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MXPLAD6.5KP43CAe3 MXPLAD6.5KP43CAe3 Microchip Technology 129479-rf01083-datasheet Description: TVS DIODE 43VWM 69.4VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 93A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD7.5KP43CAe3 MXPLAD7.5KP43CAe3 Microchip Technology 132315-plad7-5kp-datasheet Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 108A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXL5KP43CA/TR Microchip Technology Description: TVS 43V 5% 5000W BI
Packaging: Tape & Reel (TR)
Package / Case: P600, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 72A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: P600
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
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M15KP43CAE3/TR M15KP43CAE3/TR Microchip Technology Description: TVS 43V 5% 15000W BI
Packaging: Tape & Reel (TR)
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 215A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.7V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M15KP43CA/TR M15KP43CA/TR Microchip Technology Description: TVS 43V 5% 15000W BI
Packaging: Tape & Reel (TR)
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 215A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.7V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PIC32MZ2051W104132-I/NX Microchip Technology PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf Description: IC MCU
Packaging: Tray
Package / Case: 132-VFQFN Dual Rows, Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Memory Size: 2MB Flash, 512kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.97V ~ 3.63V
Power - Output: 21.5dBm
Protocol: 802.11b/g/n
Current - Receiving: 73mA ~ 162mA
Data Rate (Max): 54Mbps
Current - Transmitting: 169mA ~ 359mA
Supplier Device Package: 132-VQFN (10x10)
GPIO: 62
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
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VSC7449YIH-02 VSC7449YIH-02 Microchip Technology VMDS-10498_VSC7442-02_VSC7444-02_VSC7448-02_VSC7449-02.pdf Description: IC TELECOM INTERFACE 672FCBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Function: Ethernet Switch
Interface: JTAG, SerDes
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 0.95V ~ 1.05V
Current - Supply: 8.1A
Supplier Device Package: 672-FCBGA (27x27)
Number of Circuits: 1
Power (Watts): 13.3 W
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BZV55C20 BZV55C20 Microchip Technology 150_8298-bzv55-c2v4-c75-pdf.pdf Description: DIODE ZENER 20V DO213AA
Tolerance: ±6%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 20 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 14 V
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JANTXV1N5416 JANTXV1N5416 Microchip Technology LDS-0231%2C+1N5415+thru+1N5420%2C+MIL-PRF-19500-411.pdf Description: DIODE STANDARD 100V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 100 V
Qualification: MIL-PRF-19500/411
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MIC2194BM MIC2194BM Microchip Technology MCRLS05891-1.pdf?t.download=true&u=5oefqw Description: 400 KHZ SO-8 BUCK CONTROL IC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down, Step-Up/Step-Down
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 400kHz
Topology: Buck, Buck-Boost
Voltage - Supply (Vcc/Vdd): 2.9V ~ 14V
Supplier Device Package: 8-SOIC
Synchronous Rectifier: No
Control Features: Enable
Output Phases: 1
Duty Cycle (Max): 100%
Clock Sync: No
Number of Outputs: 1
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MIC2194YM-TR MIC2194YM-TR Microchip Technology mic2194.pdf Description: IC REG CTRLR BUCK/BUCK-BST 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down, Step-Up/Step-Down
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 400kHz
Topology: Buck, Buck-Boost
Voltage - Supply (Vcc/Vdd): 2.9V ~ 14V
Supplier Device Package: 8-SOIC
Synchronous Rectifier: No
Control Features: Enable
Output Phases: 1
Duty Cycle (Max): 100%
Clock Sync: No
Number of Outputs: 1
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1N3492R Microchip Technology S%28R%2935PF.pdf Description: DIODE STANDARD REV 100V 35A DO21
Packaging: Bulk
Package / Case: DO-208AA
Mounting Type: Press Fit
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-21
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 35 A
Current - Reverse Leakage @ Vr: 10 µA @ 100 V
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1N3492 Microchip Technology S%2CR35PF.pdf Description: DIODE STANDARD 100V 35A DO21
Packaging: Bulk
Package / Case: DO-208AA
Mounting Type: Press Fit
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-21
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 35 A
Current - Reverse Leakage @ Vr: 10 µA @ 100 V
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1N3070UR-1/TR 1N3070UR-1/TR Microchip Technology 5790-1n3070ur-1-datasheet Description: DIODE STD 175V 100MA DO213AA
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 100mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 175 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 175 V
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1N3070UR-1/TR 1N3070UR-1/TR Microchip Technology 5790-1n3070ur-1-datasheet Description: DIODE STD 175V 100MA DO213AA
