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MIC33M656-HAYMP-TR Microchip Technology MIC33M656-Data-Sheet-DS20006256A.pdf Description: IC REG BUCK PROG 6A 53B1QFN
Packaging: Tape & Reel (TR)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 1.28V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
Produkt ist nicht verfügbar
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MIC33M650YMP-TR Microchip Technology MIC33M650-Data-Sheet-DS20006253A.pdf Description: IC REG BUCK PROG 6A 53B1QFN
Packaging: Tape & Reel (TR)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 3.3V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
Produkt ist nicht verfügbar
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ATSAME51J18A-AU-EFP ATSAME51J18A-AU-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Produkt ist nicht verfügbar
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ATSAMD51J18A-AU-EFP ATSAMD51J18A-AU-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Produkt ist nicht verfügbar
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ATSAMD51J18A-MUT-EFP ATSAMD51J18A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAMD51J18A-AUT-EFP ATSAMD51J18A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIC33M656-HAYMP-TR Microchip Technology MIC33M656-Data-Sheet-DS20006256A.pdf Description: IC REG BUCK PROG 6A 53B1QFN
Packaging: Cut Tape (CT)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 1.28V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
Produkt ist nicht verfügbar
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MIC33M656-SAYMP-TR Microchip Technology MIC33M656-Data-Sheet-DS20006256A.pdf Description: IC REG BUCK PROG 6A 53B1QFN
Packaging: Cut Tape (CT)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 3.84V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
auf Bestellung 235 Stücke:
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2+8.96 EUR
25+7.47 EUR
100+7.24 EUR
Mindestbestellmenge: 2
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ATSAMD51J18A-AUT-EFP ATSAMD51J18A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIC33M650YMP-TR Microchip Technology MIC33M650-Data-Sheet-DS20006253A.pdf Description: IC REG BUCK PROG 6A 53B1QFN
Packaging: Cut Tape (CT)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 3.3V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
Produkt ist nicht verfügbar
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ATSAMD51G18A-MUT-EFP ATSAMD51G18A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME54P20A-AUT-EFP ATSAME54P20A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 128TQFP
Packaging: Cut Tape (CT)
Package / Case: 128-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 128-TQFP (14x14)
Part Status: Active
Number of I/O: 99
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME54N20A-AUT-EFP ATSAME54N20A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAMD51J18A-MUT-EFP ATSAMD51J18A-MUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIC33M656-FAYMP-TR Microchip Technology MIC33M656-Data-Sheet-DS20006256A.pdf Description: IC REG BUCK PROG 6A 53B1QFN
Packaging: Cut Tape (CT)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 1.28V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
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2+8.94 EUR
25+7.46 EUR
100+7.23 EUR
Mindestbestellmenge: 2
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ATSAME51J18A-AUT-EFP ATSAME51J18A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAM9X60T-V/DWB SAM9X60T-V/DWB Microchip Technology SAM9X60-Data-Sheet-DS60001579.pdf Description: IC MPU SAM9X60 600MHZ 228TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
auf Bestellung 1500 Stücke:
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1500+10.84 EUR
Mindestbestellmenge: 1500
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SAM9X60-V/DWB SAM9X60-V/DWB Microchip Technology SAM9X60-Data-Sheet-DS60001579.pdf Description: IC MPU SAM9X60 600MHZ 228TFBGA
Packaging: Tray
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
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SAM9X60T-V/DWB SAM9X60T-V/DWB Microchip Technology SAM9X60-Data-Sheet-DS60001579.pdf Description: IC MPU SAM9X60 600MHZ 228TFBGA
Packaging: Cut Tape (CT)
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
auf Bestellung 3082 Stücke:
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2+10.84 EUR
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DSC1221NI2-125M0000 DSC1221NI2-125M0000 Microchip Technology DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1222NI2-156M2500 DSC1222NI2-156M2500 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1221CL2-25M00000 DSC1221CL2-25M00000 Microchip Technology DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1221DA2-25M00000 DSC1221DA2-25M00000 Microchip Technology DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1222NI2-150M0000 DSC1222NI2-150M0000 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 150 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1222DI2-156M2500 DSC1222DI2-156M2500 Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf Description: MEMS OSC XO 156.2500MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Supplier Device Package: 6-VDFN (2.5x2)
Produkt ist nicht verfügbar
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DSC1223DI2-150M0000 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 150 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MRF89XAM9AT-I/RM MRF89XAM9AT-I/RM Microchip Technology 75017B.pdf Description: RF TXRX MOD ISM<1GHZ TRC ANT SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-SMD Module
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 12.5dBm
Data Rate: 200kbps
Current - Receiving: 3mA
Current - Transmitting: 16mA ~ 25mA
