Produkte > MICROCHIP (MICROSEMI) > Alle Produkte des Herstellers MICROCHIP (MICROSEMI) (3995) > Seite 66 nach 67
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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| UPGA301AE3/TR13 | MICROCHIP (MICROSEMI) |
 Category: SMD/THT thyristorsDescription: Thyristor; 100V; Igt: 0.2mA; Powermite3; SMD; Ifsm: 100A Mounting: SMD Max. off-state voltage: 100V Case: Powermite3 Max. forward impulse current: 100A Type of thyristor: thyristor Gate current: 0.2mA Anzahl je Verpackung: 5000 Stücke |
Produkt ist nicht verfügbar |
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UPS120EE3/TR7 | MICROCHIP (MICROSEMI) |
Category: SMD Schottky diodes Description: Diode: Schottky rectifying; SMD; 20V; 1A; DO216AA Type of diode: Schottky rectifying Mounting: SMD Case: DO216AA Max. off-state voltage: 20V Max. load current: 2A Max. forward voltage: 0.455V Load current: 1A Semiconductor structure: single diode Max. forward impulse current: 50A |
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UPS120EE3/TR7 | MICROCHIP (MICROSEMI) |
Category: SMD Schottky diodes Description: Diode: Schottky rectifying; SMD; 20V; 1A; DO216AA Type of diode: Schottky rectifying Mounting: SMD Case: DO216AA Max. off-state voltage: 20V Max. load current: 2A Max. forward voltage: 0.455V Load current: 1A Semiconductor structure: single diode Max. forward impulse current: 50A Anzahl je Verpackung: 3000 Stücke |
Produkt ist nicht verfügbar |
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| UPS540E3/TR13 | MICROCHIP (MICROSEMI) |
Category: SMD Schottky diodes Description: Diode: Schottky rectifying; SMD; 40V; 5A; Powermite3 Type of diode: Schottky rectifying Mounting: SMD Max. off-state voltage: 40V Load current: 5A Semiconductor structure: single diode Max. forward voltage: 0.45V Case: Powermite3 Max. forward impulse current: 100A |
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| UPS540E3/TR13 | MICROCHIP (MICROSEMI) |
Category: SMD Schottky diodes Description: Diode: Schottky rectifying; SMD; 40V; 5A; Powermite3 Type of diode: Schottky rectifying Mounting: SMD Max. off-state voltage: 40V Load current: 5A Semiconductor structure: single diode Max. forward voltage: 0.45V Case: Powermite3 Max. forward impulse current: 100A Anzahl je Verpackung: 5000 Stücke |
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USB50424e3/TR7 | MICROCHIP (MICROSEMI) |
Category: Transil diodes - arrays Description: Diode: TVS array; 26.7V; 5A; 500W; unidirectional; SOT143 Mounting: SMD Kind of package: reel; tape Type of diode: TVS array Peak pulse power dissipation: 0.5kW Case: SOT143 Max. off-state voltage: 24V Semiconductor structure: unidirectional Max. forward impulse current: 5A Breakdown voltage: 26.7V Leakage current: 1µA |
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USB50424e3/TR7 | MICROCHIP (MICROSEMI) |
Category: Transil diodes - arrays Description: Diode: TVS array; 26.7V; 5A; 500W; unidirectional; SOT143 Mounting: SMD Kind of package: reel; tape Type of diode: TVS array Peak pulse power dissipation: 0.5kW Case: SOT143 Max. off-state voltage: 24V Semiconductor structure: unidirectional Max. forward impulse current: 5A Breakdown voltage: 26.7V Leakage current: 1µA Anzahl je Verpackung: 3000 Stücke |
Produkt ist nicht verfügbar |
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USB50803C-AE3/TR7 | MICROCHIP (MICROSEMI) |
Category: Transil diodes - arrays Description: Diode: TVS array; 4V; 5A; 500W; bidirectional; SO8; reel,tape Type of diode: TVS array Breakdown voltage: 4V Max. forward impulse current: 5A Peak pulse power dissipation: 0.5kW Semiconductor structure: bidirectional Mounting: SMD Case: SO8 Max. off-state voltage: 3.3V Leakage current: 0.2mA Kind of package: reel; tape |
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USB50803C-AE3/TR7 | MICROCHIP (MICROSEMI) |
Category: Transil diodes - arrays Description: Diode: TVS array; 4V; 5A; 500W; bidirectional; SO8; reel,tape Type of diode: TVS array Breakdown voltage: 4V Max. forward impulse current: 5A Peak pulse power dissipation: 0.5kW Semiconductor structure: bidirectional Mounting: SMD Case: SO8 Max. off-state voltage: 3.3V Leakage current: 0.2mA Kind of package: reel; tape Anzahl je Verpackung: 500 Stücke |
Produkt ist nicht verfügbar |
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USB50812CE3/TR7 | MICROCHIP (MICROSEMI) |
Category: Transil diodes - arrays Description: Diode: TVS array; 13.3V; 5A; 500W; bidirectional; SO8; reel,tape Type of diode: TVS array Case: SO8 Max. off-state voltage: 12V Semiconductor structure: bidirectional Max. forward impulse current: 5A Breakdown voltage: 13.3V Leakage current: 1µA Kind of package: reel; tape Peak pulse power dissipation: 0.5kW Mounting: SMD |
Produkt ist nicht verfügbar |
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USB50812CE3/TR7 | MICROCHIP (MICROSEMI) |
Category: Transil diodes - arrays Description: Diode: TVS array; 13.3V; 5A; 500W; bidirectional; SO8; reel,tape Type of diode: TVS array Case: SO8 Max. off-state voltage: 12V Semiconductor structure: bidirectional Max. forward impulse current: 5A Breakdown voltage: 13.3V Leakage current: 1µA Kind of package: reel; tape Peak pulse power dissipation: 0.5kW Mounting: SMD Anzahl je Verpackung: 500 Stücke |
Produkt ist nicht verfügbar |
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USB50815C-Ae3/TR7 | MICROCHIP (MICROSEMI) |
Category: Transil diodes - arrays Description: Diode: TVS array; 16.7V; 5A; 500W; bidirectional; SO8; reel,tape Type of diode: TVS array Breakdown voltage: 16.7V Max. forward impulse current: 5A Peak pulse power dissipation: 0.5kW Semiconductor structure: bidirectional Mounting: SMD Case: SO8 Max. off-state voltage: 15V Leakage current: 1µA Kind of package: reel; tape |
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USB50815C-Ae3/TR7 | MICROCHIP (MICROSEMI) |
Category: Transil diodes - arrays Description: Diode: TVS array; 16.7V; 5A; 500W; bidirectional; SO8; reel,tape Type of diode: TVS array Breakdown voltage: 16.7V Max. forward impulse current: 5A Peak pulse power dissipation: 0.5kW Semiconductor structure: bidirectional Mounting: SMD Case: SO8 Max. off-state voltage: 15V Leakage current: 1µA Kind of package: reel; tape Anzahl je Verpackung: 500 Stücke |
Produkt ist nicht verfügbar |
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USB50824C-Ae3/TR7 | MICROCHIP (MICROSEMI) |
Category: Transil diodes - arrays Description: Diode: TVS array; 26.7V; 5A; 500W; bidirectional; SO8; reel,tape Mounting: SMD Kind of package: reel; tape Type of diode: TVS array Peak pulse power dissipation: 0.5kW Case: SO8 Max. off-state voltage: 24V Semiconductor structure: bidirectional Max. forward impulse current: 5A Breakdown voltage: 26.7V Leakage current: 1µA |
Produkt ist nicht verfügbar |
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USB50824C-Ae3/TR7 | MICROCHIP (MICROSEMI) |
Category: Transil diodes - arrays Description: Diode: TVS array; 26.7V; 5A; 500W; bidirectional; SO8; reel,tape Mounting: SMD Kind of package: reel; tape Type of diode: TVS array Peak pulse power dissipation: 0.5kW Case: SO8 Max. off-state voltage: 24V Semiconductor structure: bidirectional Max. forward impulse current: 5A Breakdown voltage: 26.7V Leakage current: 1µA Anzahl je Verpackung: 500 Stücke |
