Produkte > GIGADEVICE SEMICONDUCTOR (HK) LIMITED > Alle Produkte des Herstellers GIGADEVICE SEMICONDUCTOR (HK) LIMITED (707) > Seite 12 nach 12
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| GD5F2GQ5REYIHR | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tape & Reel (TR) Package / Case: 8-WDFN Exposed Pad Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 2V Technology: FLASH - NAND (SLC) Clock Frequency: 80 MHz Memory Format: FLASH Supplier Device Package: 8-WSON (6x8) Write Cycle Time - Word, Page: 600µs Memory Interface: SPI - Quad I/O, QPI, DTR Access Time: 11 ns Memory Organization: 512M x 4 |
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| GD5F2GQ5REYIHY | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tray Package / Case: 8-WDFN Exposed Pad Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 2V Technology: FLASH - NAND (SLC) Clock Frequency: 80 MHz Memory Format: FLASH Supplier Device Package: 8-WSON (6x8) Write Cycle Time - Word, Page: 600µs Memory Interface: SPI - Quad I/O, QPI, DTR Access Time: 11 ns Memory Organization: 512M x 4 |
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| GD5F2GQ5REYJGR | GigaDevice Semiconductor (HK) Limited |
 Description: LINEAR ICPackaging: Tape & Reel (TR) Package / Case: 8-WDFN Exposed Pad Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.7V ~ 2V Technology: FLASH - NAND (SLC) Clock Frequency: 80 MHz Memory Format: FLASH Supplier Device Package: 8-WSON (6x8) Write Cycle Time - Word, Page: 600µs Memory Interface: SPI - Quad I/O Access Time: 11 ns Memory Organization: 256M x 8 |
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| GD5F2GQ5RFBIGY | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tray |
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| GD5F2GQ5RFYIGY | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tray |
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| GD5F2GQ5RFZIGY | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tray |
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| GD5F2GQ5UEBIGY | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tray Package / Case: 24-TBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Clock Frequency: 104 MHz Memory Format: FLASH Supplier Device Package: 24-TFBGA (6x8) Write Cycle Time - Word, Page: 600µs Memory Interface: SPI - Quad I/O Access Time: 9 ns Memory Organization: 256M x 8 |
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| GD5F2GQ5UEY2GY | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tray Package / Case: 8-WDFN Exposed Pad Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Clock Frequency: 104 MHz Memory Format: FLASH Supplier Device Package: 8-WSON (6x8) Write Cycle Time - Word, Page: 600µs Memory Interface: SPI - Quad I/O, DTR Access Time: 9 ns Memory Organization: 256M x 8 |
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| GD5F2GQ5UEYIGR | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tape & Reel (TR) Package / Case: 8-WDFN Exposed Pad Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Clock Frequency: 104 MHz Memory Format: FLASH Supplier Device Package: 8-WSON (6x8) Write Cycle Time - Word, Page: 600µs Memory Interface: SPI - Quad I/O Access Time: 9 ns Memory Organization: 256M x 8 |
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| GD5F2GQ5UEYIGY | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tray Package / Case: 8-WDFN Exposed Pad Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Clock Frequency: 104 MHz Memory Format: FLASH Supplier Device Package: 8-WSON (6x8) Write Cycle Time - Word, Page: 600µs Memory Interface: SPI - Quad I/O Access Time: 9 ns Memory Organization: 256M x 8 |
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| GD5F2GQ5UEYIHR | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tape & Reel (TR) Package / Case: 8-WDFN Exposed Pad Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Clock Frequency: 104 MHz Memory Format: FLASH Supplier Device Package: 8-WSON (6x8) Write Cycle Time - Word, Page: 600µs Memory Interface: SPI - Quad I/O, QPI, DTR Access Time: 9 ns Memory Organization: 512M x 4 |
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| GD5F2GQ5UEYIHY | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tray Package / Case: 8-WDFN Exposed Pad Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Clock Frequency: 104 MHz Memory Format: FLASH Supplier Device Package: 8-WSON (6x8) Write Cycle Time - Word, Page: 600µs Memory Interface: SPI - Quad I/O, QPI, DTR Access Time: 9 ns Memory Organization: 512M x 4 |
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| GD5F2GQ5UEYJGR | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tape & Reel (TR) Package / Case: 8-WDFN Exposed Pad Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Clock Frequency: 104 MHz Memory Format: FLASH Supplier Device Package: 8-WSON (6x8) Write Cycle Time - Word, Page: 600µs Memory Interface: SPI - Quad I/O Access Time: 9 ns Memory Organization: 256M x 8 |
