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PIC32AK3208GC41064-I/PT PIC32AK3208GC41064-I/PT Microchip Technology PIC32AK1216GC41064-Family-Data-Sheet-DS70005592.pdf Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
auf Bestellung 498 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.9 EUR
25+2.63 EUR
100+2.4 EUR
Mindestbestellmenge: 7
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PIC32AK6416GC41064-I/PT PIC32AK6416GC41064-I/PT Microchip Technology PIC32AK1216GC41064-Family-Data-Sheet-DS70005592.pdf Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.04 EUR
25+2.77 EUR
100+2.51 EUR
Mindestbestellmenge: 6
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PIC32AK6416GC41064-I/M7 PIC32AK6416GC41064-I/M7 Microchip Technology PIC32AK1216GC41064-Family-Data-Sheet-DS70005592.pdf Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
auf Bestellung 250 Stücke:
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6+3.06 EUR
25+2.78 EUR
100+2.54 EUR
Mindestbestellmenge: 6
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PIC32AK1216GC41064-I/PT PIC32AK1216GC41064-I/PT Microchip Technology PIC32AK1216GC41064-Family-Data-Sheet-DS70005592.pdf Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
auf Bestellung 220 Stücke:
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6+3.19 EUR
25+2.89 EUR
100+2.63 EUR
Mindestbestellmenge: 6
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PIC32AK1216GC41064-I/M7 PIC32AK1216GC41064-I/M7 Microchip Technology PIC32AK1216GC41064-Family-Data-Sheet-DS70005592.pdf Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
auf Bestellung 213 Stücke:
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6+3.24 EUR
25+2.93 EUR
100+2.68 EUR
Mindestbestellmenge: 6
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EV25Z08A Microchip Technology PIC32AK1216GC41064-General-Purpose-DIM-Info-Sheet-DS30010246.pdf Description: PIC32AK1216GC41064 EVAL
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: PIC32
Utilized IC / Part: PIC32AK1216GC41064
auf Bestellung 10 Stücke:
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1+20.13 EUR
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PIC32AK3208GC41064-I/M7 PIC32AK3208GC41064-I/M7 Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
Produkt ist nicht verfügbar
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PIC32AK3208GC41064T-I/PT PIC32AK3208GC41064T-I/PT Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
Produkt ist nicht verfügbar
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PIC32AK3208GC41064T-I/M7 PIC32AK3208GC41064T-I/M7 Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
Produkt ist nicht verfügbar
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PIC32AK6416GC41064T-I/PT PIC32AK6416GC41064T-I/PT Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
Produkt ist nicht verfügbar
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PIC32AK6416GC41064T-I/M7 PIC32AK6416GC41064T-I/M7 Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
Produkt ist nicht verfügbar
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PIC32AK3208GC41064-E/M7 PIC32AK3208GC41064-E/M7 Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PIC32AK3208GC41064-E/PT PIC32AK3208GC41064-E/PT Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PIC32AK1216GC41064T-I/PT PIC32AK1216GC41064T-I/PT Microchip Technology PIC32AK1216GC41064-Family-Data-Sheet-DS70005592.pdf Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
Produkt ist nicht verfügbar
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PIC32AK1216GC41064T-I/M7 PIC32AK1216GC41064T-I/M7 Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
Produkt ist nicht verfügbar
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PIC32AK6416GC41064-E/PT PIC32AK6416GC41064-E/PT Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PIC32AK6416GC41064-E/M7 PIC32AK6416GC41064-E/M7 Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PIC32AK1216GC41064-E/PT PIC32AK1216GC41064-E/PT Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PIC32AK1216GC41064-E/M7 PIC32AK1216GC41064-E/M7 Microchip Technology Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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M1.5KE39A M1.5KE39A Microchip Technology RF01008_rE.pdf Description: TVS DIODE 33.3VWM 53.9VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 28A
Voltage - Reverse Standoff (Typ): 33.3V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 37.1V
Voltage - Clamping (Max) @ Ipp: 53.9V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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VC-801-EAW-FAAN-25M0012500 VC-801-EAW-FAAN-25M0012500 Microchip Technology VC-801.pdf Description: VC-830-ECE-FAAN-156M250000
Packaging: Strip
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -10°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 20mA
