Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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XC7S6-1CPGA196C | AMD |
![]() Packaging: Tray Package / Case: 196-TFBGA, CSBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 6000 Supplier Device Package: 196-CSPBGA (8x8) Total RAM Bits: 184320 Number of I/O: 100 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC7S6-1CPGA196I | AMD |
![]() Packaging: Tray Package / Case: 196-TFBGA, CSBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 6000 Supplier Device Package: 196-CSPBGA (8x8) Total RAM Bits: 184320 Number of I/O: 100 DigiKey Programmable: Not Verified |
auf Bestellung 73 Stücke: Lieferzeit 10-14 Tag (e) |
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XC7S6-1CSGA225C | AMD |
![]() Packaging: Tray Package / Case: 225-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 6000 Supplier Device Package: 225-CSPBGA (13x13) Total RAM Bits: 184320 Number of I/O: 100 DigiKey Programmable: Not Verified |
auf Bestellung 39 Stücke: Lieferzeit 10-14 Tag (e) |
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XC7S6-1FTGB196C | AMD |
![]() Packaging: Tray Package / Case: 196-LBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 6000 Supplier Device Package: 196-CSBGA (15x15) Total RAM Bits: 184320 Part Status: Active Number of I/O: 100 DigiKey Programmable: Not Verified |
auf Bestellung 718 Stücke: Lieferzeit 10-14 Tag (e) |
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XC7S6-1FTGB196I | AMD |
![]() Packaging: Tray Package / Case: 196-LBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 6000 Supplier Device Package: 196-CSBGA (15x15) Total RAM Bits: 184320 Number of I/O: 100 DigiKey Programmable: Not Verified |
auf Bestellung 1035 Stücke: Lieferzeit 10-14 Tag (e) |
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XC7S6-2CPGA196C | AMD |
![]() Packaging: Tray Package / Case: 196-TFBGA, CSBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 6000 Supplier Device Package: 196-CSPBGA (8x8) Total RAM Bits: 184320 Number of I/O: 100 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC7S6-2CPGA196I | AMD |
![]() Packaging: Tray Package / Case: 196-TFBGA, CSBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 6000 Supplier Device Package: 196-CSPBGA (8x8) Total RAM Bits: 184320 Number of I/O: 100 DigiKey Programmable: Not Verified |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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XC7S6-2FTGB196I | AMD |
![]() Packaging: Tray Package / Case: 196-LBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 6000 Supplier Device Package: 196-CSBGA (15x15) Total RAM Bits: 184320 Number of I/O: 100 DigiKey Programmable: Not Verified |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
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EF-DI-25G-TSN-802-1-CM-PROJ | AMD |
![]() Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Project Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
EF-DI-25G-TSN-802-1-CM-SITE | AMD |
![]() Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Site Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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EK-U1-ZCU104-G-J | AMD |
![]() Packaging: Box For Use With/Related Products: XCZU7EV Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Accessories - Power Supply Not Included - Utilized IC / Part: XCZU7EV Platform: Zynq UltraScale+ MPSoC ZCU104 Japan Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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A-U200-A64G-PQ-G | AMD |
![]() Power (Watts): 225W Packaging: Box Memory Size: 64GB Interface: PCI Express Operating Temperature: 0°C ~ 45°C Bandwidth: 77GB/s Cooling Type: Fan LUTs: 892k INT8 TOPs: 18.6 |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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A-U250-P64G-PQ-G | AMD |
![]() Power (Watts): 225W Packaging: Box Memory Size: 64GB Interface: PCI Express Operating Temperature: 0°C ~ 45°C Bandwidth: 77GB/s Cooling Type: Heat Sink LUTs: 1341k INT8 TOPs: 33.3 |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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EK-U1-ZCU111-G | AMD |
![]() Packaging: Bulk For Use With/Related Products: XCZU28DR Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Zynq UltraScale+ RFSoC ZCU111 Part Status: Active Utilized IC / Part: XCZU28DR |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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EK-U1-VCU128-G | AMD |
![]() Packaging: Bulk For Use With/Related Products: XCVU37P Type: FPGA Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Virtex UltraScale+ FPGA VCU128 PCIe Card Part Status: Active |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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XC7S50-1FGA484I | AMD |
![]() Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 52160 Supplier Device Package: 484-FPBGA (23x23) Number of LABs/CLBs: 4075 Total RAM Bits: 2764800 Part Status: Active Number of I/O: 250 DigiKey Programmable: Not Verified |
auf Bestellung 592 Stücke: Lieferzeit 10-14 Tag (e) |
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HW-PWAC-2600317 | AMD |
