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HIGFEB1BOSA1 Infineon Technologies Description: MODULE IGBT HYBRID PK
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
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S29GL256P10FFI010 S29GL256P10FFI010 Infineon Technologies 128_Mbit_3_V_Page_Flash_with_90_nm_MirrorBit_Process_Technology-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed7850458a5&utm_source=cypress&utm_medium=ref Description: IC FLASH 256MBIT PARALLEL 64FBGA
DigiKey Programmable: Not Verified
Memory Organization: 32M x 8
Access Time: 100 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 100ns
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tray
auf Bestellung 477 Stücke:
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2+20.09 EUR
10+18.65 EUR
25+18.08 EUR
50+17.64 EUR
180+16.85 EUR
360+16.42 EUR
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S29GL256P90FFIR20 S29GL256P90FFIR20 Infineon Technologies infineon-s29gl01gp-s29gl512p-s29gl256p-s29gl128p-1-gbit512256128-mbit-3-v-page-flash-with-90-nm-mirrorbit-process-technology-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed7850458a5&utm_source=cyp Description: IC FLASH 256MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (13x11)
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 32M x 8
DigiKey Programmable: Verified
auf Bestellung 16 Stücke:
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1+22.13 EUR
10+20.56 EUR
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S29GL256P90TFCR20 S29GL256P90TFCR20 Infineon Technologies 128_Mbit_3_V_Page_Flash_with_90_nm_MirrorBit_Process_Technology-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed7850458a5&utm_source=cypress&utm_medium=ref Description: IC FLASH 256MBIT PARALLEL 56TSOP
DigiKey Programmable: Not Verified
Memory Organization: 32M x 8
Access Time: 90 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 90ns
Part Status: Active
Supplier Device Package: 56-TSOP
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Packaging: Tray
Produkt ist nicht verfügbar
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S29GL256P90TFIR13 S29GL256P90TFIR13 Infineon Technologies infineon-s29gl01gp-s29gl512p-s29gl256p-s29gl128p-1-gbit512256128-mbit-3-v-page-flash-with-90-nm-mirrorbit-process-technology-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed7850458a5&utm_source=cyp Description: IC FLASH 256MBIT PARALLEL 56TSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 56-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 32M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S29GL256P90TFIR13 S29GL256P90TFIR13 Infineon Technologies infineon-s29gl01gp-s29gl512p-s29gl256p-s29gl128p-1-gbit512256128-mbit-3-v-page-flash-with-90-nm-mirrorbit-process-technology-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed7850458a5&utm_source=cyp Description: IC FLASH 256MBIT PARALLEL 56TSOP
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 56-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 32M x 8
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.13 EUR
10+20.56 EUR
25+19.93 EUR
50+19.46 EUR
100+18.98 EUR
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S29GL256P10FFI012 S29GL256P10FFI012 Infineon Technologies 128_Mbit_3_V_Page_Flash_with_90_nm_MirrorBit_Process_Technology-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed7850458a5&utm_source=cypress&utm_medium=ref Description: IC FLASH 256MBIT PARALLEL 64FBGA
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Memory Organization: 32M x 8
Access Time: 100 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 100ns
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 400 Stücke
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S29GL256P10FFI012 S29GL256P10FFI012 Infineon Technologies 128_Mbit_3_V_Page_Flash_with_90_nm_MirrorBit_Process_Technology-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed7850458a5&utm_source=cypress&utm_medium=ref Description: IC FLASH 256MBIT PARALLEL 64FBGA
DigiKey Programmable: Not Verified
Memory Organization: 32M x 8
Access Time: 100 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 100ns
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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S29GL256P90TFCR10 S29GL256P90TFCR10 Infineon Technologies infineon-s29gl01gp-s29gl512p-s29gl256p-s29gl128p-1-gbit512256128-mbit-3-v-page-flash-with-90-nm-mirrorbit-process-technology-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed7850458a5&utm_source=cyp Description: IC FLASH 256MBIT PARALLEL 56TSOP
Packaging: Tray
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 56-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 32M x 8
DigiKey Programmable: Not Verified
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.13 EUR
10+20.56 EUR
25+19.93 EUR
91+19.05 EUR
182+18.58 EUR
273+18.3 EUR
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MB90F543GSPF-GS-9013 MB90F543GSPF-GS-9013 Infineon Technologies Infineon-16-bit_Microcontroller_F2MC-16LX_MB90540G_545G_Series-AdditionalTechnicalInformation-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edc8f4d6071&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integ Description: IC MCU 16BIT 128KB FLASH 100QFP
DigiKey Programmable: Not Verified
Number of I/O: 81
Part Status: Discontinued at Digi-Key
Supplier Device Package: 100-QFP (14x20)
Peripherals: POR, WDT
Connectivity: CANbus, EBI/EMI, SCI, Serial I/O, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x8/10b
Core Processor: F²MC-16LX
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 6K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MB90F347ESPMC-GS9013SPE1 MB90F347ESPMC-GS9013SPE1 Infineon Technologies Infineon-MB90340E_Series_F2MC-16LX_16-bit_Microcontroller_Datasheet-AdditionalTechnicalInformation-v02_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edda1ac621e&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_ Description: IC MCU 16BIT 128KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 82
Part Status: Obsolete
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x8/10b
Core Processor: F²MC-16LX
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 6K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MB90F023PF-GS-9013 MB90F023PF-GS-9013 Infineon Technologies Description: IC MCU MICOM FLASH 100QFP
Packaging: Tray
Part Status: Discontinued at Digi-Key
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IPW65R080CFDFKSA2 IPW65R080CFDFKSA2 Infineon Technologies Infineon-IPW65R080CFD-DS-v02_04-EN.pdf?fileId=db3a30432e0bea21012e14e6178c6e0a Description: MOSFET N-CH 650V 43.3A TO247-3
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43.3A (Tc)
Rds On (Max) @ Id, Vgs: 80mOhm @ 17.6A, 10V
Power Dissipation (Max): 391W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 1.8mA
Supplier Device Package: PG-TO247-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 167 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5030 pF @ 100 V
Produkt ist nicht verfügbar
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IPW65R080CFDFKSA1 IPW65R080CFDFKSA1 Infineon Technologies Infineon-IPW65R080CFD-DS-v02_04-EN.pdf?fileId=db3a30432e0bea21012e14e6178c6e0a Description: MOSFET N-CH 700V 43.3A TO247-3
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43.3A (Tc)
Rds On (Max) @ Id, Vgs: 80mOhm @ 17.6A, 10V
Power Dissipation (Max): 391W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 1.76mA
Supplier Device Package: PG-TO247-3-1
Part Status: Last Time Buy
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 700 V
Gate Charge (Qg) (Max) @ Vgs: 170 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5030 pF @ 100 V
Produkt ist nicht verfügbar
 Mindestbestellmenge: 3120 Stücke
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BCW66KHB6327HTLA1 BCW66KHB6327HTLA1 Infineon Technologies bcw66.pdf?folderId=db3a304314dca389011545f4eb561884&fileId=db3a304314dca389011547504ebe1a07 Description: TRANS NPN 45V 0.8A PG-SOT23
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Obsolete
Supplier Device Package: PG-SOT23
Frequency - Transition: 170MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 250 @ 100mA, 1V
