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PIC16F15355T-E/MV PIC16F15355T-E/MV Microchip Technology PIC16F-LF-15354-55-Data-Sheet-DS40001853.pdf Description: IC MCU 8BIT 14KB FLASH 28UFQFN
Packaging: Cut Tape (CT)
Package / Case: 28-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 24x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-UQFN (4x4)
Number of I/O: 25
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7+2.62 EUR
25+2.4 EUR
100+2.18 EUR
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PIC16F15355T-E/SS PIC16F15355T-E/SS Microchip Technology PIC16F-LF-15354-55-Data-Sheet-DS40001853.pdf Description: IC MCU 8BIT 14KB FLASH 28SSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 24x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
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2100+2.16 EUR
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PIC16F15355T-E/SS PIC16F15355T-E/SS Microchip Technology PIC16F-LF-15354-55-Data-Sheet-DS40001853.pdf Description: IC MCU 8BIT 14KB FLASH 28SSOP
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 24x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
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PIC16F15355T-E/ML PIC16F15355T-E/ML Microchip Technology PIC16F-LF-15354-55-Data-Sheet-DS40001853.pdf Description: IC MCU 8BIT 14KB FLASH 28VQFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 24x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Number of I/O: 25
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PIC16F15355T-E/ML PIC16F15355T-E/ML Microchip Technology PIC16F-LF-15354-55-Data-Sheet-DS40001853.pdf Description: IC MCU 8BIT 14KB FLASH 28VQFN
Packaging: Cut Tape (CT)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 24x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Number of I/O: 25
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PIC16LF15355T-E/ML PIC16LF15355T-E/ML Microchip Technology 40001835A.pdf Description: IC MCU 8BIT 14KB FLASH 28VQFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 24x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Number of I/O: 25
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PIC16LF15355T-E/ML PIC16LF15355T-E/ML Microchip Technology 40001835A.pdf Description: IC MCU 8BIT 14KB FLASH 28VQFN
Packaging: Cut Tape (CT)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 24x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Number of I/O: 25
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AT89LP2052-20XU AT89LP2052-20XU Microchip Technology doc3547.pdf Description: IC MCU 8BIT 2KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 15
DigiKey Programmable: Not Verified
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AT89LP2052-20XU AT89LP2052-20XU Microchip Technology doc3547.pdf Description: IC MCU 8BIT 2KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 15
DigiKey Programmable: Not Verified
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DSC1001CI5-008.0000 DSC1001CI5-008.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 8.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8 MHz
Base Resonator: MEMS
auf Bestellung 277 Stücke:
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SP6461US Microchip Technology Description: UNI-DIRECTIONAL TVS
Packaging: Bulk
auf Bestellung 29 Stücke:
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DZ020610A Microchip Technology Description: UNI-DIRECTIONAL TVS
Packaging: Bulk
Produkt ist nicht verfügbar
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LC140A Microchip Technology Description: UNI-DIRECTIONAL TVS
Packaging: Bulk
Produkt ist nicht verfügbar
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LC140 Microchip Technology Description: UNI-DIRECTIONAL TVS
Packaging: Bulk
Produkt ist nicht verfügbar
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LC140A/TR Microchip Technology Description: UNI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LC140/TR Microchip Technology Description: UNI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LZ7580 Microchip Technology Description: 5.6V UNI-DIRECTIONAL TVS
Packaging: Bulk
Produkt ist nicht verfügbar
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LZ7580/TR Microchip Technology Description: 5.6V UNI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LS7777 Microchip Technology Description: 22.6V 125A UNI-DIRECTIONAL TVS
Packaging: Bulk
Produkt ist nicht verfügbar
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EV01S50A Microchip Technology Description: ATMXT3072M1-DEV-PCB
Packaging: Box
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: ATMXT3072M1
Embedded: No
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EV13B92A Microchip Technology Description: ATMXT3072M1 EVK
Packaging: Box
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: ATMXT3072M1
Embedded: No
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BZV55C27 BZV55C27 Microchip Technology BZV55C2V4%20SERIES_H2301.pdf Description: DIODE ZENER 27V DO213AA
Tolerance: ±7%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 27 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Produkt ist nicht verfügbar
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MSC750SMA170SDT/R Microchip Technology Description: MOSFET SIC 1700 V 750 MOHM TO-26
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MSC750SMA170SDT/R Microchip Technology Description: MOSFET SIC 1700 V 750 MOHM TO-26
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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SST39SF010A-70-4I-TU-T Microchip Technology Description: 4.5V TO 5.5V 1MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 128K x 8