Description: HW ALVEO CARD RA PWR ADAPT Packaging: Box For Use With/Related Products: Alveo Accessory Type: Cable Assembly Part Status: Active |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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EK-S7-SP701-G | AMD |
![]() Packaging: Box For Use With/Related Products: XC7S100 Type: FPGA Contents: Board(s), Cable(s), Power Supply Utilized IC / Part: XC7S100 Platform: Spartan-7 FPGA SP701 Part Status: Active |
auf Bestellung 35 Stücke: Lieferzeit 10-14 Tag (e) |
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XC7Z007S-1CL225I | AMD |
![]() Packaging: Tray Package / Case: 225-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 225-CSPBGA (13x13) Architecture: MCU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
XCVU31P-2FSVH1924E | AMD |
![]() Packaging: Tray Package / Case: 1924-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 961800 Supplier Device Package: 1924-FCBGA (45x45) Number of LABs/CLBs: 54960 Total RAM Bits: 24746394 Part Status: Active Number of I/O: 208 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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EK-U1-ZCU104-G-ED | AMD |
![]() Packaging: Box For Use With/Related Products: XCZU7EV Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Zynq UltraScale+ MPSoC ZCU104 Encryption Disabled Part Status: Obsolete Utilized IC / Part: XCZU7EV |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
XA7A12T-1CPG238I | AMD |
![]() Packaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 12800 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 1000 Total RAM Bits: 737280 Part Status: Active Number of I/O: 112 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
XC7S50-1FTGB196Q | AMD |
![]() Packaging: Tray Package / Case: 196-LBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 52160 Supplier Device Package: 196-CSBGA (15x15) Number of LABs/CLBs: 4075 Total RAM Bits: 2764800 Part Status: Active Number of I/O: 100 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
XCVU31P-1FSVH1924E | AMD |
![]() Packaging: Tray Package / Case: 1924-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 961800 Supplier Device Package: 1924-FCBGA (45x45) Number of LABs/CLBs: 54960 Total RAM Bits: 24746394 Number of I/O: 208 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
XC7S25-1FTGB196Q | AMD |
![]() Packaging: Tray Package / Case: 196-LBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 23360 Supplier Device Package: 196-CSBGA (15x15) Number of LABs/CLBs: 1825 Total RAM Bits: 1658880 Part Status: Active Number of I/O: 100 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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A-U50DD-P00G-ES3-G | AMD |
![]() Packaging: Box Power (Watts): 75W Memory Size: 8GB Interface: PCI Express Operating Temperature: 0°C ~ 50°C Bandwidth: 201GB/s Cooling Type: Heat Sink LUTs: 872k |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC95288XV-7FG256C | AMD |
![]() Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 6400 Number of Macrocells: 288 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 7.5 ns Supplier Device Package: 256-FBGA (17x17) Number of Logic Elements/Blocks: 16 Voltage Supply - Internal: 2.37V ~ 2.62V Number of I/O: 192 DigiKey Programmable: Not Verified |
auf Bestellung 615 Stücke: Lieferzeit 10-14 Tag (e) |
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EK-U1-VCU129-G | AMD |
![]() Packaging: Box For Use With/Related Products: XCVU29P Type: FPGA Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Virtex UltraScale+ FPGA VCU129 Utilized IC / Part: XCVU29P |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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XC2C64A-7PCG44I | AMD |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC2C64A-7PC44C | AMD |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XC95144XV-5CS144C | AMD |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 1093 Stücke: Lieferzeit 10-14 Tag (e) |
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XC95144XV-7CS144C | AMD |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 1459 Stücke: Lieferzeit 10-14 Tag (e) |
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XC2C64A-7PCG44C | AMD |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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EK-U1-ZCU216-ES1-G | AMD |
![]() Packaging: Box For Use With/Related Products: XCZU49DR Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Utilized IC / Part: XCZU49DR Platform: Zynq UltraScale+ RFSoC ZCU216 ES1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVU35P-1FSVH2892E | AMD |
![]() Packaging: Tray Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 1906800 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 108960 Total RAM Bits: 49597645 Number of I/O: 416 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVU35P-2FSVH2892E | AMD |
![]() Packaging: Tray Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 1906800 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 108960 Total RAM Bits: 49597645 Number of I/O: 416 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVU35P-L2FSVH2892E | AMD |
![]() Packaging: Tray Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.698V ~ 0.742V Number of Logic Elements/Cells: 1906800 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 108960 Total RAM Bits: 49597645 Number of I/O: 416 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVU35P-3FSVH2892E | AMD |
