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1N3823AUR-1/TR 1N3823AUR-1/TR Microchip Technology 1N3821AUR-1-1N3828AUR-1.pdf Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 9 Ohms
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
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VCC1-G3D-100M000000 Microchip Technology VCC1-April-2020.pdf Description: CMOS XO +2.5 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAFETY-PKG-G3-F Microchip Technology Description: SOFTWARE SAFETY DATA PKG G3
Packaging: Bulk
Type: License
Produkt ist nicht verfügbar
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APT7F120S APT7F120S Microchip Technology 7262-apt7f120b-apt7f120s-datasheet Description: MOSFET N-CH 1200V 7A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7A (Tc)
Rds On (Max) @ Id, Vgs: 2.4Ohm @ 3A, 10V
Power Dissipation (Max): 335W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 80 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2565 pF @ 25 V
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100+9.95 EUR
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ATV2500BQ-25PC ATV2500BQ-25PC Microchip Technology doc0249.pdf Description: IC CPLD 24MC 25NS 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Programmable Type: OTP
Number of Macrocells: 24
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 25 ns
Supplier Device Package: 40-PDIP
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of I/O: 24
DigiKey Programmable: Not Verified
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ATV2500BL-20JI ATV2500BL-20JI Microchip Technology doc0249.pdf Description: IC CPLD 24MC 20NS 44PLCC
DigiKey Programmable: Not Verified
Number of I/O: 24
Voltage Supply - Internal: 4.5V ~ 5.5V
Supplier Device Package: 44-PLCC (16.6x16.6)
Delay Time tpd(1) Max: 20 ns
Operating Temperature: -40°C ~ 85°C (TA)
Number of Macrocells: 24
Programmable Type: OTP
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Packaging: Tube
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ATSAM3S1CB-AU ATSAM3S1CB-AU Microchip Technology atmel_6500s-32-bit%20cortex-m3%20microcontroller_sam3s_summary-datasheet.pdf Description: IC MCU 32BIT 64KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Memory Card, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10/12b; D/A 2x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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ATSAM3S1BB-AU ATSAM3S1BB-AU Microchip Technology atmel_6500s-32-bit%20cortex-m3%20microcontroller_sam3s_summary-datasheet.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 10x10/12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 47
DigiKey Programmable: Not Verified
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25+5.27 EUR
100+4.76 EUR
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ATSAM3S1BB-MUR ATSAM3S1BB-MUR Microchip Technology atmel_6500s-32-bit%20cortex-m3%20microcontroller_sam3s_summary-datasheet.pdf Description: IC MCU 32BIT 64KB FLASH 64QFN
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x10/12b; D/A 2x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
DigiKey Programmable: Not Verified
Number of I/O: 47
Supplier Device Package: 64-QFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
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ATSAM3S1BB-MUR ATSAM3S1BB-MUR Microchip Technology atmel_6500s-32-bit%20cortex-m3%20microcontroller_sam3s_summary-datasheet.pdf Description: IC MCU 32BIT 64KB FLASH 64QFN
Data Converters: A/D 10x10/12b; D/A 2x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 47
Supplier Device Package: 64-QFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
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ATSAM3S1CB-CUR ATSAM3S1CB-CUR Microchip Technology atmel_6500s-32-bit%20cortex-m3%20microcontroller_sam3s_summary-datasheet.pdf Description: IC MCU 32BIT 64KB FLASH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Memory Card, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10/12b; D/A 2x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tape & Reel (TR)
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ATSAM3S1CB-CUR ATSAM3S1CB-CUR Microchip Technology atmel_6500s-32-bit%20cortex-m3%20microcontroller_sam3s_summary-datasheet.pdf Description: IC MCU 32BIT 64KB FLASH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Memory Card, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10/12b; D/A 2x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Cut Tape (CT)
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ATSAM3S2CA-CU ATSAM3S2CA-CU Microchip Technology SAM3S_Series.pdf Description: IC MCU 32BIT 128KB FLSH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Memory Card, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10/12b; D/A 2x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
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ATSAM3S4CA-CU ATSAM3S4CA-CU Microchip Technology SAM3S_Series.pdf Description: IC MCU 32BIT 256KB FLSH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Memory Card, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10/12b; D/A 2x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 48K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
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ATSAM3SD8BA-AUR ATSAM3SD8BA-AUR Microchip Technology Atmel-11075-Atmel-SMART-SAM3S_Flyer.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 47
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, IrDA, Memory Card, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x10/12b; D/A 2x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
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2N5237S 2N5237S Microchip Technology Description: TRANS NPN 120V 10A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 2.5V @ 1A, 10A
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5A, 5V
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 10 A
Voltage - Collector Emitter Breakdown (Max): 120 V
Power - Max: 1 W
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JANTXV2N5237S JANTXV2N5237S Microchip Technology 8815-lds-0014-pdf Description: TRANS NPN 120V 10A TO39