Produkt ist nicht verfügbar |
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| VIDEO-DC-MIPI | MICROCHIP (MICROSEMI) |
Category: Microchip development kits Description: Camera module; SmartFusion2 Type of accessories for development kits: camera module Kind of connector: HDMI; LVDS Interface: HDMI; LVDS Manufacturer series: SmartFusion2 development kits accessories features: MIPI CSI-2 sensor module |
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| VIDEO-DC-PRL | MICROCHIP (MICROSEMI) |
Category: Microchip development kits Description: Camera module; SmartFusion2 Interface: HDMI; LVDS Kind of connector: HDMI; LVDS Manufacturer series: SmartFusion2 development kits accessories features: parallel sensor module Type of accessories for development kits: camera module |
Produkt ist nicht verfügbar |
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| VIDEO-DC-SDI | MICROCHIP (MICROSEMI) |
Category: Microchip development kits Description: Dev.kit: Microchip; coaxial BNC-BNC cable,quick start board Interface: DSI; FMC; HDMI; MIPI-CSI2; SDI Kit contents: coaxial BNC-BNC cable; quick start board Type of development kit: Microchip Kind of connector: BNC; HPC FMC |
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| VIDEO-DC-USXGMII | MICROCHIP (MICROSEMI) |
Category: Microchip development kits Description: Dev.kit: Microchip; quick start board Interface: DSI; FMC; HDMI; MIPI-CSI2; PHY; SDI Kit contents: quick start board Type of development kit: Microchip Kind of connector: HPC FMC; RJ45 |
Produkt ist nicht verfügbar |
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| VIDEO-DC-MIPI | MICROCHIP (MICROSEMI) |
Category: Microchip development kits Description: Camera module; SmartFusion2 Type of accessories for development kits: camera module Kind of connector: HDMI; LVDS Interface: HDMI; LVDS Manufacturer series: SmartFusion2 development kits accessories features: MIPI CSI-2 sensor module Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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| VIDEO-DC-PRL | MICROCHIP (MICROSEMI) |
Category: Microchip development kits Description: Camera module; SmartFusion2 Interface: HDMI; LVDS Kind of connector: HDMI; LVDS Manufacturer series: SmartFusion2 development kits accessories features: parallel sensor module Type of accessories for development kits: camera module Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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| VIDEO-DC-SDI | MICROCHIP (MICROSEMI) |
Category: Microchip development kits Description: Dev.kit: Microchip; coaxial BNC-BNC cable,quick start board Interface: DSI; FMC; HDMI; MIPI-CSI2; SDI Kit contents: coaxial BNC-BNC cable; quick start board Type of development kit: Microchip Kind of connector: BNC; HPC FMC Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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| VIDEO-DC-USXGMII | MICROCHIP (MICROSEMI) |
Category: Microchip development kits Description: Dev.kit: Microchip; quick start board Interface: DSI; FMC; HDMI; MIPI-CSI2; PHY; SDI Kit contents: quick start board Type of development kit: Microchip Kind of connector: HPC FMC; RJ45 Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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| VSC8211XVW | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; GMII,MII,RGMII,SGMII; LBGA117; 0÷100°C; Ch: 1 Type of integrated circuit: PoE controller Interface: GMII; MII; RGMII; SGMII Case: LBGA117 Mounting: SMD Operating temperature: 0...100°C Number of channels: 1 |
Produkt ist nicht verfügbar |
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| VSC8211XVW | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; GMII,MII,RGMII,SGMII; LBGA117; 0÷100°C; Ch: 1 Type of integrated circuit: PoE controller Interface: GMII; MII; RGMII; SGMII Case: LBGA117 Mounting: SMD Operating temperature: 0...100°C Number of channels: 1 Anzahl je Verpackung: 154 Stücke |
Produkt ist nicht verfügbar |
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VSC8221XHH | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; SGMII; TFBGA100; 0÷100°C; Ch: 1; 3.3VDC Type of integrated circuit: PoE controller Interface: SGMII Case: TFBGA100 Number of channels: 1 Supply voltage: 3.3V DC Mounting: SMD Operating temperature: 0...100°C |
Produkt ist nicht verfügbar |
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VSC8221XHH | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; SGMII; TFBGA100; 0÷100°C; Ch: 1; 3.3VDC Type of integrated circuit: PoE controller Interface: SGMII Case: TFBGA100 Number of channels: 1 Supply voltage: 3.3V DC Mounting: SMD Operating temperature: 0...100°C Anzahl je Verpackung: 260 Stücke |
Produkt ist nicht verfügbar |
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| VSC8224XHG | MICROCHIP (MICROSEMI) |
VSC8224XHG ETHERNET interfaces -integrated circuits |
Produkt ist nicht verfügbar |
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| VSC8244XHG | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; RGMII; HSBGA260; 0÷100°C; Ch: 4 Operating temperature: 0...100°C Interface: RGMII Type of integrated circuit: PoE controller Number of channels: 4 Mounting: SMD Case: HSBGA260 |
Produkt ist nicht verfügbar |
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| VSC8244XHG | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; RGMII; HSBGA260; 0÷100°C; Ch: 4 Operating temperature: 0...100°C Interface: RGMII Type of integrated circuit: PoE controller Number of channels: 4 Mounting: SMD Case: HSBGA260 Anzahl je Verpackung: 84 Stücke |
Produkt ist nicht verfügbar |
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| VSC8256YMR-01 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; RGMII; HFCBGA256; -40÷110°C; Ch: 4 Type of integrated circuit: PoE controller Interface: RGMII Case: HFCBGA256 Mounting: SMD Operating temperature: -40...110°C Number of channels: 4 |
Produkt ist nicht verfügbar |
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| VSC8256YMR-01 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; RGMII; HFCBGA256; -40÷110°C; Ch: 4 Type of integrated circuit: PoE controller Interface: RGMII Case: HFCBGA256 Mounting: SMD Operating temperature: -40...110°C Number of channels: 4 Anzahl je Verpackung: 90 Stücke |
Produkt ist nicht verfügbar |
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| VSC8257YMR-01 | MICROCHIP (MICROSEMI) | VSC8257YMR-01 ETHERNET interfaces -integrated circuits |
Produkt ist nicht verfügbar |
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| VSC8479YHQ-02 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; XFI; HFCBGA195; -40÷90°C; Ch: 1 Type of integrated circuit: PoE controller Interface: XFI Case: HFCBGA195 Mounting: SMD Operating temperature: -40...90°C Number of channels: 1 |
Produkt ist nicht verfügbar |
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| VSC8479YHQ-01 | MICROCHIP (MICROSEMI) | VSC8479YHQ-01 ETHERNET interfaces -integrated circuits |
Produkt ist nicht verfügbar |
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| VSC8479YHQ-02 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; XFI; HFCBGA195; -40÷90°C; Ch: 1 Type of integrated circuit: PoE controller Interface: XFI Case: HFCBGA195 Mounting: SMD Operating temperature: -40...90°C Number of channels: 1 Anzahl je Verpackung: 168 Stücke |
