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MCP48CMD22-E/MG MCP48CMD22-E/MG Microchip Technology MCP48CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-SPI-Interface-DS20006667.pdf Description: IC DAC 12BIT V-OUT 16QFN
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 12
Data Interface: SPI
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 16-QFN (3x3)
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±1 (Max), ±1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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PIC18F46Q71-I/P PIC18F46Q71-I/P Microchip Technology Description: IC MCU 8BIT 64KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x8b, 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: FIFO, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Part Status: Active
Number of I/O: 37
DigiKey Programmable: Not Verified
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AVR32DD32-I/RXB AVR32DD32-I/RXB Microchip Technology AVR16-32DD28-32-DataSheet-DS40002441.pdf Description: IC MCU 8BIT 32KB FLASH 32VQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 23x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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AVR32DD28-I/SP AVR32DD28-I/SP Microchip Technology AVR16-32DD28-32-DataSheet-DS40002441.pdf Description: IC MCU 8BIT 32KB FLASH 28SPDIP
DigiKey Programmable: Not Verified
Package / Case: 28-DIP (0.300", 7.62mm)
Packaging: Tube
Number of I/O: 22
Part Status: Active
Supplier Device Package: 28-SPDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Through Hole
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AVR32DD28-I/STX AVR32DD28-I/STX Microchip Technology AVR16-32DD28-32-DataSheet-DS40002441.pdf Description: IC MCU 8BIT 32KB FLASH 28VQFN
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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AVR32DD28-I/SO AVR32DD28-I/SO Microchip Technology AVR16-32DD28-32-DataSheet-DS40002441.pdf Description: IC MCU 8BIT 32KB FLASH 28SOIC
DigiKey Programmable: Not Verified
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Number of I/O: 22
Part Status: Active
Supplier Device Package: 28-SOIC
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 256 x 8
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AVR32DD32-I/PT AVR32DD32-I/PT Microchip Technology AVR16-32DD28-32-DataSheet-DS40002441.pdf Description: IC MCU 8BIT 32KB FLASH 32TQFP
Packaging: Tray
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 23x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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MIC5318-1.3YD5 TR MIC5318-1.3YD5 TR Microchip Technology MCHP-S-A0009394028-1.pdf?t.download=true&u=5oefqw Description: HIGH PERFORMANCE 300 MA MICROCAP
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MIC5318-2.6YMT TR MIC5318-2.6YMT TR Microchip Technology MCHP-S-A0009394028-1.pdf?t.download=true&u=5oefqw Description: HIGH PERFORMANCE 300 MA MICROCAP
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MIC5318-2.6YD5 TR MIC5318-2.6YD5 TR Microchip Technology MCHP-S-A0009394028-1.pdf?t.download=true&u=5oefqw Description: HIGH PERFORMANCE 300 MA MICROCAP
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JANTXV1N6336C Microchip Technology 10924-lds-0193-datasheet Description: DIODE ZENER 33V 500MW DO35
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1N5916B 1N5916B Microchip Technology 10922-sa5-57-datasheet Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 4.3 V
Impedance (Max) (Zzt): 6 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
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1N5916B/TR 1N5916B/TR Microchip Technology Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 4.3 V
Impedance (Max) (Zzt): 6 Ohms
Supplier Device Package: DO-41
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
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1N5916B-1 Microchip Technology Description: ZENER DIODE
Packaging: Bulk
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1N5916B-1/TR Microchip Technology Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
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ATAES132A-SHER-T ATAES132A-SHER-T Microchip Technology Atmel-8914S-CryptoAuth-ATAES132A-Datasheet-Summary.pdf Description: IC AUTHENTICATION CHIP 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Applications: Networking and Communications
Supplier Device Package: 8-SOIC
Part Status: Active
DigiKey Programmable: Not Verified
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ATAES132A-SHER-T ATAES132A-SHER-T Microchip Technology Atmel-8914S-CryptoAuth-ATAES132A-Datasheet-Summary.pdf Description: IC AUTHENTICATION CHIP 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Applications: Networking and Communications