Qualification: MIL-PRF-19500/394
Power - Max: 1 W
Voltage - Collector Emitter Breakdown (Max): 120 V
Current - Collector (Ic) (Max): 10 A
Grade: Military
Supplier Device Package: TO-39 (TO-205AD)
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5A, 5V
Current - Collector Cutoff (Max): 10µA
Vce Saturation (Max) @ Ib, Ic: 2.5V @ 1A, 10A
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-205AD, TO-39-3 Metal Can
Packaging: Bulk
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JANS2N5237S JANS2N5237S Microchip Technology Description: NPN TRANSISTOR
Current - Collector Cutoff (Max): 10µA
Vce Saturation (Max) @ Ib, Ic: 2.5V @ 1A, 10A
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-205AD, TO-39-3 Metal Can
Packaging: Bulk
Qualification: MIL-PRF-19500/394
Power - Max: 1 W
Voltage - Collector Emitter Breakdown (Max): 120 V
Current - Collector (Ic) (Max): 10 A
Grade: Military
Supplier Device Package: TO-39 (TO-205AD)
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5A, 5V
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AT88SC0204C-PU AT88SC0204C-PU Microchip Technology Atmel-2022S-CryptoMem-AT88SC0204C-Datasheet-Summary.pdf Description: IC SECURE MEMORY 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Type: Secure Memory
Applications: Embedded, Smart Card
Supplier Device Package: 8-PDIP
DigiKey Programmable: Not Verified
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ATA6621N-PGQW ATA6621N-PGQW Microchip Technology ATA6621N.pdf Description: IC TRANSCEIVER 1/1 20QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 20-QFN (5x5)
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DSC1121AI2-200.0000T DSC1121AI2-200.0000T Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSC XO 200.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
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JANTXV1N990B-1 JANTXV1N990B-1 Microchip Technology Description: ZENER DIODE
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 500 nA @ 122 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 1700 Ohms
Voltage - Zener (Nom) (Vz): 160 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
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JANTXV1N990B-1/TR JANTXV1N990B-1/TR Microchip Technology Description: VOLTAGE REGULATOR
Impedance (Max) (Zzt): 1.7 Ohms
Voltage - Zener (Nom) (Vz): 160 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 500 nA @ 122 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
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JAN1N990B-1 JAN1N990B-1 Microchip Technology Description: ZENER DIODE
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 500 nA @ 122 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 1700 Ohms
Voltage - Zener (Nom) (Vz): 160 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
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JANTX1N990BUR-1 Microchip Technology Description: ZENER DIODE
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 500 nA @ 122 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 1700 Ohms
Voltage - Zener (Nom) (Vz): 160 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AA (Glass)
Tolerance: ±5%
Packaging: Bulk
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VXM7-1DW-20-19M2000000 Microchip Technology vxm7.pdf Description: SMT XTAL -10C TO +70C +/-15PPM
Packaging: Tape & Reel (TR)
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JAN1N6772R Microchip Technology Description: DIODE GEN PURP 400V 8A TO257
Packaging: Bulk
Package / Case: TO-257-3
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 60 ns
Technology: Standard, Reverse Polarity
Capacitance @ Vr, F: 200pF @ 5V, 1MHz
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-257
Grade: Military
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 8 A
Current - Reverse Leakage @ Vr: 10 µA @ 320 V
Qualification: MIL-PRF-19500/645
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ATSAMD51P19A-AUT-EFP ATSAMD51P19A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 512KB FLASH 128TQFP
Packaging: Tape & Reel (TR)
Package / Case: 128-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 128-TQFP (14x14)
Number of I/O: 99
DigiKey Programmable: Not Verified
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ATSAMD51P19A-AUT-EFP ATSAMD51P19A-AUT-EFP Microchip Technology SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf Description: IC MCU 32BIT 512KB FLASH 128TQFP
Packaging: Cut Tape (CT)
Package / Case: 128-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 128-TQFP (14x14)
Number of I/O: 99
DigiKey Programmable: Not Verified
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JANTX1N6643U/TR JANTX1N6643U/TR Microchip Technology Description: DIODE GP 75V 300MA SQ-MELF B
Qualification: MIL-PRF-19500/578
Current - Reverse Leakage @ Vr: 500 nA @ 50 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 100 mA
Voltage - DC Reverse (Vr) (Max): 75 V
Grade: Military
Operating Temperature - Junction: -65°C ~ 200°C
Supplier Device Package: B, SQ-MELF
Current - Average Rectified (Io): 300mA
Capacitance @ Vr, F: 5pF @ 0V, 1MHz
Technology: Standard
Reverse Recovery Time (trr): 6 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SQ-MELF, B
Packaging: Tape & Reel (TR)
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1N6621U 1N6621U Microchip Technology Description: DIODE GP 440V 1.2A A SQ-MELF
Current - Reverse Leakage @ Vr: 500 nA @ 440 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1.2 A
Voltage - DC Reverse (Vr) (Max): 440 V
Operating Temperature - Junction: -65°C ~ 150°C
Supplier Device Package: A, SQ-MELF
Current - Average Rectified (Io): 1.2A
Technology: Standard
Reverse Recovery Time (trr): 45 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Packaging: Bulk
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1N6621US/TR 1N6621US/TR Microchip Technology 11068-sd52a-datasheet Description: DIODE GEN PURP 400V 2A D-5A
Current - Reverse Leakage @ Vr: 500 nA @ 400 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 2 A
