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DSPIC33CK64MC105-I/M4 DSPIC33CK64MC105-I/M4 Microchip Technology dsPIC33CK64MC105-Family-Data-Sheet-DS70005399C.pdf Description: IC MCU 16BIT 64KB FLASH 48UQFN
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-UQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, Smart Card, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 15x12b; D/A 1x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-UFQFN Exposed Pad
Packaging: Tube
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
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DSPIC33CK64MC105-I/PT DSPIC33CK64MC105-I/PT Microchip Technology dsPIC33CK64MC105-Family-Data-Sheet-DS70005399C.pdf Description: IC MCU 16BIT 64KB FLASH 48TQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, Smart Card, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 15x12b; D/A 1x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tray
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DSPIC33CK32MC105-E/PT DSPIC33CK32MC105-E/PT Microchip Technology Description: IC MCU 16BIT 32KB FLASH 48TQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, Smart Card, WDT
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 15x12b; D/A 1x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tray
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DSPIC33CK64MC105-E/PT DSPIC33CK64MC105-E/PT Microchip Technology dsPIC33CK64MC105-Family-Data-Sheet-DS70005399C.pdf Description: IC MCU 16BIT 64KB FLASH 48TQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, Smart Card, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 15x12b; D/A 1x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tray
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MSMLJ28CA MSMLJ28CA Microchip Technology 10563-msml-datasheet Description: TVS DIODE 28VWM 45.4VC DO214AB
Qualification: MIL-PRF-19500
Grade: Military
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AB, SMC
Packaging: Bulk
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 3000W (3kW)
Voltage - Clamping (Max) @ Ipp: 45.4V
Voltage - Breakdown (Min): 31.1V
Bidirectional Channels: 1
Supplier Device Package: DO-214AB
Voltage - Reverse Standoff (Typ): 28V
Current - Peak Pulse (10/1000µs): 66A
Applications: General Purpose
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MIC2536-2BMM TR MIC2536-2BMM TR Microchip Technology MCRLS03503-1.pdf?t.download=true&u=5oefqw Description: DUAL USB POWER DISTRIBUTION SWIT
Part Status: Active
Fault Protection: Current Limiting (Fixed), Over Temperature
Supplier Device Package: 8-MSOP
Ratio - Input:Output: 1:2
Current - Output (Max): 150mA
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Voltage - Load: 6V
Input Type: Non-Inverting
Rds On (Typ): 400mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 85°C (TA)
Switch Type: USB Switch
Interface: On/Off
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Features: Slew Rate Controlled, Status Flag
Packaging: Bulk
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JANTXV1N6637US JANTXV1N6637US Microchip Technology 1N4954US-96US%2C1N5968US-69US%2C1N6632US-1N6637US.pdf Description: DIODE ZENER 5.1V 5W D5B
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 1.5 Ohms
Supplier Device Package: D-5B
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Qualification: MIL-PRF-19500/356
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TC2117-3.3VDBTR TC2117-3.3VDBTR Microchip Technology 50001894.pdf Description: IC REG LIN 3.3V 800MA SOT-223-3
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 800mA
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 130 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-223-3
Voltage - Output (Min/Fixed): 3.3V
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 1.2V @ 800mA
Protection Features: Over Current, Over Temperature
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PIC16F18425T-I/SL PIC16F18425T-I/SL Microchip Technology 40001894B.pdf Description: IC MCU 8BIT 14KB FLASH 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: EUSART, I2C, LINbus, MSSP, SMBus/PMBus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Part Status: Active
Number of I/O: 11
DigiKey Programmable: Not Verified
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PIC16F18425T-I/SL PIC16F18425T-I/SL Microchip Technology 40001894B.pdf Description: IC MCU 8BIT 14KB FLASH 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: EUSART, I2C, LINbus, MSSP, SMBus/PMBus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Part Status: Active
Number of I/O: 11
DigiKey Programmable: Not Verified
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JANTX1N6146A JANTX1N6146A Microchip Technology 127853-1n6138-1n6173a-tvs-diode-series-datasheet Description: TVS DIODE 11.4VWM 21VC C AXIAL
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24CW1280T-I/ST 24CW1280T-I/ST Microchip Technology 24CW16X-24CW32X-24CW64X-24CW128X-Data-Sheet-20005772B.pdf Description: IC EEPROM 128KBIT I2C 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 128Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.6V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 450 ns