Current - Collector Cutoff (Max): 20nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 450mV @ 50mA, 500mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 30000 Stücke
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BCW66KFE6327HTSA1 BCW66KFE6327HTSA1 Infineon Technologies bcw66.pdf?folderId=db3a304314dca389011545f4eb561884&fileId=db3a304314dca389011547504ebe1a07 Description: TRANS NPN 45V 0.8A PG-SOT23
Packaging: Tape & Reel (TR)
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Last Time Buy
Supplier Device Package: PG-SOT23
Frequency - Transition: 170MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 1V
Current - Collector Cutoff (Max): 20nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 450mV @ 50mA, 500mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Produkt ist nicht verfügbar
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BCW 66H B6327 BCW 66H B6327 Infineon Technologies fundamentals-of-power-semiconductors Description: TRANS NPN 45V 0.8A PG-SOT23
Frequency - Transition: 170MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 250 @ 100mA, 1V
Current - Collector Cutoff (Max): 20nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 450mV @ 50mA, 500mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Tape & Reel (TR)
Power - Max: 330 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Discontinued at Digi-Key
Supplier Device Package: PG-SOT23
Produkt ist nicht verfügbar
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CY8C4147AZI-S445 CY8C4147AZI-S445 Infineon Technologies PSoC_4100S_Plus_RevH_9-14-18.pdf Description: IC MCU 32BIT 128KB FLASH 64TQFP
Part Status: Active
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b Slope, 16x12b SAR; D/A 2xIDAC
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 54
auf Bestellung 310 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.13 EUR
10+6.2 EUR
25+5.71 EUR
160+5.21 EUR
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CY8C21434-24LTXI CY8C21434-24LTXI Infineon Technologies Infineon-CY8C21634_CY8C21534_CY8C21434_CY8C21334_CY8C21234_PSoC_Programmable_System-on-Chip-DataSheet-v36_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecd82ef47ed&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_a Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 28x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 4050 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.73 EUR
10+9.02 EUR
25+8.35 EUR
100+7.6 EUR
490+7.04 EUR
980+6.87 EUR
1470+6.77 EUR
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CY8C21334B-24PVXI CY8C21334B-24PVXI Infineon Technologies download Description: IC MCU 8BIT 8KB FLASH 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 28x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 20-SSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 1254 Stücke:
Lieferzeit 10-14 Tag (e)
3+9.82 EUR
10+7.54 EUR
25+6.97 EUR
100+6.45 EUR
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CY8C4024FNI-S402T CY8C4024FNI-S402T Infineon Technologies Infineon-PSoC_4_PSoC_4000S_Datasheet_Programmable_System-on-Chip_(PSoC_)-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eda97715cf1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-file Description: IC MCU 32BIT 16KB FLASH 25WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 25-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 25-WLCSP (2.02x1.93)
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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CY8C4024FNI-S402T CY8C4024FNI-S402T Infineon Technologies Infineon-PSoC_4_PSoC_4000S_Datasheet_Programmable_System-on-Chip_(PSoC_)-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eda97715cf1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-file Description: IC MCU 32BIT 16KB FLASH 25WLCSP
Packaging: Cut Tape (CT)
Package / Case: 25-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 25-WLCSP (2.02x1.93)
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
auf Bestellung 1997 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.97 EUR
10+2.94 EUR
25+2.68 EUR
100+2.39 EUR
250+2.26 EUR
500+2.18 EUR
1000+2.17 EUR
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CY8C4125LQI-S432 CY8C4125LQI-S432 Infineon Technologies infineon-psoc-4-psoc-4100s-datasheet-programmable-system-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0eda5fc45c69&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integratio Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10b Slope, 16x12b SAR; D/A 2xIDAC
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 27
DigiKey Programmable: Not Verified
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100+4.4 EUR
490+4.05 EUR
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CY8C21434-24LTXIT CY8C21434-24LTXIT Infineon Technologies Infineon-CY8C21634_CY8C21534_CY8C21434_CY8C21334_CY8C21234_PSoC_Programmable_System-on-Chip-DataSheet-v36_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecd82ef47ed&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_a Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 28x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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CY8C21434-24LTXIT CY8C21434-24LTXIT Infineon Technologies Infineon-CY8C21634_CY8C21534_CY8C21434_CY8C21334_CY8C21234_PSoC_Programmable_System-on-Chip-DataSheet-v36_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecd82ef47ed&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_a Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 28x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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250+7.25 EUR
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CY8C4045FNI-S412T CY8C4045FNI-S412T Infineon Technologies Infineon-PSoC_4_PSoC_4000S_Datasheet_Programmable_System-on-Chip_(PSoC_)-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eda97715cf1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-file Description: IC MCU 32BIT 32KB FLASH 25WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 25-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 25-WLCSP (2.02x1.93)
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C4045FNI-S412T CY8C4045FNI-S412T Infineon Technologies Infineon-PSoC_4_PSoC_4000S_Datasheet_Programmable_System-on-Chip_(PSoC_)-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eda97715cf1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-file Description: IC MCU 32BIT 32KB FLASH 25WLCSP
Packaging: Cut Tape (CT)
Package / Case: 25-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 25-WLCSP (2.02x1.93)
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
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100+4.15 EUR
250+3.93 EUR
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F3L75R12W1H3B27BOMA1 F3L75R12W1H3B27BOMA1 Infineon Technologies Infineon-F3L75R12W1H3_B27-DS-v03_02-EN.pdf?fileId=5546d46145460399014564559a6f3fe3 Description: IGBT MOD 1200V 45A 275W MOD
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 1.7V @ 15V, 30A
NTC Thermistor: Yes
Supplier Device Package: Module
Part Status: Active
Current - Collector (Ic) (Max): 45 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 275 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
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IRLR7807ZPBF IRLR7807ZPBF Infineon Technologies IRLR7807ZPbF%2CIRLU7807ZPbF.pdf Description: MOSFET N-CH 30V 43A DPAK
Packaging: Tube
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Tc)
Rds On (Max) @ Id, Vgs: 13.8mOhm @ 15A, 10V
Power Dissipation (Max): 40W (Tc)
Vgs(th) (Max) @ Id: 2.25V @ 250µA
Supplier Device Package: TO-252AA (DPAK)
Part Status: Discontinued at Digi-Key
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 780 pF @ 15 V
Produkt ist nicht verfügbar
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KITDRIVER2EDN7524RTOBO1 KITDRIVER2EDN7524RTOBO1 Infineon Technologies Infineon-2EDN752x-2EDN852x-DS--DS-v02_05-EN.pdf?fileId=5546d462525dbac40152abcc7dbb1727 Description: 2EDN7524R DUAL LOW SIDE
Supplied Contents: Board(s)
Utilized IC / Part: 2EDN7524R
Type: Power Management
Function: Gate Driver
Packaging: Bulk