Produkt ist nicht verfügbar |
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| VSC8479YYY | MICROCHIP (MICROSEMI) |
VSC8479YYY ETHERNET interfaces -integrated circuits |
Produkt ist nicht verfügbar |
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| VSC8486YJB-11 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; XAUI; FCCSP144; -40÷85°C; Ch: 1 Mounting: SMD Interface: XAUI Operating temperature: -40...85°C Case: FCCSP144 Type of integrated circuit: PoE controller Number of channels: 1 |
Produkt ist nicht verfügbar |
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| VSC8486YJB-11 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; XAUI; FCCSP144; -40÷85°C; Ch: 1 Mounting: SMD Interface: XAUI Operating temperature: -40...85°C Case: FCCSP144 Type of integrated circuit: PoE controller Number of channels: 1 Anzahl je Verpackung: 160 Stücke |
Produkt ist nicht verfügbar |
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| VSC8486YSN-04 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; XAUI; HFCBGA256; -40÷85°C; Ch: 1 Mounting: SMD Interface: XAUI Operating temperature: -40...85°C Case: HFCBGA256 Type of integrated circuit: PoE controller Number of channels: 1 |
Produkt ist nicht verfügbar |
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| VSC8486YSN-04 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; XAUI; HFCBGA256; -40÷85°C; Ch: 1 Mounting: SMD Interface: XAUI Operating temperature: -40...85°C Case: HFCBGA256 Type of integrated circuit: PoE controller Number of channels: 1 Anzahl je Verpackung: 90 Stücke |
Produkt ist nicht verfügbar |
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| VSC8489YJU-02 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; XAUI; FCCSP196; -40÷110°C; Ch: 2 Type of integrated circuit: PoE controller Interface: XAUI Case: FCCSP196 Mounting: SMD Operating temperature: -40...110°C Number of channels: 2 |
Produkt ist nicht verfügbar |
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| VSC8489YJU-16 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; XAUI; FCCSP196; -40÷110°C; Ch: 2 Type of integrated circuit: PoE controller Interface: XAUI Case: FCCSP196 Mounting: SMD Operating temperature: -40...110°C Number of channels: 2 |
Produkt ist nicht verfügbar |
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| VSC8489YJU-17 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; XAUI; FCCSP196; -40÷110°C; Ch: 2 Type of integrated circuit: PoE controller Interface: XAUI Case: FCCSP196 Mounting: SMD Operating temperature: -40...110°C Number of channels: 2 |
Produkt ist nicht verfügbar |
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| VSC8489YJU-02 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; XAUI; FCCSP196; -40÷110°C; Ch: 2 Type of integrated circuit: PoE controller Interface: XAUI Case: FCCSP196 Mounting: SMD Operating temperature: -40...110°C Number of channels: 2 Anzahl je Verpackung: 126 Stücke |
Produkt ist nicht verfügbar |
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| VSC8489YJU-16 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; XAUI; FCCSP196; -40÷110°C; Ch: 2 Type of integrated circuit: PoE controller Interface: XAUI Case: FCCSP196 Mounting: SMD Operating temperature: -40...110°C Number of channels: 2 Anzahl je Verpackung: 126 Stücke |
Produkt ist nicht verfügbar |
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| VSC8489YJU-17 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; XAUI; FCCSP196; -40÷110°C; Ch: 2 Type of integrated circuit: PoE controller Interface: XAUI Case: FCCSP196 Mounting: SMD Operating temperature: -40...110°C Number of channels: 2 Anzahl je Verpackung: 126 Stücke |
Produkt ist nicht verfügbar |
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| VSC8501XML | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 1 Operating temperature: -40...125°C Mounting: SMD Type of integrated circuit: PoE controller Case: QFN135 Interface: GMII; MII; RGMII Number of channels: 1 |
Produkt ist nicht verfügbar |
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| VSC8501XML | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 1 Operating temperature: -40...125°C Mounting: SMD Type of integrated circuit: PoE controller Case: QFN135 Interface: GMII; MII; RGMII Number of channels: 1 Anzahl je Verpackung: 152 Stücke |
Produkt ist nicht verfügbar |
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| VSC8501XML-03 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 1 Operating temperature: -40...125°C Mounting: SMD Type of integrated circuit: PoE controller Case: QFN135 Interface: GMII; MII; RGMII Number of channels: 1 |
Produkt ist nicht verfügbar |
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| VSC8501XML-03 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 1 Operating temperature: -40...125°C Mounting: SMD Type of integrated circuit: PoE controller Case: QFN135 Interface: GMII; MII; RGMII Number of channels: 1 Anzahl je Verpackung: 152 Stücke |
Produkt ist nicht verfügbar |
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| VSC8502XML | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 2 Mounting: SMD Case: QFN135 Operating temperature: -40...125°C Type of integrated circuit: PoE controller Interface: GMII; MII; RGMII Number of channels: 2 |
Produkt ist nicht verfügbar |
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| VSC8502XML | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 2 Mounting: SMD Case: QFN135 Operating temperature: -40...125°C Type of integrated circuit: PoE controller Interface: GMII; MII; RGMII Number of channels: 2 Anzahl je Verpackung: 152 Stücke |
Produkt ist nicht verfügbar |
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| VSC8502XML-03 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 2 Mounting: SMD Case: QFN135 Operating temperature: -40...125°C Type of integrated circuit: PoE controller Interface: GMII; MII; RGMII Number of channels: 2 |
Produkt ist nicht verfügbar |
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| VSC8502XML-03 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 2 Mounting: SMD Case: QFN135 Operating temperature: -40...125°C Type of integrated circuit: PoE controller Interface: GMII; MII; RGMII Number of channels: 2 Anzahl je Verpackung: 152 Stücke |
Produkt ist nicht verfügbar |
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| VSC8504XKS-02 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; QSGMII,SGMII; PBGA256; -40÷125°C; Ch: 4 Type of integrated circuit: PoE controller Interface: QSGMII; SGMII Case: PBGA256 Mounting: SMD Operating temperature: -40...125°C Number of channels: 4 |
Produkt ist nicht verfügbar |
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| VSC8504XKS-05 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; QSGMII,SGMII; PBGA256; -40÷125°C; Ch: 4 Type of integrated circuit: PoE controller Interface: QSGMII; SGMII Case: PBGA256 Mounting: SMD Operating temperature: -40...125°C Number of channels: 4 |
Produkt ist nicht verfügbar |
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| VSC8504XKS-02 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; QSGMII,SGMII; PBGA256; -40÷125°C; Ch: 4 Type of integrated circuit: PoE controller Interface: QSGMII; SGMII Case: PBGA256 Mounting: SMD Operating temperature: -40...125°C Number of channels: 4 |