Height - Seated (Max): 0.055" (1.40mm)
Frequency: 25.00125 MHz
Base Resonator: Crystal
Produkt ist nicht verfügbar
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JANTXV1N5417 JANTXV1N5417 Microchip Technology 124360-lds-0231-datasheet Description: DIODE STANDARD 200V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 200 V
Qualification: MIL-PRF-19500/411
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JANTXV1N5417/TR JANTXV1N5417/TR Microchip Technology 124360-lds-0231-datasheet Description: DIODE STANDARD 200V 3A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 200 V
Qualification: MIL-PRF-19500/411
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1N5417US/TR 1N5417US/TR Microchip Technology Description: DIODE STANDARD 200V 3A D5B
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: D-5B
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 200 V
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JANS1N5417 JANS1N5417 Microchip Technology Description: DIODE STANDARD 200V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Qualification: MIL-PRF-19500/411
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JANS1N5417/TR JANS1N5417/TR Microchip Technology 124360-lds-0231-datasheet Description: DIODE STANDARD 200V 3A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Qualification: MIL-PRF-19500/411
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DSC1121DM2-003.3333T DSC1121DM2-003.3333T Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613C.pdf Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.3333 MHz
Base Resonator: MEMS
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DSC1121DM2-003.3333 DSC1121DM2-003.3333 Microchip Technology Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.3333 MHz
Base Resonator: MEMS
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DSC1121CM2-003.1152 DSC1121CM2-003.1152 Microchip Technology Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Absolute Pull Range (APR): ±25ppm
Frequency: 3.1152 MHz
Base Resonator: MEMS
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APT100M50J APT100M50J Microchip Technology 6581-apt100m50j-datasheet Description: MOSFET N-CH 500V 103A SOT227
Packaging: Tube
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 103A (Tc)
Rds On (Max) @ Id, Vgs: 38mOhm @ 75A, 10V
Power Dissipation (Max): 960W (Tc)
Vgs(th) (Max) @ Id: 5V @ 5mA
Supplier Device Package: SOT-227
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 620 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 24600 pF @ 25 V
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APT10035JLL APT10035JLL Microchip Technology 123944-apt10035jll-c-pdf Description: MOSFET N-CH 1000V 25A ISOTOP
Packaging: Tube
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 25A (Tc)
Rds On (Max) @ Id, Vgs: 350mOhm @ 14A, 10V
Power Dissipation (Max): 520W (Tc)
Vgs(th) (Max) @ Id: 5V @ 2.5mA
Supplier Device Package: ISOTOP®
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 186 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5185 pF @ 25 V
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APT100F50J APT100F50J Microchip Technology 6559-apt100f50j-datasheet Description: MOSFET N-CH 500V 103A ISOTOP
Packaging: Tube
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 103A (Tc)
Rds On (Max) @ Id, Vgs: 36mOhm @ 75A, 10V
Power Dissipation (Max): 960W (Tc)
Vgs(th) (Max) @ Id: 5V @ 5mA
Supplier Device Package: ISOTOP®
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 620 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 24600 pF @ 25 V
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TVS528e3 TVS528e3 Microchip Technology Description: TVS DIODE 28VWM 46.5VC B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TA)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 10.7A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: B, Axial
Unidirectional Channels: 1
Voltage - Breakdown (Min): 30.7V
Voltage - Clamping (Max) @ Ipp: 46.5V
Power - Peak Pulse: 500W
Power Line Protection: No
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tvs528/tr tvs528/tr Microchip Technology Description: TVS DIODE 28VWM 46.5V AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 10.7A (8/20µs)
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: B, Axial
Unidirectional Channels: 1
Voltage - Breakdown (Min): 30.7V
Voltage - Clamping (Max) @ Ipp: 46.5V
Power - Peak Pulse: 500W
Power Line Protection: No
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ATTINY84V-10PU ATTINY84V-10PU Microchip Technology 8006S.pdf Description: IC MCU 8BIT 8KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 10MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 14-PDIP
Number of I/O: 12
DigiKey Programmable: Not Verified
