Produkte > MICROCHIP TECHNOLOGY > Alle Produkte des Herstellers MICROCHIP TECHNOLOGY (276074) > Seite 1935 nach 4602
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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| EV59Y78A | Microchip Technology |
Description: WILCS02 M.2 WI-FI MODULE CARD Packaging: Box Package / Case: Module Mounting Type: Card Edge Voltage - Supply: 3.3V Protocol: 802.11b/g/n Antenna Type: Antenna Not Included, U.FL RF Family/Standard: WiFi Serial Interfaces: SDIO, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
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JAN1N6051A/TR | Microchip Technology |
Description: TVS DIODE 28VWM 45.7VC DO13 Packaging: Tape & Reel (TR) Package / Case: DO-202AA, DO-13, Axial Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 33A Voltage - Reverse Standoff (Typ): 28V Supplier Device Package: DO-13 (DO-202AA) Bidirectional Channels: 1 Voltage - Breakdown (Min): 31.4V Voltage - Clamping (Max) @ Ipp: 45.7V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Grade: Military Qualification: MIL-PRF-19500/507 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 100 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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JANTX1N6051A/TR | Microchip Technology |
Description: TVS DIODE 28VWM 45.7VC DO13 Packaging: Tape & Reel (TR) Package / Case: DO-202AA, DO-13, Axial Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 33A Voltage - Reverse Standoff (Typ): 28V Supplier Device Package: DO-13 (DO-202AA) Bidirectional Channels: 1 Voltage - Breakdown (Min): 31.4V Voltage - Clamping (Max) @ Ipp: 45.7V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Grade: Military Qualification: MIL-PRF-19500/507 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 100 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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JANTXV1N6051A | Microchip Technology |
Description: TVS DIODE 28VWM 45.7VC DO13 Packaging: Bulk Package / Case: DO-202AA, DO-13, Axial Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 33A Voltage - Reverse Standoff (Typ): 28V Supplier Device Package: DO-13 (DO-202AA) Bidirectional Channels: 1 Voltage - Breakdown (Min): 31.4V Voltage - Clamping (Max) @ Ipp: 45.7V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Grade: Military Qualification: MIL-PRF-19500/507 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 100 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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JANTXV1N6051A/TR | Microchip Technology |
 Description: TVS DIODE 28VWM 45.7VC DO13Packaging: Tape & Reel (TR) Package / Case: DO-202AA, DO-13, Axial Mounting Type: Through Hole Type: Zener Operating Temperature: -55°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 33A Voltage - Reverse Standoff (Typ): 28V Supplier Device Package: DO-13 (DO-202AA) Bidirectional Channels: 1 Voltage - Breakdown (Min): 31.4V Voltage - Clamping (Max) @ Ipp: 45.7V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Grade: Military Qualification: MIL-PRF-19500/507 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 100 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6327US/TR | Microchip Technology |
Description: DIODE ZENER 13V 500MW SQ-MELF Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: SQ-MELF, B Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C (TJ) Voltage - Zener (Nom) (Vz): 13 V Impedance (Max) (Zzt): 8 Ohms Supplier Device Package: B, SQ-MELF Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V |
auf Bestellung 200 Stücke: Lieferzeit 10-14 Tag (e) |
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1N6327US/TR | Microchip Technology |
Description: DIODE ZENER 13V 500MW SQ-MELF Tolerance: ±5% Packaging: Cut Tape (CT) Package / Case: SQ-MELF, B Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C (TJ) Voltage - Zener (Nom) (Vz): 13 V Impedance (Max) (Zzt): 8 Ohms Supplier Device Package: B, SQ-MELF Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V |
auf Bestellung 200 Stücke: Lieferzeit 10-14 Tag (e) |
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T7023-PEQ | Microchip Technology |
Description: IC AMP BLUETOOTH 2.4GHZ 16QFN Packaging: Tube Package / Case: 16-VQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.5GHz RF Type: Bluetooth Voltage - Supply: 2.7V ~ 4.6V Gain: 23dB Current - Supply: 165mA Supplier Device Package: 16-QFN (4x4) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 240 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N6360/TR | Microchip Technology |
Description: TVS DIODE 15VWM 20.6VC DO13 Packaging: Tape & Reel (TR) Package / Case: DO-13 Mounting Type: Through Hole Type: Zener Operating Temperature: -65°C ~ 175°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 60A Voltage - Reverse Standoff (Typ): 15V Supplier Device Package: DO-13 Unidirectional Channels: 1 Voltage - Breakdown (Min): 17.6V Voltage - Clamping (Max) @ Ipp: 20.6V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 100 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32AK3208GC41064-I/PT | Microchip Technology |
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F Packaging: Tray Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 22x12b SAR; D/A 3x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 49 |
auf Bestellung 498 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32AK6416GC41064-I/PT | Microchip Technology |
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F Packaging: Tray Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 22x12b SAR; D/A 3x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 49 |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32AK6416GC41064-I/M7 | Microchip Technology |
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F Packaging: Tube Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 200MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 22x12b SAR; D/A 3x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-VQFN (9x9) Number of I/O: 49 |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32AK1216GC41064-I/PT | Microchip Technology |
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K Packaging: Tray Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 22x12b SAR; D/A 3x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 49 |
auf Bestellung 220 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32AK1216GC41064-I/M7 | Microchip Technology |
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K Packaging: Tube Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 200MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 22x12b SAR; D/A 3x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-VQFN (9x9) Number of I/O: 49 |
auf Bestellung 213 Stücke: Lieferzeit 10-14 Tag (e) |
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| EV25Z08A | Microchip Technology |
Description: PIC32AK1216GC41064 EVAL Utilized IC / Part: PIC32AK1216GC41064 Core Processor: PIC32 Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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PIC32AK3208GC41064-I/M7 | Microchip Technology |
