Produkte > AMD > Alle Produkte des Herstellers AMD (11150) > Seite 37 nach 186

Wählen Sie Seite:   [  << Vorherige Seite ]  1 18 32 33 34 35 36 37 38 39 40 41 42 54 72 90 108 126 144 162 180 186  [ Nächste Seite >> ]
Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Preis
XCVU440-2FLGA2892E AMD O9iAY2JkM9hO1yVc2ra2tw Description: IC FPGA 1456 I/O 2892FCBGA
Packaging: Bulk
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 5540850
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 316620
Total RAM Bits: 90726400
Number of I/O: 1456
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DV-SPVIV-DES-PP-100-XDV AMD Description: VIVADO DESIGN SUITE: DESIGN EDIT
Packaging: Bulk
For Use With/Related Products: Xilinx
Type: Integrated Development Environment (IDE)
Applications: Programming
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EF-DI-25GBASE-KR-WW AMD DIoTxAJbgkWaC_IKzfRD1w Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EK-U1-ZCU102-ES2-G EK-U1-ZCU102-ES2-G AMD xtp426-zcu102-quickstart.pdf Description: KIT EVAL ZYNQ ULTRA ZCU102
Packaging: Bulk
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ MPSoC ZCU102 ES2
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EK-U1-ZCU102-ES2-G-J EK-U1-ZCU102-ES2-G-J AMD xtp426-zcu102-quickstart.pdf Description: KIT EVAL ZYNQ ULTRA ZCU102
Packaging: Bulk
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ MPSoC ZCU102 ES2 Japan
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EF-DI-25GEMAC-WW AMD DIoTxAJbgkWaC_IKzfRD1w Description: LICENSE 25GEMAC WW LOGICORE
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Worldwide
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCKU040-1FFVA1156I XCKU040-1FFVA1156I AMD ds892-kintex-ultrascale-data-sheet Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Part Status: Active
Number of I/O: 520
DigiKey Programmable: Not Verified
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+4327.1 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z007S-2CLG400I XC7Z007S-2CLG400I AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 766MHZ 400BGA
Speed: 766MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
auf Bestellung 98 Stücke:
Lieferzeit 10-14 Tag (e)
1+130.1 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z007S-2CLG225E XC7Z007S-2CLG225E AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 766MHZ 225BGA
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 766MHz
Package / Case: 225-LFBGA, CSPBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 225-CSPBGA (13x13)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Produkt ist nicht verfügbar
 Mindestbestellmenge: 160 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z012S-1CLG485I XC7Z012S-1CLG485I AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Architecture: MCU, FPGA
Supplier Device Package: 485-CSPBGA (19x19)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 485-LFBGA, CSPBGA
Packaging: Tray
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+242.25 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z007S-1CLG225C XC7Z007S-1CLG225C AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 225BGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 225-CSPBGA (13x13)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 225-LFBGA, CSPBGA
Packaging: Tray
auf Bestellung 93 Stücke:
Lieferzeit 10-14 Tag (e)
1+90.2 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z014S-1CLG400I XC7Z014S-1CLG400I AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 400BGA
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
auf Bestellung 68 Stücke:
Lieferzeit 10-14 Tag (e)
1+198.77 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z014S-2CLG400I XC7Z014S-2CLG400I AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+234.91 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z012S-2CLG485I XC7Z012S-2CLG485I AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 766MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 71 Stücke:
Lieferzeit 10-14 Tag (e)
1+262.08 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z007S-1CLG400C XC7Z007S-1CLG400C AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 269 Stücke:
Lieferzeit 10-14 Tag (e)
1+107.24 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z007S-1CLG225I XC7Z007S-1CLG225I AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 156 Stücke:
Lieferzeit 10-14 Tag (e)
1+103.12 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z014S-1CLG400C XC7Z014S-1CLG400C AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 174 Stücke:
Lieferzeit 10-14 Tag (e)
1+191.96 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z007S-2CLG225I XC7Z007S-2CLG225I AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 766MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 160 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z007S-1CLG400I XC7Z007S-1CLG400I AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 684 Stücke:
Lieferzeit 10-14 Tag (e)
1+101.31 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z007S-2CLG400E XC7Z007S-2CLG400E AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 766MHZ 400BGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 766MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
auf Bestellung 194 Stücke:
Lieferzeit 10-14 Tag (e)