Contents: Board(s)
Part Status: Active
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KITDRIVER2EDN7524FTOBO1 KITDRIVER2EDN7524FTOBO1 Infineon Technologies Infineon-Quick-start-guide_KIT_DRIVER_2EDN7524F-ATI-v01_00-EN.pdf?fileId=5546d46265257de8016538e130b0009e Description: EVAL BOARD FOR 2EDN7524F
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: 2EDN7524F
Type: Power Management
Function: Gate Driver
Packaging: Bulk
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IR25607STRPBF IR25607STRPBF Infineon Technologies Infineon-IR25607S-DS-v01_00-EN.pdf?fileId=5546d46269e1c019016a4a9172b34acb Description: IC GATE DRVR HALF-BRIDGE 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 10V ~ 20V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 600 V
Supplier Device Package: 16-SOIC
Rise / Fall Time (Typ): 25ns, 17ns
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: IGBT, N-Channel MOSFET
Logic Voltage - VIL, VIH: 6V, 9.5V
Current - Peak Output (Source, Sink): 2.5A, 2.5A
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IR25607STRPBF IR25607STRPBF Infineon Technologies Infineon-IR25607S-DS-v01_00-EN.pdf?fileId=5546d46269e1c019016a4a9172b34acb Description: IC GATE DRVR HALF-BRIDGE 16SOIC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 10V ~ 20V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 600 V
Supplier Device Package: 16-SOIC
Rise / Fall Time (Typ): 25ns, 17ns
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: IGBT, N-Channel MOSFET
Logic Voltage - VIL, VIH: 6V, 9.5V
Current - Peak Output (Source, Sink): 2.5A, 2.5A
Part Status: Active
DigiKey Programmable: Not Verified
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S70GL02GT12FHIV10 S70GL02GT12FHIV10 Infineon Technologies Infineon-S70GL02GT_2-Gbit_(256-MB)_3.0V_Flash_Memory-DataSheet-v06_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2615368d7&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FLASH 2GBIT PARALLEL 64FBGA
DigiKey Programmable: Not Verified
Memory Organization: 256M x 8, 128M x 16
Access Time: 120 ns
Memory Interface: Parallel
Part Status: Active
Supplier Device Package: 64-FBGA (11x13)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tray
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S76HS512TC0BHB013 S76HS512TC0BHB013 Infineon Technologies Infineon-S76HS512TC0_S76HL512TC0_512Mb_SEMPER_Flash_and_64Mb_HYPERRAM_2.0_HYPERBUS_interface_multi-chip_package_1.8_V_3.0_V-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c8386267f0183a234e7935d45&da=t Description: IC FLSH RAM 512MBIT HYPRBS 24BGA
Packaging: Cut Tape (CT)
Package / Case: 24-BGA
Mounting Type: Surface Mount
Memory Size: 512Mbit (FLASH), 64Mbit (RAM)
Memory Type: Non-Volatile, Volatile
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH, DRAM
Clock Frequency: 200 MHz
Memory Format: FLASH, RAM
Supplier Device Package: PG-BGA-24
Part Status: Active
Memory Interface: HyperBus
DigiKey Programmable: Not Verified
auf Bestellung 1956 Stücke:
Lieferzeit 10-14 Tag (e)
1+43.84 EUR
10+40.61 EUR
25+39.33 EUR
50+38.37 EUR
100+37.41 EUR
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S76HS512TC0BHB013 S76HS512TC0BHB013 Infineon Technologies Infineon-S76HS512TC0_S76HL512TC0_512Mb_SEMPER_Flash_and_64Mb_HYPERRAM_2.0_HYPERBUS_interface_multi-chip_package_1.8_V_3.0_V-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c8386267f0183a234e7935d45&da=t Description: IC FLSH RAM 512MBIT HYPRBS 24BGA
Packaging: Tape & Reel (TR)
Package / Case: 24-BGA
Mounting Type: Surface Mount
Memory Size: 512Mbit (FLASH), 64Mbit (RAM)
Memory Type: Non-Volatile, Volatile
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH, DRAM
Clock Frequency: 200 MHz
Memory Format: FLASH, RAM
Supplier Device Package: PG-BGA-24
Part Status: Active
Memory Interface: HyperBus
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S29GL256S10TFV010 S29GL256S10TFV010 Infineon Technologies infineon-s29gl01gs-s29gl512s-s29gl256s-s29gl128s-128-mb-256-mb-512-mb-1-gb-gl-s-mirrorbit-tm-flash-parallel-3-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5&utm_source=cypress&utm_medium Description: IC FLASH 256MBIT PARALLEL 56TSOP
Packaging: Tray
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 56-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 16M x 16
DigiKey Programmable: Not Verified
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DD230S20KHPSA1 DD230S20KHPSA1 Infineon Technologies DD230S.pdf Description: DIODE ARRAY MOD 2900V 350A
Current - Reverse Leakage @ Vr: 160 mA @ 2000 V
Voltage - Forward (Vf) (Max) @ If: 1.74 V @ 800 A
Voltage - DC Reverse (Vr) (Max): 2000 V
Part Status: Obsolete
Operating Temperature - Junction: 150°C
Supplier Device Package: Module
Current - Average Rectified (Io) (per Diode): 261A
Diode Configuration: 1 Pair Series Connection
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
Produkt ist nicht verfügbar
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S25HL512TDPMHI010 S25HL512TDPMHI010 Infineon Technologies 002-12345_rev-AF.pdf Description: IC FLASH 512MBIT SPI/QUAD 16SOIC
DigiKey Programmable: Not Verified
Memory Organization: 64M x 8
Memory Interface: SPI - Quad I/O
Part Status: Active
Supplier Device Package: 16-SOIC
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 512Mbit
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tray
auf Bestellung 183 Stücke:
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S25HL512TDPBHI010 S25HL512TDPBHI010 Infineon Technologies 002-12345_rev-AF.pdf Description: IC FLASH 512MBIT SPI/QUAD 24BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Memory Organization: 64M x 8
Memory Interface: SPI - Quad I/O
Part Status: Active
Supplier Device Package: 24-BGA (8x6)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 512Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
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2EDL8123G3CXTMA1 2EDL8123G3CXTMA1 Infineon Technologies Infineon-2EDL8X2X-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c82ce566401837ff6a7de184a Description: IC GATE DRVR HALF-BRIDGE 10VFDFN
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 8V ~ 17V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 120 V
Supplier Device Package: PG-VSON-10-4
Rise / Fall Time (Typ): 45ns, 45ns
Channel Type: Independent
Driven Configuration: High-Side and Low-Side
Number of Drivers: 2
Gate Type: MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 3A, 5A
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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2EDL8123G3CXTMA1 2EDL8123G3CXTMA1 Infineon Technologies Infineon-2EDL8X2X-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c82ce566401837ff6a7de184a Description: IC GATE DRVR HALF-BRIDGE 10VFDFN
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 8V ~ 17V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 120 V
Supplier Device Package: PG-VSON-10-4
Rise / Fall Time (Typ): 45ns, 45ns
Channel Type: Independent
Driven Configuration: High-Side and Low-Side
Number of Drivers: 2
Gate Type: MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 3A, 5A
Part Status: Active
DigiKey Programmable: Not Verified
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25+1.37 EUR
100+1.2 EUR
250+1.13 EUR
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1000+1.05 EUR
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TC234LX32F200FABKXUMA1 TC234LX32F200FABKXUMA1 Infineon Technologies TriCore_Family_BR-2016_web.pdf?fileId=5546d46159d9a237015a127ab33e0137 Description: IC MCU 32BIT 2MB FLASH 144TQFP
DigiKey Programmable: Not Verified
Number of I/O: 120
Part Status: Active
Supplier Device Package: PG-TQFP-144-27
Peripherals: DMA, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, QSPI
Voltage - Supply (Vcc/Vdd): 3.3V
Core Size: 32-Bit
Data Converters: A/D 24x12b
Core Processor: TriCore™
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Cut Tape (CT)
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1+38.77 EUR
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100+26.94 EUR
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TZ800N18KOFB1HPSA2 TZ800N18KOFB1HPSA2 Infineon Technologies Description: SCR MODULE 1.8KV 1500A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Single
Current - Hold (Ih) (Max): 500 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 35000A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 819 A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Part Status: Active
Current - On State (It (RMS)) (Max): 1500 A
Voltage - Off State: 1.8 kV
Produkt ist nicht verfügbar
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TC222S16F133NACKXUMA1 TC222S16F133NACKXUMA1 Infineon Technologies infineon-aurix-tc2xx-addendum-datasheet-en.pdf Description: IC MCU 32BIT 1MB FLASH 80TQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-80-7
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC222S16F133NACKXUMA1 TC222S16F133NACKXUMA1 Infineon Technologies infineon-aurix-tc2xx-addendum-datasheet-en.pdf Description: IC MCU 32BIT 1MB FLASH 80TQFP
Packaging: Cut Tape (CT)
Package / Case: 80-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-80-7
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
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10+19.04 EUR
25+17.74 EUR
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250+16.09 EUR
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AUIRFP4310Z AUIRFP4310Z Infineon Technologies AUIRFP4310Z.pdf Description: MOSFET N-CH 100V 128A TO247AC
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 128A (Tc)
Rds On (Max) @ Id, Vgs: 6mOhm @ 77A, 10V
Power Dissipation (Max): 278W (Tc)
Vgs(th) (Max) @ Id: 4V @ 150µA
Supplier Device Package: PG-TO247-3
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 188 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 7120 pF @ 50 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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SK-MB9DF120-001-JLINK Infineon Technologies Description: DEV KIT TOOL KIT PWR MGMT
Packaging: Box
Function: CANbus
Type: Interface
Utilized IC / Part: MB9DF120
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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CG8281AA Infineon Technologies Description: IC MEMORY FLASH NOR
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
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CG8281AAT Infineon Technologies Description: IC MEMORY FLASH NOR
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9AF001PMC-GFKE1 Infineon Technologies Description: IC MCU
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 840 Stücke:
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2+17.11 EUR
10+13.32 EUR
84+11.53 EUR
Mindestbestellmenge: 2 Stücke
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CYAT81682-100AA61ZT CYAT81682-100AA61ZT Infineon Technologies CYAT8168x.pdf Description: PSOC BASED - TRUETOUCH
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Touchscreen: 2 Wire Capacitive
Supplier Device Package: 100-TQFP (14x14)
Voltage - Supply: 1.71V ~ 1.95V, 3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Interface: I2C, SPI
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IRFR120NTRRPBF IRFR120NTRRPBF Infineon Technologies irfr120npbf.pdf?fileId=5546d462533600a40153562d2620204d Description: MOSFET N-CH 100V 9.4A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 9.4A (Tc)
Rds On (Max) @ Id, Vgs: 210mOhm @ 5.6A, 10V
Power Dissipation (Max): 48W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: TO-252AA (DPAK)
Part Status: Discontinued at Digi-Key
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 25 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 25 V
Produkt ist nicht verfügbar
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FS820R08A6P2LBBPSA1 FS820R08A6P2LBBPSA1 Infineon Technologies Infineon-FS820R08A6P2LB-DataSheet-v03_03-EN.pdf?fileId=5546d4625fe36784015fe7bf83492945 Description: IGBT MODULE 820A HYBRID PK DRIVE
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: No
Operating Temperature: 175°C (TJ)
Configuration: Three Phase Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Current - Collector (Ic) (Max): 820 A
Part Status: Active
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FS800R07A2E3BOSA2 Infineon Technologies Description: IGBT MOD ATV 800A HYBRID PACK2
Vce(on) (Max) @ Vge, Ic: 1.6V @ 15V, 550A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Three Phase Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Input Capacitance (Cies) @ Vce: 52 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 1500 W
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector (Ic) (Max): 700 A
Part Status: Obsolete
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: Yes
Produkt ist nicht verfügbar
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FS200R07A5E3S6BPSA1 FS200R07A5E3S6BPSA1 Infineon Technologies Infineon-FS200R07A5E3_S6-DS-v03_00-EN.pdf?fileId=5546d46262b31d2e0163019320f4339d Description: IGBT MODULE HYBRID PACK LIGHT
Input Capacitance (Cies) @ Vce: 13 nF @ 25 V
Current - Collector Cutoff (Max): 100 µA
Power - Max: 630 W
Voltage - Collector Emitter Breakdown (Max): 705 V
Current - Collector (Ic) (Max): 200 A
Part Status: Last Time Buy
IGBT Type: Trench
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 1.7V @ 15V, 200A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Full Bridge Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
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FS820R08A6P2BPSA1 FS820R08A6P2BPSA1 Infineon Technologies Infineon-FS820R08A6P2-DataSheet-v03_20-EN.pdf?fileId=5546d4626cb27db2016cdda3fdba2f5e Description: IGBT MODULE PACK DRV HYBRIDD-1
Input Capacitance (Cies) @ Vce: 80 nF @ 50 V
Current - Collector Cutoff (Max): 1 mA
Power - Max: 714 W
Voltage - Collector Emitter Breakdown (Max): 750 V
Current - Collector (Ic) (Max): 820 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: AG-HYBRIDD-1
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 1.35V @ 15V, 450A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Three Phase Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
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FS600R07A2E3BOSA3 Infineon Technologies Description: MODULE IGBT 600V HYBRID PACK 2
Input Capacitance (Cies) @ Vce: 39 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 1250 W
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector (Ic) (Max): 530 A
Part Status: Obsolete
IGBT Type: Trench Field Stop
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 1.6V @ 15V, 400A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Three Phase
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
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FS400R07A3E3H6BPSA1 FS400R07A3E3H6BPSA1 Infineon Technologies Infineon-FS400R07A3E3_H6-DataSheet-v01_20-EN.pdf?fileId=5546d462636cc8fb0163862ed75f130b Description: IGBT MODULE 650V 400A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector (Ic) (Max): 400 A
Part Status: Last Time Buy
Supplier Device Package: Module
NTC Thermistor: Yes
Operating Temperature: 175°C (TJ)
Configuration: Three Phase Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
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AUIRFS3206TRL AUIRFS3206TRL Infineon Technologies auirfs3206.pdf?fileId=5546d462533600a4015355b6755614b6 Description: MOSFET N-CH 60V 210A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 3mOhm @ 75A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 150µA
Supplier Device Package: D2PAK
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 170 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6540 pF @ 50 V
Grade: Automotive
Qualification: AEC-Q101
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HIGFEB1BOSA1
Hersteller: Infineon Technologies
Description: MODULE IGBT HYBRID PK
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
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S29GL256P10FFI010 128_Mbit_3_V_Page_Flash_with_90_nm_MirrorBit_Process_Technology-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed7850458a5&utm_source=cypress&utm_medium=ref
S29GL256P10FFI010
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT PARALLEL 64FBGA
DigiKey Programmable: Not Verified
Memory Organization: 32M x 8
Access Time: 100 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 100ns