Antenna Type: Integrated, Trace
Utilized IC / Part: MRF89XAM9A
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
Part Status: Active
DigiKey Programmable: Not Verified
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DSC1222CI2-25M00000 DSC1222CI2-25M00000 Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf Description: MEMS OSC XO 25.0000MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1223DI2-212M5000 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
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DSC1222CI2-212M5000 DSC1222CI2-212M5000 Microchip Technology DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf Description: MEMS OSC XO 212.5000MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 212.5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1223BI2-156M2500 DSC1223BI2-156M2500 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1223CI2-133M3333 DSC1223CI2-133M3333 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 133.333 MHz
Base Resonator: MEMS
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DSC1224DI2-125M0000 DSC1224DI2-125M0000 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1224DL1-100M0000 DSC1224DL1-100M0000 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MRF89XAM9AT-I/RM MRF89XAM9AT-I/RM Microchip Technology 75017B.pdf Description: RF TXRX MOD ISM<1GHZ TRC ANT SMD
Packaging: Cut Tape (CT)
Package / Case: 12-SMD Module
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 12.5dBm
Data Rate: 200kbps
Current - Receiving: 3mA
Current - Transmitting: 16mA ~ 25mA
Antenna Type: Integrated, Trace
Utilized IC / Part: MRF89XAM9A
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
Part Status: Active
DigiKey Programmable: Not Verified
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SAM9X60D5M-I/4FB SAM9X60D5M-I/4FB Microchip Technology SAM9X60-SIP-DataSheet-DS60001580B.pdf Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
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SAM9X60D5MT-I/4FB SAM9X60D5MT-I/4FB Microchip Technology SAM9X60-SIP-DataSheet-DS60001580B.pdf Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
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SAM9X60D1G-I/4FB SAM9X60D1G-I/4FB Microchip Technology SAM9X60-SIP-DataSheet-DS60001580B.pdf Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
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2+14.06 EUR
25+11.71 EUR
100+11.32 EUR
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SAM9X60D1GT-I/4FB SAM9X60D1GT-I/4FB Microchip Technology SAM9X60-SIP-DataSheet-DS60001580B.pdf Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Produkt ist nicht verfügbar
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ATSAMA5D27C-D1G-CUR ATSAMA5D27C-D1G-CUR Microchip Technology SAMA5D2-Plus-DDR2-LPDDR2-System-in-Package-(SIP)-60001484d.pdf Description: IC MPU SAMA5D2 500MHZ 289TFBGA
Packaging: Cut Tape (CT)
Package / Case: 289-TFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 289-TFBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
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ATECC608A-TNGTLSU-B Microchip Technology Description: TRUST & GO TLS I2C PROTO 8-UDFN
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ATECC608A-TNGLORAS-G Microchip Technology Description: TRUST & GO LORAWAN I2C PROVISION
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ATECC608A-TNGTLSS-C Microchip Technology Description: TRUST & GO TLS I2C PROVISIONED 8
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ATECC608A-TNGLORAU-C Microchip Technology Description: TRUST & GO LORAWAN I2C PROVISION
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ATECC608A-TNGLORAU-G Microchip Technology Description: TRUST & GO LORAWAN I2C PROVISION
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ATECC608A-TNGTLSU-C Microchip Technology Description: TRUST & GO TLS I2C PROVISIONED 8
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ATECC608A-TNGLORAS-C Microchip Technology Description: TRUST & GO LORAWAN I2C PROVISION
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ATECC608A-TNGTLSS-B Microchip Technology Description: TRUST & GO TLS I2C PROTO 8-SOIC
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ATECC608A-TNGTLSS-G Microchip Technology Description: TRUST & GO TLS I2C PROVISIONED 8
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ATECC608A-TNGLORAS-B Microchip Technology Description: TRUST & GO LORAWAN I2C PROTO 8-S
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ATECC608A-TNGTLSU-G Microchip Technology Description: TRUST & GO TLS I2C PROVISIONED 8
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ATECC608A-TNGLORAU-B Microchip Technology Description: TRUST & GO LORAWAN I2C PROTO 8-U
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KSZ9131MNXC-TR KSZ9131MNXC-TR Microchip Technology 00002840B.pdf Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 1000 Stücke:
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1000+4.92 EUR
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DT100108 DT100108 Microchip Technology DT100108_Web.pdf Description: EVAL BOARD FOR MIC33M656
Packaging: Bulk
Voltage - Output: 0.6V, 3.84V
Voltage - Input: 2.4V ~ 5.5V
Current - Output: 6A
Frequency - Switching: 2.2MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MIC33M656
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Contents: Board(s)
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RN4870-I/RM140 RN4870-I/RM140 Microchip Technology RN4870-71-Bluetooth-Low-Energy-Module-DS50002489.pdf Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 33-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Data Rate: 10kbps
Protocol: Bluetooth v5.0
Current - Receiving: 13mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