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| GD5F2GQ5UEZIGY | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tray Package / Case: 24-TBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Clock Frequency: 104 MHz Memory Format: FLASH Supplier Device Package: 24-TFBGA (6x8) Write Cycle Time - Word, Page: 600µs Memory Interface: SPI - Quad I/O Access Time: 9 ns Memory Organization: 256M x 8 |
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| GD5F2GQ5UFYIGR | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tape & Reel (TR) |
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GD5F4GM8REWIGR | GigaDevice Semiconductor (HK) Limited |
Description: IC FLASH 4GBIT SPI/QUAD 8WSON Packaging: Tape & Reel (TR) Package / Case: 8-WDFN Exposed Pad Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 2V Technology: FLASH - NAND (SLC) Clock Frequency: 104 MHz Memory Format: FLASH Supplier Device Package: 8-WSON (5x6) Write Cycle Time - Word, Page: 600µs Memory Interface: SPI - Quad I/O, DTR Access Time: 9 ns Memory Organization: 1G x 4 |
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GD5F4GM8REWIGY | GigaDevice Semiconductor (HK) Limited |
Description: IC FLASH 4GBIT SPI/QUAD 8WSON Packaging: Tray Package / Case: 8-WDFN Exposed Pad Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 2V Technology: FLASH - NAND (SLC) Clock Frequency: 104 MHz Memory Format: FLASH Supplier Device Package: 8-WSON (5x6) Write Cycle Time - Word, Page: 600µs Memory Interface: SPI - Quad I/O, DTR Access Time: 9 ns Memory Organization: 1G x 4 |
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GD5F4GM8UEYIGR | GigaDevice Semiconductor (HK) Limited |
Description: IC FLASH 4GBIT SPI/QUAD 8WSON Packaging: Tape & Reel (TR) Package / Case: 8-WDFN Exposed Pad Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Clock Frequency: 133 MHz Memory Format: FLASH Supplier Device Package: 8-WSON (6x8) Write Cycle Time - Word, Page: 600µs Memory Interface: SPI - Quad I/O, DTR Access Time: 7 ns Memory Organization: 1G x 4 |
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GD5F4GM8UEYIGY | GigaDevice Semiconductor (HK) Limited |
Description: IC FLASH 4GBIT SPI/QUAD 8WSON Packaging: Tray Package / Case: 8-WDFN Exposed Pad Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Clock Frequency: 133 MHz Memory Format: FLASH Supplier Device Package: 8-WSON (6x8) Write Cycle Time - Word, Page: 600µs Memory Interface: SPI - Quad I/O, DTR Access Time: 7 ns Memory Organization: 1G x 4 |
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GD5F4GQ4UCYIGY | GigaDevice Semiconductor (HK) Limited |
Description: IC FLASH 4GBIT SPI/QUAD 8WSON Packaging: Tray Package / Case: 8-WDFN Exposed Pad Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND Clock Frequency: 120 MHz Memory Format: FLASH Supplier Device Package: 8-WSON (6x8) Memory Interface: SPI - Quad I/O Memory Organization: 512M x 8 DigiKey Programmable: Not Verified |
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| GD5F4GQ6RFYIGR | GigaDevice Semiconductor (HK) Limited | Description: SPI NAND FLASH 4GB WSON8 |
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| GD5F4GQ6RFYIGR | GigaDevice Semiconductor (HK) Limited | Description: SPI NAND FLASH 4GB WSON8 |
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| GD5F4GQ6RFYIGR | GigaDevice Semiconductor (HK) Limited | Description: SPI NAND FLASH 4GB WSON8 |
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| GD9FS1G8F2ALGI | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tray Package / Case: 63-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: FLASH - NAND (SLC) Memory Format: FLASH Supplier Device Package: 63-FBGA (9x11) Write Cycle Time - Word, Page: 45ns Memory Interface: Parallel Access Time: 30 ns Memory Organization: 128M x 8 |
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GD9FS1G8F2AMGI | GigaDevice Semiconductor (HK) Limited |
Description: IC FLASH 1GBIT 48TSOP I Packaging: Tray Package / Case: 48-TFSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Non-Volatile Voltage - Supply: 1.7V ~ 1.95V Technology: FLASH - NAND Memory Format: FLASH Supplier Device Package: 48-TSOP I Part Status: Active Memory Organization: 128M x 8 DigiKey Programmable: Not Verified |
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| GD9FS1G8F3ALGI | GigaDevice Semiconductor (HK) Limited |
Description: IC MEMORY Packaging: Tray |
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| GD9FS2G6F2AMGI | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tray Package / Case: 48-TFSOP (0.724", 18.40mm Width) Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: FLASH - NAND (SLC) Memory Format: FLASH Supplier Device Package: 48-TSOP I Write Cycle Time - Word, Page: 25ns Memory Interface: ONFI Access Time: 20 ns Memory Organization: 128M x 16 |
