Produkte > CUI DEVICES > Alle Produkte des Herstellers CUI DEVICES (22872) > Seite 25 nach 382
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
SJ2-3592B-SMT-TR | CUI Devices |
Description: AUDIO JACK, 3.5 MM, RT, 2 CONDUC Features: Board Guide Packaging: Cut Tape (CT) Connector Type: Phone Jack Gender: Female Mounting Type: Surface Mount, Right Angle Shielding: Unshielded Operating Temperature: -25°C ~ 85°C Number of Positions/Contacts: 2 Conductors, 3 Contacts Internal Switch(s): Single Switch Signal Lines: Mono Termination: Solder Actual Diameter: 0.142" (3.60mm) Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone |
auf Bestellung 701 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
SJ2-35853A-SMT-TR | CUI Devices |
Description: AUDIO JACK, 3.5 MM, RT, 3 CONDUC Features: Board Guide Packaging: Cut Tape (CT) Connector Type: Phone Jack Gender: Female Mounting Type: Surface Mount, Right Angle Shielding: Unshielded Operating Temperature: -25°C ~ 85°C Number of Positions/Contacts: 3 Conductors, 3 Contacts Internal Switch(s): Does Not Contain Switch Signal Lines: Stereo (3 Conductor, TRS) Termination: Solder Actual Diameter: 0.142" (3.60mm) Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone Part Status: Active |
auf Bestellung 7745 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
SJ2-35863A1-SMT-TR | CUI Devices | Description: AUDIO JACK, 3.5 MM, RT, 3 CONDUC |
Produkt ist nicht verfügbar |
||||||||||||||||||||
SJ2-35863B-SMT-TR | CUI Devices | Description: AUDIO JACK, 3.5 MM, RT, 3 CONDUC |
Produkt ist nicht verfügbar |
||||||||||||||||||||
SJ2-35863A-SMT-TR | CUI Devices |
Description: AUDIO JACK, 3.5 MM, RT, 3 CONDUC Features: Board Guide Packaging: Cut Tape (CT) Connector Type: Phone Jack Gender: Female Mounting Type: Surface Mount, Right Angle Shielding: Unshielded Operating Temperature: -25°C ~ 85°C Number of Positions/Contacts: 3 Conductors, 3 Contacts Internal Switch(s): Does Not Contain Switch Signal Lines: Stereo (3 Conductor, TRS) Termination: Solder Actual Diameter: 0.142" (3.60mm) Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone |
auf Bestellung 536 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
SJ2-35862B-SMT-TR | CUI Devices |
Description: AUDIO JACK, 3.5 MM, RT, 2 CONDUC Features: Board Guide Packaging: Cut Tape (CT) Connector Type: Phone Jack Gender: Female Mounting Type: Surface Mount, Right Angle Shielding: Unshielded Operating Temperature: -25°C ~ 85°C Number of Positions/Contacts: 2 Conductors, 3 Contacts Internal Switch(s): Single Switch Signal Lines: Mono Termination: Solder Actual Diameter: 0.142" (3.60mm) Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone |
auf Bestellung 858 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
SJ2-35894D-SMT-TR | CUI Devices |
Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC Packaging: Cut Tape (CT) Features: Board Guide Connector Type: Phone Jack Gender: Female Mounting Type: Surface Mount, Right Angle Shielding: Unshielded Operating Temperature: -25°C ~ 85°C Number of Positions/Contacts: 4 Conductors, 6 Contacts Internal Switch(s): Two Switches Signal Lines: Stereo (4 Conductor, TRRS) Termination: Solder Actual Diameter: 0.142" (3.60mm) Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone Part Status: Active |
auf Bestellung 21312 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
SJ2-35944A-SMT-TR | CUI Devices | Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC |
Produkt ist nicht verfügbar |
||||||||||||||||||||
SJ2-35943A-SMT-TR | CUI Devices | Description: AUDIO JACK, 3.5 MM, RT, 3 CONDUC |
Produkt ist nicht verfügbar |
||||||||||||||||||||
SJ2-35954D-SMT-TR | CUI Devices |
Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC Packaging: Cut Tape (CT) Features: Board Guide Connector Type: Phone Jack Gender: Female Mounting Type: Surface Mount, Right Angle Shielding: Unshielded Operating Temperature: -25°C ~ 85°C Number of Positions/Contacts: 4 Conductors, 6 Contacts Internal Switch(s): Two Switches Signal Lines: Stereo (4 Conductor, TRRS) Termination: Solder Actual Diameter: 0.142" (3.60mm) Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone Part Status: Active |
auf Bestellung 3594 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
SJ2-35954B-SMT-TR | CUI Devices |
Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC Packaging: Cut Tape (CT) Features: Board Guide Connector Type: Phone Jack Gender: Female Mounting Type: Surface Mount, Right Angle Shielding: Unshielded Operating Temperature: -25°C ~ 85°C Number of Positions/Contacts: 4 Conductors, 5 Contacts Internal Switch(s): Single Switch Signal Lines: Stereo (4 Conductor, TRRS) Termination: Solder Actual Diameter: 0.142" (3.60mm) Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone |
Produkt ist nicht verfügbar |
||||||||||||||||||||
SJ2-35954C-SMT-TR | CUI Devices |
Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC Packaging: Cut Tape (CT) Features: Board Guide Connector Type: Phone Jack Gender: Female Mounting Type: Surface Mount, Right Angle Shielding: Unshielded Operating Temperature: -25°C ~ 85°C Number of Positions/Contacts: 4 Conductors, 5 Contacts Internal Switch(s): Single Switch Signal Lines: Stereo (4 Conductor, TRRS) Termination: Solder Actual Diameter: 0.142" (3.60mm) Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone |
auf Bestellung 363 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
SJ2-35954A-SMT-TR | CUI Devices |
Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC Packaging: Cut Tape (CT) Features: Board Guide Connector Type: Phone Jack Gender: Female Mounting Type: Surface Mount, Right Angle Shielding: Unshielded Operating Temperature: -25°C ~ 85°C Number of Positions/Contacts: 4 Conductors, 4 Contacts Internal Switch(s): Does Not Contain Switch Signal Lines: Stereo (4 Conductor, TRRS) Termination: Solder Actual Diameter: 0.142" (3.60mm) Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone Part Status: Active |
auf Bestellung 5903 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
SJ2-35953A-SMT-TR | CUI Devices | Description: AUDIO JACK, 3.5 MM, RT, 3 CONDUC |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
||||||||||||||||||||
SJ2-35043A-SMT-TR | CUI Devices |
Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC Packaging: Cut Tape (CT) Features: Board Guide Connector Type: Phone Jack Gender: Female Mounting Type: Surface Mount, Right Angle Shielding: Unshielded Operating Temperature: -25°C ~ 85°C Number of Positions/Contacts: 4 Conductors, 4 Contacts Internal Switch(s): Does Not Contain Switch Signal Lines: Stereo (4 Conductor, TRRS) Termination: Solder Actual Diameter: 0.142" (3.60mm) Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone |
auf Bestellung 217 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSS-B20-061H | CUI Devices |
Description: HEATSINK TO-220 4W ALUMINUM Packaging: Box Material: Aluminum Length: 1.500" (38.10mm) Shape: Rectangular, Fins Type: Board Level Width: 0.504" (12.80mm) Package Cooled: TO-220 Attachment Method: PC Pin Power Dissipation @ Temperature Rise: 4.0W @ 75°C Thermal Resistance @ Forced Air Flow: 5.01°C/W @ 200 LFM Thermal Resistance @ Natural: 18.63°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1987 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSS-B20-NP | CUI Devices | Description: HEATSINK TO-220 4W ALUMINUM |
auf Bestellung 72 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSS-B20-NP-07 | CUI Devices | Description: HEATSINK TO-220 2.3W ALUMINUM |
auf Bestellung 678 Stücke: Lieferzeit 10-14 Tag (e) |
||||||||||||||||||||
HSS-B20-0953H-01 | CUI Devices |
Description: HEATSINK TO-220 2.3W ALUMINUM Packaging: Bag Material: Aluminum Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Board Level Width: 0.504" (12.80mm) Package Cooled: TO-220 Attachment Method: PC Pin Power Dissipation @ Temperature Rise: 2.3W @ 75°C Thermal Resistance @ Forced Air Flow: 11.04°C/W @ 200 LFM Thermal Resistance @ Natural: 33.28°C/W Fin Height: 0.590" (15.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 2851 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSS-B20-095H | CUI Devices |
Description: HEATSINK TO-220 4.1W ALUMINUM Packaging: Bag Material: Aluminum Length: 0.441" (11.20mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 0.866" (22.00mm) Package Cooled: TO-220 Attachment Method: PC Pin Power Dissipation @ Temperature Rise: 4.1W @ 75°C Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM Thermal Resistance @ Natural: 18.34°C/W Fin Height: 0.626" (15.90mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1106 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSS-B20-0508H-01R | CUI Devices |