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tray
auf Bestellung 477 Stücke:
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2+20.09 EUR
10+18.65 EUR
25+18.08 EUR
50+17.64 EUR
180+16.85 EUR
360+16.42 EUR
Mindestbestellmenge: 2 Stücke
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S29GL256P90FFIR20 infineon-s29gl01gp-s29gl512p-s29gl256p-s29gl128p-1-gbit512256128-mbit-3-v-page-flash-with-90-nm-mirrorbit-process-technology-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed7850458a5&utm_source=cyp
S29GL256P90FFIR20
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (13x11)
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 32M x 8
DigiKey Programmable: Verified
auf Bestellung 16 Stücke:
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1+22.13 EUR
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S29GL256P90TFCR20 128_Mbit_3_V_Page_Flash_with_90_nm_MirrorBit_Process_Technology-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed7850458a5&utm_source=cypress&utm_medium=ref
S29GL256P90TFCR20
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT PARALLEL 56TSOP
DigiKey Programmable: Not Verified
Memory Organization: 32M x 8
Access Time: 90 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 90ns
Part Status: Active
Supplier Device Package: 56-TSOP
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Packaging: Tray
Produkt ist nicht verfügbar
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S29GL256P90TFIR13 infineon-s29gl01gp-s29gl512p-s29gl256p-s29gl128p-1-gbit512256128-mbit-3-v-page-flash-with-90-nm-mirrorbit-process-technology-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed7850458a5&utm_source=cyp
S29GL256P90TFIR13
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT PARALLEL 56TSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 56-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 32M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S29GL256P90TFIR13 infineon-s29gl01gp-s29gl512p-s29gl256p-s29gl128p-1-gbit512256128-mbit-3-v-page-flash-with-90-nm-mirrorbit-process-technology-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed7850458a5&utm_source=cyp
S29GL256P90TFIR13
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT PARALLEL 56TSOP
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 56-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 32M x 8
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
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1+22.13 EUR
10+20.56 EUR
25+19.93 EUR
50+19.46 EUR
100+18.98 EUR
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S29GL256P10FFI012 128_Mbit_3_V_Page_Flash_with_90_nm_MirrorBit_Process_Technology-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed7850458a5&utm_source=cypress&utm_medium=ref
S29GL256P10FFI012
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT PARALLEL 64FBGA
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Memory Organization: 32M x 8
Access Time: 100 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 100ns
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Produkt ist nicht verfügbar
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S29GL256P10FFI012 128_Mbit_3_V_Page_Flash_with_90_nm_MirrorBit_Process_Technology-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed7850458a5&utm_source=cypress&utm_medium=ref
S29GL256P10FFI012
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT PARALLEL 64FBGA
DigiKey Programmable: Not Verified
Memory Organization: 32M x 8
Access Time: 100 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 100ns
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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S29GL256P90TFCR10 infineon-s29gl01gp-s29gl512p-s29gl256p-s29gl128p-1-gbit512256128-mbit-3-v-page-flash-with-90-nm-mirrorbit-process-technology-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed7850458a5&utm_source=cyp
S29GL256P90TFCR10
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT PARALLEL 56TSOP
Packaging: Tray
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 56-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 32M x 8
DigiKey Programmable: Not Verified
auf Bestellung 300 Stücke:
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AnzahlPrivatkunde
1+22.13 EUR
10+20.56 EUR
25+19.93 EUR
91+19.05 EUR
182+18.58 EUR
273+18.3 EUR
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MB90F543GSPF-GS-9013 Infineon-16-bit_Microcontroller_F2MC-16LX_MB90540G_545G_Series-AdditionalTechnicalInformation-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edc8f4d6071&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integ
MB90F543GSPF-GS-9013
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 128KB FLASH 100QFP
DigiKey Programmable: Not Verified
Number of I/O: 81
Part Status: Discontinued at Digi-Key
Supplier Device Package: 100-QFP (14x20)
Peripherals: POR, WDT
Connectivity: CANbus, EBI/EMI, SCI, Serial I/O, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x8/10b
Core Processor: F²MC-16LX
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 6K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MB90F347ESPMC-GS9013SPE1 Infineon-MB90340E_Series_F2MC-16LX_16-bit_Microcontroller_Datasheet-AdditionalTechnicalInformation-v02_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edda1ac621e&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_
MB90F347ESPMC-GS9013SPE1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 128KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 82
Part Status: Obsolete
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x8/10b
Core Processor: F²MC-16LX
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 6K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MB90F023PF-GS-9013
MB90F023PF-GS-9013
Hersteller: Infineon Technologies
Description: IC MCU MICOM FLASH 100QFP
Packaging: Tray
Part Status: Discontinued at Digi-Key
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IPW65R080CFDFKSA2 Infineon-IPW65R080CFD-DS-v02_04-EN.pdf?fileId=db3a30432e0bea21012e14e6178c6e0a
IPW65R080CFDFKSA2
Hersteller: Infineon Technologies
Description: MOSFET N-CH 650V 43.3A TO247-3
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43.3A (Tc)
Rds On (Max) @ Id, Vgs: 80mOhm @ 17.6A, 10V
Power Dissipation (Max): 391W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 1.8mA
Supplier Device Package: PG-TO247-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 167 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5030 pF @ 100 V
Produkt ist nicht verfügbar
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IPW65R080CFDFKSA1 Infineon-IPW65R080CFD-DS-v02_04-EN.pdf?fileId=db3a30432e0bea21012e14e6178c6e0a
IPW65R080CFDFKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 700V 43.3A TO247-3
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43.3A (Tc)
Rds On (Max) @ Id, Vgs: 80mOhm @ 17.6A, 10V
Power Dissipation (Max): 391W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 1.76mA
Supplier Device Package: PG-TO247-3-1
Part Status: Last Time Buy
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 700 V
Gate Charge (Qg) (Max) @ Vgs: 170 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5030 pF @ 100 V
Produkt ist nicht verfügbar
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BCW66KHB6327HTLA1 bcw66.pdf?folderId=db3a304314dca389011545f4eb561884&fileId=db3a304314dca389011547504ebe1a07
BCW66KHB6327HTLA1
Hersteller: Infineon Technologies
Description: TRANS NPN 45V 0.8A PG-SOT23
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Obsolete
Supplier Device Package: PG-SOT23
Frequency - Transition: 170MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 250 @ 100mA, 1V
Current - Collector Cutoff (Max): 20nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 450mV @ 50mA, 500mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BCW66KFE6327HTSA1 bcw66.pdf?folderId=db3a304314dca389011545f4eb561884&fileId=db3a304314dca389011547504ebe1a07
BCW66KFE6327HTSA1
Hersteller: Infineon Technologies
Description: TRANS NPN 45V 0.8A PG-SOT23
Packaging: Tape & Reel (TR)
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Last Time Buy
Supplier Device Package: PG-SOT23