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F Packaging: Tube Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 200MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 22x12b SAR; D/A 3x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-VQFN (9x9) Number of I/O: 49 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 440 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32AK3208GC41064T-I/PT | Microchip Technology |
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F Program Memory Size: 32KB (32K x 8) Speed: 200MHz Mounting Type: Surface Mount Package / Case: 64-TQFP Packaging: Tape & Reel (TR) Number of I/O: 49 Supplier Device Package: 64-TQFP (10x10) Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 22x12b SAR; D/A 3x12b Core Processor: PIC Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 8K x 8 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32AK3208GC41064T-I/M7 | Microchip Technology |
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F Number of I/O: 49 Supplier Device Package: 64-VQFN (9x9) Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 22x12b SAR; D/A 3x12b Core Processor: PIC Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 8K x 8 Program Memory Size: 32KB (32K x 8) Speed: 200MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 64-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32AK6416GC41064T-I/PT | Microchip Technology |
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 16K x 8 Program Memory Size: 64KB (64K x 8) Speed: 200MHz Mounting Type: Surface Mount Package / Case: 64-TQFP Packaging: Tape & Reel (TR) Number of I/O: 49 Supplier Device Package: 64-TQFP (10x10) Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 22x12b SAR; D/A 3x12b Core Processor: PIC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32AK6416GC41064T-I/M7 | Microchip Technology |
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F Packaging: Tape & Reel (TR) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 200MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 22x12b SAR; D/A 3x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-VQFN (9x9) Number of I/O: 49 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32AK3208GC41064-E/M7 | Microchip Technology |
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F Packaging: Tube Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 200MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 22x12b SAR; D/A 3x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-VQFN (9x9) Grade: Automotive Number of I/O: 49 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 400 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32AK3208GC41064-E/PT | Microchip Technology |
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F Packaging: Tray Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 22x12b SAR; D/A 3x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-TQFP (10x10) Grade: Automotive Number of I/O: 49 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 480 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32AK1216GC41064T-I/PT | Microchip Technology |
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K Packaging: Tape & Reel (TR) Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 22x12b SAR; D/A 3x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 49 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32AK1216GC41064T-I/M7 | Microchip Technology |
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K Packaging: Tape & Reel (TR) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 200MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 22x12b SAR; D/A 3x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-VQFN (9x9) Number of I/O: 49 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32AK6416GC41064-E/PT | Microchip Technology |
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F Packaging: Tray Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 22x12b SAR; D/A 3x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-TQFP (10x10) Grade: Automotive Number of I/O: 49 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 480 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32AK6416GC41064-E/M7 | Microchip Technology |
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F Packaging: Tube Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 200MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 22x12b SAR; D/A 3x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-VQFN (9x9) Grade: Automotive Number of I/O: 49 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 360 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32AK1216GC41064-E/PT | Microchip Technology |
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K Packaging: Tray Package / Case: 64-TQFP Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 22x12b SAR; D/A 3x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-TQFP (10x10) Grade: Automotive Number of I/O: 49 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 480 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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PIC32AK1216GC41064-E/M7 | Microchip Technology |
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K Packaging: Tube Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 200MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 22x12b SAR; D/A 3x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-VQFN (9x9) Grade: Automotive Number of I/O: 49 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 360 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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M1.5KE39A | Microchip Technology |
Description: TVS DIODE 33.3VWM 53.9VC CASE-1 Packaging: Bulk Package / Case: DO-201AA, DO-27, Axial Mounting Type: Through Hole Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 28A Voltage - Reverse Standoff (Typ): 33.3V Supplier Device Package: CASE-1 Unidirectional Channels: 1 Voltage - Breakdown (Min): 37.1V Voltage - Clamping (Max) @ Ipp: 53.9V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Grade: Military Qualification: MIL-PRF-19500 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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VC-801-EAW-FAAN-25M0012500 | Microchip Technology |
Description: VC-830-ECE-FAAN-156M250000 Packaging: Strip Package / Case: 4-SMD, No Lead Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -10°C ~ 70°C Frequency Stability: ±25ppm Voltage - Supply: 3.3V Current - Supply (Max): 20mA Height - Seated (Max): 0.055" (1.40mm) Frequency: 25.00125 MHz Base Resonator: Crystal |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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JANTXV1N5417 | Microchip Technology |
Description: DIODE STANDARD 200V 3A B AXIAL Packaging: Bulk Package / Case: B, Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 150 ns Technology: Standard Current - Average Rectified (Io): 3A Supplier Device Package: B, Axial Operating Temperature - Junction: -65°C ~ 175°C Grade: Military Voltage - DC Reverse (Vr) (Max): 200 V Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A Current - Reverse Leakage @ Vr: 1 µA @ 200 V Qualification: MIL-PRF-19500/411 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 171 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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JANTXV1N5417/TR | Microchip Technology |
