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AT91SAM7XC256B-CU AT91SAM7XC256B-CU Microchip Technology 6209s.pdf Description: IC MCU 16/32BIT 256KB 100TFBGA
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 62
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 55MHz
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AT91SAM7XC512-CU AT91SAM7XC512-CU Microchip Technology 6209s.pdf Description: IC MCU 16/32BIT 512KB 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 62
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 55MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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DSC1001DL2-016.0000T DSC1001DL2-016.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001DL2-016.3690T DSC1001DL2-016.3690T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 16.3690MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16.369 MHz
Base Resonator: MEMS
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DSC1001CL2-016.0000T DSC1001CL2-016.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 16 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 8mA
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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DSC1101CL2-016.3840T DSC1101CL2-016.3840T Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSC XO 16.3840MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 16.384 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 35mA
Voltage - Supply: 2.25V ~ 3.6V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Package / Case: 6-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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DSC1001CL2-016.0000T DSC1001CL2-016.0000T Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 16 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 6.3mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSC1001CL2-016.0000 DSC1001CL2-016.0000 Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 16 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 6.3mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Tube
Produkt ist nicht verfügbar
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MCP1501T-50E/CHYVAO MCP1501T-50E/CHYVAO Microchip Technology MCP1501-Data-Sheet-DS20005474F.pdf Description: 50 PPM 0.1% VOLTAGE REFERENCE
Current - Output: 20 mA
Voltage - Output (Min/Fixed): 5V
Supplier Device Package: SOT-23-6
Current - Supply: 550µA
Operating Temperature: -40°C ~ 125°C (TA)
Reference Type: Series
Voltage - Input: 5.2V ~ 5.5V
Mounting Type: Surface Mount
Output Type: Fixed
Temperature Coefficient: 50ppm/°C
Package / Case: SOT-23-6
Tolerance: ±0.1%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N4581-1/TR 1N4581-1/TR Microchip Technology 1N4565-1N4585A-1.pdf Description: TEMPERATURE COMPENSATED
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 25 Ohms
Voltage - Zener (Nom) (Vz): 6.4 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N4581A/TR 1N4581A/TR Microchip Technology 1N4565-1N4585A-1.pdf Description: TEMPERATURE COMPENSATED
Voltage - Zener (Nom) (Vz): 6.4 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 25 Ohms
Produkt ist nicht verfügbar
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AVR32DD32T-I/PT AVR32DD32T-I/PT Microchip Technology AVR16-32DD28-32-DataSheet-DS40002441.pdf Description: IC MCU 8BIT 32KB FLASH 32TQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 23x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
Produkt ist nicht verfügbar
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AVR32DD32T-I/PT AVR32DD32T-I/PT Microchip Technology AVR16-32DD28-32-DataSheet-DS40002441.pdf Description: IC MCU 8BIT 32KB FLASH 32TQFP
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 23x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
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AVR64DD32T-I/PT AVR64DD32T-I/PT Microchip Technology AVR32-16DD20-14-Complete-DataSheet-DS40002413.pdf Description: IC MCU 8BIT 64KB FLASH 32TQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 23x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
Produkt ist nicht verfügbar
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AVR64DD32T-I/PT AVR64DD32T-I/PT Microchip Technology AVR32-16DD20-14-Complete-DataSheet-DS40002413.pdf Description: IC MCU 8BIT 64KB FLASH 32TQFP
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 23x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
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PIC16F17174T-I/PT PIC16F17174T-I/PT Microchip Technology PIC16F17154-55-74-75-Microcontroller-Data-Sheet-DS40002490.pdf Description: 7KB FLASH, 512B RAM, 128B EEPROM
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 58x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
Produkt ist nicht verfügbar
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PIC16F17174T-I/PT PIC16F17174T-I/PT Microchip Technology PIC16F17154-55-74-75-Microcontroller-Data-Sheet-DS40002490.pdf Description: 7KB FLASH, 512B RAM, 128B EEPROM
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 58x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
Produkt ist nicht verfügbar
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AVR64DD32T-E/PT AVR64DD32T-E/PT Microchip Technology AVR32-16DD20-14-Complete-DataSheet-DS40002413.pdf Description: IC MCU 8BIT 64KB FLASH 32TQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 23x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
Produkt ist nicht verfügbar
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AVR64DD32T-E/PT AVR64DD32T-E/PT Microchip Technology AVR32-16DD20-14-Complete-DataSheet-DS40002413.pdf Description: IC MCU 8BIT 64KB FLASH 32TQFP