Packaging: Cut Tape (CT)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 100mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 175 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 175 V
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1N3070UR 1N3070UR Microchip Technology 1N3070UR-1.pdf Description: DIODE GP 200V 100MA DO213AA
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 100mA
Supplier Device Package: DO-213AA
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 175 V
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1N3070UR/TR Microchip Technology 5790-1n3070ur-1-datasheet Description: SIGNAL OR COMPUTER DIODE
Packaging: Tape & Reel (TR)
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MIC5350-MGYMT-TR MIC5350-MGYMT-TR Microchip Technology mic5350.pdf Description: IC REG LINEAR 2.8V/1.8V 8-TMLF
Current - Supply (Max): 240 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.2V @ 300mA, 0.3V @ 500mA
PSRR: 50dB ~ 35dB (1kHz ~ 20kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.8V, 1.8V
Supplier Device Package: 8-TMLF® (2x2)
Number of Regulators: 2
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 175 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 300mA, 500mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 8-UFDFN Exposed Pad, 8-TMLF®
Packaging: Tape & Reel (TR)
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MIC5350-MGYMT-TR MIC5350-MGYMT-TR Microchip Technology mic5350.pdf Description: IC REG LINEAR 2.8V/1.8V 8-TMLF
Current - Supply (Max): 240 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.2V @ 300mA, 0.3V @ 500mA
PSRR: 50dB ~ 35dB (1kHz ~ 20kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.8V, 1.8V
Supplier Device Package: 8-TMLF® (2x2)
Number of Regulators: 2
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 175 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 300mA, 500mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 8-UFDFN Exposed Pad, 8-TMLF®
Packaging: Cut Tape (CT)
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2N6052 2N6052 Microchip Technology 2N6052-D.pdf Description: PNP POWER TRANSISTOR SILICON AMP
Packaging: Bulk
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EV12Y79A Microchip Technology Description: DSPIC33CK512MP606 DP PIM
Platform: Digital Power Plug-In Module (DP PIM)
Utilized IC / Part: dsPIC33CK512MP606
Core Processor: dsPIC
Contents: Board(s)
Type: MCU 16-Bit
Mounting Type: Fixed
Packaging: Bulk
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M1.5KE27A Microchip Technology RF01008_rE.pdf Description: TVS DIODE 23.1VWM 37.5VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 40A
Voltage - Reverse Standoff (Typ): 23.1V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 25.7V
Voltage - Clamping (Max) @ Ipp: 37.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PD-9606GC/AC-EK PD-9606GC/AC-EK Microchip Technology PD-96XXGC-Data-Sheet.pdf Description: 6-PORT BT 90W NMS AC EU/UK CORD
Packaging: Bulk
Size / Dimension: 17.24" L x 10.71" W x 1.73" H (438.0mm x 272.0mm x 44.0mm)
Voltage - Output: 54V
Mounting Type: Rack Mount
Voltage - Input: 100 ~ 240 VAC
Type: Midspan Injector
Operating Temperature: 0°C ~ 40°C
Data Rate: 10/100/1000 Mbps
Power (Watts) - Per Port: 90W
Compliance: IEEE802.3af, IEEE802.3at, IEEE802.3bt
Current - Output: 6 A
Number of Ports: 6
Standard Number: 62368-1
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MASMCGLCE160A Microchip Technology 10562-msmclce-datasheet Description: TVS DIODE 160VWM 259VC SMCG
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 259V
Voltage - Breakdown (Min): 178V
Unidirectional Channels: 1
Supplier Device Package: DO-214AB (SMCG)
Voltage - Reverse Standoff (Typ): 160V
Current - Peak Pulse (10/1000µs): 5.8A
Capacitance @ Frequency: 90pF @ 1MHz
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-215AB, SMC Gull Wing
Packaging: Bulk
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DSA1124DL2-156.2500TVAO DSA1124DL2-156.2500TVAO Microchip Technology DSA1104-24-Low-Jitter-Precision-HCSL-Oscillator-for-Automotive-DS20005894A.pdf Description: MEMS OSC, AUTO, HCSL, 156.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 42mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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DSA1223BI1-106M2500TVAO DSA1223BI1-106M2500TVAO Microchip Technology DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf Description: MEMS OSC, AUTO, LVDS, 106.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Supplier Device Package: 6-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 106.25 MHz
Base Resonator: MEMS
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DSA1224DL2-156M2500TVAO DSA1224DL2-156M2500TVAO Microchip Technology DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf Description: MEMS OSC, AUTO, HCSL, 156.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 40mA (Typ)
