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DSC1001CI2-050.0000T DSC1001CI2-050.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 50.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
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DSC1001CI2-001.9521 DSC1001CI2-001.9521 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 1.9521MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 1.9521 MHz
Base Resonator: MEMS
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DSC1001CL2-025.0000 DSC1001CL2-025.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC1001BI2-007.3728 DSC1001BI2-007.3728 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 7.3728MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 7.3728 MHz
Base Resonator: MEMS
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DSC1001BI2-008.0000 DSC1001BI2-008.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 8.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC1001CI2-011.0592T DSC1001CI2-011.0592T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 11.0592MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 11.0592 MHz
Base Resonator: MEMS
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DSC1001CI2-024.0000 DSC1001CI2-024.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC1001CI2-012.0000 DSC1001CI2-012.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC1001BI2-125.0000 DSC1001BI2-125.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 125.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSC1121BI2-156.2500 DSC1121BI2-156.2500 Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSC XO 156.2500MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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2N2222AUB 2N2222AUB Microchip Technology 2N2221A%2C%202N2222A.pdf Description: TRANS NPN 50V 0.8A UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
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24CSM01T-E/ST 24CSM01T-E/ST Microchip Technology 24CSM01-1-Mbit-3.4MHz-I2C-Serial-EEPROM-DS20006781.pdf Description: IC EEPROM 1MBIT I2C 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 70 ns
Memory Organization: 128K x 8
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24CSM01T-E/ST 24CSM01T-E/ST Microchip Technology 24CSM01-1-Mbit-3.4MHz-I2C-Serial-EEPROM-DS20006781.pdf Description: IC EEPROM 1MBIT I2C 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 70 ns
Memory Organization: 128K x 8
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VXB2-1D6-16M0000000 Microchip Technology 1243751-vxb1-vxb2 Description: VXB2-1D6-16M0000000
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIC3003GML-TR MIC3003GML-TR Microchip Technology mic3003.pdf Description: IC LASER CTRLR 10GBPS 3.6V 24MLF
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad, 24-MLF®
Mounting Type: Surface Mount
Type: Laser Diode Controller (Fiber Optic)
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3V ~ 3.6V
Data Rate: 10Gbps
Supplier Device Package: 24-MLF® (4x4)
Number of Channels: 1
Current - Supply: 2.3 mA
Produkt ist nicht verfügbar
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1N1186R Microchip Technology 8540-coe-18-datasheet Description: DIODE STD REV 200V 35A DO203AB
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-203AB (DO-5)
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 110 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Produkt ist nicht verfügbar
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JAN1N1186R Microchip Technology 8951-lds-0138-pdf Description: DIODE STANDARD REV 200V 35A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Chassis, Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-5
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 110 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Qualification: MIL-PRF-19500/297
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JANTX1N1186R Microchip Technology 8951-lds-0138-datasheet Description: DIODE STD REV 200V 35A DO203AB
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-203AB (DO-5)
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 110 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Qualification: MIL-PRF-19500/297
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JANTXV1N1186R Microchip Technology 8951-lds-0138-pdf Description: DIODE STANDARD REV 200V 35A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Chassis, Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-5
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 110 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Qualification: MIL-PRF-19500/297
Produkt ist nicht verfügbar
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ATMEGA16-16AUR ATMEGA16-16AUR Microchip Technology 2466S.pdf Description: IC MCU 8BIT 16KB FLASH 44TQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
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ATMEGA16-16AUR ATMEGA16-16AUR Microchip Technology 2466S.pdf Description: IC MCU 8BIT 16KB FLASH 44TQFP