Description: HEATSINK TO-220 4.7W ALUMINUM Packaging: Bag Material: Aluminum Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Board Level Width: 1.000" (25.40mm) Package Cooled: TO-220 Attachment Method: Bolt On and Board Mounts Power Dissipation @ Temperature Rise: 4.7W @ 75°C Thermal Resistance @ Forced Air Flow: 5.87°C/W @ 200 LFM Thermal Resistance @ Natural: 15.83°C/W Fin Height: 1.180" (29.97mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 3935 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSS-B20-0508H-01S | CUI Devices |
Description: HEATSINK TO-220 4.7W ALUMINUM Packaging: Bag Material: Aluminum Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Board Level Width: 1.000" (25.40mm) Package Cooled: TO-220 Attachment Method: Bolt On and Board Mounts Power Dissipation @ Temperature Rise: 4.7W @ 75°C Thermal Resistance @ Forced Air Flow: 5.87°C/W @ 200 LFM Thermal Resistance @ Natural: 15.83°C/W Fin Height: 1.180" (29.97mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 678 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSS-B20-0635H-01 | CUI Devices | Description: HEATSINK TO-220 2.7W ALUMINUM |
auf Bestellung 1013 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSS-B20-061H-02 | CUI Devices |
Description: HEATSINK TO-220 2.9W ALUMINUM Packaging: Bag Material: Aluminum Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 0.504" (12.80mm) Package Cooled: TO-220 Attachment Method: PC Pin Power Dissipation @ Temperature Rise: 2.9W @ 75°C Thermal Resistance @ Forced Air Flow: 7.24°C/W @ 200 LFM Thermal Resistance @ Natural: 25.92°C/W Fin Height: 0.748" (19.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 2965 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSS-B20-065V-02 | CUI Devices |
Description: HEATSINK TO-220 2.9W ALUMINUM Packaging: Bag Material: Aluminum Length: 0.748" (19.00mm) Shape: Rectangular, Fins Type: Board Level Width: 0.504" (12.80mm) Package Cooled: TO-220 Attachment Method: PC Pin Power Dissipation @ Temperature Rise: 2.9W @ 75°C Thermal Resistance @ Forced Air Flow: 7.24°C/W @ 200 LFM Thermal Resistance @ Natural: 25.92°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1113 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSS-B20-NP-10 | CUI Devices |
Description: HEATSINK TO-220 2.9W ALUMINUM Packaging: Bag Material: Aluminum Length: 0.748" (19.00mm) Shape: Rectangular, Fins Type: Board Level Width: 0.504" (12.80mm) Package Cooled: TO-220 Power Dissipation @ Temperature Rise: 2.9W @ 75°C Thermal Resistance @ Forced Air Flow: 7.24°C/W @ 200 LFM Thermal Resistance @ Natural: 25.92°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1807 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSS-B20-0953H-02 | CUI Devices |
Description: HEATSINK TO-220 2.9W ALUMINUM Packaging: Bag Material: Aluminum Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 0.504" (12.80mm) Package Cooled: TO-220 Attachment Method: PC Pin Power Dissipation @ Temperature Rise: 2.9W @ 75°C Thermal Resistance @ Forced Air Flow: 7.24°C/W @ 200 LFM Thermal Resistance @ Natural: 25.92°C/W Fin Height: 0.748" (19.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 2935 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSS-B20-NPS-02 | CUI Devices | Description: HEATSINK TO-220 5.1W ALUMINUM |
auf Bestellung 117 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSS-B20-053H-01 | CUI Devices |
Description: HEATSINK TO-220 4.8W ALUMINUM Packaging: Bag Material: Aluminum Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Board Level Width: 1.000" (25.40mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 4.8W @ 75°C Thermal Resistance @ Forced Air Flow: 5.83°C/W @ 200 LFM Thermal Resistance @ Natural: 15.79°C/W Fin Height: 1.181" (30.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 2816 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSS-B20-0503H | CUI Devices |
Description: HEATSINK TO-220 4.6W ALUMINUM Packaging: Box Material: Aluminum Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: TO-220 Attachment Method: PC Pin Power Dissipation @ Temperature Rise: 4.6W @ 75°C Thermal Resistance @ Forced Air Flow: 5.44°C/W @ 200 LFM Thermal Resistance @ Natural: 16.30°C/W Fin Height: 1.180" (29.97mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 2661 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSS-B20-NP-12 | CUI Devices |
Description: HEATSINK TO-220 6.8W ALUMINUM Packaging: Bag Material: Aluminum Length: 1.450" (36.83mm) Shape: Rectangular, Fins Type: Board Level Width: 0.700" (17.80mm) Package Cooled: TO-220 Attachment Method: Bolt On Power Dissipation @ Temperature Rise: 6.8W @ 75°C Thermal Resistance @ Forced Air Flow: 3.47°C/W @ 200 LFM Thermal Resistance @ Natural: 14.33°C/W Fin Height: 0.850" (21.60mm) Material Finish: Black Anodized |
auf Bestellung 2101 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSS-B20-NP-04 | CUI Devices |
Description: HEATSINK TO-220 6.5W ALUMINUM Packaging: Box Material: Aluminum Length: 1.450" (36.83mm) Shape: Rectangular, Fins Type: Board Level Width: 1.750" (44.45mm) Package Cooled: TO-220 Attachment Method: Bolt On Power Dissipation @ Temperature Rise: 6.5W @ 75°C Thermal Resistance @ Forced Air Flow: 3.76°C/W @ 200 LFM Thermal Resistance @ Natural: 11.54°C/W Fin Height: 0.370" (9.40mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 5583 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSS-B20-065V | CUI Devices |
Description: HEATSINK TO-220 4W ALUMINUM Packaging: Bag Material: Aluminum Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Board Level Width: 0.504" (12.80mm) Package Cooled: TO-220 Attachment Method: PC Pin Power Dissipation @ Temperature Rise: 4.0W @ 75°C Thermal Resistance @ Forced Air Flow: 5.01°C/W @ 200 LFM Thermal Resistance @ Natural: 18.63°C/W Fin Height: 1.500" (38.10mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 2921 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSS-B20-085H | CUI Devices | Description: HEATSINK TO-220 3.4W ALUMINUM |
Produkt ist nicht verfügbar |
||||||||||||||||||||
HSS-B20-0452H | CUI Devices | Description: HEATSINK TO-220 3.2W ALUMINUM |
Produkt ist nicht verfügbar |
||||||||||||||||||||
HSS-B20-05H | CUI Devices | Description: HEATSINK TO-220 9.8W ALUMINUM |
Produkt ist nicht verfügbar |
||||||||||||||||||||
HSS-B20-0508H-01 | CUI Devices | Description: HEATSINK TO-220 7.4W ALUMINUM |
Produkt ist nicht verfügbar |
||||||||||||||||||||
HSE-B254-04H | CUI Devices |
Description: HEAT SINK, EXTRUSION, TO-220/TO- Packaging: Box Material: Aluminum Alloy Length: 1.000" (25.40mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 0.650" (16.50mm) Package Cooled: TO-218, TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 4.7W @ 75°C Thermal Resistance @ Forced Air Flow: 4.93°C/W @ 200 LFM Thermal Resistance @ Natural: 15.96°C/W Fin Height: 0.630" (16.00mm) Material Finish: Black Anodized |
auf Bestellung 1183 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSE-B254-045H | CUI Devices |
Description: HEAT SINK, EXTRUSION, TO-220, 25 Packaging: Box Material: Aluminum Alloy Length: 1.000" (25.40mm) Shape: Rectangular, Angled Fins Type: Board Level, Vertical Width: 1.772" (45.00mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 6.4W @ 75°C Thermal Resistance @ Forced Air Flow: 3.86°C/W @ 200 LFM Thermal Resistance @ Natural: 11.72°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
auf Bestellung 630 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSE-B18254-035H | CUI Devices |
Description: HEAT SINK, EXTRUSION, TO-218, 25 Packaging: Box Material: Aluminum Alloy Length: 1.000" (25.40mm) Shape: Rectangular, Angled Fins Type: Board Level, Vertical Width: 1.638" (41.60mm) Package Cooled: TO-218 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 8.1W @ 75°C Thermal Resistance @ Forced Air Flow: 3.09°C/W @ 200 LFM Thermal Resistance @ Natural: 9.26°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 155 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSE-B18254-035H-00 | CUI Devices |
Description: HEAT SINK, EXTRUSION, TO-218, 25 Packaging: Box Material: Aluminum Alloy Length: 1.000" (25.40mm) Shape: Rectangular, Angled Fins Type: Board Level, Vertical Width: 1.638" (41.60mm) Package Cooled: TO-218 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 10.0W @ 75°C Thermal Resistance @ Forced Air Flow: 4.03°C/W @ 200 LFM Thermal Resistance @ Natural: 7.50°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
||||||||||||||||||||
HSE-B20254-035H | CUI Devices |