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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DSA1204CL1-156M2500TVAO DSA1204CL1-156M2500TVAO Microchip Technology DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf Description: MEMS OSC, AUTO, HCSL, 156.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 40mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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DSA1223CL1-106M2500TVAO DSA1223CL1-106M2500TVAO Microchip Technology DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf Description: MEMS OSC, AUTO, LVDS, 106.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 106.25 MHz
Base Resonator: MEMS
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DSA1222BL3-156M2500TVAO DSA1222BL3-156M2500TVAO Microchip Technology DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf Description: MEMS OSC, AUTO, PECL, 156.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 50mA (Typ)
Supplier Device Package: 6-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1222CL3-156M2500TVAO DSA1222CL3-156M2500TVAO Microchip Technology DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf Description: MEMS OSC, AUTOMOTIVE, 156.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 50mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1222CL1-156M2500TVAO DSA1222CL1-156M2500TVAO Microchip Technology DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf Description: MEMS OSC, AUTOMOTIVE, 156.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 50mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1223DL2-156M2500TVAO DSA1223DL2-156M2500TVAO Microchip Technology Description: MEMS OSC, AUTO, LVDS, 156.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1123DL2-156.2500TVAO DSA1123DL2-156.2500TVAO Microchip Technology Description: MEMS OSC, AUTO, LVDS, 156.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1223DL2-126M2500TVAO DSA1223DL2-126M2500TVAO Microchip Technology Description: MEMS OSC, AUTO, LVDS, 126.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 126.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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HV56266T-E/RXB-VAO HV56266T-E/RXB-VAO Microchip Technology HV56266-Data-Sheet-DS20006751.pdf Description: SINGLE CHANNEL 300V AMPLFIIER AR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Amplifier
Applications: Driver
Supplier Device Package: 32-VQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PIC18F26Q24T-I/SO PIC18F26Q24T-I/SO Microchip Technology PIC18F26-45-46-55-56Q24-Microcontroller-Data-Sheet-XLP-DS40002503.pdf Description: IC MCU 8BIT 64KB FLASH 28SOIC
Number of I/O: 24
Supplier Device Package: 28-SOIC
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC18F26Q24T-I/SO PIC18F26Q24T-I/SO Microchip Technology PIC18F26-45-46-55-56Q24-Microcontroller-Data-Sheet-XLP-DS40002503.pdf Description: IC MCU 8BIT 64KB FLASH 28SOIC
Number of I/O: 24
Supplier Device Package: 28-SOIC
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
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PIC18F26Q84T-I/SS PIC18F26Q84T-I/SS Microchip Technology PIC18F26-46-56Q84-Data-Sheet-DS40002259.pdf Description: IC MCU 8BIT 64KB FLASH 28SSOP
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F26Q84T-I/SO PIC18F26Q84T-I/SO Microchip Technology PIC18F26-46-56Q84-Data-Sheet-40002259A.pdf Description: IC MCU 8BIT 64KB FLASH 28SOIC
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 28-SOIC
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b; D/A 1x8b
Core Processor: PIC
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
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ATTINY13V-10SUR ATTINY13V-10SUR Microchip Technology 2535S.pdf Description: IC MCU 8BIT 1KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 1KB (512 x 16)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64 x 8
Core Processor: AVR
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 6
DigiKey Programmable: Verified
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ATWINC3400A-MU-Y042 Microchip Technology ATWINC3400A-MU-Data-Sheet_DS70005390A.pdf Description: IC RF TXRX+MCU BLUETOOTH/WIFI
Packaging: Tray
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ATWINC3400A-MU-T042 Microchip Technology ATWINC3400A-MU-Data-Sheet_DS70005390A.pdf Description: IC RF TXRX+MCU BLUETOOTH/WIFI
Packaging: Tape & Reel (TR)
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CDLL982B/TR CDLL982B/TR Microchip Technology 5917-1n962bur-datasheet Description: DIODE ZENER 75V 500MW DO213AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AB, MELF
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 75 V
Impedance (Max) (Zzt): 270 Ohms
Supplier Device Package: DO-213AB
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 56 V
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ATSAME54N20A-AFT-SL3 ATSAME54N20A-AFT-SL3 Microchip Technology SAM-D5x-E5x-Family-Data-Sheet-DS60001507.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
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EV67T15A EV67T15A Microchip Technology PIC32-WFI32-2.0-Curiosity-Board-User-Guide-DS50003689.pdf Description: PIC32 WFI32 2.0 CURIOSITY
Utilized IC / Part: PIC32MZ2051W104132, WFI32E03
Contents: Board(s), Cable(s)
Type: Transceiver; 802.11 b/g/n (Wi-Fi, WiFi, WLAN)
Frequency: 2.4GHz
Packaging: Box
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JAN1N6316US/TR JAN1N6316US/TR Microchip Technology Description: DIODE ZENER 4.7V 500MW SQ-MELF