Produkt ist nicht verfügbar |
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| VSC8504XKS-05 | MICROCHIP (MICROSEMI) |
Category: ETHERNET interfaces -integrated circuits Description: IC: PoE controller; QSGMII,SGMII; PBGA256; -40÷125°C; Ch: 4 Type of integrated circuit: PoE controller Interface: QSGMII; SGMII Case: PBGA256 Mounting: SMD Operating temperature: -40...125°C Number of channels: 4 |
Produkt ist nicht verfügbar |
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| VSC8512XJG-02 | MICROCHIP (MICROSEMI) |
VSC8512XJG-02 ETHERNET interfaces -integrated circuits |
Produkt ist nicht verfügbar |
| UPGA301AE3/TR13 |
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Hersteller: MICROCHIP (MICROSEMI)
Category: SMD/THT thyristors
Description: Thyristor; 100V; Igt: 0.2mA; Powermite3; SMD; Ifsm: 100A
Mounting: SMD
Max. off-state voltage: 100V
Case: Powermite3
Max. forward impulse current: 100A
Type of thyristor: thyristor
Gate current: 0.2mA
Anzahl je Verpackung: 5000 Stücke
Category: SMD/THT thyristors
Description: Thyristor; 100V; Igt: 0.2mA; Powermite3; SMD; Ifsm: 100A
Mounting: SMD
Max. off-state voltage: 100V
Case: Powermite3
Max. forward impulse current: 100A
Type of thyristor: thyristor
Gate current: 0.2mA
Anzahl je Verpackung: 5000 Stücke
Produkt ist nicht verfügbar
| UPS120EE3/TR7 |
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Hersteller: MICROCHIP (MICROSEMI)
Category: SMD Schottky diodes
Description: Diode: Schottky rectifying; SMD; 20V; 1A; DO216AA
Type of diode: Schottky rectifying
Mounting: SMD
Case: DO216AA
Max. off-state voltage: 20V
Max. load current: 2A
Max. forward voltage: 0.455V
Load current: 1A
Semiconductor structure: single diode
Max. forward impulse current: 50A
Category: SMD Schottky diodes
Description: Diode: Schottky rectifying; SMD; 20V; 1A; DO216AA
Type of diode: Schottky rectifying
Mounting: SMD
Case: DO216AA
Max. off-state voltage: 20V
Max. load current: 2A
Max. forward voltage: 0.455V
Load current: 1A
Semiconductor structure: single diode
Max. forward impulse current: 50A
Produkt ist nicht verfügbar
| UPS120EE3/TR7 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: SMD Schottky diodes
Description: Diode: Schottky rectifying; SMD; 20V; 1A; DO216AA
Type of diode: Schottky rectifying
Mounting: SMD
Case: DO216AA
Max. off-state voltage: 20V
Max. load current: 2A
Max. forward voltage: 0.455V
Load current: 1A
Semiconductor structure: single diode
Max. forward impulse current: 50A
Anzahl je Verpackung: 3000 Stücke
Category: SMD Schottky diodes
Description: Diode: Schottky rectifying; SMD; 20V; 1A; DO216AA
Type of diode: Schottky rectifying
Mounting: SMD
Case: DO216AA
Max. off-state voltage: 20V
Max. load current: 2A
Max. forward voltage: 0.455V
Load current: 1A
Semiconductor structure: single diode
Max. forward impulse current: 50A
Anzahl je Verpackung: 3000 Stücke
Produkt ist nicht verfügbar
| UPS540E3/TR13 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: SMD Schottky diodes
Description: Diode: Schottky rectifying; SMD; 40V; 5A; Powermite3
Type of diode: Schottky rectifying
Mounting: SMD
Max. off-state voltage: 40V
Load current: 5A
Semiconductor structure: single diode
Max. forward voltage: 0.45V
Case: Powermite3
Max. forward impulse current: 100A
Category: SMD Schottky diodes
Description: Diode: Schottky rectifying; SMD; 40V; 5A; Powermite3
Type of diode: Schottky rectifying
Mounting: SMD
Max. off-state voltage: 40V
Load current: 5A
Semiconductor structure: single diode
Max. forward voltage: 0.45V
Case: Powermite3
Max. forward impulse current: 100A
Produkt ist nicht verfügbar
| UPS540E3/TR13 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: SMD Schottky diodes
Description: Diode: Schottky rectifying; SMD; 40V; 5A; Powermite3
Type of diode: Schottky rectifying
Mounting: SMD
Max. off-state voltage: 40V
Load current: 5A
Semiconductor structure: single diode
Max. forward voltage: 0.45V
Case: Powermite3
Max. forward impulse current: 100A
Anzahl je Verpackung: 5000 Stücke
Category: SMD Schottky diodes
Description: Diode: Schottky rectifying; SMD; 40V; 5A; Powermite3
Type of diode: Schottky rectifying
Mounting: SMD
Max. off-state voltage: 40V
Load current: 5A
Semiconductor structure: single diode
Max. forward voltage: 0.45V
Case: Powermite3
Max. forward impulse current: 100A
Anzahl je Verpackung: 5000 Stücke
Produkt ist nicht verfügbar
| USB50424e3/TR7 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: Transil diodes - arrays
Description: Diode: TVS array; 26.7V; 5A; 500W; unidirectional; SOT143
Mounting: SMD
Kind of package: reel; tape
Type of diode: TVS array
Peak pulse power dissipation: 0.5kW
Case: SOT143
Max. off-state voltage: 24V
Semiconductor structure: unidirectional
Max. forward impulse current: 5A
Breakdown voltage: 26.7V
Leakage current: 1µA
Category: Transil diodes - arrays
Description: Diode: TVS array; 26.7V; 5A; 500W; unidirectional; SOT143
Mounting: SMD
Kind of package: reel; tape
Type of diode: TVS array
Peak pulse power dissipation: 0.5kW
Case: SOT143
Max. off-state voltage: 24V
Semiconductor structure: unidirectional
Max. forward impulse current: 5A
Breakdown voltage: 26.7V
Leakage current: 1µA
Produkt ist nicht verfügbar
| USB50424e3/TR7 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: Transil diodes - arrays
Description: Diode: TVS array; 26.7V; 5A; 500W; unidirectional; SOT143
Mounting: SMD
Kind of package: reel; tape
Type of diode: TVS array
Peak pulse power dissipation: 0.5kW
Case: SOT143
Max. off-state voltage: 24V
Semiconductor structure: unidirectional
Max. forward impulse current: 5A
Breakdown voltage: 26.7V
Leakage current: 1µA
Anzahl je Verpackung: 3000 Stücke
Category: Transil diodes - arrays
Description: Diode: TVS array; 26.7V; 5A; 500W; unidirectional; SOT143
Mounting: SMD
Kind of package: reel; tape
Type of diode: TVS array
Peak pulse power dissipation: 0.5kW
Case: SOT143
Max. off-state voltage: 24V
Semiconductor structure: unidirectional
Max. forward impulse current: 5A
Breakdown voltage: 26.7V
Leakage current: 1µA
Anzahl je Verpackung: 3000 Stücke
Produkt ist nicht verfügbar
| USB50803C-AE3/TR7 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: Transil diodes - arrays
Description: Diode: TVS array; 4V; 5A; 500W; bidirectional; SO8; reel,tape
Type of diode: TVS array
Breakdown voltage: 4V
Max. forward impulse current: 5A
Peak pulse power dissipation: 0.5kW
Semiconductor structure: bidirectional
Mounting: SMD
Case: SO8
Max. off-state voltage: 3.3V
Leakage current: 0.2mA
Kind of package: reel; tape
Category: Transil diodes - arrays
Description: Diode: TVS array; 4V; 5A; 500W; bidirectional; SO8; reel,tape
Type of diode: TVS array
Breakdown voltage: 4V
Max. forward impulse current: 5A
Peak pulse power dissipation: 0.5kW
Semiconductor structure: bidirectional
Mounting: SMD
Case: SO8
Max. off-state voltage: 3.3V
Leakage current: 0.2mA
Kind of package: reel; tape
Produkt ist nicht verfügbar
| USB50803C-AE3/TR7 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: Transil diodes - arrays
Description: Diode: TVS array; 4V; 5A; 500W; bidirectional; SO8; reel,tape
Type of diode: TVS array
Breakdown voltage: 4V
Max. forward impulse current: 5A
Peak pulse power dissipation: 0.5kW