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| GD9FS2G8F2ALGI | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tray Package / Case: 63-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: FLASH - NAND (SLC) Memory Format: FLASH Supplier Device Package: 63-FBGA (9x11) Write Cycle Time - Word, Page: 25ns Memory Interface: ONFI Access Time: 20 ns Memory Organization: 256M x 8 |
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| GD9FS2G8F2AMGI | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tray Package / Case: 48-TFSOP (0.724", 18.40mm Width) Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: FLASH - NAND (SLC) Memory Format: FLASH Supplier Device Package: 48-TSOP I Write Cycle Time - Word, Page: 25ns Memory Interface: ONFI Access Time: 20 ns Memory Organization: 256M x 8 |
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| GD9FS2G8F3ALGI | GigaDevice Semiconductor (HK) Limited |
Description: IC FLASH 2GBIT ONFI Packaging: Tray Package / Case: 63-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: FLASH - NAND (SLC) Memory Format: FLASH Supplier Device Package: 63-FBGA (9x11) Write Cycle Time - Word, Page: 25ns Memory Interface: ONFI Access Time: 20 ns Memory Organization: 256M x 8 |
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| GD9FS2G8F3AMGI | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tray Package / Case: 48-TFSOP (0.724", 18.40mm Width) Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: FLASH - NAND (SLC) Memory Format: FLASH Supplier Device Package: 48-TSOP I Write Cycle Time - Word, Page: 25ns Memory Interface: Parallel Access Time: 20 ns Memory Organization: 256M x 8 |
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| GD9FS4G8F2ALGI | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tray |
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| GD9FS4G8F2ALGJ | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tray |
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| GD9FS4G8F2AMGI | GigaDevice Semiconductor (HK) Limited |
Description: IC FLASH 4GBIT ONFI 48TSOPI Packaging: Tray Package / Case: 48-TFSOP (0.724", 18.40mm Width) Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: FLASH - NAND (SLC) Memory Format: FLASH Supplier Device Package: 48-TSOP I Write Cycle Time - Word, Page: 25ns Memory Interface: ONFI Access Time: 22 ns Memory Organization: 512M x 8 |
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| GD9FS4G8F3ALGI | GigaDevice Semiconductor (HK) Limited |
Description: IC MEMORY Packaging: Tray Package / Case: 63-VFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: FLASH - NAND (SLC) Memory Format: FLASH Supplier Device Package: 63-FBGA (9x11) Write Cycle Time - Word, Page: 25ns Memory Interface: ONFI Access Time: 22 ns Memory Organization: 512M x 8 |
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| GD9FS4G8F3AMGI | GigaDevice Semiconductor (HK) Limited |
Description: IC FLASH 4GBIT ONFI 48TSOPI Packaging: Tray Package / Case: 48-TFSOP (0.724", 18.40mm Width) Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: FLASH - NAND (SLC) Memory Format: FLASH Supplier Device Package: 48-TSOP I Write Cycle Time - Word, Page: 25ns Memory Interface: ONFI Access Time: 22 ns Memory Organization: 512M x 8 |
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| GD9FS8G8E2AMGI | GigaDevice Semiconductor (HK) Limited |
Description: IC FLASH 8GBIT ONFI 48TSOPI Packaging: Tray Package / Case: 48-TFSOP (0.724", 18.40mm Width) Mounting Type: Surface Mount Memory Size: 8Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: FLASH - NAND (SLC) Memory Format: FLASH Supplier Device Package: 48-TSOP I Write Cycle Time - Word, Page: 25ns Memory Interface: ONFI Access Time: 22 ns Memory Organization: 1G x 8 |
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| GD9FS8G8E3AMGI | GigaDevice Semiconductor (HK) Limited |
Description: IC FLASH 8GBIT ONFI 48TSOPI Packaging: Tray Package / Case: 48-TFSOP (0.724", 18.40mm Width) Mounting Type: Surface Mount Memory Size: 8Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: FLASH - NAND (SLC) Memory Format: FLASH Supplier Device Package: 48-TSOP I Write Cycle Time - Word, Page: 25ns Memory Interface: ONFI Access Time: 22 ns Memory Organization: 1G x 8 |
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| GD9FU1G8F2ALGI | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tray Package / Case: 63-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Memory Format: FLASH Supplier Device Package: 63-FBGA (9x11) Write Cycle Time - Word, Page: 25ns Memory Interface: Parallel Access Time: 20 ns Memory Organization: 128M x 8 |
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GD9FU1G8F2AMGI | GigaDevice Semiconductor (HK) Limited |
Description: SLC NAND FLASH |
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| GD9FU1G8F3ALGI | GigaDevice Semiconductor (HK) Limited |
