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XCVU35P-L2FSVH2104E AMD GnuVZDIoTcrlIuu8Aok5XQ Description: IC FPGA 416 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 416
Total RAM Bits: 49597645
Number of LABs/CLBs: 108960
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 1906800
Voltage - Supply: 0.698V ~ 0.742V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCVU45P-2FSVH2104E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 416 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 416
Total RAM Bits: 49597645
Number of LABs/CLBs: 108960
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 1906800
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCVU35P-3FSVH2104E AMD GnuVZDIoTcrlIuu8Aok5XQ Description: IC FPGA 416 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 416
Total RAM Bits: 49597645
Number of LABs/CLBs: 108960
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 1906800
Voltage - Supply: 0.873V ~ 0.927V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCVU45P-L2FSVH2104E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 416 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 416
Total RAM Bits: 49597645
Number of LABs/CLBs: 108960
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 1906800
Voltage - Supply: 0.698V ~ 0.742V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCVU45P-3FSVH2104E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 416 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 416
Total RAM Bits: 49597645
Number of LABs/CLBs: 108960
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 1906800
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XC4062XL-3HQ240C0624 XC4062XL-3HQ240C0624 AMD XILIS01358-1.pdf?t.download=true&u=5oefqw Description: FPGA, 2304 CLBS, 40000 GATES
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Part Status: Active
Number of I/O: 193
DigiKey Programmable: Not Verified
auf Bestellung 26 Stücke:
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2+358 EUR
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XC4062XL-3BG432C AMD 4000.pdf Description: IC FPGA 352 I/O 432MBGA
Packaging: Bulk
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
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XC4052XLA-09HQ208C XC4052XLA-09HQ208C AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 1936 CLBS, 33000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 52000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 4598
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1936
Total RAM Bits: 61952
Number of I/O: 160
DigiKey Programmable: Not Verified
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XC5210-5PQG208C XC5210-5PQG208C AMD 1605200.pdf?t.download=true&u=ovmfp3 Description: FPGA, 324 CLBS, 10000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 16000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1296
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 324
Number of I/O: 164
DigiKey Programmable: Not Verified
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EF-VIVADO-ENTER-NL AMD Description: VIVADO ENTERPRISE NODE-LOCKED
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: Integrated Software Environment (ISE)
Applications: Programming
Operating System: Linux, Windows
Edition: Enterprise
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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XC1765ELPC20C XC1765ELPC20C AMD ds027 Description: IC PROM SER C-TEMP 3.3V 20-PLCC
Packaging: Tube
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
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51+11.52 EUR
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XC1765ELVOG8C XC1765ELVOG8C AMD ds027 Description: IC 3V SER CFG PROM 65K 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
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51+11.41 EUR
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XC95144XV-5TQG100C AMD XILIS01084-1.pdf?t.download=true&u=ovmfp3 Description: FLASH PLD, 5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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XC95144XV-7CSG144C XC95144XV-7CSG144C AMD XILIS01084-1.pdf?t.download=true&u=ovmfp3 Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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27+19.64 EUR
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XC95144XV-7TQ144I XC95144XV-7TQ144I AMD XILIS01084-1.pdf?t.download=true&u=ovmfp3 Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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28+22.17 EUR