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
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1N2128A Microchip Technology S%2CR35.pdf Description: DIODE STANDARD 50V 70A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 70A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 A
Current - Reverse Leakage @ Vr: 25 µA @ 50 V
Produkt ist nicht verfügbar
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ATMEGA48V-10PI ATMEGA48V-10PI Microchip Technology ATmega48_88_168%20Preliminary%20Complete.pdf Description: IC MCU 8BIT 4KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 10MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-PDIP
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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M5KP24A M5KP24A Microchip Technology rf01010_rb.pdf Description: TVS DIODE 24VWM 38.9VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 128A
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 38.9V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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AVR32SD20-I/SS AVR32SD20-I/SS Microchip Technology AVR32SD20-28-32-Data-Sheet-DS40002629.pdf Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 15
Mounting Type: Surface Mount
Data Converters: A/D 13x10b; D/A 1x10b
Core Size: 8-Bit
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APT100GN60LDQ4G APT100GN60LDQ4G Microchip Technology APT100GN60LDQ4(G)_A.pdf Description: IGBT TRENCH FS 600V 229A TO264
Packaging: Tube
Package / Case: TO-264-3, TO-264AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 1.85V @ 15V, 100A
Supplier Device Package: TO-264 [L]
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 31ns/310ns
Switching Energy: 4.75mJ (on), 2.675mJ (off)
Test Condition: 400V, 100A, 1Ohm, 15V
Gate Charge: 600 nC
Current - Collector (Ic) (Max): 229 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 300 A
Power - Max: 625 W
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APT100GN120B2G APT100GN120B2G Microchip Technology High-Voltage-Power-Discretes-and-Modules-Brochure-00003052.pdf Description: IGBT TRENCH FIELD STP 1200V 245A
Packaging: Tube
Package / Case: TO-247-3 Variant
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 100A
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 50ns/615ns
Switching Energy: 11mJ (on), 9.5mJ (off)
Test Condition: 800V, 100A, 1Ohm, 15V
Gate Charge: 540 nC
Current - Collector (Ic) (Max): 245 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Pulsed (Icm): 300 A
Power - Max: 960 W
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APT100GN60B2G APT100GN60B2G Microchip Technology APT100GN60B2(G)_A.pdf Description: IGBT TRENCH FIELD STOP 600V 229A
Packaging: Tube
Package / Case: TO-247-3 Variant
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 1.85V @ 15V, 100A
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 31ns/310ns
Switching Energy: 4.7mJ (on), 2.675mJ (off)
Test Condition: 400V, 100A, 1Ohm, 15V
Gate Charge: 600 nC
Current - Collector (Ic) (Max): 229 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 300 A
Power - Max: 625 W
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APT10090SLLG APT10090SLLG Microchip Technology 6553-apt10090bllg-apt10090sllg-datasheet Description: MOSFET N-CH 1000V 12A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 12A (Tc)
Rds On (Max) @ Id, Vgs: 900mOhm @ 6A, 10V
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 71 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1969 pF @ 25 V
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APT1001R6BFLLG APT1001R6BFLLG Microchip Technology Description: MOSFET N-CH 1000V 8A TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 8A (Tc)
Rds On (Max) @ Id, Vgs: 1.6Ohm @ 4A, 10V
Power Dissipation (Max): 266W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: TO-247 [B]
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 55 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1320 pF @ 25 V
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APT10035LLLG APT10035LLLG Microchip Technology 123943-apt10035b2-lll-g-c-pdf Description: MOSFET N-CH 1000V 28A TO264
Packaging: Tube
Package / Case: TO-264-3, TO-264AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 28A (Tc)
Rds On (Max) @ Id, Vgs: 350mOhm @ 14A, 10V
Power Dissipation (Max): 690W (Tc)
Vgs(th) (Max) @ Id: 5V @ 2.5mA
Supplier Device Package: TO-264 [L]
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 186 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5185 pF @ 25 V
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APT10035LFLLG APT10035LFLLG Microchip Technology 6545-apt10035b2fllg-apt10035lfllg-datasheet Description: MOSFET N-CH 1000V 28A TO264
Packaging: Tube
Package / Case: TO-264-3, TO-264AA
Mounting Type: Through Hole
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 28A (Tc)
Rds On (Max) @ Id, Vgs: 370mOhm @ 14A, 10V
Vgs(th) (Max) @ Id: 5V @ 2.5mA
Supplier Device Package: TO-264 [L]