Description: IC MEMORY Packaging: Tray Package / Case: 63-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Memory Format: FLASH Supplier Device Package: 63-FBGA (9x11) Write Cycle Time - Word, Page: 20ns Memory Interface: ONFI Access Time: 18 ns Memory Organization: 128M x 8 |
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| GD9FU2G6F3ALGI | GigaDevice Semiconductor (HK) Limited |
Description: IC FLASH 2GBIT ONFI Packaging: Tray Package / Case: 63-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Memory Format: FLASH Supplier Device Package: 63-FBGA (9x11) Write Cycle Time - Word, Page: 20ns Memory Interface: ONFI Access Time: 18 ns Memory Organization: 128M x 16 |
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| GD9FU2G8F2ALGI | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tray Package / Case: 63-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Memory Format: FLASH Supplier Device Package: 63-FBGA (9x11) Write Cycle Time - Word, Page: 20ns Memory Interface: ONFI Access Time: 18 ns Memory Organization: 256M x 8 |
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| GD9FU2G8F3ALGI | GigaDevice Semiconductor (HK) Limited |
Description: IC FLASH 2GBIT ONFI Packaging: Tray Package / Case: 63-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Memory Format: FLASH Supplier Device Package: 63-FBGA (9x11) Write Cycle Time - Word, Page: 20ns Memory Interface: ONFI Access Time: 18 ns Memory Organization: 256M x 8 |
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| GD9FU4G8F2ALGI | GigaDevice Semiconductor (HK) Limited |
Description: LINEAR IC Packaging: Tray |
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| GD9FU4G8F3ALGI | GigaDevice Semiconductor (HK) Limited |
Description: IC MEMORY Packaging: Tray Package / Case: 63-VFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Memory Format: FLASH Supplier Device Package: 63-FBGA (9x11) Write Cycle Time - Word, Page: 20ns Memory Interface: ONFI Access Time: 18 ns Memory Organization: 512M x 8 |
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| GD9FU4G8F3ALGJ | GigaDevice Semiconductor (HK) Limited |
Description: IC FLASH Packaging: Tray Technology: FLASH - NAND Memory Format: FLASH |
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| GD5F2GQ5REYIHR |
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NAND (SLC)
Clock Frequency: 80 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O, QPI, DTR
Access Time: 11 ns
Memory Organization: 512M x 4
Description: LINEAR IC
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NAND (SLC)
Clock Frequency: 80 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O, QPI, DTR
Access Time: 11 ns
Memory Organization: 512M x 4
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| GD5F2GQ5REYIHY |
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NAND (SLC)
Clock Frequency: 80 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O, QPI, DTR
Access Time: 11 ns
Memory Organization: 512M x 4
Description: LINEAR IC
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NAND (SLC)
Clock Frequency: 80 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O, QPI, DTR
Access Time: 11 ns
Memory Organization: 512M x 4
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD5F2GQ5REYJGR |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NAND (SLC)
Clock Frequency: 80 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O
Access Time: 11 ns
Memory Organization: 256M x 8
Description: LINEAR IC
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NAND (SLC)
Clock Frequency: 80 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O
Access Time: 11 ns
Memory Organization: 256M x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD5F2GQ5UEBIGY |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tray
Package / Case: 24-TBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 24-TFBGA (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O
Access Time: 9 ns
Memory Organization: 256M x 8
Description: LINEAR IC
Packaging: Tray
Package / Case: 24-TBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 24-TFBGA (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O
Access Time: 9 ns
Memory Organization: 256M x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD5F2GQ5UEY2GY |
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O, DTR
Access Time: 9 ns
Memory Organization: 256M x 8
Description: LINEAR IC
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O, DTR
Access Time: 9 ns
Memory Organization: 256M x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD5F2GQ5UEYIGR |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O
Access Time: 9 ns
Memory Organization: 256M x 8
Description: LINEAR IC
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O
Access Time: 9 ns
Memory Organization: 256M x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD5F2GQ5UEYIGY |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O
Access Time: 9 ns
Memory Organization: 256M x 8
Description: LINEAR IC
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O
