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MIC23656YFT MIC23656YFT Microchip Technology MIC23656-Data-Sheet-20006112B.pdf Description: 6A, 5V SYNCH BUCK REGULATOR W/ I
Packaging: Tube
Package / Case: 16-PowerUFQFN
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 16-FTQFN (2.5x2.5)
Synchronous Rectifier: Yes
Voltage - Output (Max): 1.28V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Produkt ist nicht verfügbar
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MIC23656-SAYFT MIC23656-SAYFT Microchip Technology MIC23656-Data-Sheet-20006112B.pdf Description: 6A, 5V SYNCH BUCK REGULATOR W/ I
Packaging: Tube
Package / Case: 16-PowerUFQFN
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 16-FTQFN (2.5x2.5)
Synchronous Rectifier: Yes
Voltage - Output (Max): 3.84V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Produkt ist nicht verfügbar
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MIC23656-HAYFT MIC23656-HAYFT Microchip Technology MIC23656-Data-Sheet-20006112B.pdf Description: 6A, 5V SYNCH BUCK REGULATOR W/ I
Packaging: Tube
Package / Case: 16-PowerUFQFN
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 16-FTQFN (2.5x2.5)
Synchronous Rectifier: Yes
Voltage - Output (Max): 1.28V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Produkt ist nicht verfügbar
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MIC23656-FAYFT MIC23656-FAYFT Microchip Technology MIC23656-Data-Sheet-20006112B.pdf Description: 6A, 5V SYNCH BUCK REGULATOR W/ I
Packaging: Tube
Package / Case: 16-PowerUFQFN
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 16-FTQFN (2.5x2.5)
Synchronous Rectifier: Yes
Voltage - Output (Max): 1.28V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
Produkt ist nicht verfügbar
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DSC1123AE2-300.0000 DSC1123AE2-300.0000 Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 300.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 300 MHz
Base Resonator: MEMS
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DSC1123AE2-200.0000 DSC1123AE2-200.0000 Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 200.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
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MCP47CVB18T-20E/ST MCP47CVB18T-20E/ST Microchip Technology MCP47CXBX4_8-Data-Sheet-20006537B.pdf Description: IC DAC 10BIT V-OUT 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 10
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 8
INL/DNL (LSB): ±0.25, ±0.25
Differential Output: No
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MCP47CVB18T-20E/ST MCP47CVB18T-20E/ST Microchip Technology MCP47CXBX4_8-Data-Sheet-20006537B.pdf Description: IC DAC 10BIT V-OUT 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 10
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 8
INL/DNL (LSB): ±0.25, ±0.25
Differential Output: No
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MCP48CMB18T-20E/ST MCP48CMB18T-20E/ST Microchip Technology MCP48CxBx4_8_2021.pdf Description: IC DAC 10BIT V-OUT 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 10
Data Interface: SPI
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 8
INL/DNL (LSB): ±0.25, ±0.25
Differential Output: No
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MCP48CMB18T-20E/ST MCP48CMB18T-20E/ST Microchip Technology MCP48CxBx4_8_2021.pdf Description: IC DAC 10BIT V-OUT 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 10
Data Interface: SPI
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 8
INL/DNL (LSB): ±0.25, ±0.25
Differential Output: No
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1N5244B 1N5244B Microchip Technology 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf Description: DIODE ZENER 14V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 14 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 10 V
Produkt ist nicht verfügbar
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M5KP30A M5KP30A Microchip Technology rf01010_rb.pdf Description: TVS DIODE 30VWM 48.4VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 103A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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M15KP30A M15KP30A Microchip Technology rf01011_m15kp_rev_e.pdf Description: TVS DIODE 30VWM 50.7VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 296A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 50.7V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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APTGX75DU170T3AG Microchip Technology APTGX75DU170T3AG-IGBT-Module-Datasheet.pdf Description: IGBT MODULE 1700V 145A 524W
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual, Common Emitter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 75A
