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XCKU060-2FFVA1156E XCKU060-2FFVA1156E AMD ds892-kintex-ultrascale-data-sheet Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 725550
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 41460
Total RAM Bits: 38912000
Part Status: Active
Number of I/O: 520
DigiKey Programmable: Not Verified
auf Bestellung 6 Stücke:
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XC7VX330T-2FFV1761C XC7VX330T-2FFV1761C AMD ds183_Virtex_7_Data_Sheet Description: IC FPGA 700 I/O 1760FCBGA
Packaging: Bulk
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 326400
Supplier Device Package: 1761-FCBGA (42.5x42.5)
Number of LABs/CLBs: 25500
Total RAM Bits: 27648000
Number of I/O: 700
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC7VX415T-2FFV1158C XC7VX415T-2FFV1158C AMD ds183_Virtex_7_Data_Sheet Description: IC FPGA 350 I/O 1158FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 412160
Supplier Device Package: 1158-FCBGA (35x35)
Number of LABs/CLBs: 32200
Total RAM Bits: 32440320
Number of I/O: 350
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU115-1FLVD1517I XCKU115-1FLVD1517I AMD Wireless_BLE_Module_Overview_Rev1.4.pdf Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1451100
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 82920
Total RAM Bits: 77721600
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU115-2FLVD1517E XCKU115-2FLVD1517E AMD ds922-kintex-ultrascale-plus Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1451100
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 82920
Total RAM Bits: 77721600
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCKU115-2FLVD1517I XCKU115-2FLVD1517I AMD ds892-kintex-ultrascale-data-sheet Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1451100
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 82920
Total RAM Bits: 77721600
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EF-DI-25GEMAC-PROJ EF-DI-25GEMAC-PROJ AMD kluQRHH2MabKs5cfFYUQmg Description: LOGICORE, 10G/25G ETHERNET MAC/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
Utilized IC / Part: Xilinx
License Length: 1 Year
License - User Details: Project
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
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XCVU080-1FFVD1517I XCVU080-1FFVD1517I AMD O9iAY2JkM9hO1yVc2ra2tw Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 975000
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 55714
Total RAM Bits: 51200000
Part Status: Active
Number of I/O: 338
Produkt ist nicht verfügbar
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XCVU080-2FFVD1517E XCVU080-2FFVD1517E AMD ds892-kintex-ultrascale-data-sheet Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 975000
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 55714
Total RAM Bits: 51200000
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EF-DI-25GEMAC-SITE EF-DI-25GEMAC-SITE AMD kluQRHH2MabKs5cfFYUQmg Description: LOGICORE, 10G/25G ETHERNET MAC/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
Utilized IC / Part: Xilinx
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
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XCVU125-H1FLVD1517E AMD ds890-ultrascale-overview Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 1.030V
Number of Logic Elements/Cells: 1566600
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 89520
Total RAM Bits: 90726400
Part Status: Active
Number of I/O: 338
Produkt ist nicht verfügbar
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XCVU095-2FFVD1517E XCVU095-2FFVD1517E AMD ds893-virtex-ultrascale-data-sheet Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1176000
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 67200
Total RAM Bits: 62259200
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EF-DI-25GBASE-KR-PROJ AMD kluQRHH2MabKs5cfFYUQmg Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Project
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
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EF-DI-25GBASE-KR-SITE AMD DIoTxAJbgkWaC_IKzfRD1w Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
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XCVU440-1FLGA2892C AMD O9iAY2JkM9hO1yVc2ra2tw Description: IC FPGA 1456 I/O 2892FCBGA
Packaging: Bulk
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 5540850
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 316620
Total RAM Bits: 90726400
Number of I/O: 1456
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCVU440-2FLGA2892E AMD O9iAY2JkM9hO1yVc2ra2tw Description: IC FPGA 1456 I/O 2892FCBGA
Packaging: Bulk
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 5540850
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 316620
Total RAM Bits: 90726400
Number of I/O: 1456
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DV-SPVIV-DES-PP-100-XDV AMD Description: VIVADO DESIGN SUITE: DESIGN EDIT
Packaging: Bulk
For Use With/Related Products: Xilinx
Type: Integrated Development Environment (IDE)
Applications: Programming
Part Status: Obsolete
Produkt ist nicht verfügbar
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EF-DI-25GBASE-KR-WW AMD DIoTxAJbgkWaC_IKzfRD1w Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
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EK-U1-ZCU102-ES2-G EK-U1-ZCU102-ES2-G AMD xtp426-zcu102-quickstart.pdf Description: KIT EVAL ZYNQ ULTRA ZCU102
Packaging: Bulk
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ MPSoC ZCU102 ES2
Produkt ist nicht verfügbar
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EK-U1-ZCU102-ES2-G-J EK-U1-ZCU102-ES2-G-J AMD xtp426-zcu102-quickstart.pdf Description: KIT EVAL ZYNQ ULTRA ZCU102