Semiconductor structure: bidirectional
Mounting: SMD
Case: SO8
Max. off-state voltage: 3.3V
Leakage current: 0.2mA
Kind of package: reel; tape
Anzahl je Verpackung: 500 Stücke
Category: Transil diodes - arrays
Description: Diode: TVS array; 4V; 5A; 500W; bidirectional; SO8; reel,tape
Type of diode: TVS array
Breakdown voltage: 4V
Max. forward impulse current: 5A
Peak pulse power dissipation: 0.5kW
Semiconductor structure: bidirectional
Mounting: SMD
Case: SO8
Max. off-state voltage: 3.3V
Leakage current: 0.2mA
Kind of package: reel; tape
Anzahl je Verpackung: 500 Stücke
Produkt ist nicht verfügbar
| USB50812CE3/TR7 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: Transil diodes - arrays
Description: Diode: TVS array; 13.3V; 5A; 500W; bidirectional; SO8; reel,tape
Type of diode: TVS array
Case: SO8
Max. off-state voltage: 12V
Semiconductor structure: bidirectional
Max. forward impulse current: 5A
Breakdown voltage: 13.3V
Leakage current: 1µA
Kind of package: reel; tape
Peak pulse power dissipation: 0.5kW
Mounting: SMD
Category: Transil diodes - arrays
Description: Diode: TVS array; 13.3V; 5A; 500W; bidirectional; SO8; reel,tape
Type of diode: TVS array
Case: SO8
Max. off-state voltage: 12V
Semiconductor structure: bidirectional
Max. forward impulse current: 5A
Breakdown voltage: 13.3V
Leakage current: 1µA
Kind of package: reel; tape
Peak pulse power dissipation: 0.5kW
Mounting: SMD
Produkt ist nicht verfügbar
| USB50812CE3/TR7 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: Transil diodes - arrays
Description: Diode: TVS array; 13.3V; 5A; 500W; bidirectional; SO8; reel,tape
Type of diode: TVS array
Case: SO8
Max. off-state voltage: 12V
Semiconductor structure: bidirectional
Max. forward impulse current: 5A
Breakdown voltage: 13.3V
Leakage current: 1µA
Kind of package: reel; tape
Peak pulse power dissipation: 0.5kW
Mounting: SMD
Anzahl je Verpackung: 500 Stücke
Category: Transil diodes - arrays
Description: Diode: TVS array; 13.3V; 5A; 500W; bidirectional; SO8; reel,tape
Type of diode: TVS array
Case: SO8
Max. off-state voltage: 12V
Semiconductor structure: bidirectional
Max. forward impulse current: 5A
Breakdown voltage: 13.3V
Leakage current: 1µA
Kind of package: reel; tape
Peak pulse power dissipation: 0.5kW
Mounting: SMD
Anzahl je Verpackung: 500 Stücke
Produkt ist nicht verfügbar
| USB50815C-Ae3/TR7 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: Transil diodes - arrays
Description: Diode: TVS array; 16.7V; 5A; 500W; bidirectional; SO8; reel,tape
Type of diode: TVS array
Breakdown voltage: 16.7V
Max. forward impulse current: 5A
Peak pulse power dissipation: 0.5kW
Semiconductor structure: bidirectional
Mounting: SMD
Case: SO8
Max. off-state voltage: 15V
Leakage current: 1µA
Kind of package: reel; tape
Category: Transil diodes - arrays
Description: Diode: TVS array; 16.7V; 5A; 500W; bidirectional; SO8; reel,tape
Type of diode: TVS array
Breakdown voltage: 16.7V
Max. forward impulse current: 5A
Peak pulse power dissipation: 0.5kW
Semiconductor structure: bidirectional
Mounting: SMD
Case: SO8
Max. off-state voltage: 15V
Leakage current: 1µA
Kind of package: reel; tape
Produkt ist nicht verfügbar
| USB50815C-Ae3/TR7 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: Transil diodes - arrays
Description: Diode: TVS array; 16.7V; 5A; 500W; bidirectional; SO8; reel,tape
Type of diode: TVS array
Breakdown voltage: 16.7V
Max. forward impulse current: 5A
Peak pulse power dissipation: 0.5kW
Semiconductor structure: bidirectional
Mounting: SMD
Case: SO8
Max. off-state voltage: 15V
Leakage current: 1µA
Kind of package: reel; tape
Anzahl je Verpackung: 500 Stücke
Category: Transil diodes - arrays
Description: Diode: TVS array; 16.7V; 5A; 500W; bidirectional; SO8; reel,tape
Type of diode: TVS array
Breakdown voltage: 16.7V
Max. forward impulse current: 5A
Peak pulse power dissipation: 0.5kW
Semiconductor structure: bidirectional
Mounting: SMD
Case: SO8
Max. off-state voltage: 15V
Leakage current: 1µA
Kind of package: reel; tape
Anzahl je Verpackung: 500 Stücke
Produkt ist nicht verfügbar
| USB50824C-Ae3/TR7 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: Transil diodes - arrays
Description: Diode: TVS array; 26.7V; 5A; 500W; bidirectional; SO8; reel,tape
Mounting: SMD
Kind of package: reel; tape
Type of diode: TVS array
Peak pulse power dissipation: 0.5kW
Case: SO8
Max. off-state voltage: 24V
Semiconductor structure: bidirectional
Max. forward impulse current: 5A
Breakdown voltage: 26.7V
Leakage current: 1µA
Category: Transil diodes - arrays
Description: Diode: TVS array; 26.7V; 5A; 500W; bidirectional; SO8; reel,tape
Mounting: SMD
Kind of package: reel; tape
Type of diode: TVS array
Peak pulse power dissipation: 0.5kW
Case: SO8
Max. off-state voltage: 24V
Semiconductor structure: bidirectional
Max. forward impulse current: 5A
Breakdown voltage: 26.7V
Leakage current: 1µA
Produkt ist nicht verfügbar
| USB50824C-Ae3/TR7 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: Transil diodes - arrays
Description: Diode: TVS array; 26.7V; 5A; 500W; bidirectional; SO8; reel,tape
Mounting: SMD
Kind of package: reel; tape
Type of diode: TVS array
Peak pulse power dissipation: 0.5kW
Case: SO8
Max. off-state voltage: 24V
Semiconductor structure: bidirectional
Max. forward impulse current: 5A
Breakdown voltage: 26.7V
Leakage current: 1µA
Anzahl je Verpackung: 500 Stücke
Category: Transil diodes - arrays
Description: Diode: TVS array; 26.7V; 5A; 500W; bidirectional; SO8; reel,tape
Mounting: SMD
Kind of package: reel; tape
Type of diode: TVS array
Peak pulse power dissipation: 0.5kW
Case: SO8
Max. off-state voltage: 24V
Semiconductor structure: bidirectional
Max. forward impulse current: 5A
Breakdown voltage: 26.7V
Leakage current: 1µA
Anzahl je Verpackung: 500 Stücke
Produkt ist nicht verfügbar
| VIDEO-DC-MIPI |
Hersteller: MICROCHIP (MICROSEMI)
Category: Microchip development kits
Description: Camera module; SmartFusion2
Type of accessories for development kits: camera module
Kind of connector: HDMI; LVDS
Interface: HDMI; LVDS
Manufacturer series: SmartFusion2
development kits accessories features: MIPI CSI-2 sensor module
Category: Microchip development kits
Description: Camera module; SmartFusion2
Type of accessories for development kits: camera module
Kind of connector: HDMI; LVDS
Interface: HDMI; LVDS
Manufacturer series: SmartFusion2
development kits accessories features: MIPI CSI-2 sensor module
Produkt ist nicht verfügbar
| VIDEO-DC-PRL |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: Microchip development kits
Description: Camera module; SmartFusion2
Interface: HDMI; LVDS
Kind of connector: HDMI; LVDS
Manufacturer series: SmartFusion2
development kits accessories features: parallel sensor module
Type of accessories for development kits: camera module
Category: Microchip development kits
Description: Camera module; SmartFusion2
Interface: HDMI; LVDS
Kind of connector: HDMI; LVDS
Manufacturer series: SmartFusion2
development kits accessories features: parallel sensor module
Type of accessories for development kits: camera module
Produkt ist nicht verfügbar
| VIDEO-DC-SDI |
Hersteller: MICROCHIP (MICROSEMI)
Category: Microchip development kits
Description: Dev.kit: Microchip; coaxial BNC-BNC cable,quick start board
Interface: DSI; FMC; HDMI; MIPI-CSI2; SDI