Description: DIODE STANDARD 200V 3A B AXIAL Packaging: Tape & Reel (TR) Package / Case: B, Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 150 ns Technology: Standard Current - Average Rectified (Io): 3A Supplier Device Package: B, Axial Operating Temperature - Junction: -65°C ~ 175°C Grade: Military Voltage - DC Reverse (Vr) (Max): 200 V Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A Current - Reverse Leakage @ Vr: 1 µA @ 200 V Qualification: MIL-PRF-19500/411 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 168 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N5417US/TR | Microchip Technology |
Description: DIODE STANDARD 200V 3A D5B Packaging: Tape & Reel (TR) Package / Case: SQ-MELF, E Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 150 ns Technology: Standard Current - Average Rectified (Io): 3A Supplier Device Package: D-5B Operating Temperature - Junction: -65°C ~ 175°C Voltage - DC Reverse (Vr) (Max): 200 V Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A Current - Reverse Leakage @ Vr: 1 µA @ 200 V |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 100 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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JANS1N5417 | Microchip Technology |
Description: DIODE STANDARD 200V 3A B AXIAL Grade: Military Operating Temperature - Junction: -65°C ~ 175°C Supplier Device Package: B, Axial Current - Average Rectified (Io): 3A Technology: Standard Reverse Recovery Time (trr): 150 ns Speed: Fast Recovery =< 500ns, > 200mA (Io) Mounting Type: Through Hole Package / Case: B, Axial Packaging: Bulk Qualification: MIL-PRF-19500/411 Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A Voltage - DC Reverse (Vr) (Max): 200 V |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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JANS1N5417/TR | Microchip Technology |
Description: DIODE STANDARD 200V 3A B AXIAL Qualification: MIL-PRF-19500/411 Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A Voltage - DC Reverse (Vr) (Max): 200 V Grade: Military Operating Temperature - Junction: -65°C ~ 175°C Supplier Device Package: B, Axial Current - Average Rectified (Io): 3A Technology: Standard Reverse Recovery Time (trr): 150 ns Speed: Fast Recovery =< 500ns, > 200mA (Io) Mounting Type: Through Hole Package / Case: B, Axial Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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DSC1121DM2-003.3333T | Microchip Technology |
Description: MEMS CMOS OSC Packaging: Strip Package / Case: 6-VDFN Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -55°C ~ 125°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.6V Ratings: AEC-Q100 Current - Supply (Max): 35mA Supplier Device Package: 6-VDFN (2.5x2) Height - Seated (Max): 0.035" (0.90mm) Frequency: 3.3333 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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DSC1121DM2-003.3333 | Microchip Technology |
Description: MEMS CMOS OSC Packaging: Strip Package / Case: 6-VDFN Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -55°C ~ 125°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.6V Ratings: AEC-Q100 Current - Supply (Max): 35mA Supplier Device Package: 6-VDFN (2.5x2) Height - Seated (Max): 0.035" (0.90mm) Frequency: 3.3333 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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DSC1121CM2-003.1152 | Microchip Technology |
Description: MEMS CMOS OSC Packaging: Strip Package / Case: 6-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: CMOS Function: Enable/Disable Type: XO (Standard) Operating Temperature: -55°C ~ 125°C Voltage - Supply: 2.25V ~ 3.6V Current - Supply (Max): 35mA Supplier Device Package: 6-VDFN (3.2x2.5) Height - Seated (Max): 0.035" (0.90mm) Absolute Pull Range (APR): ±25ppm Frequency: 3.1152 MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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APT100M50J | Microchip Technology |
Description: MOSFET N-CH 500V 103A SOT227 Mounting Type: Chassis Mount Package / Case: SOT-227-4, miniBLOC Input Capacitance (Ciss) (Max) @ Vds: 24600 pF @ 25 V Gate Charge (Qg) (Max) @ Vgs: 620 nC @ 10 V Drain to Source Voltage (Vdss): 500 V Vgs (Max): ±30V Drive Voltage (Max Rds On, Min Rds On): 10V Supplier Device Package: SOT-227 Vgs(th) (Max) @ Id: 5V @ 5mA Power Dissipation (Max): 960W (Tc) Rds On (Max) @ Id, Vgs: 38mOhm @ 75A, 10V Current - Continuous Drain (Id) @ 25°C: 103A (Tc) FET Type: N-Channel Packaging: Tube Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 150°C (TJ) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 20 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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APT10035JLL | Microchip Technology |
Description: MOSFET N-CH 1000V 25A ISOTOP Drive Voltage (Max Rds On, Min Rds On): 10V Supplier Device Package: ISOTOP® Vgs(th) (Max) @ Id: 5V @ 2.5mA Power Dissipation (Max): 520W (Tc) Rds On (Max) @ Id, Vgs: 350mOhm @ 14A, 10V Current - Continuous Drain (Id) @ 25°C: 25A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Chassis Mount Package / Case: SOT-227-4, miniBLOC Packaging: Tube Input Capacitance (Ciss) (Max) @ Vds: 5185 pF @ 25 V Gate Charge (Qg) (Max) @ Vgs: 186 nC @ 10 V Drain to Source Voltage (Vdss): 1000 V Vgs (Max): ±30V |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 10 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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APT100F50J | Microchip Technology |
Description: MOSFET N-CH 500V 103A ISOTOP Input Capacitance (Ciss) (Max) @ Vds: 24600 pF @ 25 V Gate Charge (Qg) (Max) @ Vgs: 620 nC @ 10 V Drain to Source Voltage (Vdss): 500 V Vgs (Max): ±30V Drive Voltage (Max Rds On, Min Rds On): 10V Supplier Device Package: ISOTOP® Vgs(th) (Max) @ Id: 5V @ 5mA Power Dissipation (Max): 960W (Tc) Rds On (Max) @ Id, Vgs: 36mOhm @ 75A, 10V Current - Continuous Drain (Id) @ 25°C: 103A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Chassis Mount Package / Case: SOT-227-4, miniBLOC Packaging: Tube |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 10 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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TVS528e3 | Microchip Technology |
Description: TVS DIODE 28VWM 46.5VC B AXIAL Voltage - Reverse Standoff (Typ): 28V Current - Peak Pulse (10/1000µs): 10.7A Applications: General Purpose Operating Temperature: -65°C ~ 175°C (TA) Type: Zener Mounting Type: Through Hole Package / Case: B, Axial Packaging: Bulk Power Line Protection: No Power - Peak Pulse: 500W Voltage - Clamping (Max) @ Ipp: 46.5V Voltage - Breakdown (Min): 30.7V Unidirectional Channels: 1 Supplier Device Package: B, Axial |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 100 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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tvs528/tr | Microchip Technology |