![]() Packaging: Tray Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.873V ~ 0.927V Number of Logic Elements/Cells: 1906800 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 108960 Total RAM Bits: 49597645 Number of I/O: 416 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVU47P-2FSVH2892E | AMD |
![]() Packaging: Tray Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 2851800 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 162960 Total RAM Bits: 74344038 Number of I/O: 624 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVU47P-L2FSVH2892E | AMD |
![]() Packaging: Tray Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.698V ~ 0.742V Number of Logic Elements/Cells: 2851800 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 162960 Total RAM Bits: 74344038 Number of I/O: 624 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCVU47P-3FSVH2892E | AMD |
![]() Packaging: Tray Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 2851800 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 162960 Total RAM Bits: 74344038 Number of I/O: 624 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
LMS-EMBD-SDSOC | AMD |
Description: TRAINING CREDIT SDSOC DEV METHOD Packaging: Electronic Delivery Type: License Media Delivery Type: Electronically Delivered Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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XCZU4EG-L1SFVC784I | AMD |
![]() Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU4EG-L1FBVB900I | AMD |
![]() Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU6EG-L1FFVC900I | AMD |
![]() Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU6EG-L1FFVB1156I | AMD |
![]() Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU7EG-L1FFVC1156I | AMD |
![]() Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU11EG-L1FFVC1156I | AMD |
![]() Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU15EG-L1FFVB1156I | AMD |
![]() Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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XCZU19EG-L1FFVB1517I | AMD |
![]() Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
XCZU19EG-L1FFVC1760I | AMD |
![]() Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
XCVU160-2FLGB2104E | AMD |
![]() Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 2026500 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 115800 Total RAM Bits: 130969600 Number of I/O: 702 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
XCVU160-2FLGB2104I | AMD |
![]() Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 2026500 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 115800 Total RAM Bits: 130969600 Number of I/O: 702 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||
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XCKU3P-1SFVB784E | AMD |
![]() Packaging: Bulk Package / Case: 784-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 355950 Supplier Device Package: 784-FCBGA (23x23) Number of LABs/CLBs: 20340 Total RAM Bits: 31641600 Number of I/O: 304 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
![]() |
XCKU3P-1FFVA676E | AMD |
![]() Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 355950 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 20340 Total RAM Bits: 31641600 Number of I/O: 256 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
![]() |
XCKU3P-1SFVB784I | AMD |
![]() Packaging: Tray Package / Case: 784-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 355950 Supplier Device Package: 784-FCBGA (23x23) Number of LABs/CLBs: 20340 Total RAM Bits: 31641600 Number of I/O: 256 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
![]() |
XCKU3P-1FFVD900I | AMD |
![]() Packaging: Tray Package / Case: 900-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 355950 Supplier Device Package: 900-FCBGA (31x31) Number of LABs/CLBs: 20340 Total RAM Bits: 31641600 Number of I/O: 304 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
![]() |
XCKU3P-2SFVB784E | AMD |
![]() Packaging: Bulk Package / Case: 784-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 355950 Supplier Device Package: 784-FCBGA (23x23) Number of LABs/CLBs: 20340 Total RAM Bits: 31641600 Number of I/O: 304 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
![]() |
XCKU3P-2FFVA676E | AMD |
![]() Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 355950 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 20340 Total RAM Bits: 31641600 Number of I/O: 256 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
![]() |
XCKU3P-2FFVD900E | AMD |
![]() Packaging: Tray Package / Case: 900-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 355950 Supplier Device Package: 900-FCBGA (31x31) Number of LABs/CLBs: 20340 Total RAM Bits: 31641600 Number of I/O: 304 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
XC7S6-1CPGA196C |
![]() |
Hersteller: AMD
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 196-CSPBGA (8x8)
Total RAM Bits: 184320
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 196-CSPBGA (8x8)
Total RAM Bits: 184320
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
XC7S6-1CPGA196I |
![]() |
Hersteller: AMD
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 196-CSPBGA (8x8)