1+110.44 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z012S-1CLG485C XC7Z012S-1CLG485C AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 485-CSPBGA (19x19)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 485-LFBGA, CSPBGA
Packaging: Tray
auf Bestellung 56 Stücke:
Lieferzeit 10-14 Tag (e)
1+171.28 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z014S-1CLG484C XC7Z014S-1CLG484C AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 49 Stücke:
Lieferzeit 10-14 Tag (e)
1+211.22 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z014S-1CLG484I XC7Z014S-1CLG484I AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 130 Stücke:
Lieferzeit 10-14 Tag (e)
1+239.57 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9EG-2FFVB1156E XCZU9EG-2FFVB1156E AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
1+7422.29 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9EG-2FFVB1156I XCZU9EG-2FFVB1156I AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9CG-2FFVC900I XCZU9CG-2FFVC900I AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9EG-1FFVC900E XCZU9EG-1FFVC900E AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+4692.55 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9CG-1FFVC900E XCZU9CG-1FFVC900E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+4576.23 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCKU5P-1FFVA676E XCKU5P-1FFVA676E AMD ds922-kintex-ultrascale-plus Description: IC FPGA 256 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 256
Total RAM Bits: 41984000
Number of LABs/CLBs: 27120
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 474600
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCKU5P-1FFVB676E XCKU5P-1FFVB676E AMD ds922-kintex-ultrascale-plus Description: IC FPGA 280 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 41984000
Number of LABs/CLBs: 27120
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 474600
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU2EG-1SFVA625E XCZU2EG-1SFVA625E AMD jDqbmrrvy_u9hmwDv1iWBQ Description: IC SOC CORTEX-A53 625FCBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU2EG-1SFVA625I XCZU2EG-1SFVA625I AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 625FCBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MCU, FPGA
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+665.33 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU2EG-1SFVC784E XCZU2EG-1SFVC784E AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+547.57 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU2EG-1SFVC784I XCZU2EG-1SFVC784I AMD XCN20014 Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+683 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU2EG-L1SBVA484I XCZU2EG-L1SBVA484I AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
1+708.52 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU3CG-1SFVC784E XCZU3CG-1SFVC784E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 140 Stücke:
Lieferzeit 10-14 Tag (e)
1+727.72 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU3CG-2SFVC784E XCZU3CG-2SFVC784E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 62 Stücke:
Lieferzeit 10-14 Tag (e)
1+1053.2 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU3CG-2SFVC784I XCZU3CG-2SFVC784I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+1171.79 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU15EG-L1FFVC900I XCZU15EG-L1FFVC900I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU19EG-1FFVD1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU19EG-1FFVD1760I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU19EG-2FFVD1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU19EG-2FFVD1760I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU19EG-3FFVD1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU19EG-L2FFVD1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU2CG-1SBVA484I XCZU2CG-1SBVA484I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
1+521.98 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU2CG-2SBVA484I XCZU2CG-2SBVA484I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+706.96 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU2CG-L1SFVC784I XCZU2CG-L1SFVC784I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 66 Stücke:
Lieferzeit 10-14 Tag (e)
1+659.52 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU4CG-1SFVC784I XCZU4CG-1SFVC784I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 46 Stücke:
Lieferzeit 10-14 Tag (e)
1+1955.29 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU4CG-2SFVC784I XCZU4CG-2SFVC784I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 122 Stücke:
Lieferzeit 10-14 Tag (e)
1+2524.42 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU4EG-1SFVC784E XCZU4EG-1SFVC784E AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
1+1662.58 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU4EV-1SFVC784E XCZU4EV-1SFVC784E AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+1933.2 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU7EV-2FFVC1156I XCZU7EV-2FFVC1156I AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+7724.97 EUR
Im Einkaufswagen  Stück im Wert von  UAH
EK-U1-ZCU102-G EK-U1-ZCU102-G AMD xtp426-zcu102-quickstart.pdf Description: XILINX ZYNQ ULTRASCALE+ MPSOC ZC
Packaging: Box
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: XCZU9EG
Platform: Zynq UltraScale+ MPSoC ZCU102
Part Status: Active