Utilized IC / Part: RN4870
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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KSZ9131RNXC-TR KSZ9131RNXC-TR Microchip Technology 00002841B.pdf Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
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KSZ9131MNXI KSZ9131MNXI Microchip Technology 00002840B.pdf Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
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3+7.62 EUR
25+6.32 EUR
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KSZ9131MNXI-TR KSZ9131MNXI-TR Microchip Technology 00002840B.pdf Description: IC TXRX FULL/HALF 8/8 64QFN
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KSZ9131MNXC KSZ9131MNXC Microchip Technology 00002840B.pdf Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 201 Stücke:
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3+6.09 EUR
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RN4871-V/RM140 RN4871-V/RM140 Microchip Technology RN4870-71-Bluetooth-Low-Energy-Module-DS50002489.pdf Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 16-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Data Rate: 10kbps
Protocol: Bluetooth v5.0
Current - Receiving: 13mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
Utilized IC / Part: RN4871
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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2+14.04 EUR
25+12.85 EUR
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MIC33M656-HAYMP-TR MIC33M656-Data-Sheet-DS20006256A.pdf
Hersteller: Microchip Technology
Description: IC REG BUCK PROG 6A 53B1QFN
Packaging: Tape & Reel (TR)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 1.28V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
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MIC33M650YMP-TR MIC33M650-Data-Sheet-DS20006253A.pdf
Hersteller: Microchip Technology
Description: IC REG BUCK PROG 6A 53B1QFN
Packaging: Tape & Reel (TR)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 3.3V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
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ATSAME51J18A-AU-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME51J18A-AU-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
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ATSAMD51J18A-AU-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51J18A-AU-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
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ATSAMD51J18A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51J18A-MUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
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ATSAMD51J18A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51J18A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIC33M656-HAYMP-TR MIC33M656-Data-Sheet-DS20006256A.pdf
Hersteller: Microchip Technology
Description: IC REG BUCK PROG 6A 53B1QFN
Packaging: Cut Tape (CT)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 1.28V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
Produkt ist nicht verfügbar
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MIC33M656-SAYMP-TR MIC33M656-Data-Sheet-DS20006256A.pdf
Hersteller: Microchip Technology
Description: IC REG BUCK PROG 6A 53B1QFN
Packaging: Cut Tape (CT)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 3.84V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
auf Bestellung 235 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+8.96 EUR
25+7.47 EUR
100+7.24 EUR
Mindestbestellmenge: 2
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ATSAMD51J18A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51J18A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIC33M650YMP-TR MIC33M650-Data-Sheet-DS20006253A.pdf
Hersteller: Microchip Technology
Description: IC REG BUCK PROG 6A 53B1QFN
Packaging: Cut Tape (CT)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 3.3V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
Produkt ist nicht verfügbar
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ATSAMD51G18A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51G18A-MUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 37
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME54P20A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME54P20A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 128TQFP
Packaging: Cut Tape (CT)
Package / Case: 128-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 128-TQFP (14x14)
Part Status: Active
Number of I/O: 99
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAME54N20A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME54N20A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAMD51J18A-MUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51J18A-MUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64VQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIC33M656-FAYMP-TR MIC33M656-Data-Sheet-DS20006256A.pdf
Hersteller: Microchip Technology
Description: IC REG BUCK PROG 6A 53B1QFN
Packaging: Cut Tape (CT)
Package / Case: 53-PowerBFQFN Module
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 53-B1QFN (6x10)
Synchronous Rectifier: Yes
Voltage - Output (Max): 1.28V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+8.94 EUR
25+7.46 EUR
100+7.23 EUR
Mindestbestellmenge: 2
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ATSAME51J18A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAME51J18A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAM9X60T-V/DWB SAM9X60-Data-Sheet-DS60001579.pdf
SAM9X60T-V/DWB
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 228TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1500+10.84 EUR
Mindestbestellmenge: 1500
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SAM9X60-V/DWB SAM9X60-Data-Sheet-DS60001579.pdf