Memory Organization: 16K x 8
DigiKey Programmable: Not Verified
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DSC1103CL2-333.3333 Microchip Technology filehandler.aspx?ddocname=en576728 Description: MEMS OSC LOW POWER LVDS -40C-105
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DSC1103CL2-333.3333T Microchip Technology filehandler.aspx?ddocname=en576728 Description: MEMS OSC LOW POWER LVDS -40C-105
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DSC1123CL2-333.3333 Microchip Technology filehandler.aspx?ddocname=en576728 Description: MEMS OSC LOW POWER LVDS -40C-105
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DSC1123CL2-333.3333T Microchip Technology filehandler.aspx?ddocname=en576728 Description: MEMS OSC LOW POWER LVDS -40C-105
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MSMCJ45CAe3 MSMCJ45CAe3 Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 45VWM 72.7VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 20.6A
Voltage - Reverse Standoff (Typ): 45V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 50V
Voltage - Clamping (Max) @ Ipp: 72.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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DSC6001CI2A-012.1732T Microchip Technology Description: OSC MEMS LOW PWR LVCMOS
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DSC6001CI2A-012.1732 Microchip Technology Description: OSC MEMS LOW PWR LVCMOS
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JAN1N1188 JAN1N1188 Microchip Technology 8951-lds-0138-pdf Description: DIODE GEN PURP 400V 35A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-5
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 110 A
Current - Reverse Leakage @ Vr: 10 µA @ 400 V
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MP6KE7.5CA MP6KE7.5CA Microchip Technology rf01007_rb.pdf Description: TVS DIODE 6.4VWM 11.3VC T18
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 11.3V
Voltage - Breakdown (Min): 7.13V
Bidirectional Channels: 1
Supplier Device Package: T-18
Voltage - Reverse Standoff (Typ): 6.4V
Current - Peak Pulse (10/1000µs): 53A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: T-18, Axial
Packaging: Bulk
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MP6KE7.5CAe3 MP6KE7.5CAe3 Microchip Technology rf01007_rb.pdf Description: TVS DIODE 6.4VWM 11.3VC T18
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 11.3V
Voltage - Breakdown (Min): 7.13V
Bidirectional Channels: 1
Supplier Device Package: T-18
Voltage - Reverse Standoff (Typ): 6.4V
Current - Peak Pulse (10/1000µs): 53A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: T-18, Axial
Packaging: Bulk
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MAP6KE7.5CA MAP6KE7.5CA Microchip Technology rf01007_rb.pdf Description: TVS DIODE 6.4VWM 11.3VC T18
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 11.3V
Voltage - Breakdown (Min): 7.13V
Bidirectional Channels: 1
Supplier Device Package: T-18
Voltage - Reverse Standoff (Typ): 6.4V
Current - Peak Pulse (10/1000µs): 53A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: T-18, Axial
Packaging: Bulk
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MAP6KE7.5CAe3 MAP6KE7.5CAe3 Microchip Technology rf01007_rb.pdf Description: TVS DIODE 6.4VWM 11.3VC T18
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 11.3V
Voltage - Breakdown (Min): 7.13V
Bidirectional Channels: 1
Supplier Device Package: T-18
Voltage - Reverse Standoff (Typ): 6.4V
Current - Peak Pulse (10/1000µs): 53A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: T-18, Axial
Packaging: Bulk
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MXLP6KE7.5CA MXLP6KE7.5CA Microchip Technology 9518-mp6ke-pdf Description: TVS DIODE 6.4VWM 11.3VC T18
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 11.3V
Voltage - Breakdown (Min): 7.13V
Bidirectional Channels: 1
Supplier Device Package: T-18
Voltage - Reverse Standoff (Typ): 6.4V
Current - Peak Pulse (10/1000µs): 53A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: T-18, Axial
Packaging: Bulk
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MXLP6KE7.5CAe3 MXLP6KE7.5CAe3 Microchip Technology 9518-mp6ke-pdf Description: TVS DIODE 6.4VWM 11.3VC T18
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 11.3V
Voltage - Breakdown (Min): 7.13V
Bidirectional Channels: 1
Supplier Device Package: T-18
Voltage - Reverse Standoff (Typ): 6.4V
Current - Peak Pulse (10/1000µs): 53A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: T-18, Axial
Packaging: Bulk
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
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MXP6KE7.5CA MXP6KE7.5CA Microchip Technology 9518-mp6ke-pdf Description: TVS DIODE 6.4VWM 11.3VC T18
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 11.3V
Voltage - Breakdown (Min): 7.13V
Bidirectional Channels: 1
Supplier Device Package: T-18
Voltage - Reverse Standoff (Typ): 6.4V
Current - Peak Pulse (10/1000µs): 53A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: T-18, Axial
Packaging: Bulk