Access Time: 9 ns
Memory Organization: 256M x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD5F2GQ5UEYIHR |
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O, QPI, DTR
Access Time: 9 ns
Memory Organization: 512M x 4
Description: LINEAR IC
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O, QPI, DTR
Access Time: 9 ns
Memory Organization: 512M x 4
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD5F2GQ5UEYIHY |
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O, QPI, DTR
Access Time: 9 ns
Memory Organization: 512M x 4
Description: LINEAR IC
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O, QPI, DTR
Access Time: 9 ns
Memory Organization: 512M x 4
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD5F2GQ5UEYJGR |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O
Access Time: 9 ns
Memory Organization: 256M x 8
Description: LINEAR IC
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O
Access Time: 9 ns
Memory Organization: 256M x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD5F2GQ5UEZIGY |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tray
Package / Case: 24-TBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 24-TFBGA (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O
Access Time: 9 ns
Memory Organization: 256M x 8
Description: LINEAR IC
Packaging: Tray
Package / Case: 24-TBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 24-TFBGA (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O
Access Time: 9 ns
Memory Organization: 256M x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD5F4GM8REWIGR |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 4GBIT SPI/QUAD 8WSON
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NAND (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (5x6)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O, DTR
Access Time: 9 ns
Memory Organization: 1G x 4
Description: IC FLASH 4GBIT SPI/QUAD 8WSON
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NAND (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (5x6)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O, DTR
Access Time: 9 ns
Memory Organization: 1G x 4
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD5F4GM8REWIGY |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 4GBIT SPI/QUAD 8WSON
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NAND (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (5x6)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O, DTR
Access Time: 9 ns
Memory Organization: 1G x 4
Description: IC FLASH 4GBIT SPI/QUAD 8WSON
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NAND (SLC)
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (5x6)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O, DTR
Access Time: 9 ns
Memory Organization: 1G x 4
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD5F4GM8UEYIGR |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 4GBIT SPI/QUAD 8WSON
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O, DTR
Access Time: 7 ns
Memory Organization: 1G x 4
Description: IC FLASH 4GBIT SPI/QUAD 8WSON
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O, DTR
Access Time: 7 ns
Memory Organization: 1G x 4
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD5F4GM8UEYIGY |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 4GBIT SPI/QUAD 8WSON
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O, DTR
Access Time: 7 ns
Memory Organization: 1G x 4
Description: IC FLASH 4GBIT SPI/QUAD 8WSON
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Write Cycle Time - Word, Page: 600µs
Memory Interface: SPI - Quad I/O, DTR
Access Time: 7 ns
Memory Organization: 1G x 4
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD5F4GQ4UCYIGY |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 4GBIT SPI/QUAD 8WSON
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 120 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Memory Interface: SPI - Quad I/O
Memory Organization: 512M x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 4GBIT SPI/QUAD 8WSON
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 120 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Memory Interface: SPI - Quad I/O
Memory Organization: 512M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD5F4GQ6RFYIGR |
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: SPI NAND FLASH 4GB WSON8
Description: SPI NAND FLASH 4GB WSON8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD5F4GQ6RFYIGR |
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: SPI NAND FLASH 4GB WSON8
Description: SPI NAND FLASH 4GB WSON8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD5F4GQ6RFYIGR |
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: SPI NAND FLASH 4GB WSON8
Description: SPI NAND FLASH 4GB WSON8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD9FS1G8F2ALGI |
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tray
