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MIC812TUY-TR MIC812TUY-TR Microchip Technology mic811.pdf Description: IC SUPERVISOR 1 CHANNEL SOT143
Packaging: Cut Tape (CT)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Reset: Active High
Operating Temperature: -40°C ~ 85°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 140ms Minimum
Voltage - Threshold: 3.08V
Supplier Device Package: SOT-143
DigiKey Programmable: Not Verified
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25+0.76 EUR
100+0.69 EUR
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JANTX1N5623US JANTX1N5623US Microchip Technology SD47A%2C+1N5615US+thru+1N5623US%2C+MIL-PRF-19500-429.pdf Description: DIODE STANDARD 1000V 1A D5A
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 500 ns
Technology: Standard
Capacitance @ Vr, F: 15pF @ 12V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: D-5A
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 1000 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 3 A
Current - Reverse Leakage @ Vr: 500 nA @ 1000 V
Qualification: MIL-PRF-19500/429
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MCP47CVB28-20E/ST MCP47CVB28-20E/ST Microchip Technology MCP47CXBXX-Data-Sheet-DS20006089B.pdf Description: IC DAC 12BIT V-OUT 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 12
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 8
INL/DNL (LSB): -, ±1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP47CVB18-20E/ST MCP47CVB18-20E/ST Microchip Technology MCP47CXBXX-Data-Sheet-DS20006089B.pdf Description: IC DAC 10BIT V-OUT 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 10
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 8
INL/DNL (LSB): ±0.25, ±0.25
Differential Output: No
DigiKey Programmable: Not Verified
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MCP48CVB28-20E/ST MCP48CVB28-20E/ST Microchip Technology MCP48CxBx4_8_2021.pdf Description: IC DAC 12BIT V-OUT 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 12
Data Interface: SPI
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 8
INL/DNL (LSB): -, ±1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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UPS560e3/TR13 UPS560e3/TR13 Microchip Technology UPS560e3.pdf Description: DIODE SCHOTTKY 60V 5A POWERMITE3
Packaging: Tape & Reel (TR)
Package / Case: Powermite®3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 150pF @ 4V, 1MHz
Current - Average Rectified (Io): 5A
Supplier Device Package: Powermite 3
Operating Temperature - Junction: -55°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 690 mV @ 5 A
Current - Reverse Leakage @ Vr: 200 µA @ 60 V
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UPS560e3/TR13 UPS560e3/TR13 Microchip Technology UPS560e3.pdf Description: DIODE SCHOTTKY 60V 5A POWERMITE3
Packaging: Cut Tape (CT)
Package / Case: Powermite®3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 150pF @ 4V, 1MHz
Current - Average Rectified (Io): 5A
Supplier Device Package: Powermite 3
Operating Temperature - Junction: -55°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 690 mV @ 5 A
Current - Reverse Leakage @ Vr: 200 µA @ 60 V
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SST39SF020A-70-4I-NHE-T SST39SF020A-70-4I-NHE-T Microchip Technology SST39SF010A-SST39SF020A-SST39SF040-Data-Sheet-DS20005022.pdf Description: IC FLASH 2MBIT PARALLEL 32PLCC
Packaging: Tape & Reel (TR)
Package / Case: 32-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Supplier Device Package: 32-PLCC (11.43x13.97)
Write Cycle Time - Word, Page: 20µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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SST39SF020A-70-4I-NHE-T SST39SF020A-70-4I-NHE-T Microchip Technology SST39SF010A-SST39SF020A-SST39SF040-Data-Sheet-DS20005022.pdf Description: IC FLASH 2MBIT PARALLEL 32PLCC
Packaging: Cut Tape (CT)
Package / Case: 32-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Supplier Device Package: 32-PLCC (11.43x13.97)
Write Cycle Time - Word, Page: 20µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
DigiKey Programmable: Verified
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SST39SF020A-55-4C-TU Microchip Technology Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 256K x 8
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SST39SF020A-55-4I-TU Microchip Technology Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 256K x 8
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SST39SF020A-70-4C-TU Microchip Technology Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-70-4I-TU Microchip Technology Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-70-4C-TU-T Microchip Technology Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-55-4C-TU-T Microchip Technology Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-55-4I-TU-T Microchip Technology Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-70-4I-TU-T Microchip Technology Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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1N6147AUS/TR 1N6147AUS/TR Microchip Technology 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet Description: TVS DIODE 12.2VWM 22.3VC SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 67.3A