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XC95144XV-5TQ100C XC95144XV-5TQ100C AMD XILIS01084-1.pdf?t.download=true&u=ovmfp3 Description: FLASH PLD, 5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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XC95288XV-6PQ208C XC95288XV-6PQ208C AMD ds050.pdf?t.download=true&u=ovmfp3 Description: FLASH PLD, 6NS, 288-CELL PQFP208
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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9+60.31 EUR
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XC4028XL-3HQ208I XC4028XL-3HQ208I AMD 4000.pdf Description: IC FPGA 160 I/O 208QFP
DigiKey Programmable: Not Verified
Number of I/O: 160
Total RAM Bits: 32768
Number of LABs/CLBs: 1024
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Cells: 2432
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 28000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP Exposed Pad
Packaging: Bulk
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XCZU7EG-1FFVC1156E XCZU7EG-1FFVC1156E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Produkt ist nicht verfügbar
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XCZU7EV-1FFVC1156E XCZU7EV-1FFVC1156E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU7EG-1FFVC1156I XCZU7EG-1FFVC1156I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU7EV-1FFVC1156I XCZU7EV-1FFVC1156I AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU11EG-1FFVC1156E XCZU11EG-1FFVC1156E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU7EG-2FFVC1156E XCZU7EG-2FFVC1156E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU7EV-2FFVC1156E XCZU7EV-2FFVC1156E AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC SOC CORTEX-A53 1156FCBGA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Produkt ist nicht verfügbar
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XCZU7EV-L1FFVC1156I XCZU7EV-L1FFVC1156I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU7EG-2FFVC1156I XCZU7EG-2FFVC1156I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU11EG-1FFVC1156I XCZU11EG-1FFVC1156I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
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XCZU11EG-2FFVC1156E XCZU11EG-2FFVC1156E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU7EG-3FFVC1156E XCZU7EG-3FFVC1156E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 667MHz, 1.5GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU11EG-2FFVC1156I XCZU11EG-2FFVC1156I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU11EG-L2FFVC1156E XCZU11EG-L2FFVC1156E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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A-SN1022-P4N-PQ AMD rllO00cN~P_4HGlYrQWB6w Description: SMARTNIC ALVEO SN1022 PQ ED DCAB
Operating Temperature: 0°C ~ 30°C
Interface: PCI Express
Power (Watts): 75W
Packaging: Box
Part Status: Active
Cooling Type: Fan
Bandwidth: 2GHz
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XCZU9EG-2FFVC900E XCZU9EG-2FFVC900E AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
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1+7943.12 EUR
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SK-KV260-G SK-KV260-G AMD Kria_KV260_Vision_AI_Starter_Kit.pdf Description: KRIA KV260 VISION AI STARTER
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Utilized IC / Part: SM-K26, XCK26
Platform: Kria KV260 Vision AI Starter
Part Status: Active
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SK-KV260-G-ED SK-KV260-G-ED AMD Kria_KV260_Vision_AI_Starter_Kit.pdf Description: KRIA KV260 VISION AI STARTER ED
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Utilized IC / Part: SM-K26, XCK26
Platform: Kria KV260 Vision AI Starter Encryption Disabled
Produkt ist nicht verfügbar
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SM-K26-XCL2GC-ED SM-K26-XCL2GC-ED AMD SM-K26-XCL2GC-ED.pdf Description: SOM K26C VISION ZYNQ MPSOC ED
Packaging: Box
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed: 533MHz, 1.333GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C (TJ)
Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Flash Size: 16GB eMMC, 64MB QSPI
Part Status: Active
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SM-K26-XCL2GC SM-K26-XCL2GC AMD 122_SM-K26-XCL2GC.pdf Description: SOM ARM A53 ZYNQ MPSOC KRIA K26
Packaging: Box
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed: 533MHz, 1.333GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C (TJ)
Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Flash Size: 16GB eMMC, 64MB QSPI
Part Status: Active
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XA7A35T-2CSG324I XA7A35T-2CSG324I AMD ds197-xa-artix7-overview Description: IC FPGA 210 I/O 324CSBGA
Packaging: Bulk
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Grade: Automotive
Number of I/O: 210
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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XCZU3EG-1SFVC784E XCZU3EG-1SFVC784E AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