Frequency - Transition: 170MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 1V
Current - Collector Cutoff (Max): 20nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 450mV @ 50mA, 500mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Produkt ist nicht verfügbar
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BCW 66H B6327 fundamentals-of-power-semiconductors
BCW 66H B6327
Hersteller: Infineon Technologies
Description: TRANS NPN 45V 0.8A PG-SOT23
Frequency - Transition: 170MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 250 @ 100mA, 1V
Current - Collector Cutoff (Max): 20nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 450mV @ 50mA, 500mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Tape & Reel (TR)
Power - Max: 330 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 800 mA
Part Status: Discontinued at Digi-Key
Supplier Device Package: PG-SOT23
Produkt ist nicht verfügbar
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CY8C4147AZI-S445 PSoC_4100S_Plus_RevH_9-14-18.pdf
CY8C4147AZI-S445
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 64TQFP
Part Status: Active
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b Slope, 16x12b SAR; D/A 2xIDAC
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 54
auf Bestellung 310 Stücke:
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AnzahlPrivatkunde
3+8.13 EUR
10+6.2 EUR
25+5.71 EUR
160+5.21 EUR
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CY8C21434-24LTXI Infineon-CY8C21634_CY8C21534_CY8C21434_CY8C21334_CY8C21234_PSoC_Programmable_System-on-Chip-DataSheet-v36_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecd82ef47ed&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_a
CY8C21434-24LTXI
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 28x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 4050 Stücke:
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2+11.73 EUR
10+9.02 EUR
25+8.35 EUR
100+7.6 EUR
490+7.04 EUR
980+6.87 EUR
1470+6.77 EUR
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CY8C21334B-24PVXI download
CY8C21334B-24PVXI
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 28x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 20-SSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 1254 Stücke:
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3+9.82 EUR
10+7.54 EUR
25+6.97 EUR
100+6.45 EUR
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CY8C4024FNI-S402T Infineon-PSoC_4_PSoC_4000S_Datasheet_Programmable_System-on-Chip_(PSoC_)-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eda97715cf1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-file
CY8C4024FNI-S402T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 16KB FLASH 25WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 25-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 25-WLCSP (2.02x1.93)
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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CY8C4024FNI-S402T Infineon-PSoC_4_PSoC_4000S_Datasheet_Programmable_System-on-Chip_(PSoC_)-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eda97715cf1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-file
CY8C4024FNI-S402T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 16KB FLASH 25WLCSP
Packaging: Cut Tape (CT)
Package / Case: 25-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 25-WLCSP (2.02x1.93)
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
auf Bestellung 1997 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6+3.97 EUR
10+2.94 EUR
25+2.68 EUR
100+2.39 EUR
250+2.26 EUR
500+2.18 EUR
1000+2.17 EUR
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CY8C4125LQI-S432 infineon-psoc-4-psoc-4100s-datasheet-programmable-system-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0eda5fc45c69&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integratio
CY8C4125LQI-S432
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10b Slope, 16x12b SAR; D/A 2xIDAC
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 27
DigiKey Programmable: Not Verified
auf Bestellung 3083 Stücke:
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3+7.06 EUR
10+5.32 EUR
25+4.88 EUR
100+4.4 EUR
490+4.05 EUR
980+3.93 EUR
1470+3.87 EUR
2940+3.78 EUR
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CY8C21434-24LTXIT Infineon-CY8C21634_CY8C21534_CY8C21434_CY8C21334_CY8C21234_PSoC_Programmable_System-on-Chip-DataSheet-v36_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecd82ef47ed&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_a
CY8C21434-24LTXIT
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 28x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2500+6.19 EUR
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CY8C21434-24LTXIT Infineon-CY8C21634_CY8C21534_CY8C21434_CY8C21334_CY8C21234_PSoC_Programmable_System-on-Chip-DataSheet-v36_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecd82ef47ed&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_a
CY8C21434-24LTXIT
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 28x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 4695 Stücke:
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2+11.73 EUR
10+9.02 EUR
25+8.35 EUR
100+7.6 EUR
250+7.25 EUR
500+7.03 EUR
1000+6.85 EUR
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CY8C4045FNI-S412T Infineon-PSoC_4_PSoC_4000S_Datasheet_Programmable_System-on-Chip_(PSoC_)-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eda97715cf1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-file
CY8C4045FNI-S412T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 25WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 25-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 25-WLCSP (2.02x1.93)
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C4045FNI-S412T Infineon-PSoC_4_PSoC_4000S_Datasheet_Programmable_System-on-Chip_(PSoC_)-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eda97715cf1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-file
CY8C4045FNI-S412T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 25WLCSP
Packaging: Cut Tape (CT)
Package / Case: 25-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 25-WLCSP (2.02x1.93)
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
auf Bestellung 1620 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4+6.72 EUR
10+5.03 EUR
25+4.62 EUR
100+4.15 EUR
250+3.93 EUR
500+3.8 EUR
1000+3.69 EUR
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F3L75R12W1H3B27BOMA1 Infineon-F3L75R12W1H3_B27-DS-v03_02-EN.pdf?fileId=5546d46145460399014564559a6f3fe3
F3L75R12W1H3B27BOMA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 45A 275W MOD
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 1.7V @ 15V, 30A
NTC Thermistor: Yes
Supplier Device Package: Module
Part Status: Active
Current - Collector (Ic) (Max): 45 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 275 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
auf Bestellung 12 Stücke:
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AnzahlPrivatkunde
1+54.6 EUR
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IRLR7807ZPBF IRLR7807ZPbF%2CIRLU7807ZPbF.pdf
IRLR7807ZPBF
Hersteller: Infineon Technologies
Description: MOSFET N-CH 30V 43A DPAK
Packaging: Tube
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Tc)
Rds On (Max) @ Id, Vgs: 13.8mOhm @ 15A, 10V
Power Dissipation (Max): 40W (Tc)
Vgs(th) (Max) @ Id: 2.25V @ 250µA
Supplier Device Package: TO-252AA (DPAK)
Part Status: Discontinued at Digi-Key
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 780 pF @ 15 V
Produkt ist nicht verfügbar
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KITDRIVER2EDN7524RTOBO1 Infineon-2EDN752x-2EDN852x-DS--DS-v02_05-EN.pdf?fileId=5546d462525dbac40152abcc7dbb1727
KITDRIVER2EDN7524RTOBO1
Hersteller: Infineon Technologies
Description: 2EDN7524R DUAL LOW SIDE
Supplied Contents: Board(s)
Utilized IC / Part: 2EDN7524R
Type: Power Management
Function: Gate Driver
Packaging: Bulk
Contents: Board(s)
Part Status: Active
auf Bestellung 2 Stücke:
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AnzahlPrivatkunde
1+112.85 EUR
