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DSC6101MA3B-026.0000 DSC6101MA3B-026.0000 Microchip Technology DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6003MI3B-026.0000T DSC6003MI3B-026.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: OSC MEMS AUTO -40C-85C SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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AVR16EB14T-I/SL AVR16EB14T-I/SL Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
Produkt ist nicht verfügbar
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AVR16EB14T-I/SL AVR16EB14T-I/SL Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
auf Bestellung 2563 Stücke:
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15+1.23 EUR
25+1.13 EUR
100+1.01 EUR
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AVR16EB14T-E/SL AVR16EB14T-E/SL Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
Produkt ist nicht verfügbar
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AVR16EB14T-E/SL AVR16EB14T-E/SL Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
auf Bestellung 2554 Stücke:
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14+1.28 EUR
25+1.18 EUR
100+1.06 EUR
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AVR16EB20T-I/SS AVR16EB20T-I/SS Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 14x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 17
Produkt ist nicht verfügbar
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AVR16EB20T-I/SS AVR16EB20T-I/SS Microchip Technology AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 14x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 17
auf Bestellung 1598 Stücke:
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12+1.48 EUR
25+1.36 EUR
100+1.22 EUR
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MCP41HV51T-104E/ST MCP41HV51T-104E/ST Microchip Technology MCP41HVX1-Data-Sheet-20005207.pdf Description: IC DGT POT 100KOHM 256TP 14TSSOP
Packaging: Tape & Reel (TR)
Resistance (Ohms): 100k
Tolerance: ±20%
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: SPI
Configuration: Potentiometer
Operating Temperature: -40°C ~ 125°C
Number of Taps: 256
Voltage - Supply: 1.8V ~ 5.5V, 10V ~ 36V, ±5V ~ 18V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 145
Temperature Coefficient (Typ): 100ppm/°C
Number of Circuits: 1
DigiKey Programmable: Not Verified
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2500+2.3 EUR
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MCP41HV51T-104E/ST MCP41HV51T-104E/ST Microchip Technology MCP41HVX1-Data-Sheet-20005207.pdf Description: IC DGT POT 100KOHM 256TP 14TSSOP
Packaging: Cut Tape (CT)
Resistance (Ohms): 100k
Tolerance: ±20%
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: SPI
Configuration: Potentiometer
Operating Temperature: -40°C ~ 125°C
Number of Taps: 256
Voltage - Supply: 1.8V ~ 5.5V, 10V ~ 36V, ±5V ~ 18V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 145
Temperature Coefficient (Typ): 100ppm/°C
Number of Circuits: 1
DigiKey Programmable: Not Verified
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25+2.52 EUR
100+2.3 EUR
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ATMEGA8L-8PI ATMEGA8L-8PI Microchip Technology ATmega8%28L%29%20Complete.pdf description Description: IC MCU 8BIT 8KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-PDIP
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AVR32SD20T-I/SS AVR32SD20T-I/SS Microchip Technology Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 15
Mounting Type: Surface Mount
Data Converters: A/D 13x10b; D/A 1x10b
Core Size: 8-Bit
Produkt ist nicht verfügbar
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AVR32SD20-E/SS AVR32SD20-E/SS Microchip Technology Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 15
Mounting Type: Surface Mount
Data Converters: A/D 13x10b; D/A 1x10b
Core Size: 8-Bit
Produkt ist nicht verfügbar
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AVR32SD20T-E/SS AVR32SD20T-E/SS Microchip Technology Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 15
Mounting Type: Surface Mount
Data Converters: A/D 13x10b; D/A 1x10b
Core Size: 8-Bit
Produkt ist nicht verfügbar
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MML4402-GM3 MML4402-GM3 Microchip Technology 136336-mml4400-series-datasheet Description: SI LIMITER NON HERMETIC PLASTIC
Packaging: Bulk
Package / Case: 4-SMD, No Lead
Diode Type: PIN - 2 Independent
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 75V
Produkt ist nicht verfügbar
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MML4402-GM3/TR MML4402-GM3/TR Microchip Technology MML4400.pdf Description: SI LIMITER NON HERMETIC PLASTIC
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Diode Type: PIN - 2 Independent
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 75V
Produkt ist nicht verfügbar
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MML4403-GM3/TR MML4403-GM3/TR Microchip Technology MML4400.pdf Description: SI LIMITER NON HERMETIC PLASTIC
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Diode Type: PIN - 2 Independent
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
Resistance @ If, F: 1Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 75V
Produkt ist nicht verfügbar
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DSC1001DL2-016.0000 DSC1001DL2-016.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
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17+1.09 EUR
50+1.07 EUR
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DSC1001DL5-027.0000 DSC1001DL5-027.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 27.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
auf Bestellung 482 Stücke:
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10+2.31 EUR
50+2.27 EUR