Voltage - DC Reverse (Vr) (Max): 400 V
Operating Temperature - Junction: -65°C ~ 150°C
Supplier Device Package: D-5A
Current - Average Rectified (Io): 2A
Capacitance @ Vr, F: 10pF @ 10V, 1MHz
Technology: Standard
Reverse Recovery Time (trr): 45 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Packaging: Tape & Reel (TR)
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1N6621U/TR 1N6621U/TR Microchip Technology Description: DIODE GP 440V 1.2A A SQ-MELF
Current - Reverse Leakage @ Vr: 500 nA @ 440 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1.2 A
Voltage - DC Reverse (Vr) (Max): 440 V
Operating Temperature - Junction: -65°C ~ 150°C
Supplier Device Package: A, SQ-MELF
Current - Average Rectified (Io): 1.2A
Technology: Standard
Reverse Recovery Time (trr): 45 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Packaging: Tape & Reel (TR)
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JAN1N6621US/TR JAN1N6621US/TR Microchip Technology Description: DIODE GEN PURP 75V 200MA D-5A
Qualification: MIL-PRF-19500/116
Current - Reverse Leakage @ Vr: 500 nA @ 75 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 100 mA
Voltage - DC Reverse (Vr) (Max): 75 V
Grade: Military
Operating Temperature - Junction: -65°C ~ 200°C
Supplier Device Package: D-5A
Current - Average Rectified (Io): 200mA
Capacitance @ Vr, F: 2.8pF @ 1.5V, 1MHz
Technology: Standard
Reverse Recovery Time (trr): 20 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Packaging: Tape & Reel (TR)
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JAN1N6621U/TR JAN1N6621U/TR Microchip Technology Description: DIODE GP 440V 1.2A A SQ-MELF
Qualification: MIL-PRF-19500/585
Current - Reverse Leakage @ Vr: 500 nA @ 440 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1.2 A
Voltage - DC Reverse (Vr) (Max): 440 V
Grade: Military
Operating Temperature - Junction: -65°C ~ 150°C
Supplier Device Package: A, SQ-MELF
Current - Average Rectified (Io): 1.2A
Technology: Standard
Reverse Recovery Time (trr): 45 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Packaging: Tape & Reel (TR)
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JANTX1N6621U/TR JANTX1N6621U/TR Microchip Technology Description: DIODE GP 440V 1.2A A SQ-MELF
Voltage - DC Reverse (Vr) (Max): 440 V
Grade: Military
Operating Temperature - Junction: -65°C ~ 150°C
Supplier Device Package: A, SQ-MELF
Current - Average Rectified (Io): 1.2A
Technology: Standard
Reverse Recovery Time (trr): 45 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Packaging: Tape & Reel (TR)
Qualification: MIL-PRF-19500/585
Current - Reverse Leakage @ Vr: 500 nA @ 440 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1.2 A
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JANTXV1N6621U/TR JANTXV1N6621U/TR Microchip Technology Description: DIODE GP 440V 1.2A A SQ-MELF
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Packaging: Tape & Reel (TR)
Qualification: MIL-PRF-19500/585
Current - Reverse Leakage @ Vr: 500 nA @ 440 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1.2 A
Voltage - DC Reverse (Vr) (Max): 440 V
Grade: Military
Operating Temperature - Junction: -65°C ~ 150°C
Supplier Device Package: A, SQ-MELF
Current - Average Rectified (Io): 1.2A
Technology: Standard
Reverse Recovery Time (trr): 45 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
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JANS1N6621US JANS1N6621US Microchip Technology Description: DIODE GP 400V 1.2A A SQ-MELF
Grade: Military
Operating Temperature - Junction: -65°C ~ 150°C
Supplier Device Package: A, SQ-MELF
Current - Average Rectified (Io): 1.2A
Technology: Standard
Reverse Recovery Time (trr): 45 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Packaging: Bulk
Qualification: MIL-PRF-19500/585
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 2 A
Voltage - DC Reverse (Vr) (Max): 400 V
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JANS1N6621US/TR JANS1N6621US/TR Microchip Technology Description: DIODE GP 400V 1.2A A SQ-MELF
Qualification: MIL-PRF-19500/585
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 2 A
Voltage - DC Reverse (Vr) (Max): 400 V
Grade: Military
Operating Temperature - Junction: -65°C ~ 150°C
Supplier Device Package: A, SQ-MELF
Current - Average Rectified (Io): 1.2A
Technology: Standard
Reverse Recovery Time (trr): 45 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Packaging: Tape & Reel (TR)
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1N6164US/TR 1N6164US/TR Microchip Technology 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet Description: BI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 13.3A
Voltage - Reverse Standoff (Typ): 62.2V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 77.9V
Voltage - Clamping (Max) @ Ipp: 112.8V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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1N6164US/TR 1N6164US/TR Microchip Technology 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet Description: BI-DIRECTIONAL TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 13.3A
Voltage - Reverse Standoff (Typ): 62.2V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 77.9V
Voltage - Clamping (Max) @ Ipp: 112.8V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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1N6164AUS/TR 1N6164AUS/TR Microchip Technology 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet Description: BI-DIRECTIONAL TVS
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 112.8V
Voltage - Breakdown (Min): 77.9V
Bidirectional Channels: 1
Supplier Device Package: C, SQ-MELF
Voltage - Reverse Standoff (Typ): 62.2V
Current - Peak Pulse (10/1000µs): 13.3A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: SQ-MELF, C
Packaging: Tape & Reel (TR)
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1N6164AUS/TR 1N6164AUS/TR Microchip Technology 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet Description: BI-DIRECTIONAL TVS
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 112.8V
Voltage - Breakdown (Min): 77.9V
Bidirectional Channels: 1