Kit contents: coaxial BNC-BNC cable; quick start board
Type of development kit: Microchip
Kind of connector: BNC; HPC FMC
Category: Microchip development kits
Description: Dev.kit: Microchip; coaxial BNC-BNC cable,quick start board
Interface: DSI; FMC; HDMI; MIPI-CSI2; SDI
Kit contents: coaxial BNC-BNC cable; quick start board
Type of development kit: Microchip
Kind of connector: BNC; HPC FMC
Produkt ist nicht verfügbar
| VIDEO-DC-USXGMII |
Hersteller: MICROCHIP (MICROSEMI)
Category: Microchip development kits
Description: Dev.kit: Microchip; quick start board
Interface: DSI; FMC; HDMI; MIPI-CSI2; PHY; SDI
Kit contents: quick start board
Type of development kit: Microchip
Kind of connector: HPC FMC; RJ45
Category: Microchip development kits
Description: Dev.kit: Microchip; quick start board
Interface: DSI; FMC; HDMI; MIPI-CSI2; PHY; SDI
Kit contents: quick start board
Type of development kit: Microchip
Kind of connector: HPC FMC; RJ45
Produkt ist nicht verfügbar
| VIDEO-DC-MIPI |
Hersteller: MICROCHIP (MICROSEMI)
Category: Microchip development kits
Description: Camera module; SmartFusion2
Type of accessories for development kits: camera module
Kind of connector: HDMI; LVDS
Interface: HDMI; LVDS
Manufacturer series: SmartFusion2
development kits accessories features: MIPI CSI-2 sensor module
Anzahl je Verpackung: 1 Stücke
Category: Microchip development kits
Description: Camera module; SmartFusion2
Type of accessories for development kits: camera module
Kind of connector: HDMI; LVDS
Interface: HDMI; LVDS
Manufacturer series: SmartFusion2
development kits accessories features: MIPI CSI-2 sensor module
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
| VIDEO-DC-PRL |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: Microchip development kits
Description: Camera module; SmartFusion2
Interface: HDMI; LVDS
Kind of connector: HDMI; LVDS
Manufacturer series: SmartFusion2
development kits accessories features: parallel sensor module
Type of accessories for development kits: camera module
Anzahl je Verpackung: 1 Stücke
Category: Microchip development kits
Description: Camera module; SmartFusion2
Interface: HDMI; LVDS
Kind of connector: HDMI; LVDS
Manufacturer series: SmartFusion2
development kits accessories features: parallel sensor module
Type of accessories for development kits: camera module
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
| VIDEO-DC-SDI |
Hersteller: MICROCHIP (MICROSEMI)
Category: Microchip development kits
Description: Dev.kit: Microchip; coaxial BNC-BNC cable,quick start board
Interface: DSI; FMC; HDMI; MIPI-CSI2; SDI
Kit contents: coaxial BNC-BNC cable; quick start board
Type of development kit: Microchip
Kind of connector: BNC; HPC FMC
Anzahl je Verpackung: 1 Stücke
Category: Microchip development kits
Description: Dev.kit: Microchip; coaxial BNC-BNC cable,quick start board
Interface: DSI; FMC; HDMI; MIPI-CSI2; SDI
Kit contents: coaxial BNC-BNC cable; quick start board
Type of development kit: Microchip
Kind of connector: BNC; HPC FMC
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
| VIDEO-DC-USXGMII |
Hersteller: MICROCHIP (MICROSEMI)
Category: Microchip development kits
Description: Dev.kit: Microchip; quick start board
Interface: DSI; FMC; HDMI; MIPI-CSI2; PHY; SDI
Kit contents: quick start board
Type of development kit: Microchip
Kind of connector: HPC FMC; RJ45
Anzahl je Verpackung: 1 Stücke
Category: Microchip development kits
Description: Dev.kit: Microchip; quick start board
Interface: DSI; FMC; HDMI; MIPI-CSI2; PHY; SDI
Kit contents: quick start board
Type of development kit: Microchip
Kind of connector: HPC FMC; RJ45
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
| VSC8211XVW |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; GMII,MII,RGMII,SGMII; LBGA117; 0÷100°C; Ch: 1
Type of integrated circuit: PoE controller
Interface: GMII; MII; RGMII; SGMII
Case: LBGA117
Mounting: SMD
Operating temperature: 0...100°C
Number of channels: 1
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; GMII,MII,RGMII,SGMII; LBGA117; 0÷100°C; Ch: 1
Type of integrated circuit: PoE controller
Interface: GMII; MII; RGMII; SGMII
Case: LBGA117
Mounting: SMD
Operating temperature: 0...100°C
Number of channels: 1
Produkt ist nicht verfügbar
| VSC8211XVW |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; GMII,MII,RGMII,SGMII; LBGA117; 0÷100°C; Ch: 1
Type of integrated circuit: PoE controller
Interface: GMII; MII; RGMII; SGMII
Case: LBGA117
Mounting: SMD
Operating temperature: 0...100°C
Number of channels: 1
Anzahl je Verpackung: 154 Stücke
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; GMII,MII,RGMII,SGMII; LBGA117; 0÷100°C; Ch: 1
Type of integrated circuit: PoE controller
Interface: GMII; MII; RGMII; SGMII
Case: LBGA117
Mounting: SMD
Operating temperature: 0...100°C
Number of channels: 1
Anzahl je Verpackung: 154 Stücke
Produkt ist nicht verfügbar
| VSC8221XHH |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; SGMII; TFBGA100; 0÷100°C; Ch: 1; 3.3VDC
Type of integrated circuit: PoE controller
Interface: SGMII
Case: TFBGA100
Number of channels: 1
Supply voltage: 3.3V DC
Mounting: SMD
Operating temperature: 0...100°C
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; SGMII; TFBGA100; 0÷100°C; Ch: 1; 3.3VDC
Type of integrated circuit: PoE controller
Interface: SGMII
Case: TFBGA100
Number of channels: 1
Supply voltage: 3.3V DC
Mounting: SMD
Operating temperature: 0...100°C
Produkt ist nicht verfügbar
| VSC8221XHH |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; SGMII; TFBGA100; 0÷100°C; Ch: 1; 3.3VDC
Type of integrated circuit: PoE controller
Interface: SGMII
Case: TFBGA100
Number of channels: 1
Supply voltage: 3.3V DC
Mounting: SMD
Operating temperature: 0...100°C
Anzahl je Verpackung: 260 Stücke
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; SGMII; TFBGA100; 0÷100°C; Ch: 1; 3.3VDC
Type of integrated circuit: PoE controller
Interface: SGMII
Case: TFBGA100
Number of channels: 1
Supply voltage: 3.3V DC
Mounting: SMD
Operating temperature: 0...100°C
Anzahl je Verpackung: 260 Stücke
Produkt ist nicht verfügbar
| VSC8224XHG |
|
Hersteller: MICROCHIP (MICROSEMI)
VSC8224XHG ETHERNET interfaces -integrated circuits
VSC8224XHG ETHERNET interfaces -integrated circuits
Produkt ist nicht verfügbar
| VSC8244XHG |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; RGMII; HSBGA260; 0÷100°C; Ch: 4
Operating temperature: 0...100°C
Interface: RGMII
Type of integrated circuit: PoE controller
Number of channels: 4
Mounting: SMD
Case: HSBGA260
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; RGMII; HSBGA260; 0÷100°C; Ch: 4
Operating temperature: 0...100°C
Interface: RGMII
Type of integrated circuit: PoE controller
Number of channels: 4
Mounting: SMD
Case: HSBGA260
Produkt ist nicht verfügbar
| VSC8244XHG |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; RGMII; HSBGA260; 0÷100°C; Ch: 4
Operating temperature: 0...100°C
Interface: RGMII
Type of integrated circuit: PoE controller
Number of channels: 4
Mounting: SMD
Case: HSBGA260
Anzahl je Verpackung: 84 Stücke
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; RGMII; HSBGA260; 0÷100°C; Ch: 4
Operating temperature: 0...100°C
Interface: RGMII
Type of integrated circuit: PoE controller
Number of channels: 4
Mounting: SMD
Case: HSBGA260
Anzahl je Verpackung: 84 Stücke