Supplier Device Package: 8-SOIC
Part Status: Active
DigiKey Programmable: Not Verified
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ATAES132A-MAHER-S ATAES132A-MAHER-S Microchip Technology ATAES132A-Data-Sheet-40002023A.pdf Description: IC AUTHENTICATION CHIP 8UDFN
DigiKey Programmable: Not Verified
Supplier Device Package: 8-UDFN (2x3)
Applications: Networking and Communications
Type: Authentication Chip
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Packaging: Cut Tape (CT)
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ATAES132A-MAHEQ-S ATAES132A-MAHEQ-S Microchip Technology ATAES132A-Data-Sheet-40002023A.pdf Description: IC AUTHENTICATION CHIP 8UDFN
DigiKey Programmable: Not Verified
Supplier Device Package: 8-UDFN (2x3)
Applications: Networking and Communications
Type: Authentication Chip
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Packaging: Tape & Reel (TR)
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AT87C51RC2-RLTUM AT87C51RC2-RLTUM Microchip Technology doc4188.pdf Description: IC MCU 8BIT 32KB OTP 44VQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40/20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-VQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
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AT87C51RB2-SLSUM AT87C51RB2-SLSUM Microchip Technology doc4188.pdf Description: IC MCU 8BIT 16KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40/20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Not Verified
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AT87C51RB2-RLTUL AT87C51RB2-RLTUL Microchip Technology doc4188.pdf Description: IC MCU 8BIT 16KB OTP 44VQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 30/20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-VQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
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AT87C51RB2-SLRUM AT87C51RB2-SLRUM Microchip Technology doc4188.pdf Description: IC MCU 8BIT 16KB OTP 44PLCC
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AT87C51RD2-3CSUM AT87C51RD2-3CSUM Microchip Technology doc4188.pdf Description: IC MCU 8BIT 64KB OTP 40PDIL
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 40/20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 40-PDIL
Number of I/O: 32
DigiKey Programmable: Not Verified
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M2S025T-1FCSG158I Microchip Technology Description: M2S025T-1FCSG158I
Packaging: Tray
Package / Case: 158-BGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 158-FCBGA
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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M2S025T-FCSG158I M2S025T-FCSG158I Microchip Technology IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf Description: M2S025T-FCSG158I
Packaging: Tray
Package / Case: 158-FBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 158-FCBGA (9x9)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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2N4858 2N4858 Microchip Technology 6078-2n4856-pdf Description: JFET N-CH 40V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: TO-18
Drain to Source Voltage (Vdss): 40 V
Power - Max: 360 mW
Resistance - RDS(On): 60 Ohms
Voltage - Cutoff (VGS off) @ Id: 4 V @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 8 mA @ 15 V
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2N4858U 2N4858U Microchip Technology Description: JFET N-CH 40V UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: UB
Drain to Source Voltage (Vdss): 40 V
Power - Max: 360 mW
Resistance - RDS(On): 60 Ohms
Voltage - Cutoff (VGS off) @ Id: 800 mV @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 8 mA @ 15 V
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2N4858U/TR 2N4858U/TR Microchip Technology Description: JFET N-CH 40V UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: UB
Drain to Source Voltage (Vdss): 40 V
Power - Max: 360 mW
Resistance - RDS(On): 60 Ohms
Voltage - Cutoff (VGS off) @ Id: 800 mV @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 8 mA @ 15 V
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MQ2N4858UB MQ2N4858UB Microchip Technology Description: JFET N-CH 40V UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: UB
Drain to Source Voltage (Vdss): 40 V
Power - Max: 360 mW
Resistance - RDS(On): 60 Ohms
Voltage - Cutoff (VGS off) @ Id: 800 mV @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 8 mA @ 15 V
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MQ2N4858 MQ2N4858 Microchip Technology Description: JFET N-CH 40V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: TO-18 (TO-206AA)
Drain to Source Voltage (Vdss): 40 V
Power - Max: 360 mW
Resistance - RDS(On): 60 Ohms
Voltage - Cutoff (VGS off) @ Id: 800 mV @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 8 mA @ 15 V