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XCZU3EG-1SFVC784I XCZU3EG-1SFVC784I AMD XCZU3EG-1SFVC784I.pdf Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
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1+1428.07 EUR
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HW-DMB-1-G HW-DMB-1-G AMD unresolved?ft%3Alocale=en-US&url=ug1377-alveo-programming-cable-user-guide Description: CABLE PROGRAM ALVEO
Packaging: Bag
For Use With/Related Products: Alveo
Accessory Type: Cable Assembly
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1+906.85 EUR
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XC5204-6VQ100I XC5204-6VQ100I AMD 1605200.pdf?t.download=true&u=ovmfp3 Description: FPGA, 120 CLBS, 4000 GATES
DigiKey Programmable: Not Verified
Number of I/O: 81
Part Status: Active
Number of LABs/CLBs: 120
Supplier Device Package: 100-VQFP (14x14)
Number of Logic Elements/Cells: 480
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 6000
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Bulk
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EK-U1-ZCU216-V1-G EK-U1-ZCU216-V1-G AMD xilinx-zcu216-product-brief.pdf Description: ZYNQ US+ RFSOC ZCU216 V1 EVK
Packaging: Box
For Use With/Related Products: XCZU49DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU216 V1
Utilized IC / Part: XCZU49DR
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EK-U1-ZCU216-V1-G-J AMD xilinx-zcu216-product-brief.pdf Description: ZYNQ US+ RFSOC ZCU216 V1 J EVK
Packaging: Box
For Use With/Related Products: XCZU49DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ RFSoC ZCU216 V1 Japan
Utilized IC / Part: XCZU49DR
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XC3190-PG175IPH AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BCPGA
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 175-CPGA (42.16x42.16)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Number of I/O: 144
DigiKey Programmable: Not Verified
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XC3190-PQ160CPH XC3190-PQ160CPH AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Part Status: Active
Number of I/O: 138
DigiKey Programmable: Not Verified
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XC3190-PG175CPH AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BCPGA
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 175-CPGA (42.16x42.16)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Number of I/O: 144
DigiKey Programmable: Not Verified
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XC3190-PP175CPH AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BPGA
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 175-PGA (42.16x42.16)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Number of I/O: 144
DigiKey Programmable: Not Verified
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XC3190-4PQ208C XC3190-4PQ208C AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 320 CLBS, 5000 GATES
Packaging: Bulk
Part Status: Active
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XC3190-3PQ208C XC3190-3PQ208C AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 320 CLBS, 5000 GATES
Packaging: Bulk
Part Status: Active
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XC3190-5PQ208C XC3190-5PQ208C AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 320 CLBS, 5000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Part Status: Active
Number of I/O: 144
DigiKey Programmable: Not Verified
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XC3190-5PQ208I XC3190-5PQ208I AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 320 CLBS, 5000 GATES
Packaging: Bulk
Part Status: Active
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XC95144-15PQ100I XC95144-15PQ100I AMD 7v31deTPvLpOqLmr4oi9zg Description: IC CPLD 144MC 15NS 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.5V ~ 5.5V
Part Status: Obsolete
Number of I/O: 81
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU035-2FBVA676I XCKU035-2FBVA676I AMD ds892-kintex-ultrascale-data-sheet Description: IC FPGA 312 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 312
Total RAM Bits: 19456000
Number of LABs/CLBs: 25391
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 444343
Voltage - Supply: 0.922V ~ 0.979V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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XC9536XV-5VQ44C0779 XC9536XV-5VQ44C0779 AMD ds054.pdf?t.download=true&u=ovmfp3 Description: FLASH PLD, 5NS, 36-CELL, CMOS
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XA7A50T-1CSG324I XA7A50T-1CSG324I AMD s3NwarfUcQdgTa4CDreCuQ Description: IC FPGA 210 I/O 324CSBGA
Packaging: Bulk