NTC Thermistor: Yes
Current - Collector (Ic) (Max): 145 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 524 W
Current - Collector Cutoff (Max): 10 µA
Input Capacitance (Cies) @ Vce: 7600 pF @ 25 V
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APTGX300DU120T6G Microchip Technology APTGX300DU120T6G-IGBT-Module-Datasheet.pdf Description: IGBT MODULE 1200V 415A 1.02KW
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual, Common Emitter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 300A
NTC Thermistor: Yes
Current - Collector (Ic) (Max): 415 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1.02 kW
Current - Collector Cutoff (Max): 24 µA
Input Capacitance (Cies) @ Vce: 60000 pF @ 25 V
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APTGX300DU170T6G Microchip Technology APTGX300DU170T6G-IGBT-Module-Datasheet.pdf Description: IGBT MODULE 1700V 385A 1.034KW
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual, Common Emitter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 300A
NTC Thermistor: Yes
Current - Collector (Ic) (Max): 385 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 1.034 kW
Current - Collector Cutoff (Max): 25 µA
Input Capacitance (Cies) @ Vce: 31300 pF @ 25 V
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APTGX450DU120T6G Microchip Technology APTGX450DU120T6G-IGBT-Module-Datasheet.pdf Description: IGBT MODULE 1200V 605A 1.456KW
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual, Common Emitter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 450A
NTC Thermistor: Yes
Current - Collector (Ic) (Max): 605 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1.456 kW
Current - Collector Cutoff (Max): 36 µA
Input Capacitance (Cies) @ Vce: 90000 pF @ 25 V
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APTGX600DU120T6G Microchip Technology APTGX600DU120T6G-IGBT-Module-Datasheet.pdf Description: IGBT MODULE 1200V 805A 1.923KW
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual, Common Emitter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 600A
NTC Thermistor: Yes
Current - Collector (Ic) (Max): 805 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1.923 kW
Current - Collector Cutoff (Max): 50 µA
Input Capacitance (Cies) @ Vce: 120000 pF @ 25 V
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APTGX600DU170T6G Microchip Technology APTGX600DU170T6G-IGBT-Module-Datasheet.pdf Description: IGBT MODULE 1700V 750A 1.948KW
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual, Common Emitter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 600A
NTC Thermistor: Yes
Current - Collector (Ic) (Max): 750 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 1.948 kW
Current - Collector Cutoff (Max): 50 µA
Input Capacitance (Cies) @ Vce: 62500 pF @ 25 V
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AT24C16BY6-YH-T AT24C16BY6-YH-T Microchip Technology AT24C16B.pdf Description: IC EEPROM 16KBIT I2C 8MINI MAP
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-Mini Map (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 550 ns
Memory Organization: 2K x 8
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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1N5300UR-1 1N5300UR-1 Microchip Technology 1N5283UR-1_1N5314UR-1.pdf Description: DIODE CUR REG 100V 1.43MA 500MW
Packaging: Bulk
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 500mW
Voltage - Anode - Cathode (Vak)(Max): 100V
Regulator Current (Max): 1.43mA
Voltage - Limiting (Max): 1.5V
Produkt ist nicht verfügbar
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1N5302UR-1 1N5302UR-1 Microchip Technology 1N5283UR-1_1N5314UR-1.pdf Description: DIODE CUR REG 100V 1.65MA 500MW
Packaging: Bulk
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 500mW
Voltage - Anode - Cathode (Vak)(Max): 100V
Regulator Current (Max): 1.65mA
Voltage - Limiting (Max): 1.6V
Produkt ist nicht verfügbar
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1N5302UR-1/TR 1N5302UR-1/TR Microchip Technology 1N5283UR-1_1N5314UR-1.pdf Description: DIODE CUR REG 100V 1.65MA 500MW
Packaging: Tape & Reel (TR)
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 500mW
Voltage - Anode - Cathode (Vak)(Max): 100V
Regulator Current (Max): 1.65mA
Voltage - Limiting (Max): 1.6V
Produkt ist nicht verfügbar
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USB7205C/KDX USB7205C/KDX Microchip Technology USB7205C-Data-Sheet-00005227.pdf Description: USB3.1 GEN2 HUB_NO PD_NO TYPE C
Packaging: Tray
Package / Case: 100-VFQFN Exposed Pad
Function: Hub Controller
Interface: I2C
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.3V
Protocol: USB