auf Bestellung 312 Stücke:
Lieferzeit 10-14 Tag (e)
1+5473.6 EUR
Im Einkaufswagen  Stück im Wert von  UAH
EK-U1-KCU116-G EK-U1-KCU116-G AMD xtp471-kcu116-quickstart.pdf Description: XILINX KINTEX ULTRASCALE+ FPGA K
Utilized IC / Part: XCKU5P
Part Status: Active
Platform: Kintex UltraScale+ FPGA KCU116 PCIe Card
Contents: Board(s), Cable(s), Power Supply
Type: FPGA
For Use With/Related Products: XCKU5P
Packaging: Box
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+11094.79 EUR
Im Einkaufswagen  Stück im Wert von  UAH
EF-DI-25G-RS-FEC-PROJ AMD Description: LOGICORE, 25G IEEE 802.3 REED-SO
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Project
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EF-DI-25G-RS-FEC-SITE AMD Description: LOGICORE, 25G IEEE 802.3 REED-SO
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Site
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCKU3P-1FFVB676E XCKU3P-1FFVB676E AMD ds922-kintex-ultrascale-plus Description: IC FPGA 280 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 31641600
Number of LABs/CLBs: 20340
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 355950
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
1+2480.46 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCKU3P-1FFVB676I XCKU3P-1FFVB676I AMD ds922-kintex-ultrascale-plus Description: IC FPGA 280 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 31641600
Number of LABs/CLBs: 20340
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 355950
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+3102.11 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCKU3P-2FFVB676E XCKU3P-2FFVB676E AMD ds922-kintex-ultrascale-plus Description: IC FPGA 280 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 31641600
Number of LABs/CLBs: 20340
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 355950
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCVU440-2FLGA2892E O9iAY2JkM9hO1yVc2ra2tw
Hersteller: AMD
Description: IC FPGA 1456 I/O 2892FCBGA
Packaging: Bulk
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 5540850
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 316620
Total RAM Bits: 90726400
Number of I/O: 1456
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
DV-SPVIV-DES-PP-100-XDV
Hersteller: AMD
Description: VIVADO DESIGN SUITE: DESIGN EDIT
Packaging: Bulk
For Use With/Related Products: Xilinx
Type: Integrated Development Environment (IDE)
Applications: Programming
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EF-DI-25GBASE-KR-WW DIoTxAJbgkWaC_IKzfRD1w
Hersteller: AMD
Description: LOGICORE, 10G/25G ETHERNET PCS/P
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EK-U1-ZCU102-ES2-G xtp426-zcu102-quickstart.pdf
EK-U1-ZCU102-ES2-G
Hersteller: AMD
Description: KIT EVAL ZYNQ ULTRA ZCU102
Packaging: Bulk
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ MPSoC ZCU102 ES2
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EK-U1-ZCU102-ES2-G-J xtp426-zcu102-quickstart.pdf
EK-U1-ZCU102-ES2-G-J
Hersteller: AMD
Description: KIT EVAL ZYNQ ULTRA ZCU102
Packaging: Bulk
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ MPSoC ZCU102 ES2 Japan
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EF-DI-25GEMAC-WW DIoTxAJbgkWaC_IKzfRD1w
Hersteller: AMD
Description: LICENSE 25GEMAC WW LOGICORE
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Worldwide
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCKU040-1FFVA1156I ds892-kintex-ultrascale-data-sheet
XCKU040-1FFVA1156I
Hersteller: AMD
Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Part Status: Active
Number of I/O: 520
DigiKey Programmable: Not Verified
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+4327.1 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z007S-2CLG400I ds190-Zynq-7000-Overview
XC7Z007S-2CLG400I
Hersteller: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Speed: 766MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
auf Bestellung 98 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+130.1 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z007S-2CLG225E ds190-Zynq-7000-Overview
XC7Z007S-2CLG225E
Hersteller: AMD
Description: IC SOC CORTEX-A9 766MHZ 225BGA
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 766MHz
Package / Case: 225-LFBGA, CSPBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 225-CSPBGA (13x13)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Produkt ist nicht verfügbar
Mindestbestellmenge: 160 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z012S-1CLG485I ds190-Zynq-7000-Overview
XC7Z012S-1CLG485I
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Architecture: MCU, FPGA
Supplier Device Package: 485-CSPBGA (19x19)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 485-LFBGA, CSPBGA
Packaging: Tray
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+242.25 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z007S-1CLG225C ds190-Zynq-7000-Overview
XC7Z007S-1CLG225C
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 225BGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 225-CSPBGA (13x13)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 225-LFBGA, CSPBGA
Packaging: Tray
auf Bestellung 93 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+90.2 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z014S-1CLG400I ds190-Zynq-7000-Overview
XC7Z014S-1CLG400I