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 210
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XA7A50T-1CSG324Q XA7A50T-1CSG324Q AMD s3NwarfUcQdgTa4CDreCuQ Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 210
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 4 Stücke
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XC4052XLA-09HQ208I XC4052XLA-09HQ208I AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 1936 CLBS, 33000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 52000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 4598
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1936
Total RAM Bits: 61952
Number of I/O: 160
DigiKey Programmable: Not Verified
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2+567.4 EUR
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XC4VSX35-12FF668C AMD ds112 Description: IC FPGA 448 I/O 668FCBGA
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XCVU35P-L2FSVH2104E GnuVZDIoTcrlIuu8Aok5XQ
Hersteller: AMD
Description: IC FPGA 416 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 416
Total RAM Bits: 49597645
Number of LABs/CLBs: 108960
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 1906800
Voltage - Supply: 0.698V ~ 0.742V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCVU45P-2FSVH2104E ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 416 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 416
Total RAM Bits: 49597645
Number of LABs/CLBs: 108960
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 1906800
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCVU35P-3FSVH2104E GnuVZDIoTcrlIuu8Aok5XQ
Hersteller: AMD
Description: IC FPGA 416 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 416
Total RAM Bits: 49597645
Number of LABs/CLBs: 108960
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 1906800
Voltage - Supply: 0.873V ~ 0.927V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCVU45P-L2FSVH2104E ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 416 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 416
Total RAM Bits: 49597645
Number of LABs/CLBs: 108960
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 1906800
Voltage - Supply: 0.698V ~ 0.742V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCVU45P-3FSVH2104E ds923-virtex-ultrascale-plus
Hersteller: AMD
Description: IC FPGA 416 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 416
Total RAM Bits: 49597645
Number of LABs/CLBs: 108960
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 1906800
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XC4062XL-3HQ240C0624 XILIS01358-1.pdf?t.download=true&u=5oefqw
XC4062XL-3HQ240C0624
Hersteller: AMD
Description: FPGA, 2304 CLBS, 40000 GATES
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Part Status: Active
Number of I/O: 193
DigiKey Programmable: Not Verified
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AnzahlPrivatkunde
2+358 EUR
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XC4062XL-3BG432C 4000.pdf
Hersteller: AMD
Description: IC FPGA 352 I/O 432MBGA
Packaging: Bulk
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
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AnzahlPrivatkunde
2+452 EUR
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XC4052XLA-09HQ208C 4000.pdf?t.download=true&u=ovmfp3
XC4052XLA-09HQ208C
Hersteller: AMD
Description: FPGA, 1936 CLBS, 33000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 52000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 4598
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1936
Total RAM Bits: 61952
Number of I/O: 160
DigiKey Programmable: Not Verified
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2+436.83 EUR
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XC5210-5PQG208C 1605200.pdf?t.download=true&u=ovmfp3
XC5210-5PQG208C
Hersteller: AMD
Description: FPGA, 324 CLBS, 10000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 16000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1296
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 324
Number of I/O: 164
DigiKey Programmable: Not Verified
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AnzahlPrivatkunde
4+146.89 EUR
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EF-VIVADO-ENTER-NL
Hersteller: AMD
Description: VIVADO ENTERPRISE NODE-LOCKED
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: Integrated Software Environment (ISE)
Applications: Programming
Operating System: Linux, Windows
Edition: Enterprise
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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XC1765ELPC20C ds027
XC1765ELPC20C
Hersteller: AMD
Description: IC PROM SER C-TEMP 3.3V 20-PLCC
Packaging: Tube
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