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 23x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
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PIC16F17175T-I/PT PIC16F17175T-I/PT Microchip Technology PIC16F17156-76-Microcontroller-Data-Sheet-DS40002485.pdf Description: IC MCU 8BIT 14KB FLASH 44TQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 58x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
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PIC16F17175T-I/PT PIC16F17175T-I/PT Microchip Technology PIC16F17156-76-Microcontroller-Data-Sheet-DS40002485.pdf Description: IC MCU 8BIT 14KB FLASH 44TQFP
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 58x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
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100+2.8 EUR
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PIC16F18175T-I/PT PIC16F18175T-I/PT Microchip Technology PIC16F18154-55-74-75-Microcontroller-Data-Sheet-DS40002491.pdf Description: 14KB FLASH, 1KB RAM, 128B EEPROM
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
Produkt ist nicht verfügbar
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PIC16F18175T-I/PT PIC16F18175T-I/PT Microchip Technology PIC16F18154-55-74-75-Microcontroller-Data-Sheet-DS40002491.pdf Description: 14KB FLASH, 1KB RAM, 128B EEPROM
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
Produkt ist nicht verfügbar
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PIC16F17176T-I/PT PIC16F17176T-I/PT Microchip Technology PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf Description: 28KB FLASH, 2KB RAM, 128B EEPROM
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
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PIC16F17176T-I/PT PIC16F17176T-I/PT Microchip Technology PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf Description: 28KB FLASH, 2KB RAM, 128B EEPROM
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
auf Bestellung 1200 Stücke:
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PIC16F18176T-I/PT PIC16F18176T-I/PT Microchip Technology PIC16F18156-76-Microcontroller-Data-Sheet-DS40002484.pdf Description: 28KB FLASH, 2KB RAM, 128B EEPROM
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
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PIC16F18176T-I/PT PIC16F18176T-I/PT Microchip Technology PIC16F18156-76-Microcontroller-Data-Sheet-DS40002484.pdf Description: 28KB FLASH, 2KB RAM, 128B EEPROM
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
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USB7050PT/KDX USB7050PT/KDX Microchip Technology USB7050-Data-Sheet-DS00002672E.pdf Description: 4 PORT USB3.2 GEN1 - PD UPSTREAM
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 100-VQFN (12x12)
Standards: USB 2.0, USB 3.2
Protocol: USB
Voltage - Supply: 1.08V ~ 1.32V, 3V ~ 3.6V
Operating Temperature: 0°C ~ 70°C (TA)
Interface: GPIO, I2C, I2S, SPI, UART, USB
Function: Hub Controller
Package / Case: 100-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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USB7050PT/KDX USB7050PT/KDX Microchip Technology USB7050-Data-Sheet-DS00002672E.pdf Description: 4 PORT USB3.2 GEN1 - PD UPSTREAM
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 100-VQFN (12x12)
Standards: USB 2.0, USB 3.2
Protocol: USB
Voltage - Supply: 1.08V ~ 1.32V, 3V ~ 3.6V
Operating Temperature: 0°C ~ 70°C (TA)
Interface: GPIO, I2C, I2S, SPI, UART, USB
Function: Hub Controller
Package / Case: 100-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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USB7050PT-I/KDX USB7050PT-I/KDX Microchip Technology USB7050-Data-Sheet-DS00002672E.pdf Description: 4 PORT USB3.2 GEN1 - PD UPSTREAM
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 100-VQFN (12x12)
Packaging: Tape & Reel (TR)
Standards: USB 2.0, USB 3.2
Protocol: USB
Voltage - Supply: 1.08V ~ 1.32V, 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Interface: GPIO, I2C, I2S, SPI, UART, USB
Function: Hub Controller
Package / Case: 100-VFQFN Exposed Pad
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USB7050PT-I/KDX USB7050PT-I/KDX Microchip Technology USB7050-Data-Sheet-DS00002672E.pdf Description: 4 PORT USB3.2 GEN1 - PD UPSTREAM
Protocol: USB
Voltage - Supply: 1.08V ~ 1.32V, 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Interface: GPIO, I2C, I2S, SPI, UART, USB
Function: Hub Controller
Package / Case: 100-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 100-VQFN (12x12)
Standards: USB 2.0, USB 3.2
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BM78SPP05MC2-0B04AA Microchip Technology 60001380E.pdf Description: RF TXRX MODULE BLUETOOTH SMD
Packaging: Tray
Package / Case: 33-SMD Module
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 4MB Flash, 320kB ROM, 28kB SRAM
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 3.3V ~ 4.2V
Power - Output: 1.5dBm
Data Rate: 1Mbps
Protocol: Bluetooth v5.0 Dual Mode
Current - Receiving: 37mA (Max)
Current - Transmitting: 43mA (Max)
Antenna Type: Antenna Not Included
Utilized IC / Part: BM78SPPS5MC2/NC2
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, UART
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BM78SPP05MC2-0B02AA Microchip Technology 60001380E.pdf Description: RF TXRX MODULE BLUETOOTH SMD
Packaging: Tray
Package / Case: 33-SMD Module
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 4MB Flash, 320kB ROM, 28kB SRAM
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 3.3V ~ 4.2V
Power - Output: 1.5dBm
Data Rate: 1Mbps
Protocol: Bluetooth v5.0 Dual Mode
Current - Receiving: 37mA (Max)
Current - Transmitting: 43mA (Max)
Antenna Type: Antenna Not Included
Utilized IC / Part: BM78SPPS5MC2/NC2
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, UART