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SST39SF010A-55-4C-TU Microchip Technology Description: 4.5V TO 5.5V 1MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 128K x 8
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SST39SF010A-55-4I-TU Microchip Technology Description: 4.5V TO 5.5V 1MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 128K x 8
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SST39SF010A-55-4C-TU-T Microchip Technology Description: 4.5V TO 5.5V 1MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 128K x 8
Produkt ist nicht verfügbar
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SST39SF010A-70-4C-TU Microchip Technology Description: 4.5V TO 5.5V 1MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 128K x 8
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SST39SF010A-70-4C-TU-T Microchip Technology Description: 4.5V TO 5.5V 1MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 128K x 8
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SST39SF010A-70-4I-TU Microchip Technology Description: 4.5V TO 5.5V 1MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 128K x 8
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SST39SF010A-55-4I-TU-T Microchip Technology Description: 4.5V TO 5.5V 1MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 128K x 8
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EV88N31A Microchip Technology Description: AVR16EB32-CNANO MPPB-ADAPTER
Packaging: Box
Function: Breakout Board
Type: Connectivity
Contents: Board(s)
Utilized IC / Part: AVR16EB32
Platform: Curiosity Nano
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MCP2003BT-H/SN MCP2003BT-H/SN Microchip Technology 2000546C3.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5.5V ~ 30V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LINbus
Supplier Device Package: 8-SOIC
Duplex: Half
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MCP2003BT-H/SN MCP2003BT-H/SN Microchip Technology 2000546C3.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5.5V ~ 30V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LINbus
Supplier Device Package: 8-SOIC
Duplex: Half
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MCP3201T-CI/MS MCP3201T-CI/MS Microchip Technology 21290F.pdf Description: 12-BIT ADC, SPI, SINGLE CHANNEL
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: 3-Wire Serial, SPI
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.7V ~ 5.5V
Voltage - Supply, Digital: 2.7V ~ 5.5V
Sampling Rate (Per Second): 100k
Input Type: Pseudo-Differential
Number of Inputs: 1
Supplier Device Package: 8-MSOP
Architecture: SAR
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 1
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MCP3201T-CI/MS MCP3201T-CI/MS Microchip Technology 21290F.pdf Description: 12-BIT ADC, SPI, SINGLE CHANNEL
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: 3-Wire Serial, SPI
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.7V ~ 5.5V
Voltage - Supply, Digital: 2.7V ~ 5.5V
Sampling Rate (Per Second): 100k
Input Type: Pseudo-Differential
Number of Inputs: 1
Supplier Device Package: 8-MSOP
Architecture: SAR
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 1
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MSMCJ75A MSMCJ75A Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 75VWM 121VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 75V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 83.3V
Voltage - Clamping (Max) @ Ipp: 121V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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AT86RF232-ZX AT86RF232-ZX Microchip Technology doc8321.pdf Description: IC RF TXRX+MCU 802.15.4 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128B SRAM
Type: TxRx + MCU
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 3dBm
Protocol: 6LoWPAN, Zigbee®
Current - Receiving: 11.3mA ~ 11.8mA
Data Rate (Max): 250kbps
Current - Transmitting: 7.2mA ~ 13.8mA
Supplier Device Package: 32-QFN (5x5)
Modulation: O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
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ATMEGA128RFA1-ZU00 ATMEGA128RFA1-ZU00 Microchip Technology Atmel-8266-MCU_Wireless-ATmega128RFA1_Summary_Datasheet.pdf Description: IC RF TXRX+MCU 802.15.4 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 4kB EEPROM, 16kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 3.5dBm
Protocol: 6LoWPAN, Zigbee®
Current - Receiving: 12mA ~ 12.5mA
Data Rate (Max): 2Mbps
Current - Transmitting: 8mA ~ 14.5mA
Supplier Device Package: 64-QFN (9x9)
GPIO: 38
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, USART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DSC1001CE5-025.0000 DSC1001CE5-025.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC1001BE5-020.0000 DSC1001BE5-020.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
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DSC1001BE5-024.0000 DSC1001BE5-024.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC1001AE5-020.0000 DSC1001AE5-020.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-DFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
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MASMCJ15A/TR MASMCJ15A/TR Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 15VWM 24.4VC DO214AB
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 61.5A
Voltage - Reverse Standoff (Typ): 15V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 16.7V
