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PIC16F18075T-I/PT PIC16F18075T-I/PT Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 14KB FLASH 44TQFP
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
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25+2.05 EUR
100+1.85 EUR
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PIC16F18074-E/PT PIC16F18074-E/PT Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 7KB FLASH 44TQFP
Number of I/O: 35
Supplier Device Package: 44-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Packaging: Tray
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25+2.47 EUR
100+2.41 EUR
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PIC16F18075T-I/MP PIC16F18075T-I/MP Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 14KB FLASH 40VFQFN
Number of I/O: 35
Supplier Device Package: 40-QFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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PIC16F18075T-I/MP PIC16F18075T-I/MP Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 14KB FLASH 40VFQFN
Number of I/O: 35
Supplier Device Package: 40-QFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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PIC16F18074-E/MP PIC16F18074-E/MP Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 7KB FLASH 40VFQFN
Number of I/O: 35
Supplier Device Package: 40-QFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tube
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PIC16F18075-E/PT PIC16F18075-E/PT Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 14KB FLASH 44TQFP
Number of I/O: 35
Supplier Device Package: 44-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Packaging: Tray
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PIC16F18075-E/MP PIC16F18075-E/MP Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 14KB FLASH 40VFQFN
Number of I/O: 35
Supplier Device Package: 40-QFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tube
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PIC16F18074-E/P PIC16F18074-E/P Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 7KB FLASH 40DIP
Number of I/O: 35
Supplier Device Package: 40-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
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PIC16F18075-E/P PIC16F18075-E/P Microchip Technology PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf Description: IC MCU 8BIT 14KB FLASH 40DIP
Number of I/O: 35
Supplier Device Package: 40-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
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JANTXV1N3023CUR-1 JANTXV1N3023CUR-1 Microchip Technology 1N3016BUR-1-1N3045BUR-1.pdf Description: DIODE ZENER 13V 1W DO213AB
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 10 µA @ 9.9 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 13 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±2%
Packaging: Bulk
Produkt ist nicht verfügbar
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1N2068 Microchip Technology 1N4044-1N4056.pdf Description: DIODE GP 1KV 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 1000 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 1000 V
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1N2068R Microchip Technology 1N4044-1N4056.pdf Description: DIODE GP REV 1KV 275A DO205AB
Current - Reverse Leakage @ Vr: 75 µA @ 1000 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Voltage - DC Reverse (Vr) (Max): 1000 V
Operating Temperature - Junction: -65°C ~ 190°C
Supplier Device Package: DO-205AB (DO-9)
Current - Average Rectified (Io): 275A
Technology: Standard, Reverse Polarity
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-205AB, DO-9, Stud
Packaging: Bulk
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2N6229 2N6229 Microchip Technology Description: PNP POWER TRANSISTOR SILICON AMP
Packaging: Bulk
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JAN2N6274 JAN2N6274 Microchip Technology Description: TRANS NPN 100V 50A TO-3
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 3V @ 10A, 50A
Current - Collector Cutoff (Max): 50µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20A, 4V
Supplier Device Package: TO-3
Grade: Military
Current - Collector (Ic) (Max): 50 A
Voltage - Collector Emitter Breakdown (Max): 100 V
Power - Max: 250 W
Qualification: MIL-PRF-19500/514
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Jantxv2N6274 Jantxv2N6274 Microchip Technology Description: TRANS NPN 100V 50A TO-3
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 3V @ 10A, 50A
Current - Collector Cutoff (Max): 50µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20A, 4V
Supplier Device Package: TO-3
Grade: Military
Current - Collector (Ic) (Max): 50 A
Voltage - Collector Emitter Breakdown (Max): 100 V
Power - Max: 250 W
Qualification: MIL-PRF-19500/514
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PIC16F18023-I/P PIC16F18023-I/P Microchip Technology PIC16F18013-14-23-24-Microcontroller-Data-Sheet-DS40002539.pdf Description: IC MCU 8BIT 3.5KB FLASH 14DIP
Number of I/O: 11
Supplier Device Package: 14-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 3.5KB (3.5K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
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PIC16F18023-E/P PIC16F18023-E/P Microchip Technology PIC16F18013-14-23-24-Microcontroller-Data-Sheet-DS40002539.pdf Description: IC MCU 8BIT 3.5KB FLASH 14DIP
Number of I/O: 11