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BM78SPPS5MC2-0B02AA Microchip Technology 60001380E.pdf Description: RF TXRX MODULE BT CHIP SMD
Packaging: Tray
Package / Case: 33-SMD Module
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 4MB Flash, 320kB ROM, 28kB SRAM
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 3.3V ~ 4.2V
Power - Output: 1.5dBm
Data Rate: 1Mbps
Protocol: Bluetooth v5.0 Dual Mode
Current - Receiving: 37mA (Max)
Current - Transmitting: 43mA (Max)
Antenna Type: Integrated, Chip
Utilized IC / Part: BM78SPPS5MC2/NC2
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, UART
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BM78SPPS5MC2-0B04AA Microchip Technology 60001380E.pdf Description: RF TXRX MODULE BT CHIP SMD
Packaging: Tray
Package / Case: 33-SMD Module
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 4MB Flash, 320kB ROM, 28kB SRAM
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 3.3V ~ 4.2V
Power - Output: 1.5dBm
Data Rate: 1Mbps
Protocol: Bluetooth v5.0 Dual Mode
Current - Receiving: 37mA (Max)
Current - Transmitting: 43mA (Max)
Antenna Type: Integrated, Chip
Utilized IC / Part: BM78SPPS5MC2/NC2
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, UART
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MP4KE27A MP4KE27A Microchip Technology 9517-mp4ke-pdf Description: TVS DIODE 23.1VWM 37.5VC DO204AL
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 400W
Voltage - Clamping (Max) @ Ipp: 37.5V
Voltage - Breakdown (Min): 25.7V
Unidirectional Channels: 1
Supplier Device Package: DO-204AL (DO-41)
Voltage - Reverse Standoff (Typ): 23.1V
Current - Peak Pulse (10/1000µs): 11A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AL, DO-41, Axial
Packaging: Bulk
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MIC38C44YN MIC38C44YN Microchip Technology MIC38C42-43-44-45-BiCMOS-Current-Mode-PWM-Controllers-DS20006436B.pdf Description: IC OFFLINE SWITCH MULT TOP 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 500kHz
Internal Switch(s): Yes
Output Isolation: Isolated
Topology: Boost, Buck, Flyback, Forward
Voltage - Supply (Vcc/Vdd): 9V ~ 20V
Supplier Device Package: 8-DIP
Voltage - Start Up: 14.5 V
Control Features: Frequency Control
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MIC38C44-1YM MIC38C44-1YM Microchip Technology MIC38C42-43-44-45-BiCMOS-Current-Mode-PWM-Controllers-DS20006436B.pdf Description: IC OFFLINE SW MULT TOP 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 500kHz
Internal Switch(s): Yes
Output Isolation: Isolated
Topology: Boost, Buck, Flyback, Forward
Voltage - Supply (Vcc/Vdd): 9V ~ 20V
Supplier Device Package: 14-SOIC
Voltage - Start Up: 14.5 V
Control Features: Frequency Control
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AT26DF321-SU AT26DF321-SU Microchip Technology AT26DF321%20Rev2008.pdf description Description: IC FLASH 32MBIT SPI 66MHZ 8SOIC
DigiKey Programmable: Not Verified
Memory Organization: 256 Bytes x 16384 pages
Memory Interface: SPI
Write Cycle Time - Word, Page: 6µs, 5ms
Supplier Device Package: 8-SOIC
Memory Format: FLASH
Clock Frequency: 66 MHz
Technology: FLASH
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TC)
Memory Type: Non-Volatile
Memory Size: 32Mbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Packaging: Tube
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DSC6003CI2B-250K000T DSC6003CI2B-250K000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6111JI2B-250K000T DSC6111JI2B-250K000T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC LVCMOS 25PPM 2.5X2.0MM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011JI2B-250K000T DSC6011JI2B-250K000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC LVCMOS 25PPM 2.5X2.0MM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6013JI2B-250K000T DSC6013JI2B-250K000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC LVCMOS 25PPM 2.5X2.0MM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6003JI2B-250K000T DSC6003JI2B-250K000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: OSC MEMS LOW PWR LVCMOS
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6112JI2B-250K000T DSC6112JI2B-250K000T Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC LVCMOS 25PPM 2.5X2.0MM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 250 kHz
Base Resonator: MEMS
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SAMA7G54T-E/4HB SAMA7G54T-E/4HB Microchip Technology SAMA7G5-Series-Silicon-Errata-and-Data-Sheet-Clarification-DS80001016.pdf Description: CORTEX-A7 MPU, BGA, EXT. TEMP (T
Packaging: Tape & Reel (TR)
Package / Case: 343-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 343-TFBGA (14x14)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB Typ-C (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
Produkt ist nicht verfügbar
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JANTX1N3022D-1 JANTX1N3022D-1 Microchip Technology 125225-lds-0285-datasheet Description: DIODE ZENER 12V 1W DO204AL
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 9 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 9.1 V
Qualification: MIL-PRF-19500/115
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MP6KE13A MP6KE13A Microchip Technology rf01007_rb.pdf Description: TVS DIODE 11.1VWM 18.2VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 11.1V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 12.4V
Voltage - Clamping (Max) @ Ipp: 18.2V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPFS095T-1FCVG484E MPFS095T-1FCVG484E Microchip Technology 1244583-polarfire-soc-advance-datasheet Description: IC SOC RISC-V 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
RAM Size: 857.6kB
Operating Temperature: 0°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