auf Bestellung 4238 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
51+11.52 EUR
Mindestbestellmenge: 51 Stücke
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XC1765ELVOG8C ds027
XC1765ELVOG8C
Hersteller: AMD
Description: IC 3V SER CFG PROM 65K 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
auf Bestellung 6809 Stücke:
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AnzahlPrivatkunde
51+11.41 EUR
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XC95144XV-5TQG100C XILIS01084-1.pdf?t.download=true&u=ovmfp3
Hersteller: AMD
Description: FLASH PLD, 5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95144XV-7CSG144C XILIS01084-1.pdf?t.download=true&u=ovmfp3
XC95144XV-7CSG144C
Hersteller: AMD
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 978 Stücke:
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AnzahlPrivatkunde
27+19.64 EUR
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XC95144XV-7TQ144I XILIS01084-1.pdf?t.download=true&u=ovmfp3
XC95144XV-7TQ144I
Hersteller: AMD
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 89 Stücke:
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AnzahlPrivatkunde
28+22.17 EUR
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XC95144XV-5TQ100C XILIS01084-1.pdf?t.download=true&u=ovmfp3
XC95144XV-5TQ100C
Hersteller: AMD
Description: FLASH PLD, 5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1364 Stücke:
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AnzahlPrivatkunde
21+26.23 EUR
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XC95288XV-6PQ208C ds050.pdf?t.download=true&u=ovmfp3
XC95288XV-6PQ208C
Hersteller: AMD
Description: FLASH PLD, 6NS, 288-CELL PQFP208
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 392 Stücke:
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AnzahlPrivatkunde
9+60.31 EUR
Mindestbestellmenge: 9 Stücke
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XC4028XL-3HQ208I 4000.pdf
XC4028XL-3HQ208I
Hersteller: AMD
Description: IC FPGA 160 I/O 208QFP
DigiKey Programmable: Not Verified
Number of I/O: 160
Total RAM Bits: 32768
Number of LABs/CLBs: 1024
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Cells: 2432
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 28000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP Exposed Pad
Packaging: Bulk
auf Bestellung 123 Stücke:
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AnzahlPrivatkunde
5+130.09 EUR
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XCZU7EG-1FFVC1156E jDqbmrrvy_u9hmwDv1iWBQ
XCZU7EG-1FFVC1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Produkt ist nicht verfügbar
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XCZU7EV-1FFVC1156E jDqbmrrvy_u9hmwDv1iWBQ
XCZU7EV-1FFVC1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU7EG-1FFVC1156I jDqbmrrvy_u9hmwDv1iWBQ
XCZU7EG-1FFVC1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU7EV-1FFVC1156I dfRkDKgzEvo5CsUiQJdEkg
XCZU7EV-1FFVC1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU11EG-1FFVC1156E ds891-zynq-ultrascale-plus-overview
XCZU11EG-1FFVC1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU7EG-2FFVC1156E jDqbmrrvy_u9hmwDv1iWBQ
XCZU7EG-2FFVC1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU7EV-2FFVC1156E dfRkDKgzEvo5CsUiQJdEkg
XCZU7EV-2FFVC1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Produkt ist nicht verfügbar
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XCZU7EV-L1FFVC1156I jDqbmrrvy_u9hmwDv1iWBQ
XCZU7EV-L1FFVC1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU7EG-2FFVC1156I jDqbmrrvy_u9hmwDv1iWBQ
XCZU7EG-2FFVC1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU11EG-1FFVC1156I ds891-zynq-ultrascale-plus-overview
XCZU11EG-1FFVC1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Produkt ist nicht verfügbar
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XCZU11EG-2FFVC1156E ds891-zynq-ultrascale-plus-overview
XCZU11EG-2FFVC1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU7EG-3FFVC1156E jDqbmrrvy_u9hmwDv1iWBQ
XCZU7EG-3FFVC1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 667MHz, 1.5GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU11EG-2FFVC1156I ds891-zynq-ultrascale-plus-overview
XCZU11EG-2FFVC1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU11EG-L2FFVC1156E ds891-zynq-ultrascale-plus-overview
XCZU11EG-L2FFVC1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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A-SN1022-P4N-PQ rllO00cN~P_4HGlYrQWB6w
Hersteller: AMD
Description: SMARTNIC ALVEO SN1022 PQ ED DCAB
Operating Temperature: 0°C ~ 30°C
Interface: PCI Express
Power (Watts): 75W
Packaging: Box
Part Status: Active
Cooling Type: Fan
Bandwidth: 2GHz
Produkt ist nicht verfügbar