Supplier Device Package: 14-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256 x 8
Program Memory Size: 3.5KB (3.5K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
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PIC16F18024-I/P PIC16F18024-I/P Microchip Technology PIC16F18013-14-23-24-Microcontroller-Data-Sheet-DS40002539.pdf Description: IC MCU 8BIT 7KB FLASH 14DIP
Number of I/O: 11
Supplier Device Package: 14-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
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PIC16F18024-E/P PIC16F18024-E/P Microchip Technology PIC16F18013-14-23-24-Microcontroller-Data-Sheet-DS40002539.pdf Description: IC MCU 8BIT 7KB FLASH 14DIP
Number of I/O: 11
Supplier Device Package: 14-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
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PIC16F18025-E/P PIC16F18025-E/P Microchip Technology PIC16F18015-25-44-45-Microcontroller-Data-Sheet-40002340B.pdf Description: IC MCU 8BIT 14KB FLASH 14DIP
Number of I/O: 11
Supplier Device Package: 14-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
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JAN1N3023C-1 JAN1N3023C-1 Microchip Technology 125225-lds-0285-datasheet Description: DIODE ZENER 13V 1W DO41
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 10 µA @ 9.9 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-204AL (DO-41)
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 13 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AL, DO-41, Axial
Tolerance: ±2%
Packaging: Bulk
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JANTXV1N3595AUS/TR Microchip Technology Description: SIGNAL OR COMPUTER DIODE
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, D
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Capacitance @ Vr, F: 8pF @ 0V, 1MHz
Current - Average Rectified (Io): 150mA
Supplier Device Package: D-5D
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 125 V
Voltage - Forward (Vf) (Max) @ If: 920 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 nA @ 125 V
Qualification: MIL-PRF-19500
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1N4988US/TR 1N4988US/TR Microchip Technology 1N4954US-1N4996US_1N5968US-1N5969US_1N6632US-1N6637US.pdf Description: DIODE ZENER 180V 5W E-MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 180 V
Impedance (Max) (Zzt): 450 Ohms
Supplier Device Package: E-MELF
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 136.8 V
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1N4988US/TR 1N4988US/TR Microchip Technology 1N4954US-1N4996US_1N5968US-1N5969US_1N6632US-1N6637US.pdf Description: DIODE ZENER 180V 5W E-MELF
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 180 V
Impedance (Max) (Zzt): 450 Ohms
Supplier Device Package: E-MELF
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 136.8 V
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DSC1001BE2-014.7456T DSC1001BE2-014.7456T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 14.7456MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.7456 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-014.7450T DSC1001BE2-014.7450T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 14.7450MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.745 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-012.2880T DSC1001BE2-012.2880T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 12.2880MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.288 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-010.0000T DSC1001BE2-010.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 10.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-012.0000T DSC1001BE2-012.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-012.2880 DSC1001BE2-012.2880 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 12.2880MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.288 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-010.0000 DSC1001BE2-010.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 10.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-014.7450 DSC1001BE2-014.7450 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 14.7450MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.745 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-014.7456 DSC1001BE2-014.7456 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 14.7456MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.7456 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-012.0000 DSC1001BE2-012.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 12 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 8mA
Ratings: AEC-Q100
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±25ppm
Operating Temperature: -20°C ~ 70°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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AT89LP51IC2-20AAU AT89LP51IC2-20AAU Microchip Technology doc3722S.pdf Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.375K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 7x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AT89LP51IC2-20MU AT89LP51IC2-20MU Microchip Technology doc3722S.pdf Description: IC MCU 8BIT 32KB FLASH 44VQFN
Packaging: Tray
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.375K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 7x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-VQFN (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AT89LP51ID2-20MU AT89LP51ID2-20MU Microchip Technology doc3714S.pdf Description: IC MCU 8BIT 64KB FLASH 44VQFN