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AT89C2051-12SU AT89C2051-12SU Microchip Technology doc0368.pdf description Description: IC MCU 8BIT 2KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: UART/USART
Peripherals: LED
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Verified
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100+2.23 EUR
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MIC37120-1.8YMT-TR MIC37120-1.8YMT-TR Microchip Technology MIC37110%2C12%2C20%2C22_DS.pdf Description: IC REG LINEAR 1.8V 1A 6-TMLF
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN Exposed Pad, 6-TMLF®
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 500 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-TMLF® (2x2)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
Voltage Dropout (Max): 0.4V @ 1A
Protection Features: Over Current, Over Temperature
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MIC37120-1.8YMT-TR MIC37120-1.8YMT-TR Microchip Technology MIC37110%2C12%2C20%2C22_DS.pdf Description: IC REG LINEAR 1.8V 1A 6-TMLF
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN Exposed Pad, 6-TMLF®
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 500 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-TMLF® (2x2)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
Voltage Dropout (Max): 0.4V @ 1A
Protection Features: Over Current, Over Temperature
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JAN1N4560B Microchip Technology Description: ZENER DIODE
Tolerance: ±10%
Packaging: Bulk
Package / Case: TO-204AD
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 0.12 Ohms
Supplier Device Package: TO-204AD (TO-3)
Grade: Military
Power - Max: 50 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Qualification: MIL-PRF-19500/114
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JANTXV1N4560B Microchip Technology Description: ZENER DIODE
Tolerance: ±10%
Packaging: Bulk
Package / Case: TO-204AD
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 0.12 Ohms
Supplier Device Package: TO-204AD (TO-3)
Grade: Military
Power - Max: 50 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Qualification: MIL-PRF-19500/114
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2N5621 2N5621 Microchip Technology Description: TRANS PNP 60V 10A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: PNP
Supplier Device Package: TO-204AA (TO-3)
Current - Collector (Ic) (Max): 10 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 116 W
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JANTX1N5542B-1 JANTX1N5542B-1 Microchip Technology 1N5518B_1N5546B-1.pdf Description: DIODE ZENER 22V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 19.8 V
Qualification: MIL-PRF-19500/437
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APT12060LVFRG APT12060LVFRG Microchip Technology APT12060B2_LVFR_A.pdf Description: MOSFET N-CH 1200V 20A TO264
Input Capacitance (Ciss) (Max) @ Vds: 9500 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 650 nC @ 10 V
Drain to Source Voltage (Vdss): 1200 V
Supplier Device Package: TO-264 [L]
Vgs(th) (Max) @ Id: 4V @ 1mA
Rds On (Max) @ Id, Vgs: 600mOhm @ 10A, 10V
Current - Continuous Drain (Id) @ 25°C: 20A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Mounting Type: Through Hole
Package / Case: TO-264-3, TO-264AA
Packaging: Tube
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SY100EL01ZG-TR SY100EL01ZG-TR Microchip Technology sy10-100el01.pdf Description: IC GATE OR/NOR 4-INPUT 8-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Differential
Mounting Type: Surface Mount
Logic Type: NOR/OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.2V ~ 5.5V
Number of Inputs: 4
Schmitt Trigger Input: No
Supplier Device Package: 8-SOIC
Number of Circuits: 1
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SY100EL01ZC SY100EL01ZC Microchip Technology sy10-100el01.pdf Description: IC GATE OR/NOR 4-INPUT 8-SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Differential
Mounting Type: Surface Mount
Logic Type: NOR/OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.2V ~ 5.5V
Number of Inputs: 4
Schmitt Trigger Input: No
Supplier Device Package: 8-SOIC
Number of Circuits: 1
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MCP79520T-I/MS MCP79520T-I/MS Microchip Technology MCP7951X-MCP7952X-Battery-Backed-SPI-Real-Time-Clock-Calendar-20002300D.pdf Description: IC RTC CLK/CALENDAR SPI 10MSOP
Features: Alarm, EEPROM, Leap Year, Square Wave Output, SRAM, Unique ID
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Memory Size: 64B
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-MSOP
Voltage - Supply, Battery: 1.3V ~ 3.6V
Current - Timekeeping (Max): 1µA @ 1.8V ~ 3.6V
DigiKey Programmable: Not Verified
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AT91SAM7XC256B-CU 6209s.pdf
AT91SAM7XC256B-CU
Hersteller: Microchip Technology
Description: IC MCU 16/32BIT 256KB 100TFBGA
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 62
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 55MHz
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AT91SAM7XC512-CU 6209s.pdf
AT91SAM7XC512-CU
Hersteller: Microchip Technology
Description: IC MCU 16/32BIT 512KB 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 62
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 55MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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DSC1001DL2-016.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-016.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
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DSC1001DL2-016.3690T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-016.3690T