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1N5934A 1N5934A Microchip Technology 1N5913BG_1N5956BG.pdf Description: DIODE ZENER 24V 1.25W DO204AL
Packaging: Bulk
Tolerance: ±10%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 19 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 18.2 V
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1N5934C 1N5934C Microchip Technology 1N5913BG_1N5956BG.pdf Description: DIODE ZENER 24V 1.25W DO204AL
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 19 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 18.2 V
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1N5934D 1N5934D Microchip Technology 1N5913BG_1N5956BG.pdf Description: DIODE ZENER 24V 1.25W DO204AL
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 19 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 18.2 V
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1N5956B 1N5956B Microchip Technology 1n5913b-d.pdf Description: DIODE ZENER 200V 1.25W DO41
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 200 V
Impedance (Max) (Zzt): 1200 Ohms
Supplier Device Package: DO-41
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 152 V
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JAN1N3822C-1 JAN1N3822C-1 Microchip Technology 5797-1n3821a-3828a-datasheet Description: DIODE ZENER 3.6V 1W DO204AL
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 75 µA @ 1 V
Qualification: MIL-PRF-19500/115
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JANTX1N3822C-1 JANTX1N3822C-1 Microchip Technology 5797-1n3821a-3828a-datasheet Description: DIODE ZENER 3.6V 1W DO204AL
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 75 µA @ 1 V
Qualification: MIL-PRF-19500/115
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DSC6003HI2B-745K000T Microchip Technology Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 745 kHz
Base Resonator: MEMS
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DSC6003HI1B-745K000T Microchip Technology Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 745 kHz
Base Resonator: MEMS
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SAMA7D65D2GT-V/4UB Microchip Technology Description: CORTEX-A7 MPU,BGA, EXT TEMP,2GB
Packaging: Tape & Reel (TR)
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SAMA7D65D2G-V/4UB Microchip Technology SAMA7D6-Series-Data-Sheet-DS60001851.pdf Description: CORTEX-A7 MPU,BGA, EXT TEMP,2GB
Packaging: Tray
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SAMA7D65D2GT-V/4UB-SL3 Microchip Technology Description: CORTEX-A7 MPU,BGA, EXT TEMP, 2GB
Packaging: Tape & Reel (TR)
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SAMA7D65D2GN8-I/5BW Microchip Technology Description: SAMA7D65 SYSTEM ON MODULE USING
Packaging: Bulk
Speed: 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A7
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
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SAMA7D65-V/4HB SAMA7D65-V/4HB Microchip Technology SAMA7D65-Curiosity-User-Guide-EA89C15A-DS50003708.pdf Description: CORTEX-A7 MPU, BGA, EXT 125C TEM
Packaging: Tray
Package / Case: 343-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 343-TFBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
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EV63J76A Microchip Technology Description: SAMA7D65 CURIOSITY
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-A7
Utilized IC / Part: SAMA7D65
Platform: Curiosity
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SAMA7D65T-V/4HB Microchip Technology Description: CORTEX-A7 MPU, BGA, EXT. TEMP
Packaging: Tape & Reel (TR)
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SAMA7D65-V/4HB-SL3 SAMA7D65-V/4HB-SL3 Microchip Technology Description: CORTEX-A7 MPU, BGA, EXT TEMP
Packaging: Tray
Package / Case: 343-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 343-TFBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
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SAMA7D65T-V/4HB-SL3 SAMA7D65T-V/4HB-SL3 Microchip Technology Description: CORTEX-A7 MPU, BGA, EXT TEMP, T&
Packaging: Tape & Reel (TR)
Package / Case: 343-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 343-TFBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
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SAMA7D65D1G-V/4UB Microchip Technology Description: CORTEX-A7 MPU,BGA, EXT TEMP,1GB
Packaging: Tray
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
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SAMA7D65D1GT-V/4UB-SL3 Microchip Technology Description: CORTEX-A7 MPU,BGA, EXT TEMP, 1GB
Packaging: Tape & Reel (TR)
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
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SAMA7G54D4GT-I/4UB Microchip Technology Description: CORTEX-A7 MPU,BGA,IND TEMP,4GB D