Packaging: Tray
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 8051
Data Converters: A/D 7x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-VQFN (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AT89LP51RC2-20PU AT89LP51RC2-20PU Microchip Technology doc3722S.pdf Description: IC MCU 8BIT 32KB FLASH 40DIP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 40-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 7x10b
Core Processor: 8051
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.375K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
Produkt ist nicht verfügbar
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AT89LP51IC2-20AU AT89LP51IC2-20AU Microchip Technology doc3722S.pdf Description: IC MCU 8BIT 32KB FLASH 44TQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 44-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 7x10b
Core Processor: 8051
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.375K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Packaging: Tray
Produkt ist nicht verfügbar
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EV72E72A EV72E72A Microchip Technology RNWF02-Add-On-Board-User-Guide-DS50003575.pdf Description: RNWF02 ADD ON BOARD
Packaging: Bulk
Function: WiFi
Type: RF RFID Wireless
Contents: Board(s)
Utilized IC / Part: RNWF02PC
Platform: mikroBUS™ Click™
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DSA1104CI3-020.0032TVAO DSA1104CI3-020.0032TVAO Microchip Technology DSA1104-24-Low-Jitter-Precision-HCSL-Oscillator-for-Automotive-DS20005894A.pdf Description: MEMS OSC., AUTOMOTIVE, -40-85C,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 42mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20.0032 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1104CI3-020.0032VAO DSA1104CI3-020.0032VAO Microchip Technology DSA1104-24-Low-Jitter-Precision-HCSL-Oscillator-for-Automotive-DS20005894A.pdf Description: MEMS OSC., AUTOMOTIVE, -40-85C,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 42mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20.0032 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1104CL2-156.2500TVAO DSA1104CL2-156.2500TVAO Microchip Technology DSA1104-24-Low-Jitter-Precision-HCSL-Oscillator-for-Automotive-DS20005894A.pdf Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 42mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1104CL2-156.2500VAO DSA1104CL2-156.2500VAO Microchip Technology DSA1104-24-Low-Jitter-Precision-HCSL-Oscillator-for-Automotive-DS20005894A.pdf Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 42mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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1N4932/TR 1N4932/TR Microchip Technology 5837-1n4916-4932a-datasheet Description: DIODE ZENER TEMP COMPENSATED
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 36 Ohms
Voltage - Zener (Nom) (Vz): 19.2 V
Operating Temperature: -25°C ~ 100°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N4932A/TR 1N4932A/TR Microchip Technology 5837-1n4916-4932a-datasheet Description: DIODE ZENER TEMP COMPENSATED
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 36 Ohms
Voltage - Zener (Nom) (Vz): 19.2 V
Operating Temperature: -55°C ~ 100°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LAN8670C2T-E/LMX LAN8670C2T-E/LMX Microchip Technology LAN8670-1-2-Data-Sheet-60001573.pdf Description: 10BASE-T1S PHY WITH MII/RMII
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Number of Drivers/Receivers: 1/1
Data Rate: 10Mbps
Protocol: Ethernet
Supplier Device Package: 32-VQFN (5x5)
Receiver Hysteresis: 230 mV
Duplex: Full, Half
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4+5.28 EUR
25+5.2 EUR
Mindestbestellmenge: 4 Stücke
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JAN1N4992 Microchip Technology 10913-sa5-37-datasheet Description: DIODE ZENER 270V 5W E AXIAL
Qualification: MIL-PRF-19500/356
Current - Reverse Leakage @ Vr: 2 µA @ 206 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Power - Max: 5 W
Grade: Military
Supplier Device Package: E, Axial
Impedance (Max) (Zzt): 800 Ohms
Voltage - Zener (Nom) (Vz): 270 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: E, Axial
Tolerance: ±5%
Packaging: Bulk
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JANTX1N4992 Microchip Technology 10913-sa5-37-datasheet Description: DIODE ZENER 270V 5W E AXIAL
Qualification: MIL-PRF-19500/356
Current - Reverse Leakage @ Vr: 2 µA @ 206 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Power - Max: 5 W
Grade: Military
Supplier Device Package: E, Axial
Impedance (Max) (Zzt): 800 Ohms
Voltage - Zener (Nom) (Vz): 270 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: E, Axial
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTX1N4993 Microchip Technology 10913-sa5-37-datasheet Description: DIODE ZENER 300V 5W E AXIAL
Qualification: MIL-PRF-19500/356
Current - Reverse Leakage @ Vr: 2 µA @ 228 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Power - Max: 5 W
Grade: Military
Supplier Device Package: E, Axial
Impedance (Max) (Zzt): 950 Ohms
Voltage - Zener (Nom) (Vz): 300 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: E, Axial
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTX1N4991US Microchip Technology 11059-sd44a-datasheet Description: DIODE ZENER 240V 5W E AXIAL
Qualification: MIL-PRF-19500/356