Packaging: Bulk
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ MPSoC ZCU102 ES2 Japan
Produkt ist nicht verfügbar
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EF-DI-25GEMAC-WW AMD DIoTxAJbgkWaC_IKzfRD1w Description: LICENSE 25GEMAC WW LOGICORE
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Worldwide
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Produkt ist nicht verfügbar
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XCKU040-1FFVA1156I XCKU040-1FFVA1156I AMD ds892-kintex-ultrascale-data-sheet Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Part Status: Active
Number of I/O: 520
DigiKey Programmable: Not Verified
auf Bestellung 4 Stücke:
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1+5149.25 EUR
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XC7Z007S-2CLG400I XC7Z007S-2CLG400I AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 766MHZ 400BGA
Speed: 766MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
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XC7Z007S-2CLG225E XC7Z007S-2CLG225E AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 766MHZ 225BGA
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 766MHz
Package / Case: 225-LFBGA, CSPBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 225-CSPBGA (13x13)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Produkt ist nicht verfügbar
 Mindestbestellmenge: 160 Stücke
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XC7Z012S-1CLG485I XC7Z012S-1CLG485I AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Architecture: MCU, FPGA
Supplier Device Package: 485-CSPBGA (19x19)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 485-LFBGA, CSPBGA
Packaging: Tray
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XC7Z007S-1CLG225C XC7Z007S-1CLG225C AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 225BGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 225-CSPBGA (13x13)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 225-LFBGA, CSPBGA
Packaging: Tray
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XC7Z014S-1CLG400I XC7Z014S-1CLG400I AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 400BGA
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
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XC7Z014S-2CLG400I XC7Z014S-2CLG400I AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
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XC7Z012S-2CLG485I XC7Z012S-2CLG485I AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 766MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
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XC7Z007S-1CLG400C XC7Z007S-1CLG400C AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 396 Stücke:
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XC7Z007S-1CLG225I XC7Z007S-1CLG225I AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
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XC7Z014S-1CLG400C XC7Z014S-1CLG400C AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 174 Stücke:
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XC7Z007S-2CLG225I XC7Z007S-2CLG225I AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 766MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 160 Stücke
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XC7Z007S-1CLG400I XC7Z007S-1CLG400I AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 684 Stücke:
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XC7Z007S-2CLG400E XC7Z007S-2CLG400E AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 766MHZ 400BGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 766MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
auf Bestellung 194 Stücke:
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1+131.42 EUR
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XC7Z012S-1CLG485C XC7Z012S-1CLG485C AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 485-CSPBGA (19x19)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 485-LFBGA, CSPBGA
Packaging: Tray
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1+203.82 EUR
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XC7Z014S-1CLG484C XC7Z014S-1CLG484C AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
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XC7Z014S-1CLG484I XC7Z014S-1CLG484I AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
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XCZU9EG-2FFVB1156E XCZU9EG-2FFVB1156E AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
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XCZU9EG-2FFVB1156I XCZU9EG-2FFVB1156I AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU9CG-2FFVC900I XCZU9CG-2FFVC900I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU9EG-1FFVC900E XCZU9EG-1FFVC900E AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
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XCZU9CG-1FFVC900E XCZU9CG-1FFVC900E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
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1+5445.71 EUR
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XCKU5P-1FFVA676E XCKU5P-1FFVA676E AMD ds922-kintex-ultrascale-plus Description: IC FPGA 256 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 256
Total RAM Bits: 41984000
Number of LABs/CLBs: 27120
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 474600
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCKU5P-1FFVB676E XCKU5P-1FFVB676E AMD ds922-kintex-ultrascale-plus Description: IC FPGA 280 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 41984000
Number of LABs/CLBs: 27120