Produkt ist nicht verfügbar
| VSC8256YMR-01 |
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; RGMII; HFCBGA256; -40÷110°C; Ch: 4
Type of integrated circuit: PoE controller
Interface: RGMII
Case: HFCBGA256
Mounting: SMD
Operating temperature: -40...110°C
Number of channels: 4
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; RGMII; HFCBGA256; -40÷110°C; Ch: 4
Type of integrated circuit: PoE controller
Interface: RGMII
Case: HFCBGA256
Mounting: SMD
Operating temperature: -40...110°C
Number of channels: 4
Produkt ist nicht verfügbar
| VSC8256YMR-01 |
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; RGMII; HFCBGA256; -40÷110°C; Ch: 4
Type of integrated circuit: PoE controller
Interface: RGMII
Case: HFCBGA256
Mounting: SMD
Operating temperature: -40...110°C
Number of channels: 4
Anzahl je Verpackung: 90 Stücke
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; RGMII; HFCBGA256; -40÷110°C; Ch: 4
Type of integrated circuit: PoE controller
Interface: RGMII
Case: HFCBGA256
Mounting: SMD
Operating temperature: -40...110°C
Number of channels: 4
Anzahl je Verpackung: 90 Stücke
Produkt ist nicht verfügbar
| VSC8257YMR-01 |
Hersteller: MICROCHIP (MICROSEMI)
VSC8257YMR-01 ETHERNET interfaces -integrated circuits
VSC8257YMR-01 ETHERNET interfaces -integrated circuits
Produkt ist nicht verfügbar
| VSC8479YHQ-02 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XFI; HFCBGA195; -40÷90°C; Ch: 1
Type of integrated circuit: PoE controller
Interface: XFI
Case: HFCBGA195
Mounting: SMD
Operating temperature: -40...90°C
Number of channels: 1
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XFI; HFCBGA195; -40÷90°C; Ch: 1
Type of integrated circuit: PoE controller
Interface: XFI
Case: HFCBGA195
Mounting: SMD
Operating temperature: -40...90°C
Number of channels: 1
Produkt ist nicht verfügbar
| VSC8479YHQ-01 |
Hersteller: MICROCHIP (MICROSEMI)
VSC8479YHQ-01 ETHERNET interfaces -integrated circuits
VSC8479YHQ-01 ETHERNET interfaces -integrated circuits
Produkt ist nicht verfügbar
| VSC8479YHQ-02 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XFI; HFCBGA195; -40÷90°C; Ch: 1
Type of integrated circuit: PoE controller
Interface: XFI
Case: HFCBGA195
Mounting: SMD
Operating temperature: -40...90°C
Number of channels: 1
Anzahl je Verpackung: 168 Stücke
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XFI; HFCBGA195; -40÷90°C; Ch: 1
Type of integrated circuit: PoE controller
Interface: XFI
Case: HFCBGA195
Mounting: SMD
Operating temperature: -40...90°C
Number of channels: 1
Anzahl je Verpackung: 168 Stücke
Produkt ist nicht verfügbar
| VSC8479YYY |
|
Hersteller: MICROCHIP (MICROSEMI)
VSC8479YYY ETHERNET interfaces -integrated circuits
VSC8479YYY ETHERNET interfaces -integrated circuits
Produkt ist nicht verfügbar
| VSC8486YJB-11 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XAUI; FCCSP144; -40÷85°C; Ch: 1
Mounting: SMD
Interface: XAUI
Operating temperature: -40...85°C
Case: FCCSP144
Type of integrated circuit: PoE controller
Number of channels: 1
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XAUI; FCCSP144; -40÷85°C; Ch: 1
Mounting: SMD
Interface: XAUI
Operating temperature: -40...85°C
Case: FCCSP144
Type of integrated circuit: PoE controller
Number of channels: 1
Produkt ist nicht verfügbar
| VSC8486YJB-11 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XAUI; FCCSP144; -40÷85°C; Ch: 1
Mounting: SMD
Interface: XAUI
Operating temperature: -40...85°C
Case: FCCSP144
Type of integrated circuit: PoE controller
Number of channels: 1
Anzahl je Verpackung: 160 Stücke
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XAUI; FCCSP144; -40÷85°C; Ch: 1
Mounting: SMD
Interface: XAUI
Operating temperature: -40...85°C
Case: FCCSP144
Type of integrated circuit: PoE controller
Number of channels: 1
Anzahl je Verpackung: 160 Stücke
Produkt ist nicht verfügbar
| VSC8486YSN-04 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XAUI; HFCBGA256; -40÷85°C; Ch: 1
Mounting: SMD
Interface: XAUI
Operating temperature: -40...85°C
Case: HFCBGA256
Type of integrated circuit: PoE controller
Number of channels: 1
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XAUI; HFCBGA256; -40÷85°C; Ch: 1
Mounting: SMD
Interface: XAUI
Operating temperature: -40...85°C
Case: HFCBGA256
Type of integrated circuit: PoE controller
Number of channels: 1
Produkt ist nicht verfügbar
| VSC8486YSN-04 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XAUI; HFCBGA256; -40÷85°C; Ch: 1
Mounting: SMD
Interface: XAUI
Operating temperature: -40...85°C
Case: HFCBGA256
Type of integrated circuit: PoE controller
Number of channels: 1
Anzahl je Verpackung: 90 Stücke
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XAUI; HFCBGA256; -40÷85°C; Ch: 1
Mounting: SMD
Interface: XAUI
Operating temperature: -40...85°C
Case: HFCBGA256
Type of integrated circuit: PoE controller
Number of channels: 1
Anzahl je Verpackung: 90 Stücke
Produkt ist nicht verfügbar
| VSC8489YJU-02 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XAUI; FCCSP196; -40÷110°C; Ch: 2
Type of integrated circuit: PoE controller
Interface: XAUI
Case: FCCSP196
Mounting: SMD
Operating temperature: -40...110°C
Number of channels: 2
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XAUI; FCCSP196; -40÷110°C; Ch: 2
Type of integrated circuit: PoE controller
Interface: XAUI
Case: FCCSP196
Mounting: SMD
Operating temperature: -40...110°C
Number of channels: 2
Produkt ist nicht verfügbar
| VSC8489YJU-16 |
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XAUI; FCCSP196; -40÷110°C; Ch: 2
Type of integrated circuit: PoE controller
Interface: XAUI
Case: FCCSP196
Mounting: SMD
Operating temperature: -40...110°C
Number of channels: 2
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XAUI; FCCSP196; -40÷110°C; Ch: 2
Type of integrated circuit: PoE controller
Interface: XAUI
Case: FCCSP196
Mounting: SMD
Operating temperature: -40...110°C
Number of channels: 2
Produkt ist nicht verfügbar
| VSC8489YJU-17 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XAUI; FCCSP196; -40÷110°C; Ch: 2
Type of integrated circuit: PoE controller
Interface: XAUI
Case: FCCSP196
Mounting: SMD
Operating temperature: -40...110°C
Number of channels: 2
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XAUI; FCCSP196; -40÷110°C; Ch: 2
Type of integrated circuit: PoE controller
Interface: XAUI
Case: FCCSP196
Mounting: SMD
Operating temperature: -40...110°C
Number of channels: 2
Produkt ist nicht verfügbar
| VSC8489YJU-02 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XAUI; FCCSP196; -40÷110°C; Ch: 2
Type of integrated circuit: PoE controller
Interface: XAUI
Case: FCCSP196
Mounting: SMD
Operating temperature: -40...110°C
Number of channels: 2
Anzahl je Verpackung: 126 Stücke
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XAUI; FCCSP196; -40÷110°C; Ch: 2
Type of integrated circuit: PoE controller
Interface: XAUI
Case: FCCSP196
Mounting: SMD
Operating temperature: -40...110°C
Number of channels: 2
Anzahl je Verpackung: 126 Stücke
Produkt ist nicht verfügbar
| VSC8489YJU-16 |
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XAUI; FCCSP196; -40÷110°C; Ch: 2
Type of integrated circuit: PoE controller
Interface: XAUI
Case: FCCSP196
Mounting: SMD
Operating temperature: -40...110°C
Number of channels: 2
Anzahl je Verpackung: 126 Stücke