Voltage - Clamping (Max) @ Ipp: 24.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCJ15A/TR MASMCJ15A/TR Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 15VWM 24.4VC DO214AB
Packaging: Cut Tape (CT)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 61.5A
Voltage - Reverse Standoff (Typ): 15V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 16.7V
Voltage - Clamping (Max) @ Ipp: 24.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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2+9.63 EUR
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MASMCJ7.5A/TR MASMCJ7.5A/TR Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 7.5VWM 12.9V DO214AB
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 116.3A
Voltage - Reverse Standoff (Typ): 7.5V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 8.33V
Voltage - Clamping (Max) @ Ipp: 12.9V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCJ7.5A/TR MASMCJ7.5A/TR Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 7.5VWM 12.9V DO214AB
Packaging: Cut Tape (CT)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 116.3A
Voltage - Reverse Standoff (Typ): 7.5V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 8.33V
Voltage - Clamping (Max) @ Ipp: 12.9V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCJ10CA/TR MASMCJ10CA/TR Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 10VWM 17VC DO214AB
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 88.2A
Voltage - Reverse Standoff (Typ): 10V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 11.1V
Voltage - Clamping (Max) @ Ipp: 17V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MASMCJ10CA/TR MASMCJ10CA/TR Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 10VWM 17VC DO214AB
Packaging: Cut Tape (CT)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 88.2A
Voltage - Reverse Standoff (Typ): 10V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 11.1V
Voltage - Clamping (Max) @ Ipp: 17V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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APTDX300A120D16AG APTDX300A120D16AG Microchip Technology APTDX300A120D16AG-Si-Diode-Module-Datasheet.pdf Description: DIODE MODULE GEN PURP 1200V 485A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 485A
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 300 A
Current - Reverse Leakage @ Vr: 20 µA @ 1200 V
auf Bestellung 10 Stücke:
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APTDX300KK120D16AG APTDX300KK120D16AG Microchip Technology APTDX300KK120D16AG-Si-Diode-Module-Datasheet.pdf Description: DIODE MODULE GEN PURP 1200V 485A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 485A
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 300 A
Current - Reverse Leakage @ Vr: 20 µA @ 1200 V
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APTDX300A170D16AG APTDX300A170D16AG Microchip Technology APTDX300A170D16AG-Si-Diode-Module-Datasheet.pdf Description: DIODE MODULE GEN PURP 1700V 345A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 345A
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1700 V
Voltage - Forward (Vf) (Max) @ If: 2.7 V @ 300 A
Current - Reverse Leakage @ Vr: 25 µA @ 1700 V
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DSC6101JL2B-026.0000 DSC6101JL2B-026.0000 Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6003MI2B-026.0000 DSC6003MI2B-026.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001JI2B-026.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011JE1B-026.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011JI2B-026.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6101JI2B-026.0000 DSC6101JI2B-026.0000 Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6111JI1B-026.0000 DSC6111JI1B-026.0000 Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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PIC16F15355T-E/MV PIC16F-LF-15354-55-Data-Sheet-DS40001853.pdf
PIC16F15355T-E/MV
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 28UFQFN
Packaging: Cut Tape (CT)
Package / Case: 28-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 24x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-UQFN (4x4)
Number of I/O: 25
auf Bestellung 3263 Stücke:
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Anzahl Preis
7+2.62 EUR
25+2.4 EUR
100+2.18 EUR
Mindestbestellmenge: 7
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PIC16F15355T-E/SS PIC16F-LF-15354-55-Data-Sheet-DS40001853.pdf
PIC16F15355T-E/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 28SSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 24x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
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Anzahl Preis
2100+2.16 EUR
Mindestbestellmenge: 2100
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PIC16F15355T-E/SS PIC16F-LF-15354-55-Data-Sheet-DS40001853.pdf
PIC16F15355T-E/SS
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 28SSOP
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 24x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 25
auf Bestellung 2100 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.62 EUR
25+2.4 EUR
100+2.16 EUR
Mindestbestellmenge: 7
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PIC16F15355T-E/ML PIC16F-LF-15354-55-Data-Sheet-DS40001853.pdf
PIC16F15355T-E/ML
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 28VQFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 24x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Number of I/O: 25
auf Bestellung 1600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1600+2.25 EUR
Mindestbestellmenge: 1600
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PIC16F15355T-E/ML PIC16F-LF-15354-55-Data-Sheet-DS40001853.pdf