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MQ2N4858UB/TR MQ2N4858UB/TR Microchip Technology Description: JFET N-CH 40V UB
Resistance - RDS(On): 60 Ohms
Power - Max: 360 mW
Drain to Source Voltage (Vdss): 40 V
Supplier Device Package: UB
Voltage - Breakdown (V(BR)GSS): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
FET Type: N-Channel
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
Current - Drain (Idss) @ Vds (Vgs=0): 8 mA @ 15 V
Voltage - Cutoff (VGS off) @ Id: 800 mV @ 500 pA
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VSC7418XKT-01 Microchip Technology download.php?fid=4754&number=vsc7418 Description: IC TELECOM INTERFACE 11PORT
Packaging: Tray
Package / Case: 284-TQFP
Mounting Type: Surface Mount
Function: Ethernet Switch
Interface: Ethernet
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 284-TQFP (24x24)
Number of Circuits: 11
Power (Watts): 1.6 W
Produkt ist nicht verfügbar
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VSC7416XKT-01 Microchip Technology download.php?fid=4790&number=vsc7416 Description: IC TELECOM INTERFACE 6PORT
Packaging: Tray
Package / Case: 284-TQFP
Mounting Type: Surface Mount
Function: Ethernet Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 284-TQFP (24x24)
Number of Circuits: 7
Power (Watts): 1.5 W
Produkt ist nicht verfügbar
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VSC7438YIH-01 Microchip Technology VSC7438_PB_1-9-17.pdf Description: IC TELECOM INTERFACE
Packaging: Bulk
Package / Case: 672-BGA, FCBGA
Mounting Type: Surface Mount
Function: Ethernet Switch
Interface: Ethernet
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 672-FCBGA (27x27)
Number of Circuits: 1
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VSC7410XMT Microchip Technology VMDS-10479.pdf Description: IC TELECOM INTERFACE 6PORT
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Function: Ethernet Switch
Interface: 2-Wire Serial, JTAG
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.95V ~ 1.05V
Current - Supply: 1.3A
Supplier Device Package: 324-PBGA (19x19)
Number of Circuits: 1
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VSC7415XMT VSC7415XMT Microchip Technology VMDS-10447.pdf Description: IC TELECOM INTERFACE 324BGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Supplier Device Package: 324-BGA (19x19)
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JAN1N4134D-1 JAN1N4134D-1 Microchip Technology 129734-lds-0245-2-datasheet Description: DIODE ZENER 91V DO35
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1N3010A 1N3010A Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 140V 10W DO213AA
Current - Reverse Leakage @ Vr: 10 µA @ 100 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Power - Max: 10 W
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 125 Ohms
Voltage - Zener (Nom) (Vz): 140 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Chassis, Stud Mount
Package / Case: DO-203AA, DO-4, Stud
Tolerance: ±5%
Packaging: Bulk
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JANTXV1N3009B Microchip Technology Description: ZENER DIODE
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JANTX1N3009B Microchip Technology Description: ZENER DIODE
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JAN1N3009B Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 130V 10W DO213AA
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ATSAMC20J18A-ANTS2 ATSAMC20J18A-ANTS2 Microchip Technology Description: IC MCU 32BIT 256KB FLASH 64TQFP
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Active
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
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ATSAMC20J18A-ANTS2 ATSAMC20J18A-ANTS2 Microchip Technology Description: IC MCU 32BIT 256KB FLASH 64TQFP
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Active
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Cut Tape (CT)
Operating Temperature: -40°C ~ 105°C (TA)
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HV56264T-E/AKA-VAO HV56264T-E/AKA-VAO Microchip Technology HV56264-Data-Sheet-DS20006477.pdf Description: IC OPAMP GP 4 CIRCUIT 60TFBGA
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HV56264T-E/AKA-VAO HV56264T-E/AKA-VAO Microchip Technology HV56264-Data-Sheet-DS20006477.pdf Description: IC OPAMP GP 4 CIRCUIT 60TFBGA
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2N6340 2N6340 Microchip Technology 2N6338-ssi.pdf Description: NPN TRANSISTOR
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AT90LS8535-4PI AT90LS8535-4PI Microchip Technology doc1041.pdf Description: IC MCU 8BIT 8KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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ATMEGA163L-4PI ATMEGA163L-4PI Microchip Technology doc1142.pdf Description: IC MCU 8BIT 16KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1N5223 1N5223 Microchip Technology LDS-0232.pdf Description: DIODE ZENER 2.7V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 75 µA @ 950 mV