Total RAM Bits: 184320
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 196-CSPBGA (8x8)
Total RAM Bits: 184320
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 73 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 33.90 EUR |
XC7S6-1CSGA225C |
![]() |
Hersteller: AMD
Description: IC FPGA 100 I/O 225CSBGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 225-CSPBGA (13x13)
Total RAM Bits: 184320
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC FPGA 100 I/O 225CSBGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 225-CSPBGA (13x13)
Total RAM Bits: 184320
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 39 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 29.46 EUR |
XC7S6-1FTGB196C |
![]() |
Hersteller: AMD
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-LBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 196-CSBGA (15x15)
Total RAM Bits: 184320
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-LBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 196-CSBGA (15x15)
Total RAM Bits: 184320
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 718 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 29.46 EUR |
XC7S6-1FTGB196I |
![]() |
Hersteller: AMD
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-LBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 196-CSBGA (15x15)
Total RAM Bits: 184320
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-LBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 196-CSBGA (15x15)
Total RAM Bits: 184320
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 1035 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 33.90 EUR |
XC7S6-2CPGA196C |
![]() |
Hersteller: AMD
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 196-CSPBGA (8x8)
Total RAM Bits: 184320
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 196-CSPBGA (8x8)
Total RAM Bits: 184320
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
XC7S6-2CPGA196I |
![]() |
Hersteller: AMD
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 196-CSPBGA (8x8)
Total RAM Bits: 184320
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 196-CSPBGA (8x8)
Total RAM Bits: 184320
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 37.26 EUR |
XC7S6-2FTGB196I |
![]() |
Hersteller: AMD
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-LBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 196-CSBGA (15x15)
Total RAM Bits: 184320
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-LBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 196-CSBGA (15x15)
Total RAM Bits: 184320
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 37.26 EUR |
EF-DI-25G-TSN-802-1-CM-PROJ |
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Hersteller: AMD
Description: 10G/25G TSN 802.1CM WIRELESS PRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Project
Part Status: Active
Description: 10G/25G TSN 802.1CM WIRELESS PRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Project
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EF-DI-25G-TSN-802-1-CM-SITE |
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Hersteller: AMD
Description: 10G/25G TSN 802.1CM WIRELESS SIT
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Part Status: Active
Description: 10G/25G TSN 802.1CM WIRELESS SIT
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EK-U1-ZCU104-G-J |
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Hersteller: AMD
Description: XILINX ZYNQ ULTRASCALE+ ZCU104 P
Packaging: Box
For Use With/Related Products: XCZU7EV
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Utilized IC / Part: XCZU7EV
Platform: Zynq UltraScale+ MPSoC ZCU104 Japan
Part Status: Active
Description: XILINX ZYNQ ULTRASCALE+ ZCU104 P
Packaging: Box
For Use With/Related Products: XCZU7EV
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Utilized IC / Part: XCZU7EV
Platform: Zynq UltraScale+ MPSoC ZCU104 Japan
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
A-U200-A64G-PQ-G |
![]() |
Hersteller: AMD
Description: BOARD DCAB SERVER U200 ACTIVE
Power (Watts): 225W
Packaging: Box
Memory Size: 64GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 77GB/s
Cooling Type: Fan
LUTs: 892k
INT8 TOPs: 18.6
Description: BOARD DCAB SERVER U200 ACTIVE
Power (Watts): 225W
Packaging: Box
Memory Size: 64GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 77GB/s
Cooling Type: Fan
LUTs: 892k
INT8 TOPs: 18.6
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 9705.12 EUR |
A-U250-P64G-PQ-G |
![]() |
Hersteller: AMD
Description: BOARD DCAB SERVER U250 PASSIVE
Power (Watts): 225W
Packaging: Box
Memory Size: 64GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 77GB/s
Cooling Type: Heat Sink
LUTs: 1341k
INT8 TOPs: 33.3
Description: BOARD DCAB SERVER U250 PASSIVE
Power (Watts): 225W
Packaging: Box
Memory Size: 64GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 77GB/s
Cooling Type: Heat Sink
LUTs: 1341k
INT8 TOPs: 33.3
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 15141.25 EUR |
EK-U1-ZCU111-G |
![]() |
Hersteller: AMD
Description: ZYNQUS+ XCZU28DR EVAL BRD
Packaging: Bulk
For Use With/Related Products: XCZU28DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU111
Part Status: Active
Utilized IC / Part: XCZU28DR
Description: ZYNQUS+ XCZU28DR EVAL BRD
Packaging: Bulk