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KITDRIVER2EDN7524FTOBO1 Infineon-Quick-start-guide_KIT_DRIVER_2EDN7524F-ATI-v01_00-EN.pdf?fileId=5546d46265257de8016538e130b0009e
KITDRIVER2EDN7524FTOBO1
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR 2EDN7524F
Contents: Board(s)
Part Status: Active
Supplied Contents: Board(s)
Utilized IC / Part: 2EDN7524F
Type: Power Management
Function: Gate Driver
Packaging: Bulk
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+52.61 EUR
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IR25607STRPBF Infineon-IR25607S-DS-v01_00-EN.pdf?fileId=5546d46269e1c019016a4a9172b34acb
IR25607STRPBF
Hersteller: Infineon Technologies
Description: IC GATE DRVR HALF-BRIDGE 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 10V ~ 20V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 600 V
Supplier Device Package: 16-SOIC
Rise / Fall Time (Typ): 25ns, 17ns
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: IGBT, N-Channel MOSFET
Logic Voltage - VIL, VIH: 6V, 9.5V
Current - Peak Output (Source, Sink): 2.5A, 2.5A
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IR25607STRPBF Infineon-IR25607S-DS-v01_00-EN.pdf?fileId=5546d46269e1c019016a4a9172b34acb
IR25607STRPBF
Hersteller: Infineon Technologies
Description: IC GATE DRVR HALF-BRIDGE 16SOIC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 10V ~ 20V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 600 V
Supplier Device Package: 16-SOIC
Rise / Fall Time (Typ): 25ns, 17ns
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: IGBT, N-Channel MOSFET
Logic Voltage - VIL, VIH: 6V, 9.5V
Current - Peak Output (Source, Sink): 2.5A, 2.5A
Part Status: Active
DigiKey Programmable: Not Verified
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4+6.47 EUR
10+4.69 EUR
25+4.25 EUR
100+3.76 EUR
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S70GL02GT12FHIV10 Infineon-S70GL02GT_2-Gbit_(256-MB)_3.0V_Flash_Memory-DataSheet-v06_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2615368d7&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
S70GL02GT12FHIV10
Hersteller: Infineon Technologies
Description: IC FLASH 2GBIT PARALLEL 64FBGA
DigiKey Programmable: Not Verified
Memory Organization: 256M x 8, 128M x 16
Access Time: 120 ns
Memory Interface: Parallel
Part Status: Active
Supplier Device Package: 64-FBGA (11x13)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tray
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S76HS512TC0BHB013 Infineon-S76HS512TC0_S76HL512TC0_512Mb_SEMPER_Flash_and_64Mb_HYPERRAM_2.0_HYPERBUS_interface_multi-chip_package_1.8_V_3.0_V-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c8386267f0183a234e7935d45&da=t
S76HS512TC0BHB013
Hersteller: Infineon Technologies
Description: IC FLSH RAM 512MBIT HYPRBS 24BGA
Packaging: Cut Tape (CT)
Package / Case: 24-BGA
Mounting Type: Surface Mount
Memory Size: 512Mbit (FLASH), 64Mbit (RAM)
Memory Type: Non-Volatile, Volatile
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH, DRAM
Clock Frequency: 200 MHz
Memory Format: FLASH, RAM
Supplier Device Package: PG-BGA-24
Part Status: Active
Memory Interface: HyperBus
DigiKey Programmable: Not Verified
auf Bestellung 1956 Stücke:
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1+43.84 EUR
10+40.61 EUR
25+39.33 EUR
50+38.37 EUR
100+37.41 EUR
250+36.18 EUR
500+35.25 EUR
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S76HS512TC0BHB013 Infineon-S76HS512TC0_S76HL512TC0_512Mb_SEMPER_Flash_and_64Mb_HYPERRAM_2.0_HYPERBUS_interface_multi-chip_package_1.8_V_3.0_V-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c8386267f0183a234e7935d45&da=t
S76HS512TC0BHB013
Hersteller: Infineon Technologies
Description: IC FLSH RAM 512MBIT HYPRBS 24BGA
Packaging: Tape & Reel (TR)
Package / Case: 24-BGA
Mounting Type: Surface Mount
Memory Size: 512Mbit (FLASH), 64Mbit (RAM)
Memory Type: Non-Volatile, Volatile
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH, DRAM
Clock Frequency: 200 MHz
Memory Format: FLASH, RAM
Supplier Device Package: PG-BGA-24
Part Status: Active
Memory Interface: HyperBus
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S29GL256S10TFV010 infineon-s29gl01gs-s29gl512s-s29gl256s-s29gl128s-128-mb-256-mb-512-mb-1-gb-gl-s-mirrorbit-tm-flash-parallel-3-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5&utm_source=cypress&utm_medium
S29GL256S10TFV010
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT PARALLEL 56TSOP
Packaging: Tray
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 56-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 16M x 16
DigiKey Programmable: Not Verified
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DD230S20KHPSA1 DD230S.pdf
DD230S20KHPSA1
Hersteller: Infineon Technologies
Description: DIODE ARRAY MOD 2900V 350A
Current - Reverse Leakage @ Vr: 160 mA @ 2000 V
Voltage - Forward (Vf) (Max) @ If: 1.74 V @ 800 A
Voltage - DC Reverse (Vr) (Max): 2000 V
Part Status: Obsolete
Operating Temperature - Junction: 150°C
Supplier Device Package: Module
Current - Average Rectified (Io) (per Diode): 261A
Diode Configuration: 1 Pair Series Connection
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
Produkt ist nicht verfügbar
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S25HL512TDPMHI010 002-12345_rev-AF.pdf
S25HL512TDPMHI010
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT SPI/QUAD 16SOIC
DigiKey Programmable: Not Verified
Memory Organization: 64M x 8
Memory Interface: SPI - Quad I/O
Part Status: Active
Supplier Device Package: 16-SOIC
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 512Mbit
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tray
auf Bestellung 183 Stücke:
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2+12.79 EUR
10+11.9 EUR
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S25HL512TDPBHI010 002-12345_rev-AF.pdf
S25HL512TDPBHI010
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT SPI/QUAD 24BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Memory Organization: 64M x 8
Memory Interface: SPI - Quad I/O
Part Status: Active
Supplier Device Package: 24-BGA (8x6)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 512Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
auf Bestellung 267 Stücke:
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2+12.48 EUR
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50+11 EUR
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2EDL8123G3CXTMA1 Infineon-2EDL8X2X-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c82ce566401837ff6a7de184a
2EDL8123G3CXTMA1
Hersteller: Infineon Technologies
Description: IC GATE DRVR HALF-BRIDGE 10VFDFN
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 8V ~ 17V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 120 V
Supplier Device Package: PG-VSON-10-4
Rise / Fall Time (Typ): 45ns, 45ns
Channel Type: Independent
Driven Configuration: High-Side and Low-Side
Number of Drivers: 2
Gate Type: MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 3A, 5A
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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2EDL8123G3CXTMA1 Infineon-2EDL8X2X-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c82ce566401837ff6a7de184a
2EDL8123G3CXTMA1
Hersteller: Infineon Technologies
Description: IC GATE DRVR HALF-BRIDGE 10VFDFN
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 8V ~ 17V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 120 V
Supplier Device Package: PG-VSON-10-4
Rise / Fall Time (Typ): 45ns, 45ns
Channel Type: Independent
Driven Configuration: High-Side and Low-Side
Number of Drivers: 2
Gate Type: MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 3A, 5A
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2224 Stücke:
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10+2.09 EUR
14+1.51 EUR
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TC234LX32F200FABKXUMA1 TriCore_Family_BR-2016_web.pdf?fileId=5546d46159d9a237015a127ab33e0137
TC234LX32F200FABKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 144TQFP
DigiKey Programmable: Not Verified
Number of I/O: 120
Part Status: Active
Supplier Device Package: PG-TQFP-144-27
Peripherals: DMA, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, QSPI