Packaging: Tape & Reel (TR)
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
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SAMA7D65D1G-V/4UB-SL3 Microchip Technology Description: CORTEX-A7 MPU,BGA, EXT TEMP, 1GB
Packaging: Tray
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
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SAMA7G54D4G-I/4UB Microchip Technology Description: CORTEX-A7 MPU,BGA,IND TEMP,4GB D
Packaging: Tray
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
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SAMA7D65D1GT-V/4UB Microchip Technology Description: CORTEX-A7 MPU,BGA, EXT TEMP,1GB
Packaging: Tape & Reel (TR)
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
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MX575ABC200M000-TR MX575ABC200M000-TR Microchip Technology MX575ABC200M000.pdf Description: XTAL OSC XO 200.0000MHZ LVCMOS
Packaging: Cut Tape (CT)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVCMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.375V ~ 3.63V
Current - Supply (Max): 95mA
Height - Seated (Max): 0.055" (1.40mm)
Frequency: 200 MHz
Base Resonator: Crystal
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PD-9501GS/AC-UK Microchip Technology PD-9501GS-DS00005108.pdf Description: 1-PORT BT 60W UK EU POWER CORD
Packaging: Bulk
Size / Dimension: 5.51" L x 2.36" W x 1.45" H (140.0mm x 59.9mm x 36.8mm)
Voltage - Output: 52V
Mounting Type: Desktop
Voltage - Input: 100 ~ 240 VAC
Type: Midspan Injector
Operating Temperature: -10°C ~ 50°C
Data Rate: 10/100/1000 Mbps
Approval Agency: CE, cULus, DEMKO, UKCA
Efficiency: Level VI
Power (Watts) - Per Port: 60W
Compliance: IEEE802.3af, IEEE802.3at, IEEE802.3bt
Current - Output: 1.15 A
Number of Ports: 1
Standard Number: 62368-1
auf Bestellung 10 Stücke:
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1+108.15 EUR
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PIC32AK3208GC41064-I/PT PIC32AK1216GC41064-Family-Data-Sheet-DS70005592.pdf
PIC32AK3208GC41064-I/PT
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
auf Bestellung 498 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.9 EUR
25+2.63 EUR
100+2.4 EUR
Mindestbestellmenge: 7
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PIC32AK6416GC41064-I/PT PIC32AK1216GC41064-Family-Data-Sheet-DS70005592.pdf
PIC32AK6416GC41064-I/PT
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.04 EUR
25+2.77 EUR
100+2.51 EUR
Mindestbestellmenge: 6
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PIC32AK6416GC41064-I/M7 PIC32AK1216GC41064-Family-Data-Sheet-DS70005592.pdf
PIC32AK6416GC41064-I/M7
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.06 EUR
25+2.78 EUR
100+2.54 EUR
Mindestbestellmenge: 6
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PIC32AK1216GC41064-I/PT PIC32AK1216GC41064-Family-Data-Sheet-DS70005592.pdf
PIC32AK1216GC41064-I/PT
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
auf Bestellung 220 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.19 EUR
25+2.89 EUR
100+2.63 EUR
Mindestbestellmenge: 6
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PIC32AK1216GC41064-I/M7 PIC32AK1216GC41064-Family-Data-Sheet-DS70005592.pdf
PIC32AK1216GC41064-I/M7
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
auf Bestellung 213 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.24 EUR
25+2.93 EUR
100+2.68 EUR
Mindestbestellmenge: 6
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EV25Z08A PIC32AK1216GC41064-General-Purpose-DIM-Info-Sheet-DS30010246.pdf
Hersteller: Microchip Technology
Description: PIC32AK1216GC41064 EVAL
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: PIC32
Utilized IC / Part: PIC32AK1216GC41064
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Anzahl Preis
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PIC32AK3208GC41064-I/M7
PIC32AK3208GC41064-I/M7
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
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PIC32AK3208GC41064T-I/PT
PIC32AK3208GC41064T-I/PT
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
Produkt ist nicht verfügbar
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PIC32AK3208GC41064T-I/M7
PIC32AK3208GC41064T-I/M7
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
Produkt ist nicht verfügbar
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PIC32AK6416GC41064T-I/PT
PIC32AK6416GC41064T-I/PT
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
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PIC32AK6416GC41064T-I/M7
PIC32AK6416GC41064T-I/M7
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
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PIC32AK3208GC41064-E/M7
PIC32AK3208GC41064-E/M7
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
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PIC32AK3208GC41064-E/PT