Hersteller: Microchip Technology
Description: MEMS OSC XO 16.3690MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16.369 MHz
Base Resonator: MEMS
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DSC1001CL2-016.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CL2-016.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 16 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 8mA
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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DSC1101CL2-016.3840T DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1101CL2-016.3840T
Hersteller: Microchip Technology
Description: MEMS OSC XO 16.3840MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 16.384 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 35mA
Voltage - Supply: 2.25V ~ 3.6V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Package / Case: 6-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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DSC1001CL2-016.0000T MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
DSC1001CL2-016.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 16 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 6.3mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSC1001CL2-016.0000 MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
DSC1001CL2-016.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 16 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 6.3mA
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Tube
Produkt ist nicht verfügbar
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MCP1501T-50E/CHYVAO MCP1501-Data-Sheet-DS20005474F.pdf
MCP1501T-50E/CHYVAO
Hersteller: Microchip Technology
Description: 50 PPM 0.1% VOLTAGE REFERENCE
Current - Output: 20 mA
Voltage - Output (Min/Fixed): 5V
Supplier Device Package: SOT-23-6
Current - Supply: 550µA
Operating Temperature: -40°C ~ 125°C (TA)
Reference Type: Series
Voltage - Input: 5.2V ~ 5.5V
Mounting Type: Surface Mount
Output Type: Fixed
Temperature Coefficient: 50ppm/°C
Package / Case: SOT-23-6
Tolerance: ±0.1%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N4581-1/TR 1N4565-1N4585A-1.pdf
1N4581-1/TR
Hersteller: Microchip Technology
Description: TEMPERATURE COMPENSATED
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 25 Ohms
Voltage - Zener (Nom) (Vz): 6.4 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N4581A/TR 1N4565-1N4585A-1.pdf
1N4581A/TR
Hersteller: Microchip Technology
Description: TEMPERATURE COMPENSATED
Voltage - Zener (Nom) (Vz): 6.4 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 25 Ohms
Produkt ist nicht verfügbar
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AVR32DD32T-I/PT AVR16-32DD28-32-DataSheet-DS40002441.pdf
AVR32DD32T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 32TQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 23x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
Produkt ist nicht verfügbar
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AVR32DD32T-I/PT AVR16-32DD28-32-DataSheet-DS40002441.pdf
AVR32DD32T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 32TQFP
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 23x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
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10+2.26 EUR
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AVR64DD32T-I/PT AVR32-16DD20-14-Complete-DataSheet-DS40002413.pdf
AVR64DD32T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 32TQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 23x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
Produkt ist nicht verfügbar
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AVR64DD32T-I/PT AVR32-16DD20-14-Complete-DataSheet-DS40002413.pdf
AVR64DD32T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 32TQFP
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 23x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
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9+2.43 EUR
25+2.36 EUR
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PIC16F17174T-I/PT PIC16F17154-55-74-75-Microcontroller-Data-Sheet-DS40002490.pdf
PIC16F17174T-I/PT
Hersteller: Microchip Technology
Description: 7KB FLASH, 512B RAM, 128B EEPROM
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 58x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
Produkt ist nicht verfügbar
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PIC16F17174T-I/PT PIC16F17154-55-74-75-Microcontroller-Data-Sheet-DS40002490.pdf
PIC16F17174T-I/PT
Hersteller: Microchip Technology
Description: 7KB FLASH, 512B RAM, 128B EEPROM
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 58x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
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AVR64DD32T-E/PT AVR32-16DD20-14-Complete-DataSheet-DS40002413.pdf
AVR64DD32T-E/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 32TQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 23x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
Produkt ist nicht verfügbar
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AVR64DD32T-E/PT AVR32-16DD20-14-Complete-DataSheet-DS40002413.pdf
AVR64DD32T-E/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 32TQFP
Packaging: Cut Tape (CT)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 23x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
auf Bestellung 1566 Stücke:
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AnzahlPrivatkunde
8+2.67 EUR
25+2.58 EUR
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PIC16F17175T-I/PT PIC16F17156-76-Microcontroller-Data-Sheet-DS40002485.pdf
PIC16F17175T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 44TQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 58x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