Description: HEAT SINK, EXTRUSION, TO-220,25. Packaging: Box Material: Aluminum Alloy Length: 1.000" (25.40mm) Shape: Rectangular, Angled Fins Type: Board Level, Vertical Width: 1.375" (34.93mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 5.8W @ 75°C Thermal Resistance @ Forced Air Flow: 3.28°C/W @ 200 LFM Thermal Resistance @ Natural: 12.93°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1683 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSE-B20254-035H-01 | CUI Devices |
Description: HEAT SINK, EXTRUSION, TO-220, 25 Packaging: Box Material: Aluminum Alloy Length: 1.000" (25.40mm) Shape: Rectangular, Angled Fins Type: Board Level, Vertical Width: 1.378" (35.00mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 5.2W @ 75°C Thermal Resistance @ Forced Air Flow: 4.42°C/W @ 200 LFM Thermal Resistance @ Natural: 14.42°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1047 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSE-B20254-035H-02 | CUI Devices |
Description: HEAT SINK, EXTRUSION, TO-220, 25 Packaging: Box Material: Aluminum Alloy Length: 1.000" (25.40mm) Shape: Rectangular, Angled Fins Type: Board Level, Vertical Width: 1.378" (35.00mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 5.5W @ 75°C Thermal Resistance @ Forced Air Flow: 4.39°C/W @ 200 LFM Thermal Resistance @ Natural: 13.64°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
||||||||||||||||||||
HSE-B20250-045H | CUI Devices |
Description: HEAT SINK, EXTRUSION, TO-220, 50 Packaging: Box Material: Aluminum Alloy Length: 1.969" (50.00mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.181" (30.00mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 7.7W @ 75°C Thermal Resistance @ Forced Air Flow: 4.05°C/W @ 200 LFM Thermal Resistance @ Natural: 9.74°C/W Fin Height: 0.472" (12.00mm) Material Finish: Black Anodized Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||||||
HSE-B20250-040H | CUI Devices |
Description: HEAT SINK, EXTRUSION, TO-220, 25 Packaging: Tray Material: Aluminum Alloy Length: 0.984" (25.00mm) Shape: Rectangular, Angled Fins Type: Board Level, Vertical Width: 1.378" (35.00mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 5.0W @ 75°C Thermal Resistance @ Forced Air Flow: 4.28°C/W @ 200 LFM Thermal Resistance @ Natural: 15.00°C/W Fin Height: 0.492" (12.50mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
||||||||||||||||||||
HSE-B20250-040H-01 | CUI Devices |
Description: HEAT SINK, EXTRUSION, TO-220, 25 Packaging: Box Material: Aluminum Alloy Length: 0.984" (25.00mm) Shape: Rectangular, Angled Fins Type: Board Level, Vertical Width: 1.359" (34.50mm) Package Cooled: TO-220 Attachment Method: PC Pin Power Dissipation @ Temperature Rise: 5.5W @ 75°C Thermal Resistance @ Forced Air Flow: 4.44°C/W @ 200 LFM Thermal Resistance @ Natural: 13.64°C/W Fin Height: 0.492" (12.50mm) Material Finish: Black Anodized |
auf Bestellung 1273 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSE-B20254-040H | CUI Devices |
Description: HEAT SINK, EXTRUSION, TO-220, 25 Packaging: Bag Material: Aluminum Alloy Length: 1.000" (25.40mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.260" (32.00mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 5.7W @ 75°C Thermal Resistance @ Forced Air Flow: 7.74°C/W @ 200 LFM Thermal Resistance @ Natural: 13.16°C/W Fin Height: 0.551" (14.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 3602 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSE-B635-045H | CUI Devices | Description: HEAT SINK, EXTRUSION, TO-220, 63 |
Produkt ist nicht verfügbar |
||||||||||||||||||||
HSE-B18381-035H | CUI Devices | Description: HEAT SINK, EXTRUSION, TO-218, 38 |
Produkt ist nicht verfügbar |
||||||||||||||||||||
HSE-B18381-035H-02 | CUI Devices | Description: HEAT SINK, EXTRUSION, TO-218, 38 |
Produkt ist nicht verfügbar |
||||||||||||||||||||
HSE-B20381-035H | CUI Devices |
Description: HEAT SINK, EXTRUSION, TO-220, 38 Packaging: Box Material: Aluminum Alloy Length: 1.500" (38.10mm) Shape: Rectangular, Angled Fins Type: Board Level, Vertical Width: 1.375" (34.93mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 6.5W @ 75°C Thermal Resistance @ Forced Air Flow: 3.66°C/W @ 200 LFM Thermal Resistance @ Natural: 11.54°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
auf Bestellung 1012 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||||
HSE-B20381-035H-01 | CUI Devices | Description: HEAT SINK, EXTRUSION, TO-220, 38 |
Produkt ist nicht verfügbar |
||||||||||||||||||||
HSE-B20381-035H-02 | CUI Devices | Description: HEAT SINK, EXTRUSION, TO-220, 38 |
Produkt ist nicht verfügbar |
||||||||||||||||||||
ACZ16BR1E-15FA1-24C | CUI Devices |
Description: ROTARY ENCODER INCREMENT 24PPR Packaging: Bulk Output Type: Quadrature (Incremental) Mounting Type: Panel, PCB Through Hole Orientation: Horizontal Termination Style: PC Pin Voltage - Supply: 5V Encoder Type: Incremental Detent: Yes Pulses per Revolution: 24 Actuator Type: 6mm Dia Flatted End Built in Switch: Yes Rotational Life (Cycles Min): 100k DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||||||||||
ACZ16BR1E-15FD1-24C | CUI Devices |
Description: ROTARY ENCODER INCREMENT 24PPR Packaging: Bulk Output Type: Quadrature (Incremental) Mounting Type: Panel, PCB Through Hole Orientation: Vertical Termination Style: PC Pin Voltage - Supply: 5V Encoder Type: Incremental Detent: Yes Pulses per Revolution: 24 Actuator Type: 6mm Dia Flatted End Built in Switch: Yes Rotational Life (Cycles Min): 100k DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||||||||||
ACZ16BR1E-15KQD1-24C | CUI Devices |
Description: ROTARY ENCODER INCREMENT 24PPR Packaging: Bulk Output Type: Quadrature (Incremental) Mounting Type: Panel, PCB Through Hole Orientation: Vertical Termination Style: PC Pin Voltage - Supply: 5V Encoder Type: Incremental Detent: Yes Pulses per Revolution: 24 Actuator Type: 6mm Dia Flatted End Built in Switch: Yes Rotational Life (Cycles Min): 100k Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||||||||||
ACZ16BR1E-20FA1-24C | CUI Devices |
Description: ROTARY ENCODER INCREMENT 24PPR Packaging: Box Output Type: Quadrature (Incremental) Mounting Type: Panel, PCB Through Hole Orientation: Horizontal Termination Style: PC Pin Voltage - Supply: 5V Encoder Type: Incremental Detent: Yes Pulses per Revolution: 24 Actuator Type: 6mm Dia Flatted End Built in Switch: Yes Rotational Life (Cycles Min): 100k DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||||||||||
ACZ16BR1E-20FD1-24C | CUI Devices |
Description: ROTARY ENCODER INCREMENT 24PPR Packaging: Box Output Type: Quadrature (Incremental) Mounting Type: Panel, PCB Through Hole Orientation: Vertical Termination Style: PC Pin Voltage - Supply: 5V Encoder Type: Incremental Detent: Yes Pulses per Revolution: 24 Actuator Type: 6mm Dia Flatted End Built in Switch: Yes Rotational Life (Cycles Min): 100k DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||||||||||
ACZ16BR1E-20KQD1-24C | CUI Devices |
Description: ROTARY ENCODER INCREMENT 24PPR Packaging: Bulk Output Type: Quadrature (Incremental) Mounting Type: Panel, PCB Through Hole Orientation: Vertical Termination Style: PC Pin Voltage - Supply: 5V Encoder Type: Incremental Detent: Yes Pulses per Revolution: 24 Actuator Type: 6mm Dia Flatted End Built in Switch: Yes Rotational Life (Cycles Min): 100k DigiKey Programmable: Not Verified |
auf Bestellung 1012 Stücke: Lieferzeit 10-14 Tag (e) |
|
SJ2-3592B-SMT-TR |
Hersteller: CUI Devices
Description: AUDIO JACK, 3.5 MM, RT, 2 CONDUC
Features: Board Guide
Packaging: Cut Tape (CT)
Connector Type: Phone Jack
Gender: Female
Mounting Type: Surface Mount, Right Angle
Shielding: Unshielded
Operating Temperature: -25°C ~ 85°C
Number of Positions/Contacts: 2 Conductors, 3 Contacts
Internal Switch(s): Single Switch
Signal Lines: Mono
Termination: Solder
Actual Diameter: 0.142" (3.60mm)
Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone
Description: AUDIO JACK, 3.5 MM, RT, 2 CONDUC
Features: Board Guide
Packaging: Cut Tape (CT)
Connector Type: Phone Jack
Gender: Female
Mounting Type: Surface Mount, Right Angle
Shielding: Unshielded
Operating Temperature: -25°C ~ 85°C
Number of Positions/Contacts: 2 Conductors, 3 Contacts
Internal Switch(s): Single Switch
Signal Lines: Mono
Termination: Solder
Actual Diameter: 0.142" (3.60mm)
Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone
auf Bestellung 701 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
9+ | 2.08 EUR |
11+ | 1.75 EUR |
25+ | 1.68 EUR |
50+ | 1.64 EUR |
100+ | 1.57 EUR |
250+ | 1.43 EUR |
500+ | 1.29 EUR |
SJ2-35853A-SMT-TR |
Hersteller: CUI Devices
Description: AUDIO JACK, 3.5 MM, RT, 3 CONDUC
Features: Board Guide
Packaging: Cut Tape (CT)
Connector Type: Phone Jack
Gender: Female
Mounting Type: Surface Mount, Right Angle
Shielding: Unshielded
Operating Temperature: -25°C ~ 85°C
Number of Positions/Contacts: 3 Conductors, 3 Contacts