Package / Case: 63-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 63-FBGA (9x11)
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 30 ns
Memory Organization: 128M x 8
Description: LINEAR IC
Packaging: Tray
Package / Case: 63-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 63-FBGA (9x11)
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 30 ns
Memory Organization: 128M x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD9FS1G8F2AMGI |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 1GBIT 48TSOP I
Packaging: Tray
Package / Case: 48-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 48-TSOP I
Part Status: Active
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 1GBIT 48TSOP I
Packaging: Tray
Package / Case: 48-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 48-TSOP I
Part Status: Active
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD9FS2G6F2AMGI |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 48-TSOP I
Write Cycle Time - Word, Page: 25ns
Memory Interface: ONFI
Access Time: 20 ns
Memory Organization: 128M x 16
Description: LINEAR IC
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 48-TSOP I
Write Cycle Time - Word, Page: 25ns
Memory Interface: ONFI
Access Time: 20 ns
Memory Organization: 128M x 16
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD9FS2G8F2ALGI |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tray
Package / Case: 63-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 63-FBGA (9x11)
Write Cycle Time - Word, Page: 25ns
Memory Interface: ONFI
Access Time: 20 ns
Memory Organization: 256M x 8
Description: LINEAR IC
Packaging: Tray
Package / Case: 63-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 63-FBGA (9x11)
Write Cycle Time - Word, Page: 25ns
Memory Interface: ONFI
Access Time: 20 ns
Memory Organization: 256M x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD9FS2G8F2AMGI |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 48-TSOP I
Write Cycle Time - Word, Page: 25ns
Memory Interface: ONFI
Access Time: 20 ns
Memory Organization: 256M x 8
Description: LINEAR IC
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 48-TSOP I
Write Cycle Time - Word, Page: 25ns
Memory Interface: ONFI
Access Time: 20 ns
Memory Organization: 256M x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD9FS2G8F3ALGI |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 2GBIT ONFI
Packaging: Tray
Package / Case: 63-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 63-FBGA (9x11)
Write Cycle Time - Word, Page: 25ns
Memory Interface: ONFI
Access Time: 20 ns
Memory Organization: 256M x 8
Description: IC FLASH 2GBIT ONFI
Packaging: Tray
Package / Case: 63-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 63-FBGA (9x11)
Write Cycle Time - Word, Page: 25ns
Memory Interface: ONFI
Access Time: 20 ns
Memory Organization: 256M x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD9FS2G8F3AMGI |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 48-TSOP I
Write Cycle Time - Word, Page: 25ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
Description: LINEAR IC
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 48-TSOP I
Write Cycle Time - Word, Page: 25ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD9FS4G8F2AMGI |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 4GBIT ONFI 48TSOPI
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 48-TSOP I
Write Cycle Time - Word, Page: 25ns
Memory Interface: ONFI
Access Time: 22 ns
Memory Organization: 512M x 8
Description: IC FLASH 4GBIT ONFI 48TSOPI
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 48-TSOP I
Write Cycle Time - Word, Page: 25ns
Memory Interface: ONFI
Access Time: 22 ns
Memory Organization: 512M x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD9FS4G8F3ALGI |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC MEMORY
Packaging: Tray
Package / Case: 63-VFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 63-FBGA (9x11)
Write Cycle Time - Word, Page: 25ns
Memory Interface: ONFI
Access Time: 22 ns
Memory Organization: 512M x 8
Description: IC MEMORY
Packaging: Tray
Package / Case: 63-VFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 63-FBGA (9x11)
Write Cycle Time - Word, Page: 25ns
Memory Interface: ONFI
Access Time: 22 ns
Memory Organization: 512M x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD9FS4G8F3AMGI |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 4GBIT ONFI 48TSOPI
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 48-TSOP I
Write Cycle Time - Word, Page: 25ns
Memory Interface: ONFI
Access Time: 22 ns
Memory Organization: 512M x 8
Description: IC FLASH 4GBIT ONFI 48TSOPI
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 48-TSOP I
Write Cycle Time - Word, Page: 25ns
Memory Interface: ONFI
Access Time: 22 ns
Memory Organization: 512M x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD9FS8G8E2AMGI |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 8GBIT ONFI 48TSOPI