Qualification: MIL-PRF-19500/533
Current - Reverse Leakage @ Vr: 5 µA @ 1.5 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Power - Max: 500 mW
Grade: Military
Supplier Device Package: B, SQ-MELF
Impedance (Max) (Zzt): 17 Ohms
Voltage - Zener (Nom) (Vz): 4.7 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SQ-MELF, B
Tolerance: ±5%
Packaging: Tape & Reel (TR)
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AVR32DD20T-I/REB AVR32DD20T-I/REB Microchip Technology AVR32-16DD20-14-Complete-DataSheet-DS40002413.pdf Description: IC MCU 8BIT 32KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 13x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 16
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AVR32DD20T-I/REB AVR32DD20T-I/REB Microchip Technology AVR32-16DD20-14-Complete-DataSheet-DS40002413.pdf Description: IC MCU 8BIT 32KB FLASH 20VFQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 13x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 16
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AVR32DD20-E/REB AVR32DD20-E/REB Microchip Technology AVR32-16DD20-14-Complete-DataSheet-DS40002413.pdf Description: IC MCU 8BIT 32KB FLASH 20VFQFN
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 13x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 16
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AVR32DD20T-E/REB AVR32DD20T-E/REB Microchip Technology AVR32-16DD20-14-Complete-DataSheet-DS40002413.pdf Description: IC MCU 8BIT 32KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 13x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 16
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AVR32DD20T-E/REB AVR32DD20T-E/REB Microchip Technology AVR32-16DD20-14-Complete-DataSheet-DS40002413.pdf Description: IC MCU 8BIT 32KB FLASH 20VFQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 13x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 16
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AVR32DD28T-I/STX AVR32DD28T-I/STX Microchip Technology AVR64DD32-28-Complete-DataSheet-DS40002315.pdf Description: IC MCU 8BIT 32KB FLASH 28VFQFN
Number of I/O: 22
Supplier Device Package: 28-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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AVR32DD28T-I/STX AVR32DD28T-I/STX Microchip Technology AVR64DD32-28-Complete-DataSheet-DS40002315.pdf Description: IC MCU 8BIT 32KB FLASH 28VFQFN
Number of I/O: 22
Supplier Device Package: 28-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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AVR32DD28T-E/STX AVR32DD28T-E/STX Microchip Technology AVR64DD32-28-Complete-DataSheet-DS40002315.pdf Description: IC MCU 8BIT 32KB FLASH 28VFQFN
Number of I/O: 22
Supplier Device Package: 28-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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AVR32DD28T-E/STX AVR32DD28T-E/STX Microchip Technology AVR64DD32-28-Complete-DataSheet-DS40002315.pdf Description: IC MCU 8BIT 32KB FLASH 28VFQFN
Number of I/O: 22
Supplier Device Package: 28-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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AVR32DD28-E/STX AVR32DD28-E/STX Microchip Technology AVR64DD32-28-Complete-DataSheet-DS40002315.pdf Description: IC MCU 8BIT 32KB FLASH 28VFQFN
Number of I/O: 22
Supplier Device Package: 28-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-VFQFN Exposed Pad
Packaging: Tube
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AVR32DD28-I/SS AVR32DD28-I/SS Microchip Technology PIC18-L-F24-25K40-Microcontroller-Data-Sheet-DS40001843.pdf Description: IC MCU 8BIT 32KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
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AVR32DD28T-I/SS AVR32DD28T-I/SS Microchip Technology AVR64DD32-28-Complete-DataSheet-DS40002315.pdf Description: IC MCU 8BIT 32KB FLASH 28SSOP
Number of I/O: 22
Supplier Device Package: 28-SSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
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AVR32DD28T-I/SS AVR32DD28T-I/SS Microchip Technology AVR64DD32-28-Complete-DataSheet-DS40002315.pdf Description: IC MCU 8BIT 32KB FLASH 28SSOP
Number of I/O: 22
Supplier Device Package: 28-SSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Cut Tape (CT)
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MXPLAD6.5KP43CAe3 129479-rf01083-datasheet
MXPLAD6.5KP43CAe3
Hersteller: Microchip Technology
Description: TVS DIODE 43VWM 69.4VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 93A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MXPLAD7.5KP43CAe3 132315-plad7-5kp-datasheet
MXPLAD7.5KP43CAe3
Hersteller: Microchip Technology
Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 108A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXL5KP43CA/TR
Hersteller: Microchip Technology
Description: TVS 43V 5% 5000W BI
Packaging: Tape & Reel (TR)
Package / Case: P600, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 72A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: P600
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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M15KP43CAE3/TR
M15KP43CAE3/TR
Hersteller: Microchip Technology
Description: TVS 43V 5% 15000W BI
Packaging: Tape & Reel (TR)
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 215A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.7V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M15KP43CA/TR
M15KP43CA/TR
Hersteller: Microchip Technology
Description: TVS 43V 5% 15000W BI
Packaging: Tape & Reel (TR)
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 215A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.7V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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PIC32MZ2051W104132-I/NX PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf
Hersteller: Microchip Technology
Description: IC MCU
Packaging: Tray
Package / Case: 132-VFQFN Dual Rows, Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Memory Size: 2MB Flash, 512kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.97V ~ 3.63V
Power - Output: 21.5dBm
Protocol: 802.11b/g/n
Current - Receiving: 73mA ~ 162mA
Data Rate (Max): 54Mbps
Current - Transmitting: 169mA ~ 359mA
Supplier Device Package: 132-VQFN (10x10)
GPIO: 62
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
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VSC7449YIH-02 VMDS-10498_VSC7442-02_VSC7444-02_VSC7448-02_VSC7449-02.pdf
VSC7449YIH-02
Hersteller: Microchip Technology
Description: IC TELECOM INTERFACE 672FCBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Function: Ethernet Switch
Interface: JTAG, SerDes
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 0.95V ~ 1.05V
Current - Supply: 8.1A
Supplier Device Package: 672-FCBGA (27x27)
Number of Circuits: 1
Power (Watts): 13.3 W
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BZV55C20 150_8298-bzv55-c2v4-c75-pdf.pdf
BZV55C20
Hersteller: Microchip Technology
Description: DIODE ZENER 20V DO213AA
Tolerance: ±6%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 20 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 14 V
Produkt ist nicht verfügbar
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JANTXV1N5416 LDS-0231%2C+1N5415+thru+1N5420%2C+MIL-PRF-19500-411.pdf
JANTXV1N5416
Hersteller: Microchip Technology
Description: DIODE STANDARD 100V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 100 V
Qualification: MIL-PRF-19500/411
Produkt ist nicht verfügbar
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MIC2194BM MCRLS05891-1.pdf?t.download=true&u=5oefqw
MIC2194BM
Hersteller: Microchip Technology
Description: 400 KHZ SO-8 BUCK CONTROL IC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down, Step-Up/Step-Down
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 400kHz
Topology: Buck, Buck-Boost
Voltage - Supply (Vcc/Vdd): 2.9V ~ 14V
Supplier Device Package: 8-SOIC
Synchronous Rectifier: No
Control Features: Enable
Output Phases: 1
Duty Cycle (Max): 100%
Clock Sync: No
Number of Outputs: 1
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MIC2194YM-TR mic2194.pdf
MIC2194YM-TR
Hersteller: Microchip Technology
Description: IC REG CTRLR BUCK/BUCK-BST 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down, Step-Up/Step-Down
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 400kHz
Topology: Buck, Buck-Boost
Voltage - Supply (Vcc/Vdd): 2.9V ~ 14V
Supplier Device Package: 8-SOIC
Synchronous Rectifier: No
Control Features: Enable
Output Phases: 1
Duty Cycle (Max): 100%
Clock Sync: No
Number of Outputs: 1
Produkt ist nicht verfügbar
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1N3492R S%28R%2935PF.pdf
Hersteller: Microchip Technology
Description: DIODE STANDARD REV 100V 35A DO21
Packaging: Bulk
Package / Case: DO-208AA
Mounting Type: Press Fit
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-21
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 35 A
Current - Reverse Leakage @ Vr: 10 µA @ 100 V
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1N3492 S%2CR35PF.pdf
Hersteller: Microchip Technology
Description: DIODE STANDARD 100V 35A DO21
Packaging: Bulk
Package / Case: DO-208AA
Mounting Type: Press Fit
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-21
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 35 A
Current - Reverse Leakage @ Vr: 10 µA @ 100 V
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1N3070UR-1/TR 5790-1n3070ur-1-datasheet
1N3070UR-1/TR
Hersteller: Microchip Technology
Description: DIODE STD 175V 100MA DO213AA
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 100mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 175 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 175 V
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1N3070UR-1/TR 5790-1n3070ur-1-datasheet
1N3070UR-1/TR
Hersteller: Microchip Technology
Description: DIODE STD 175V 100MA DO213AA
Packaging: Cut Tape (CT)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 100mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 175 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 175 V
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1N3070UR 1N3070UR-1.pdf
1N3070UR
Hersteller: Microchip Technology
Description: DIODE GP 200V 100MA DO213AA
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 100mA
Supplier Device Package: DO-213AA
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 175 V
