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AVR64DB28-I/SS AVR64DB28-I/SS Microchip Technology AVR128DB28-32-48-64-DataSheet-DS40002247.pdf Description: IC MCU 8BIT 64KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 9x12b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
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ATMEGA809-MFR ATMEGA809-MFR Microchip Technology ATmega808-09-1608-09-DS40002172B.pdf Description: IC MCU 8BIT 8KB FLASH 48VQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 41
DigiKey Programmable: Not Verified
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ATMEGA809-MUR ATMEGA809-MUR Microchip Technology ATmega808-09-1608-09-DS40002172B.pdf Description: IC MCU 8BIT 8KB FLASH 48VQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
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ATMEGA809-MUR ATMEGA809-MUR Microchip Technology ATmega808-09-1608-09-DS40002172B.pdf Description: IC MCU 8BIT 8KB FLASH 48VQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
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APT14M120S APT14M120S Microchip Technology 6629-apt14m120bg-apt14m120sg-datasheet Description: MOSFET N-CH 1200V 14A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 14A (Tc)
Rds On (Max) @ Id, Vgs: 1.1Ohm @ 7A, 10V
Power Dissipation (Max): 625W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 145 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4765 pF @ 25 V
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TC2117-3.3VEBTR TC2117-3.3VEBTR Microchip Technology 50001894.pdf Description: IC REG LINEAR 3.3V 800MA DDPAK-3
Packaging: Cut Tape (CT)
Package / Case: TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 800mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 130 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: DDPAK-3
Voltage - Output (Min/Fixed): 3.3V
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 1.2V @ 800mA
Protection Features: Over Current, Over Temperature
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PIC32MZ2064DAH169-I/6J PIC32MZ2064DAH169-I/6J Microchip Technology PIC32MZ-Graphics-DA-Family-Data-Sheet-DS60001361J.pdf Description: IC MCU 32BIT 2MB FLASH 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1025DAH169T-I/6J PIC32MZ1025DAH169T-I/6J Microchip Technology PIC32MZ-Graphics-DA-Family-Data-Sheet-DS60001361J.pdf Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ1025DAH169T-I/6J PIC32MZ1025DAH169T-I/6J Microchip Technology PIC32MZ-Graphics-DA-Family-Data-Sheet-DS60001361J.pdf Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Cut Tape (CT)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ2025DAH169T-I/6J PIC32MZ2025DAH169T-I/6J Microchip Technology PIC32MZ-Graphics-DA-Family-Data-Sheet-DS60001361J.pdf Description: IC MCU 32BIT 2MB FLASH 169LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ2025DAH169T-I/6J PIC32MZ2025DAH169T-I/6J Microchip Technology PIC32MZ-Graphics-DA-Family-Data-Sheet-DS60001361J.pdf Description: IC MCU 32BIT 2MB FLASH 169LFBGA
Packaging: Cut Tape (CT)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ2064DAH169T-I/6J PIC32MZ2064DAH169T-I/6J Microchip Technology PIC32MZ-Graphics-DA-Family-Data-Sheet-DS60001361J.pdf Description: IC MCU 32BIT 2MB FLASH 169LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
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PIC32MZ2064DAH169T-I/6J PIC32MZ2064DAH169T-I/6J Microchip Technology PIC32MZ-Graphics-DA-Family-Data-Sheet-DS60001361J.pdf Description: IC MCU 32BIT 2MB FLASH 169LFBGA
Packaging: Cut Tape (CT)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
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AT45DB1282-TC AT45DB1282-TC Microchip Technology AT45DB1282.pdf Description: IC FLASH 128MBIT SPI 40TSOP
Packaging: Tray
Package / Case: 40-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TC)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 40 MHz
Memory Format: FLASH
Supplier Device Package: 40-TSOP
Part Status: Obsolete
Write Cycle Time - Word, Page: 50ms
Memory Interface: SPI
Memory Organization: 1056 Bytes x 16,384 pages
DigiKey Programmable: Not Verified
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MCP6292-H/MS MCP6292-H/MS Microchip Technology MCP6291-Family-Data-Sheet-DS20001812G.pdf Description: IC OP AMP 2CH 8-MSOP
Packaging: Tube
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 150°C (TA)
Current - Supply: 1mA (x2 Channels)
Slew Rate: 7V/µs
Gain Bandwidth Product: 10 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 3 mV
Supplier Device Package: 8-MSOP
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 25 mA
Voltage - Supply Span (Min): 2.4 V
Voltage - Supply Span (Max): 6 V
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PIC24FJ128GL302T-I/ML PIC24FJ128GL302T-I/ML Microchip Technology PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf Description: IC MCU 16BIT 128KB FLASH 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 21