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MXP6KE7.5CAe3 MXP6KE7.5CAe3 Microchip Technology 9518-mp6ke-pdf Description: TVS DIODE 6.4VWM 11.3VC T18
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 11.3V
Voltage - Breakdown (Min): 7.13V
Bidirectional Channels: 1
Supplier Device Package: T-18
Voltage - Reverse Standoff (Typ): 6.4V
Current - Peak Pulse (10/1000µs): 53A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: T-18, Axial
Packaging: Bulk
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ATSAML10D16A-MF ATSAML10D16A-MF Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 24VQFN
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 17
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
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ATSAML11D16A-MU ATSAML11D16A-MU Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 24VQFN
DigiKey Programmable: Not Verified
Number of I/O: 17
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
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ATSAML11D16A-MF ATSAML11D16A-MF Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 24VQFN
DigiKey Programmable: Not Verified
Number of I/O: 17
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
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ATSAML10D16A-MUT ATSAML10D16A-MUT Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 24VQFN
DigiKey Programmable: Not Verified
Number of I/O: 17
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATSAML10D16A-MUT ATSAML10D16A-MUT Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 24VQFN
DigiKey Programmable: Not Verified
Number of I/O: 17
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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ATSAML10D16A-MFT ATSAML10D16A-MFT Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 24VQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 5x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 24-VQFN (4x4)
Number of I/O: 17
DigiKey Programmable: Not Verified
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ATSAML10D16A-MFT ATSAML10D16A-MFT Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 24VQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 5x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 24-VQFN (4x4)
Number of I/O: 17
DigiKey Programmable: Not Verified
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ATSAML11D16A-MUT ATSAML11D16A-MUT Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 24VQFN
Number of I/O: 17
Part Status: Active
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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ATSAML11D16A-MUT ATSAML11D16A-MUT Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 24VQFN
DigiKey Programmable: Not Verified
Number of I/O: 17
Part Status: Active
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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ATSAML11D16A-MFT ATSAML11D16A-MFT Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 24VQFN
DigiKey Programmable: Not Verified
Number of I/O: 17
Part Status: Active
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATSAML11D16A-MFT ATSAML11D16A-MFT Microchip Technology SAM-L10L11-Family-DataSheet-DS60001513F.pdf Description: IC MCU 32BIT 64KB FLASH 24VQFN
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 17
Part Status: Active
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
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1000+4.7 EUR
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LM2576-12BUTR LM2576-12BUTR Microchip Technology MCRLS03589-1.pdf?t.download=true&u=5oefqw Description: IC REG BUCK 12V 3A TO263-5
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 3A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Packaging: Bulk
Part Status: Active
Voltage - Output (Min/Fixed): 12V
Voltage - Input (Min): 4V
Synchronous Rectifier: No
Supplier Device Package: TO-263-5
Topology: Buck
Voltage - Input (Max): 40V
Frequency - Switching: 52kHz
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LM2576-12BU TR LM2576-12BU TR Microchip Technology MCRLS03589-1.pdf?t.download=true&u=5oefqw Description: IC REG BUCK 12V 3A TO263-5
Packaging: Bulk
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 52kHz
Voltage - Input (Max): 40V
Topology: Buck
Supplier Device Package: TO-263-5
Synchronous Rectifier: No
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 12V
Part Status: Active
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ATSAMA5D22C-CUR ATSAMA5D22C-CUR Microchip Technology SAMA5D2-Series-Datasheet-DS60001476H.pdf Description: IC MPU SAMA5D2 500MHZ 196TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 196-TFBGA (11x11)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
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ATSAMA5D22C-CUR ATSAMA5D22C-CUR Microchip Technology SAMA5D2-Series-Datasheet-DS60001476H.pdf Description: IC MPU SAMA5D2 500MHZ 196TFBGA
Packaging: Cut Tape (CT)
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 196-TFBGA (11x11)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