Supplier Device Package: C, SQ-MELF
Voltage - Reverse Standoff (Typ): 62.2V
Current - Peak Pulse (10/1000µs): 13.3A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: SQ-MELF, C
Packaging: Cut Tape (CT)
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DSC1103CL5-200.0000T DSC1103CL5-200.0000T Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: OSC MEMS LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1103CL5-200.0000 DSC1103CL5-200.0000 Microchip Technology Description: OSC MEMS LVDS SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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VXM7-1D1-16M0000000 Microchip Technology vxm7.pdf Description: SMT XTAL +/-15PPM
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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JANTXV1N5530BUR-1 Microchip Technology Description: ZENER DIODE
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 60 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 9.1 V
Qualification: MIL-PRF-19500/437
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2281600-R 2281600-R Microchip Technology 135884-microsemi-adaptec-series-8-product-brief Description: ADAPTEC RAID 81605ZQ SINGLE
Number of Ports: 16
Type: SAS/SATA
Interface: PCI Express
Packaging: Bulk
Produkt ist nicht verfügbar
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1N5531D-1 1N5531D-1 Microchip Technology Description: ZENER DIODE
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
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1N5531D-1/TR 1N5531D-1/TR Microchip Technology Description: VOLTAGE REGULATOR
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
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JAN1N5531D-1 JAN1N5531D-1 Microchip Technology 123956-lds-0037-1-datasheet Description: DIODE ZENER 11V 500MW DO35
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
Qualification: MIL-PRF-19500/437
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JANTX1N5531D-1/TR JANTX1N5531D-1/TR Microchip Technology Description: VOLTAGE REGULATOR
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
Qualification: MIL-PRF-19500/437
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JANTXV1N5531D-1 JANTXV1N5531D-1 Microchip Technology 123956-lds-0037-1-datasheet Description: DIODE ZENER 11V 500MW DO35
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
Qualification: MIL-PRF-19500/437
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JANTX1N5531D-1 JANTX1N5531D-1 Microchip Technology 123956-lds-0037-1-datasheet Description: DIODE ZENER 11V 500MW DO35
Tolerance: ±1%
Packaging: Bulk
Qualification: MIL-PRF-19500/437
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 80 Ohms
Voltage - Zener (Nom) (Vz): 11 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
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DSC6331JI1BB-018.4320 Microchip Technology DSC63xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-with-Spread-Spectrum-DS20006154A.pdf Description: MEMS OSC AUTO LOWPWR -40C-85C
Base Resonator: MEMS
Frequency: 18.432 MHz
Height - Seated (Max): 0.035" (0.89mm)
Current - Supply (Max): 3mA (Typ)
Spread Spectrum Bandwidth: ±0.50%, Center Spread
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Output: LVCMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VLGA
Packaging: Tube
Produkt ist nicht verfügbar
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DSC6331JI1BB-018.4320T Microchip Technology DSC63xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-with-Spread-Spectrum-DS20006154A.pdf Description: MEMS OSC AUTO LOWPWR -40C-85C
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VLGA
Packaging: Tape & Reel (TR)
Base Resonator: MEMS
Frequency: 18.432 MHz
Height - Seated (Max): 0.035" (0.89mm)
Current - Supply (Max): 3mA (Typ)
Spread Spectrum Bandwidth: ±0.50%, Center Spread
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Output: LVCMOS
Mounting Type: Surface Mount
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DSC6011HI2B-025.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSC AUTO LOWPWR -40C-85C
Base Resonator: MEMS
Frequency: 25 MHz
Height - Seated (Max): 0.035" (0.89mm)
Current - Supply (Max): 1.3mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: 4-VFLGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSC1001AI5-001.7000T DSC1001AI5-001.7000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC LOW POWER 1.7MHZ LVCMOS
Base Resonator: MEMS
Frequency: 1.7 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 8mA
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 4-VDFN Exposed Pad
Packaging: Strip
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DSC1001AI5-001.7000 DSC1001AI5-001.7000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 1.7000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 1.7 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 8mA
Ratings: AEC-Q100
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 4-VDFN Exposed Pad
Packaging: Strip
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DSC1001AI5-001.7000 DSC1001AI5-001.7000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC LOW POWER 1.7MHZ LVCMOS
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 4-VDFN Exposed Pad
Packaging: Tube
Base Resonator: MEMS
Frequency: 1.7 MHz
Absolute Pull Range (APR): ±10ppm
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 8mA
Produkt ist nicht verfügbar
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1N3823AUR-1/TR 1N3821AUR-1-1N3828AUR-1.pdf
1N3823AUR-1/TR
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 9 Ohms
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
Produkt ist nicht verfügbar
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VCC1-G3D-100M000000 VCC1-April-2020.pdf
Hersteller: Microchip Technology
Description: CMOS XO +2.5 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAFETY-PKG-G3-F
Hersteller: Microchip Technology
Description: SOFTWARE SAFETY DATA PKG G3
Packaging: Bulk
Type: License
Produkt ist nicht verfügbar
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APT7F120S 7262-apt7f120b-apt7f120s-datasheet