PIC32AK3208GC41064-E/PT
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 32K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PIC32AK1216GC41064T-I/PT PIC32AK1216GC41064-Family-Data-Sheet-DS70005592.pdf
PIC32AK1216GC41064T-I/PT
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 49
Produkt ist nicht verfügbar
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PIC32AK1216GC41064T-I/M7
PIC32AK1216GC41064T-I/M7
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 49
Produkt ist nicht verfügbar
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PIC32AK6416GC41064-E/PT
PIC32AK6416GC41064-E/PT
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
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PIC32AK6416GC41064-E/M7
PIC32AK6416GC41064-E/M7
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 64K F
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
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PIC32AK1216GC41064-E/PT
PIC32AK1216GC41064-E/PT
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PIC32AK1216GC41064-E/M7
PIC32AK1216GC41064-E/M7
Hersteller: Microchip Technology
Description: 32-BIT 200MHZ MCU, DP-FPU, 128K
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 22x12b SAR; D/A 3x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Grade: Automotive
Number of I/O: 49
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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M1.5KE39A RF01008_rE.pdf
M1.5KE39A
Hersteller: Microchip Technology
Description: TVS DIODE 33.3VWM 53.9VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 28A
Voltage - Reverse Standoff (Typ): 33.3V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 37.1V
Voltage - Clamping (Max) @ Ipp: 53.9V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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VC-801-EAW-FAAN-25M0012500 VC-801.pdf
VC-801-EAW-FAAN-25M0012500
Hersteller: Microchip Technology
Description: VC-830-ECE-FAAN-156M250000
Packaging: Strip
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -10°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 20mA
Height - Seated (Max): 0.055" (1.40mm)
Frequency: 25.00125 MHz
Base Resonator: Crystal
Produkt ist nicht verfügbar
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JANTXV1N5417 124360-lds-0231-datasheet
JANTXV1N5417
Hersteller: Microchip Technology
Description: DIODE STANDARD 200V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 200 V
Qualification: MIL-PRF-19500/411
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JANTXV1N5417/TR 124360-lds-0231-datasheet
JANTXV1N5417/TR
Hersteller: Microchip Technology
Description: DIODE STANDARD 200V 3A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 200 V
Qualification: MIL-PRF-19500/411
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1N5417US/TR
1N5417US/TR
Hersteller: Microchip Technology
Description: DIODE STANDARD 200V 3A D5B
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: D-5B
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 200 V
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JANS1N5417
JANS1N5417
Hersteller: Microchip Technology
Description: DIODE STANDARD 200V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Qualification: MIL-PRF-19500/411
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JANS1N5417/TR 124360-lds-0231-datasheet
JANS1N5417/TR
Hersteller: Microchip Technology
Description: DIODE STANDARD 200V 3A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Qualification: MIL-PRF-19500/411
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DSC1121DM2-003.3333T DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613C.pdf
DSC1121DM2-003.3333T
Hersteller: Microchip Technology
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.3333 MHz
Base Resonator: MEMS
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DSC1121DM2-003.3333
DSC1121DM2-003.3333
Hersteller: Microchip Technology
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.3333 MHz
Base Resonator: MEMS
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DSC1121CM2-003.1152
DSC1121CM2-003.1152
Hersteller: Microchip Technology
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Absolute Pull Range (APR): ±25ppm
Frequency: 3.1152 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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APT100M50J 6581-apt100m50j-datasheet
APT100M50J
Hersteller: Microchip Technology
Description: MOSFET N-CH 500V 103A SOT227
Packaging: Tube
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 103A (Tc)
Rds On (Max) @ Id, Vgs: 38mOhm @ 75A, 10V
Power Dissipation (Max): 960W (Tc)
Vgs(th) (Max) @ Id: 5V @ 5mA
Supplier Device Package: SOT-227
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 620 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 24600 pF @ 25 V