Description: TVS DIODE 28VWM 46.5V AXIAL Power Line Protection: No Power - Peak Pulse: 500W Voltage - Clamping (Max) @ Ipp: 46.5V Voltage - Breakdown (Min): 30.7V Unidirectional Channels: 1 Supplier Device Package: B, Axial Voltage - Reverse Standoff (Typ): 28V Current - Peak Pulse (10/1000µs): 10.7A (8/20µs) Applications: General Purpose Operating Temperature: -65°C ~ 175°C (TJ) Type: Zener Mounting Type: Through Hole Package / Case: B, Axial Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 100 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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ATTINY84V-10PU | Microchip Technology |
Description: IC MCU 8BIT 8KB FLASH 14DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 10MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: AVR Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: USI Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT Supplier Device Package: 14-PDIP Number of I/O: 12 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N5934A | Microchip Technology |
Description: DIODE ZENER 24V 1.25W DO204AL Tolerance: ±10% Packaging: Bulk Package / Case: DO-204AL, DO-41, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C (TJ) Voltage - Zener (Nom) (Vz): 24 V Impedance (Max) (Zzt): 19 Ohms Supplier Device Package: DO-204AL (DO-41) Power - Max: 1.25 W Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA Current - Reverse Leakage @ Vr: 1 µA @ 18.2 V |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 625 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N5934C | Microchip Technology |
Description: DIODE ZENER 24V 1.25W DO204AL Tolerance: ±2% Packaging: Bulk Package / Case: DO-204AL, DO-41, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C (TJ) Voltage - Zener (Nom) (Vz): 24 V Impedance (Max) (Zzt): 19 Ohms Supplier Device Package: DO-204AL (DO-41) Power - Max: 1.25 W Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA Current - Reverse Leakage @ Vr: 1 µA @ 18.2 V |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 157 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N5934D | Microchip Technology |
Description: DIODE ZENER 24V 1.25W DO204AL Current - Reverse Leakage @ Vr: 1 µA @ 18.2 V Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA Power - Max: 1.25 W Supplier Device Package: DO-204AL (DO-41) Impedance (Max) (Zzt): 19 Ohms Voltage - Zener (Nom) (Vz): 24 V Operating Temperature: -65°C ~ 175°C (TJ) Mounting Type: Through Hole Package / Case: DO-204AL, DO-41, Axial Tolerance: ±1% Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 125 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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1N5956B | Microchip Technology |
Description: DIODE ZENER 200V 1.25W DO41 Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA Power - Max: 1.25 W Supplier Device Package: DO-41 Impedance (Max) (Zzt): 1200 Ohms Current - Reverse Leakage @ Vr: 1 µA @ 152 V Voltage - Zener (Nom) (Vz): 200 V Operating Temperature: -65°C ~ 175°C (TJ) Mounting Type: Through Hole Package / Case: DO-204AL, DO-41, Axial Tolerance: ±5% Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 278 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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JAN1N3822C-1 | Microchip Technology |
Description: DIODE ZENER 3.6V 1W DO204AL Qualification: MIL-PRF-19500/115 Current - Reverse Leakage @ Vr: 75 µA @ 1 V Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA Power - Max: 1 W Grade: Military Supplier Device Package: DO-204AL (DO-41) Impedance (Max) (Zzt): 10 Ohms Voltage - Zener (Nom) (Vz): 3.6 V Operating Temperature: -65°C ~ 175°C Mounting Type: Through Hole Package / Case: DO-204AL, DO-41, Axial Tolerance: ±2% Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 100 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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JANTX1N3822C-1 | Microchip Technology |
Description: DIODE ZENER 3.6V 1W DO204AL Mounting Type: Through Hole Package / Case: DO-204AL, DO-41, Axial Tolerance: ±2% Packaging: Bulk Qualification: MIL-PRF-19500/115 Current - Reverse Leakage @ Vr: 75 µA @ 1 V Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA Power - Max: 1 W Grade: Military Supplier Device Package: DO-204AL (DO-41) Impedance (Max) (Zzt): 10 Ohms Voltage - Zener (Nom) (Vz): 3.6 V Operating Temperature: -65°C ~ 175°C |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 100 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
| DSC6003HI2B-745K000T | Microchip Technology |
Description: MEMS CMOS OSC Height - Seated (Max): 0.035" (0.89mm) Supplier Device Package: 4-VFLGA (1.6x1.2) Current - Supply (Max): 1.3mA (Typ) Ratings: AEC-Q100 Voltage - Supply: 1.8V ~ 3.3V Frequency Stability: ±25ppm Operating Temperature: -40°C ~ 85°C Type: XO (Standard) Function: Enable/Disable Output: CMOS Mounting Type: Surface Mount Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm) Package / Case: 4-VFLGA Packaging: Strip Base Resonator: MEMS Frequency: 745 kHz |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| DSC6003HI1B-745K000T | Microchip Technology |
Description: MEMS CMOS OSC Base Resonator: MEMS Frequency: 745 kHz Height - Seated (Max): 0.035" (0.89mm) Supplier Device Package: 4-VFLGA (1.6x1.2) Current - Supply (Max): 1.3mA (Typ) Ratings: AEC-Q100 Voltage - Supply: 1.71V ~ 3.63V Frequency Stability: ±50ppm Operating Temperature: -40°C ~ 85°C Type: XO (Standard) Function: Enable/Disable Output: CMOS Mounting Type: Surface Mount Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm) Package / Case: 4-VFLGA Packaging: Strip |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| SAMA7D65D2GT-V/4UB | Microchip Technology |
Description: CORTEX-A7 MPU,BGA, EXT TEMP,2GB Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||
| SAMA7D65D2G-V/4UB | Microchip Technology |
Description: CORTEX-A7 MPU,BGA, EXT TEMP,2GB Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 70 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||
| SAMA7D65D2GT-V/4UB-SL3 | Microchip Technology |
Description: CORTEX-A7 MPU,BGA, EXT TEMP, 2GB Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||
| SAMA7D65D2GN8-I/5BW | Microchip Technology |
Description: SAMA7D65 SYSTEM ON MODULE USING Packaging: Bulk Speed: 1GHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A7 Ethernet: 10/100/1000Mbps (2) USB: USB (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR3L Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB Security Features: AES, SHA, TDES, TRNG Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
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SAMA7D65-V/4HB | Microchip Technology |
Description: CORTEX-A7 MPU, BGA, EXT 125C TEM Packaging: Tray Package / Case: 343-TFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Supplier Device Package: 343-TFBGA (14x14) Ethernet: 10/100/1000Mbps (2) USB: USB (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR3L Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB Security Features: AES, SHA, TDES, TRNG Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART |
auf Bestellung 119 Stücke: Lieferzeit 10-14 Tag (e) |
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| EV63J76A | Microchip Technology |
Description: SAMA7D65 CURIOSITY Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-A7 Utilized IC / Part: SAMA7D65 Platform: Curiosity |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| SAMA7D65T-V/4HB | Microchip Technology |