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1N5223BUR-1 1N5223BUR-1 Microchip Technology 1N5221BUR-1%20thru%201N5281BUR-1.pdf Description: DIODE ZENER 2.7V 500MW DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 75 µA @ 1 V
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1N5223A 1N5223A Microchip Technology 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf Description: DIODE ZENER 2.7V 500MW DO204AH
Tolerance: ±10%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 75 µA @ 950 mV
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1N5223A/TR 1N5223A/TR Microchip Technology 1N5221%20-%201N5281B.pdf Description: DIODE ZENER 2.7V 500MW DO204AH
Tolerance: ±10%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 75 µA @ 950 mV
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1N5223/TR 1N5223/TR Microchip Technology LDS-0232.pdf Description: DIODE ZENER 2.7V 500MW DO204AH
Current - Reverse Leakage @ Vr: 75 µA @ 950 mV
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 30 Ohms
Voltage - Zener (Nom) (Vz): 2.7 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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1N5223B/TR 1N5223B/TR Microchip Technology 1N5221%20-%201N5281B.pdf Description: DIODE ZENER 2.7V 500MW DO204AH
Current - Reverse Leakage @ Vr: 75 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 30 Ohms
Voltage - Zener (Nom) (Vz): 2.7 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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1N2458 Microchip Technology S%2CR35.pdf Description: DIODE GEN PURP 50V 70A DO5
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 A
Voltage - DC Reverse (Vr) (Max): 50 V
Operating Temperature - Junction: -65°C ~ 200°C
Supplier Device Package: DO-5 (DO-203AB)
Current - Average Rectified (Io): 70A
Packaging: Bulk
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-203AB, DO-5, Stud
Current - Reverse Leakage @ Vr: 25 µA @ 50 V
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1N2459 Microchip Technology S,R35.pdf Description: DIODE GEN PURP 100V 70A DO5
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PIC16F15376T-I/MV PIC16F15376T-I/MV Microchip Technology PIC16-L-F15356-75-76-85-86-Microcontroller-Data-Sheet-40001866D.pdf Description: IC MCU 8BIT 28KB FLASH 40UQFN
DigiKey Programmable: Not Verified
Number of I/O: 36
Supplier Device Package: 40-UQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 35x10b; D/A 1x5b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 28KB (16K x 14)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 40-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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PIC16F15376T-I/MV PIC16F15376T-I/MV Microchip Technology PIC16-L-F15356-75-76-85-86-Microcontroller-Data-Sheet-40001866D.pdf Description: IC MCU 8BIT 28KB FLASH 40UQFN
DigiKey Programmable: Not Verified
Number of I/O: 36
Supplier Device Package: 40-UQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 35x10b; D/A 1x5b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 28KB (16K x 14)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 40-UFQFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PIC16F15376-E/P PIC16F15376-E/P Microchip Technology PIC16-L-F15356-75-76-85-86-Microcontroller-Data-Sheet-40001866D.pdf Description: IC MCU 8BIT 28KB FLASH 40DIP
DigiKey Programmable: Not Verified
Number of I/O: 36
Supplier Device Package: 40-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 35x10b; D/A 1x5b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 28KB (16K x 14)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
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MCP48CMD22-E/MG MCP48CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-SPI-Interface-DS20006667.pdf
MCP48CMD22-E/MG
Hersteller: Microchip Technology
Description: IC DAC 12BIT V-OUT 16QFN
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 12
Data Interface: SPI
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 16-QFN (3x3)
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±1 (Max), ±1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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4+5.26 EUR
25+4.38 EUR
100+3.98 EUR
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PIC18F46Q71-I/P
PIC18F46Q71-I/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 35x12b SAR; D/A 2x8b, 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: FIFO, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Part Status: Active
Number of I/O: 37
DigiKey Programmable: Not Verified