For Use With/Related Products: XCZU28DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU111
Part Status: Active
Utilized IC / Part: XCZU28DR
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 27546.01 EUR |
EK-U1-VCU128-G |
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Hersteller: AMD
Description: KIT EVAL VCU128 VIRTEX USCALE
Packaging: Bulk
For Use With/Related Products: XCVU37P
Type: FPGA
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Virtex UltraScale+ FPGA VCU128 PCIe Card
Part Status: Active
Description: KIT EVAL VCU128 VIRTEX USCALE
Packaging: Bulk
For Use With/Related Products: XCVU37P
Type: FPGA
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Virtex UltraScale+ FPGA VCU128 PCIe Card
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 24446.79 EUR |
XC7S50-1FGA484I |
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Hersteller: AMD
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 484-FPBGA (23x23)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 250
DigiKey Programmable: Not Verified
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 484-FPBGA (23x23)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 250
DigiKey Programmable: Not Verified
auf Bestellung 592 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 109.38 EUR |
HW-PWAC-2600317 |
Hersteller: AMD
Description: HW ALVEO CARD RA PWR ADAPT
Packaging: Box
For Use With/Related Products: Alveo
Accessory Type: Cable Assembly
Part Status: Active
Description: HW ALVEO CARD RA PWR ADAPT
Packaging: Box
For Use With/Related Products: Alveo
Accessory Type: Cable Assembly
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 21.28 EUR |
EK-S7-SP701-G |
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Hersteller: AMD
Description: SPARTAN7 SP701 FPGA KIT
Packaging: Box
For Use With/Related Products: XC7S100
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: XC7S100
Platform: Spartan-7 FPGA SP701
Part Status: Active
Description: SPARTAN7 SP701 FPGA KIT
Packaging: Box
For Use With/Related Products: XC7S100
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: XC7S100
Platform: Spartan-7 FPGA SP701
Part Status: Active
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 1498.09 EUR |
XC7Z007S-1CL225I |
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Hersteller: AMD
Description: IC FPGA SGL ARM CORTEX 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
Description: IC FPGA SGL ARM CORTEX 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
XCVU31P-2FSVH1924E |
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Hersteller: AMD
Description: IC FPGA 208 I/O 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 961800
Supplier Device Package: 1924-FCBGA (45x45)
Number of LABs/CLBs: 54960
Total RAM Bits: 24746394
Part Status: Active
Number of I/O: 208
DigiKey Programmable: Not Verified
Description: IC FPGA 208 I/O 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 961800
Supplier Device Package: 1924-FCBGA (45x45)
Number of LABs/CLBs: 54960
Total RAM Bits: 24746394
Part Status: Active
Number of I/O: 208
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
EK-U1-ZCU104-G-ED |
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Hersteller: AMD
Description: KIT EVAL ZYNQUS+ MPSOC ZCU104 ED
Packaging: Box
For Use With/Related Products: XCZU7EV
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ MPSoC ZCU104 Encryption Disabled
Part Status: Obsolete
Utilized IC / Part: XCZU7EV
Description: KIT EVAL ZYNQUS+ MPSOC ZCU104 ED
Packaging: Box
For Use With/Related Products: XCZU7EV
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ MPSoC ZCU104 Encryption Disabled
Part Status: Obsolete
Utilized IC / Part: XCZU7EV
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
XA7A12T-1CPG238I |
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Hersteller: AMD
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 112
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 112
Produkt ist nicht verfügbar
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XC7S50-1FTGB196Q |
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Hersteller: AMD
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-LBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 196-CSBGA (15x15)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-LBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 196-CSBGA (15x15)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
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XCVU31P-1FSVH1924E |
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Hersteller: AMD
Description: IC FPGA 208 I/O 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 961800
Supplier Device Package: 1924-FCBGA (45x45)
Number of LABs/CLBs: 54960
Total RAM Bits: 24746394
Number of I/O: 208
DigiKey Programmable: Not Verified
Description: IC FPGA 208 I/O 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 961800
Supplier Device Package: 1924-FCBGA (45x45)
Number of LABs/CLBs: 54960
Total RAM Bits: 24746394
Number of I/O: 208
DigiKey Programmable: Not Verified
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XC7S25-1FTGB196Q |
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Hersteller: AMD