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 474600
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU2EG-1SFVA625E XCZU2EG-1SFVA625E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 625FCBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU2EG-1SFVA625I XCZU2EG-1SFVA625I AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 625FCBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MCU, FPGA
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1+791.74 EUR
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XCZU2EG-1SFVC784E XCZU2EG-1SFVC784E AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
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XCZU2EG-1SFVC784I XCZU2EG-1SFVC784I AMD XCN20014 Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
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1+812.77 EUR
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XCZU2EG-L1SBVA484I XCZU2EG-L1SBVA484I AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 20 Stücke:
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1+947.67 EUR
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XCZU3CG-1SFVC784E XCZU3CG-1SFVC784E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 10 Stücke:
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1+973.92 EUR
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XCZU3CG-2SFVC784E XCZU3CG-2SFVC784E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 53 Stücke:
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1+1190.94 EUR
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XCZU3CG-2SFVC784I XCZU3CG-2SFVC784I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
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1+1394.43 EUR
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XCZU15EG-L1FFVC900I XCZU15EG-L1FFVC900I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-1FFVD1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-1FFVD1760I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-2FFVD1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-2FFVD1760I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-3FFVD1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-L2FFVD1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCKU060-2FFVA1156E ds892-kintex-ultrascale-data-sheet
XCKU060-2FFVA1156E
Hersteller: AMD
Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 725550
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 41460
Total RAM Bits: 38912000
Part Status: Active
Number of I/O: 520
DigiKey Programmable: Not Verified
auf Bestellung 6 Stücke:
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AnzahlPrivatkunde
1+9337.55 EUR
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XC7VX330T-2FFV1761C ds183_Virtex_7_Data_Sheet
XC7VX330T-2FFV1761C
Hersteller: AMD
Description: IC FPGA 700 I/O 1760FCBGA
Packaging: Bulk
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 326400
Supplier Device Package: 1761-FCBGA (42.5x42.5)
Number of LABs/CLBs: 25500
Total RAM Bits: 27648000
Number of I/O: 700
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC7VX415T-2FFV1158C ds183_Virtex_7_Data_Sheet
XC7VX415T-2FFV1158C
Hersteller: AMD
Description: IC FPGA 350 I/O 1158FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 412160
Supplier Device Package: 1158-FCBGA (35x35)
Number of LABs/CLBs: 32200
Total RAM Bits: 32440320
Number of I/O: 350
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCKU115-1FLVD1517I Wireless_BLE_Module_Overview_Rev1.4.pdf
XCKU115-1FLVD1517I
Hersteller: AMD
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1451100
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 82920
Total RAM Bits: 77721600
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCKU115-2FLVD1517E ds922-kintex-ultrascale-plus
XCKU115-2FLVD1517E
Hersteller: AMD
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1451100
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 82920
Total RAM Bits: 77721600
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCKU115-2FLVD1517I ds892-kintex-ultrascale-data-sheet
XCKU115-2FLVD1517I
Hersteller: AMD
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1451100
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 82920
Total RAM Bits: 77721600
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EF-DI-25GEMAC-PROJ kluQRHH2MabKs5cfFYUQmg
EF-DI-25GEMAC-PROJ
Hersteller: AMD
Description: LOGICORE, 10G/25G ETHERNET MAC/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
Utilized IC / Part: Xilinx
License Length: 1 Year
License - User Details: Project
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVU080-1FFVD1517I O9iAY2JkM9hO1yVc2ra2tw
XCVU080-1FFVD1517I
Hersteller: AMD
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 975000
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 55714
Total RAM Bits: 51200000
Part Status: Active
Number of I/O: 338
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVU080-2FFVD1517E ds892-kintex-ultrascale-data-sheet
XCVU080-2FFVD1517E
Hersteller: AMD
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 975000
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 55714
Total RAM Bits: 51200000
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EF-DI-25GEMAC-SITE kluQRHH2MabKs5cfFYUQmg
EF-DI-25GEMAC-SITE
Hersteller: AMD
Description: LOGICORE, 10G/25G ETHERNET MAC/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
Utilized IC / Part: Xilinx
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVU125-H1FLVD1517E ds890-ultrascale-overview
Hersteller: AMD
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Bulk
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 1.030V
Number of Logic Elements/Cells: 1566600