Internal Switch(s): Does Not Contain Switch
Signal Lines: Stereo (3 Conductor, TRS)
Termination: Solder
Actual Diameter: 0.142" (3.60mm)
Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone
Part Status: Active
Description: AUDIO JACK, 3.5 MM, RT, 3 CONDUC
Features: Board Guide
Packaging: Cut Tape (CT)
Connector Type: Phone Jack
Gender: Female
Mounting Type: Surface Mount, Right Angle
Shielding: Unshielded
Operating Temperature: -25°C ~ 85°C
Number of Positions/Contacts: 3 Conductors, 3 Contacts
Internal Switch(s): Does Not Contain Switch
Signal Lines: Stereo (3 Conductor, TRS)
Termination: Solder
Actual Diameter: 0.142" (3.60mm)
Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone
Part Status: Active
auf Bestellung 7745 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
11+ | 1.67 EUR |
13+ | 1.41 EUR |
25+ | 1.35 EUR |
50+ | 1.32 EUR |
100+ | 1.26 EUR |
250+ | 1.15 EUR |
500+ | 1.03 EUR |
SJ2-35863A1-SMT-TR |
Hersteller: CUI Devices
Description: AUDIO JACK, 3.5 MM, RT, 3 CONDUC
Description: AUDIO JACK, 3.5 MM, RT, 3 CONDUC
Produkt ist nicht verfügbar
SJ2-35863B-SMT-TR |
Hersteller: CUI Devices
Description: AUDIO JACK, 3.5 MM, RT, 3 CONDUC
Description: AUDIO JACK, 3.5 MM, RT, 3 CONDUC
Produkt ist nicht verfügbar
SJ2-35863A-SMT-TR |
Hersteller: CUI Devices
Description: AUDIO JACK, 3.5 MM, RT, 3 CONDUC
Features: Board Guide
Packaging: Cut Tape (CT)
Connector Type: Phone Jack
Gender: Female
Mounting Type: Surface Mount, Right Angle
Shielding: Unshielded
Operating Temperature: -25°C ~ 85°C
Number of Positions/Contacts: 3 Conductors, 3 Contacts
Internal Switch(s): Does Not Contain Switch
Signal Lines: Stereo (3 Conductor, TRS)
Termination: Solder
Actual Diameter: 0.142" (3.60mm)
Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone
Description: AUDIO JACK, 3.5 MM, RT, 3 CONDUC
Features: Board Guide
Packaging: Cut Tape (CT)
Connector Type: Phone Jack
Gender: Female
Mounting Type: Surface Mount, Right Angle
Shielding: Unshielded
Operating Temperature: -25°C ~ 85°C
Number of Positions/Contacts: 3 Conductors, 3 Contacts
Internal Switch(s): Does Not Contain Switch
Signal Lines: Stereo (3 Conductor, TRS)
Termination: Solder
Actual Diameter: 0.142" (3.60mm)
Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone
auf Bestellung 536 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
9+ | 2.18 EUR |
10+ | 1.85 EUR |
25+ | 1.78 EUR |
50+ | 1.74 EUR |
100+ | 1.66 EUR |
250+ | 1.51 EUR |
SJ2-35862B-SMT-TR |
Hersteller: CUI Devices
Description: AUDIO JACK, 3.5 MM, RT, 2 CONDUC
Features: Board Guide
Packaging: Cut Tape (CT)
Connector Type: Phone Jack
Gender: Female
Mounting Type: Surface Mount, Right Angle
Shielding: Unshielded
Operating Temperature: -25°C ~ 85°C
Number of Positions/Contacts: 2 Conductors, 3 Contacts
Internal Switch(s): Single Switch
Signal Lines: Mono
Termination: Solder
Actual Diameter: 0.142" (3.60mm)
Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone
Description: AUDIO JACK, 3.5 MM, RT, 2 CONDUC
Features: Board Guide
Packaging: Cut Tape (CT)
Connector Type: Phone Jack
Gender: Female
Mounting Type: Surface Mount, Right Angle
Shielding: Unshielded
Operating Temperature: -25°C ~ 85°C
Number of Positions/Contacts: 2 Conductors, 3 Contacts
Internal Switch(s): Single Switch
Signal Lines: Mono
Termination: Solder
Actual Diameter: 0.142" (3.60mm)
Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone
auf Bestellung 858 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
9+ | 2.18 EUR |
10+ | 1.85 EUR |
25+ | 1.78 EUR |
50+ | 1.74 EUR |
100+ | 1.66 EUR |
250+ | 1.51 EUR |
SJ2-35894D-SMT-TR |
Hersteller: CUI Devices
Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC
Packaging: Cut Tape (CT)
Features: Board Guide
Connector Type: Phone Jack
Gender: Female
Mounting Type: Surface Mount, Right Angle
Shielding: Unshielded
Operating Temperature: -25°C ~ 85°C
Number of Positions/Contacts: 4 Conductors, 6 Contacts
Internal Switch(s): Two Switches
Signal Lines: Stereo (4 Conductor, TRRS)
Termination: Solder
Actual Diameter: 0.142" (3.60mm)
Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone
Part Status: Active
Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC
Packaging: Cut Tape (CT)
Features: Board Guide
Connector Type: Phone Jack
Gender: Female
Mounting Type: Surface Mount, Right Angle
Shielding: Unshielded
Operating Temperature: -25°C ~ 85°C
Number of Positions/Contacts: 4 Conductors, 6 Contacts
Internal Switch(s): Two Switches
Signal Lines: Stereo (4 Conductor, TRRS)
Termination: Solder
Actual Diameter: 0.142" (3.60mm)
Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone
Part Status: Active
auf Bestellung 21312 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
10+ | 1.94 EUR |
11+ | 1.7 EUR |
25+ | 1.63 EUR |
50+ | 1.59 EUR |
100+ | 1.52 EUR |
250+ | 1.37 EUR |
SJ2-35944A-SMT-TR |
Hersteller: CUI Devices
Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC
Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC
Produkt ist nicht verfügbar
SJ2-35943A-SMT-TR |
Hersteller: CUI Devices
Description: AUDIO JACK, 3.5 MM, RT, 3 CONDUC
Description: AUDIO JACK, 3.5 MM, RT, 3 CONDUC
Produkt ist nicht verfügbar
SJ2-35954D-SMT-TR |
Hersteller: CUI Devices
Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC
Packaging: Cut Tape (CT)
Features: Board Guide
Connector Type: Phone Jack
Gender: Female
Mounting Type: Surface Mount, Right Angle
Shielding: Unshielded
Operating Temperature: -25°C ~ 85°C
Number of Positions/Contacts: 4 Conductors, 6 Contacts
Internal Switch(s): Two Switches
Signal Lines: Stereo (4 Conductor, TRRS)
Termination: Solder
Actual Diameter: 0.142" (3.60mm)
Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone
Part Status: Active
Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC
Packaging: Cut Tape (CT)
Features: Board Guide
Connector Type: Phone Jack
Gender: Female
Mounting Type: Surface Mount, Right Angle
Shielding: Unshielded
Operating Temperature: -25°C ~ 85°C
Number of Positions/Contacts: 4 Conductors, 6 Contacts
Internal Switch(s): Two Switches
Signal Lines: Stereo (4 Conductor, TRRS)
Termination: Solder
Actual Diameter: 0.142" (3.60mm)
Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone
Part Status: Active
auf Bestellung 3594 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
9+ | 1.97 EUR |
11+ | 1.72 EUR |
25+ | 1.65 EUR |
50+ | 1.61 EUR |
100+ | 1.54 EUR |
250+ | 1.39 EUR |
500+ | 1.28 EUR |
SJ2-35954B-SMT-TR |
Hersteller: CUI Devices
Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC
Packaging: Cut Tape (CT)
Features: Board Guide
Connector Type: Phone Jack
Gender: Female
Mounting Type: Surface Mount, Right Angle
Shielding: Unshielded
Operating Temperature: -25°C ~ 85°C
Number of Positions/Contacts: 4 Conductors, 5 Contacts
Internal Switch(s): Single Switch
Signal Lines: Stereo (4 Conductor, TRRS)
Termination: Solder
Actual Diameter: 0.142" (3.60mm)
Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone
Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC
Packaging: Cut Tape (CT)
Features: Board Guide
Connector Type: Phone Jack
Gender: Female
Mounting Type: Surface Mount, Right Angle
Shielding: Unshielded
Operating Temperature: -25°C ~ 85°C
Number of Positions/Contacts: 4 Conductors, 5 Contacts
Internal Switch(s): Single Switch
Signal Lines: Stereo (4 Conductor, TRRS)
Termination: Solder
Actual Diameter: 0.142" (3.60mm)
Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone
Produkt ist nicht verfügbar
SJ2-35954C-SMT-TR |
Hersteller: CUI Devices
Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC
Packaging: Cut Tape (CT)
Features: Board Guide
Connector Type: Phone Jack
Gender: Female
Mounting Type: Surface Mount, Right Angle
Shielding: Unshielded
Operating Temperature: -25°C ~ 85°C
Number of Positions/Contacts: 4 Conductors, 5 Contacts
Internal Switch(s): Single Switch
Signal Lines: Stereo (4 Conductor, TRRS)
Termination: Solder
Actual Diameter: 0.142" (3.60mm)
Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone
Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC
Packaging: Cut Tape (CT)
Features: Board Guide
Connector Type: Phone Jack
Gender: Female
Mounting Type: Surface Mount, Right Angle
Shielding: Unshielded
Operating Temperature: -25°C ~ 85°C
Number of Positions/Contacts: 4 Conductors, 5 Contacts
Internal Switch(s): Single Switch
Signal Lines: Stereo (4 Conductor, TRRS)
Termination: Solder
Actual Diameter: 0.142" (3.60mm)
Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone
auf Bestellung 363 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8+ | 2.34 EUR |
10+ | 1.97 EUR |
25+ | 1.89 EUR |
50+ | 1.85 EUR |
100+ | 1.77 EUR |
250+ | 1.61 EUR |
SJ2-35954A-SMT-TR |
Hersteller: CUI Devices
Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC
Packaging: Cut Tape (CT)
Features: Board Guide
Connector Type: Phone Jack
Gender: Female
Mounting Type: Surface Mount, Right Angle
Shielding: Unshielded
Operating Temperature: -25°C ~ 85°C
Number of Positions/Contacts: 4 Conductors, 4 Contacts
Internal Switch(s): Does Not Contain Switch
Signal Lines: Stereo (4 Conductor, TRRS)
Termination: Solder
Actual Diameter: 0.142" (3.60mm)
Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone
Part Status: Active
Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC
Packaging: Cut Tape (CT)
Features: Board Guide
Connector Type: Phone Jack
Gender: Female
Mounting Type: Surface Mount, Right Angle
Shielding: Unshielded
Operating Temperature: -25°C ~ 85°C
Number of Positions/Contacts: 4 Conductors, 4 Contacts
Internal Switch(s): Does Not Contain Switch
Signal Lines: Stereo (4 Conductor, TRRS)
Termination: Solder
Actual Diameter: 0.142" (3.60mm)
Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone
Part Status: Active
auf Bestellung 5903 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8+ | 2.27 EUR |
10+ | 1.98 EUR |
25+ | 1.9 EUR |
50+ | 1.86 EUR |
100+ | 1.77 EUR |
250+ | 1.6 EUR |
500+ | 1.48 EUR |
SJ2-35953A-SMT-TR |
Hersteller: CUI Devices
Description: AUDIO JACK, 3.5 MM, RT, 3 CONDUC
Description: AUDIO JACK, 3.5 MM, RT, 3 CONDUC
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)SJ2-35043A-SMT-TR |
Hersteller: CUI Devices
Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC
Packaging: Cut Tape (CT)
Features: Board Guide
Connector Type: Phone Jack
Gender: Female
Mounting Type: Surface Mount, Right Angle
Shielding: Unshielded
Operating Temperature: -25°C ~ 85°C
Number of Positions/Contacts: 4 Conductors, 4 Contacts
Internal Switch(s): Does Not Contain Switch
Signal Lines: Stereo (4 Conductor, TRRS)
Termination: Solder
Actual Diameter: 0.142" (3.60mm)
Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone
Description: AUDIO JACK, 3.5 MM, RT, 4 CONDUC
Packaging: Cut Tape (CT)
Features: Board Guide
Connector Type: Phone Jack
Gender: Female
Mounting Type: Surface Mount, Right Angle
Shielding: Unshielded
Operating Temperature: -25°C ~ 85°C
Number of Positions/Contacts: 4 Conductors, 4 Contacts
Internal Switch(s): Does Not Contain Switch
Signal Lines: Stereo (4 Conductor, TRRS)
Termination: Solder
Actual Diameter: 0.142" (3.60mm)
Industry Recognized Mating Diameter: 3.50mm (0.141", 1/8", Mini Plug) - Headphone
auf Bestellung 217 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
9+ | 2.15 EUR |
10+ | 1.81 EUR |
25+ | 1.74 EUR |
50+ | 1.7 EUR |
100+ | 1.63 EUR |
HSS-B20-061H |
Hersteller: CUI Devices
Description: HEATSINK TO-220 4W ALUMINUM
Packaging: Box
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.504" (12.80mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 4.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.01°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.63°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 4W ALUMINUM
Packaging: Box
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.504" (12.80mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 4.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.01°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.63°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1987 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
13+ | 1.37 EUR |
14+ | 1.31 EUR |
25+ | 1.25 EUR |
50+ | 1.21 EUR |
100+ | 1.2 EUR |
250+ | 1.12 EUR |
500+ | 1.05 EUR |
1000+ | 0.95 EUR |
HSS-B20-NP |
Hersteller: CUI Devices
Description: HEATSINK TO-220 4W ALUMINUM
Description: HEATSINK TO-220 4W ALUMINUM
auf Bestellung 72 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
14+ | 1.27 EUR |
15+ | 1.2 EUR |
25+ | 1.14 EUR |
50+ | 1.11 EUR |
HSS-B20-NP-07 |
Hersteller: CUI Devices
Description: HEATSINK TO-220 2.3W ALUMINUM
Description: HEATSINK TO-220 2.3W ALUMINUM
auf Bestellung 678 Stücke:
Lieferzeit 10-14 Tag (e)HSS-B20-0953H-01 |
Hersteller: CUI Devices
Description: HEATSINK TO-220 2.3W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.504" (12.80mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 2.3W @ 75°C
Thermal Resistance @ Forced Air Flow: 11.04°C/W @ 200 LFM
Thermal Resistance @ Natural: 33.28°C/W
Fin Height: 0.590" (15.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 2.3W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.504" (12.80mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 2.3W @ 75°C
Thermal Resistance @ Forced Air Flow: 11.04°C/W @ 200 LFM
Thermal Resistance @ Natural: 33.28°C/W
Fin Height: 0.590" (15.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2851 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
17+ | 1.04 EUR |
18+ | 0.99 EUR |
25+ | 0.94 EUR |
50+ | 0.91 EUR |
100+ | 0.9 EUR |
250+ | 0.84 EUR |
500+ | 0.79 EUR |
1000+ | 0.71 EUR |
HSS-B20-095H |
Hersteller: CUI Devices
Description: HEATSINK TO-220 4.1W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.441" (11.20mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.866" (22.00mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 4.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.34°C/W
Fin Height: 0.626" (15.90mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 4.1W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.441" (11.20mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.866" (22.00mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 4.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.34°C/W
Fin Height: 0.626" (15.90mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1106 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
13+ | 1.36 EUR |
14+ | 1.28 EUR |
25+ | 1.22 EUR |
50+ | 1.18 EUR |
100+ | 1.17 EUR |
250+ | 1.09 EUR |
500+ | 1.02 EUR |
1000+ | 0.93 EUR |
HSS-B20-0508H-01R |
Hersteller: CUI Devices
Description: HEATSINK TO-220 4.7W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and Board Mounts
Power Dissipation @ Temperature Rise: 4.7W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.87°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.83°C/W
Fin Height: 1.180" (29.97mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 4.7W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and Board Mounts
Power Dissipation @ Temperature Rise: 4.7W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.87°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.83°C/W
Fin Height: 1.180" (29.97mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 3935 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
17+ | 1.07 EUR |
18+ | 1.02 EUR |
25+ | 0.97 EUR |
50+ | 0.94 EUR |
100+ | 0.93 EUR |
250+ | 0.87 EUR |
500+ | 0.81 EUR |
1000+ | 0.74 EUR |
HSS-B20-0508H-01S |
Hersteller: CUI Devices
Description: HEATSINK TO-220 4.7W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and Board Mounts
Power Dissipation @ Temperature Rise: 4.7W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.87°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.83°C/W
Fin Height: 1.180" (29.97mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 4.7W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and Board Mounts
Power Dissipation @ Temperature Rise: 4.7W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.87°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.83°C/W
Fin Height: 1.180" (29.97mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 678 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
16+ | 1.11 EUR |
25+ | 1.06 EUR |
50+ | 1.03 EUR |
100+ | 1.02 EUR |
250+ | 0.95 EUR |
500+ | 0.89 EUR |
HSS-B20-0635H-01 |
Hersteller: CUI Devices
Description: HEATSINK TO-220 2.7W ALUMINUM
Description: HEATSINK TO-220 2.7W ALUMINUM
auf Bestellung 1013 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
25+ | 0.72 EUR |
26+ | 0.7 EUR |
27+ | 0.66 EUR |
50+ | 0.64 EUR |
250+ | 0.59 EUR |
500+ | 0.56 EUR |
1000+ | 0.51 EUR |
HSS-B20-061H-02 |
Hersteller: CUI Devices
Description: HEATSINK TO-220 2.9W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.504" (12.80mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 2.9W @ 75°C
Thermal Resistance @ Forced Air Flow: 7.24°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.92°C/W
Fin Height: 0.748" (19.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 2.9W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.504" (12.80mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 2.9W @ 75°C
Thermal Resistance @ Forced Air Flow: 7.24°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.92°C/W
Fin Height: 0.748" (19.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2965 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
24+ | 0.76 EUR |
25+ | 0.72 EUR |
26+ | 0.69 EUR |
50+ | 0.67 EUR |
100+ | 0.66 EUR |
250+ | 0.61 EUR |
500+ | 0.58 EUR |