SAM9X60-V/DWB
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 228TFBGA
Packaging: Tray
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
auf Bestellung 1139 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.63 EUR
Mindestbestellmenge: 2
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SAM9X60T-V/DWB SAM9X60-Data-Sheet-DS60001579.pdf
SAM9X60T-V/DWB
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 228TFBGA
Packaging: Cut Tape (CT)
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
auf Bestellung 3082 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.84 EUR
Mindestbestellmenge: 2
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DSC1221NI2-125M0000 DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf
DSC1221NI2-125M0000
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1222NI2-156M2500 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
DSC1222NI2-156M2500
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1221CL2-25M00000 DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf
DSC1221CL2-25M00000
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1221DA2-25M00000 DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf
DSC1221DA2-25M00000
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1222NI2-150M0000 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
DSC1222NI2-150M0000
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 150 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1222DI2-156M2500 DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf
DSC1222DI2-156M2500
Hersteller: Microchip Technology
Description: MEMS OSC XO 156.2500MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Supplier Device Package: 6-VDFN (2.5x2)
Produkt ist nicht verfügbar
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DSC1223DI2-150M0000 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 150 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MRF89XAM9AT-I/RM 75017B.pdf
MRF89XAM9AT-I/RM
Hersteller: Microchip Technology
Description: RF TXRX MOD ISM<1GHZ TRC ANT SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-SMD Module
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 12.5dBm
Data Rate: 200kbps
Current - Receiving: 3mA
Current - Transmitting: 16mA ~ 25mA
Antenna Type: Integrated, Trace
Utilized IC / Part: MRF89XAM9A
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 4500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
500+13 EUR
Mindestbestellmenge: 500
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DSC1222CI2-25M00000 DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf
DSC1222CI2-25M00000
Hersteller: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1223DI2-212M5000 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Produkt ist nicht verfügbar
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DSC1222CI2-212M5000 DSC12x2-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011.pdf
DSC1222CI2-212M5000
Hersteller: Microchip Technology
Description: MEMS OSC XO 212.5000MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 212.5 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1223BI2-156M2500 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
DSC1223BI2-156M2500
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1223CI2-133M3333 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
DSC1223CI2-133M3333
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 133.333 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1224DI2-125M0000 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
DSC1224DI2-125M0000
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1224DL1-100M0000 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
DSC1224DL1-100M0000
Hersteller: Microchip Technology
Description: OSC MEMS SMD HIGH PERFORMANCE
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MRF89XAM9AT-I/RM 75017B.pdf
MRF89XAM9AT-I/RM
Hersteller: Microchip Technology
Description: RF TXRX MOD ISM<1GHZ TRC ANT SMD
Packaging: Cut Tape (CT)
Package / Case: 12-SMD Module
Sensitivity: -111dBm
Mounting Type: Surface Mount
Frequency: 902MHz ~ 928MHz
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.1V ~ 3.6V
Power - Output: 12.5dBm
Data Rate: 200kbps
Current - Receiving: 3mA
Current - Transmitting: 16mA ~ 25mA
Antenna Type: Integrated, Trace
Utilized IC / Part: MRF89XAM9A
Modulation: FSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 5582 Stücke:
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Anzahl Preis
2+12.99 EUR
Mindestbestellmenge: 2
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SAM9X60D5M-I/4FB SAM9X60-SIP-DataSheet-DS60001580B.pdf
SAM9X60D5M-I/4FB
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
auf Bestellung 65 Stücke:
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Anzahl Preis
2+13.06 EUR
25+10.88 EUR
Mindestbestellmenge: 2
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SAM9X60D5MT-I/4FB SAM9X60-SIP-DataSheet-DS60001580B.pdf
SAM9X60D5MT-I/4FB
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Produkt ist nicht verfügbar
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SAM9X60D1G-I/4FB SAM9X60-SIP-DataSheet-DS60001580B.pdf
SAM9X60D1G-I/4FB
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
auf Bestellung 192 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.06 EUR
25+11.71 EUR
100+11.32 EUR
Mindestbestellmenge: 2
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SAM9X60D1GT-I/4FB SAM9X60-SIP-DataSheet-DS60001580B.pdf
SAM9X60D1GT-I/4FB
Hersteller: Microchip Technology
Description: IC MPU SAM9X60 600MHZ 233TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Part Status: Active
Produkt ist nicht verfügbar
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ATSAMA5D27C-D1G-CUR SAMA5D2-Plus-DDR2-LPDDR2-System-in-Package-(SIP)-60001484d.pdf
