Produkte > LUMISSIL MICROSYSTEMS > Alle Produkte des Herstellers LUMISSIL MICROSYSTEMS (728) > Seite 13 nach 13
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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| X1600E | Lumissil Microsystems |
Low-power Micro-Processor |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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X1600HN | Lumissil Microsystems |
Description: INTEGRATED APPLICATION PROCESSORPackaging: Tray Package / Case: 159-LFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: XBurst® 1 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 159-BGA (9x9) Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2 Graphics Acceleration: No Display & Interface Controllers: DVP, LCD, MIPI-CSI, RGB Security Features: AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA, SHA-2 Additional Interfaces: AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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X2000 | Lumissil Microsystems |
Description: IC MPU 1.2GHZ 270BGAPackaging: Tray Package / Case: 270-LFBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: XBurst® 2 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 270-BGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 OTG (1) RAM Controllers: LPDDR3 Graphics Acceleration: No Display & Interface Controllers: DVP, LCD, MIPI-CSI, MIPI-DSI Security Features: AES, RSA, TRNG, MD5, SHA, SHA2 Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG Part Status: Active |
auf Bestellung 1192 Stücke: Lieferzeit 10-14 Tag (e) |
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| X2000 | Lumissil Microsystems |
Multi-CPU Multi-App Micro-Processor |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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X2000E | Lumissil Microsystems |
Description: MULTI-CPU HETEROGENEOUS MULTI-APPackaging: Tape & Reel (TR) Package / Case: 270-LFBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: XBurst® 2 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 270-BGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: LPDDR3 Graphics Acceleration: No Display & Interface Controllers: LCD, DVP, MIPI-CSI, MIPI-DSI Security Features: AES, RSA, TRNG, MD5, SHA, SHA2 Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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X2000H | Lumissil Microsystems |
Description: MULTI-CPU HETEROGENEOUS MULTI-APPackaging: Tape & Reel (TR) Package / Case: 270-LFBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: XBurst® 2 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 270-BGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: LPDDR3 Graphics Acceleration: No Display & Interface Controllers: LCD, DVP, MIPI-CSI, MIPI-DSI Security Features: AES, RSA, TRNG, MD5, SHA, SHA2 Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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X2600H | Lumissil Microsystems |
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZPackaging: Cut Tape (CT) Package / Case: 209-TFBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: RISC-V, XBurst® 2 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 209-FBGA (11x11) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2 Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART |
auf Bestellung 1759 Stücke: Lieferzeit 10-14 Tag (e) |
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X2600H | Lumissil Microsystems |
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZPackaging: Tape & Reel (TR) Package / Case: 209-TFBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: RISC-V, XBurst® 2 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 209-FBGA (11x11) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2 Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| X1600E |
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Hersteller: Lumissil Microsystems
Low-power Micro-Processor
Low-power Micro-Processor
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| X1600HN |
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Hersteller: Lumissil Microsystems
Description: INTEGRATED APPLICATION PROCESSOR
Packaging: Tray
Package / Case: 159-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 1
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 159-BGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2
Graphics Acceleration: No
Display & Interface Controllers: DVP, LCD, MIPI-CSI, RGB
Security Features: AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA, SHA-2
Additional Interfaces: AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Description: INTEGRATED APPLICATION PROCESSOR
Packaging: Tray
Package / Case: 159-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 1
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 159-BGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2
Graphics Acceleration: No
Display & Interface Controllers: DVP, LCD, MIPI-CSI, RGB
Security Features: AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA, SHA-2
Additional Interfaces: AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| X2000 |
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Hersteller: Lumissil Microsystems
Description: IC MPU 1.2GHZ 270BGA
Packaging: Tray
Package / Case: 270-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 270-BGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 OTG (1)
RAM Controllers: LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: DVP, LCD, MIPI-CSI, MIPI-DSI
Security Features: AES, RSA, TRNG, MD5, SHA, SHA2
Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
Part Status: Active
Description: IC MPU 1.2GHZ 270BGA
Packaging: Tray
Package / Case: 270-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 270-BGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 OTG (1)
RAM Controllers: LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: DVP, LCD, MIPI-CSI, MIPI-DSI
Security Features: AES, RSA, TRNG, MD5, SHA, SHA2
Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
Part Status: Active
auf Bestellung 1192 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 24.01 EUR |
| 10+ | 19.92 EUR |
| 25+ | 18.63 EUR |
| 100+ | 17.08 EUR |
| 250+ | 16.3 EUR |
| 500+ | 15.82 EUR |
| X2000 |
![]() |
Hersteller: Lumissil Microsystems
Multi-CPU Multi-App Micro-Processor
Multi-CPU Multi-App Micro-Processor
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| X2000E |
![]() |
Hersteller: Lumissil Microsystems
Description: MULTI-CPU HETEROGENEOUS MULTI-AP
Packaging: Tape & Reel (TR)
Package / Case: 270-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 270-BGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD, DVP, MIPI-CSI, MIPI-DSI
Security Features: AES, RSA, TRNG, MD5, SHA, SHA2
Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
Description: MULTI-CPU HETEROGENEOUS MULTI-AP
Packaging: Tape & Reel (TR)
Package / Case: 270-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 270-BGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD, DVP, MIPI-CSI, MIPI-DSI
Security Features: AES, RSA, TRNG, MD5, SHA, SHA2
Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| X2000H |
![]() |
Hersteller: Lumissil Microsystems
Description: MULTI-CPU HETEROGENEOUS MULTI-AP
Packaging: Tape & Reel (TR)
Package / Case: 270-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 270-BGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD, DVP, MIPI-CSI, MIPI-DSI
Security Features: AES, RSA, TRNG, MD5, SHA, SHA2
Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
Description: MULTI-CPU HETEROGENEOUS MULTI-AP
Packaging: Tape & Reel (TR)
Package / Case: 270-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 270-BGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD, DVP, MIPI-CSI, MIPI-DSI
Security Features: AES, RSA, TRNG, MD5, SHA, SHA2
Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| X2600H |
![]() |
Hersteller: Lumissil Microsystems
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ
Packaging: Cut Tape (CT)
Package / Case: 209-TFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: RISC-V, XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 209-FBGA (11x11)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB
Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2
Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ
Packaging: Cut Tape (CT)
Package / Case: 209-TFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: RISC-V, XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 209-FBGA (11x11)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB
Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2
Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
auf Bestellung 1759 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 14.94 EUR |
| 10+ | 12.38 EUR |
| 25+ | 11.53 EUR |
| 100+ | 10.49 EUR |
| 250+ | 9.96 EUR |
| 500+ | 9.62 EUR |
| X2600H |
![]() |
Hersteller: Lumissil Microsystems
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ
Packaging: Tape & Reel (TR)
Package / Case: 209-TFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: RISC-V, XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 209-FBGA (11x11)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB
Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2
Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ
Packaging: Tape & Reel (TR)
Package / Case: 209-TFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: RISC-V, XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 209-FBGA (11x11)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB
Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2
Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH