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 186 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5185 pF @ 25 V
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APT10035B2FLLG APT10035B2FLLG Microchip Technology 6545-apt10035b2fllg-apt10035lfllg-datasheet Description: MOSFET N-CH 1000V 28A T-MAX
Packaging: Tube
Package / Case: TO-247-3 Variant
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 28A (Tc)
Rds On (Max) @ Id, Vgs: 370mOhm @ 14A, 10V
Power Dissipation (Max): 690W (Tc)
Vgs(th) (Max) @ Id: 5V @ 2.5mA
Supplier Device Package: T-MAX™ [B2]
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 186 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5185 pF @ 25 V
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APT10035JFLL APT10035JFLL Microchip Technology 6546-apt10035jfll-datasheet Description: MOSFET N-CH 1000V 25A ISOTOP
Packaging: Tube
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 25A (Tc)
Rds On (Max) @ Id, Vgs: 370mOhm @ 14A, 10V
Power Dissipation (Max): 520W (Tc)
Vgs(th) (Max) @ Id: 5V @ 2.5mA
Supplier Device Package: ISOTOP®
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 186 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5185 pF @ 25 V
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MIC812TUY-TR MIC812TUY-TR Microchip Technology mic811.pdf Description: IC SUPERVISOR 1 CHANNEL SOT143
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Reset: Active High
Operating Temperature: -40°C ~ 85°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 140ms Minimum
Voltage - Threshold: 3.08V
Supplier Device Package: SOT-143
DigiKey Programmable: Not Verified
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MIC812TUY-TR MIC812TUY-TR Microchip Technology mic811.pdf Description: IC SUPERVISOR 1 CHANNEL SOT143
Packaging: Cut Tape (CT)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Reset: Active High
Operating Temperature: -40°C ~ 85°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 140ms Minimum
Voltage - Threshold: 3.08V
Supplier Device Package: SOT-143
DigiKey Programmable: Not Verified
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JANTX1N5623US JANTX1N5623US Microchip Technology SD47A%2C+1N5615US+thru+1N5623US%2C+MIL-PRF-19500-429.pdf Description: DIODE STANDARD 1000V 1A D5A
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 500 ns
Technology: Standard
Capacitance @ Vr, F: 15pF @ 12V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: D-5A
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 1000 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 3 A
Current - Reverse Leakage @ Vr: 500 nA @ 1000 V
Qualification: MIL-PRF-19500/429
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MCP47CVB28-20E/ST MCP47CVB28-20E/ST Microchip Technology MCP47CXBXX-Data-Sheet-DS20006089B.pdf Description: IC DAC 12BIT V-OUT 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 12
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 8
INL/DNL (LSB): -, ±1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP47CVB18-20E/ST MCP47CVB18-20E/ST Microchip Technology MCP47CXBXX-Data-Sheet-DS20006089B.pdf Description: IC DAC 10BIT V-OUT 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 10
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 8
INL/DNL (LSB): ±0.25, ±0.25
Differential Output: No
DigiKey Programmable: Not Verified
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MCP48CVB28-20E/ST MCP48CVB28-20E/ST Microchip Technology MCP48CxBx4_8_2021.pdf Description: IC DAC 12BIT V-OUT 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 12
Data Interface: SPI
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 8
INL/DNL (LSB): -, ±1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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UPS560e3/TR13 UPS560e3/TR13 Microchip Technology UPS560e3.pdf Description: DIODE SCHOTTKY 60V 5A POWERMITE3
Packaging: Tape & Reel (TR)
Package / Case: Powermite®3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 150pF @ 4V, 1MHz
Current - Average Rectified (Io): 5A
Supplier Device Package: Powermite 3
Operating Temperature - Junction: -55°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 690 mV @ 5 A
Current - Reverse Leakage @ Vr: 200 µA @ 60 V
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UPS560e3/TR13 UPS560e3/TR13 Microchip Technology UPS560e3.pdf Description: DIODE SCHOTTKY 60V 5A POWERMITE3
Packaging: Cut Tape (CT)
Package / Case: Powermite®3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 150pF @ 4V, 1MHz
Current - Average Rectified (Io): 5A
Supplier Device Package: Powermite 3
Operating Temperature - Junction: -55°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 690 mV @ 5 A
Current - Reverse Leakage @ Vr: 200 µA @ 60 V
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SST39SF020A-70-4I-NHE-T SST39SF020A-70-4I-NHE-T Microchip Technology SST39SF010A-SST39SF020A-SST39SF040-Data-Sheet-DS20005022.pdf Description: IC FLASH 2MBIT PARALLEL 32PLCC
Packaging: Tape & Reel (TR)
Package / Case: 32-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Supplier Device Package: 32-PLCC (11.43x13.97)
Write Cycle Time - Word, Page: 20µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
DigiKey Programmable: Verified
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SST39SF020A-70-4I-NHE-T SST39SF020A-70-4I-NHE-T Microchip Technology SST39SF010A-SST39SF020A-SST39SF040-Data-Sheet-DS20005022.pdf Description: IC FLASH 2MBIT PARALLEL 32PLCC
Packaging: Cut Tape (CT)
Package / Case: 32-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Supplier Device Package: 32-PLCC (11.43x13.97)
Write Cycle Time - Word, Page: 20µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
DigiKey Programmable: Verified
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SST39SF020A-55-4C-TU Microchip Technology Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 256K x 8
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SST39SF020A-55-4I-TU Microchip Technology Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 256K x 8
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SST39SF020A-70-4C-TU Microchip Technology Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
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SST39SF020A-70-4I-TU Microchip Technology Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
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SST39SF020A-70-4C-TU-T Microchip Technology Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
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SST39SF020A-55-4C-TU-T Microchip Technology Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-55-4I-TU-T Microchip Technology Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-70-4I-TU-T Microchip Technology Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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1N6147AUS/TR 1N6147AUS/TR Microchip Technology 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet Description: TVS DIODE 12.2VWM 22.3VC SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 67.3A
Voltage - Reverse Standoff (Typ): 12.2V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 15.2V
Voltage - Clamping (Max) @ Ipp: 22.3V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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1N6147AUS/TR 1N6147AUS/TR Microchip Technology 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet Description: TVS DIODE 12.2VWM 22.3VC SQMELF
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 67.3A
Voltage - Reverse Standoff (Typ): 12.2V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 15.2V
Voltage - Clamping (Max) @ Ipp: 22.3V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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CDLL4926 CDLL4926 Microchip Technology 8393-cdll4916-4932a-datasheet Description: DIODE ZENER 19.2V 500MW DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
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CDLL4926/TR CDLL4926/TR Microchip Technology 8393-cdll4916-4932a-datasheet Description: DIODE ZENER 19.2V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 100°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
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CDLL4926A CDLL4926A Microchip Technology 8393-cdll4916-4932a-datasheet Description: DIODE ZENER 19.2V 500MW DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
Produkt ist nicht verfügbar
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CDLL4926A/TR CDLL4926A/TR Microchip Technology 8393-cdll4916-4932a-datasheet Description: DIODE ZENER 19.2V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 100°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
Produkt ist nicht verfügbar
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CDLL4925A/TR CDLL4925A/TR Microchip Technology 8393-cdll4916-4932a-datasheet Description: DIODE ZENER 19.2V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 100°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
Produkt ist nicht verfügbar
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CDLL4925/TR CDLL4925/TR Microchip Technology 8393-cdll4916-4932a-datasheet Description: DIODE ZENER 19.2V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 100°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
Produkt ist nicht verfügbar
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DSC1001CI2-050.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CI2-050.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 50.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
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DSC1001CI2-001.9521 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CI2-001.9521
Hersteller: Microchip Technology
Description: MEMS OSC XO 1.9521MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 1.9521 MHz
Base Resonator: MEMS
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DSC1001CL2-025.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CL2-025.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC1001BI2-007.3728 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BI2-007.3728