APT7F120S
Hersteller: Microchip Technology
Description: MOSFET N-CH 1200V 7A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7A (Tc)
Rds On (Max) @ Id, Vgs: 2.4Ohm @ 3A, 10V
Power Dissipation (Max): 335W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 80 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2565 pF @ 25 V
auf Bestellung 240 Stücke:
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AnzahlPreis
2+11.53 EUR
100+9.95 EUR
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ATV2500BQ-25PC doc0249.pdf
ATV2500BQ-25PC
Hersteller: Microchip Technology
Description: IC CPLD 24MC 25NS 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Programmable Type: OTP
Number of Macrocells: 24
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 25 ns
Supplier Device Package: 40-PDIP
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of I/O: 24
DigiKey Programmable: Not Verified
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ATV2500BL-20JI doc0249.pdf
ATV2500BL-20JI
Hersteller: Microchip Technology
Description: IC CPLD 24MC 20NS 44PLCC
DigiKey Programmable: Not Verified
Number of I/O: 24
Voltage Supply - Internal: 4.5V ~ 5.5V
Supplier Device Package: 44-PLCC (16.6x16.6)
Delay Time tpd(1) Max: 20 ns
Operating Temperature: -40°C ~ 85°C (TA)
Number of Macrocells: 24
Programmable Type: OTP
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Packaging: Tube
Produkt ist nicht verfügbar
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ATSAM3S1CB-AU atmel_6500s-32-bit%20cortex-m3%20microcontroller_sam3s_summary-datasheet.pdf
ATSAM3S1CB-AU
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Memory Card, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10/12b; D/A 2x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
auf Bestellung 270 Stücke:
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AnzahlPreis
3+6.99 EUR
25+6.33 EUR
100+5.74 EUR
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ATSAM3S1BB-AU atmel_6500s-32-bit%20cortex-m3%20microcontroller_sam3s_summary-datasheet.pdf
ATSAM3S1BB-AU
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 10x10/12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 47
DigiKey Programmable: Not Verified
auf Bestellung 480 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4+5.76 EUR
25+5.27 EUR
100+4.76 EUR
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ATSAM3S1BB-MUR atmel_6500s-32-bit%20cortex-m3%20microcontroller_sam3s_summary-datasheet.pdf
ATSAM3S1BB-MUR
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 64QFN
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x10/12b; D/A 2x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
DigiKey Programmable: Not Verified
Number of I/O: 47
Supplier Device Package: 64-QFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Produkt ist nicht verfügbar
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ATSAM3S1BB-MUR atmel_6500s-32-bit%20cortex-m3%20microcontroller_sam3s_summary-datasheet.pdf
ATSAM3S1BB-MUR
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 64QFN
Data Converters: A/D 10x10/12b; D/A 2x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 47
Supplier Device Package: 64-QFN (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
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ATSAM3S1CB-CUR atmel_6500s-32-bit%20cortex-m3%20microcontroller_sam3s_summary-datasheet.pdf
ATSAM3S1CB-CUR
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Memory Card, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10/12b; D/A 2x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATSAM3S1CB-CUR atmel_6500s-32-bit%20cortex-m3%20microcontroller_sam3s_summary-datasheet.pdf
ATSAM3S1CB-CUR
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Memory Card, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10/12b; D/A 2x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Cut Tape (CT)
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ATSAM3S2CA-CU SAM3S_Series.pdf
ATSAM3S2CA-CU
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB FLSH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Memory Card, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10/12b; D/A 2x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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ATSAM3S4CA-CU SAM3S_Series.pdf
ATSAM3S4CA-CU
Hersteller: Microchip Technology
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Memory Card, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x10/12b; D/A 2x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 48K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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ATSAM3SD8BA-AUR Atmel-11075-Atmel-SMART-SAM3S_Flyer.pdf
ATSAM3SD8BA-AUR
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 47
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, IrDA, Memory Card, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x10/12b; D/A 2x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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2N5237S
2N5237S
Hersteller: Microchip Technology
Description: TRANS NPN 120V 10A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 2.5V @ 1A, 10A
Current - Collector Cutoff (Max): 10µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5A, 5V
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 10 A
Voltage - Collector Emitter Breakdown (Max): 120 V
Power - Max: 1 W
Produkt ist nicht verfügbar
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JANTXV2N5237S 8815-lds-0014-pdf
JANTXV2N5237S
Hersteller: Microchip Technology
Description: TRANS NPN 120V 10A TO39
Qualification: MIL-PRF-19500/394
Power - Max: 1 W
Voltage - Collector Emitter Breakdown (Max): 120 V
Current - Collector (Ic) (Max): 10 A
Grade: Military
Supplier Device Package: TO-39 (TO-205AD)
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5A, 5V
Current - Collector Cutoff (Max): 10µA
Vce Saturation (Max) @ Ib, Ic: 2.5V @ 1A, 10A
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-205AD, TO-39-3 Metal Can
Packaging: Bulk
Produkt ist nicht verfügbar
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JANS2N5237S