Description: CORTEX-A7 MPU, BGA, EXT. TEMP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||
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SAMA7D65-V/4HB-SL3 | Microchip Technology |
Description: CORTEX-A7 MPU, BGA, EXT TEMP Packaging: Tray Package / Case: 343-TFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Supplier Device Package: 343-TFBGA (14x14) Ethernet: 10/100/1000Mbps (2) USB: USB (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR3L Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB Security Features: AES, SHA, TDES, TRNG Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 119 Stücke Im Einkaufswagen Stück im Wert von UAH |
| EV59Y78A |
Hersteller: Microchip Technology
Description: WILCS02 M.2 WI-FI MODULE CARD
Packaging: Box
Package / Case: Module
Mounting Type: Card Edge
Voltage - Supply: 3.3V
Protocol: 802.11b/g/n
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: WiFi
Serial Interfaces: SDIO, SPI
Description: WILCS02 M.2 WI-FI MODULE CARD
Packaging: Box
Package / Case: Module
Mounting Type: Card Edge
Voltage - Supply: 3.3V
Protocol: 802.11b/g/n
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: WiFi
Serial Interfaces: SDIO, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| JAN1N6051A/TR |
Hersteller: Microchip Technology
Description: TVS DIODE 28VWM 45.7VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.4V
Voltage - Clamping (Max) @ Ipp: 45.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/507
Description: TVS DIODE 28VWM 45.7VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.4V
Voltage - Clamping (Max) @ Ipp: 45.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/507
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| JANTX1N6051A/TR |
Hersteller: Microchip Technology
Description: TVS DIODE 28VWM 45.7VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.4V
Voltage - Clamping (Max) @ Ipp: 45.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/507
Description: TVS DIODE 28VWM 45.7VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.4V
Voltage - Clamping (Max) @ Ipp: 45.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/507
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| JANTXV1N6051A |
Hersteller: Microchip Technology
Description: TVS DIODE 28VWM 45.7VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.4V
Voltage - Clamping (Max) @ Ipp: 45.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/507
Description: TVS DIODE 28VWM 45.7VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.4V
Voltage - Clamping (Max) @ Ipp: 45.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/507
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| JANTXV1N6051A/TR |
|
Hersteller: Microchip Technology
Description: TVS DIODE 28VWM 45.7VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.4V
Voltage - Clamping (Max) @ Ipp: 45.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/507
Description: TVS DIODE 28VWM 45.7VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 33A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-13 (DO-202AA)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 31.4V
Voltage - Clamping (Max) @ Ipp: 45.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/507
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 1N6327US/TR |
|
Hersteller: Microchip Technology
Description: DIODE ZENER 13V 500MW SQ-MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: B, SQ-MELF
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
Description: DIODE ZENER 13V 500MW SQ-MELF
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: B, SQ-MELF
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
auf Bestellung 200 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 100+ | 21.51 EUR |
| 1N6327US/TR |
|
Hersteller: Microchip Technology
Description: DIODE ZENER 13V 500MW SQ-MELF
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: B, SQ-MELF
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
Description: DIODE ZENER 13V 500MW SQ-MELF
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: B, SQ-MELF
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 50 nA @ 9.9 V
auf Bestellung 200 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 23.16 EUR |
| T7023-PEQ |
|
Hersteller: Microchip Technology
Description: IC AMP BLUETOOTH 2.4GHZ 16QFN
Packaging: Tube
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
RF Type: Bluetooth
Voltage - Supply: 2.7V ~ 4.6V
Gain: 23dB
Current - Supply: 165mA
Supplier Device Package: 16-QFN (4x4)
Description: IC AMP BLUETOOTH 2.4GHZ 16QFN
Packaging: Tube
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
RF Type: Bluetooth
Voltage - Supply: 2.7V ~ 4.6V
Gain: 23dB
Current - Supply: 165mA
Supplier Device Package: 16-QFN (4x4)
Produkt ist nicht verfügbar
Mindestbestellmenge: 240 Stücke
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| 1N6360/TR |
|
Hersteller: Microchip Technology
Description: TVS DIODE 15VWM 20.6VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 60A
Voltage - Reverse Standoff (Typ): 15V
Supplier Device Package: DO-13
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.6V
Voltage - Clamping (Max) @ Ipp: 20.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Description: TVS DIODE 15VWM 20.6VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 60A
Voltage - Reverse Standoff (Typ): 15V
Supplier Device Package: DO-13
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.6V
Voltage - Clamping (Max) @ Ipp: 20.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
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| PIC32AK3208GC41064-I/PT |
|
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
auf Bestellung 498 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 7+ | 2.9 EUR |
| 25+ | 2.63 EUR |
| 100+ | 2.4 EUR |
| PIC32AK6416GC41064-I/PT |
|
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 6+ | 3.04 EUR |
| 25+ | 2.77 EUR |
| 100+ | 2.51 EUR |
| PIC32AK6416GC41064-I/M7 |
|
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 6+ | 3.06 EUR |
| 25+ | 2.78 EUR |
| 100+ | 2.54 EUR |
| PIC32AK1216GC41064-I/PT |
|
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
auf Bestellung 220 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 6+ | 3.19 EUR |
| 25+ | 2.89 EUR |
| 100+ | 2.63 EUR |
| PIC32AK1216GC41064-I/M7 |
|
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
auf Bestellung 213 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 6+ | 3.24 EUR |
| 25+ | 2.93 EUR |
| 100+ | 2.68 EUR |
| EV25Z08A |
|
Hersteller: Microchip Technology
Description: PIC32AK1216GC41064 EVAL
Utilized IC / Part: PIC32AK1216GC41064
Core Processor: PIC32
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: PIC32AK1216GC41064 EVAL
Utilized IC / Part: PIC32AK1216GC41064
Core Processor: PIC32
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 20.13 EUR |
| PIC32AK3208GC41064-I/M7 |
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
Produkt ist nicht verfügbar
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| PIC32AK3208GC41064T-I/PT |
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Program Memory Size: 32KB (32K x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
Number of I/O: 49