Supplier Device Package: 100-VQFN (12x12)
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25+11.75 EUR
100+11.34 EUR
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USB7205C-I/KDX USB7205C-I/KDX Microchip Technology USB7205C-Data-Sheet-00005227.pdf Description: USB3.1 GEN2 HUB_NO PD_NO TYPE C
Packaging: Tray
Package / Case: 100-VFQFN Exposed Pad
Function: Hub Controller
Interface: I2C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Protocol: USB
Supplier Device Package: 100-VQFN (12x12)
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25+14.67 EUR
100+14.18 EUR
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USB7205CT/KDX USB7205CT/KDX Microchip Technology USB7205C-Data-Sheet-00005227.pdf Description: USB3.1 GEN2 HUB_NO PD_NO TYPE C
Packaging: Tape & Reel (TR)
Package / Case: 100-VFQFN Exposed Pad
Function: Hub Controller
Interface: I2C
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.3V
Protocol: USB
Supplier Device Package: 100-VQFN (12x12)
Produkt ist nicht verfügbar
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USB7205CT-I/KDX USB7205CT-I/KDX Microchip Technology USB7205C-Data-Sheet-00005227.pdf Description: USB3.1 GEN2 HUB_NO PD_NO TYPE C
Packaging: Tape & Reel (TR)
Package / Case: 100-VFQFN Exposed Pad
Function: Hub Controller
Interface: I2C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Protocol: USB
Supplier Device Package: 100-VQFN (12x12)
Produkt ist nicht verfügbar
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VT-706-EAE-2070-25M0000000 Microchip Technology Description: TCXO +3.3 VDC CMOS -40C TO +85C
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LXS101-23-3 LXS101-23-3 Microchip Technology 150_LSX100_LSX700_Series.pdf Description: RF DIODE SCHOTTKY 8V 1A SOT23-3
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Schottky - 1 Pair Common Anode
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 1pF @ 0V, 1MHz
Voltage - Peak Reverse (Max): 8V
Supplier Device Package: SOT-23-3
Current - Max: 1 A
Power Dissipation (Max): 250 mW
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3+8.54 EUR
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MCP6141T-E/OTVAO MCP6141T-E/OTVAO Microchip Technology 20001668E.pdf Description: IC OPAMP GP 1 CIRCUIT SOT23-5
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C
Current - Supply: 600nA
Slew Rate: 0.003V/µs
Gain Bandwidth Product: 100 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 3 mV
Supplier Device Package: SOT-23-5
Grade: Automotive
Number of Circuits: 1
Current - Output / Channel: 20 mA
Voltage - Supply Span (Min): 1.4 V
Voltage - Supply Span (Max): 6 V
Qualification: AEC-Q100
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3000+0.91 EUR
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MCP6141T-E/OTVAO MCP6141T-E/OTVAO Microchip Technology 20001668E.pdf Description: IC OPAMP GP 1 CIRCUIT SOT23-5
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C
Current - Supply: 600nA
Slew Rate: 0.003V/µs
Gain Bandwidth Product: 100 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 3 mV
Supplier Device Package: SOT-23-5
Grade: Automotive
Number of Circuits: 1
Current - Output / Channel: 20 mA
Voltage - Supply Span (Min): 1.4 V
Voltage - Supply Span (Max): 6 V
Qualification: AEC-Q100
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MCP6141T-E/SNVAO MCP6141T-E/SNVAO Microchip Technology 20001668E.pdf Description: IC OPAMP GP 1 CIRCUIT 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Single-Ended
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 600nA
Slew Rate: 0.024V/µs
Gain Bandwidth Product: 100 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 3 mV
Supplier Device Package: 8-SOIC
Number of Circuits: 1
Current - Output / Channel: 20 mA
Voltage - Supply Span (Min): 1.4 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
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ATA6502T-4BWVAO ATA6502T-4BWVAO Microchip Technology ATA6500T-4CWVAO.pdf Description: CAN FD TRX SBC WITH 5V LDO 1.8 A
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 3.1V ~ 5.5V, 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 10-VDFN (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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ATA6502T-4BWVAO ATA6502T-4BWVAO Microchip Technology ATA6500T-4CWVAO.pdf Description: CAN FD TRX SBC WITH 5V LDO 1.8 A
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 3.1V ~ 5.5V, 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 10-VDFN (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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JANTX1N5310UR-1 JANTX1N5310UR-1 Microchip Technology 1N5283UR-1_1N5314UR-1.pdf Description: DIODE CUR REG 100V 3.63MA 500MW
Packaging: Bulk