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ATSAMA5D24C-CUR ATSAMA5D24C-CUR Microchip Technology SAMA5D2-Series-Datasheet-ds60001476.pdf Description: IC MPU SAMA5D2 500MHZ 256TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 256-TFBGA (8x8)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
Produkt ist nicht verfügbar
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ATSAMA5D24C-CUR ATSAMA5D24C-CUR Microchip Technology SAMA5D2-Series-Datasheet-ds60001476.pdf Description: IC MPU SAMA5D2 500MHZ 256TFBGA
Packaging: Cut Tape (CT)
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 256-TFBGA (8x8)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
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AT28HC256-90SU AT28HC256-90SU Microchip Technology AT28HC256-256-Kbit-32%2C768x8-High-Speed-Parallel-EEPROM-DS20006428.pdf Description: IC EEPROM 256KBIT PAR 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 256Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 32K x 8
DigiKey Programmable: Not Verified
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AT28HC64B-90SU-T AT28HC64B-90SU-T Microchip Technology doc0274.pdf Description: IC EEPROM 64KBIT PARALLEL 28SOIC
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AT28HC64B-90SU-T AT28HC64B-90SU-T Microchip Technology doc0274.pdf Description: IC EEPROM 64KBIT PARALLEL 28SOIC
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AT28HC64BF-12SU-T AT28HC64BF-12SU-T Microchip Technology doc3648.pdf Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 8K x 8
DigiKey Programmable: Verified
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AT28HC64BF-12SU-T AT28HC64BF-12SU-T Microchip Technology doc3648.pdf Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 8K x 8
DigiKey Programmable: Verified
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AT28HC64B-12SU-T AT28HC64B-12SU-T Microchip Technology doc0274.pdf Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 8K x 8
DigiKey Programmable: Not Verified
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AT28HC64B-12SU-T AT28HC64B-12SU-T Microchip Technology doc0274.pdf Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 8K x 8
DigiKey Programmable: Not Verified
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AT28HC64B-70SU-T AT28HC64B-70SU-T Microchip Technology doc0274.pdf Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 8K x 8
DigiKey Programmable: Not Verified
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AT28HC64B-70SU-T AT28HC64B-70SU-T Microchip Technology doc0274.pdf Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 8K x 8
DigiKey Programmable: Not Verified
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AT28HC64B-90TU-T AT28HC64B-90TU-T Microchip Technology doc0274.pdf Description: IC EEPROM 64KBIT PARALLEL 28TSOP
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AT28HC64B-90TU-T AT28HC64B-90TU-T Microchip Technology doc0274.pdf Description: IC EEPROM 64KBIT PARALLEL 28TSOP
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2+13.7 EUR
25+13.2 EUR
100+12.66 EUR
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AT28HC256-90TU-T AT28HC256-90TU-T Microchip Technology Military-Grade-256-Kbit-High-Speed-Paged-Parallel-EEPROM-Data-Sheet-20006352A.pdf Description: IC EEPROM 256KBIT PAR 28TSOP
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AT28HC256-90TU-T AT28HC256-90TU-T Microchip Technology Military-Grade-256-Kbit-High-Speed-Paged-Parallel-EEPROM-Data-Sheet-20006352A.pdf Description: IC EEPROM 256KBIT PAR 28TSOP
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AT28HC256-12TU-T AT28HC256-12TU-T Microchip Technology Military-Grade-256-Kbit-High-Speed-Paged-Parallel-EEPROM-Data-Sheet-20006352A.pdf Description: IC EEPROM 256KBIT PAR 28TSOP
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AT28HC256-12TU-T AT28HC256-12TU-T Microchip Technology Military-Grade-256-Kbit-High-Speed-Paged-Parallel-EEPROM-Data-Sheet-20006352A.pdf Description: IC EEPROM 256KBIT PAR 28TSOP
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DSPIC33CK64MC105-I/M4 dsPIC33CK64MC105-Family-Data-Sheet-DS70005399C.pdf
DSPIC33CK64MC105-I/M4
Hersteller: Microchip Technology
Description: IC MCU 16BIT 64KB FLASH 48UQFN
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-UQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, Smart Card, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 15x12b; D/A 1x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-UFQFN Exposed Pad
Packaging: Tube
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
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DSPIC33CK64MC105-I/PT dsPIC33CK64MC105-Family-Data-Sheet-DS70005399C.pdf
DSPIC33CK64MC105-I/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 64KB FLASH 48TQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, Smart Card, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 15x12b; D/A 1x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tray
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DSPIC33CK32MC105-E/PT
DSPIC33CK32MC105-E/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 32KB FLASH 48TQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, Smart Card, WDT