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
auf Bestellung 68 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+198.77 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z014S-2CLG400I ds190-Zynq-7000-Overview
XC7Z014S-2CLG400I
Hersteller: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+234.91 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z012S-2CLG485I ds190-Zynq-7000-Overview
XC7Z012S-2CLG485I
Hersteller: AMD
Description: IC SOC CORTEX-A9 766MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 71 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+262.08 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z007S-1CLG400C ds190-Zynq-7000-Overview
XC7Z007S-1CLG400C
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 269 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+107.24 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z007S-1CLG225I ds190-Zynq-7000-Overview
XC7Z007S-1CLG225I
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 156 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+103.12 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z014S-1CLG400C ds190-Zynq-7000-Overview
XC7Z014S-1CLG400C
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 174 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+191.96 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z007S-2CLG225I ds190-Zynq-7000-Overview
XC7Z007S-2CLG225I
Hersteller: AMD
Description: IC SOC CORTEX-A9 766MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 160 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z007S-1CLG400I ds190-Zynq-7000-Overview
XC7Z007S-1CLG400I
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 684 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+101.31 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z007S-2CLG400E ds190-Zynq-7000-Overview
XC7Z007S-2CLG400E
Hersteller: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 766MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
auf Bestellung 194 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+110.44 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z012S-1CLG485C ds190-Zynq-7000-Overview
XC7Z012S-1CLG485C
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 485-CSPBGA (19x19)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 85°C (TJ)
RAM Size: 256KB
Speed: 667MHz
Package / Case: 485-LFBGA, CSPBGA
Packaging: Tray
auf Bestellung 56 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+171.28 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z014S-1CLG484C ds190-Zynq-7000-Overview
XC7Z014S-1CLG484C
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 49 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+211.22 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XC7Z014S-1CLG484I ds190-Zynq-7000-Overview
XC7Z014S-1CLG484I
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 130 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+239.57 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9EG-2FFVB1156E Zynq%20UltraScale%2B_Datasheet.pdf
XCZU9EG-2FFVB1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+7422.29 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9EG-2FFVB1156I Zynq%20UltraScale%2B_Datasheet.pdf
XCZU9EG-2FFVB1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9CG-2FFVC900I jDqbmrrvy_u9hmwDv1iWBQ
XCZU9CG-2FFVC900I
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9EG-1FFVC900E Zynq%20UltraScale%2B_Datasheet.pdf
XCZU9EG-1FFVC900E
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+4692.55 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU9CG-1FFVC900E jDqbmrrvy_u9hmwDv1iWBQ
XCZU9CG-1FFVC900E
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+4576.23 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCKU5P-1FFVA676E ds922-kintex-ultrascale-plus
XCKU5P-1FFVA676E
Hersteller: AMD
Description: IC FPGA 256 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 256
Total RAM Bits: 41984000
Number of LABs/CLBs: 27120
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 474600
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCKU5P-1FFVB676E ds922-kintex-ultrascale-plus
XCKU5P-1FFVB676E
Hersteller: AMD
Description: IC FPGA 280 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 41984000
Number of LABs/CLBs: 27120
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 474600
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU2EG-1SFVA625E jDqbmrrvy_u9hmwDv1iWBQ
XCZU2EG-1SFVA625E
Hersteller: AMD
Description: IC SOC CORTEX-A53 625FCBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU2EG-1SFVA625I Zynq%20UltraScale%2B_Datasheet.pdf
XCZU2EG-1SFVA625I
Hersteller: AMD
Description: IC SOC CORTEX-A53 625FCBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MCU, FPGA
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+665.33 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU2EG-1SFVC784E Zynq%20UltraScale%2B_Datasheet.pdf
XCZU2EG-1SFVC784E
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+547.57 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU2EG-1SFVC784I XCN20014
XCZU2EG-1SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+683 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU2EG-L1SBVA484I Zynq%20UltraScale%2B_Datasheet.pdf
XCZU2EG-L1SBVA484I
Hersteller: AMD
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+708.52 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU3CG-1SFVC784E ds891-zynq-ultrascale-plus-overview