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Program Memory Size: 32KB (32K x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
Number of I/O: 49
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Produkt ist nicht verfügbar
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| PIC32AK3208GC41064T-I/M7 |
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Number of I/O: 49
Supplier Device Package: 64-VQFN (9x9)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Number of I/O: 49
Supplier Device Package: 64-VQFN (9x9)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 3300 Stücke
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| PIC32AK6416GC41064T-I/PT |
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
Number of I/O: 49
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Processor: PIC
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
Number of I/O: 49
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Processor: PIC
Produkt ist nicht verfügbar
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| PIC32AK6416GC41064T-I/M7 |
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
Produkt ist nicht verfügbar
Mindestbestellmenge: 3300 Stücke
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| PIC32AK3208GC41064-E/M7 |
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 400 Stücke
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| PIC32AK3208GC41064-E/PT |
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| PIC32AK1216GC41064T-I/PT |
|
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
Produkt ist nicht verfügbar
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| PIC32AK1216GC41064T-I/M7 |
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
Produkt ist nicht verfügbar
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| PIC32AK6416GC41064-E/PT |
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| PIC32AK6416GC41064-E/M7 |
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| PIC32AK1216GC41064-E/PT |
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
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| PIC32AK1216GC41064-E/M7 |
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
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| M1.5KE39A |
|
Hersteller: Microchip Technology
Description: TVS DIODE 33.3VWM 53.9VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 28A
Voltage - Reverse Standoff (Typ): 33.3V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 37.1V
Voltage - Clamping (Max) @ Ipp: 53.9V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Description: TVS DIODE 33.3VWM 53.9VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 28A
Voltage - Reverse Standoff (Typ): 33.3V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 37.1V
Voltage - Clamping (Max) @ Ipp: 53.9V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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| VC-801-EAW-FAAN-25M0012500 |
|
Hersteller: Microchip Technology
Description: VC-830-ECE-FAAN-156M250000
Packaging: Strip
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -10°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 20mA
Height - Seated (Max): 0.055" (1.40mm)
Frequency: 25.00125 MHz
Base Resonator: Crystal
Description: VC-830-ECE-FAAN-156M250000
Packaging: Strip
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -10°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 20mA
Height - Seated (Max): 0.055" (1.40mm)
Frequency: 25.00125 MHz
Base Resonator: Crystal
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| JANTXV1N5417 |
|
Hersteller: Microchip Technology
Description: DIODE STANDARD 200V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 200 V
Qualification: MIL-PRF-19500/411
Description: DIODE STANDARD 200V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 200 V
Qualification: MIL-PRF-19500/411
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| JANTXV1N5417/TR |
|
Hersteller: Microchip Technology
Description: DIODE STANDARD 200V 3A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 200 V
Qualification: MIL-PRF-19500/411
Description: DIODE STANDARD 200V 3A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 200 V
Qualification: MIL-PRF-19500/411
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| 1N5417US/TR |
Hersteller: Microchip Technology
Description: DIODE STANDARD 200V 3A D5B
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: D-5B
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 200 V
Description: DIODE STANDARD 200V 3A D5B
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: D-5B
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 200 V
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| JANS1N5417 |
Hersteller: Microchip Technology
Description: DIODE STANDARD 200V 3A B AXIAL
Grade: Military
Operating Temperature - Junction: -65°C ~ 175°C
Supplier Device Package: B, Axial
Current - Average Rectified (Io): 3A
Technology: Standard
Reverse Recovery Time (trr): 150 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: B, Axial
Packaging: Bulk
Qualification: MIL-PRF-19500/411
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Voltage - DC Reverse (Vr) (Max): 200 V
Description: DIODE STANDARD 200V 3A B AXIAL
Grade: Military
Operating Temperature - Junction: -65°C ~ 175°C
Supplier Device Package: B, Axial
Current - Average Rectified (Io): 3A
Technology: Standard
Reverse Recovery Time (trr): 150 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: B, Axial
Packaging: Bulk
Qualification: MIL-PRF-19500/411
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Voltage - DC Reverse (Vr) (Max): 200 V
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| JANS1N5417/TR |
|
Hersteller: Microchip Technology
Description: DIODE STANDARD 200V 3A B AXIAL
Qualification: MIL-PRF-19500/411
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Voltage - DC Reverse (Vr) (Max): 200 V
Grade: Military
Operating Temperature - Junction: -65°C ~ 175°C
Supplier Device Package: B, Axial
Current - Average Rectified (Io): 3A
Technology: Standard
Reverse Recovery Time (trr): 150 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: B, Axial
Packaging: Tape & Reel (TR)
Description: DIODE STANDARD 200V 3A B AXIAL
Qualification: MIL-PRF-19500/411
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Voltage - DC Reverse (Vr) (Max): 200 V
Grade: Military
Operating Temperature - Junction: -65°C ~ 175°C
Supplier Device Package: B, Axial
Current - Average Rectified (Io): 3A
Technology: Standard
Reverse Recovery Time (trr): 150 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Through Hole
Package / Case: B, Axial
Packaging: Tape & Reel (TR)
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| DSC1121DM2-003.3333T |
|
Hersteller: Microchip Technology
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.3333 MHz
Base Resonator: MEMS
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.3333 MHz
Base Resonator: MEMS
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| DSC1121DM2-003.3333 |
Hersteller: Microchip Technology
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.3333 MHz
Base Resonator: MEMS
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.3333 MHz
Base Resonator: MEMS
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| DSC1121CM2-003.1152 |