Current - Reverse Leakage @ Vr: 2 µA @ 182 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Power - Max: 5 W
Grade: Military
Supplier Device Package: E, Axial
Impedance (Max) (Zzt): 650 Ohms
Voltage - Zener (Nom) (Vz): 240 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: E, Axial
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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AT80C51RD2-RLRUM AT80C51RD2-RLRUM Microchip Technology doc4113.pdf Description: IC MCU 8BIT ROMLESS 44VQFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 44-VQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Core Processor: 80C51
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
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AT80C51RD2-RLRUM AT80C51RD2-RLRUM Microchip Technology doc4113.pdf Description: IC MCU 8BIT ROMLESS 44VQFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 44-VQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Core Processor: 80C51
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Cut Tape (CT)
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SST26VF020AT-80E/MF SST26VF020AT-80E/MF Microchip Technology 20006279A.pdf Description: IC FLASH 2MBIT SPI/QUAD 8WDFN
Packaging: Cut Tape (CT)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 80 MHz
Memory Format: FLASH
Supplier Device Package: 8-WDFN (5x6)
Write Cycle Time - Word, Page: 1.5ms
Memory Interface: SPI - Quad I/O
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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APL602LG-1 Microchip Technology 6535-apl602b2-apl602l-datasheet Description: MOSFET LINEAR 600 V 49 A TO-264
Input Capacitance (Ciss) (Max) @ Vds: 9000 pF @ 25 V
Drain to Source Voltage (Vdss): 600 V
Vgs (Max): ±30V
Drive Voltage (Max Rds On, Min Rds On): 12V
Supplier Device Package: TO-264 (L)
Vgs(th) (Max) @ Id: 4V @ 2.5mA
Power Dissipation (Max): 730W
Rds On (Max) @ Id, Vgs: 125mOhm @ 24.5A, 12V
Current - Continuous Drain (Id) @ 25°C: 49A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-264-3, TO-264AA
Packaging: Tube
Produkt ist nicht verfügbar
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JAN1N4616-1/TR JAN1N4616-1/TR Microchip Technology 1N4614-1-1n4627e3+%2C1N4099-1_1N4135-1_e3.pdf Description: DIODE ZENER 2.2V 500MW DO204AH
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 2.2 V
Impedance (Max) (Zzt): 1300 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 2 µA @ 1 V
Qualification: MIL-PRF-19500/435
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1N4680 1N4680 Microchip Technology 1N4678-1N4717-1.pdf Description: ZENER DIODE
Current - Reverse Leakage @ Vr: 4 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Voltage - Zener (Nom) (Vz): 2.2 V
Operating Temperature: -65°C ~ 175°C (TA)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
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1N4680/TR 1N4680/TR Microchip Technology 5827-1n4678-4717-datasheet Description: VOLTAGE REGULATOR
Current - Reverse Leakage @ Vr: 4 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Voltage - Zener (Nom) (Vz): 2.2 V
Operating Temperature: -65°C ~ 175°C (TA)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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RNWF02PE-I/100 RNWF02PE-I/100 Microchip Technology RNWF02-Wi-Fi-Module-Data-Sheet-DS70005544.pdf Description: 28-PAD WI-FI RN MODULE, 802.11 B
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3V
Power - Output: 20dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n, Bluetooth
Current - Receiving: 80mA ~ 86mA
Current - Transmitting: 224mA ~ 269mA
Antenna Type: PCB Trace
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, UART
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RNWF02UE-I/100 RNWF02UE-I/100 Microchip Technology RNWF02-Wi-Fi-Module-Data-Sheet-DS70005544.pdf Description: 28-PAD WI-FI RN MODULE, 802.11 B
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3V
Power - Output: 20dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n, Bluetooth
Current - Receiving: 80mA ~ 86mA
Current - Transmitting: 224mA ~ 269mA
Antenna Type: Antenna Not Included, U.FL
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, UART
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PIC16F18075T-I/PT PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18075T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 44TQFP
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (14K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: PIC
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
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8+2.24 EUR
25+2.05 EUR
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PIC16F18074-E/PT PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18074-E/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 44TQFP
Number of I/O: 35
Supplier Device Package: 44-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Packaging: Tray
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7+2.69 EUR
25+2.47 EUR
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PIC16F18075T-I/MP PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18075T-I/MP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 40VFQFN
Number of I/O: 35
Supplier Device Package: 40-QFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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PIC16F18075T-I/MP PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18075T-I/MP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 40VFQFN