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PIC24FJ128GL302T-I/ML PIC24FJ128GL302T-I/ML Microchip Technology PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf Description: IC MCU 16BIT 128KB FLASH 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 21
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PIC24FJ128GL302T-I/MV PIC24FJ128GL302T-I/MV Microchip Technology PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf Description: IC MCU 16BIT 128KB FLASH 28UQFN
Packaging: Tape & Reel (TR)
Package / Case: 28-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 28-UQFN (4x4)
Grade: Automotive
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PIC24FJ128GL302T-I/MV PIC24FJ128GL302T-I/MV Microchip Technology PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf Description: IC MCU 16BIT 128KB FLASH 28UQFN
Packaging: Cut Tape (CT)
Package / Case: 28-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 28-UQFN (4x4)
Grade: Automotive
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PIC24FJ128GL302T-I/SO Microchip Technology PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf Description: IC MCU 16BIT 128KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 21
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PIC24FJ128GL302T-I/SO Microchip Technology PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf Description: IC MCU 16BIT 128KB FLASH 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 21
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PIC24FJ128GL305T-I/M4 PIC24FJ128GL305T-I/M4 Microchip Technology PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf Description: IC MCU 16BIT 128KB FLASH 48UQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 12x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 48-UQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PIC24FJ128GL305T-I/M4 PIC24FJ128GL305T-I/M4 Microchip Technology PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf Description: IC MCU 16BIT 128KB FLASH 48UQFN
Packaging: Cut Tape (CT)
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 12x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 48-UQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PIC24FJ128GL303T-I/M5 PIC24FJ128GL303T-I/M5 Microchip Technology PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf Description: IC MCU 16BIT 128KB FLASH 36UQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 11x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 36-UQFN (5x5)
Grade: Automotive
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PIC24FJ128GL306T-I/MR PIC24FJ128GL306T-I/MR Microchip Technology PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf Description: IC MCU 16BIT 128KB FLASH 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 17x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Grade: Automotive
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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PIC24FJ128GL306T-I/MR PIC24FJ128GL306T-I/MR Microchip Technology PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf Description: IC MCU 16BIT 128KB FLASH 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 17x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Grade: Automotive
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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MSMLJ170CAe3 MSMLJ170CAe3 Microchip Technology 10563-msml-datasheet Description: TVS DIODE 170VWM 275VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 11A
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: DO-214AB
Bidirectional Channels: 1
Voltage - Breakdown (Min): 189V
Voltage - Clamping (Max) @ Ipp: 275V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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DSC6331JI2FA-027.0000T Microchip Technology filehandler.aspx?ddocname=en600231 Description: MEMS OSC XO 27.0000MHZ LVCMOS
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DSC6331JI2FA-027.0000T Microchip Technology filehandler.aspx?ddocname=en600231 Description: MEMS OSC XO 27.0000MHZ LVCMOS
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DSC6331JI2FA-026.0000T Microchip Technology filehandler.aspx?ddocname=en600231 Description: MEMS OSC XO 26.0000MHZ LVCMOS
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DSC6331JI2FA-026.0000T Microchip Technology filehandler.aspx?ddocname=en600231 Description: MEMS OSC XO 26.0000MHZ LVCMOS
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DSC6331JI2GA-026.0000T Microchip Technology filehandler.aspx?ddocname=en600231 Description: MEMS OSC XO 26.0000MHZ LVCMOS
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DSC6331JI2GA-026.0000T Microchip Technology filehandler.aspx?ddocname=en600231 Description: MEMS OSC XO 26.0000MHZ LVCMOS