1000+ | 0.52 EUR |
HSS-B20-065V-02 |
Hersteller: CUI Devices
Description: HEATSINK TO-220 2.9W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.748" (19.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.504" (12.80mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 2.9W @ 75°C
Thermal Resistance @ Forced Air Flow: 7.24°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.92°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 2.9W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.748" (19.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.504" (12.80mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 2.9W @ 75°C
Thermal Resistance @ Forced Air Flow: 7.24°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.92°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1113 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
25+ | 0.72 EUR |
26+ | 0.68 EUR |
28+ | 0.65 EUR |
50+ | 0.63 EUR |
100+ | 0.62 EUR |
250+ | 0.58 EUR |
500+ | 0.55 EUR |
1000+ | 0.5 EUR |
HSS-B20-NP-10 |
Hersteller: CUI Devices
Description: HEATSINK TO-220 2.9W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.748" (19.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.504" (12.80mm)
Package Cooled: TO-220
Power Dissipation @ Temperature Rise: 2.9W @ 75°C
Thermal Resistance @ Forced Air Flow: 7.24°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.92°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 2.9W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.748" (19.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.504" (12.80mm)
Package Cooled: TO-220
Power Dissipation @ Temperature Rise: 2.9W @ 75°C
Thermal Resistance @ Forced Air Flow: 7.24°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.92°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1807 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
19+ | 0.93 EUR |
20+ | 0.89 EUR |
25+ | 0.84 EUR |
50+ | 0.82 EUR |
100+ | 0.81 EUR |
250+ | 0.75 EUR |
500+ | 0.71 EUR |
1000+ | 0.64 EUR |
HSS-B20-0953H-02 |
Hersteller: CUI Devices
Description: HEATSINK TO-220 2.9W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.504" (12.80mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 2.9W @ 75°C
Thermal Resistance @ Forced Air Flow: 7.24°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.92°C/W
Fin Height: 0.748" (19.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 2.9W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.504" (12.80mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 2.9W @ 75°C
Thermal Resistance @ Forced Air Flow: 7.24°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.92°C/W
Fin Height: 0.748" (19.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2935 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
24+ | 0.74 EUR |
25+ | 0.71 EUR |
26+ | 0.68 EUR |
50+ | 0.66 EUR |
100+ | 0.65 EUR |
250+ | 0.61 EUR |
500+ | 0.57 EUR |
1000+ | 0.52 EUR |
HSS-B20-NPS-02 |
Hersteller: CUI Devices
Description: HEATSINK TO-220 5.1W ALUMINUM
Description: HEATSINK TO-220 5.1W ALUMINUM
auf Bestellung 117 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
17+ | 1.04 EUR |
18+ | 0.99 EUR |
25+ | 0.94 EUR |
50+ | 0.92 EUR |
100+ | 0.91 EUR |
HSS-B20-053H-01 |
Hersteller: CUI Devices
Description: HEATSINK TO-220 4.8W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 4.8W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.83°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.79°C/W
Fin Height: 1.181" (30.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 4.8W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 4.8W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.83°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.79°C/W
Fin Height: 1.181" (30.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2816 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
13+ | 1.36 EUR |
14+ | 1.28 EUR |
25+ | 1.22 EUR |
50+ | 1.19 EUR |
100+ | 1.17 EUR |
250+ | 1.09 EUR |
500+ | 1.03 EUR |
1000+ | 0.93 EUR |
HSS-B20-0503H |
Hersteller: CUI Devices
Description: HEATSINK TO-220 4.6W ALUMINUM
Packaging: Box
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 4.6W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.44°C/W @ 200 LFM
Thermal Resistance @ Natural: 16.30°C/W
Fin Height: 1.180" (29.97mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 4.6W ALUMINUM
Packaging: Box
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 4.6W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.44°C/W @ 200 LFM
Thermal Resistance @ Natural: 16.30°C/W
Fin Height: 1.180" (29.97mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2661 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
12+ | 1.5 EUR |
13+ | 1.42 EUR |
25+ | 1.35 EUR |
50+ | 1.31 EUR |
100+ | 1.3 EUR |
250+ | 1.21 EUR |
500+ | 1.14 EUR |
1000+ | 1.03 EUR |
HSS-B20-NP-12 |
Hersteller: CUI Devices
Description: HEATSINK TO-220 6.8W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 1.450" (36.83mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.700" (17.80mm)
Package Cooled: TO-220
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 6.8W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.47°C/W @ 200 LFM
Thermal Resistance @ Natural: 14.33°C/W
Fin Height: 0.850" (21.60mm)
Material Finish: Black Anodized
Description: HEATSINK TO-220 6.8W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 1.450" (36.83mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.700" (17.80mm)
Package Cooled: TO-220
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 6.8W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.47°C/W @ 200 LFM
Thermal Resistance @ Natural: 14.33°C/W
Fin Height: 0.850" (21.60mm)
Material Finish: Black Anodized
auf Bestellung 2101 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
16+ | 1.11 EUR |
17+ | 1.05 EUR |
25+ | 1 EUR |
50+ | 0.97 EUR |
100+ | 0.96 EUR |
250+ | 0.89 EUR |
600+ | 0.84 EUR |
1200+ | 0.76 EUR |
HSS-B20-NP-04 |
Hersteller: CUI Devices
Description: HEATSINK TO-220 6.5W ALUMINUM
Packaging: Box
Material: Aluminum
Length: 1.450" (36.83mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.750" (44.45mm)
Package Cooled: TO-220
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 6.5W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.76°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.54°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 6.5W ALUMINUM
Packaging: Box
Material: Aluminum
Length: 1.450" (36.83mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.750" (44.45mm)
Package Cooled: TO-220
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 6.5W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.76°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.54°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 5583 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
17+ | 1.06 EUR |
18+ | 1 EUR |
25+ | 0.95 EUR |
50+ | 0.92 EUR |
100+ | 0.91 EUR |
250+ | 0.85 EUR |
500+ | 0.8 EUR |
1000+ | 0.72 EUR |
5000+ | 0.7 EUR |
HSS-B20-065V |
Hersteller: CUI Devices
Description: HEATSINK TO-220 4W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.504" (12.80mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 4.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.01°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.63°C/W
Fin Height: 1.500" (38.10mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 4W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.504" (12.80mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 4.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.01°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.63°C/W
Fin Height: 1.500" (38.10mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2921 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
13+ | 1.37 EUR |
14+ | 1.31 EUR |
25+ | 1.25 EUR |
50+ | 1.21 EUR |
100+ | 1.2 EUR |
250+ | 1.12 EUR |
500+ | 1.05 EUR |
1000+ | 0.95 EUR |
HSS-B20-085H |
Hersteller: CUI Devices
Description: HEATSINK TO-220 3.4W ALUMINUM
Description: HEATSINK TO-220 3.4W ALUMINUM
Produkt ist nicht verfügbar
HSS-B20-0452H |
Hersteller: CUI Devices
Description: HEATSINK TO-220 3.2W ALUMINUM
Description: HEATSINK TO-220 3.2W ALUMINUM
Produkt ist nicht verfügbar
HSS-B20-05H |
Hersteller: CUI Devices
Description: HEATSINK TO-220 9.8W ALUMINUM
Description: HEATSINK TO-220 9.8W ALUMINUM
Produkt ist nicht verfügbar
HSS-B20-0508H-01 |
Hersteller: CUI Devices
Description: HEATSINK TO-220 7.4W ALUMINUM
Description: HEATSINK TO-220 7.4W ALUMINUM
Produkt ist nicht verfügbar
HSE-B254-04H |
Hersteller: CUI Devices
Description: HEAT SINK, EXTRUSION, TO-220/TO-
Packaging: Box
Material: Aluminum Alloy
Length: 1.000" (25.40mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.650" (16.50mm)