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 15x12b; D/A 1x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tray
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DSPIC33CK64MC105-E/PT dsPIC33CK64MC105-Family-Data-Sheet-DS70005399C.pdf
DSPIC33CK64MC105-E/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 64KB FLASH 48TQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, Smart Card, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 15x12b; D/A 1x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tray
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MSMLJ28CA 10563-msml-datasheet
MSMLJ28CA
Hersteller: Microchip Technology
Description: TVS DIODE 28VWM 45.4VC DO214AB
Qualification: MIL-PRF-19500
Grade: Military
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-214AB, SMC
Packaging: Bulk
Part Status: Active
Power Line Protection: No
Power - Peak Pulse: 3000W (3kW)
Voltage - Clamping (Max) @ Ipp: 45.4V
Voltage - Breakdown (Min): 31.1V
Bidirectional Channels: 1
Supplier Device Package: DO-214AB
Voltage - Reverse Standoff (Typ): 28V
Current - Peak Pulse (10/1000µs): 66A
Applications: General Purpose
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MIC2536-2BMM TR MCRLS03503-1.pdf?t.download=true&u=5oefqw
MIC2536-2BMM TR
Hersteller: Microchip Technology
Description: DUAL USB POWER DISTRIBUTION SWIT
Part Status: Active
Fault Protection: Current Limiting (Fixed), Over Temperature
Supplier Device Package: 8-MSOP
Ratio - Input:Output: 1:2
Current - Output (Max): 150mA
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Voltage - Load: 6V
Input Type: Non-Inverting
Rds On (Typ): 400mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 85°C (TA)
Switch Type: USB Switch
Interface: On/Off
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Features: Slew Rate Controlled, Status Flag
Packaging: Bulk
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JANTXV1N6637US 1N4954US-96US%2C1N5968US-69US%2C1N6632US-1N6637US.pdf
JANTXV1N6637US
Hersteller: Microchip Technology
Description: DIODE ZENER 5.1V 5W D5B
Tolerance: ±5%
Packaging: Bulk
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 1.5 Ohms
Supplier Device Package: D-5B
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Qualification: MIL-PRF-19500/356
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TC2117-3.3VDBTR 50001894.pdf
TC2117-3.3VDBTR
Hersteller: Microchip Technology
Description: IC REG LIN 3.3V 800MA SOT-223-3
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 800mA
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 130 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-223-3
Voltage - Output (Min/Fixed): 3.3V
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 1.2V @ 800mA
Protection Features: Over Current, Over Temperature
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PIC16F18425T-I/SL 40001894B.pdf
PIC16F18425T-I/SL
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: EUSART, I2C, LINbus, MSSP, SMBus/PMBus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Part Status: Active
Number of I/O: 11
DigiKey Programmable: Not Verified
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PIC16F18425T-I/SL 40001894B.pdf
PIC16F18425T-I/SL
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: EUSART, I2C, LINbus, MSSP, SMBus/PMBus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Part Status: Active
Number of I/O: 11
DigiKey Programmable: Not Verified
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JANTX1N6146A 127853-1n6138-1n6173a-tvs-diode-series-datasheet
JANTX1N6146A
Hersteller: Microchip Technology
Description: TVS DIODE 11.4VWM 21VC C AXIAL
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24CW1280T-I/ST 24CW16X-24CW32X-24CW64X-24CW128X-Data-Sheet-20005772B.pdf
24CW1280T-I/ST
Hersteller: Microchip Technology
Description: IC EEPROM 128KBIT I2C 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 128Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.6V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 450 ns
Memory Organization: 16K x 8
DigiKey Programmable: Not Verified
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DSC1103CL2-333.3333 filehandler.aspx?ddocname=en576728
Hersteller: Microchip Technology
Description: MEMS OSC LOW POWER LVDS -40C-105
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DSC1103CL2-333.3333T filehandler.aspx?ddocname=en576728
Hersteller: Microchip Technology
Description: MEMS OSC LOW POWER LVDS -40C-105
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DSC1123CL2-333.3333 filehandler.aspx?ddocname=en576728
Hersteller: Microchip Technology
Description: MEMS OSC LOW POWER LVDS -40C-105
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DSC1123CL2-333.3333T filehandler.aspx?ddocname=en576728
Hersteller: Microchip Technology
Description: MEMS OSC LOW POWER LVDS -40C-105
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MSMCJ45CAe3 10561-msmc-datasheet
MSMCJ45CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 45VWM 72.7VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 20.6A