Voltage - Reverse Standoff (Typ): 12.2V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 15.2V
Voltage - Clamping (Max) @ Ipp: 22.3V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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1N6147AUS/TR 1N6147AUS/TR Microchip Technology 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet Description: TVS DIODE 12.2VWM 22.3VC SQMELF
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 67.3A
Voltage - Reverse Standoff (Typ): 12.2V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 15.2V
Voltage - Clamping (Max) @ Ipp: 22.3V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
auf Bestellung 218 Stücke:
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CDLL4926 CDLL4926 Microchip Technology 8393-cdll4916-4932a-datasheet Description: DIODE ZENER 19.2V 500MW DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
Produkt ist nicht verfügbar
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CDLL4926/TR CDLL4926/TR Microchip Technology 8393-cdll4916-4932a-datasheet Description: DIODE ZENER 19.2V 500MW DO213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 100°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
Produkt ist nicht verfügbar
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CDLL4926A CDLL4926A Microchip Technology 8393-cdll4916-4932a-datasheet Description: DIODE ZENER 19.2V 500MW DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
Produkt ist nicht verfügbar
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CDLL4926A/TR CDLL4926A/TR Microchip Technology 8393-cdll4916-4932a-datasheet Description: DIODE ZENER 19.2V 500MW DO213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 100°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
Produkt ist nicht verfügbar
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CDLL4925A/TR CDLL4925A/TR Microchip Technology 8393-cdll4916-4932a-datasheet Description: DIODE ZENER 19.2V 500MW DO213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 100°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
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CDLL4925/TR CDLL4925/TR Microchip Technology 8393-cdll4916-4932a-datasheet Description: DIODE ZENER 19.2V 500MW DO213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 100°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
Produkt ist nicht verfügbar
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EV97L33A EV97L33A Microchip Technology PAC1942-2-Evaluation-Board-User-Guide-DS50003277.pdf Description: EVAL BOARD FOR PAC1942
Packaging: Bulk
Function: Energy/Power Monitor
Type: Power Management
Contents: Board(s)
Utilized IC / Part: PAC1942
Primary Attributes: 2-Channel (Dual)
Embedded: No
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EV99K19A EV99K19A Microchip Technology 50003272A-PAC1952-2-Evaluation-Board-User-Guide-DS50003272.pdf Description: EVAL BOARD FOR PAC1952
Packaging: Bulk
Function: Energy/Power Monitor
Type: Power Management
Contents: Board(s)
Utilized IC / Part: PAC1952
Primary Attributes: 2-Channel (Dual)
Embedded: No
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PAC1942T-2E/4MX PAC1942T-2E/4MX Microchip Technology Description: IC CURRENT/VOLT MON 1% 16VQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Sensing Method: Low-Side
Mounting Type: Surface Mount, Wettable Flank
Function: Current/Voltage Monitor
Voltage - Input: 2.7V ~ 5.5V
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 16-VQFN (3x3)
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PAC1942T-2E/4MX PAC1942T-2E/4MX Microchip Technology Description: IC CURRENT/VOLT MON 1% 16VQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Sensing Method: Low-Side
Mounting Type: Surface Mount, Wettable Flank
Function: Current/Voltage Monitor
Voltage - Input: 2.7V ~ 5.5V
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 16-VQFN (3x3)
Produkt ist nicht verfügbar
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PAC1934-I/JQ PAC1934-I/JQ Microchip Technology PAC1931-Family-Data-Sheet-DS20005850E.pdf Description: IC CURRENT MONITOR 1% 16UQFN
Packaging: Tube
Package / Case: 16-UQFN Exposed Pad
Sensing Method: High-Side
Mounting Type: Surface Mount
Function: Current Monitor
Voltage - Input: 2.7V ~ 5.5V
Accuracy: ±1%
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 16-UQFN (4x4)
Produkt ist nicht verfügbar
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PAC1952T-1E/4MXVAO PAC1952T-1E/4MXVAO Microchip Technology PAC195X-Family-Data-Sheet-DS20006539.pdf Description: IC CURRENT/VOLT MON 1% 16VQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Sensing Method: High-Side
Mounting Type: Surface Mount, Wettable Flank
Function: Current/Voltage Monitor
Voltage - Input: 2.7V ~ 5.5V
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 16-VQFN (3x3)