auf Bestellung 1200 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1200+2.8 EUR
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PIC16F17175T-I/PT PIC16F17156-76-Microcontroller-Data-Sheet-DS40002485.pdf
PIC16F17175T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 44TQFP
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 58x12b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
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PIC16F18175T-I/PT PIC16F18154-55-74-75-Microcontroller-Data-Sheet-DS40002491.pdf
PIC16F18175T-I/PT
Hersteller: Microchip Technology
Description: 14KB FLASH, 1KB RAM, 128B EEPROM
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
Produkt ist nicht verfügbar
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PIC16F18175T-I/PT PIC16F18154-55-74-75-Microcontroller-Data-Sheet-DS40002491.pdf
PIC16F18175T-I/PT
Hersteller: Microchip Technology
Description: 14KB FLASH, 1KB RAM, 128B EEPROM
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
Produkt ist nicht verfügbar
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PIC16F17176T-I/PT PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf
PIC16F17176T-I/PT
Hersteller: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 128B EEPROM
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
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PIC16F17176T-I/PT PIC16F17114-15-24-25-44-45-Microcontroller-Data-Sheet-DS40002403.pdf
PIC16F17176T-I/PT
Hersteller: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 128B EEPROM
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
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PIC16F18176T-I/PT PIC16F18156-76-Microcontroller-Data-Sheet-DS40002484.pdf
PIC16F18176T-I/PT
Hersteller: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 128B EEPROM
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
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PIC16F18176T-I/PT PIC16F18156-76-Microcontroller-Data-Sheet-DS40002484.pdf
PIC16F18176T-I/PT
Hersteller: Microchip Technology
Description: 28KB FLASH, 2KB RAM, 128B EEPROM
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 58x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
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6+3.72 EUR
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USB7050PT/KDX USB7050-Data-Sheet-DS00002672E.pdf
USB7050PT/KDX
Hersteller: Microchip Technology
Description: 4 PORT USB3.2 GEN1 - PD UPSTREAM
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 100-VQFN (12x12)
Standards: USB 2.0, USB 3.2
Protocol: USB
Voltage - Supply: 1.08V ~ 1.32V, 3V ~ 3.6V
Operating Temperature: 0°C ~ 70°C (TA)
Interface: GPIO, I2C, I2S, SPI, UART, USB
Function: Hub Controller
Package / Case: 100-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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USB7050PT/KDX USB7050-Data-Sheet-DS00002672E.pdf
USB7050PT/KDX
Hersteller: Microchip Technology
Description: 4 PORT USB3.2 GEN1 - PD UPSTREAM
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 100-VQFN (12x12)
Standards: USB 2.0, USB 3.2
Protocol: USB
Voltage - Supply: 1.08V ~ 1.32V, 3V ~ 3.6V
Operating Temperature: 0°C ~ 70°C (TA)
Interface: GPIO, I2C, I2S, SPI, UART, USB
Function: Hub Controller
Package / Case: 100-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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USB7050PT-I/KDX USB7050-Data-Sheet-DS00002672E.pdf
USB7050PT-I/KDX
Hersteller: Microchip Technology
Description: 4 PORT USB3.2 GEN1 - PD UPSTREAM
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 100-VQFN (12x12)
Packaging: Tape & Reel (TR)
Standards: USB 2.0, USB 3.2
Protocol: USB
Voltage - Supply: 1.08V ~ 1.32V, 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Interface: GPIO, I2C, I2S, SPI, UART, USB
Function: Hub Controller
Package / Case: 100-VFQFN Exposed Pad
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USB7050PT-I/KDX USB7050-Data-Sheet-DS00002672E.pdf
USB7050PT-I/KDX
Hersteller: Microchip Technology
Description: 4 PORT USB3.2 GEN1 - PD UPSTREAM
Protocol: USB
Voltage - Supply: 1.08V ~ 1.32V, 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Interface: GPIO, I2C, I2S, SPI, UART, USB
Function: Hub Controller
Package / Case: 100-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 100-VQFN (12x12)
Standards: USB 2.0, USB 3.2
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BM78SPP05MC2-0B04AA 60001380E.pdf
Hersteller: Microchip Technology
Description: RF TXRX MODULE BLUETOOTH SMD
Packaging: Tray
Package / Case: 33-SMD Module
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 4MB Flash, 320kB ROM, 28kB SRAM
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 3.3V ~ 4.2V
Power - Output: 1.5dBm
Data Rate: 1Mbps
Protocol: Bluetooth v5.0 Dual Mode
Current - Receiving: 37mA (Max)
Current - Transmitting: 43mA (Max)
Antenna Type: Antenna Not Included
Utilized IC / Part: BM78SPPS5MC2/NC2
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, UART
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BM78SPP05MC2-0B02AA 60001380E.pdf
Hersteller: Microchip Technology
Description: RF TXRX MODULE BLUETOOTH SMD
Packaging: Tray
Package / Case: 33-SMD Module
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 4MB Flash, 320kB ROM, 28kB SRAM
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 3.3V ~ 4.2V
Power - Output: 1.5dBm
Data Rate: 1Mbps
Protocol: Bluetooth v5.0 Dual Mode
Current - Receiving: 37mA (Max)
Current - Transmitting: 43mA (Max)
Antenna Type: Antenna Not Included
Utilized IC / Part: BM78SPPS5MC2/NC2
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, UART
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BM78SPPS5MC2-0B02AA 60001380E.pdf