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Supplier Device Package: DO-213AB (MELF, LL41)
Grade: Military
Power - Max: 500mW
Voltage - Anode - Cathode (Vak)(Max): 100V
Regulator Current (Max): 3.63mA
Voltage - Limiting (Max): 2.35V
Qualification: MIL-PRF-19500/463
Produkt ist nicht verfügbar
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AT80C51SND1C-ROTUL AT80C51SND1C-ROTUL Microchip Technology doc4109s.pdf Description: IC MCU 8BIT ROMLESS 80TQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 80C51
Data Converters: A/D 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Connectivity: I2C, IDE/ATAPI, Memory Card, SPI, UART/USART, USB
Peripherals: Audio, I2S, MP3, PCM, POR, WDT
Supplier Device Package: 80-TQFP (14x14)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC32CM3204JH00048-I/Y8X PIC32CM3204JH00048-I/Y8X Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Supplier Device Package: 48-TQFP (7x7)
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PIC32CM3204JH00048-I/U5B PIC32CM3204JH00048-I/U5B Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-VQFN (7x7)
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PIC32CX5109BZ36048-V/ZWX Microchip Technology PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf Description: 48-PIN 64MHZ CM4F CORE WITH INTE
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -108dBm
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 512kB Flash, 64kB ROM, 96kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v6.0, Thread, Zigbee®
Current - Receiving: 14.5mA ~ 20mA
Data Rate (Max): 2Mbps
Current - Transmitting: 21.5mA ~ 50mA
Supplier Device Package: 48-VQFN (6x6)
GPIO: 27
Modulation: DSSS
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, DAC, GPIO, IrDA, I2C, PWM, SPI, UART, USART
Grade: Automotive
Qualification: AEC-Q100
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PIC32CX5109BZ36048T-V/ZWX Microchip Technology PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf Description: 48-PIN 64MHZ CM4F CORE WITH INTE
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -108dBm
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 512kB Flash, 64kB ROM, 96kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v6.0, Thread, Zigbee®
Current - Receiving: 14.5mA ~ 20mA
Data Rate (Max): 2Mbps
Current - Transmitting: 21.5mA ~ 50mA
Supplier Device Package: 48-VQFN (6x6)
GPIO: 27
Modulation: DSSS
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, DAC, GPIO, IrDA, I2C, PWM, SPI, UART, USART
Grade: Automotive
Qualification: AEC-Q100
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PIC32CX5109BZ36048T-V/ZWX Microchip Technology PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf Description: 48-PIN 64MHZ CM4F CORE WITH INTE
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -108dBm
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 512kB Flash, 64kB ROM, 96kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v6.0, Thread, Zigbee®
Current - Receiving: 14.5mA ~ 20mA
Data Rate (Max): 2Mbps
Current - Transmitting: 21.5mA ~ 50mA
Supplier Device Package: 48-VQFN (6x6)
GPIO: 27
Modulation: DSSS
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, DAC, GPIO, IrDA, I2C, PWM, SPI, UART, USART
Grade: Automotive
Qualification: AEC-Q100
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PIC32CM3204JH00048T-I/Y8X PIC32CM3204JH00048T-I/Y8X Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Supplier Device Package: 48-TQFP (7x7)
Produkt ist nicht verfügbar
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PIC32CM3204JH00048T-I/U5B PIC32CM3204JH00048T-I/U5B Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-VQFN (7x7)
Produkt ist nicht verfügbar
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PIC32CM6408JH00048T-I/Y8X Microchip Technology PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM6408JH00048T-I/U5B Microchip Technology PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM3204JH00048-E/Y8X PIC32CM3204JH00048-E/Y8X Microchip Technology Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Supplier Device Package: 48-TQFP (7x7)
Produkt ist nicht verfügbar
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PIC32CM3204JH00048T-E/Y8X PIC32CM3204JH00048T-E/Y8X Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Supplier Device Package: 48-TQFP (7x7)
Produkt ist nicht verfügbar
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PIC32CM3204JH00048-E/U5B PIC32CM3204JH00048-E/U5B Microchip Technology Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-VQFN (7x7)
Produkt ist nicht verfügbar
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PIC32CM3204JH00048T-E/U5B PIC32CM3204JH00048T-E/U5B Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-VQFN (7x7)