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XCZU9EG-2FFVC900E Zynq%20UltraScale%2B_Datasheet.pdf
XCZU9EG-2FFVC900E
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+7943.12 EUR
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SK-KV260-G Kria_KV260_Vision_AI_Starter_Kit.pdf
SK-KV260-G
Hersteller: AMD
Description: KRIA KV260 VISION AI STARTER
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Utilized IC / Part: SM-K26, XCK26
Platform: Kria KV260 Vision AI Starter
Part Status: Active
auf Bestellung 457 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+521.09 EUR
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SK-KV260-G-ED Kria_KV260_Vision_AI_Starter_Kit.pdf
SK-KV260-G-ED
Hersteller: AMD
Description: KRIA KV260 VISION AI STARTER ED
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Utilized IC / Part: SM-K26, XCK26
Platform: Kria KV260 Vision AI Starter Encryption Disabled
Produkt ist nicht verfügbar
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SM-K26-XCL2GC-ED SM-K26-XCL2GC-ED.pdf
SM-K26-XCL2GC-ED
Hersteller: AMD
Description: SOM K26C VISION ZYNQ MPSOC ED
Packaging: Box
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed: 533MHz, 1.333GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C (TJ)
Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Flash Size: 16GB eMMC, 64MB QSPI
Part Status: Active
Produkt ist nicht verfügbar
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SM-K26-XCL2GC 122_SM-K26-XCL2GC.pdf
SM-K26-XCL2GC
Hersteller: AMD
Description: SOM ARM A53 ZYNQ MPSOC KRIA K26
Packaging: Box
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed: 533MHz, 1.333GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C (TJ)
Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Flash Size: 16GB eMMC, 64MB QSPI
Part Status: Active
auf Bestellung 1199 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+769.63 EUR
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XA7A35T-2CSG324I ds197-xa-artix7-overview
XA7A35T-2CSG324I
Hersteller: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Bulk
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Grade: Automotive
Number of I/O: 210
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+141.29 EUR
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XCZU3EG-1SFVC784E Zynq%20UltraScale%2B_Datasheet.pdf
XCZU3EG-1SFVC784E
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+1141.92 EUR
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XCZU3EG-1SFVC784I XCZU3EG-1SFVC784I.pdf
XCZU3EG-1SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
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1+1428.07 EUR
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HW-DMB-1-G unresolved?ft%3Alocale=en-US&url=ug1377-alveo-programming-cable-user-guide
HW-DMB-1-G
Hersteller: AMD
Description: CABLE PROGRAM ALVEO
Packaging: Bag
For Use With/Related Products: Alveo
Accessory Type: Cable Assembly
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1+906.85 EUR
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XC5204-6VQ100I 1605200.pdf?t.download=true&u=ovmfp3
XC5204-6VQ100I
Hersteller: AMD
Description: FPGA, 120 CLBS, 4000 GATES
DigiKey Programmable: Not Verified
Number of I/O: 81
Part Status: Active
Number of LABs/CLBs: 120
Supplier Device Package: 100-VQFP (14x14)
Number of Logic Elements/Cells: 480
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 6000
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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EK-U1-ZCU216-V1-G xilinx-zcu216-product-brief.pdf
EK-U1-ZCU216-V1-G
Hersteller: AMD
Description: ZYNQ US+ RFSOC ZCU216 V1 EVK
Packaging: Box
For Use With/Related Products: XCZU49DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU216 V1
Utilized IC / Part: XCZU49DR
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1+34442.18 EUR
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EK-U1-ZCU216-V1-G-J xilinx-zcu216-product-brief.pdf
Hersteller: AMD
Description: ZYNQ US+ RFSOC ZCU216 V1 J EVK
Packaging: Box
For Use With/Related Products: XCZU49DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ RFSoC ZCU216 V1 Japan
Utilized IC / Part: XCZU49DR
Produkt ist nicht verfügbar
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XC3190-PG175IPH 1153000.pdf?t.download=true&u=ovmfp3
Hersteller: AMD
Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BCPGA
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 175-CPGA (42.16x42.16)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Number of I/O: 144
DigiKey Programmable: Not Verified
auf Bestellung 130 Stücke:
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AnzahlPrivatkunde
10+58.81 EUR
Mindestbestellmenge: 10 Stücke
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XC3190-PQ160CPH 1153000.pdf?t.download=true&u=ovmfp3