JANS2N5237S
Hersteller: Microchip Technology
Description: NPN TRANSISTOR
Current - Collector Cutoff (Max): 10µA
Vce Saturation (Max) @ Ib, Ic: 2.5V @ 1A, 10A
Operating Temperature: -65°C ~ 200°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-205AD, TO-39-3 Metal Can
Packaging: Bulk
Qualification: MIL-PRF-19500/394
Power - Max: 1 W
Voltage - Collector Emitter Breakdown (Max): 120 V
Current - Collector (Ic) (Max): 10 A
Grade: Military
Supplier Device Package: TO-39 (TO-205AD)
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5A, 5V
Produkt ist nicht verfügbar
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AT88SC0204C-PU Atmel-2022S-CryptoMem-AT88SC0204C-Datasheet-Summary.pdf
AT88SC0204C-PU
Hersteller: Microchip Technology
Description: IC SECURE MEMORY 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Type: Secure Memory
Applications: Embedded, Smart Card
Supplier Device Package: 8-PDIP
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATA6621N-PGQW ATA6621N.pdf
ATA6621N-PGQW
Hersteller: Microchip Technology
Description: IC TRANSCEIVER 1/1 20QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 20-QFN (5x5)
Produkt ist nicht verfügbar
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DSC1121AI2-200.0000T DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1121AI2-200.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 200.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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JANTXV1N990B-1
JANTXV1N990B-1
Hersteller: Microchip Technology
Description: ZENER DIODE
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 500 nA @ 122 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 1700 Ohms
Voltage - Zener (Nom) (Vz): 160 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTXV1N990B-1/TR
JANTXV1N990B-1/TR
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Impedance (Max) (Zzt): 1.7 Ohms
Voltage - Zener (Nom) (Vz): 160 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 500 nA @ 122 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
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JAN1N990B-1
JAN1N990B-1
Hersteller: Microchip Technology
Description: ZENER DIODE
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 500 nA @ 122 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 1700 Ohms
Voltage - Zener (Nom) (Vz): 160 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
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JANTX1N990BUR-1
Hersteller: Microchip Technology
Description: ZENER DIODE
Qualification: MIL-PRF-19500/117
Current - Reverse Leakage @ Vr: 500 nA @ 122 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 1700 Ohms
Voltage - Zener (Nom) (Vz): 160 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AA (Glass)
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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VXM7-1DW-20-19M2000000 vxm7.pdf
Hersteller: Microchip Technology
Description: SMT XTAL -10C TO +70C +/-15PPM
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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JAN1N6772R
Hersteller: Microchip Technology
Description: DIODE GEN PURP 400V 8A TO257
Packaging: Bulk
Package / Case: TO-257-3
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 60 ns
Technology: Standard, Reverse Polarity
Capacitance @ Vr, F: 200pF @ 5V, 1MHz
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-257
Grade: Military
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 8 A
Current - Reverse Leakage @ Vr: 10 µA @ 320 V
Qualification: MIL-PRF-19500/645
Produkt ist nicht verfügbar
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ATSAMD51P19A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51P19A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 128TQFP
Packaging: Tape & Reel (TR)
Package / Case: 128-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 128-TQFP (14x14)
Number of I/O: 99
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAMD51P19A-AUT-EFP SAM_D5x_E5x_Family_Data_Sheet_DS60001507G.pdf
ATSAMD51P19A-AUT-EFP
Hersteller: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 128TQFP
Packaging: Cut Tape (CT)
Package / Case: 128-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 128-TQFP (14x14)
Number of I/O: 99
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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JANTX1N6643U/TR
JANTX1N6643U/TR
Hersteller: Microchip Technology
Description: DIODE GP 75V 300MA SQ-MELF B
Qualification: MIL-PRF-19500/578
Current - Reverse Leakage @ Vr: 500 nA @ 50 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 100 mA
Voltage - DC Reverse (Vr) (Max): 75 V
Grade: Military
Operating Temperature - Junction: -65°C ~ 200°C
Supplier Device Package: B, SQ-MELF
Current - Average Rectified (Io): 300mA
Capacitance @ Vr, F: 5pF @ 0V, 1MHz
Technology: Standard
Reverse Recovery Time (trr): 6 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SQ-MELF, B
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N6621U
1N6621U
Hersteller: Microchip Technology
Description: DIODE GP 440V 1.2A A SQ-MELF
Current - Reverse Leakage @ Vr: 500 nA @ 440 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1.2 A
Voltage - DC Reverse (Vr) (Max): 440 V
Operating Temperature - Junction: -65°C ~ 150°C
Supplier Device Package: A, SQ-MELF
Current - Average Rectified (Io): 1.2A
Technology: Standard
Reverse Recovery Time (trr): 45 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Packaging: Bulk
Produkt ist nicht verfügbar
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1N6621US/TR 11068-sd52a-datasheet
1N6621US/TR
Hersteller: Microchip Technology
Description: DIODE GEN PURP 400V 2A D-5A
Current - Reverse Leakage @ Vr: 500 nA @ 400 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 2 A
Voltage - DC Reverse (Vr) (Max): 400 V
Operating Temperature - Junction: -65°C ~ 150°C
Supplier Device Package: D-5A
Current - Average Rectified (Io): 2A
Capacitance @ Vr, F: 10pF @ 10V, 1MHz
Technology: Standard
Reverse Recovery Time (trr): 45 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N6621U/TR