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DSC6331JI2GA-027.0000T Microchip Technology filehandler.aspx?ddocname=en600231 Description: MEMS OSC XO 27.0000MHZ LVCMOS
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DSC6331JI2GA-027.0000T Microchip Technology filehandler.aspx?ddocname=en600231 Description: MEMS OSC XO 27.0000MHZ LVCMOS
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DSC6331JI2LA-026.0000T Microchip Technology filehandler.aspx?ddocname=en600231 Description: MEMS OSC XO 26.0000MHZ LVCMOS
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DSC6331JI2LA-026.0000T Microchip Technology filehandler.aspx?ddocname=en600231 Description: MEMS OSC XO 26.0000MHZ LVCMOS
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DSC6331JI2LA-027.0000T Microchip Technology filehandler.aspx?ddocname=en600231 Description: MEMS OSC XO 27.0000MHZ LVCMOS
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DSC6331JI2LA-027.0000T Microchip Technology filehandler.aspx?ddocname=en600231 Description: MEMS OSC XO 27.0000MHZ LVCMOS
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VXC4-1EE-13-25M0000000 Microchip Technology VXC4-April-2020.pdf Description: OSCILLATOR CMOS SMD
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VXC1-1EE-13-25M0000000 Microchip Technology VXC1-April-2020.pdf Description: OSCILLATOR CMOS SMD
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AVR128DB48-I/6LX AVR128DB48-I/6LX Microchip Technology AVR128DB28-32-48-64-DataSheet-DS40002247A.pdf Description: IC MCU 8BIT 128KB FLASH 48VQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: AVR
Data Converters: A/D 18x12b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
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6+3.86 EUR
25+3.51 EUR
100+3.18 EUR
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DSA1121BA2-025.0000TVAO Microchip Technology DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121BA2-025.0000VAO Microchip Technology DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121BI2-027.0000TVAO Microchip Technology DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121BI2-027.0000VAO Microchip Technology DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121BI2-028.6364TVAO Microchip Technology DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121BI2-028.6364VAO Microchip Technology DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121CA1-016.0000TVAO DSA1121CA1-016.0000TVAO Microchip Technology DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
Packaging: Bulk
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1121CA1-016.0000VAO DSA1121CA1-016.0000VAO Microchip Technology DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
Packaging: Bulk
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
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DSA1121CA2-008.0000TVAO Microchip Technology DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf Description: MEMS OSCILLATOR, AUTOMOTIVE CMOS
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DSA1121CA2-008.0000VAO Microchip Technology DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121CA2-024.0000TVAO Microchip Technology DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121CA2-024.0000VAO Microchip Technology DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121CA2-040.0000TVAO Microchip Technology DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121CA2-040.0000VAO Microchip Technology DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121DA2-027.0000TVAO Microchip Technology filehandler.aspx?ddocname=en605044 Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121DA2-027.0000VAO Microchip Technology filehandler.aspx?ddocname=en605044 Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121DI3-033.3333TVAO Microchip Technology filehandler.aspx?ddocname=en605044 Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121DI3-033.3333VAO Microchip Technology filehandler.aspx?ddocname=en605044 Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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AVR64DB28-I/SS AVR128DB28-32-48-64-DataSheet-DS40002247.pdf
AVR64DB28-I/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 9x12b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
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7+3 EUR
25+2.93 EUR
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ATMEGA809-MFR ATmega808-09-1608-09-DS40002172B.pdf
ATMEGA809-MFR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 48VQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 41
DigiKey Programmable: Not Verified
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ATMEGA809-MUR ATmega808-09-1608-09-DS40002172B.pdf
ATMEGA809-MUR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 48VQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