XCZU3CG-1SFVC784E
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 140 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+727.72 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU3CG-2SFVC784E ds891-zynq-ultrascale-plus-overview
XCZU3CG-2SFVC784E
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 62 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+1053.2 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU3CG-2SFVC784I ds891-zynq-ultrascale-plus-overview
XCZU3CG-2SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+1171.79 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU15EG-L1FFVC900I ds891-zynq-ultrascale-plus-overview
XCZU15EG-L1FFVC900I
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU19EG-1FFVD1760E ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU19EG-1FFVD1760I ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU19EG-2FFVD1760E ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU19EG-2FFVD1760I ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU19EG-3FFVD1760E ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU19EG-L2FFVD1760E ds891-zynq-ultrascale-plus-overview
Hersteller: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCZU2CG-1SBVA484I ds891-zynq-ultrascale-plus-overview
XCZU2CG-1SBVA484I
Hersteller: AMD
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+521.98 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU2CG-2SBVA484I ds891-zynq-ultrascale-plus-overview
XCZU2CG-2SBVA484I
Hersteller: AMD
Description: IC SOC CORTEX-A53 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+706.96 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU2CG-L1SFVC784I ds891-zynq-ultrascale-plus-overview
XCZU2CG-L1SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 66 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+659.52 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU4CG-1SFVC784I ds891-zynq-ultrascale-plus-overview
XCZU4CG-1SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 46 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+1955.29 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU4CG-2SFVC784I ds891-zynq-ultrascale-plus-overview
XCZU4CG-2SFVC784I
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 122 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+2524.42 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU4EG-1SFVC784E Zynq%20UltraScale%2B_Datasheet.pdf
XCZU4EG-1SFVC784E
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+1662.58 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU4EV-1SFVC784E dfRkDKgzEvo5CsUiQJdEkg
XCZU4EV-1SFVC784E
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+1933.2 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCZU7EV-2FFVC1156I dfRkDKgzEvo5CsUiQJdEkg
XCZU7EV-2FFVC1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+7724.97 EUR
Im Einkaufswagen  Stück im Wert von  UAH
EK-U1-ZCU102-G xtp426-zcu102-quickstart.pdf
EK-U1-ZCU102-G
Hersteller: AMD
Description: XILINX ZYNQ ULTRASCALE+ MPSOC ZC
Packaging: Box
For Use With/Related Products: XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: XCZU9EG
Platform: Zynq UltraScale+ MPSoC ZCU102
Part Status: Active
auf Bestellung 312 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+5473.6 EUR
Im Einkaufswagen  Stück im Wert von  UAH
EK-U1-KCU116-G xtp471-kcu116-quickstart.pdf
EK-U1-KCU116-G
Hersteller: AMD
Description: XILINX KINTEX ULTRASCALE+ FPGA K
Utilized IC / Part: XCKU5P
Part Status: Active
Platform: Kintex UltraScale+ FPGA KCU116 PCIe Card
Contents: Board(s), Cable(s), Power Supply
Type: FPGA
For Use With/Related Products: XCKU5P
Packaging: Box
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+11094.79 EUR
Im Einkaufswagen  Stück im Wert von  UAH
EF-DI-25G-RS-FEC-PROJ
Hersteller: AMD
Description: LOGICORE, 25G IEEE 802.3 REED-SO
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Project
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EF-DI-25G-RS-FEC-SITE
Hersteller: AMD
Description: LOGICORE, 25G IEEE 802.3 REED-SO
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Site
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
XCKU3P-1FFVB676E ds922-kintex-ultrascale-plus
XCKU3P-1FFVB676E
Hersteller: AMD
Description: IC FPGA 280 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 31641600
Number of LABs/CLBs: 20340
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 355950
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+2480.46 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCKU3P-1FFVB676I ds922-kintex-ultrascale-plus
XCKU3P-1FFVB676I
Hersteller: AMD
Description: IC FPGA 280 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 31641600
Number of LABs/CLBs: 20340
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 355950
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+3102.11 EUR
Im Einkaufswagen  Stück im Wert von  UAH
XCKU3P-2FFVB676E ds922-kintex-ultrascale-plus
XCKU3P-2FFVB676E
Hersteller: AMD
Description: IC FPGA 280 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 31641600
Number of LABs/CLBs: 20340
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 355950
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
Wählen Sie Seite:   [  << Vorherige Seite ]  1 18 32 33 34 35 36 37 38 39 40 41 42 54 72 90 108 126 144 162 180 186  [ Nächste Seite >> ]