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 89520
Total RAM Bits: 90726400
Part Status: Active
Number of I/O: 338
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVU095-2FFVD1517E ds893-virtex-ultrascale-data-sheet
XCVU095-2FFVD1517E
Hersteller: AMD
Description: IC FPGA 338 I/O 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1176000
Supplier Device Package: 1517-FCBGA (40x40)
Number of LABs/CLBs: 67200
Total RAM Bits: 62259200
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EF-DI-25GBASE-KR-PROJ kluQRHH2MabKs5cfFYUQmg
Hersteller: AMD
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Project
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EF-DI-25GBASE-KR-SITE DIoTxAJbgkWaC_IKzfRD1w
Hersteller: AMD
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVU440-1FLGA2892C O9iAY2JkM9hO1yVc2ra2tw
Hersteller: AMD
Description: IC FPGA 1456 I/O 2892FCBGA
Packaging: Bulk
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 5540850
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 316620
Total RAM Bits: 90726400
Number of I/O: 1456
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVU440-2FLGA2892E O9iAY2JkM9hO1yVc2ra2tw
Hersteller: AMD
Description: IC FPGA 1456 I/O 2892FCBGA
Packaging: Bulk
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 5540850
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 316620
Total RAM Bits: 90726400
Number of I/O: 1456
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DV-SPVIV-DES-PP-100-XDV
Hersteller: AMD
Description: VIVADO DESIGN SUITE: DESIGN EDIT
Packaging: Bulk
For Use With/Related Products: Xilinx
Type: Integrated Development Environment (IDE)
Applications: Programming
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EF-DI-25GBASE-KR-WW DIoTxAJbgkWaC_IKzfRD1w
Hersteller: AMD
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EK-U1-ZCU102-ES2-G xtp426-zcu102-quickstart.pdf
EK-U1-ZCU102-ES2-G
Hersteller: AMD
Description: KIT EVAL ZYNQ ULTRA ZCU102
Packaging: Bulk
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ MPSoC ZCU102 ES2
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EK-U1-ZCU102-ES2-G-J xtp426-zcu102-quickstart.pdf
EK-U1-ZCU102-ES2-G-J
Hersteller: AMD
Description: KIT EVAL ZYNQ ULTRA ZCU102
Packaging: Bulk
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ MPSoC ZCU102 ES2 Japan
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EF-DI-25GEMAC-WW DIoTxAJbgkWaC_IKzfRD1w
Hersteller: AMD
Description: LICENSE 25GEMAC WW LOGICORE
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Worldwide
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCKU040-1FFVA1156I ds892-kintex-ultrascale-data-sheet
XCKU040-1FFVA1156I
Hersteller: AMD
Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Part Status: Active
Number of I/O: 520
DigiKey Programmable: Not Verified
auf Bestellung 4 Stücke:
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AnzahlPrivatkunde
1+5149.25 EUR
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XC7Z007S-2CLG400I ds190-Zynq-7000-Overview
XC7Z007S-2CLG400I
Hersteller: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Speed: 766MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
auf Bestellung 98 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+154.82 EUR
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XC7Z007S-2CLG225E ds190-Zynq-7000-Overview
XC7Z007S-2CLG225E
Hersteller: AMD
Description: IC SOC CORTEX-A9 766MHZ 225BGA
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 766MHz
Package / Case: 225-LFBGA, CSPBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 225-CSPBGA (13x13)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Produkt ist nicht verfügbar
Mindestbestellmenge: 160 Stücke
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XC7Z012S-1CLG485I ds190-Zynq-7000-Overview
XC7Z012S-1CLG485I
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Architecture: MCU, FPGA
Supplier Device Package: 485-CSPBGA (19x19)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 485-LFBGA, CSPBGA
Packaging: Tray
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+288.28 EUR
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XC7Z007S-1CLG225C ds190-Zynq-7000-Overview
XC7Z007S-1CLG225C
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 225BGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 225-CSPBGA (13x13)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 225-LFBGA, CSPBGA
Packaging: Tray
auf Bestellung 93 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+107.34 EUR
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XC7Z014S-1CLG400I ds190-Zynq-7000-Overview
XC7Z014S-1CLG400I
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
auf Bestellung 68 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+236.54 EUR
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XC7Z014S-2CLG400I ds190-Zynq-7000-Overview
XC7Z014S-2CLG400I
Hersteller: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+279.54 EUR
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XC7Z012S-2CLG485I ds190-Zynq-7000-Overview
XC7Z012S-2CLG485I
Hersteller: AMD
Description: IC SOC CORTEX-A9 766MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 71 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+311.88 EUR
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XC7Z007S-1CLG400C ds190-Zynq-7000-Overview
XC7Z007S-1CLG400C
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 396 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+131.61 EUR
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XC7Z007S-1CLG225I ds190-Zynq-7000-Overview
XC7Z007S-1CLG225I
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 156 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+122.71 EUR