Hersteller: Microchip Technology
Description: MEMS OSC XO 7.3728MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 7.3728 MHz
Base Resonator: MEMS
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DSC1001BI2-008.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BI2-008.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 8.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC1001CI2-011.0592T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CI2-011.0592T
Hersteller: Microchip Technology
Description: MEMS OSC XO 11.0592MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 11.0592 MHz
Base Resonator: MEMS
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DSC1001CI2-024.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CI2-024.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC1001CI2-012.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CI2-012.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC1001BI2-125.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BI2-125.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 125.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
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DSC1121BI2-156.2500 DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1121BI2-156.2500
Hersteller: Microchip Technology
Description: MEMS OSC XO 156.2500MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-CDFN (5x3.2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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2N2222AUB 2N2221A%2C%202N2222A.pdf
2N2222AUB
Hersteller: Microchip Technology
Description: TRANS NPN 50V 0.8A UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
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3+8.75 EUR
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24CSM01T-E/ST 24CSM01-1-Mbit-3.4MHz-I2C-Serial-EEPROM-DS20006781.pdf
24CSM01T-E/ST
Hersteller: Microchip Technology
Description: IC EEPROM 1MBIT I2C 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 70 ns
Memory Organization: 128K x 8
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24CSM01T-E/ST 24CSM01-1-Mbit-3.4MHz-I2C-Serial-EEPROM-DS20006781.pdf
24CSM01T-E/ST
Hersteller: Microchip Technology
Description: IC EEPROM 1MBIT I2C 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 70 ns
Memory Organization: 128K x 8
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VXB2-1D6-16M0000000 1243751-vxb1-vxb2
Hersteller: Microchip Technology
Description: VXB2-1D6-16M0000000
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIC3003GML-TR mic3003.pdf
MIC3003GML-TR
Hersteller: Microchip Technology
Description: IC LASER CTRLR 10GBPS 3.6V 24MLF
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad, 24-MLF®
Mounting Type: Surface Mount
Type: Laser Diode Controller (Fiber Optic)
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3V ~ 3.6V
Data Rate: 10Gbps
Supplier Device Package: 24-MLF® (4x4)
Number of Channels: 1
Current - Supply: 2.3 mA
Produkt ist nicht verfügbar
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1N1186R 8540-coe-18-datasheet
Hersteller: Microchip Technology
Description: DIODE STD REV 200V 35A DO203AB
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-203AB (DO-5)
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 110 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Produkt ist nicht verfügbar
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JAN1N1186R 8951-lds-0138-pdf
Hersteller: Microchip Technology
Description: DIODE STANDARD REV 200V 35A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Chassis, Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-5
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 110 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Qualification: MIL-PRF-19500/297
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JANTX1N1186R 8951-lds-0138-datasheet
Hersteller: Microchip Technology
Description: DIODE STD REV 200V 35A DO203AB
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-203AB (DO-5)
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 110 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Qualification: MIL-PRF-19500/297
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JANTXV1N1186R 8951-lds-0138-pdf
Hersteller: Microchip Technology
Description: DIODE STANDARD REV 200V 35A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Chassis, Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-5
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 110 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
Qualification: MIL-PRF-19500/297
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ATMEGA16-16AUR 2466S.pdf
ATMEGA16-16AUR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 44TQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
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ATMEGA16-16AUR 2466S.pdf
ATMEGA16-16AUR
Hersteller: Microchip Technology