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APT10035JLL 123944-apt10035jll-c-pdf
APT10035JLL
Hersteller: Microchip Technology
Description: MOSFET N-CH 1000V 25A ISOTOP
Packaging: Tube
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 25A (Tc)
Rds On (Max) @ Id, Vgs: 350mOhm @ 14A, 10V
Power Dissipation (Max): 520W (Tc)
Vgs(th) (Max) @ Id: 5V @ 2.5mA
Supplier Device Package: ISOTOP®
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 186 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5185 pF @ 25 V
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APT100F50J 6559-apt100f50j-datasheet
APT100F50J
Hersteller: Microchip Technology
Description: MOSFET N-CH 500V 103A ISOTOP
Packaging: Tube
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 103A (Tc)
Rds On (Max) @ Id, Vgs: 36mOhm @ 75A, 10V
Power Dissipation (Max): 960W (Tc)
Vgs(th) (Max) @ Id: 5V @ 5mA
Supplier Device Package: ISOTOP®
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 620 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 24600 pF @ 25 V
Produkt ist nicht verfügbar
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TVS528e3
TVS528e3
Hersteller: Microchip Technology
Description: TVS DIODE 28VWM 46.5VC B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TA)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 10.7A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: B, Axial
Unidirectional Channels: 1
Voltage - Breakdown (Min): 30.7V
Voltage - Clamping (Max) @ Ipp: 46.5V
Power - Peak Pulse: 500W
Power Line Protection: No
Produkt ist nicht verfügbar
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tvs528/tr
tvs528/tr
Hersteller: Microchip Technology
Description: TVS DIODE 28VWM 46.5V AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 10.7A (8/20µs)
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: B, Axial
Unidirectional Channels: 1
Voltage - Breakdown (Min): 30.7V
Voltage - Clamping (Max) @ Ipp: 46.5V
Power - Peak Pulse: 500W
Power Line Protection: No
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ATTINY84V-10PU 8006S.pdf
ATTINY84V-10PU
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 10MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 14-PDIP
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1N5934A 1N5913BG_1N5956BG.pdf
1N5934A
Hersteller: Microchip Technology
Description: DIODE ZENER 24V 1.25W DO204AL
Packaging: Bulk
Tolerance: ±10%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 19 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 18.2 V
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1N5934C 1N5913BG_1N5956BG.pdf
1N5934C
Hersteller: Microchip Technology
Description: DIODE ZENER 24V 1.25W DO204AL
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 19 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 18.2 V
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1N5934D 1N5913BG_1N5956BG.pdf
1N5934D
Hersteller: Microchip Technology
Description: DIODE ZENER 24V 1.25W DO204AL
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 19 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 18.2 V
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1N5956B 1n5913b-d.pdf
1N5956B
Hersteller: Microchip Technology
Description: DIODE ZENER 200V 1.25W DO41
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 200 V
Impedance (Max) (Zzt): 1200 Ohms
Supplier Device Package: DO-41
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 152 V
Produkt ist nicht verfügbar
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JAN1N3822C-1 5797-1n3821a-3828a-datasheet
JAN1N3822C-1
Hersteller: Microchip Technology
Description: DIODE ZENER 3.6V 1W DO204AL
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 75 µA @ 1 V
Qualification: MIL-PRF-19500/115
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JANTX1N3822C-1 5797-1n3821a-3828a-datasheet
JANTX1N3822C-1
Hersteller: Microchip Technology
Description: DIODE ZENER 3.6V 1W DO204AL
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 75 µA @ 1 V
Qualification: MIL-PRF-19500/115
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DSC6003HI2B-745K000T
Hersteller: Microchip Technology
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 745 kHz
Base Resonator: MEMS
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DSC6003HI1B-745K000T
Hersteller: Microchip Technology
Description: MEMS CMOS OSC
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 745 kHz
Base Resonator: MEMS
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SAMA7D65D2GT-V/4UB
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU,BGA, EXT TEMP,2GB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAMA7D65D2G-V/4UB SAMA7D6-Series-Data-Sheet-DS60001851.pdf
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU,BGA, EXT TEMP,2GB
Packaging: Tray