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PAC1953T-E/4MXVAO PAC1953T-E/4MXVAO Microchip Technology PAC195X-Family-Data-Sheet-DS20006539.pdf Description: IC CURRENT MONITOR 1% 16VQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Sensing Method: High-Side
Mounting Type: Surface Mount, Wettable Flank
Function: Current Monitor
Voltage - Input: 2.7V ~ 5.5V
Current - Output: 100mA
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 16-VQFN (3x3)
Produkt ist nicht verfügbar
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AT89LP4052-16XU AT89LP4052-16XU Microchip Technology doc3547.pdf Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PAC1942T-2E/4MXVAO PAC1942T-2E/4MXVAO Microchip Technology PAC194X-Family-Data-Sheet-DS20006543.pdf Description: IC CURRENT MONITOR 1% 16VQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Sensing Method: Low-Side
Mounting Type: Surface Mount, Wettable Flank
Function: Current Monitor
Voltage - Input: 2.7V ~ 5.5V
Current - Output: 100mA
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 16-VQFN (3x3)
Produkt ist nicht verfügbar
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PAC1942T-1E/4MXVAO PAC1942T-1E/4MXVAO Microchip Technology PAC194X-Family-Data-Sheet-DS20006543.pdf Description: IC CURRENT MONITOR 1% 16VQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Sensing Method: High-Side
Mounting Type: Surface Mount, Wettable Flank
Function: Current Monitor
Voltage - Input: 2.7V ~ 5.5V
Current - Output: 100mA
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 16-VQFN (3x3)
Produkt ist nicht verfügbar
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DSC1001CL5-012.8000 DSC1001CL5-012.8000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 12.8000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.8 MHz
Base Resonator: MEMS
auf Bestellung 390 Stücke:
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EV24J15A Microchip Technology Description: DEV TOOL FOR ICP0349PP7-1-300I
Packaging: Bulk
Frequency: 2.7GHz ~ 3.5GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: ICP0349PP7
Produkt ist nicht verfügbar
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DSC1001DC1-025.0000T DSC1001DC1-025.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: 0°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1004DC1-020.0000T DSC1004DC1-020.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: 0°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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LAN9646-I/MXX LAN9646-I/MXX Microchip Technology LAN9646-Data-Sheet-DS00005175.pdf Description: 6-PORT GIGE MANAGED SWITCH WITH
Packaging: Tray
Package / Case: 132-VFQFN Dual Rows, Exposed Pad
Function: Switch
Interface: I2C, MII, RGMII, RMII, SGMII, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.26V, 2.375V ~ 2.625V
Current - Supply: 680mA (Typ)
Protocol: Ethernet
Standards: IEEE 802.3, 10/100/1000 Base-T/TX PHY
Supplier Device Package: 132-DRQFN (11x11)
auf Bestellung 157 Stücke:
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100+19 EUR
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24CS128T-E/OT66KVAO 24CS128T-E/OT66KVAO Microchip Technology Description: 128KB SPI EEPROM, 8-MSOP T&R, 12
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Memory Size: 128Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: SOT-23-5
Grade: Automotive
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 400 ns
Memory Organization: 16K x 8
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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DSC6001CI2B-016.0000T DSC6001CI2B-016.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSCILLATOR, ULTRA LOW POWER
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-025.0000T DSC6001CI2B-025.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-008.1920T DSC6001CI2B-008.1920T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8.192 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-032K768T DSC6001CI2B-032K768T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-040.0000T DSC6001CI2B-040.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 40 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-025.0000 DSC6001CI2B-025.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-008.1920 DSC6001CI2B-008.1920 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 8.1920MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8.192 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-032K768 DSC6001CI2B-032K768 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 32.7680KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-040.0000 DSC6001CI2B-040.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 40.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 40 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-004.0000 DSC6001CI2B-004.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSC SO
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-012.0000 DSC6001CI2B-012.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSC SO