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1N3070UR/TR 5790-1n3070ur-1-datasheet
Hersteller: Microchip Technology
Description: SIGNAL OR COMPUTER DIODE
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIC5350-MGYMT-TR mic5350.pdf
MIC5350-MGYMT-TR
Hersteller: Microchip Technology
Description: IC REG LINEAR 2.8V/1.8V 8-TMLF
Current - Supply (Max): 240 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.2V @ 300mA, 0.3V @ 500mA
PSRR: 50dB ~ 35dB (1kHz ~ 20kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.8V, 1.8V
Supplier Device Package: 8-TMLF® (2x2)
Number of Regulators: 2
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 175 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 300mA, 500mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 8-UFDFN Exposed Pad, 8-TMLF®
Packaging: Tape & Reel (TR)
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MIC5350-MGYMT-TR mic5350.pdf
MIC5350-MGYMT-TR
Hersteller: Microchip Technology
Description: IC REG LINEAR 2.8V/1.8V 8-TMLF
Current - Supply (Max): 240 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.2V @ 300mA, 0.3V @ 500mA
PSRR: 50dB ~ 35dB (1kHz ~ 20kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.8V, 1.8V
Supplier Device Package: 8-TMLF® (2x2)
Number of Regulators: 2
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 175 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 300mA, 500mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 8-UFDFN Exposed Pad, 8-TMLF®
Packaging: Cut Tape (CT)
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2N6052 2N6052-D.pdf
2N6052
Hersteller: Microchip Technology
Description: PNP POWER TRANSISTOR SILICON AMP
Packaging: Bulk
Produkt ist nicht verfügbar
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EV12Y79A
Hersteller: Microchip Technology
Description: DSPIC33CK512MP606 DP PIM
Platform: Digital Power Plug-In Module (DP PIM)
Utilized IC / Part: dsPIC33CK512MP606
Core Processor: dsPIC
Contents: Board(s)
Type: MCU 16-Bit
Mounting Type: Fixed
Packaging: Bulk
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M1.5KE27A RF01008_rE.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 23.1VWM 37.5VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 40A
Voltage - Reverse Standoff (Typ): 23.1V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 25.7V
Voltage - Clamping (Max) @ Ipp: 37.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PD-9606GC/AC-EK PD-96XXGC-Data-Sheet.pdf
PD-9606GC/AC-EK
Hersteller: Microchip Technology
Description: 6-PORT BT 90W NMS AC EU/UK CORD
Packaging: Bulk
Size / Dimension: 17.24" L x 10.71" W x 1.73" H (438.0mm x 272.0mm x 44.0mm)
Voltage - Output: 54V
Mounting Type: Rack Mount
Voltage - Input: 100 ~ 240 VAC
Type: Midspan Injector
Operating Temperature: 0°C ~ 40°C
Data Rate: 10/100/1000 Mbps
Power (Watts) - Per Port: 90W
Compliance: IEEE802.3af, IEEE802.3at, IEEE802.3bt
Current - Output: 6 A
Number of Ports: 6
Standard Number: 62368-1
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MASMCGLCE160A 10562-msmclce-datasheet
Hersteller: Microchip Technology
Description: TVS DIODE 160VWM 259VC SMCG
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 259V
Voltage - Breakdown (Min): 178V
Unidirectional Channels: 1
Supplier Device Package: DO-214AB (SMCG)
Voltage - Reverse Standoff (Typ): 160V
Current - Peak Pulse (10/1000µs): 5.8A
Capacitance @ Frequency: 90pF @ 1MHz
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Surface Mount
Package / Case: DO-215AB, SMC Gull Wing
Packaging: Bulk
Produkt ist nicht verfügbar
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DSA1124DL2-156.2500TVAO DSA1104-24-Low-Jitter-Precision-HCSL-Oscillator-for-Automotive-DS20005894A.pdf
DSA1124DL2-156.2500TVAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTO, HCSL, 156.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 42mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1223BI1-106M2500TVAO DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf
DSA1223BI1-106M2500TVAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTO, LVDS, 106.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Supplier Device Package: 6-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 106.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1224DL2-156M2500TVAO DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf
DSA1224DL2-156M2500TVAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTO, HCSL, 156.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 40mA (Typ)
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1204CL1-156M2500TVAO DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf
DSA1204CL1-156M2500TVAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTO, HCSL, 156.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 40mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1223CL1-106M2500TVAO DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf
DSA1223CL1-106M2500TVAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTO, LVDS, 106.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 106.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1222BL3-156M2500TVAO DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf
DSA1222BL3-156M2500TVAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTO, PECL, 156.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 50mA (Typ)
Supplier Device Package: 6-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1222CL3-156M2500TVAO DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf
DSA1222CL3-156M2500TVAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTOMOTIVE, 156.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 50mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1222CL1-156M2500TVAO DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378.pdf
DSA1222CL1-156M2500TVAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTOMOTIVE, 156.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 50mA (Typ)
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1223DL2-156M2500TVAO
DSA1223DL2-156M2500TVAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTO, LVDS, 156.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1123DL2-156.2500TVAO
DSA1123DL2-156.2500TVAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTO, LVDS, 156.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1223DL2-126M2500TVAO
DSA1223DL2-126M2500TVAO
Hersteller: Microchip Technology
Description: MEMS OSC, AUTO, LVDS, 126.25MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.5V, 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 126.25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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HV56266T-E/RXB-VAO HV56266-Data-Sheet-DS20006751.pdf
HV56266T-E/RXB-VAO
Hersteller: Microchip Technology
Description: SINGLE CHANNEL 300V AMPLFIIER AR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Amplifier
Applications: Driver
Supplier Device Package: 32-VQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PIC18F26Q24T-I/SO PIC18F26-45-46-55-56Q24-Microcontroller-Data-Sheet-XLP-DS40002503.pdf
PIC18F26Q24T-I/SO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28SOIC
Number of I/O: 24
Supplier Device Package: 28-SOIC
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC18F26Q24T-I/SO PIC18F26-45-46-55-56Q24-Microcontroller-Data-Sheet-XLP-DS40002503.pdf
PIC18F26Q24T-I/SO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28SOIC
Number of I/O: 24
Supplier Device Package: 28-SOIC
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Connectivity: DALI, FIFO, I2C, LINbus, SMBus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x10b SAR; D/A 1x8b
Core Processor: PIC
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
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PIC18F26Q84T-I/SS PIC18F26-46-56Q84-Data-Sheet-DS40002259.pdf
PIC18F26Q84T-I/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28SSOP
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
DigiKey Programmable: Not Verified
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PIC18F26Q84T-I/SO PIC18F26-46-56Q84-Data-Sheet-40002259A.pdf
PIC18F26Q84T-I/SO
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28SOIC
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 28-SOIC
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b; D/A 1x8b
Core Processor: PIC
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
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ATTINY13V-10SUR 2535S.pdf
ATTINY13V-10SUR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 1KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 1KB (512 x 16)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64 x 8
Core Processor: AVR
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 6
DigiKey Programmable: Verified
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ATWINC3400A-MU-Y042 ATWINC3400A-MU-Data-Sheet_DS70005390A.pdf
Hersteller: Microchip Technology
Description: IC RF TXRX+MCU BLUETOOTH/WIFI
Packaging: Tray
Produkt ist nicht verfügbar
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ATWINC3400A-MU-T042 ATWINC3400A-MU-Data-Sheet_DS70005390A.pdf
Hersteller: Microchip Technology
Description: IC RF TXRX+MCU BLUETOOTH/WIFI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CDLL982B/TR 5917-1n962bur-datasheet
CDLL982B/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 75V 500MW DO213AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AB, MELF
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 75 V
Impedance (Max) (Zzt): 270 Ohms
Supplier Device Package: DO-213AB
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 56 V
Produkt ist nicht verfügbar
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ATSAME54N20A-AFT-SL3 SAM-D5x-E5x-Family-Data-Sheet-DS60001507.pdf
ATSAME54N20A-AFT-SL3
Hersteller: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 28x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 81
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EV67T15A PIC32-WFI32-2.0-Curiosity-Board-User-Guide-DS50003689.pdf
EV67T15A
Hersteller: Microchip Technology
Description: PIC32 WFI32 2.0 CURIOSITY
Utilized IC / Part: PIC32MZ2051W104132, WFI32E03
Contents: Board(s), Cable(s)
Type: Transceiver; 802.11 b/g/n (Wi-Fi, WiFi, WLAN)
Frequency: 2.4GHz
Packaging: Box
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JAN1N6316US/TR
JAN1N6316US/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 4.7V 500MW SQ-MELF
Qualification: MIL-PRF-19500/533