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XAUI; FCCSP196; -40÷110°C; Ch: 2
Type of integrated circuit: PoE controller
Interface: XAUI
Case: FCCSP196
Mounting: SMD
Operating temperature: -40...110°C
Number of channels: 2
Anzahl je Verpackung: 126 Stücke
Produkt ist nicht verfügbar
| VSC8489YJU-17 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XAUI; FCCSP196; -40÷110°C; Ch: 2
Type of integrated circuit: PoE controller
Interface: XAUI
Case: FCCSP196
Mounting: SMD
Operating temperature: -40...110°C
Number of channels: 2
Anzahl je Verpackung: 126 Stücke
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; XAUI; FCCSP196; -40÷110°C; Ch: 2
Type of integrated circuit: PoE controller
Interface: XAUI
Case: FCCSP196
Mounting: SMD
Operating temperature: -40...110°C
Number of channels: 2
Anzahl je Verpackung: 126 Stücke
Produkt ist nicht verfügbar
| VSC8501XML |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 1
Operating temperature: -40...125°C
Mounting: SMD
Type of integrated circuit: PoE controller
Case: QFN135
Interface: GMII; MII; RGMII
Number of channels: 1
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 1
Operating temperature: -40...125°C
Mounting: SMD
Type of integrated circuit: PoE controller
Case: QFN135
Interface: GMII; MII; RGMII
Number of channels: 1
Produkt ist nicht verfügbar
| VSC8501XML |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 1
Operating temperature: -40...125°C
Mounting: SMD
Type of integrated circuit: PoE controller
Case: QFN135
Interface: GMII; MII; RGMII
Number of channels: 1
Anzahl je Verpackung: 152 Stücke
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 1
Operating temperature: -40...125°C
Mounting: SMD
Type of integrated circuit: PoE controller
Case: QFN135
Interface: GMII; MII; RGMII
Number of channels: 1
Anzahl je Verpackung: 152 Stücke
Produkt ist nicht verfügbar
| VSC8501XML-03 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 1
Operating temperature: -40...125°C
Mounting: SMD
Type of integrated circuit: PoE controller
Case: QFN135
Interface: GMII; MII; RGMII
Number of channels: 1
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 1
Operating temperature: -40...125°C
Mounting: SMD
Type of integrated circuit: PoE controller
Case: QFN135
Interface: GMII; MII; RGMII
Number of channels: 1
Produkt ist nicht verfügbar
| VSC8501XML-03 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 1
Operating temperature: -40...125°C
Mounting: SMD
Type of integrated circuit: PoE controller
Case: QFN135
Interface: GMII; MII; RGMII
Number of channels: 1
Anzahl je Verpackung: 152 Stücke
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 1
Operating temperature: -40...125°C
Mounting: SMD
Type of integrated circuit: PoE controller
Case: QFN135
Interface: GMII; MII; RGMII
Number of channels: 1
Anzahl je Verpackung: 152 Stücke
Produkt ist nicht verfügbar
| VSC8502XML |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 2
Mounting: SMD
Case: QFN135
Operating temperature: -40...125°C
Type of integrated circuit: PoE controller
Interface: GMII; MII; RGMII
Number of channels: 2
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 2
Mounting: SMD
Case: QFN135
Operating temperature: -40...125°C
Type of integrated circuit: PoE controller
Interface: GMII; MII; RGMII
Number of channels: 2
Produkt ist nicht verfügbar
| VSC8502XML |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 2
Mounting: SMD
Case: QFN135
Operating temperature: -40...125°C
Type of integrated circuit: PoE controller
Interface: GMII; MII; RGMII
Number of channels: 2
Anzahl je Verpackung: 152 Stücke
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 2
Mounting: SMD
Case: QFN135
Operating temperature: -40...125°C
Type of integrated circuit: PoE controller
Interface: GMII; MII; RGMII
Number of channels: 2
Anzahl je Verpackung: 152 Stücke
Produkt ist nicht verfügbar
| VSC8502XML-03 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 2
Mounting: SMD
Case: QFN135
Operating temperature: -40...125°C
Type of integrated circuit: PoE controller
Interface: GMII; MII; RGMII
Number of channels: 2
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 2
Mounting: SMD
Case: QFN135
Operating temperature: -40...125°C
Type of integrated circuit: PoE controller
Interface: GMII; MII; RGMII
Number of channels: 2
Produkt ist nicht verfügbar
| VSC8502XML-03 |
|
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 2
Mounting: SMD
Case: QFN135
Operating temperature: -40...125°C
Type of integrated circuit: PoE controller
Interface: GMII; MII; RGMII
Number of channels: 2
Anzahl je Verpackung: 152 Stücke
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; GMII,MII,RGMII; QFN135; -40÷125°C; Ch: 2
Mounting: SMD
Case: QFN135
Operating temperature: -40...125°C
Type of integrated circuit: PoE controller
Interface: GMII; MII; RGMII
Number of channels: 2
Anzahl je Verpackung: 152 Stücke
Produkt ist nicht verfügbar
| VSC8504XKS-02 |
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; QSGMII,SGMII; PBGA256; -40÷125°C; Ch: 4
Type of integrated circuit: PoE controller
Interface: QSGMII; SGMII
Case: PBGA256
Mounting: SMD
Operating temperature: -40...125°C
Number of channels: 4
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; QSGMII,SGMII; PBGA256; -40÷125°C; Ch: 4
Type of integrated circuit: PoE controller
Interface: QSGMII; SGMII
Case: PBGA256
Mounting: SMD
Operating temperature: -40...125°C
Number of channels: 4
Produkt ist nicht verfügbar
| VSC8504XKS-05 |
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; QSGMII,SGMII; PBGA256; -40÷125°C; Ch: 4
Type of integrated circuit: PoE controller
Interface: QSGMII; SGMII
Case: PBGA256
Mounting: SMD
Operating temperature: -40...125°C
Number of channels: 4
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; QSGMII,SGMII; PBGA256; -40÷125°C; Ch: 4
Type of integrated circuit: PoE controller
Interface: QSGMII; SGMII
Case: PBGA256
Mounting: SMD
Operating temperature: -40...125°C
Number of channels: 4
Produkt ist nicht verfügbar
| VSC8504XKS-02 |
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; QSGMII,SGMII; PBGA256; -40÷125°C; Ch: 4
Type of integrated circuit: PoE controller
Interface: QSGMII; SGMII
Case: PBGA256
Mounting: SMD
Operating temperature: -40...125°C
Number of channels: 4
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; QSGMII,SGMII; PBGA256; -40÷125°C; Ch: 4
Type of integrated circuit: PoE controller
Interface: QSGMII; SGMII
Case: PBGA256
Mounting: SMD
Operating temperature: -40...125°C
Number of channels: 4
Produkt ist nicht verfügbar
| VSC8504XKS-05 |
Hersteller: MICROCHIP (MICROSEMI)
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; QSGMII,SGMII; PBGA256; -40÷125°C; Ch: 4
Type of integrated circuit: PoE controller
Interface: QSGMII; SGMII
Case: PBGA256
Mounting: SMD
Operating temperature: -40...125°C
Number of channels: 4
Category: ETHERNET interfaces -integrated circuits
Description: IC: PoE controller; QSGMII,SGMII; PBGA256; -40÷125°C; Ch: 4
Type of integrated circuit: PoE controller
Interface: QSGMII; SGMII
Case: PBGA256
Mounting: SMD
Operating temperature: -40...125°C
Number of channels: 4
Produkt ist nicht verfügbar
| VSC8512XJG-02 |
|
Hersteller: MICROCHIP (MICROSEMI)
VSC8512XJG-02 ETHERNET interfaces -integrated circuits
VSC8512XJG-02 ETHERNET interfaces -integrated circuits
Produkt ist nicht verfügbar