1N6621U/TR
Hersteller: Microchip Technology
Description: DIODE GP 440V 1.2A A SQ-MELF
Current - Reverse Leakage @ Vr: 500 nA @ 440 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1.2 A
Voltage - DC Reverse (Vr) (Max): 440 V
Operating Temperature - Junction: -65°C ~ 150°C
Supplier Device Package: A, SQ-MELF
Current - Average Rectified (Io): 1.2A
Technology: Standard
Reverse Recovery Time (trr): 45 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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JAN1N6621US/TR
JAN1N6621US/TR
Hersteller: Microchip Technology
Description: DIODE GEN PURP 75V 200MA D-5A
Qualification: MIL-PRF-19500/116
Current - Reverse Leakage @ Vr: 500 nA @ 75 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 100 mA
Voltage - DC Reverse (Vr) (Max): 75 V
Grade: Military
Operating Temperature - Junction: -65°C ~ 200°C
Supplier Device Package: D-5A
Current - Average Rectified (Io): 200mA
Capacitance @ Vr, F: 2.8pF @ 1.5V, 1MHz
Technology: Standard
Reverse Recovery Time (trr): 20 ns
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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JAN1N6621U/TR
JAN1N6621U/TR
Hersteller: Microchip Technology
Description: DIODE GP 440V 1.2A A SQ-MELF
Qualification: MIL-PRF-19500/585
Current - Reverse Leakage @ Vr: 500 nA @ 440 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1.2 A
Voltage - DC Reverse (Vr) (Max): 440 V
Grade: Military
Operating Temperature - Junction: -65°C ~ 150°C
Supplier Device Package: A, SQ-MELF
Current - Average Rectified (Io): 1.2A
Technology: Standard
Reverse Recovery Time (trr): 45 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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JANTX1N6621U/TR
JANTX1N6621U/TR
Hersteller: Microchip Technology
Description: DIODE GP 440V 1.2A A SQ-MELF
Voltage - DC Reverse (Vr) (Max): 440 V
Grade: Military
Operating Temperature - Junction: -65°C ~ 150°C
Supplier Device Package: A, SQ-MELF
Current - Average Rectified (Io): 1.2A
Technology: Standard
Reverse Recovery Time (trr): 45 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Packaging: Tape & Reel (TR)
Qualification: MIL-PRF-19500/585
Current - Reverse Leakage @ Vr: 500 nA @ 440 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1.2 A
Produkt ist nicht verfügbar
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JANTXV1N6621U/TR
JANTXV1N6621U/TR
Hersteller: Microchip Technology
Description: DIODE GP 440V 1.2A A SQ-MELF
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Packaging: Tape & Reel (TR)
Qualification: MIL-PRF-19500/585
Current - Reverse Leakage @ Vr: 500 nA @ 440 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1.2 A
Voltage - DC Reverse (Vr) (Max): 440 V
Grade: Military
Operating Temperature - Junction: -65°C ~ 150°C
Supplier Device Package: A, SQ-MELF
Current - Average Rectified (Io): 1.2A
Technology: Standard
Reverse Recovery Time (trr): 45 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Produkt ist nicht verfügbar
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JANS1N6621US
JANS1N6621US
Hersteller: Microchip Technology
Description: DIODE GP 400V 1.2A A SQ-MELF
Grade: Military
Operating Temperature - Junction: -65°C ~ 150°C
Supplier Device Package: A, SQ-MELF
Current - Average Rectified (Io): 1.2A
Technology: Standard
Reverse Recovery Time (trr): 45 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Packaging: Bulk
Qualification: MIL-PRF-19500/585
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 2 A
Voltage - DC Reverse (Vr) (Max): 400 V
Produkt ist nicht verfügbar
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JANS1N6621US/TR
JANS1N6621US/TR
Hersteller: Microchip Technology
Description: DIODE GP 400V 1.2A A SQ-MELF
Qualification: MIL-PRF-19500/585
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 2 A
Voltage - DC Reverse (Vr) (Max): 400 V
Grade: Military
Operating Temperature - Junction: -65°C ~ 150°C
Supplier Device Package: A, SQ-MELF
Current - Average Rectified (Io): 1.2A
Technology: Standard
Reverse Recovery Time (trr): 45 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: SQ-MELF, A
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N6164US/TR 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet
1N6164US/TR
Hersteller: Microchip Technology
Description: BI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 13.3A
Voltage - Reverse Standoff (Typ): 62.2V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 77.9V
Voltage - Clamping (Max) @ Ipp: 112.8V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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AnzahlPreis
100+33.72 EUR
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1N6164US/TR 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet
1N6164US/TR
Hersteller: Microchip Technology
Description: BI-DIRECTIONAL TVS
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 13.3A
Voltage - Reverse Standoff (Typ): 62.2V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 77.9V
Voltage - Clamping (Max) @ Ipp: 112.8V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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AnzahlPreis
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1N6164AUS/TR 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet
1N6164AUS/TR
Hersteller: Microchip Technology
Description: BI-DIRECTIONAL TVS
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 112.8V
Voltage - Breakdown (Min): 77.9V
Bidirectional Channels: 1
Supplier Device Package: C, SQ-MELF
Voltage - Reverse Standoff (Typ): 62.2V
Current - Peak Pulse (10/1000µs): 13.3A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: SQ-MELF, C
Packaging: Tape & Reel (TR)
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
100+33.72 EUR
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1N6164AUS/TR 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet
1N6164AUS/TR
Hersteller: Microchip Technology
Description: BI-DIRECTIONAL TVS
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 112.8V
Voltage - Breakdown (Min): 77.9V
Bidirectional Channels: 1
Supplier Device Package: C, SQ-MELF