Number of I/O: 35
Supplier Device Package: 40-QFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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7+2.82 EUR
25+2.57 EUR
100+2.47 EUR
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PIC16F18074-E/MP PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18074-E/MP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 40VFQFN
Number of I/O: 35
Supplier Device Package: 40-QFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tube
auf Bestellung 438 Stücke:
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7+2.87 EUR
25+2.63 EUR
100+2.54 EUR
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PIC16F18075-E/PT PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18075-E/PT
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 44TQFP
Number of I/O: 35
Supplier Device Package: 44-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Packaging: Tray
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AnzahlPreis
7+2.9 EUR
25+2.65 EUR
100+2.56 EUR
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PIC16F18075-E/MP PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18075-E/MP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 40VFQFN
Number of I/O: 35
Supplier Device Package: 40-QFN (5x5)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tube
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6+3.06 EUR
25+2.81 EUR
100+2.7 EUR
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PIC16F18074-E/P PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18074-E/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 40DIP
Number of I/O: 35
Supplier Device Package: 40-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x12b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
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3+6.18 EUR
25+5.68 EUR
100+5.14 EUR
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PIC16F18075-E/P PIC16F18054-55-74-75-28-40-Pin-Micorocontroller-Data-Sheet-40002338.pdf
PIC16F18075-E/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 40DIP
Number of I/O: 35
Supplier Device Package: 40-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 39x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
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3+6.41 EUR
25+5.87 EUR
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JANTXV1N3023CUR-1 1N3016BUR-1-1N3045BUR-1.pdf
JANTXV1N3023CUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 13V 1W DO213AB
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 10 µA @ 9.9 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-213AB (MELF, LL41)
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 13 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Tolerance: ±2%
Packaging: Bulk
Produkt ist nicht verfügbar
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1N2068 1N4044-1N4056.pdf
Hersteller: Microchip Technology
Description: DIODE GP 1KV 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 1000 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 1000 V
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1N2068R 1N4044-1N4056.pdf
Hersteller: Microchip Technology
Description: DIODE GP REV 1KV 275A DO205AB
Current - Reverse Leakage @ Vr: 75 µA @ 1000 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Voltage - DC Reverse (Vr) (Max): 1000 V
Operating Temperature - Junction: -65°C ~ 190°C
Supplier Device Package: DO-205AB (DO-9)
Current - Average Rectified (Io): 275A
Technology: Standard, Reverse Polarity
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Stud Mount
Package / Case: DO-205AB, DO-9, Stud
Packaging: Bulk
Produkt ist nicht verfügbar
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2N6229
2N6229
Hersteller: Microchip Technology
Description: PNP POWER TRANSISTOR SILICON AMP
Packaging: Bulk
Produkt ist nicht verfügbar
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JAN2N6274
JAN2N6274
Hersteller: Microchip Technology
Description: TRANS NPN 100V 50A TO-3
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 3V @ 10A, 50A
Current - Collector Cutoff (Max): 50µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20A, 4V
Supplier Device Package: TO-3
Grade: Military
Current - Collector (Ic) (Max): 50 A
Voltage - Collector Emitter Breakdown (Max): 100 V
Power - Max: 250 W
Qualification: MIL-PRF-19500/514
Produkt ist nicht verfügbar
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Jantxv2N6274
Jantxv2N6274
Hersteller: Microchip Technology
Description: TRANS NPN 100V 50A TO-3
Packaging: Bulk
Package / Case: TO-204AA, TO-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 3V @ 10A, 50A
Current - Collector Cutoff (Max): 50µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20A, 4V
Supplier Device Package: TO-3
Grade: Military
Current - Collector (Ic) (Max): 50 A
Voltage - Collector Emitter Breakdown (Max): 100 V
Power - Max: 250 W
Qualification: MIL-PRF-19500/514
Produkt ist nicht verfügbar
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PIC16F18023-I/P PIC16F18013-14-23-24-Microcontroller-Data-Sheet-DS40002539.pdf
PIC16F18023-I/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 14DIP
Number of I/O: 11
Supplier Device Package: 14-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 3.5KB (3.5K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
auf Bestellung 630 Stücke:
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9+2.04 EUR
25+1.88 EUR
100+1.7 EUR