Hersteller: Microchip Technology
Description: RF TXRX MODULE BT CHIP SMD
Packaging: Tray
Package / Case: 33-SMD Module
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 4MB Flash, 320kB ROM, 28kB SRAM
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 3.3V ~ 4.2V
Power - Output: 1.5dBm
Data Rate: 1Mbps
Protocol: Bluetooth v5.0 Dual Mode
Current - Receiving: 37mA (Max)
Current - Transmitting: 43mA (Max)
Antenna Type: Integrated, Chip
Utilized IC / Part: BM78SPPS5MC2/NC2
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, UART
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BM78SPPS5MC2-0B04AA 60001380E.pdf
Hersteller: Microchip Technology
Description: RF TXRX MODULE BT CHIP SMD
Packaging: Tray
Package / Case: 33-SMD Module
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 4MB Flash, 320kB ROM, 28kB SRAM
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 3.3V ~ 4.2V
Power - Output: 1.5dBm
Data Rate: 1Mbps
Protocol: Bluetooth v5.0 Dual Mode
Current - Receiving: 37mA (Max)
Current - Transmitting: 43mA (Max)
Antenna Type: Integrated, Chip
Utilized IC / Part: BM78SPPS5MC2/NC2
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, UART
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MP4KE27A 9517-mp4ke-pdf
MP4KE27A
Hersteller: Microchip Technology
Description: TVS DIODE 23.1VWM 37.5VC DO204AL
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 400W
Voltage - Clamping (Max) @ Ipp: 37.5V
Voltage - Breakdown (Min): 25.7V
Unidirectional Channels: 1
Supplier Device Package: DO-204AL (DO-41)
Voltage - Reverse Standoff (Typ): 23.1V
Current - Peak Pulse (10/1000µs): 11A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AL, DO-41, Axial
Packaging: Bulk
Produkt ist nicht verfügbar
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MIC38C44YN MIC38C42-43-44-45-BiCMOS-Current-Mode-PWM-Controllers-DS20006436B.pdf
MIC38C44YN
Hersteller: Microchip Technology
Description: IC OFFLINE SWITCH MULT TOP 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 500kHz
Internal Switch(s): Yes
Output Isolation: Isolated
Topology: Boost, Buck, Flyback, Forward
Voltage - Supply (Vcc/Vdd): 9V ~ 20V
Supplier Device Package: 8-DIP
Voltage - Start Up: 14.5 V
Control Features: Frequency Control
Produkt ist nicht verfügbar
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MIC38C44-1YM MIC38C42-43-44-45-BiCMOS-Current-Mode-PWM-Controllers-DS20006436B.pdf
MIC38C44-1YM
Hersteller: Microchip Technology
Description: IC OFFLINE SW MULT TOP 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 500kHz
Internal Switch(s): Yes
Output Isolation: Isolated
Topology: Boost, Buck, Flyback, Forward
Voltage - Supply (Vcc/Vdd): 9V ~ 20V
Supplier Device Package: 14-SOIC
Voltage - Start Up: 14.5 V
Control Features: Frequency Control
Produkt ist nicht verfügbar
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AT26DF321-SU description AT26DF321%20Rev2008.pdf
AT26DF321-SU
Hersteller: Microchip Technology
Description: IC FLASH 32MBIT SPI 66MHZ 8SOIC
DigiKey Programmable: Not Verified
Memory Organization: 256 Bytes x 16384 pages
Memory Interface: SPI
Write Cycle Time - Word, Page: 6µs, 5ms
Supplier Device Package: 8-SOIC
Memory Format: FLASH
Clock Frequency: 66 MHz
Technology: FLASH
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TC)
Memory Type: Non-Volatile
Memory Size: 32Mbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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DSC6003CI2B-250K000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003CI2B-250K000T
Hersteller: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6111JI2B-250K000T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6111JI2B-250K000T
Hersteller: Microchip Technology
Description: MEMS OSC LVCMOS 25PPM 2.5X2.0MM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011JI2B-250K000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6011JI2B-250K000T
Hersteller: Microchip Technology
Description: MEMS OSC LVCMOS 25PPM 2.5X2.0MM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6013JI2B-250K000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6013JI2B-250K000T
Hersteller: Microchip Technology
Description: MEMS OSC LVCMOS 25PPM 2.5X2.0MM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6003JI2B-250K000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003JI2B-250K000T
Hersteller: Microchip Technology
Description: OSC MEMS LOW PWR LVCMOS
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6112JI2B-250K000T DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6112JI2B-250K000T
Hersteller: Microchip Technology
Description: MEMS OSC LVCMOS 25PPM 2.5X2.0MM
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 250 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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SAMA7G54T-E/4HB SAMA7G5-Series-Silicon-Errata-and-Data-Sheet-Clarification-DS80001016.pdf
SAMA7G54T-E/4HB
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU, BGA, EXT. TEMP (T
Packaging: Tape & Reel (TR)
Package / Case: 343-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 343-TFBGA (14x14)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB Typ-C (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
Produkt ist nicht verfügbar
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JANTX1N3022D-1 125225-lds-0285-datasheet
JANTX1N3022D-1
Hersteller: Microchip Technology
Description: DIODE ZENER 12V 1W DO204AL
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 9 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 9.1 V
Qualification: MIL-PRF-19500/115
Produkt ist nicht verfügbar
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MP6KE13A rf01007_rb.pdf
MP6KE13A
Hersteller: Microchip Technology