Description: IC MCU 8BIT 16KB FLASH 44TQFP
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 32
DigiKey Programmable: Not Verified
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2+9.06 EUR
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1N2128A S%2CR35.pdf
Hersteller: Microchip Technology
Description: DIODE STANDARD 50V 70A DO5
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 70A
Supplier Device Package: DO-5 (DO-203AB)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 A
Current - Reverse Leakage @ Vr: 25 µA @ 50 V
Produkt ist nicht verfügbar
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ATMEGA48V-10PI ATmega48_88_168%20Preliminary%20Complete.pdf
ATMEGA48V-10PI
Hersteller: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 10MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-PDIP
Number of I/O: 23
DigiKey Programmable: Not Verified
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M5KP24A rf01010_rb.pdf
M5KP24A
Hersteller: Microchip Technology
Description: TVS DIODE 24VWM 38.9VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 128A
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 38.9V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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AVR32SD20-I/SS AVR32SD20-28-32-Data-Sheet-DS40002629.pdf
AVR32SD20-I/SS
Hersteller: Microchip Technology
Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 15
Mounting Type: Surface Mount
Data Converters: A/D 13x10b; D/A 1x10b
Core Size: 8-Bit
auf Bestellung 631 Stücke:
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10+1.92 EUR
25+1.77 EUR
100+1.6 EUR
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APT100GN60LDQ4G APT100GN60LDQ4(G)_A.pdf
APT100GN60LDQ4G
Hersteller: Microchip Technology
Description: IGBT TRENCH FS 600V 229A TO264
Packaging: Tube
Package / Case: TO-264-3, TO-264AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 1.85V @ 15V, 100A
Supplier Device Package: TO-264 [L]
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 31ns/310ns
Switching Energy: 4.75mJ (on), 2.675mJ (off)
Test Condition: 400V, 100A, 1Ohm, 15V
Gate Charge: 600 nC
Current - Collector (Ic) (Max): 229 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 300 A
Power - Max: 625 W
auf Bestellung 25 Stücke:
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APT100GN120B2G High-Voltage-Power-Discretes-and-Modules-Brochure-00003052.pdf
APT100GN120B2G
Hersteller: Microchip Technology
Description: IGBT TRENCH FIELD STP 1200V 245A
Packaging: Tube
Package / Case: TO-247-3 Variant
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 100A
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 50ns/615ns
Switching Energy: 11mJ (on), 9.5mJ (off)
Test Condition: 800V, 100A, 1Ohm, 15V
Gate Charge: 540 nC
Current - Collector (Ic) (Max): 245 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Pulsed (Icm): 300 A
Power - Max: 960 W
auf Bestellung 28 Stücke:
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APT100GN60B2G APT100GN60B2(G)_A.pdf
APT100GN60B2G
Hersteller: Microchip Technology
Description: IGBT TRENCH FIELD STOP 600V 229A
Packaging: Tube
Package / Case: TO-247-3 Variant
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 1.85V @ 15V, 100A
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 31ns/310ns
Switching Energy: 4.7mJ (on), 2.675mJ (off)
Test Condition: 400V, 100A, 1Ohm, 15V
Gate Charge: 600 nC
Current - Collector (Ic) (Max): 229 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 300 A
Power - Max: 625 W
Produkt ist nicht verfügbar
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APT10090SLLG 6553-apt10090bllg-apt10090sllg-datasheet
APT10090SLLG
Hersteller: Microchip Technology
Description: MOSFET N-CH 1000V 12A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 12A (Tc)
Rds On (Max) @ Id, Vgs: 900mOhm @ 6A, 10V
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 71 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1969 pF @ 25 V
Produkt ist nicht verfügbar
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APT1001R6BFLLG
APT1001R6BFLLG
Hersteller: Microchip Technology
Description: MOSFET N-CH 1000V 8A TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 8A (Tc)
Rds On (Max) @ Id, Vgs: 1.6Ohm @ 4A, 10V
Power Dissipation (Max): 266W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: TO-247 [B]
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 55 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1320 pF @ 25 V
Produkt ist nicht verfügbar
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APT10035LLLG 123943-apt10035b2-lll-g-c-pdf
APT10035LLLG
Hersteller: Microchip Technology
Description: MOSFET N-CH 1000V 28A TO264
Packaging: Tube
Package / Case: TO-264-3, TO-264AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 28A (Tc)
Rds On (Max) @ Id, Vgs: 350mOhm @ 14A, 10V
Power Dissipation (Max): 690W (Tc)
Vgs(th) (Max) @ Id: 5V @ 2.5mA
Supplier Device Package: TO-264 [L]
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 186 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5185 pF @ 25 V