PIC16F15355T-E/ML
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 28VQFN
Packaging: Cut Tape (CT)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 24x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Number of I/O: 25
auf Bestellung 1600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.71 EUR
25+2.48 EUR
100+2.25 EUR
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PIC16LF15355T-E/ML 40001835A.pdf
PIC16LF15355T-E/ML
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 28VQFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 24x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Number of I/O: 25
auf Bestellung 1600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1600+2.25 EUR
Mindestbestellmenge: 1600
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PIC16LF15355T-E/ML 40001835A.pdf
PIC16LF15355T-E/ML
Hersteller: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 28VQFN
Packaging: Cut Tape (CT)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 224 x 8
Core Processor: PIC
Data Converters: A/D 24x10b SAR; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Number of I/O: 25
auf Bestellung 1600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.71 EUR
25+2.48 EUR
100+2.25 EUR
Mindestbestellmenge: 7
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AT89LP2052-20XU doc3547.pdf
AT89LP2052-20XU
Hersteller: Microchip Technology
Description: IC MCU 8BIT 2KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 15
DigiKey Programmable: Not Verified
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AT89LP2052-20XU doc3547.pdf
AT89LP2052-20XU
Hersteller: Microchip Technology
Description: IC MCU 8BIT 2KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DSC1001CI5-008.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CI5-008.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 8.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8 MHz
Base Resonator: MEMS
auf Bestellung 277 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.52 EUR
10+2.47 EUR
50+2.43 EUR
Mindestbestellmenge: 7
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SP6461US
Hersteller: Microchip Technology
Description: UNI-DIRECTIONAL TVS
Packaging: Bulk
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+214.74 EUR
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DZ020610A
Hersteller: Microchip Technology
Description: UNI-DIRECTIONAL TVS
Packaging: Bulk
Produkt ist nicht verfügbar
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LC140A
Hersteller: Microchip Technology
Description: UNI-DIRECTIONAL TVS
Packaging: Bulk
Produkt ist nicht verfügbar
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LC140
Hersteller: Microchip Technology
Description: UNI-DIRECTIONAL TVS
Packaging: Bulk
Produkt ist nicht verfügbar
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LC140A/TR
Hersteller: Microchip Technology
Description: UNI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LC140/TR
Hersteller: Microchip Technology
Description: UNI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LZ7580
Hersteller: Microchip Technology
Description: 5.6V UNI-DIRECTIONAL TVS
Packaging: Bulk
Produkt ist nicht verfügbar
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LZ7580/TR
Hersteller: Microchip Technology
Description: 5.6V UNI-DIRECTIONAL TVS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LS7777
Hersteller: Microchip Technology
Description: 22.6V 125A UNI-DIRECTIONAL TVS
Packaging: Bulk
Produkt ist nicht verfügbar
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EV01S50A
Hersteller: Microchip Technology
Description: ATMXT3072M1-DEV-PCB
Packaging: Box
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: ATMXT3072M1
Embedded: No
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+228.38 EUR
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EV13B92A
Hersteller: Microchip Technology
Description: ATMXT3072M1 EVK
Packaging: Box
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: ATMXT3072M1
Embedded: No
auf Bestellung 2 Stücke:
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Anzahl Preis
1+609 EUR
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BZV55C27 BZV55C2V4%20SERIES_H2301.pdf
BZV55C27
Hersteller: Microchip Technology
Description: DIODE ZENER 27V DO213AA
Tolerance: ±7%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 27 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 18.9 V
Produkt ist nicht verfügbar
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MSC750SMA170SDT/R
Hersteller: Microchip Technology
Description: MOSFET SIC 1700 V 750 MOHM TO-26
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MSC750SMA170SDT/R
Hersteller: Microchip Technology
Description: MOSFET SIC 1700 V 750 MOHM TO-26
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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SST39SF010A-70-4I-TU-T
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 1MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 128K x 8
Produkt ist nicht verfügbar
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SST39SF010A-55-4C-TU
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 1MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 128K x 8
Produkt ist nicht verfügbar
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SST39SF010A-55-4I-TU
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 1MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 128K x 8
Produkt ist nicht verfügbar
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SST39SF010A-55-4C-TU-T