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DSC1001DL5-030.0000 DSC1001DL5-030.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 30.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 30 MHz
Base Resonator: MEMS
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DSC1001DL5-025.0000T DSC1001DL5-025.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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10+2.29 EUR
50+2.25 EUR
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DSC1001DL5-010.0000 DSC1001DL5-010.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 10.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
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DSC1001DL5-012.2880 DSC1001DL5-012.2880 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 12.2880MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.288 MHz
Base Resonator: MEMS
auf Bestellung 101 Stücke:
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10+2.32 EUR
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DSC1001DL5-128.0000 DSC1001DL5-128.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 128.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 128 MHz
Base Resonator: MEMS
auf Bestellung 137 Stücke:
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DSC1001DL2-027.0000 DSC1001DL2-027.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 27.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
auf Bestellung 100 Stücke:
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16+1.11 EUR
17+1.09 EUR
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DSC1001DL2-003.9000 DSC1001DL2-003.9000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 3.9000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.9 MHz
Base Resonator: MEMS
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DSC1001DL2-066.0000 DSC1001DL2-066.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 66.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 66 MHz
Base Resonator: MEMS
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DSC1001DL2-090.0000 DSC1001DL2-090.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 90.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 90 MHz
Base Resonator: MEMS
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DSC1001DL1-037.1250 DSC1001DL1-037.1250 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 37.1250MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 37.125 MHz
Base Resonator: MEMS
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DSC1001DL2-020.0000T DSC1001DL2-020.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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JAN1N5619 JAN1N5619 Microchip Technology 10968-sa7-47-datasheet Description: DIODE STANDARD 600V 1A AXIAL
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 250 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 3 A
Current - Reverse Leakage @ Vr: 500 nA @ 800 V
Qualification: MIL-PRF-19500/429
Produkt ist nicht verfügbar
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SY75576LKY-TR SY75576LKY-TR Microchip Technology SY75576L.pdf Description: IC CLK BUFFER 2:4 267MHZ 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: HCSL, LVDS
Type: Fanout Buffer (Distribution), Multiplexer
Input: HCSL, LVDS
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Ratio - Input:Output: 2:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 20-TSSOP
Frequency - Max: 267 MHz
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CDLL5529A/TR CDLL5529A/TR Microchip Technology Description: DIODE ZENER 9.1V 500MW DO213AB
Packaging: Tape & Reel (TR)
Tolerance: ±10%
Package / Case: DO-213AB, MELF
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: DO-213AB
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 7 V
Produkt ist nicht verfügbar
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MCP22350T-1I/Q8X MCP22350T-1I/Q8X Microchip Technology MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
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5000+1.34 EUR
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MCP22350T-1I/Q8X MCP22350T-1I/Q8X Microchip Technology MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
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MCP22350T-2I/Q8X MCP22350T-2I/Q8X Microchip Technology MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
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MCP22350T-2I/Q8X MCP22350T-2I/Q8X Microchip Technology MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
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MCP22350-1I/Q8X MCP22350-1I/Q8X Microchip Technology MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Tray
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
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MCP22350-2I/Q8X MCP22350-2I/Q8X Microchip Technology MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Tray
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
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EV71V36A Microchip Technology Description: MCP22301 EPR SINK BOARD
Packaging: Box
Function: USB Type-C® Power Delivery (PD)
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MCP22301
Embedded: No
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1N758A 1N758A Microchip Technology 10928-sa5-7-datasheet Description: DIODE ZENER 10V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 17 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 8 V
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1N1206AR 1N1206AR Microchip Technology 8545-coe-3-datasheet Description: DIODE STD REV 600V 12A DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 12A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.35 V @ 38 A
Current - Reverse Leakage @ Vr: 5 µA @ 600 V
Produkt ist nicht verfügbar