Voltage - Supply (Vcc/Vdd): 3.3V
Core Size: 32-Bit
Data Converters: A/D 24x12b
Core Processor: TriCore™
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 1233 Stücke:
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1+38.77 EUR
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25+29.07 EUR
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TZ800N18KOFB1HPSA2
TZ800N18KOFB1HPSA2
Hersteller: Infineon Technologies
Description: SCR MODULE 1.8KV 1500A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Single
Current - Hold (Ih) (Max): 500 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 35000A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 819 A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Part Status: Active
Current - On State (It (RMS)) (Max): 1500 A
Voltage - Off State: 1.8 kV
Produkt ist nicht verfügbar
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TC222S16F133NACKXUMA1 infineon-aurix-tc2xx-addendum-datasheet-en.pdf
TC222S16F133NACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 80TQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-80-7
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC222S16F133NACKXUMA1 infineon-aurix-tc2xx-addendum-datasheet-en.pdf
TC222S16F133NACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 80TQFP
Packaging: Cut Tape (CT)
Package / Case: 80-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-80-7
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
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1+24.22 EUR
10+19.04 EUR
25+17.74 EUR
100+16.33 EUR
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AUIRFP4310Z AUIRFP4310Z.pdf
AUIRFP4310Z
Hersteller: Infineon Technologies
Description: MOSFET N-CH 100V 128A TO247AC
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 128A (Tc)
Rds On (Max) @ Id, Vgs: 6mOhm @ 77A, 10V
Power Dissipation (Max): 278W (Tc)
Vgs(th) (Max) @ Id: 4V @ 150µA
Supplier Device Package: PG-TO247-3
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 188 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 7120 pF @ 50 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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SK-MB9DF120-001-JLINK
Hersteller: Infineon Technologies
Description: DEV KIT TOOL KIT PWR MGMT
Packaging: Box
Function: CANbus
Type: Interface
Utilized IC / Part: MB9DF120
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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CG8281AA
Hersteller: Infineon Technologies
Description: IC MEMORY FLASH NOR
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CG8281AAT
Hersteller: Infineon Technologies
Description: IC MEMORY FLASH NOR
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9AF001PMC-GFKE1
Hersteller: Infineon Technologies
Description: IC MCU
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
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2+17.11 EUR
10+13.32 EUR
84+11.53 EUR
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CYAT81682-100AA61ZT CYAT8168x.pdf
CYAT81682-100AA61ZT
Hersteller: Infineon Technologies
Description: PSOC BASED - TRUETOUCH
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Touchscreen: 2 Wire Capacitive
Supplier Device Package: 100-TQFP (14x14)
Voltage - Supply: 1.71V ~ 1.95V, 3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Interface: I2C, SPI
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IRFR120NTRRPBF irfr120npbf.pdf?fileId=5546d462533600a40153562d2620204d
IRFR120NTRRPBF
Hersteller: Infineon Technologies
Description: MOSFET N-CH 100V 9.4A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 9.4A (Tc)
Rds On (Max) @ Id, Vgs: 210mOhm @ 5.6A, 10V
Power Dissipation (Max): 48W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: TO-252AA (DPAK)
Part Status: Discontinued at Digi-Key
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 25 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 330 pF @ 25 V
Produkt ist nicht verfügbar
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FS820R08A6P2LBBPSA1 Infineon-FS820R08A6P2LB-DataSheet-v03_03-EN.pdf?fileId=5546d4625fe36784015fe7bf83492945
FS820R08A6P2LBBPSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 820A HYBRID PK DRIVE
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: No
Operating Temperature: 175°C (TJ)
Configuration: Three Phase Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Current - Collector (Ic) (Max): 820 A
Part Status: Active
auf Bestellung 4 Stücke:
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1+963.64 EUR
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FS800R07A2E3BOSA2
Hersteller: Infineon Technologies
Description: IGBT MOD ATV 800A HYBRID PACK2
Vce(on) (Max) @ Vge, Ic: 1.6V @ 15V, 550A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Three Phase Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Input Capacitance (Cies) @ Vce: 52 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 1500 W
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector (Ic) (Max): 700 A
Part Status: Obsolete
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: Yes
Produkt ist nicht verfügbar
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FS200R07A5E3S6BPSA1 Infineon-FS200R07A5E3_S6-DS-v03_00-EN.pdf?fileId=5546d46262b31d2e0163019320f4339d
FS200R07A5E3S6BPSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE HYBRID PACK LIGHT
Input Capacitance (Cies) @ Vce: 13 nF @ 25 V
Current - Collector Cutoff (Max): 100 µA
Power - Max: 630 W
Voltage - Collector Emitter Breakdown (Max): 705 V
Current - Collector (Ic) (Max): 200 A
Part Status: Last Time Buy
IGBT Type: Trench
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 1.7V @ 15V, 200A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Full Bridge Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
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FS820R08A6P2BPSA1 Infineon-FS820R08A6P2-DataSheet-v03_20-EN.pdf?fileId=5546d4626cb27db2016cdda3fdba2f5e
FS820R08A6P2BPSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE PACK DRV HYBRIDD-1
Input Capacitance (Cies) @ Vce: 80 nF @ 50 V
Current - Collector Cutoff (Max): 1 mA
Power - Max: 714 W
Voltage - Collector Emitter Breakdown (Max): 750 V
Current - Collector (Ic) (Max): 820 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: AG-HYBRIDD-1
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 1.35V @ 15V, 450A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Three Phase Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
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FS600R07A2E3BOSA3
Hersteller: Infineon Technologies
Description: MODULE IGBT 600V HYBRID PACK 2
Input Capacitance (Cies) @ Vce: 39 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 1250 W
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector (Ic) (Max): 530 A
Part Status: Obsolete
IGBT Type: Trench Field Stop
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 1.6V @ 15V, 400A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Three Phase
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
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FS400R07A3E3H6BPSA1 Infineon-FS400R07A3E3_H6-DataSheet-v01_20-EN.pdf?fileId=5546d462636cc8fb0163862ed75f130b
FS400R07A3E3H6BPSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 650V 400A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector (Ic) (Max): 400 A
Part Status: Last Time Buy
Supplier Device Package: Module
NTC Thermistor: Yes
Operating Temperature: 175°C (TJ)
Configuration: Three Phase Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
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AUIRFS3206TRL auirfs3206.pdf?fileId=5546d462533600a4015355b6755614b6
AUIRFS3206TRL
Hersteller: Infineon Technologies
Description: MOSFET N-CH 60V 210A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 3mOhm @ 75A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 150µA
Supplier Device Package: D2PAK
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 170 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6540 pF @ 50 V
Grade: Automotive
Qualification: AEC-Q101
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