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PIC16F18023-E/P PIC16F18013-14-23-24-Microcontroller-Data-Sheet-DS40002539.pdf
PIC16F18023-E/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 3.5KB FLASH 14DIP
Number of I/O: 11
Supplier Device Package: 14-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256 x 8
Program Memory Size: 3.5KB (3.5K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
auf Bestellung 570 Stücke:
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8+2.25 EUR
25+2.06 EUR
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PIC16F18024-I/P PIC16F18013-14-23-24-Microcontroller-Data-Sheet-DS40002539.pdf
PIC16F18024-I/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 14DIP
Number of I/O: 11
Supplier Device Package: 14-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
auf Bestellung 510 Stücke:
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AnzahlPreis
7+2.59 EUR
25+2.37 EUR
100+2.14 EUR
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PIC16F18024-E/P PIC16F18013-14-23-24-Microcontroller-Data-Sheet-DS40002539.pdf
PIC16F18024-E/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 14DIP
Number of I/O: 11
Supplier Device Package: 14-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
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25+2.6 EUR
100+2.36 EUR
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PIC16F18025-E/P PIC16F18015-25-44-45-Microcontroller-Data-Sheet-40002340B.pdf
PIC16F18025-E/P
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 14DIP
Number of I/O: 11
Supplier Device Package: 14-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 14KB (14K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
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5+3.92 EUR
25+3.62 EUR
100+3.27 EUR
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JAN1N3023C-1 125225-lds-0285-datasheet
JAN1N3023C-1
Hersteller: Microchip Technology
Description: DIODE ZENER 13V 1W DO41
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 10 µA @ 9.9 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-204AL (DO-41)
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 13 V
Operating Temperature: -55°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AL, DO-41, Axial
Tolerance: ±2%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTXV1N3595AUS/TR
Hersteller: Microchip Technology
Description: SIGNAL OR COMPUTER DIODE
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, D
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 3 µs
Technology: Standard
Capacitance @ Vr, F: 8pF @ 0V, 1MHz
Current - Average Rectified (Io): 150mA
Supplier Device Package: D-5D
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 125 V
Voltage - Forward (Vf) (Max) @ If: 920 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 nA @ 125 V
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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1N4988US/TR 1N4954US-1N4996US_1N5968US-1N5969US_1N6632US-1N6637US.pdf
1N4988US/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 180V 5W E-MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 180 V
Impedance (Max) (Zzt): 450 Ohms
Supplier Device Package: E-MELF
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 136.8 V
Produkt ist nicht verfügbar
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1N4988US/TR 1N4954US-1N4996US_1N5968US-1N5969US_1N6632US-1N6637US.pdf
1N4988US/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 180V 5W E-MELF
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 180 V
Impedance (Max) (Zzt): 450 Ohms
Supplier Device Package: E-MELF
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 2 µA @ 136.8 V
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DSC1001BE2-014.7456T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE2-014.7456T
Hersteller: Microchip Technology
Description: MEMS OSC XO 14.7456MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.7456 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-014.7450T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE2-014.7450T
Hersteller: Microchip Technology
Description: MEMS OSC XO 14.7450MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.745 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-012.2880T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE2-012.2880T
Hersteller: Microchip Technology
Description: MEMS OSC XO 12.2880MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.288 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-010.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE2-010.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 10.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-012.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE2-012.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-012.2880 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE2-012.2880
Hersteller: Microchip Technology
Description: MEMS OSC XO 12.2880MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.288 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-010.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE2-010.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 10.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-014.7450 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE2-014.7450
Hersteller: Microchip Technology
Description: MEMS OSC XO 14.7450MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.745 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-014.7456 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE2-014.7456