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SAMA7D65D2GT-V/4UB-SL3
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU,BGA, EXT TEMP, 2GB
Packaging: Tape & Reel (TR)
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SAMA7D65D2GN8-I/5BW
Hersteller: Microchip Technology
Description: SAMA7D65 SYSTEM ON MODULE USING
Packaging: Bulk
Speed: 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A7
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
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SAMA7D65-V/4HB SAMA7D65-Curiosity-User-Guide-EA89C15A-DS50003708.pdf
SAMA7D65-V/4HB
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU, BGA, EXT 125C TEM
Packaging: Tray
Package / Case: 343-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 343-TFBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
auf Bestellung 119 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+19.11 EUR
25+17.53 EUR
100+15.88 EUR
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EV63J76A
Hersteller: Microchip Technology
Description: SAMA7D65 CURIOSITY
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-A7
Utilized IC / Part: SAMA7D65
Platform: Curiosity
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SAMA7D65T-V/4HB
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU, BGA, EXT. TEMP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAMA7D65-V/4HB-SL3
SAMA7D65-V/4HB-SL3
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU, BGA, EXT TEMP
Packaging: Tray
Package / Case: 343-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 343-TFBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
Produkt ist nicht verfügbar
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SAMA7D65T-V/4HB-SL3
SAMA7D65T-V/4HB-SL3
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU, BGA, EXT TEMP, T&
Packaging: Tape & Reel (TR)
Package / Case: 343-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 343-TFBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
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SAMA7D65D1G-V/4UB
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU,BGA, EXT TEMP,1GB
Packaging: Tray
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
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SAMA7D65D1GT-V/4UB-SL3
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU,BGA, EXT TEMP, 1GB
Packaging: Tape & Reel (TR)
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
Produkt ist nicht verfügbar
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SAMA7G54D4GT-I/4UB
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU,BGA,IND TEMP,4GB D
Packaging: Tape & Reel (TR)
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
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SAMA7D65D1G-V/4UB-SL3
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU,BGA, EXT TEMP, 1GB
Packaging: Tray
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
Produkt ist nicht verfügbar
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SAMA7G54D4G-I/4UB
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU,BGA,IND TEMP,4GB D
Packaging: Tray
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
Produkt ist nicht verfügbar
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SAMA7D65D1GT-V/4UB
Hersteller: Microchip Technology
Description: CORTEX-A7 MPU,BGA, EXT TEMP,1GB
Packaging: Tape & Reel (TR)
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100/1000Mbps (2)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-DSI, RGB
Security Features: AES, SHA, TDES, TRNG
Additional Interfaces: CANbus, I2C, MMC/SD/SDIO, QSPI, UART
Produkt ist nicht verfügbar
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MX575ABC200M000-TR MX575ABC200M000.pdf
MX575ABC200M000-TR
Hersteller: Microchip Technology
Description: XTAL OSC XO 200.0000MHZ LVCMOS
Packaging: Cut Tape (CT)
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVCMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.375V ~ 3.63V
Current - Supply (Max): 95mA
Height - Seated (Max): 0.055" (1.40mm)
Frequency: 200 MHz
Base Resonator: Crystal
Produkt ist nicht verfügbar
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PD-9501GS/AC-UK PD-9501GS-DS00005108.pdf
Hersteller: Microchip Technology
Description: 1-PORT BT 60W UK EU POWER CORD
Packaging: Bulk
Size / Dimension: 5.51" L x 2.36" W x 1.45" H (140.0mm x 59.9mm x 36.8mm)
Voltage - Output: 52V
Mounting Type: Desktop
Voltage - Input: 100 ~ 240 VAC
Type: Midspan Injector
Operating Temperature: -10°C ~ 50°C
Data Rate: 10/100/1000 Mbps
Approval Agency: CE, cULus, DEMKO, UKCA
Efficiency: Level VI
Power (Watts) - Per Port: 60W
Compliance: IEEE802.3af, IEEE802.3at, IEEE802.3bt
Current - Output: 1.15 A
Number of Ports: 1
Standard Number: 62368-1
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+108.15 EUR
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