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-LBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 196-CSBGA (15x15)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC FPGA 100 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-LBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 196-CSBGA (15x15)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
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A-U50DD-P00G-ES3-G |
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Hersteller: AMD
Description: BOARD DCAB ALVEO U50 NET PASSIVE
Packaging: Box
Power (Watts): 75W
Memory Size: 8GB
Interface: PCI Express
Operating Temperature: 0°C ~ 50°C
Bandwidth: 201GB/s
Cooling Type: Heat Sink
LUTs: 872k
Description: BOARD DCAB ALVEO U50 NET PASSIVE
Packaging: Box
Power (Watts): 75W
Memory Size: 8GB
Interface: PCI Express
Operating Temperature: 0°C ~ 50°C
Bandwidth: 201GB/s
Cooling Type: Heat Sink
LUTs: 872k
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XC95288XV-7FG256C |
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Hersteller: AMD
Description: IC CPLD 288MC 7.5NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.37V ~ 2.62V
Number of I/O: 192
DigiKey Programmable: Not Verified
Description: IC CPLD 288MC 7.5NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.37V ~ 2.62V
Number of I/O: 192
DigiKey Programmable: Not Verified
auf Bestellung 615 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
36+ | 14.42 EUR |
EK-U1-VCU129-G |
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Hersteller: AMD
Description: KIT DEV VCU129 VIRTEX US+ 56G
Packaging: Box
For Use With/Related Products: XCVU29P
Type: FPGA
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Virtex UltraScale+ FPGA VCU129
Utilized IC / Part: XCVU29P
Description: KIT DEV VCU129 VIRTEX US+ 56G
Packaging: Box
For Use With/Related Products: XCVU29P
Type: FPGA
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Virtex UltraScale+ FPGA VCU129
Utilized IC / Part: XCVU29P
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 37627.73 EUR |
XC2C64A-7PCG44I |
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Hersteller: AMD
Description: FLASH PLD, 7.5NS, 64-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 7.5NS, 64-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC2C64A-7PC44C |
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Hersteller: AMD
Description: FLASH PLD, 7.5NS, 64-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 7.5NS, 64-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC95144XV-5CS144C |
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Hersteller: AMD
Description: FLASH PLD, 5NS, 144-CELL PBGA144
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 5NS, 144-CELL PBGA144
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1093 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
21+ | 24.41 EUR |
XC95144XV-7CS144C |
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Hersteller: AMD
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1459 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
31+ | 16.34 EUR |
XC2C64A-7PCG44C |
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Hersteller: AMD
Description: FLASH PLD, 7.5NS, 64-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 7.5NS, 64-CELL PQCC44
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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EK-U1-ZCU216-ES1-G |
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Hersteller: AMD
Description: ZYNQ US+ RFSOC ZCU216 ES1 EVK
Packaging: Box
For Use With/Related Products: XCZU49DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: XCZU49DR
Platform: Zynq UltraScale+ RFSoC ZCU216 ES1
Description: ZYNQ US+ RFSOC ZCU216 ES1 EVK
Packaging: Box
For Use With/Related Products: XCZU49DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: XCZU49DR
Platform: Zynq UltraScale+ RFSoC ZCU216 ES1
Produkt ist nicht verfügbar
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XCVU35P-1FSVH2892E |
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Hersteller: AMD
Description: IC FPGA 416 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Description: IC FPGA 416 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
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XCVU35P-2FSVH2892E |
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Hersteller: AMD
Description: IC FPGA 416 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Description: IC FPGA 416 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
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XCVU35P-L2FSVH2892E |
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Hersteller: AMD
Description: IC FPGA 416 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Description: IC FPGA 416 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
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XCVU35P-3FSVH2892E |
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Hersteller: AMD
Description: IC FPGA 416 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.873V ~ 0.927V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
Description: IC FPGA 416 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.873V ~ 0.927V
Number of Logic Elements/Cells: 1906800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 108960
Total RAM Bits: 49597645
Number of I/O: 416
DigiKey Programmable: Not Verified