Produkt ist nicht verfügbar
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PIC32CM6408JH00048-E/Y8X Microchip Technology Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tray
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PIC32CM6408JH00048T-E/Y8X Microchip Technology PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
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PIC32CM6408JH00048-E/U5B Microchip Technology Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tray
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PIC32CM6408JH00048T-E/U5B Microchip Technology PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SG2524N SG2524N Microchip Technology sg1524_rev1.2.pdf Description: IC REG CTRLR MULT TOPOLOGY 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Transistor Driver
Mounting Type: Through Hole
Function: Step-Down, Step-Up/Step-Down
Operating Temperature: -25°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 100kHz ~ 300kHz
Topology: Buck, Flyback, Push-Pull
Voltage - Supply (Vcc/Vdd): 8V ~ 40V
Supplier Device Package: 16-PDIP
Synchronous Rectifier: Yes
Control Features: Enable
Output Phases: 1
Duty Cycle (Max): 49%
Clock Sync: No
Number of Outputs: 2
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M1.5KE250A Microchip Technology RF01008_rE.pdf Description: TVS DIODE 214VWM 344VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5A
Voltage - Reverse Standoff (Typ): 214V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 237V
Voltage - Clamping (Max) @ Ipp: 344V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PIC32CZ4010CA80144-I/LUX PIC32CZ4010CA80144-I/LUX Microchip Technology PIC32CZ-CA80-CA90-Family-Data-Sheet-DS60001749.pdf Description: CM7,4MB FLASH,CONNECTIVITY,144BG
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (12x12)
Number of I/O: 108
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PIC32CZ8110CA80144-I/LUX PIC32CZ8110CA80144-I/LUX Microchip Technology PIC32CZ-CA80-CA90-Family-Data-Sheet-DS60001749.pdf Description: CM7,8MB FLASH,CONNECTIVITY,144BG
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (12x12)
Number of I/O: 108
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DSPIC33CK256MP405-E/M7 DSPIC33CK256MP405-E/M7 Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 48VFQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 19x12b SAR; D/A 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 89
auf Bestellung 183 Stücke:
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BZV55C68 BZV55C68 Microchip Technology 150_8298-bzv55-c2v4-c75-pdf.pdf Description: DIODE ZENER 68V DO213AA
Packaging: Bulk
Tolerance: ±6%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 68 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 47.6 V
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JANTX1N5526BUR-1 JANTX1N5526BUR-1 Microchip Technology 1N5518BUR-1_1N5546BUR-1.pdf Description: DIODE ZENER 6.8V 500MW DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 6.2 V
Qualification: MIL-PRF-19500/437
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MIC23656YFT MIC23656-Data-Sheet-20006112B.pdf
MIC23656YFT
Hersteller: Microchip Technology
Description: 6A, 5V SYNCH BUCK REGULATOR W/ I
Packaging: Tube
Package / Case: 16-PowerUFQFN
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 16-FTQFN (2.5x2.5)
Synchronous Rectifier: Yes
Voltage - Output (Max): 1.28V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
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MIC23656-SAYFT MIC23656-Data-Sheet-20006112B.pdf
MIC23656-SAYFT
Hersteller: Microchip Technology
Description: 6A, 5V SYNCH BUCK REGULATOR W/ I
Packaging: Tube
Package / Case: 16-PowerUFQFN
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 16-FTQFN (2.5x2.5)
Synchronous Rectifier: Yes
Voltage - Output (Max): 3.84V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
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MIC23656-HAYFT MIC23656-Data-Sheet-20006112B.pdf
MIC23656-HAYFT
Hersteller: Microchip Technology
Description: 6A, 5V SYNCH BUCK REGULATOR W/ I
Packaging: Tube
Package / Case: 16-PowerUFQFN
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 16-FTQFN (2.5x2.5)
Synchronous Rectifier: Yes
Voltage - Output (Max): 1.28V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
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MIC23656-FAYFT MIC23656-Data-Sheet-20006112B.pdf
MIC23656-FAYFT
Hersteller: Microchip Technology
Description: 6A, 5V SYNCH BUCK REGULATOR W/ I
Packaging: Tube
Package / Case: 16-PowerUFQFN
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 1.6MHz, 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 16-FTQFN (2.5x2.5)
Synchronous Rectifier: Yes
Voltage - Output (Max): 1.28V