Package Cooled: TO-218, TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 4.7W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.93°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.96°C/W
Fin Height: 0.630" (16.00mm)
Material Finish: Black Anodized
Description: HEAT SINK, EXTRUSION, TO-220/TO-
Packaging: Box
Material: Aluminum Alloy
Length: 1.000" (25.40mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.650" (16.50mm)
Package Cooled: TO-218, TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 4.7W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.93°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.96°C/W
Fin Height: 0.630" (16.00mm)
Material Finish: Black Anodized
auf Bestellung 1183 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
11+ | 1.67 EUR |
12+ | 1.58 EUR |
25+ | 1.54 EUR |
50+ | 1.5 EUR |
100+ | 1.41 EUR |
250+ | 1.33 EUR |
500+ | 1.25 EUR |
1000+ | 1.17 EUR |
HSE-B254-045H |
Hersteller: CUI Devices
Description: HEAT SINK, EXTRUSION, TO-220, 25
Packaging: Box
Material: Aluminum Alloy
Length: 1.000" (25.40mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.772" (45.00mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 6.4W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.86°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.72°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Description: HEAT SINK, EXTRUSION, TO-220, 25
Packaging: Box
Material: Aluminum Alloy
Length: 1.000" (25.40mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.772" (45.00mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 6.4W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.86°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.72°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 630 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
10+ | 1.77 EUR |
25+ | 1.72 EUR |
50+ | 1.68 EUR |
100+ | 1.58 EUR |
250+ | 1.49 EUR |
500+ | 1.4 EUR |
HSE-B18254-035H |
Hersteller: CUI Devices
Description: HEAT SINK, EXTRUSION, TO-218, 25
Packaging: Box
Material: Aluminum Alloy
Length: 1.000" (25.40mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.638" (41.60mm)
Package Cooled: TO-218
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 8.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.09°C/W @ 200 LFM
Thermal Resistance @ Natural: 9.26°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, EXTRUSION, TO-218, 25
Packaging: Box
Material: Aluminum Alloy
Length: 1.000" (25.40mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.638" (41.60mm)
Package Cooled: TO-218
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 8.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.09°C/W @ 200 LFM
Thermal Resistance @ Natural: 9.26°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 155 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
9+ | 2.02 EUR |
10+ | 1.93 EUR |
25+ | 1.88 EUR |
50+ | 1.83 EUR |
100+ | 1.73 EUR |
HSE-B18254-035H-00 |
Hersteller: CUI Devices
Description: HEAT SINK, EXTRUSION, TO-218, 25
Packaging: Box
Material: Aluminum Alloy
Length: 1.000" (25.40mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.638" (41.60mm)
Package Cooled: TO-218
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 10.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.03°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.50°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Description: HEAT SINK, EXTRUSION, TO-218, 25
Packaging: Box
Material: Aluminum Alloy
Length: 1.000" (25.40mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.638" (41.60mm)
Package Cooled: TO-218
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 10.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.03°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.50°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
HSE-B20254-035H |
Hersteller: CUI Devices
Description: HEAT SINK, EXTRUSION, TO-220,25.
Packaging: Box
Material: Aluminum Alloy
Length: 1.000" (25.40mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 5.8W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.28°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.93°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, EXTRUSION, TO-220,25.
Packaging: Box
Material: Aluminum Alloy
Length: 1.000" (25.40mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 5.8W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.28°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.93°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1683 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
12+ | 1.53 EUR |
13+ | 1.46 EUR |
25+ | 1.39 EUR |
50+ | 1.35 EUR |
100+ | 1.33 EUR |
250+ | 1.24 EUR |
500+ | 1.17 EUR |
1500+ | 1.06 EUR |
HSE-B20254-035H-01 |
Hersteller: CUI Devices
Description: HEAT SINK, EXTRUSION, TO-220, 25
Packaging: Box
Material: Aluminum Alloy
Length: 1.000" (25.40mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.378" (35.00mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 5.2W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.42°C/W @ 200 LFM
Thermal Resistance @ Natural: 14.42°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, EXTRUSION, TO-220, 25
Packaging: Box
Material: Aluminum Alloy
Length: 1.000" (25.40mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.378" (35.00mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 5.2W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.42°C/W @ 200 LFM
Thermal Resistance @ Natural: 14.42°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1047 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
11+ | 1.61 EUR |
25+ | 1.56 EUR |
50+ | 1.52 EUR |
100+ | 1.44 EUR |
250+ | 1.35 EUR |
500+ | 1.27 EUR |
HSE-B20254-035H-02 |
Hersteller: CUI Devices
Description: HEAT SINK, EXTRUSION, TO-220, 25
Packaging: Box
Material: Aluminum Alloy
Length: 1.000" (25.40mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.378" (35.00mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 5.5W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.39°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.64°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Description: HEAT SINK, EXTRUSION, TO-220, 25
Packaging: Box
Material: Aluminum Alloy
Length: 1.000" (25.40mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.378" (35.00mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 5.5W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.39°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.64°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
HSE-B20250-045H |
Hersteller: CUI Devices
Description: HEAT SINK, EXTRUSION, TO-220, 50
Packaging: Box
Material: Aluminum Alloy
Length: 1.969" (50.00mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.181" (30.00mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 7.7W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.05°C/W @ 200 LFM
Thermal Resistance @ Natural: 9.74°C/W
Fin Height: 0.472" (12.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, EXTRUSION, TO-220, 50
Packaging: Box
Material: Aluminum Alloy
Length: 1.969" (50.00mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.181" (30.00mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 7.7W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.05°C/W @ 200 LFM
Thermal Resistance @ Natural: 9.74°C/W
Fin Height: 0.472" (12.00mm)
Material Finish: Black Anodized
Part Status: Active
Produkt ist nicht verfügbar
HSE-B20250-040H |
Hersteller: CUI Devices
Description: HEAT SINK, EXTRUSION, TO-220, 25
Packaging: Tray
Material: Aluminum Alloy
Length: 0.984" (25.00mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.378" (35.00mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 5.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.28°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.00°C/W
Fin Height: 0.492" (12.50mm)
Material Finish: Black Anodized
Description: HEAT SINK, EXTRUSION, TO-220, 25
Packaging: Tray
Material: Aluminum Alloy
Length: 0.984" (25.00mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.378" (35.00mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 5.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.28°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.00°C/W
Fin Height: 0.492" (12.50mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
HSE-B20250-040H-01 |
Hersteller: CUI Devices
Description: HEAT SINK, EXTRUSION, TO-220, 25
Packaging: Box
Material: Aluminum Alloy
Length: 0.984" (25.00mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.359" (34.50mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 5.5W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.44°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.64°C/W
Fin Height: 0.492" (12.50mm)