Produkt ist nicht verfügbar
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APT10035LFLLG 6545-apt10035b2fllg-apt10035lfllg-datasheet
APT10035LFLLG
Hersteller: Microchip Technology
Description: MOSFET N-CH 1000V 28A TO264
Packaging: Tube
Package / Case: TO-264-3, TO-264AA
Mounting Type: Through Hole
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 28A (Tc)
Rds On (Max) @ Id, Vgs: 370mOhm @ 14A, 10V
Vgs(th) (Max) @ Id: 5V @ 2.5mA
Supplier Device Package: TO-264 [L]
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 186 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5185 pF @ 25 V
Produkt ist nicht verfügbar
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APT10035B2FLLG 6545-apt10035b2fllg-apt10035lfllg-datasheet
APT10035B2FLLG
Hersteller: Microchip Technology
Description: MOSFET N-CH 1000V 28A T-MAX
Packaging: Tube
Package / Case: TO-247-3 Variant
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 28A (Tc)
Rds On (Max) @ Id, Vgs: 370mOhm @ 14A, 10V
Power Dissipation (Max): 690W (Tc)
Vgs(th) (Max) @ Id: 5V @ 2.5mA
Supplier Device Package: T-MAX™ [B2]
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 186 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5185 pF @ 25 V
Produkt ist nicht verfügbar
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APT10035JFLL 6546-apt10035jfll-datasheet
APT10035JFLL
Hersteller: Microchip Technology
Description: MOSFET N-CH 1000V 25A ISOTOP
Packaging: Tube
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 25A (Tc)
Rds On (Max) @ Id, Vgs: 370mOhm @ 14A, 10V
Power Dissipation (Max): 520W (Tc)
Vgs(th) (Max) @ Id: 5V @ 2.5mA
Supplier Device Package: ISOTOP®
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 186 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5185 pF @ 25 V
Produkt ist nicht verfügbar
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MIC812TUY-TR mic811.pdf
MIC812TUY-TR
Hersteller: Microchip Technology
Description: IC SUPERVISOR 1 CHANNEL SOT143
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Reset: Active High
Operating Temperature: -40°C ~ 85°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 140ms Minimum
Voltage - Threshold: 3.08V
Supplier Device Package: SOT-143
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIC812TUY-TR mic811.pdf
MIC812TUY-TR
Hersteller: Microchip Technology
Description: IC SUPERVISOR 1 CHANNEL SOT143
Packaging: Cut Tape (CT)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Reset: Active High
Operating Temperature: -40°C ~ 85°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 140ms Minimum
Voltage - Threshold: 3.08V
Supplier Device Package: SOT-143
DigiKey Programmable: Not Verified
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Anzahl Preis
20+0.9 EUR
25+0.76 EUR
100+0.69 EUR
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JANTX1N5623US SD47A%2C+1N5615US+thru+1N5623US%2C+MIL-PRF-19500-429.pdf
JANTX1N5623US
Hersteller: Microchip Technology
Description: DIODE STANDARD 1000V 1A D5A
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 500 ns
Technology: Standard
Capacitance @ Vr, F: 15pF @ 12V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: D-5A
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 1000 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 3 A
Current - Reverse Leakage @ Vr: 500 nA @ 1000 V
Qualification: MIL-PRF-19500/429
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Anzahl Preis
2+14.13 EUR
100+13.12 EUR
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MCP47CVB28-20E/ST MCP47CXBXX-Data-Sheet-DS20006089B.pdf
MCP47CVB28-20E/ST
Hersteller: Microchip Technology
Description: IC DAC 12BIT V-OUT 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 12
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 8
INL/DNL (LSB): -, ±1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP47CVB18-20E/ST MCP47CXBXX-Data-Sheet-DS20006089B.pdf
MCP47CVB18-20E/ST
Hersteller: Microchip Technology
Description: IC DAC 10BIT V-OUT 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 10
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 8
INL/DNL (LSB): ±0.25, ±0.25
Differential Output: No
DigiKey Programmable: Not Verified
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1+18.9 EUR
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MCP48CVB28-20E/ST MCP48CxBx4_8_2021.pdf
MCP48CVB28-20E/ST
Hersteller: Microchip Technology
Description: IC DAC 12BIT V-OUT 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 12
Data Interface: SPI
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 8
INL/DNL (LSB): -, ±1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
auf Bestellung 54 Stücke:
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Anzahl Preis
1+20.42 EUR
25+17.01 EUR
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UPS560e3/TR13 UPS560e3.pdf
UPS560e3/TR13
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 60V 5A POWERMITE3
Packaging: Tape & Reel (TR)
Package / Case: Powermite®3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 150pF @ 4V, 1MHz