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ATMEGA809-MUR ATmega808-09-1608-09-DS40002172B.pdf
ATMEGA809-MUR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 48VQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
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8+2.7 EUR
25+2.62 EUR
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APT14M120S 6629-apt14m120bg-apt14m120sg-datasheet
APT14M120S
Hersteller: Microchip Technology
Description: MOSFET N-CH 1200V 14A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 14A (Tc)
Rds On (Max) @ Id, Vgs: 1.1Ohm @ 7A, 10V
Power Dissipation (Max): 625W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 145 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4765 pF @ 25 V
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TC2117-3.3VEBTR 50001894.pdf
TC2117-3.3VEBTR
Hersteller: Microchip Technology
Description: IC REG LINEAR 3.3V 800MA DDPAK-3
Packaging: Cut Tape (CT)
Package / Case: TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 800mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 130 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: DDPAK-3
Voltage - Output (Min/Fixed): 3.3V
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 1.2V @ 800mA
Protection Features: Over Current, Over Temperature
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9+2.56 EUR
25+2.17 EUR
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PIC32MZ2064DAH169-I/6J PIC32MZ-Graphics-DA-Family-Data-Sheet-DS60001361J.pdf
PIC32MZ2064DAH169-I/6J
Hersteller: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
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AnzahlPrivatkunde
1+45.93 EUR
25+42.1 EUR
100+38.1 EUR
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PIC32MZ1025DAH169T-I/6J PIC32MZ-Graphics-DA-Family-Data-Sheet-DS60001361J.pdf
PIC32MZ1025DAH169T-I/6J
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1500+30.1 EUR
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PIC32MZ1025DAH169T-I/6J PIC32MZ-Graphics-DA-Family-Data-Sheet-DS60001361J.pdf
PIC32MZ1025DAH169T-I/6J
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Cut Tape (CT)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
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1+36.21 EUR
25+35.27 EUR
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PIC32MZ2025DAH169T-I/6J PIC32MZ-Graphics-DA-Family-Data-Sheet-DS60001361J.pdf
PIC32MZ2025DAH169T-I/6J
Hersteller: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 169LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC32MZ2025DAH169T-I/6J PIC32MZ-Graphics-DA-Family-Data-Sheet-DS60001361J.pdf
PIC32MZ2025DAH169T-I/6J
Hersteller: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 169LFBGA
Packaging: Cut Tape (CT)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
auf Bestellung 10 Stücke:
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1+40.54 EUR
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PIC32MZ2064DAH169T-I/6J PIC32MZ-Graphics-DA-Family-Data-Sheet-DS60001361J.pdf
PIC32MZ2064DAH169T-I/6J
Hersteller: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 169LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC32MZ2064DAH169T-I/6J PIC32MZ-Graphics-DA-Family-Data-Sheet-DS60001361J.pdf
PIC32MZ2064DAH169T-I/6J
Hersteller: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 169LFBGA
Packaging: Cut Tape (CT)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 640K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
auf Bestellung 1380 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+45.97 EUR
25+44.77 EUR
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AT45DB1282-TC AT45DB1282.pdf
AT45DB1282-TC
Hersteller: Microchip Technology
Description: IC FLASH 128MBIT SPI 40TSOP
Packaging: Tray
Package / Case: 40-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TC)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 40 MHz
Memory Format: FLASH
Supplier Device Package: 40-TSOP
Part Status: Obsolete
Write Cycle Time - Word, Page: 50ms
Memory Interface: SPI
Memory Organization: 1056 Bytes x 16,384 pages
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCP6292-H/MS MCP6291-Family-Data-Sheet-DS20001812G.pdf
MCP6292-H/MS
Hersteller: Microchip Technology
Description: IC OP AMP 2CH 8-MSOP
Packaging: Tube
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 150°C (TA)
Current - Supply: 1mA (x2 Channels)
Slew Rate: 7V/µs
Gain Bandwidth Product: 10 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 3 mV
Supplier Device Package: 8-MSOP
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 25 mA
Voltage - Supply Span (Min): 2.4 V
Voltage - Supply Span (Max): 6 V
auf Bestellung 417 Stücke:
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9+2.43 EUR
25+2.02 EUR
100+1.84 EUR
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PIC24FJ128GL302T-I/ML PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf
PIC24FJ128GL302T-I/ML
Hersteller: Microchip Technology
Description: IC MCU 16BIT 128KB FLASH 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 21
Produkt ist nicht verfügbar
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PIC24FJ128GL302T-I/ML PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf
PIC24FJ128GL302T-I/ML
Hersteller: Microchip Technology
Description: IC MCU 16BIT 128KB FLASH 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 21
Produkt ist nicht verfügbar
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PIC24FJ128GL302T-I/MV PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf
PIC24FJ128GL302T-I/MV
Hersteller: Microchip Technology
Description: IC MCU 16BIT 128KB FLASH 28UQFN
Packaging: Tape & Reel (TR)
Package / Case: 28-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 28-UQFN (4x4)
Grade: Automotive
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PIC24FJ128GL302T-I/MV PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf
PIC24FJ128GL302T-I/MV
Hersteller: Microchip Technology
Description: IC MCU 16BIT 128KB FLASH 28UQFN
Packaging: Cut Tape (CT)
Package / Case: 28-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 28-UQFN (4x4)
Grade: Automotive
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 798 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5+4.84 EUR
25+4.45 EUR
100+4.01 EUR
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PIC24FJ128GL302T-I/SO PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf
Hersteller: Microchip Technology
Description: IC MCU 16BIT 128KB FLASH 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 21
Produkt ist nicht verfügbar
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PIC24FJ128GL302T-I/SO PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf
Hersteller: Microchip Technology
Description: IC MCU 16BIT 128KB FLASH 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 21
Produkt ist nicht verfügbar
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PIC24FJ128GL305T-I/M4 PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf
PIC24FJ128GL305T-I/M4
Hersteller: Microchip Technology
Description: IC MCU 16BIT 128KB FLASH 48UQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 12x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 48-UQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PIC24FJ128GL305T-I/M4 PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf
PIC24FJ128GL305T-I/M4
Hersteller: Microchip Technology
Description: IC MCU 16BIT 128KB FLASH 48UQFN
Packaging: Cut Tape (CT)
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 12x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 48-UQFN (6x6)
Grade: Automotive
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 2697 Stücke:
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5+4.8 EUR
25+4.43 EUR
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PIC24FJ128GL303T-I/M5 PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf
PIC24FJ128GL303T-I/M5
Hersteller: Microchip Technology
Description: IC MCU 16BIT 128KB FLASH 36UQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 11x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 36-UQFN (5x5)
Grade: Automotive
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PIC24FJ128GL306T-I/MR PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf
PIC24FJ128GL306T-I/MR
Hersteller: Microchip Technology
Description: IC MCU 16BIT 128KB FLASH 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 17x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Grade: Automotive
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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3300+4.68 EUR
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PIC24FJ128GL306T-I/MR PIC24FJ128GL306-Family-Data-Sheet-DS30010198B.pdf
PIC24FJ128GL306T-I/MR
Hersteller: Microchip Technology
Description: IC MCU 16BIT 128KB FLASH 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 17x10/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Grade: Automotive
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 8088 Stücke:
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4+5.63 EUR
25+5.18 EUR
100+4.68 EUR
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MSMLJ170CAe3 10563-msml-datasheet
MSMLJ170CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 170VWM 275VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 11A
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: DO-214AB
Bidirectional Channels: 1
Voltage - Breakdown (Min): 189V
Voltage - Clamping (Max) @ Ipp: 275V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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DSC6331JI2FA-027.0000T filehandler.aspx?ddocname=en600231
Hersteller: Microchip Technology
Description: MEMS OSC XO 27.0000MHZ LVCMOS
Produkt ist nicht verfügbar