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-004.0000T DSC6001CI2B-004.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSC SO
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-012.0000T DSC6001CI2B-012.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSC SO
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-100K000T DSC6001CI2B-100K000T Microchip Technology Description: OSCILLATOR MEMS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-100K000 DSC6001CI2B-100K000 Microchip Technology Description: OSCILLATOR MEMS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-016.0000 DSC6001CI2B-016.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001CC1-125.0000T DSC1001CC1-125.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 125.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: 0°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001CC1-125.0000 DSC1001CC1-125.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 125.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: 0°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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BZV55C10 BZV55C10 Microchip Technology 150_8298-bzv55-c2v4-c75-pdf.pdf Description: DIODE ZENER 10V DO213AA
Tolerance: ±6%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 10 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 200 nA @ 7 V
auf Bestellung 143 Stücke:
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3+6.42 EUR
100+5.96 EUR
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MIC812TUY-TR mic811.pdf
MIC812TUY-TR
Hersteller: Microchip Technology
Description: IC SUPERVISOR 1 CHANNEL SOT143
Packaging: Cut Tape (CT)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Reset: Active High
Operating Temperature: -40°C ~ 85°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 140ms Minimum
Voltage - Threshold: 3.08V
Supplier Device Package: SOT-143
DigiKey Programmable: Not Verified
auf Bestellung 870 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
20+0.9 EUR
25+0.76 EUR
100+0.69 EUR
Mindestbestellmenge: 20
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JANTX1N5623US SD47A%2C+1N5615US+thru+1N5623US%2C+MIL-PRF-19500-429.pdf
JANTX1N5623US
Hersteller: Microchip Technology
Description: DIODE STANDARD 1000V 1A D5A
Packaging: Bulk
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 500 ns
Technology: Standard
Capacitance @ Vr, F: 15pF @ 12V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: D-5A
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 1000 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 3 A
Current - Reverse Leakage @ Vr: 500 nA @ 1000 V
Qualification: MIL-PRF-19500/429
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Anzahl Preis
2+14.13 EUR
100+13.12 EUR
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MCP47CVB28-20E/ST MCP47CXBXX-Data-Sheet-DS20006089B.pdf
MCP47CVB28-20E/ST
Hersteller: Microchip Technology
Description: IC DAC 12BIT V-OUT 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 12
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 8
INL/DNL (LSB): -, ±1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP47CVB18-20E/ST MCP47CXBXX-Data-Sheet-DS20006089B.pdf
MCP47CVB18-20E/ST
Hersteller: Microchip Technology
Description: IC DAC 10BIT V-OUT 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 10
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 8
INL/DNL (LSB): ±0.25, ±0.25
Differential Output: No
DigiKey Programmable: Not Verified
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MCP48CVB28-20E/ST MCP48CxBx4_8_2021.pdf
MCP48CVB28-20E/ST
Hersteller: Microchip Technology
Description: IC DAC 12BIT V-OUT 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 12
Data Interface: SPI
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 8
INL/DNL (LSB): -, ±1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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UPS560e3/TR13 UPS560e3.pdf
UPS560e3/TR13
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 60V 5A POWERMITE3
Packaging: Tape & Reel (TR)
Package / Case: Powermite®3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 150pF @ 4V, 1MHz
Current - Average Rectified (Io): 5A
Supplier Device Package: Powermite 3
Operating Temperature - Junction: -55°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 690 mV @ 5 A
Current - Reverse Leakage @ Vr: 200 µA @ 60 V
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UPS560e3/TR13 UPS560e3.pdf
UPS560e3/TR13
Hersteller: Microchip Technology
Description: DIODE SCHOTTKY 60V 5A POWERMITE3
Packaging: Cut Tape (CT)
Package / Case: Powermite®3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 150pF @ 4V, 1MHz
Current - Average Rectified (Io): 5A
Supplier Device Package: Powermite 3
Operating Temperature - Junction: -55°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 690 mV @ 5 A
Current - Reverse Leakage @ Vr: 200 µA @ 60 V
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SST39SF020A-70-4I-NHE-T SST39SF010A-SST39SF020A-SST39SF040-Data-Sheet-DS20005022.pdf
SST39SF020A-70-4I-NHE-T
Hersteller: Microchip Technology