Current - Average Rectified (Io): 5A
Supplier Device Package: Powermite 3
Operating Temperature - Junction: -55°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 690 mV @ 5 A
Current - Reverse Leakage @ Vr: 200 µA @ 60 V
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5000+0.82 EUR
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UPS560e3/TR13 UPS560e3.pdf
UPS560e3/TR13
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 60V 5A POWERMITE3
Packaging: Cut Tape (CT)
Package / Case: Powermite®3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 150pF @ 4V, 1MHz
Current - Average Rectified (Io): 5A
Supplier Device Package: Powermite 3
Operating Temperature - Junction: -55°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 690 mV @ 5 A
Current - Reverse Leakage @ Vr: 200 µA @ 60 V
auf Bestellung 53267 Stücke:
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Anzahl Preis
19+0.95 EUR
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SST39SF020A-70-4I-NHE-T SST39SF010A-SST39SF020A-SST39SF040-Data-Sheet-DS20005022.pdf
SST39SF020A-70-4I-NHE-T
Hersteller: Microchip Technology
Description: IC FLASH 2MBIT PARALLEL 32PLCC
Packaging: Tape & Reel (TR)
Package / Case: 32-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Supplier Device Package: 32-PLCC (11.43x13.97)
Write Cycle Time - Word, Page: 20µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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SST39SF020A-70-4I-NHE-T SST39SF010A-SST39SF020A-SST39SF040-Data-Sheet-DS20005022.pdf
SST39SF020A-70-4I-NHE-T
Hersteller: Microchip Technology
Description: IC FLASH 2MBIT PARALLEL 32PLCC
Packaging: Cut Tape (CT)
Package / Case: 32-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Supplier Device Package: 32-PLCC (11.43x13.97)
Write Cycle Time - Word, Page: 20µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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SST39SF020A-55-4C-TU
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-55-4I-TU
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-70-4C-TU
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-70-4I-TU
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-70-4C-TU-T
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-55-4C-TU-T
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-55-4I-TU-T
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-70-4I-TU-T
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
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1N6147AUS/TR 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet
1N6147AUS/TR
Hersteller: Microchip Technology
Description: TVS DIODE 12.2VWM 22.3VC SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 67.3A
Voltage - Reverse Standoff (Typ): 12.2V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 15.2V
Voltage - Clamping (Max) @ Ipp: 22.3V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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1N6147AUS/TR 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet
1N6147AUS/TR
Hersteller: Microchip Technology
Description: TVS DIODE 12.2VWM 22.3VC SQMELF
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 67.3A
Voltage - Reverse Standoff (Typ): 12.2V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 15.2V
Voltage - Clamping (Max) @ Ipp: 22.3V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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CDLL4926 8393-cdll4916-4932a-datasheet
CDLL4926
Hersteller: Microchip Technology
Description: DIODE ZENER 19.2V 500MW DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
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CDLL4926/TR 8393-cdll4916-4932a-datasheet
CDLL4926/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 19.2V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 100°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
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CDLL4926A 8393-cdll4916-4932a-datasheet
CDLL4926A
Hersteller: Microchip Technology
Description: DIODE ZENER 19.2V 500MW DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
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CDLL4926A/TR 8393-cdll4916-4932a-datasheet
CDLL4926A/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 19.2V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 100°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
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CDLL4925A/TR 8393-cdll4916-4932a-datasheet
CDLL4925A/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 19.2V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 100°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
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CDLL4925/TR 8393-cdll4916-4932a-datasheet
CDLL4925/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 19.2V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 100°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
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