Hersteller: Microchip Technology
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Absolute Pull Range (APR): ±25ppm
Frequency: 3.1152 MHz
Base Resonator: MEMS
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Absolute Pull Range (APR): ±25ppm
Frequency: 3.1152 MHz
Base Resonator: MEMS
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| APT100M50J |
|
Hersteller: Microchip Technology
Description: MOSFET N-CH 500V 103A SOT227
Mounting Type: Chassis Mount
Package / Case: SOT-227-4, miniBLOC
Input Capacitance (Ciss) (Max) @ Vds: 24600 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 620 nC @ 10 V
Drain to Source Voltage (Vdss): 500 V
Vgs (Max): ±30V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: SOT-227
Vgs(th) (Max) @ Id: 5V @ 5mA
Power Dissipation (Max): 960W (Tc)
Rds On (Max) @ Id, Vgs: 38mOhm @ 75A, 10V
Current - Continuous Drain (Id) @ 25°C: 103A (Tc)
FET Type: N-Channel
Packaging: Tube
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Description: MOSFET N-CH 500V 103A SOT227
Mounting Type: Chassis Mount
Package / Case: SOT-227-4, miniBLOC
Input Capacitance (Ciss) (Max) @ Vds: 24600 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 620 nC @ 10 V
Drain to Source Voltage (Vdss): 500 V
Vgs (Max): ±30V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: SOT-227
Vgs(th) (Max) @ Id: 5V @ 5mA
Power Dissipation (Max): 960W (Tc)
Rds On (Max) @ Id, Vgs: 38mOhm @ 75A, 10V
Current - Continuous Drain (Id) @ 25°C: 103A (Tc)
FET Type: N-Channel
Packaging: Tube
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
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| APT10035JLL |
|
Hersteller: Microchip Technology
Description: MOSFET N-CH 1000V 25A ISOTOP
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: ISOTOP®
Vgs(th) (Max) @ Id: 5V @ 2.5mA
Power Dissipation (Max): 520W (Tc)
Rds On (Max) @ Id, Vgs: 350mOhm @ 14A, 10V
Current - Continuous Drain (Id) @ 25°C: 25A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Chassis Mount
Package / Case: SOT-227-4, miniBLOC
Packaging: Tube
Input Capacitance (Ciss) (Max) @ Vds: 5185 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 186 nC @ 10 V
Drain to Source Voltage (Vdss): 1000 V
Vgs (Max): ±30V
Description: MOSFET N-CH 1000V 25A ISOTOP
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: ISOTOP®
Vgs(th) (Max) @ Id: 5V @ 2.5mA
Power Dissipation (Max): 520W (Tc)
Rds On (Max) @ Id, Vgs: 350mOhm @ 14A, 10V
Current - Continuous Drain (Id) @ 25°C: 25A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Chassis Mount
Package / Case: SOT-227-4, miniBLOC
Packaging: Tube
Input Capacitance (Ciss) (Max) @ Vds: 5185 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 186 nC @ 10 V
Drain to Source Voltage (Vdss): 1000 V
Vgs (Max): ±30V
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| APT100F50J |
|
Hersteller: Microchip Technology
Description: MOSFET N-CH 500V 103A ISOTOP
Input Capacitance (Ciss) (Max) @ Vds: 24600 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 620 nC @ 10 V
Drain to Source Voltage (Vdss): 500 V
Vgs (Max): ±30V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: ISOTOP®
Vgs(th) (Max) @ Id: 5V @ 5mA
Power Dissipation (Max): 960W (Tc)
Rds On (Max) @ Id, Vgs: 36mOhm @ 75A, 10V
Current - Continuous Drain (Id) @ 25°C: 103A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Chassis Mount
Package / Case: SOT-227-4, miniBLOC
Packaging: Tube
Description: MOSFET N-CH 500V 103A ISOTOP
Input Capacitance (Ciss) (Max) @ Vds: 24600 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 620 nC @ 10 V
Drain to Source Voltage (Vdss): 500 V
Vgs (Max): ±30V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: ISOTOP®
Vgs(th) (Max) @ Id: 5V @ 5mA
Power Dissipation (Max): 960W (Tc)
Rds On (Max) @ Id, Vgs: 36mOhm @ 75A, 10V
Current - Continuous Drain (Id) @ 25°C: 103A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Chassis Mount
Package / Case: SOT-227-4, miniBLOC
Packaging: Tube
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| TVS528e3 |
Hersteller: Microchip Technology
Description: TVS DIODE 28VWM 46.5VC B AXIAL
Voltage - Reverse Standoff (Typ): 28V
Current - Peak Pulse (10/1000µs): 10.7A
Applications: General Purpose
Operating Temperature: -65°C ~ 175°C (TA)
Type: Zener
Mounting Type: Through Hole
Package / Case: B, Axial
Packaging: Bulk
Power Line Protection: No
Power - Peak Pulse: 500W
Voltage - Clamping (Max) @ Ipp: 46.5V
Voltage - Breakdown (Min): 30.7V
Unidirectional Channels: 1
Supplier Device Package: B, Axial
Description: TVS DIODE 28VWM 46.5VC B AXIAL
Voltage - Reverse Standoff (Typ): 28V
Current - Peak Pulse (10/1000µs): 10.7A
Applications: General Purpose
Operating Temperature: -65°C ~ 175°C (TA)
Type: Zener
Mounting Type: Through Hole
Package / Case: B, Axial
Packaging: Bulk
Power Line Protection: No
Power - Peak Pulse: 500W
Voltage - Clamping (Max) @ Ipp: 46.5V
Voltage - Breakdown (Min): 30.7V
Unidirectional Channels: 1
Supplier Device Package: B, Axial
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| tvs528/tr |
Hersteller: Microchip Technology
Description: TVS DIODE 28VWM 46.5V AXIAL
Power Line Protection: No
Power - Peak Pulse: 500W
Voltage - Clamping (Max) @ Ipp: 46.5V
Voltage - Breakdown (Min): 30.7V
Unidirectional Channels: 1
Supplier Device Package: B, Axial
Voltage - Reverse Standoff (Typ): 28V
Current - Peak Pulse (10/1000µs): 10.7A (8/20µs)
Applications: General Purpose
Operating Temperature: -65°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: B, Axial
Packaging: Tape & Reel (TR)
Description: TVS DIODE 28VWM 46.5V AXIAL
Power Line Protection: No
Power - Peak Pulse: 500W
Voltage - Clamping (Max) @ Ipp: 46.5V
Voltage - Breakdown (Min): 30.7V
Unidirectional Channels: 1
Supplier Device Package: B, Axial
Voltage - Reverse Standoff (Typ): 28V
Current - Peak Pulse (10/1000µs): 10.7A (8/20µs)
Applications: General Purpose
Operating Temperature: -65°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: B, Axial
Packaging: Tape & Reel (TR)
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| ATTINY84V-10PU |
|
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 10MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 14-PDIP
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 10MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 14-PDIP
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| 1N5934A |
|
Hersteller: Microchip Technology
Description: DIODE ZENER 24V 1.25W DO204AL
Tolerance: ±10%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 19 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 18.2 V
Description: DIODE ZENER 24V 1.25W DO204AL
Tolerance: ±10%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 19 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 18.2 V
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| 1N5934C |
|
Hersteller: Microchip Technology
Description: DIODE ZENER 24V 1.25W DO204AL
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 19 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 18.2 V
Description: DIODE ZENER 24V 1.25W DO204AL
Tolerance: ±2%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 19 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 18.2 V