Description: IC FLASH 2MBIT PARALLEL 32PLCC
Packaging: Tape & Reel (TR)
Package / Case: 32-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Supplier Device Package: 32-PLCC (11.43x13.97)
Write Cycle Time - Word, Page: 20µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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SST39SF020A-70-4I-NHE-T SST39SF010A-SST39SF020A-SST39SF040-Data-Sheet-DS20005022.pdf
SST39SF020A-70-4I-NHE-T
Hersteller: Microchip Technology
Description: IC FLASH 2MBIT PARALLEL 32PLCC
Packaging: Cut Tape (CT)
Package / Case: 32-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Supplier Device Package: 32-PLCC (11.43x13.97)
Write Cycle Time - Word, Page: 20µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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SST39SF020A-55-4C-TU
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-55-4I-TU
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-70-4C-TU
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-70-4I-TU
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-70-4C-TU-T
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-55-4C-TU-T
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-55-4I-TU-T
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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SST39SF020A-70-4I-TU-T
Hersteller: Microchip Technology
Description: 4.5V TO 5.5V 2MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
Produkt ist nicht verfügbar
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1N6147AUS/TR 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet
1N6147AUS/TR
Hersteller: Microchip Technology
Description: TVS DIODE 12.2VWM 22.3VC SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 67.3A
Voltage - Reverse Standoff (Typ): 12.2V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 15.2V
Voltage - Clamping (Max) @ Ipp: 22.3V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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1N6147AUS/TR 127854-1n6138us-1n6173aus-tvs-diode-series-datasheet
1N6147AUS/TR
Hersteller: Microchip Technology
Description: TVS DIODE 12.2VWM 22.3VC SQMELF
Packaging: Cut Tape (CT)
Package / Case: SQ-MELF, C
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 67.3A
Voltage - Reverse Standoff (Typ): 12.2V
Supplier Device Package: C, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 15.2V
Voltage - Clamping (Max) @ Ipp: 22.3V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
auf Bestellung 218 Stücke:
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CDLL4926 8393-cdll4916-4932a-datasheet
CDLL4926
Hersteller: Microchip Technology
Description: DIODE ZENER 19.2V 500MW DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
Produkt ist nicht verfügbar
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CDLL4926/TR 8393-cdll4916-4932a-datasheet
CDLL4926/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 19.2V 500MW DO213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 100°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
Produkt ist nicht verfügbar
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CDLL4926A 8393-cdll4916-4932a-datasheet
CDLL4926A
Hersteller: Microchip Technology
Description: DIODE ZENER 19.2V 500MW DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
Produkt ist nicht verfügbar
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CDLL4926A/TR 8393-cdll4916-4932a-datasheet
CDLL4926A/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 19.2V 500MW DO213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 100°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
Produkt ist nicht verfügbar
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CDLL4925A/TR 8393-cdll4916-4932a-datasheet
CDLL4925A/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 19.2V 500MW DO213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 100°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
Produkt ist nicht verfügbar
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CDLL4925/TR 8393-cdll4916-4932a-datasheet
CDLL4925/TR
Hersteller: Microchip Technology
Description: DIODE ZENER 19.2V 500MW DO213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 100°C
Voltage - Zener (Nom) (Vz): 19.2 V
Impedance (Max) (Zzt): 75 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 15 µA @ 12 V
Produkt ist nicht verfügbar
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EV97L33A PAC1942-2-Evaluation-Board-User-Guide-DS50003277.pdf
EV97L33A
Hersteller: Microchip Technology
Description: EVAL BOARD FOR PAC1942
Packaging: Bulk
Function: Energy/Power Monitor
Type: Power Management
Contents: Board(s)
Utilized IC / Part: PAC1942
Primary Attributes: 2-Channel (Dual)
Embedded: No
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Anzahl Preis
1+102.7 EUR
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EV99K19A 50003272A-PAC1952-2-Evaluation-Board-User-Guide-DS50003272.pdf
EV99K19A
Hersteller: Microchip Technology
Description: EVAL BOARD FOR PAC1952
Packaging: Bulk
Function: Energy/Power Monitor