ATSAMA5D27C-D1G-CUR
Hersteller: Microchip Technology
Description: IC MPU SAMA5D2 500MHZ 289TFBGA
Packaging: Cut Tape (CT)
Package / Case: 289-TFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 289-TFBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
auf Bestellung 895 Stücke:
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Anzahl Preis
1+28.39 EUR
25+23.65 EUR
100+22.84 EUR
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ATECC608A-TNGTLSU-B
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROTO 8-UDFN
Produkt ist nicht verfügbar
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ATECC608A-TNGLORAS-G
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROVISION
Produkt ist nicht verfügbar
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ATECC608A-TNGTLSS-C
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROVISIONED 8
Produkt ist nicht verfügbar
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ATECC608A-TNGLORAU-C
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROVISION
Produkt ist nicht verfügbar
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ATECC608A-TNGLORAU-G
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROVISION
Produkt ist nicht verfügbar
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ATECC608A-TNGTLSU-C
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROVISIONED 8
Produkt ist nicht verfügbar
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ATECC608A-TNGLORAS-C
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROVISION
Produkt ist nicht verfügbar
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ATECC608A-TNGTLSS-B
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROTO 8-SOIC
Produkt ist nicht verfügbar
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ATECC608A-TNGTLSS-G
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROVISIONED 8
Produkt ist nicht verfügbar
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ATECC608A-TNGLORAS-B
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROTO 8-S
auf Bestellung 5 Stücke:
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ATECC608A-TNGTLSU-G
Hersteller: Microchip Technology
Description: TRUST & GO TLS I2C PROVISIONED 8
Produkt ist nicht verfügbar
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ATECC608A-TNGLORAU-B
Hersteller: Microchip Technology
Description: TRUST & GO LORAWAN I2C PROTO 8-U
Produkt ist nicht verfügbar
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KSZ9131MNXC-TR 00002840B.pdf
KSZ9131MNXC-TR
Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+4.92 EUR
Mindestbestellmenge: 1000
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DT100108 DT100108_Web.pdf
DT100108
Hersteller: Microchip Technology
Description: EVAL BOARD FOR MIC33M656
Packaging: Bulk
Voltage - Output: 0.6V, 3.84V
Voltage - Input: 2.4V ~ 5.5V
Current - Output: 6A
Frequency - Switching: 2.2MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MIC33M656
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Contents: Board(s)
Produkt ist nicht verfügbar
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RN4870-I/RM140 RN4870-71-Bluetooth-Low-Energy-Module-DS50002489.pdf
RN4870-I/RM140
Hersteller: Microchip Technology
Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 33-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Data Rate: 10kbps
Protocol: Bluetooth v5.0
Current - Receiving: 13mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
Utilized IC / Part: RN4870
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 541 Stücke:
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Anzahl Preis
2+14.04 EUR
25+12.85 EUR
Mindestbestellmenge: 2
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KSZ9131RNXC-TR 00002841B.pdf
KSZ9131RNXC-TR
Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 4/4 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 4/4
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 48-QFN (7x7)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+3.26 EUR
Mindestbestellmenge: 1000
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KSZ9131MNXI 00002840B.pdf
KSZ9131MNXI
Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.62 EUR
25+6.32 EUR
Mindestbestellmenge: 3
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KSZ9131MNXI-TR 00002840B.pdf
KSZ9131MNXI-TR
Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 8/8 64QFN
Produkt ist nicht verfügbar
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KSZ9131MNXC 00002840B.pdf
KSZ9131MNXC
Hersteller: Microchip Technology
Description: IC TXRX FULL/HALF 8/8 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.71V ~ 1.89V, 2.375V ~ 2.75V, 3.135V ~ 3.63V
Number of Drivers/Receivers: 8/8
Data Rate: 10Mbps, 100Mbps, 1Gbps
Protocol: Gigabit Ethernet
Supplier Device Package: 64-QFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 201 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.09 EUR
25+5.07 EUR
100+4.92 EUR
Mindestbestellmenge: 3
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RN4871-V/RM140 RN4870-71-Bluetooth-Low-Energy-Module-DS50002489.pdf
RN4871-V/RM140
Hersteller: Microchip Technology
Description: RF TXRX MOD BLUETOOTH CHIP SMD
Packaging: Tray
Package / Case: 16-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.402GHz ~ 2.48GHz
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Data Rate: 10kbps
Protocol: Bluetooth v5.0
Current - Receiving: 13mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
Utilized IC / Part: RN4871
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, AIO, PIO, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 469 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.04 EUR
25+12.85 EUR
Mindestbestellmenge: 2
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