Voltage - Reverse Standoff (Typ): 62.2V
Current - Peak Pulse (10/1000µs): 13.3A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: SQ-MELF, C
Packaging: Cut Tape (CT)
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Lieferzeit 10-14 Tag (e)
AnzahlPreis
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DSC1103CL5-200.0000T DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1103CL5-200.0000T
Hersteller: Microchip Technology
Description: OSC MEMS LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1103CL5-200.0000
DSC1103CL5-200.0000
Hersteller: Microchip Technology
Description: OSC MEMS LVDS SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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VXM7-1D1-16M0000000 vxm7.pdf
Hersteller: Microchip Technology
Description: SMT XTAL +/-15PPM
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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JANTXV1N5530BUR-1
Hersteller: Microchip Technology
Description: ZENER DIODE
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 60 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 9.1 V
Qualification: MIL-PRF-19500/437
Produkt ist nicht verfügbar
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2281600-R 135884-microsemi-adaptec-series-8-product-brief
2281600-R
Hersteller: Microchip Technology
Description: ADAPTEC RAID 81605ZQ SINGLE
Number of Ports: 16
Type: SAS/SATA
Interface: PCI Express
Packaging: Bulk
Produkt ist nicht verfügbar
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1N5531D-1
1N5531D-1
Hersteller: Microchip Technology
Description: ZENER DIODE
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
Produkt ist nicht verfügbar
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1N5531D-1/TR
1N5531D-1/TR
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
Produkt ist nicht verfügbar
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JAN1N5531D-1 123956-lds-0037-1-datasheet
JAN1N5531D-1
Hersteller: Microchip Technology
Description: DIODE ZENER 11V 500MW DO35
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
Qualification: MIL-PRF-19500/437
Produkt ist nicht verfügbar
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JANTX1N5531D-1/TR
JANTX1N5531D-1/TR
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
Qualification: MIL-PRF-19500/437
Produkt ist nicht verfügbar
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JANTXV1N5531D-1 123956-lds-0037-1-datasheet
JANTXV1N5531D-1
Hersteller: Microchip Technology
Description: DIODE ZENER 11V 500MW DO35
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
Qualification: MIL-PRF-19500/437
Produkt ist nicht verfügbar
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JANTX1N5531D-1 123956-lds-0037-1-datasheet
JANTX1N5531D-1
Hersteller: Microchip Technology
Description: DIODE ZENER 11V 500MW DO35
Tolerance: ±1%
Packaging: Bulk
Qualification: MIL-PRF-19500/437
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 80 Ohms
Voltage - Zener (Nom) (Vz): 11 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Produkt ist nicht verfügbar
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DSC6331JI1BB-018.4320 DSC63xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-with-Spread-Spectrum-DS20006154A.pdf
Hersteller: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-85C
Base Resonator: MEMS
Frequency: 18.432 MHz
Height - Seated (Max): 0.035" (0.89mm)
Current - Supply (Max): 3mA (Typ)
Spread Spectrum Bandwidth: ±0.50%, Center Spread
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Output: LVCMOS
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VLGA
Packaging: Tube
Produkt ist nicht verfügbar
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DSC6331JI1BB-018.4320T DSC63xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-with-Spread-Spectrum-DS20006154A.pdf
Hersteller: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-85C
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Package / Case: 4-VLGA
Packaging: Tape & Reel (TR)
Base Resonator: MEMS
Frequency: 18.432 MHz
Height - Seated (Max): 0.035" (0.89mm)
Current - Supply (Max): 3mA (Typ)
Spread Spectrum Bandwidth: ±0.50%, Center Spread
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Output: LVCMOS
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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DSC6011HI2B-025.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
Hersteller: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-85C
Base Resonator: MEMS
Frequency: 25 MHz
Height - Seated (Max): 0.035" (0.89mm)
Current - Supply (Max): 1.3mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: 4-VFLGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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DSC1001AI5-001.7000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001AI5-001.7000T
Hersteller: Microchip Technology
Description: MEMS OSC LOW POWER 1.7MHZ LVCMOS
Base Resonator: MEMS
Frequency: 1.7 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 8mA
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 4-VDFN Exposed Pad
Packaging: Strip
Produkt ist nicht verfügbar
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DSC1001AI5-001.7000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001AI5-001.7000
Hersteller: Microchip Technology
Description: MEMS OSC XO 1.7000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 1.7 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 8mA
Ratings: AEC-Q100
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 4-VDFN Exposed Pad
Packaging: Strip
Produkt ist nicht verfügbar
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DSC1001AI5-001.7000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001AI5-001.7000
Hersteller: Microchip Technology
Description: MEMS OSC LOW POWER 1.7MHZ LVCMOS
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 4-VDFN Exposed Pad
Packaging: Tube
Base Resonator: MEMS
Frequency: 1.7 MHz
Absolute Pull Range (APR): ±10ppm
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 8mA
Produkt ist nicht verfügbar
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