Type: Power Management
Contents: Board(s)
Utilized IC / Part: PAC1952
Primary Attributes: 2-Channel (Dual)
Embedded: No
auf Bestellung 1 Stücke:
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Anzahl Preis
1+102.7 EUR
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PAC1942T-2E/4MX
PAC1942T-2E/4MX
Hersteller: Microchip Technology
Description: IC CURRENT/VOLT MON 1% 16VQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Sensing Method: Low-Side
Mounting Type: Surface Mount, Wettable Flank
Function: Current/Voltage Monitor
Voltage - Input: 2.7V ~ 5.5V
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 16-VQFN (3x3)
Produkt ist nicht verfügbar
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PAC1942T-2E/4MX
PAC1942T-2E/4MX
Hersteller: Microchip Technology
Description: IC CURRENT/VOLT MON 1% 16VQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Sensing Method: Low-Side
Mounting Type: Surface Mount, Wettable Flank
Function: Current/Voltage Monitor
Voltage - Input: 2.7V ~ 5.5V
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 16-VQFN (3x3)
Produkt ist nicht verfügbar
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PAC1934-I/JQ PAC1931-Family-Data-Sheet-DS20005850E.pdf
PAC1934-I/JQ
Hersteller: Microchip Technology
Description: IC CURRENT MONITOR 1% 16UQFN
Packaging: Tube
Package / Case: 16-UQFN Exposed Pad
Sensing Method: High-Side
Mounting Type: Surface Mount
Function: Current Monitor
Voltage - Input: 2.7V ~ 5.5V
Accuracy: ±1%
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 16-UQFN (4x4)
Produkt ist nicht verfügbar
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PAC1952T-1E/4MXVAO PAC195X-Family-Data-Sheet-DS20006539.pdf
PAC1952T-1E/4MXVAO
Hersteller: Microchip Technology
Description: IC CURRENT/VOLT MON 1% 16VQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Sensing Method: High-Side
Mounting Type: Surface Mount, Wettable Flank
Function: Current/Voltage Monitor
Voltage - Input: 2.7V ~ 5.5V
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 16-VQFN (3x3)
Produkt ist nicht verfügbar
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PAC1953T-E/4MXVAO PAC195X-Family-Data-Sheet-DS20006539.pdf
PAC1953T-E/4MXVAO
Hersteller: Microchip Technology
Description: IC CURRENT MONITOR 1% 16VQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Sensing Method: High-Side
Mounting Type: Surface Mount, Wettable Flank
Function: Current Monitor
Voltage - Input: 2.7V ~ 5.5V
Current - Output: 100mA
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 16-VQFN (3x3)
Produkt ist nicht verfügbar
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AT89LP4052-16XU doc3547.pdf
AT89LP4052-16XU
Hersteller: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PAC1942T-2E/4MXVAO PAC194X-Family-Data-Sheet-DS20006543.pdf
PAC1942T-2E/4MXVAO
Hersteller: Microchip Technology
Description: IC CURRENT MONITOR 1% 16VQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Sensing Method: Low-Side
Mounting Type: Surface Mount, Wettable Flank
Function: Current Monitor
Voltage - Input: 2.7V ~ 5.5V
Current - Output: 100mA
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 16-VQFN (3x3)
Produkt ist nicht verfügbar
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PAC1942T-1E/4MXVAO PAC194X-Family-Data-Sheet-DS20006543.pdf
PAC1942T-1E/4MXVAO
Hersteller: Microchip Technology
Description: IC CURRENT MONITOR 1% 16VQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Sensing Method: High-Side
Mounting Type: Surface Mount, Wettable Flank
Function: Current Monitor
Voltage - Input: 2.7V ~ 5.5V
Current - Output: 100mA
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 16-VQFN (3x3)
Produkt ist nicht verfügbar
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DSC1001CL5-012.8000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CL5-012.8000
Hersteller: Microchip Technology
Description: MEMS OSC XO 12.8000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±10ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12.8 MHz
Base Resonator: MEMS
auf Bestellung 390 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.73 EUR
10+2.68 EUR
50+2.63 EUR
Mindestbestellmenge: 7
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EV24J15A
Hersteller: Microchip Technology
Description: DEV TOOL FOR ICP0349PP7-1-300I
Packaging: Bulk
Frequency: 2.7GHz ~ 3.5GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: ICP0349PP7
Produkt ist nicht verfügbar
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DSC1001DC1-025.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DC1-025.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: 0°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1004DC1-020.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1004DC1-020.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: 0°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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LAN9646-I/MXX LAN9646-Data-Sheet-DS00005175.pdf
LAN9646-I/MXX
Hersteller: Microchip Technology
Description: 6-PORT GIGE MANAGED SWITCH WITH
Packaging: Tray