Hersteller: Microchip Technology
Description: MEMS OSC XO 14.7456MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.7456 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001BE2-012.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE2-012.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 12 MHz
Height - Seated (Max): 0.035" (0.90mm)
Current - Supply (Max): 8mA
Ratings: AEC-Q100
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±25ppm
Operating Temperature: -20°C ~ 70°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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AT89LP51IC2-20AAU doc3722S.pdf
AT89LP51IC2-20AAU
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.375K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 7x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AT89LP51IC2-20MU doc3722S.pdf
AT89LP51IC2-20MU
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 44VQFN
Packaging: Tray
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.375K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 7x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-VQFN (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AT89LP51ID2-20MU doc3714S.pdf
AT89LP51ID2-20MU
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 44VQFN
Packaging: Tray
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 8051
Data Converters: A/D 7x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-VQFN (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AT89LP51RC2-20PU doc3722S.pdf
AT89LP51RC2-20PU
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 40DIP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 40-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 7x10b
Core Processor: 8051
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.375K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
Produkt ist nicht verfügbar
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AT89LP51IC2-20AU doc3722S.pdf
AT89LP51IC2-20AU
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 44TQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 44-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 7x10b
Core Processor: 8051
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.375K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Packaging: Tray
Produkt ist nicht verfügbar
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EV72E72A RNWF02-Add-On-Board-User-Guide-DS50003575.pdf
EV72E72A
Hersteller: Microchip Technology
Description: RNWF02 ADD ON BOARD
Packaging: Bulk
Function: WiFi
Type: RF RFID Wireless
Contents: Board(s)
Utilized IC / Part: RNWF02PC
Platform: mikroBUS™ Click™
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DSA1104CI3-020.0032TVAO DSA1104-24-Low-Jitter-Precision-HCSL-Oscillator-for-Automotive-DS20005894A.pdf
DSA1104CI3-020.0032TVAO
Hersteller: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, -40-85C,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 42mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20.0032 MHz
Base Resonator: MEMS
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DSA1104CI3-020.0032VAO DSA1104-24-Low-Jitter-Precision-HCSL-Oscillator-for-Automotive-DS20005894A.pdf
DSA1104CI3-020.0032VAO
Hersteller: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, -40-85C,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 42mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20.0032 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1104CL2-156.2500TVAO DSA1104-24-Low-Jitter-Precision-HCSL-Oscillator-for-Automotive-DS20005894A.pdf
DSA1104CL2-156.2500TVAO
Hersteller: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 42mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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DSA1104CL2-156.2500VAO DSA1104-24-Low-Jitter-Precision-HCSL-Oscillator-for-Automotive-DS20005894A.pdf
DSA1104CL2-156.2500VAO
Hersteller: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 42mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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1N4932/TR 5837-1n4916-4932a-datasheet
1N4932/TR
Hersteller: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 36 Ohms
Voltage - Zener (Nom) (Vz): 19.2 V
Operating Temperature: -25°C ~ 100°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N4932A/TR 5837-1n4916-4932a-datasheet
1N4932A/TR
Hersteller: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 36 Ohms
Voltage - Zener (Nom) (Vz): 19.2 V
Operating Temperature: -55°C ~ 100°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LAN8670C2T-E/LMX LAN8670-1-2-Data-Sheet-60001573.pdf
LAN8670C2T-E/LMX
Hersteller: Microchip Technology
Description: 10BASE-T1S PHY WITH MII/RMII
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Number of Drivers/Receivers: 1/1
Data Rate: 10Mbps
Protocol: Ethernet
Supplier Device Package: 32-VQFN (5x5)
Receiver Hysteresis: 230 mV
Duplex: Full, Half
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JAN1N4992 10913-sa5-37-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER 270V 5W E AXIAL
Qualification: MIL-PRF-19500/356
Current - Reverse Leakage @ Vr: 2 µA @ 206 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Power - Max: 5 W
Grade: Military
Supplier Device Package: E, Axial
Impedance (Max) (Zzt): 800 Ohms
Voltage - Zener (Nom) (Vz): 270 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: E, Axial