Description: TVS DIODE 11.1VWM 18.2VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 11.1V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 12.4V
Voltage - Clamping (Max) @ Ipp: 18.2V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPFS095T-1FCVG484E 1244583-polarfire-soc-advance-datasheet
MPFS095T-1FCVG484E
Hersteller: Microchip Technology
Description: IC SOC RISC-V 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
RAM Size: 857.6kB
Operating Temperature: 0°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
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AnzahlPrivatkunde
1+393.47 EUR
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AT89C2051-12SU description doc0368.pdf
AT89C2051-12SU
Hersteller: Microchip Technology
Description: IC MCU 8BIT 2KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: UART/USART
Peripherals: LED
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Verified
auf Bestellung 2339 Stücke:
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AnzahlPrivatkunde
8+2.68 EUR
25+2.48 EUR
100+2.23 EUR
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MIC37120-1.8YMT-TR MIC37110%2C12%2C20%2C22_DS.pdf
MIC37120-1.8YMT-TR
Hersteller: Microchip Technology
Description: IC REG LINEAR 1.8V 1A 6-TMLF
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN Exposed Pad, 6-TMLF®
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 500 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-TMLF® (2x2)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
Voltage Dropout (Max): 0.4V @ 1A
Protection Features: Over Current, Over Temperature
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MIC37120-1.8YMT-TR MIC37110%2C12%2C20%2C22_DS.pdf
MIC37120-1.8YMT-TR
Hersteller: Microchip Technology
Description: IC REG LINEAR 1.8V 1A 6-TMLF
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN Exposed Pad, 6-TMLF®
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 500 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-TMLF® (2x2)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
Voltage Dropout (Max): 0.4V @ 1A
Protection Features: Over Current, Over Temperature
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JAN1N4560B
Hersteller: Microchip Technology
Description: ZENER DIODE
Tolerance: ±10%
Packaging: Bulk
Package / Case: TO-204AD
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 0.12 Ohms
Supplier Device Package: TO-204AD (TO-3)
Grade: Military
Power - Max: 50 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Qualification: MIL-PRF-19500/114
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JANTXV1N4560B
Hersteller: Microchip Technology
Description: ZENER DIODE
Tolerance: ±10%
Packaging: Bulk
Package / Case: TO-204AD
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 0.12 Ohms
Supplier Device Package: TO-204AD (TO-3)
Grade: Military
Power - Max: 50 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 20 µA @ 1 V
Qualification: MIL-PRF-19500/114
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2N5621
2N5621
Hersteller: Microchip Technology
Description: TRANS PNP 60V 10A TO204AA
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: PNP
Supplier Device Package: TO-204AA (TO-3)
Current - Collector (Ic) (Max): 10 A
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 116 W
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JANTX1N5542B-1 1N5518B_1N5546B-1.pdf
JANTX1N5542B-1
Hersteller: Microchip Technology
Description: DIODE ZENER 22V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 19.8 V
Qualification: MIL-PRF-19500/437
Produkt ist nicht verfügbar
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APT12060LVFRG APT12060B2_LVFR_A.pdf
APT12060LVFRG
Hersteller: Microchip Technology
Description: MOSFET N-CH 1200V 20A TO264
Input Capacitance (Ciss) (Max) @ Vds: 9500 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 650 nC @ 10 V
Drain to Source Voltage (Vdss): 1200 V
Supplier Device Package: TO-264 [L]
Vgs(th) (Max) @ Id: 4V @ 1mA
Rds On (Max) @ Id, Vgs: 600mOhm @ 10A, 10V
Current - Continuous Drain (Id) @ 25°C: 20A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Mounting Type: Through Hole
Package / Case: TO-264-3, TO-264AA
Packaging: Tube
Produkt ist nicht verfügbar
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SY100EL01ZG-TR sy10-100el01.pdf
SY100EL01ZG-TR
Hersteller: Microchip Technology
Description: IC GATE OR/NOR 4-INPUT 8-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Differential
Mounting Type: Surface Mount
Logic Type: NOR/OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.2V ~ 5.5V
Number of Inputs: 4
Schmitt Trigger Input: No
Supplier Device Package: 8-SOIC
Number of Circuits: 1
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SY100EL01ZC sy10-100el01.pdf
SY100EL01ZC
Hersteller: Microchip Technology
Description: IC GATE OR/NOR 4-INPUT 8-SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Differential
Mounting Type: Surface Mount
Logic Type: NOR/OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.2V ~ 5.5V
Number of Inputs: 4
Schmitt Trigger Input: No
Supplier Device Package: 8-SOIC
Number of Circuits: 1
Produkt ist nicht verfügbar
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MCP79520T-I/MS MCP7951X-MCP7952X-Battery-Backed-SPI-Real-Time-Clock-Calendar-20002300D.pdf
MCP79520T-I/MS
Hersteller: Microchip Technology
Description: IC RTC CLK/CALENDAR SPI 10MSOP
Features: Alarm, EEPROM, Leap Year, Square Wave Output, SRAM, Unique ID
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Memory Size: 64B
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 10-MSOP
Voltage - Supply, Battery: 1.3V ~ 3.6V
Current - Timekeeping (Max): 1µA @ 1.8V ~ 3.6V
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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