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XC7Z014S-1CLG400C ds190-Zynq-7000-Overview
XC7Z014S-1CLG400C
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 174 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+228.43 EUR
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XC7Z007S-2CLG225I ds190-Zynq-7000-Overview
XC7Z007S-2CLG225I
Hersteller: AMD
Description: IC SOC CORTEX-A9 766MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 160 Stücke
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XC7Z007S-1CLG400I ds190-Zynq-7000-Overview
XC7Z007S-1CLG400I
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 684 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+120.56 EUR
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XC7Z007S-2CLG400E ds190-Zynq-7000-Overview
XC7Z007S-2CLG400E
Hersteller: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 766MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
auf Bestellung 194 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+131.42 EUR
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XC7Z012S-1CLG485C ds190-Zynq-7000-Overview
XC7Z012S-1CLG485C
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 485-CSPBGA (19x19)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 485-LFBGA, CSPBGA
Packaging: Tray
auf Bestellung 56 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+203.82 EUR
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XC7Z014S-1CLG484C ds190-Zynq-7000-Overview
XC7Z014S-1CLG484C
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 49 Stücke:
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XC7Z014S-1CLG484I ds190-Zynq-7000-Overview
XC7Z014S-1CLG484I
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 93 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+294.01 EUR
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XCZU9EG-2FFVB1156E Zynq%20UltraScale%2B_Datasheet.pdf
XCZU9EG-2FFVB1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 6 Stücke:
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1+8832.53 EUR
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XCZU9EG-2FFVB1156I Zynq%20UltraScale%2B_Datasheet.pdf
XCZU9EG-2FFVB1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU9CG-2FFVC900I jDqbmrrvy_u9hmwDv1iWBQ
XCZU9CG-2FFVC900I
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU9EG-1FFVC900E Zynq%20UltraScale%2B_Datasheet.pdf
XCZU9EG-1FFVC900E
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+5584.13 EUR
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XCZU9CG-1FFVC900E jDqbmrrvy_u9hmwDv1iWBQ
XCZU9CG-1FFVC900E
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+5445.71 EUR
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XCKU5P-1FFVA676E ds922-kintex-ultrascale-plus
XCKU5P-1FFVA676E
Hersteller: AMD
Description: IC FPGA 256 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 256
Total RAM Bits: 41984000
Number of LABs/CLBs: 27120
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 474600
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCKU5P-1FFVB676E ds922-kintex-ultrascale-plus
XCKU5P-1FFVB676E
Hersteller: AMD
Description: IC FPGA 280 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 41984000
Number of LABs/CLBs: 27120
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 474600
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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XCZU2EG-1SFVA625E jDqbmrrvy_u9hmwDv1iWBQ
XCZU2EG-1SFVA625E
Hersteller: AMD
Description: IC SOC CORTEX-A53 625FCBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XCZU2EG-1SFVA625I Zynq%20UltraScale%2B_Datasheet.pdf
XCZU2EG-1SFVA625I
Hersteller: AMD
Description: IC SOC CORTEX-A53 625FCBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MCU, FPGA
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+791.74 EUR
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XCZU2EG-1SFVC784E Zynq%20UltraScale%2B_Datasheet.pdf
XCZU2EG-1SFVC784E
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+651.61 EUR
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XCZU2EG-1SFVC784I XCN20014
XCZU2EG-1SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+812.77 EUR
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XCZU2EG-L1SBVA484I Zynq%20UltraScale%2B_Datasheet.pdf
XCZU2EG-L1SBVA484I
Hersteller: AMD
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+947.67 EUR
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XCZU3CG-1SFVC784E ds891-zynq-ultrascale-plus-overview
XCZU3CG-1SFVC784E
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+973.92 EUR
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XCZU3CG-2SFVC784E ds891-zynq-ultrascale-plus-overview
XCZU3CG-2SFVC784E
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 53 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+1190.94 EUR
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XCZU3CG-2SFVC784I ds891-zynq-ultrascale-plus-overview
XCZU3CG-2SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+1394.43 EUR
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XCZU15EG-L1FFVC900I ds891-zynq-ultrascale-plus-overview
XCZU15EG-L1FFVC900I
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-1FFVD1760E ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-1FFVD1760I ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-2FFVD1760E ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-2FFVD1760I ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-3FFVD1760E ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XCZU19EG-L2FFVD1760E ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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