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTX1N4992 10913-sa5-37-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER 270V 5W E AXIAL
Qualification: MIL-PRF-19500/356
Current - Reverse Leakage @ Vr: 2 µA @ 206 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Power - Max: 5 W
Grade: Military
Supplier Device Package: E, Axial
Impedance (Max) (Zzt): 800 Ohms
Voltage - Zener (Nom) (Vz): 270 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: E, Axial
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTX1N4993 10913-sa5-37-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER 300V 5W E AXIAL
Qualification: MIL-PRF-19500/356
Current - Reverse Leakage @ Vr: 2 µA @ 228 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Power - Max: 5 W
Grade: Military
Supplier Device Package: E, Axial
Impedance (Max) (Zzt): 950 Ohms
Voltage - Zener (Nom) (Vz): 300 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: E, Axial
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTX1N4991US 11059-sd44a-datasheet
Hersteller: Microchip Technology
Description: DIODE ZENER 240V 5W E AXIAL
Qualification: MIL-PRF-19500/356
Current - Reverse Leakage @ Vr: 2 µA @ 182 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Power - Max: 5 W
Grade: Military
Supplier Device Package: E, Axial
Impedance (Max) (Zzt): 650 Ohms
Voltage - Zener (Nom) (Vz): 240 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: E, Axial
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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AT80C51RD2-RLRUM doc4113.pdf
AT80C51RD2-RLRUM
Hersteller: Microchip Technology
Description: IC MCU 8BIT ROMLESS 44VQFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 44-VQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Core Processor: 80C51
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AT80C51RD2-RLRUM doc4113.pdf
AT80C51RD2-RLRUM
Hersteller: Microchip Technology
Description: IC MCU 8BIT ROMLESS 44VQFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 44-VQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Core Processor: 80C51
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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SST26VF020AT-80E/MF 20006279A.pdf
SST26VF020AT-80E/MF
Hersteller: Microchip Technology
Description: IC FLASH 2MBIT SPI/QUAD 8WDFN
Packaging: Cut Tape (CT)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 80 MHz
Memory Format: FLASH
Supplier Device Package: 8-WDFN (5x6)
Write Cycle Time - Word, Page: 1.5ms
Memory Interface: SPI - Quad I/O
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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APL602LG-1 6535-apl602b2-apl602l-datasheet
Hersteller: Microchip Technology
Description: MOSFET LINEAR 600 V 49 A TO-264
Input Capacitance (Ciss) (Max) @ Vds: 9000 pF @ 25 V
Drain to Source Voltage (Vdss): 600 V
Vgs (Max): ±30V
Drive Voltage (Max Rds On, Min Rds On): 12V
Supplier Device Package: TO-264 (L)
Vgs(th) (Max) @ Id: 4V @ 2.5mA
Power Dissipation (Max): 730W
Rds On (Max) @ Id, Vgs: 125mOhm @ 24.5A, 12V
Current - Continuous Drain (Id) @ 25°C: 49A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-264-3, TO-264AA
Packaging: Tube
Produkt ist nicht verfügbar
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JAN1N4616-1/TR 1N4614-1-1n4627e3+%2C1N4099-1_1N4135-1_e3.pdf
JAN1N4616-1/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 2.2V 500MW DO204AH
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 2.2 V
Impedance (Max) (Zzt): 1300 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 2 µA @ 1 V
Qualification: MIL-PRF-19500/435
Produkt ist nicht verfügbar
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1N4680 1N4678-1N4717-1.pdf
1N4680
Hersteller: Microchip Technology
Description: ZENER DIODE
Current - Reverse Leakage @ Vr: 4 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Voltage - Zener (Nom) (Vz): 2.2 V
Operating Temperature: -65°C ~ 175°C (TA)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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1N4680/TR 5827-1n4678-4717-datasheet
1N4680/TR
Hersteller: Microchip Technology
Description: VOLTAGE REGULATOR
Current - Reverse Leakage @ Vr: 4 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Voltage - Zener (Nom) (Vz): 2.2 V
Operating Temperature: -65°C ~ 175°C (TA)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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RNWF02PE-I/100 RNWF02-Wi-Fi-Module-Data-Sheet-DS70005544.pdf
RNWF02PE-I/100
Hersteller: Microchip Technology
Description: 28-PAD WI-FI RN MODULE, 802.11 B
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3V
Power - Output: 20dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n, Bluetooth
Current - Receiving: 80mA ~ 86mA
Current - Transmitting: 224mA ~ 269mA
Antenna Type: PCB Trace
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, UART
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RNWF02UE-I/100 RNWF02-Wi-Fi-Module-Data-Sheet-DS70005544.pdf
RNWF02UE-I/100
Hersteller: Microchip Technology
Description: 28-PAD WI-FI RN MODULE, 802.11 B
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 2MB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3V
Power - Output: 20dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n, Bluetooth
Current - Receiving: 80mA ~ 86mA
Current - Transmitting: 224mA ~ 269mA
Antenna Type: Antenna Not Included, U.FL
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, UART
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