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5+3.82 EUR
25+3.5 EUR
100+3.17 EUR
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AVR32DD32-I/RXB AVR16-32DD28-32-DataSheet-DS40002441.pdf
AVR32DD32-I/RXB
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 32VQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 23x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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11+1.72 EUR
25+1.58 EUR
100+1.43 EUR
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AVR32DD28-I/SP AVR16-32DD28-32-DataSheet-DS40002441.pdf
AVR32DD28-I/SP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28SPDIP
DigiKey Programmable: Not Verified
Package / Case: 28-DIP (0.300", 7.62mm)
Packaging: Tube
Number of I/O: 22
Part Status: Active
Supplier Device Package: 28-SPDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Through Hole
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6+3.26 EUR
25+3 EUR
100+2.72 EUR
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AVR32DD28-I/STX AVR16-32DD28-32-DataSheet-DS40002441.pdf
AVR32DD28-I/STX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28VQFN
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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12+1.58 EUR
25+1.45 EUR
100+1.31 EUR
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AVR32DD28-I/SO AVR16-32DD28-32-DataSheet-DS40002441.pdf
AVR32DD28-I/SO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28SOIC
DigiKey Programmable: Not Verified
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Number of I/O: 22
Part Status: Active
Supplier Device Package: 28-SOIC
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 256 x 8
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8+2.27 EUR
25+2.09 EUR
100+1.89 EUR
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AVR32DD32-I/PT AVR16-32DD28-32-DataSheet-DS40002441.pdf
AVR32DD32-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 32TQFP
Packaging: Tray
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 23x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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MIC5318-1.3YD5 TR MCHP-S-A0009394028-1.pdf?t.download=true&u=5oefqw
MIC5318-1.3YD5 TR
Hersteller: Microchip Technology
Description: HIGH PERFORMANCE 300 MA MICROCAP
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AnzahlPreis
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MIC5318-2.6YMT TR MCHP-S-A0009394028-1.pdf?t.download=true&u=5oefqw
MIC5318-2.6YMT TR
Hersteller: Microchip Technology
Description: HIGH PERFORMANCE 300 MA MICROCAP
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962+0.5 EUR
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MIC5318-2.6YD5 TR MCHP-S-A0009394028-1.pdf?t.download=true&u=5oefqw
MIC5318-2.6YD5 TR
Hersteller: Microchip Technology
Description: HIGH PERFORMANCE 300 MA MICROCAP
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JANTXV1N6336C 10924-lds-0193-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER 33V 500MW DO35
Produkt ist nicht verfügbar
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1N5916B 10922-sa5-57-datasheet
1N5916B
Hersteller: Microchip Technology
Description: DIODE ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 4.3 V
Impedance (Max) (Zzt): 6 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Produkt ist nicht verfügbar
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1N5916B/TR
1N5916B/TR
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 4.3 V
Impedance (Max) (Zzt): 6 Ohms
Supplier Device Package: DO-41
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 1 V
Produkt ist nicht verfügbar
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1N5916B-1
Hersteller: Microchip Technology
Description: ZENER DIODE
Packaging: Bulk
Produkt ist nicht verfügbar
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1N5916B-1/TR
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATAES132A-SHER-T Atmel-8914S-CryptoAuth-ATAES132A-Datasheet-Summary.pdf
ATAES132A-SHER-T
Hersteller: Microchip Technology
Description: IC AUTHENTICATION CHIP 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Applications: Networking and Communications
Supplier Device Package: 8-SOIC
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
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AnzahlPreis
4000+1.35 EUR
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ATAES132A-SHER-T Atmel-8914S-CryptoAuth-ATAES132A-Datasheet-Summary.pdf
ATAES132A-SHER-T
Hersteller: Microchip Technology
Description: IC AUTHENTICATION CHIP 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Applications: Networking and Communications
Supplier Device Package: 8-SOIC
Part Status: Active
DigiKey Programmable: Not Verified
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12+1.57 EUR