Material Finish: Black Anodized
Description: HEAT SINK, EXTRUSION, TO-220, 25
Packaging: Box
Material: Aluminum Alloy
Length: 0.984" (25.00mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.359" (34.50mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 5.5W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.44°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.64°C/W
Fin Height: 0.492" (12.50mm)
Material Finish: Black Anodized
auf Bestellung 1273 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
13+ | 1.39 EUR |
14+ | 1.31 EUR |
25+ | 1.25 EUR |
50+ | 1.22 EUR |
100+ | 1.2 EUR |
250+ | 1.12 EUR |
500+ | 1.05 EUR |
1000+ | 0.95 EUR |
HSE-B20254-040H |
Hersteller: CUI Devices
Description: HEAT SINK, EXTRUSION, TO-220, 25
Packaging: Bag
Material: Aluminum Alloy
Length: 1.000" (25.40mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.260" (32.00mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 5.7W @ 75°C
Thermal Resistance @ Forced Air Flow: 7.74°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.16°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, EXTRUSION, TO-220, 25
Packaging: Bag
Material: Aluminum Alloy
Length: 1.000" (25.40mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.260" (32.00mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 5.7W @ 75°C
Thermal Resistance @ Forced Air Flow: 7.74°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.16°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 3602 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
10+ | 1.8 EUR |
11+ | 1.71 EUR |
25+ | 1.66 EUR |
50+ | 1.62 EUR |
100+ | 1.53 EUR |
250+ | 1.44 EUR |
500+ | 1.35 EUR |
1000+ | 1.26 EUR |
HSE-B635-045H |
Hersteller: CUI Devices
Description: HEAT SINK, EXTRUSION, TO-220, 63
Description: HEAT SINK, EXTRUSION, TO-220, 63
Produkt ist nicht verfügbar
HSE-B18381-035H |
Hersteller: CUI Devices
Description: HEAT SINK, EXTRUSION, TO-218, 38
Description: HEAT SINK, EXTRUSION, TO-218, 38
Produkt ist nicht verfügbar
HSE-B18381-035H-02 |
Hersteller: CUI Devices
Description: HEAT SINK, EXTRUSION, TO-218, 38
Description: HEAT SINK, EXTRUSION, TO-218, 38
Produkt ist nicht verfügbar
HSE-B20381-035H |
Hersteller: CUI Devices
Description: HEAT SINK, EXTRUSION, TO-220, 38
Packaging: Box
Material: Aluminum Alloy
Length: 1.500" (38.10mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 6.5W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.66°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.54°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Description: HEAT SINK, EXTRUSION, TO-220, 38
Packaging: Box
Material: Aluminum Alloy
Length: 1.500" (38.10mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 6.5W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.66°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.54°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 1012 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
10+ | 1.86 EUR |
25+ | 1.81 EUR |
50+ | 1.76 EUR |
100+ | 1.66 EUR |
250+ | 1.56 EUR |
500+ | 1.47 EUR |
1000+ | 1.37 EUR |
HSE-B20381-035H-01 |
Hersteller: CUI Devices
Description: HEAT SINK, EXTRUSION, TO-220, 38
Description: HEAT SINK, EXTRUSION, TO-220, 38
Produkt ist nicht verfügbar
HSE-B20381-035H-02 |
Hersteller: CUI Devices
Description: HEAT SINK, EXTRUSION, TO-220, 38
Description: HEAT SINK, EXTRUSION, TO-220, 38
Produkt ist nicht verfügbar
ACZ16BR1E-15FA1-24C |
Hersteller: CUI Devices
Description: ROTARY ENCODER INCREMENT 24PPR
Packaging: Bulk
Output Type: Quadrature (Incremental)
Mounting Type: Panel, PCB Through Hole
Orientation: Horizontal
Termination Style: PC Pin
Voltage - Supply: 5V
Encoder Type: Incremental
Detent: Yes
Pulses per Revolution: 24
Actuator Type: 6mm Dia Flatted End
Built in Switch: Yes
Rotational Life (Cycles Min): 100k
DigiKey Programmable: Not Verified
Description: ROTARY ENCODER INCREMENT 24PPR
Packaging: Bulk
Output Type: Quadrature (Incremental)
Mounting Type: Panel, PCB Through Hole
Orientation: Horizontal
Termination Style: PC Pin
Voltage - Supply: 5V
Encoder Type: Incremental
Detent: Yes
Pulses per Revolution: 24
Actuator Type: 6mm Dia Flatted End
Built in Switch: Yes
Rotational Life (Cycles Min): 100k
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
ACZ16BR1E-15FD1-24C |
Hersteller: CUI Devices
Description: ROTARY ENCODER INCREMENT 24PPR
Packaging: Bulk
Output Type: Quadrature (Incremental)
Mounting Type: Panel, PCB Through Hole
Orientation: Vertical
Termination Style: PC Pin
Voltage - Supply: 5V
Encoder Type: Incremental
Detent: Yes
Pulses per Revolution: 24
Actuator Type: 6mm Dia Flatted End
Built in Switch: Yes
Rotational Life (Cycles Min): 100k
DigiKey Programmable: Not Verified
Description: ROTARY ENCODER INCREMENT 24PPR
Packaging: Bulk
Output Type: Quadrature (Incremental)
Mounting Type: Panel, PCB Through Hole
Orientation: Vertical
Termination Style: PC Pin
Voltage - Supply: 5V
Encoder Type: Incremental
Detent: Yes
Pulses per Revolution: 24
Actuator Type: 6mm Dia Flatted End
Built in Switch: Yes
Rotational Life (Cycles Min): 100k
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
ACZ16BR1E-15KQD1-24C |
Hersteller: CUI Devices
Description: ROTARY ENCODER INCREMENT 24PPR
Packaging: Bulk
Output Type: Quadrature (Incremental)
Mounting Type: Panel, PCB Through Hole
Orientation: Vertical
Termination Style: PC Pin
Voltage - Supply: 5V
Encoder Type: Incremental
Detent: Yes
Pulses per Revolution: 24
Actuator Type: 6mm Dia Flatted End
Built in Switch: Yes
Rotational Life (Cycles Min): 100k
Part Status: Active
DigiKey Programmable: Not Verified
Description: ROTARY ENCODER INCREMENT 24PPR
Packaging: Bulk
Output Type: Quadrature (Incremental)
Mounting Type: Panel, PCB Through Hole
Orientation: Vertical
Termination Style: PC Pin
Voltage - Supply: 5V
Encoder Type: Incremental
Detent: Yes
Pulses per Revolution: 24
Actuator Type: 6mm Dia Flatted End
Built in Switch: Yes
Rotational Life (Cycles Min): 100k
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
ACZ16BR1E-20FA1-24C |
Hersteller: CUI Devices
Description: ROTARY ENCODER INCREMENT 24PPR
Packaging: Box
Output Type: Quadrature (Incremental)
Mounting Type: Panel, PCB Through Hole
Orientation: Horizontal
Termination Style: PC Pin
Voltage - Supply: 5V
Encoder Type: Incremental
Detent: Yes
Pulses per Revolution: 24
Actuator Type: 6mm Dia Flatted End
Built in Switch: Yes
Rotational Life (Cycles Min): 100k
DigiKey Programmable: Not Verified
Description: ROTARY ENCODER INCREMENT 24PPR
Packaging: Box
Output Type: Quadrature (Incremental)
Mounting Type: Panel, PCB Through Hole
Orientation: Horizontal
Termination Style: PC Pin
Voltage - Supply: 5V
Encoder Type: Incremental
Detent: Yes
Pulses per Revolution: 24
Actuator Type: 6mm Dia Flatted End
Built in Switch: Yes
Rotational Life (Cycles Min): 100k
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
ACZ16BR1E-20FD1-24C |
Hersteller: CUI Devices
Description: ROTARY ENCODER INCREMENT 24PPR
Packaging: Box
Output Type: Quadrature (Incremental)
Mounting Type: Panel, PCB Through Hole
Orientation: Vertical
Termination Style: PC Pin
Voltage - Supply: 5V
Encoder Type: Incremental
Detent: Yes
Pulses per Revolution: 24
Actuator Type: 6mm Dia Flatted End
Built in Switch: Yes
Rotational Life (Cycles Min): 100k
DigiKey Programmable: Not Verified
Description: ROTARY ENCODER INCREMENT 24PPR
Packaging: Box
Output Type: Quadrature (Incremental)
Mounting Type: Panel, PCB Through Hole
Orientation: Vertical
Termination Style: PC Pin
Voltage - Supply: 5V
Encoder Type: Incremental
Detent: Yes
Pulses per Revolution: 24
Actuator Type: 6mm Dia Flatted End
Built in Switch: Yes
Rotational Life (Cycles Min): 100k
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
ACZ16BR1E-20KQD1-24C |
Hersteller: CUI Devices
Description: ROTARY ENCODER INCREMENT 24PPR
Packaging: Bulk
Output Type: Quadrature (Incremental)
Mounting Type: Panel, PCB Through Hole
Orientation: Vertical
Termination Style: PC Pin
Voltage - Supply: 5V
Encoder Type: Incremental
Detent: Yes
Pulses per Revolution: 24
Actuator Type: 6mm Dia Flatted End
Built in Switch: Yes
Rotational Life (Cycles Min): 100k
DigiKey Programmable: Not Verified
Description: ROTARY ENCODER INCREMENT 24PPR
Packaging: Bulk
Output Type: Quadrature (Incremental)
Mounting Type: Panel, PCB Through Hole
Orientation: Vertical
Termination Style: PC Pin
Voltage - Supply: 5V
Encoder Type: Incremental
Detent: Yes
Pulses per Revolution: 24
Actuator Type: 6mm Dia Flatted End
Built in Switch: Yes
Rotational Life (Cycles Min): 100k
DigiKey Programmable: Not Verified
auf Bestellung 1012 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 4.63 EUR |
10+ | 3.85 EUR |
50+ | 3.21 EUR |
100+ | 2.85 EUR |
500+ | 2.28 EUR |
1000+ | 2.07 EUR |