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ATMEGA8-16PC ATMEGA8-16PC Microchip Technology ATmega8%28L%29%20Complete.pdf Description: IC MCU 8BIT 8KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 16MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 1K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-PDIP
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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JAN1N4959D JAN1N4959D Microchip Technology 1N4954-1N4996%2C15968-1N5969%2C1N6632-1N6637.pdf Description: DIODE ZENER 11V 5W E-AXIAL
Packaging: Bulk
Tolerance: ±1%
Package / Case: E, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E, Axial
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
Produkt ist nicht verfügbar
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JANTXV1N4959D JANTXV1N4959D Microchip Technology 10913-sa5-37-pdf.pdf Description: DIODE ZENER 11V 5W E-AXIAL
Packaging: Bulk
Tolerance: ±1%
Package / Case: E, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E, Axial
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
Produkt ist nicht verfügbar
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JAN1N4959DUS/TR JAN1N4959DUS/TR Microchip Technology 1N4460US-1N4496US.1N6485US-1NN6491US.pdf Description: DIODE ZENER 11V 5W E-MELF
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E-MELF
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
Produkt ist nicht verfügbar
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JANTX1N4959DUS/TR JANTX1N4959DUS/TR Microchip Technology 1N4954US-1N4996US%2C%201N5968US-1N5969US%2C%201N6632US-1N6637US.pdf Description: DIODE ZENER 11V 5W E-MELF
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E-MELF
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
Produkt ist nicht verfügbar
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JANTXV1N4959DUS JANTXV1N4959DUS Microchip Technology 11059-sd44a-pdf.pdf Description: DIODE ZENER 11V 5W E-MELF
Packaging: Bulk
Tolerance: ±1%
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E-MELF
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
Produkt ist nicht verfügbar
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JANTXV1N4959DUS/TR JANTXV1N4959DUS/TR Microchip Technology 1N4954US-1N4996US%2C%201N5968US-1N5969US%2C%201N6632US-1N6637US.pdf Description: DIODE ZENER 11V 5W E-MELF
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E-MELF
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
Produkt ist nicht verfügbar
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JANS1N4959D JANS1N4959D Microchip Technology 10913-sa5-37-pdf.pdf Description: DIODE ZENER 11V 5W E-AXIAL
Packaging: Bulk
Tolerance: ±1%
Package / Case: E, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E, Axial
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
Produkt ist nicht verfügbar
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JANS1N4959DUS JANS1N4959DUS Microchip Technology 1N4954US-96US%2C1N5968US-69US%2C1N6632US-1N6637US.pdf Description: DIODE ZENER 11V 5W D5B
Packaging: Bulk
Tolerance: ±1%
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5B
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
Produkt ist nicht verfügbar
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JANS1N4959DUS/TR JANS1N4959DUS/TR Microchip Technology 11059-sd44a-pdf.pdf Description: DIODE ZENER 11V 5W E-MELF
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E-MELF
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
Produkt ist nicht verfügbar
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DSC6001HI2B-008.0000 DSC6001HI2B-008.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSC ULP LVCMOS -40C-85C 25P
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 8 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001HI2B-008.0000T DSC6001HI2B-008.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSC ULP LVCMOS -40C-85C 25P
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6001HI2B-020.0000 DSC6001HI2B-020.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 20 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001HI2B-016.0000 DSC6001HI2B-016.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 16 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001HI2B-020.0000T DSC6001HI2B-020.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 20 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001HI2B-016.0000T DSC6001HI2B-016.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 16 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6003JL3B-004.0096 DSC6003JL3B-004.0096 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 4.0096MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4.0096 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011JI3B-025.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6101MA3B-026.0000 DSC61xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006155.pdf
DSC6101MA3B-026.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 26.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6003MI3B-026.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003MI3B-026.0000T
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-85C SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 26 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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AVR16EB14T-I/SL AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB14T-I/SL
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
Produkt ist nicht verfügbar
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AVR16EB14T-I/SL AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB14T-I/SL
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
auf Bestellung 2563 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15+1.23 EUR
25+1.13 EUR
100+1.01 EUR
Mindestbestellmenge: 15
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AVR16EB14T-E/SL AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB14T-E/SL
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