Current - Reverse Leakage @ Vr: 5 µA @ 1.5 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Power - Max: 500 mW
Grade: Military
Supplier Device Package: B, SQ-MELF
Impedance (Max) (Zzt): 17 Ohms
Voltage - Zener (Nom) (Vz): 4.7 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SQ-MELF, B
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AVR32DD20T-I/REB AVR32-16DD20-14-Complete-DataSheet-DS40002413.pdf
AVR32DD20T-I/REB
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 13x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 16
Produkt ist nicht verfügbar
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AVR32DD20T-I/REB AVR32-16DD20-14-Complete-DataSheet-DS40002413.pdf
AVR32DD20T-I/REB
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 20VFQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 13x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 16
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12+1.82 EUR
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AVR32DD20-E/REB AVR32-16DD20-14-Complete-DataSheet-DS40002413.pdf
AVR32DD20-E/REB
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 20VFQFN
Packaging: Tray
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 13x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 16
auf Bestellung 977 Stücke:
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12+1.88 EUR
25+1.73 EUR
100+1.56 EUR
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AVR32DD20T-E/REB AVR32-16DD20-14-Complete-DataSheet-DS40002413.pdf
AVR32DD20T-E/REB
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 13x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 16
Produkt ist nicht verfügbar
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AVR32DD20T-E/REB AVR32-16DD20-14-Complete-DataSheet-DS40002413.pdf
AVR32DD20T-E/REB
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 20VFQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 13x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Number of I/O: 16
auf Bestellung 3101 Stücke:
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AnzahlPrivatkunde
11+1.9 EUR
25+1.86 EUR
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AVR32DD28T-I/STX AVR64DD32-28-Complete-DataSheet-DS40002315.pdf
AVR32DD28T-I/STX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28VFQFN
Number of I/O: 22
Supplier Device Package: 28-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
auf Bestellung 3300 Stücke:
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AVR32DD28T-I/STX AVR64DD32-28-Complete-DataSheet-DS40002315.pdf
AVR32DD28T-I/STX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28VFQFN
Number of I/O: 22
Supplier Device Package: 28-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 3300 Stücke:
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AnzahlPrivatkunde
10+2.26 EUR
25+2.06 EUR
100+2 EUR
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AVR32DD28T-E/STX AVR64DD32-28-Complete-DataSheet-DS40002315.pdf
AVR32DD28T-E/STX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28VFQFN
Number of I/O: 22
Supplier Device Package: 28-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AVR32DD28T-E/STX AVR64DD32-28-Complete-DataSheet-DS40002315.pdf
AVR32DD28T-E/STX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28VFQFN
Number of I/O: 22
Supplier Device Package: 28-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 3170 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
10+2.31 EUR
25+2.13 EUR
100+2.07 EUR
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AVR32DD28-E/STX AVR64DD32-28-Complete-DataSheet-DS40002315.pdf
AVR32DD28-E/STX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28VFQFN
Number of I/O: 22
Supplier Device Package: 28-VQFN (4x4)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-VFQFN Exposed Pad
Packaging: Tube
auf Bestellung 446 Stücke:
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AnzahlPrivatkunde
10+2.31 EUR
25+2.13 EUR
100+2.05 EUR
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AVR32DD28-I/SS PIC18-L-F24-25K40-Microcontroller-Data-Sheet-DS40001843.pdf
AVR32DD28-I/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 769 Stücke:
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AnzahlPrivatkunde
11+2.05 EUR
25+1.88 EUR
100+1.7 EUR
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AVR32DD28T-I/SS AVR64DD32-28-Complete-DataSheet-DS40002315.pdf
AVR32DD28T-I/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28SSOP
Number of I/O: 22
Supplier Device Package: 28-SSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
auf Bestellung 2100 Stücke:
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2100+2.19 EUR
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AVR32DD28T-I/SS AVR64DD32-28-Complete-DataSheet-DS40002315.pdf
AVR32DD28T-I/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 28SSOP
Number of I/O: 22
Supplier Device Package: 28-SSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, RS-485, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x12b SAR; D/A 1x10b
Core Processor: AVR
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 2100 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
9+2.45 EUR
25+2.25 EUR
100+2.19 EUR
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