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 1MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 128K x 8
Produkt ist nicht verfügbar
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SST39SF010A-70-4C-TU
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 1MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 128K x 8
Produkt ist nicht verfügbar
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SST39SF010A-70-4C-TU-T
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 1MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 128K x 8
Produkt ist nicht verfügbar
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SST39SF010A-70-4I-TU
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 1MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 128K x 8
Produkt ist nicht verfügbar
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SST39SF010A-55-4I-TU-T
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 1MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 128K x 8
Produkt ist nicht verfügbar
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EV88N31A
Hersteller: Microchip Technology
Description: AVR16EB32-CNANO MPPB-ADAPTER
Packaging: Box
Function: Breakout Board
Type: Connectivity
Contents: Board(s)
Utilized IC / Part: AVR16EB32
Platform: Curiosity Nano
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+24.83 EUR
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MCP2003BT-H/SN 2000546C3.pdf
MCP2003BT-H/SN
Hersteller: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5.5V ~ 30V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LINbus
Supplier Device Package: 8-SOIC
Duplex: Half
auf Bestellung 3300 Stücke:
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Anzahl Preis
3300+1.17 EUR
Mindestbestellmenge: 3300
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MCP2003BT-H/SN 2000546C3.pdf
MCP2003BT-H/SN
Hersteller: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5.5V ~ 30V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LINbus
Supplier Device Package: 8-SOIC
Duplex: Half
auf Bestellung 3300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12+1.55 EUR
25+1.28 EUR
100+1.17 EUR
Mindestbestellmenge: 12
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MCP3201T-CI/MS 21290F.pdf
MCP3201T-CI/MS
Hersteller: Microchip Technology
Description: 12-BIT ADC, SPI, SINGLE CHANNEL
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: 3-Wire Serial, SPI
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.7V ~ 5.5V
Voltage - Supply, Digital: 2.7V ~ 5.5V
Sampling Rate (Per Second): 100k
Input Type: Pseudo-Differential
Number of Inputs: 1
Supplier Device Package: 8-MSOP
Architecture: SAR
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 1
Produkt ist nicht verfügbar
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MCP3201T-CI/MS 21290F.pdf
MCP3201T-CI/MS
Hersteller: Microchip Technology
Description: 12-BIT ADC, SPI, SINGLE CHANNEL
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: 3-Wire Serial, SPI
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 2.7V ~ 5.5V
Voltage - Supply, Digital: 2.7V ~ 5.5V
Sampling Rate (Per Second): 100k
Input Type: Pseudo-Differential
Number of Inputs: 1
Supplier Device Package: 8-MSOP
Architecture: SAR
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 1
auf Bestellung 2049 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.31 EUR
25+1.93 EUR
100+1.75 EUR
Mindestbestellmenge: 8
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MSMCJ75A rf01001_rev_b_final-pd-000307351.pdf
MSMCJ75A
Hersteller: Microchip Technology
Description: TVS DIODE 75VWM 121VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12.4A
Voltage - Reverse Standoff (Typ): 75V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 83.3V
Voltage - Clamping (Max) @ Ipp: 121V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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AT86RF232-ZX doc8321.pdf
AT86RF232-ZX
Hersteller: Microchip Technology
Description: IC RF TXRX+MCU 802.15.4 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128B SRAM
Type: TxRx + MCU
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 3dBm
Protocol: 6LoWPAN, Zigbee®
Current - Receiving: 11.3mA ~ 11.8mA
Data Rate (Max): 250kbps
Current - Transmitting: 7.2mA ~ 13.8mA
Supplier Device Package: 32-QFN (5x5)
Modulation: O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
auf Bestellung 484 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.54 EUR
25+4.16 EUR
100+4.14 EUR
Mindestbestellmenge: 4
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ATMEGA128RFA1-ZU00 Atmel-8266-MCU_Wireless-ATmega128RFA1_Summary_Datasheet.pdf
ATMEGA128RFA1-ZU00
Hersteller: Microchip Technology
Description: IC RF TXRX+MCU 802.15.4 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 4kB EEPROM, 16kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 3.5dBm
Protocol: 6LoWPAN, Zigbee®
Current - Receiving: 12mA ~ 12.5mA
Data Rate (Max): 2Mbps
Current - Transmitting: 8mA ~ 14.5mA
Supplier Device Package: 64-QFN (9x9)
GPIO: 38
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, USART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DSC1001CE5-025.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CE5-025.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
auf Bestellung 855 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.73 EUR
10+2.68 EUR
50+2.63 EUR
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DSC1001BE5-020.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE5-020.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
auf Bestellung 424 Stücke:
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Anzahl Preis
7+2.9 EUR