25+1.41 EUR
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ATAES132A-MAHER-S ATAES132A-Data-Sheet-40002023A.pdf
ATAES132A-MAHER-S
Hersteller: Microchip Technology
Description: IC AUTHENTICATION CHIP 8UDFN
DigiKey Programmable: Not Verified
Supplier Device Package: 8-UDFN (2x3)
Applications: Networking and Communications
Type: Authentication Chip
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Packaging: Cut Tape (CT)
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13+1.46 EUR
25+1.32 EUR
100+1.25 EUR
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ATAES132A-MAHEQ-S ATAES132A-Data-Sheet-40002023A.pdf
ATAES132A-MAHEQ-S
Hersteller: Microchip Technology
Description: IC AUTHENTICATION CHIP 8UDFN
DigiKey Programmable: Not Verified
Supplier Device Package: 8-UDFN (2x3)
Applications: Networking and Communications
Type: Authentication Chip
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AT87C51RC2-RLTUM doc4188.pdf
AT87C51RC2-RLTUM
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB OTP 44VQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40/20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-VQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AT87C51RB2-SLSUM doc4188.pdf
AT87C51RB2-SLSUM
Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40/20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AT87C51RB2-RLTUL doc4188.pdf
AT87C51RB2-RLTUL
Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB OTP 44VQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 30/20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-VQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AT87C51RB2-SLRUM doc4188.pdf
AT87C51RB2-SLRUM
Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB OTP 44PLCC
Produkt ist nicht verfügbar
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AT87C51RD2-3CSUM doc4188.pdf
AT87C51RD2-3CSUM
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB OTP 40PDIL
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 40/20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 40-PDIL
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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M2S025T-1FCSG158I
Hersteller: Microchip Technology
Description: M2S025T-1FCSG158I
Packaging: Tray
Package / Case: 158-BGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 158-FCBGA
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Produkt ist nicht verfügbar
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M2S025T-FCSG158I IGLOO-2-FPGA-And-SmartFusion-2-SoC-FPGA-Data-Sheet-DS00004750.pdf
M2S025T-FCSG158I
Hersteller: Microchip Technology
Description: M2S025T-FCSG158I
Packaging: Tray
Package / Case: 158-FBGA, FCBGA
Speed: 166MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: FPGA - 25K Logic Modules
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Supplier Device Package: 158-FCBGA (9x9)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
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1+116.49 EUR
100+114.78 EUR
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2N4858 6078-2n4856-pdf
2N4858
Hersteller: Microchip Technology
Description: JFET N-CH 40V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: TO-18
Drain to Source Voltage (Vdss): 40 V
Power - Max: 360 mW
Resistance - RDS(On): 60 Ohms
Voltage - Cutoff (VGS off) @ Id: 4 V @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 8 mA @ 15 V
Produkt ist nicht verfügbar
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2N4858U
2N4858U
Hersteller: Microchip Technology
Description: JFET N-CH 40V UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: UB
Drain to Source Voltage (Vdss): 40 V
Power - Max: 360 mW
Resistance - RDS(On): 60 Ohms
Voltage - Cutoff (VGS off) @ Id: 800 mV @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 8 mA @ 15 V
Produkt ist nicht verfügbar
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2N4858U/TR
2N4858U/TR
Hersteller: Microchip Technology
Description: JFET N-CH 40V UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: UB
Drain to Source Voltage (Vdss): 40 V
Power - Max: 360 mW
Resistance - RDS(On): 60 Ohms
Voltage - Cutoff (VGS off) @ Id: 800 mV @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 8 mA @ 15 V
Produkt ist nicht verfügbar
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MQ2N4858UB
MQ2N4858UB
Hersteller: Microchip Technology
Description: JFET N-CH 40V UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: UB
Drain to Source Voltage (Vdss): 40 V
Power - Max: 360 mW
Resistance - RDS(On): 60 Ohms
Voltage - Cutoff (VGS off) @ Id: 800 mV @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 8 mA @ 15 V
Produkt ist nicht verfügbar
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MQ2N4858
MQ2N4858
Hersteller: Microchip Technology