Produkt ist nicht verfügbar
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AVR16EB14T-E/SL AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB14T-E/SL
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
auf Bestellung 2554 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
14+1.28 EUR
25+1.18 EUR
100+1.06 EUR
Mindestbestellmenge: 14
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AVR16EB20T-I/SS AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB20T-I/SS
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 14x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 17
Produkt ist nicht verfügbar
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AVR16EB20T-I/SS AVR16EB14_20_28_32-Prelim-DataSheet-DS40002522.pdf
AVR16EB20T-I/SS
Hersteller: Microchip Technology
Description: 16KB RWW,2KB RAM,20MHZ,12-BIT AD
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 14x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 17
auf Bestellung 1598 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12+1.48 EUR
25+1.36 EUR
100+1.22 EUR
Mindestbestellmenge: 12
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MCP41HV51T-104E/ST MCP41HVX1-Data-Sheet-20005207.pdf
MCP41HV51T-104E/ST
Hersteller: Microchip Technology
Description: IC DGT POT 100KOHM 256TP 14TSSOP
Packaging: Tape & Reel (TR)
Resistance (Ohms): 100k
Tolerance: ±20%
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: SPI
Configuration: Potentiometer
Operating Temperature: -40°C ~ 125°C
Number of Taps: 256
Voltage - Supply: 1.8V ~ 5.5V, 10V ~ 36V, ±5V ~ 18V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 145
Temperature Coefficient (Typ): 100ppm/°C
Number of Circuits: 1
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+2.3 EUR
Mindestbestellmenge: 2500
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MCP41HV51T-104E/ST MCP41HVX1-Data-Sheet-20005207.pdf
MCP41HV51T-104E/ST
Hersteller: Microchip Technology
Description: IC DGT POT 100KOHM 256TP 14TSSOP
Packaging: Cut Tape (CT)
Resistance (Ohms): 100k
Tolerance: ±20%
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: SPI
Configuration: Potentiometer
Operating Temperature: -40°C ~ 125°C
Number of Taps: 256
Voltage - Supply: 1.8V ~ 5.5V, 10V ~ 36V, ±5V ~ 18V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 145
Temperature Coefficient (Typ): 100ppm/°C
Number of Circuits: 1
DigiKey Programmable: Not Verified
auf Bestellung 4960 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.04 EUR
25+2.52 EUR
100+2.3 EUR
Mindestbestellmenge: 6
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ATMEGA8L-8PI description ATmega8%28L%29%20Complete.pdf
ATMEGA8L-8PI
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-PDIP
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AVR32SD20T-I/SS
AVR32SD20T-I/SS
Hersteller: Microchip Technology
Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 15
Mounting Type: Surface Mount
Data Converters: A/D 13x10b; D/A 1x10b
Core Size: 8-Bit
Produkt ist nicht verfügbar
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AVR32SD20-E/SS
AVR32SD20-E/SS
Hersteller: Microchip Technology
Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 15
Mounting Type: Surface Mount
Data Converters: A/D 13x10b; D/A 1x10b
Core Size: 8-Bit
Produkt ist nicht verfügbar
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AVR32SD20T-E/SS
AVR32SD20T-E/SS
Hersteller: Microchip Technology
Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 15
Mounting Type: Surface Mount
Data Converters: A/D 13x10b; D/A 1x10b
Core Size: 8-Bit
Produkt ist nicht verfügbar
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MML4402-GM3 136336-mml4400-series-datasheet
MML4402-GM3
Hersteller: Microchip Technology
Description: SI LIMITER NON HERMETIC PLASTIC
Packaging: Bulk
Package / Case: 4-SMD, No Lead
Diode Type: PIN - 2 Independent
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 75V
Produkt ist nicht verfügbar
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MML4402-GM3/TR MML4400.pdf
MML4402-GM3/TR
Hersteller: Microchip Technology
Description: SI LIMITER NON HERMETIC PLASTIC
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Diode Type: PIN - 2 Independent
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 75V
Produkt ist nicht verfügbar
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MML4403-GM3/TR MML4400.pdf
MML4403-GM3/TR
Hersteller: Microchip Technology
Description: SI LIMITER NON HERMETIC PLASTIC
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Diode Type: PIN - 2 Independent
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
Resistance @ If, F: 1Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 75V
Produkt ist nicht verfügbar
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DSC1001DL2-016.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-016.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
16+1.11 EUR
17+1.09 EUR
50+1.07 EUR
Mindestbestellmenge: 16
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DSC1001DL5-027.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-027.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 27.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
auf Bestellung 482 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.36 EUR
10+2.31 EUR
50+2.27 EUR
Mindestbestellmenge: 8
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DSC1001DL5-030.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-030.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 30.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 30 MHz
Base Resonator: MEMS
auf Bestellung 377 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.36 EUR
10+2.31 EUR
50+2.27 EUR
Mindestbestellmenge: 8
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DSC1001DL5-025.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-025.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