10+2.84 EUR
50+2.79 EUR
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DSC1001BE5-024.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BE5-024.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
auf Bestellung 292 Stücke:
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Anzahl Preis
7+2.9 EUR
10+2.84 EUR
50+2.79 EUR
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DSC1001AE5-020.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001AE5-020.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-DFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
auf Bestellung 293 Stücke:
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Anzahl Preis
7+2.83 EUR
10+2.78 EUR
50+2.73 EUR
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MASMCJ15A/TR rf01001_rev_b_final-pd-000307351.pdf
MASMCJ15A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 15VWM 24.4VC DO214AB
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 61.5A
Voltage - Reverse Standoff (Typ): 15V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 16.7V
Voltage - Clamping (Max) @ Ipp: 24.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MASMCJ15A/TR rf01001_rev_b_final-pd-000307351.pdf
MASMCJ15A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 15VWM 24.4VC DO214AB
Packaging: Cut Tape (CT)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 61.5A
Voltage - Reverse Standoff (Typ): 15V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 16.7V
Voltage - Clamping (Max) @ Ipp: 24.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
auf Bestellung 197 Stücke:
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Anzahl Preis
2+9.63 EUR
Mindestbestellmenge: 2
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MASMCJ7.5A/TR rf01001_rev_b_final-pd-000307351.pdf
MASMCJ7.5A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 7.5VWM 12.9V DO214AB
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 116.3A
Voltage - Reverse Standoff (Typ): 7.5V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 8.33V
Voltage - Clamping (Max) @ Ipp: 12.9V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MASMCJ7.5A/TR rf01001_rev_b_final-pd-000307351.pdf
MASMCJ7.5A/TR
Hersteller: Microchip Technology
Description: TVS DIODE 7.5VWM 12.9V DO214AB
Packaging: Cut Tape (CT)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 116.3A
Voltage - Reverse Standoff (Typ): 7.5V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 8.33V
Voltage - Clamping (Max) @ Ipp: 12.9V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MASMCJ10CA/TR rf01001_rev_b_final-pd-000307351.pdf
MASMCJ10CA/TR
Hersteller: Microchip Technology
Description: TVS DIODE 10VWM 17VC DO214AB
Packaging: Tape & Reel (TR)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 88.2A
Voltage - Reverse Standoff (Typ): 10V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 11.1V
Voltage - Clamping (Max) @ Ipp: 17V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MASMCJ10CA/TR rf01001_rev_b_final-pd-000307351.pdf
MASMCJ10CA/TR
Hersteller: Microchip Technology
Description: TVS DIODE 10VWM 17VC DO214AB
Packaging: Cut Tape (CT)
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 88.2A
Voltage - Reverse Standoff (Typ): 10V
Supplier Device Package: DO-214AB (SMCJ)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 11.1V
Voltage - Clamping (Max) @ Ipp: 17V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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APTDX300A120D16AG APTDX300A120D16AG-Si-Diode-Module-Datasheet.pdf
APTDX300A120D16AG
Hersteller: Microchip Technology
Description: DIODE MODULE GEN PURP 1200V 485A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 485A
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 300 A
Current - Reverse Leakage @ Vr: 20 µA @ 1200 V
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Anzahl Preis
1+193.81 EUR
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APTDX300KK120D16AG APTDX300KK120D16AG-Si-Diode-Module-Datasheet.pdf
APTDX300KK120D16AG
Hersteller: Microchip Technology
Description: DIODE MODULE GEN PURP 1200V 485A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 485A
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 300 A
Current - Reverse Leakage @ Vr: 20 µA @ 1200 V
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APTDX300A170D16AG APTDX300A170D16AG-Si-Diode-Module-Datasheet.pdf
APTDX300A170D16AG
Hersteller: Microchip Technology
Description: DIODE MODULE GEN PURP 1700V 345A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 345A
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1700 V
Voltage - Forward (Vf) (Max) @ If: 2.7 V @ 300 A
Current - Reverse Leakage @ Vr: 25 µA @ 1700 V
auf Bestellung 10 Stücke:
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Anzahl Preis
1+196.84 EUR
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DSC6101JL2B-026.0000 DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6101JL2B-026.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6003MI2B-026.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003MI2B-026.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001JI2B-026.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011JE1B-026.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011JI2B-026.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6101JI2B-026.0000 DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6101JI2B-026.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6111JI1B-026.0000 DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6111JI1B-026.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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