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DSC6331JI2FA-027.0000T filehandler.aspx?ddocname=en600231
Hersteller: Microchip Technology
Description: MEMS OSC XO 27.0000MHZ LVCMOS
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DSC6331JI2FA-026.0000T filehandler.aspx?ddocname=en600231
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ LVCMOS
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DSC6331JI2FA-026.0000T filehandler.aspx?ddocname=en600231
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ LVCMOS
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DSC6331JI2GA-026.0000T filehandler.aspx?ddocname=en600231
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ LVCMOS
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DSC6331JI2GA-026.0000T filehandler.aspx?ddocname=en600231
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ LVCMOS
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DSC6331JI2GA-027.0000T filehandler.aspx?ddocname=en600231
Hersteller: Microchip Technology
Description: MEMS OSC XO 27.0000MHZ LVCMOS
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DSC6331JI2GA-027.0000T filehandler.aspx?ddocname=en600231
Hersteller: Microchip Technology
Description: MEMS OSC XO 27.0000MHZ LVCMOS
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DSC6331JI2LA-026.0000T filehandler.aspx?ddocname=en600231
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ LVCMOS
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DSC6331JI2LA-026.0000T filehandler.aspx?ddocname=en600231
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ LVCMOS
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DSC6331JI2LA-027.0000T filehandler.aspx?ddocname=en600231
Hersteller: Microchip Technology
Description: MEMS OSC XO 27.0000MHZ LVCMOS
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Hersteller: Microchip Technology
Description: MEMS OSC XO 27.0000MHZ LVCMOS
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VXC4-1EE-13-25M0000000 VXC4-April-2020.pdf
Hersteller: Microchip Technology
Description: OSCILLATOR CMOS SMD
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VXC1-1EE-13-25M0000000 VXC1-April-2020.pdf
Hersteller: Microchip Technology
Description: OSCILLATOR CMOS SMD
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AVR128DB48-I/6LX AVR128DB28-32-48-64-DataSheet-DS40002247A.pdf
AVR128DB48-I/6LX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 128KB FLASH 48VQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: AVR
Data Converters: A/D 18x12b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
auf Bestellung 121 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6+3.86 EUR
25+3.51 EUR
100+3.18 EUR
Mindestbestellmenge: 6 Stücke
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DSA1121BA2-025.0000TVAO DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121BA2-025.0000VAO DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121BI2-027.0000TVAO DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121BI2-027.0000VAO DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121BI2-028.6364TVAO DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121BI2-028.6364VAO DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121CA1-016.0000TVAO DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf
DSA1121CA1-016.0000TVAO
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
Packaging: Bulk
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
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DSA1121CA1-016.0000VAO DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf
DSA1121CA1-016.0000VAO
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
Packaging: Bulk
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
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DSA1121CA2-008.0000TVAO DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE CMOS
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DSA1121CA2-008.0000VAO DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121CA2-024.0000TVAO DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121CA2-024.0000VAO DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121CA2-040.0000TVAO DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121CA2-040.0000VAO DSA1101-21-05-25-Low-Jitter-Precision-CMOS-Oscillator-for-Automotive-DS20005890B.pdf
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121DA2-027.0000TVAO filehandler.aspx?ddocname=en605044
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121DA2-027.0000VAO filehandler.aspx?ddocname=en605044
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121DI3-033.3333TVAO filehandler.aspx?ddocname=en605044
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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DSA1121DI3-033.3333VAO filehandler.aspx?ddocname=en605044
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, AUTOMOTIVE, CMO
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