Package / Case: 132-VFQFN Dual Rows, Exposed Pad
Function: Switch
Interface: I2C, MII, RGMII, RMII, SGMII, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.26V, 2.375V ~ 2.625V
Current - Supply: 680mA (Typ)
Protocol: Ethernet
Standards: IEEE 802.3, 10/100/1000 Base-T/TX PHY
Supplier Device Package: 132-DRQFN (11x11)
auf Bestellung 157 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+23.6 EUR
25+19.67 EUR
100+19 EUR
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24CS128T-E/OT66KVAO
24CS128T-E/OT66KVAO
Hersteller: Microchip Technology
Description: 128KB SPI EEPROM, 8-MSOP T&R, 12
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Memory Size: 128Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: SOT-23-5
Grade: Automotive
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 400 ns
Memory Organization: 16K x 8
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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DSC6001CI2B-016.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001CI2B-016.0000T
Hersteller: Microchip Technology
Description: MEMS OSCILLATOR, ULTRA LOW POWER
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-025.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001CI2B-025.0000T
Hersteller: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-008.1920T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001CI2B-008.1920T
Hersteller: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8.192 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-032K768T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001CI2B-032K768T
Hersteller: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-040.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001CI2B-040.0000T
Hersteller: Microchip Technology
Description: MEMS OSC
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 40 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-025.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001CI2B-025.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-008.1920 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001CI2B-008.1920
Hersteller: Microchip Technology
Description: MEMS OSC XO 8.1920MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8.192 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-032K768 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001CI2B-032K768
Hersteller: Microchip Technology
Description: MEMS OSC XO 32.7680KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-040.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001CI2B-040.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 40.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 40 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-004.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
DSC6001CI2B-004.0000
Hersteller: Microchip Technology
Description: MEMS OSC SO
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-012.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
DSC6001CI2B-012.0000
Hersteller: Microchip Technology
Description: MEMS OSC SO
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-004.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
DSC6001CI2B-004.0000T
Hersteller: Microchip Technology
Description: MEMS OSC SO
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-012.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
DSC6001CI2B-012.0000T
Hersteller: Microchip Technology
Description: MEMS OSC SO
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-100K000T
DSC6001CI2B-100K000T
Hersteller: Microchip Technology
Description: OSCILLATOR MEMS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-100K000
DSC6001CI2B-100K000
Hersteller: Microchip Technology
Description: OSCILLATOR MEMS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 kHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC6001CI2B-016.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001CI2B-016.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 16.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001CC1-125.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CC1-125.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 125.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: 0°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001CC1-125.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CC1-125.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 125.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: 0°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 16.6mA
Supplier Device Package: 4-CDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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BZV55C10 150_8298-bzv55-c2v4-c75-pdf.pdf
BZV55C10
Hersteller: Microchip Technology
Description: DIODE ZENER 10V DO213AA
Tolerance: ±6%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 10 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 200 nA @ 7 V
auf Bestellung 143 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.42 EUR
100+5.96 EUR
Mindestbestellmenge: 3
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