auf Bestellung 53 Stücke:
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DSC1001DL5-010.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-010.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 10.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
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DSC1001DL5-012.2880 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-012.2880
Hersteller: Microchip Technology
Description: MEMS OSC XO 12.2880MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.288 MHz
Base Resonator: MEMS
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DSC1001DL5-128.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL5-128.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 128.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 128 MHz
Base Resonator: MEMS
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DSC1001DL2-027.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-027.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 27.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC1001DL2-003.9000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-003.9000
Hersteller: Microchip Technology
Description: MEMS OSC XO 3.9000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.9 MHz
Base Resonator: MEMS
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DSC1001DL2-066.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-066.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 66.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 66 MHz
Base Resonator: MEMS
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DSC1001DL2-090.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-090.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 90.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 90 MHz
Base Resonator: MEMS
auf Bestellung 264 Stücke:
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DSC1001DL1-037.1250 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL1-037.1250
Hersteller: Microchip Technology
Description: MEMS OSC XO 37.1250MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 37.125 MHz
Base Resonator: MEMS
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DSC1001DL2-020.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-020.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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JAN1N5619 10968-sa7-47-datasheet
JAN1N5619
Hersteller: Microchip Technology
Description: DIODE STANDARD 600V 1A AXIAL
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 250 ns
Technology: Standard
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 3 A
Current - Reverse Leakage @ Vr: 500 nA @ 800 V
Qualification: MIL-PRF-19500/429
Produkt ist nicht verfügbar
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SY75576LKY-TR SY75576L.pdf
SY75576LKY-TR
Hersteller: Microchip Technology
Description: IC CLK BUFFER 2:4 267MHZ 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: HCSL, LVDS
Type: Fanout Buffer (Distribution), Multiplexer
Input: HCSL, LVDS
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Ratio - Input:Output: 2:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 20-TSSOP
Frequency - Max: 267 MHz
auf Bestellung 887 Stücke:
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CDLL5529A/TR
CDLL5529A/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 9.1V 500MW DO213AB
Packaging: Tape & Reel (TR)
Tolerance: ±10%
Package / Case: DO-213AB, MELF
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: DO-213AB
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 7 V
Produkt ist nicht verfügbar
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MCP22350T-1I/Q8X MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf
MCP22350T-1I/Q8X
Hersteller: Microchip Technology
Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
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5000+1.34 EUR
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MCP22350T-1I/Q8X MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf
MCP22350T-1I/Q8X
Hersteller: Microchip Technology
Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
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MCP22350T-2I/Q8X MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf
MCP22350T-2I/Q8X
Hersteller: Microchip Technology
Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
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5000+1.35 EUR
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MCP22350T-2I/Q8X MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf
MCP22350T-2I/Q8X
Hersteller: Microchip Technology
Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
auf Bestellung 5347 Stücke:
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MCP22350-1I/Q8X MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf
MCP22350-1I/Q8X
Hersteller: Microchip Technology
Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Tray
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
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MCP22350-2I/Q8X MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf
MCP22350-2I/Q8X
Hersteller: Microchip Technology
Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Tray
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
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10+1.8 EUR
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EV71V36A
Hersteller: Microchip Technology
Description: MCP22301 EPR SINK BOARD
Packaging: Box
Function: USB Type-C® Power Delivery (PD)
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MCP22301
Embedded: No
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1N758A 10928-sa5-7-datasheet
1N758A
Hersteller: Microchip Technology
Description: DIODE ZENER 10V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 17 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 8 V