Voltage - Reverse Standoff (Typ): 45V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 50V
Voltage - Clamping (Max) @ Ipp: 72.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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DSC6001CI2A-012.1732T
Hersteller: Microchip Technology
Description: OSC MEMS LOW PWR LVCMOS
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DSC6001CI2A-012.1732
Hersteller: Microchip Technology
Description: OSC MEMS LOW PWR LVCMOS
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JAN1N1188 8951-lds-0138-pdf
JAN1N1188
Hersteller: Microchip Technology
Description: DIODE GEN PURP 400V 35A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-5
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 110 A
Current - Reverse Leakage @ Vr: 10 µA @ 400 V
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MP6KE7.5CA rf01007_rb.pdf
MP6KE7.5CA
Hersteller: Microchip Technology
Description: TVS DIODE 6.4VWM 11.3VC T18
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 11.3V
Voltage - Breakdown (Min): 7.13V
Bidirectional Channels: 1
Supplier Device Package: T-18
Voltage - Reverse Standoff (Typ): 6.4V
Current - Peak Pulse (10/1000µs): 53A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: T-18, Axial
Packaging: Bulk
Produkt ist nicht verfügbar
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MP6KE7.5CAe3 rf01007_rb.pdf
MP6KE7.5CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 6.4VWM 11.3VC T18
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 11.3V
Voltage - Breakdown (Min): 7.13V
Bidirectional Channels: 1
Supplier Device Package: T-18
Voltage - Reverse Standoff (Typ): 6.4V
Current - Peak Pulse (10/1000µs): 53A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: T-18, Axial
Packaging: Bulk
Produkt ist nicht verfügbar
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MAP6KE7.5CA rf01007_rb.pdf
MAP6KE7.5CA
Hersteller: Microchip Technology
Description: TVS DIODE 6.4VWM 11.3VC T18
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 11.3V
Voltage - Breakdown (Min): 7.13V
Bidirectional Channels: 1
Supplier Device Package: T-18
Voltage - Reverse Standoff (Typ): 6.4V
Current - Peak Pulse (10/1000µs): 53A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: T-18, Axial
Packaging: Bulk
Produkt ist nicht verfügbar
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MAP6KE7.5CAe3 rf01007_rb.pdf
MAP6KE7.5CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 6.4VWM 11.3VC T18
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 11.3V
Voltage - Breakdown (Min): 7.13V
Bidirectional Channels: 1
Supplier Device Package: T-18
Voltage - Reverse Standoff (Typ): 6.4V
Current - Peak Pulse (10/1000µs): 53A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: T-18, Axial
Packaging: Bulk
Produkt ist nicht verfügbar
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MXLP6KE7.5CA 9518-mp6ke-pdf
MXLP6KE7.5CA
Hersteller: Microchip Technology
Description: TVS DIODE 6.4VWM 11.3VC T18
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 11.3V
Voltage - Breakdown (Min): 7.13V
Bidirectional Channels: 1
Supplier Device Package: T-18
Voltage - Reverse Standoff (Typ): 6.4V
Current - Peak Pulse (10/1000µs): 53A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: T-18, Axial
Packaging: Bulk
Produkt ist nicht verfügbar
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MXLP6KE7.5CAe3 9518-mp6ke-pdf
MXLP6KE7.5CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 6.4VWM 11.3VC T18
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 11.3V
Voltage - Breakdown (Min): 7.13V
Bidirectional Channels: 1
Supplier Device Package: T-18
Voltage - Reverse Standoff (Typ): 6.4V
Current - Peak Pulse (10/1000µs): 53A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: T-18, Axial
Packaging: Bulk
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Produkt ist nicht verfügbar
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MXP6KE7.5CA 9518-mp6ke-pdf
MXP6KE7.5CA
Hersteller: Microchip Technology
Description: TVS DIODE 6.4VWM 11.3VC T18
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 11.3V
Voltage - Breakdown (Min): 7.13V
Bidirectional Channels: 1
Supplier Device Package: T-18
Voltage - Reverse Standoff (Typ): 6.4V
Current - Peak Pulse (10/1000µs): 53A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: T-18, Axial
Packaging: Bulk
Produkt ist nicht verfügbar
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MXP6KE7.5CAe3 9518-mp6ke-pdf
MXP6KE7.5CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 6.4VWM 11.3VC T18
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 600W
Voltage - Clamping (Max) @ Ipp: 11.3V
Voltage - Breakdown (Min): 7.13V
Bidirectional Channels: 1
Supplier Device Package: T-18
Voltage - Reverse Standoff (Typ): 6.4V
Current - Peak Pulse (10/1000µs): 53A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: T-18, Axial
Packaging: Bulk
Produkt ist nicht verfügbar
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ATSAML10D16A-MF SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML10D16A-MF
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 24VQFN
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 17