Description: JFET N-CH 40V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: TO-18 (TO-206AA)
Drain to Source Voltage (Vdss): 40 V
Power - Max: 360 mW
Resistance - RDS(On): 60 Ohms
Voltage - Cutoff (VGS off) @ Id: 800 mV @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 8 mA @ 15 V
Produkt ist nicht verfügbar
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MQ2N4858UB/TR
MQ2N4858UB/TR
Hersteller: Microchip Technology
Description: JFET N-CH 40V UB
Resistance - RDS(On): 60 Ohms
Power - Max: 360 mW
Drain to Source Voltage (Vdss): 40 V
Supplier Device Package: UB
Voltage - Breakdown (V(BR)GSS): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
FET Type: N-Channel
Operating Temperature: -65°C ~ 200°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-SMD, No Lead
Packaging: Tape & Reel (TR)
Current - Drain (Idss) @ Vds (Vgs=0): 8 mA @ 15 V
Voltage - Cutoff (VGS off) @ Id: 800 mV @ 500 pA
Produkt ist nicht verfügbar
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VSC7418XKT-01 download.php?fid=4754&number=vsc7418
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE 11PORT
Packaging: Tray
Package / Case: 284-TQFP
Mounting Type: Surface Mount
Function: Ethernet Switch
Interface: Ethernet
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 284-TQFP (24x24)
Number of Circuits: 11
Power (Watts): 1.6 W
Produkt ist nicht verfügbar
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VSC7416XKT-01 download.php?fid=4790&number=vsc7416
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE 6PORT
Packaging: Tray
Package / Case: 284-TQFP
Mounting Type: Surface Mount
Function: Ethernet Switch
Interface: SPI
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 284-TQFP (24x24)
Number of Circuits: 7
Power (Watts): 1.5 W
Produkt ist nicht verfügbar
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VSC7438YIH-01 VSC7438_PB_1-9-17.pdf
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE
Packaging: Bulk
Package / Case: 672-BGA, FCBGA
Mounting Type: Surface Mount
Function: Ethernet Switch
Interface: Ethernet
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 672-FCBGA (27x27)
Number of Circuits: 1
Produkt ist nicht verfügbar
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VSC7410XMT VMDS-10479.pdf
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE 6PORT
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Function: Ethernet Switch
Interface: 2-Wire Serial, JTAG
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.95V ~ 1.05V
Current - Supply: 1.3A
Supplier Device Package: 324-PBGA (19x19)
Number of Circuits: 1
Produkt ist nicht verfügbar
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VSC7415XMT VMDS-10447.pdf
VSC7415XMT
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE 324BGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Supplier Device Package: 324-BGA (19x19)
Produkt ist nicht verfügbar
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JAN1N4134D-1 129734-lds-0245-2-datasheet
JAN1N4134D-1
Hersteller: Microchip Technology
Description: DIODE ZENER 91V DO35
Produkt ist nicht verfügbar
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1N3010A 8914-lds-0075-datasheet
1N3010A
Hersteller: Microchip Technology
Description: DIODE ZENER 140V 10W DO213AA
Current - Reverse Leakage @ Vr: 10 µA @ 100 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Power - Max: 10 W
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 125 Ohms
Voltage - Zener (Nom) (Vz): 140 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Chassis, Stud Mount
Package / Case: DO-203AA, DO-4, Stud
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTXV1N3009B
Hersteller: Microchip Technology
Description: ZENER DIODE
Produkt ist nicht verfügbar
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JANTX1N3009B
Hersteller: Microchip Technology
Description: ZENER DIODE
Produkt ist nicht verfügbar
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JAN1N3009B 8914-lds-0075-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER 130V 10W DO213AA
Produkt ist nicht verfügbar
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ATSAMC20J18A-ANTS2
ATSAMC20J18A-ANTS2
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Active
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1500+6.52 EUR
Mindestbestellmenge: 1500 Stücke
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ATSAMC20J18A-ANTS2
ATSAMC20J18A-ANTS2
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 64TQFP
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Active
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Cut Tape (CT)
Operating Temperature: -40°C ~ 105°C (TA)
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+7.85 EUR
25+7.19 EUR
100+6.52 EUR
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HV56264T-E/AKA-VAO HV56264-Data-Sheet-DS20006477.pdf