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6+3.13 EUR
100+2.92 EUR
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1N1206AR 8545-coe-3-datasheet
1N1206AR
Hersteller: Microchip Technology
Description: DIODE STD REV 600V 12A DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 12A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.35 V @ 38 A
Current - Reverse Leakage @ Vr: 5 µA @ 600 V
Produkt ist nicht verfügbar
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ATMEGA8-16PC ATmega8%28L%29%20Complete.pdf
ATMEGA8-16PC
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 16MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 1K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-PDIP
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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JAN1N4959D 1N4954-1N4996%2C15968-1N5969%2C1N6632-1N6637.pdf
JAN1N4959D
Hersteller: Microchip Technology
Description: DIODE ZENER 11V 5W E-AXIAL
Packaging: Bulk
Tolerance: ±1%
Package / Case: E, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E, Axial
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
Produkt ist nicht verfügbar
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JANTXV1N4959D 10913-sa5-37-pdf.pdf
JANTXV1N4959D
Hersteller: Microchip Technology
Description: DIODE ZENER 11V 5W E-AXIAL
Packaging: Bulk
Tolerance: ±1%
Package / Case: E, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E, Axial
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
Produkt ist nicht verfügbar
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JAN1N4959DUS/TR 1N4460US-1N4496US.1N6485US-1NN6491US.pdf
JAN1N4959DUS/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 11V 5W E-MELF
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E-MELF
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
Produkt ist nicht verfügbar
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JANTX1N4959DUS/TR 1N4954US-1N4996US%2C%201N5968US-1N5969US%2C%201N6632US-1N6637US.pdf
JANTX1N4959DUS/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 11V 5W E-MELF
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E-MELF
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
Produkt ist nicht verfügbar
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JANTXV1N4959DUS 11059-sd44a-pdf.pdf
JANTXV1N4959DUS
Hersteller: Microchip Technology
Description: DIODE ZENER 11V 5W E-MELF
Packaging: Bulk
Tolerance: ±1%
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E-MELF
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
Produkt ist nicht verfügbar
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JANTXV1N4959DUS/TR 1N4954US-1N4996US%2C%201N5968US-1N5969US%2C%201N6632US-1N6637US.pdf
JANTXV1N4959DUS/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 11V 5W E-MELF
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E-MELF
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
Produkt ist nicht verfügbar
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JANS1N4959D 10913-sa5-37-pdf.pdf
JANS1N4959D
Hersteller: Microchip Technology
Description: DIODE ZENER 11V 5W E-AXIAL
Packaging: Bulk
Tolerance: ±1%
Package / Case: E, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E, Axial
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
Produkt ist nicht verfügbar
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JANS1N4959DUS 1N4954US-96US%2C1N5968US-69US%2C1N6632US-1N6637US.pdf
JANS1N4959DUS
Hersteller: Microchip Technology
Description: DIODE ZENER 11V 5W D5B
Packaging: Bulk
Tolerance: ±1%
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5B
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
Produkt ist nicht verfügbar
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JANS1N4959DUS/TR 11059-sd44a-pdf.pdf
JANS1N4959DUS/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 11V 5W E-MELF
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E-MELF
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
Produkt ist nicht verfügbar
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DSC6001HI2B-008.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
DSC6001HI2B-008.0000
Hersteller: Microchip Technology
Description: MEMS OSC ULP LVCMOS -40C-85C 25P
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 8 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001HI2B-008.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
DSC6001HI2B-008.0000T
Hersteller: Microchip Technology
Description: MEMS OSC ULP LVCMOS -40C-85C 25P
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 8 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001HI2B-020.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001HI2B-020.0000
Hersteller: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 20 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001HI2B-016.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001HI2B-016.0000
Hersteller: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 16 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001HI2B-020.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001HI2B-020.0000T
Hersteller: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 20 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001HI2B-016.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001HI2B-016.0000T
Hersteller: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 16 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6003JL3B-004.0096 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003JL3B-004.0096
Hersteller: Microchip Technology
Description: MEMS OSC XO 4.0096MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4.0096 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6011JI3B-025.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Hersteller: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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