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| 1N5934D |
|
Hersteller: Microchip Technology
Description: DIODE ZENER 24V 1.25W DO204AL
Current - Reverse Leakage @ Vr: 1 µA @ 18.2 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1.25 W
Supplier Device Package: DO-204AL (DO-41)
Impedance (Max) (Zzt): 19 Ohms
Voltage - Zener (Nom) (Vz): 24 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AL, DO-41, Axial
Tolerance: ±1%
Packaging: Bulk
Description: DIODE ZENER 24V 1.25W DO204AL
Current - Reverse Leakage @ Vr: 1 µA @ 18.2 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1.25 W
Supplier Device Package: DO-204AL (DO-41)
Impedance (Max) (Zzt): 19 Ohms
Voltage - Zener (Nom) (Vz): 24 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AL, DO-41, Axial
Tolerance: ±1%
Packaging: Bulk
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| 1N5956B |
|
Hersteller: Microchip Technology
Description: DIODE ZENER 200V 1.25W DO41
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1.25 W
Supplier Device Package: DO-41
Impedance (Max) (Zzt): 1200 Ohms
Current - Reverse Leakage @ Vr: 1 µA @ 152 V
Voltage - Zener (Nom) (Vz): 200 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AL, DO-41, Axial
Tolerance: ±5%
Packaging: Bulk
Description: DIODE ZENER 200V 1.25W DO41
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1.25 W
Supplier Device Package: DO-41
Impedance (Max) (Zzt): 1200 Ohms
Current - Reverse Leakage @ Vr: 1 µA @ 152 V
Voltage - Zener (Nom) (Vz): 200 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AL, DO-41, Axial
Tolerance: ±5%
Packaging: Bulk
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| JAN1N3822C-1 |
|
Hersteller: Microchip Technology
Description: DIODE ZENER 3.6V 1W DO204AL
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 75 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-204AL (DO-41)
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 3.6 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AL, DO-41, Axial
Tolerance: ±2%
Packaging: Bulk
Description: DIODE ZENER 3.6V 1W DO204AL
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 75 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-204AL (DO-41)
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 3.6 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AL, DO-41, Axial
Tolerance: ±2%
Packaging: Bulk
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| JANTX1N3822C-1 |
|
Hersteller: Microchip Technology
Description: DIODE ZENER 3.6V 1W DO204AL
Mounting Type: Through Hole
Package / Case: DO-204AL, DO-41, Axial
Tolerance: ±2%
Packaging: Bulk
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 75 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-204AL (DO-41)
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 3.6 V
Operating Temperature: -65°C ~ 175°C
Description: DIODE ZENER 3.6V 1W DO204AL
Mounting Type: Through Hole
Package / Case: DO-204AL, DO-41, Axial
Tolerance: ±2%
Packaging: Bulk
Qualification: MIL-PRF-19500/115
Current - Reverse Leakage @ Vr: 75 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Power - Max: 1 W
Grade: Military
Supplier Device Package: DO-204AL (DO-41)
Impedance (Max) (Zzt): 10 Ohms
Voltage - Zener (Nom) (Vz): 3.6 V
Operating Temperature: -65°C ~ 175°C
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| DSC6003HI2B-745K000T |
Hersteller: Microchip Technology
Description: MEMS CMOS OSC
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Current - Supply (Max): 1.3mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: 4-VFLGA
Packaging: Strip
Base Resonator: MEMS
Frequency: 745 kHz
Description: MEMS CMOS OSC
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Current - Supply (Max): 1.3mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 1.8V ~ 3.3V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: 4-VFLGA
Packaging: Strip
Base Resonator: MEMS
Frequency: 745 kHz
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| DSC6003HI1B-745K000T |
Hersteller: Microchip Technology
Description: MEMS CMOS OSC
Base Resonator: MEMS
Frequency: 745 kHz
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Current - Supply (Max): 1.3mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: 4-VFLGA
Packaging: Strip
Description: MEMS CMOS OSC
Base Resonator: MEMS
Frequency: 745 kHz
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Current - Supply (Max): 1.3mA (Typ)
Ratings: AEC-Q100
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±50ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: 4-VFLGA
Packaging: Strip
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| SAMA7D65D2GT-V/4UB |
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU,BGA, EXT TEMP,2GB
Packaging: Tape & Reel (TR)
Description: CORTEX-A7 MPU,BGA, EXT TEMP,2GB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| SAMA7D65D2G-V/4UB |
|
Produkt ist nicht verfügbar
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| SAMA7D65D2GT-V/4UB-SL3 |
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU,BGA, EXT TEMP, 2GB
Packaging: Tape & Reel (TR)
Description: CORTEX-A7 MPU,BGA, EXT TEMP, 2GB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| SAMA7D65D2GN8-I/5BW |
Hersteller: Microchip Technology
Description: SAMA7D65 SYSTEM ON MODULE USING
Packaging: Bulk
Speed: 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A7
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
Description: SAMA7D65 SYSTEM ON MODULE USING
Packaging: Bulk
Speed: 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A7
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
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| SAMA7D65-V/4HB |
|
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU, BGA, EXT 125C TEM
Packaging: Tray
Package / Case: 343-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 343-TFBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
Description: CORTEX-A7 MPU, BGA, EXT 125C TEM
Packaging: Tray
Package / Case: 343-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 343-TFBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
auf Bestellung 119 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 19.11 EUR |
| 25+ | 17.53 EUR |
| 100+ | 15.88 EUR |
| EV63J76A |
Hersteller: Microchip Technology
Description: SAMA7D65 CURIOSITY
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-A7
Utilized IC / Part: SAMA7D65
Platform: Curiosity
Description: SAMA7D65 CURIOSITY
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-A7
Utilized IC / Part: SAMA7D65
Platform: Curiosity
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAMA7D65T-V/4HB |
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU, BGA, EXT. TEMP
Packaging: Tape & Reel (TR)
Description: CORTEX-A7 MPU, BGA, EXT. TEMP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| SAMA7D65-V/4HB-SL3 |
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU, BGA, EXT TEMP
Packaging: Tray
Package / Case: 343-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 343-TFBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
Description: CORTEX-A7 MPU, BGA, EXT TEMP
Packaging: Tray
Package / Case: 343-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 343-TFBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 119 Stücke
Im Einkaufswagen
Stück im Wert von UAH