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
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4+5.28 EUR
25+4.82 EUR
100+4.37 EUR
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ATSAML11D16A-MU SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML11D16A-MU
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 24VQFN
DigiKey Programmable: Not Verified
Number of I/O: 17
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
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5+5.18 EUR
25+4.72 EUR
100+4.28 EUR
1000+4.12 EUR
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ATSAML11D16A-MF SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML11D16A-MF
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 24VQFN
DigiKey Programmable: Not Verified
Number of I/O: 17
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
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4+5.84 EUR
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ATSAML10D16A-MUT SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML10D16A-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 24VQFN
DigiKey Programmable: Not Verified
Number of I/O: 17
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATSAML10D16A-MUT SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML10D16A-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 24VQFN
DigiKey Programmable: Not Verified
Number of I/O: 17
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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ATSAML10D16A-MFT SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML10D16A-MFT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 24VQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 5x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 24-VQFN (4x4)
Number of I/O: 17
DigiKey Programmable: Not Verified
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ATSAML10D16A-MFT SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML10D16A-MFT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 24VQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 5x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 24-VQFN (4x4)
Number of I/O: 17
DigiKey Programmable: Not Verified
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ATSAML11D16A-MUT SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML11D16A-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 24VQFN
Number of I/O: 17
Part Status: Active
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAML11D16A-MUT SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML11D16A-MUT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 24VQFN
DigiKey Programmable: Not Verified
Number of I/O: 17
Part Status: Active
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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ATSAML11D16A-MFT SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML11D16A-MFT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 24VQFN
DigiKey Programmable: Not Verified
Number of I/O: 17
Part Status: Active
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATSAML11D16A-MFT SAM-L10L11-Family-DataSheet-DS60001513F.pdf
ATSAML11D16A-MFT
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 24VQFN
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 5x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 17
Part Status: Active
Supplier Device Package: 24-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
auf Bestellung 7250 Stücke:
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LM2576-12BUTR MCRLS03589-1.pdf?t.download=true&u=5oefqw
LM2576-12BUTR
Hersteller: Microchip Technology
Description: IC REG BUCK 12V 3A TO263-5
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 3A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Packaging: Bulk
Part Status: Active
Voltage - Output (Min/Fixed): 12V
Voltage - Input (Min): 4V
Synchronous Rectifier: No
Supplier Device Package: TO-263-5
Topology: Buck
Voltage - Input (Max): 40V
Frequency - Switching: 52kHz
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LM2576-12BU TR MCRLS03589-1.pdf?t.download=true&u=5oefqw
LM2576-12BU TR
Hersteller: Microchip Technology
Description: IC REG BUCK 12V 3A TO263-5
Packaging: Bulk
Package / Case: TO-263-6, D2PAK (5 Leads + Tab), TO-263BA
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 3A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 52kHz
Voltage - Input (Max): 40V
Topology: Buck
Supplier Device Package: TO-263-5
Synchronous Rectifier: No
Voltage - Input (Min): 4V
Voltage - Output (Min/Fixed): 12V
Part Status: Active
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ATSAMA5D22C-CUR SAMA5D2-Series-Datasheet-DS60001476H.pdf
ATSAMA5D22C-CUR
Hersteller: Microchip Technology
Description: IC MPU SAMA5D2 500MHZ 196TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 196-TFBGA (11x11)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
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1500+16.56 EUR
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ATSAMA5D22C-CUR SAMA5D2-Series-Datasheet-DS60001476H.pdf
ATSAMA5D22C-CUR