HV56264T-E/AKA-VAO
Hersteller: Microchip Technology
Description: IC OPAMP GP 4 CIRCUIT 60TFBGA
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HV56264T-E/AKA-VAO HV56264-Data-Sheet-DS20006477.pdf
HV56264T-E/AKA-VAO
Hersteller: Microchip Technology
Description: IC OPAMP GP 4 CIRCUIT 60TFBGA
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2N6340 2N6338-ssi.pdf
2N6340
Hersteller: Microchip Technology
Description: NPN TRANSISTOR
Produkt ist nicht verfügbar
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AT90LS8535-4PI doc1041.pdf
AT90LS8535-4PI
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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ATMEGA163L-4PI doc1142.pdf
ATMEGA163L-4PI
Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 32
DigiKey Programmable: Not Verified
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1N5223 LDS-0232.pdf
1N5223
Hersteller: Microchip Technology
Description: DIODE ZENER 2.7V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 75 µA @ 950 mV
Produkt ist nicht verfügbar
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1N5223BUR-1 1N5221BUR-1%20thru%201N5281BUR-1.pdf
1N5223BUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 2.7V 500MW DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 75 µA @ 1 V
Produkt ist nicht verfügbar
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1N5223A 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf
1N5223A
Hersteller: Microchip Technology
Description: DIODE ZENER 2.7V 500MW DO204AH
Tolerance: ±10%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 75 µA @ 950 mV
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1N5223A/TR 1N5221%20-%201N5281B.pdf
1N5223A/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 2.7V 500MW DO204AH
Tolerance: ±10%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 2.7 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 75 µA @ 950 mV
Produkt ist nicht verfügbar
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1N5223/TR LDS-0232.pdf
1N5223/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 2.7V 500MW DO204AH
Current - Reverse Leakage @ Vr: 75 µA @ 950 mV
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 30 Ohms
Voltage - Zener (Nom) (Vz): 2.7 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N5223B/TR 1N5221%20-%201N5281B.pdf
1N5223B/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 2.7V 500MW DO204AH
Current - Reverse Leakage @ Vr: 75 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 30 Ohms
Voltage - Zener (Nom) (Vz): 2.7 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N2458 S%2CR35.pdf
Hersteller: Microchip Technology
Description: DIODE GEN PURP 50V 70A DO5
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 A
Voltage - DC Reverse (Vr) (Max): 50 V
Operating Temperature - Junction: -65°C ~ 200°C
Supplier Device Package: DO-5 (DO-203AB)
Current - Average Rectified (Io): 70A
Packaging: Bulk
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-203AB, DO-5, Stud
Current - Reverse Leakage @ Vr: 25 µA @ 50 V
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1N2459 S,R35.pdf
Hersteller: Microchip Technology
Description: DIODE GEN PURP 100V 70A DO5
Produkt ist nicht verfügbar
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PIC16F15376T-I/MV PIC16-L-F15356-75-76-85-86-Microcontroller-Data-Sheet-40001866D.pdf
PIC16F15376T-I/MV
Hersteller: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 40UQFN
DigiKey Programmable: Not Verified
Number of I/O: 36
Supplier Device Package: 40-UQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 35x10b; D/A 1x5b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 28KB (16K x 14)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 40-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC16F15376T-I/MV PIC16-L-F15356-75-76-85-86-Microcontroller-Data-Sheet-40001866D.pdf
PIC16F15376T-I/MV
Hersteller: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 40UQFN
DigiKey Programmable: Not Verified
Number of I/O: 36
Supplier Device Package: 40-UQFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 35x10b; D/A 1x5b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 28KB (16K x 14)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 40-UFQFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PIC16F15376-E/P PIC16-L-F15356-75-76-85-86-Microcontroller-Data-Sheet-40001866D.pdf
PIC16F15376-E/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 40DIP
DigiKey Programmable: Not Verified
Number of I/O: 36
Supplier Device Package: 40-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 35x10b; D/A 1x5b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 28KB (16K x 14)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
Produkt ist nicht verfügbar
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