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 48-TSOP I
Write Cycle Time - Word, Page: 25ns
Memory Interface: ONFI
Access Time: 22 ns
Memory Organization: 1G x 8
Description: IC FLASH 8GBIT ONFI 48TSOPI
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 48-TSOP I
Write Cycle Time - Word, Page: 25ns
Memory Interface: ONFI
Access Time: 22 ns
Memory Organization: 1G x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD9FS8G8E3AMGI |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 8GBIT ONFI 48TSOPI
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 48-TSOP I
Write Cycle Time - Word, Page: 25ns
Memory Interface: ONFI
Access Time: 22 ns
Memory Organization: 1G x 8
Description: IC FLASH 8GBIT ONFI 48TSOPI
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 48-TSOP I
Write Cycle Time - Word, Page: 25ns
Memory Interface: ONFI
Access Time: 22 ns
Memory Organization: 1G x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD9FU1G8F2ALGI |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tray
Package / Case: 63-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 63-FBGA (9x11)
Write Cycle Time - Word, Page: 25ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 8
Description: LINEAR IC
Packaging: Tray
Package / Case: 63-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 63-FBGA (9x11)
Write Cycle Time - Word, Page: 25ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD9FU1G8F2AMGI |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: SLC NAND FLASH
Description: SLC NAND FLASH
auf Bestellung 99 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| GD9FU1G8F3ALGI |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC MEMORY
Packaging: Tray
Package / Case: 63-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 63-FBGA (9x11)
Write Cycle Time - Word, Page: 20ns
Memory Interface: ONFI
Access Time: 18 ns
Memory Organization: 128M x 8
Description: IC MEMORY
Packaging: Tray
Package / Case: 63-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 63-FBGA (9x11)
Write Cycle Time - Word, Page: 20ns
Memory Interface: ONFI
Access Time: 18 ns
Memory Organization: 128M x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD9FU2G6F3ALGI |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 2GBIT ONFI
Packaging: Tray
Package / Case: 63-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 63-FBGA (9x11)
Write Cycle Time - Word, Page: 20ns
Memory Interface: ONFI
Access Time: 18 ns
Memory Organization: 128M x 16
Description: IC FLASH 2GBIT ONFI
Packaging: Tray
Package / Case: 63-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 63-FBGA (9x11)
Write Cycle Time - Word, Page: 20ns
Memory Interface: ONFI
Access Time: 18 ns
Memory Organization: 128M x 16
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD9FU2G8F2ALGI |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: LINEAR IC
Packaging: Tray
Package / Case: 63-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 63-FBGA (9x11)
Write Cycle Time - Word, Page: 20ns
Memory Interface: ONFI
Access Time: 18 ns
Memory Organization: 256M x 8
Description: LINEAR IC
Packaging: Tray
Package / Case: 63-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 63-FBGA (9x11)
Write Cycle Time - Word, Page: 20ns
Memory Interface: ONFI
Access Time: 18 ns
Memory Organization: 256M x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD9FU2G8F3ALGI |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 2GBIT ONFI
Packaging: Tray
Package / Case: 63-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 63-FBGA (9x11)
Write Cycle Time - Word, Page: 20ns
Memory Interface: ONFI
Access Time: 18 ns
Memory Organization: 256M x 8
Description: IC FLASH 2GBIT ONFI
Packaging: Tray
Package / Case: 63-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 63-FBGA (9x11)
Write Cycle Time - Word, Page: 20ns
Memory Interface: ONFI
Access Time: 18 ns
Memory Organization: 256M x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD9FU4G8F3ALGI |
|
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC MEMORY
Packaging: Tray
Package / Case: 63-VFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 63-FBGA (9x11)
Write Cycle Time - Word, Page: 20ns
Memory Interface: ONFI
Access Time: 18 ns
Memory Organization: 512M x 8
Description: IC MEMORY
Packaging: Tray
Package / Case: 63-VFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Memory Format: FLASH
Supplier Device Package: 63-FBGA (9x11)
Write Cycle Time - Word, Page: 20ns
Memory Interface: ONFI
Access Time: 18 ns
Memory Organization: 512M x 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| GD9FU4G8F3ALGJ |
Hersteller: GigaDevice Semiconductor (HK) Limited
Description: IC FLASH
Packaging: Tray
Technology: FLASH - NAND
Memory Format: FLASH
Description: IC FLASH
Packaging: Tray
Technology: FLASH - NAND
Memory Format: FLASH
Produkt ist nicht verfügbar
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Stück im Wert von UAH