Hersteller: Microchip Technology
Description: IC MPU SAMA5D2 500MHZ 196TFBGA
Packaging: Cut Tape (CT)
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 196-TFBGA (11x11)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
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ATSAMA5D24C-CUR SAMA5D2-Series-Datasheet-ds60001476.pdf
ATSAMA5D24C-CUR
Hersteller: Microchip Technology
Description: IC MPU SAMA5D2 500MHZ 256TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 256-TFBGA (8x8)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
Produkt ist nicht verfügbar
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ATSAMA5D24C-CUR SAMA5D2-Series-Datasheet-ds60001476.pdf
ATSAMA5D24C-CUR
Hersteller: Microchip Technology
Description: IC MPU SAMA5D2 500MHZ 256TFBGA
Packaging: Cut Tape (CT)
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 256-TFBGA (8x8)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + HSIC
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: I2C, SMC, SPI, UART, USART, QSPI
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AT28HC256-90SU AT28HC256-256-Kbit-32%2C768x8-High-Speed-Parallel-EEPROM-DS20006428.pdf
AT28HC256-90SU
Hersteller: Microchip Technology
Description: IC EEPROM 256KBIT PAR 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 256Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 32K x 8
DigiKey Programmable: Not Verified
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AT28HC64B-90SU-T doc0274.pdf
AT28HC64B-90SU-T
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Produkt ist nicht verfügbar
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AT28HC64B-90SU-T doc0274.pdf
AT28HC64B-90SU-T
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Produkt ist nicht verfügbar
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AT28HC64BF-12SU-T doc3648.pdf
AT28HC64BF-12SU-T
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 8K x 8
DigiKey Programmable: Verified
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AT28HC64BF-12SU-T doc3648.pdf
AT28HC64BF-12SU-T
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 8K x 8
DigiKey Programmable: Verified
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2+13.11 EUR
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AT28HC64B-12SU-T doc0274.pdf
AT28HC64B-12SU-T
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 8K x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AT28HC64B-12SU-T doc0274.pdf
AT28HC64B-12SU-T
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 8K x 8
DigiKey Programmable: Not Verified
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2+13.3 EUR
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AT28HC64B-70SU-T doc0274.pdf
AT28HC64B-70SU-T
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 8K x 8
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1000+12.4 EUR
Mindestbestellmenge: 1000 Stücke
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AT28HC64B-70SU-T doc0274.pdf
AT28HC64B-70SU-T
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT PARALLEL 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Memory Format: EEPROM
Supplier Device Package: 28-SOIC
Write Cycle Time - Word, Page: 10ms
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 8K x 8
DigiKey Programmable: Not Verified
auf Bestellung 3977 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+13.55 EUR
Mindestbestellmenge: 2 Stücke
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AT28HC64B-90TU-T doc0274.pdf
AT28HC64B-90TU-T
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT PARALLEL 28TSOP
Produkt ist nicht verfügbar
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AT28HC64B-90TU-T doc0274.pdf
AT28HC64B-90TU-T
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT PARALLEL 28TSOP
auf Bestellung 700 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+13.7 EUR
25+13.2 EUR
100+12.66 EUR
Mindestbestellmenge: 2 Stücke
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AT28HC256-90TU-T Military-Grade-256-Kbit-High-Speed-Paged-Parallel-EEPROM-Data-Sheet-20006352A.pdf
AT28HC256-90TU-T
Hersteller: Microchip Technology
Description: IC EEPROM 256KBIT PAR 28TSOP
Produkt ist nicht verfügbar
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AT28HC256-90TU-T Military-Grade-256-Kbit-High-Speed-Paged-Parallel-EEPROM-Data-Sheet-20006352A.pdf
AT28HC256-90TU-T
Hersteller: Microchip Technology
Description: IC EEPROM 256KBIT PAR 28TSOP
Produkt ist nicht verfügbar
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AT28HC256-12TU-T Military-Grade-256-Kbit-High-Speed-Paged-Parallel-EEPROM-Data-Sheet-20006352A.pdf
AT28HC256-12TU-T
Hersteller: Microchip Technology
Description: IC EEPROM 256KBIT PAR 28TSOP
Produkt ist nicht verfügbar
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AT28HC256-12TU-T Military-Grade-256-Kbit-High-Speed-Paged-Parallel-EEPROM-Data-Sheet-20006352A.pdf
AT28HC256-12TU-T
Hersteller: Microchip Technology
Description: IC EEPROM 256KBIT PAR 28TSOP
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+20.25 EUR
Mindestbestellmenge: 2 Stücke
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