XC3190-PQ160CPH
Hersteller: AMD
Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Part Status: Active
Number of I/O: 138
DigiKey Programmable: Not Verified
auf Bestellung 283 Stücke:
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10+58.81 EUR
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XC3190-PG175CPH 1153000.pdf?t.download=true&u=ovmfp3
Hersteller: AMD
Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BCPGA
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 175-CPGA (42.16x42.16)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Number of I/O: 144
DigiKey Programmable: Not Verified
auf Bestellung 1334 Stücke:
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AnzahlPrivatkunde
10+58.81 EUR
Mindestbestellmenge: 10 Stücke
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XC3190-PP175CPH 1153000.pdf?t.download=true&u=ovmfp3
Hersteller: AMD
Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BPGA
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 175-PGA (42.16x42.16)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Number of I/O: 144
DigiKey Programmable: Not Verified
auf Bestellung 3347 Stücke:
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AnzahlPrivatkunde
9+66.01 EUR
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XC3190-4PQ208C 1153000.pdf?t.download=true&u=ovmfp3
XC3190-4PQ208C
Hersteller: AMD
Description: FPGA, 320 CLBS, 5000 GATES
Packaging: Bulk
Part Status: Active
auf Bestellung 72 Stücke:
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25+24.2 EUR
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XC3190-3PQ208C 1153000.pdf?t.download=true&u=ovmfp3
XC3190-3PQ208C
Hersteller: AMD
Description: FPGA, 320 CLBS, 5000 GATES
Packaging: Bulk
Part Status: Active
auf Bestellung 80 Stücke:
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AnzahlPrivatkunde
18+33.88 EUR
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XC3190-5PQ208C 1153000.pdf?t.download=true&u=ovmfp3
XC3190-5PQ208C
Hersteller: AMD
Description: FPGA, 320 CLBS, 5000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Part Status: Active
Number of I/O: 144
DigiKey Programmable: Not Verified
auf Bestellung 710 Stücke:
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AnzahlPrivatkunde
14+45.09 EUR
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XC3190-5PQ208I 1153000.pdf?t.download=true&u=ovmfp3
XC3190-5PQ208I
Hersteller: AMD
Description: FPGA, 320 CLBS, 5000 GATES
Packaging: Bulk
Part Status: Active
auf Bestellung 17 Stücke:
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AnzahlPrivatkunde
17+44.14 EUR
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XC95144-15PQ100I 7v31deTPvLpOqLmr4oi9zg
XC95144-15PQ100I
Hersteller: AMD
Description: IC CPLD 144MC 15NS 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.5V ~ 5.5V
Part Status: Obsolete
Number of I/O: 81
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU035-2FBVA676I ds892-kintex-ultrascale-data-sheet
XCKU035-2FBVA676I
Hersteller: AMD
Description: IC FPGA 312 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 312
Total RAM Bits: 19456000
Number of LABs/CLBs: 25391
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 444343
Voltage - Supply: 0.922V ~ 0.979V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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XC9536XV-5VQ44C0779 ds054.pdf?t.download=true&u=ovmfp3
XC9536XV-5VQ44C0779
Hersteller: AMD
Description: FLASH PLD, 5NS, 36-CELL, CMOS
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XA7A50T-1CSG324I s3NwarfUcQdgTa4CDreCuQ
XA7A50T-1CSG324I
Hersteller: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Bulk
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 210
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 4 Stücke
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XA7A50T-1CSG324Q s3NwarfUcQdgTa4CDreCuQ
XA7A50T-1CSG324Q
Hersteller: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 210
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 4 Stücke
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XC4052XLA-09HQ208I 4000.pdf?t.download=true&u=ovmfp3
XC4052XLA-09HQ208I
Hersteller: AMD
Description: FPGA, 1936 CLBS, 33000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 52000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 4598
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1936
Total RAM Bits: 61952
Number of I/O: 160
DigiKey Programmable: Not Verified
auf Bestellung 3 Stücke:
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AnzahlPrivatkunde
2+567.4 EUR
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XC4VSX35-12FF668C ds112
Hersteller: AMD
Description: IC FPGA 448 I/O 668FCBGA
Produkt ist nicht verfügbar
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