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XCVU47P-2FSVH2892E |
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Hersteller: AMD
Description: IC FPGA 624 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Description: IC FPGA 624 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU47P-L2FSVH2892E |
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Hersteller: AMD
Description: IC FPGA 624 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Description: IC FPGA 624 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
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XCVU47P-3FSVH2892E |
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Hersteller: AMD
Description: IC FPGA 624 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Description: IC FPGA 624 I/O 2892FCBGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LMS-EMBD-SDSOC |
Hersteller: AMD
Description: TRAINING CREDIT SDSOC DEV METHOD
Packaging: Electronic Delivery
Type: License
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: TRAINING CREDIT SDSOC DEV METHOD
Packaging: Electronic Delivery
Type: License
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
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XCZU4EG-L1SFVC784I |
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Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU4EG-L1FBVB900I |
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Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU6EG-L1FFVC900I |
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Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU6EG-L1FFVB1156I |
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Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU7EG-L1FFVC1156I |
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Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU11EG-L1FFVC1156I |
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Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU15EG-L1FFVB1156I |
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Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
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XCZU19EG-L1FFVB1517I |
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Hersteller: AMD
Description: IC SOC CORTEX-A53 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
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XCZU19EG-L1FFVC1760I |
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Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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XCVU160-2FLGB2104E |
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Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
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XCVU160-2FLGB2104I |
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Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
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XCKU3P-1SFVB784E |
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Hersteller: AMD
Description: IC FPGA 304 I/O 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 304
DigiKey Programmable: Not Verified
Description: IC FPGA 304 I/O 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 304
DigiKey Programmable: Not Verified
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XCKU3P-1FFVA676E |
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Hersteller: AMD
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
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XCKU3P-1SFVB784I |
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Hersteller: AMD
Description: IC FPGA 256 I/O 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC FPGA 256 I/O 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
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XCKU3P-1FFVD900I |
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Hersteller: AMD
Description: IC FPGA 304 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 304
DigiKey Programmable: Not Verified
Description: IC FPGA 304 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 304
DigiKey Programmable: Not Verified
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Stück im Wert von UAH
XCKU3P-2SFVB784E |
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Hersteller: AMD
Description: IC FPGA 304 I/O 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 304
DigiKey Programmable: Not Verified
Description: IC FPGA 304 I/O 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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Stück im Wert von UAH
XCKU3P-2FFVA676E |
![]() |
Hersteller: AMD
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC FPGA 256 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 256
DigiKey Programmable: Not Verified
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XCKU3P-2FFVD900E |
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Hersteller: AMD
Description: IC FPGA 304 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 304
DigiKey Programmable: Not Verified
Description: IC FPGA 304 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 355950
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 20340
Total RAM Bits: 31641600
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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Stück im Wert von UAH