Voltage - Input (Min): 2.4V
Voltage - Output (Min/Fixed): 0.6V
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DSC1123AE2-300.0000 DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123AE2-300.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 300.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 300 MHz
Base Resonator: MEMS
auf Bestellung 1055 Stücke:
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Anzahl Preis
7+2.76 EUR
10+2.7 EUR
50+2.66 EUR
1000+2.58 EUR
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DSC1123AE2-200.0000 DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123AE2-200.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 200.0000MHZ LVDS SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA
Supplier Device Package: 6-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 200 MHz
Base Resonator: MEMS
auf Bestellung 113 Stücke:
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Anzahl Preis
7+2.76 EUR
10+2.7 EUR
50+2.66 EUR
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MCP47CVB18T-20E/ST MCP47CXBX4_8-Data-Sheet-20006537B.pdf
MCP47CVB18T-20E/ST
Hersteller: Microchip Technology
Description: IC DAC 10BIT V-OUT 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 10
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 8
INL/DNL (LSB): ±0.25, ±0.25
Differential Output: No
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2500+12.95 EUR
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MCP47CVB18T-20E/ST MCP47CXBX4_8-Data-Sheet-20006537B.pdf
MCP47CVB18T-20E/ST
Hersteller: Microchip Technology
Description: IC DAC 10BIT V-OUT 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 10
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 8
INL/DNL (LSB): ±0.25, ±0.25
Differential Output: No
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2+17.12 EUR
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MCP48CMB18T-20E/ST MCP48CxBx4_8_2021.pdf
MCP48CMB18T-20E/ST
Hersteller: Microchip Technology
Description: IC DAC 10BIT V-OUT 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 10
Data Interface: SPI
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 8
INL/DNL (LSB): ±0.25, ±0.25
Differential Output: No
auf Bestellung 2500 Stücke:
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Anzahl Preis
2500+13.35 EUR
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MCP48CMB18T-20E/ST MCP48CxBx4_8_2021.pdf
MCP48CMB18T-20E/ST
Hersteller: Microchip Technology
Description: IC DAC 10BIT V-OUT 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 10
Data Interface: SPI
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 16µs (Typ)
Supplier Device Package: 20-TSSOP
Architecture: R-2R
Number of D/A Converters: 8
INL/DNL (LSB): ±0.25, ±0.25
Differential Output: No
auf Bestellung 2500 Stücke:
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Anzahl Preis
1+17.6 EUR
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1N5244B 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf
1N5244B
Hersteller: Microchip Technology
Description: DIODE ZENER 14V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 14 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 10 V
Produkt ist nicht verfügbar
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M5KP30A rf01010_rb.pdf
M5KP30A
Hersteller: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 103A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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M15KP30A rf01011_m15kp_rev_e.pdf
M15KP30A
Hersteller: Microchip Technology
Description: TVS DIODE 30VWM 50.7VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 296A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 50.7V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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APTGX75DU170T3AG APTGX75DU170T3AG-IGBT-Module-Datasheet.pdf
Hersteller: Microchip Technology
Description: IGBT MODULE 1700V 145A 524W
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual, Common Emitter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 75A
NTC Thermistor: Yes
Current - Collector (Ic) (Max): 145 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 524 W
Current - Collector Cutoff (Max): 10 µA
Input Capacitance (Cies) @ Vce: 7600 pF @ 25 V
auf Bestellung 9 Stücke:
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1+111.27 EUR
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APTGX300DU120T6G APTGX300DU120T6G-IGBT-Module-Datasheet.pdf
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 415A 1.02KW
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual, Common Emitter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 300A
NTC Thermistor: Yes
Current - Collector (Ic) (Max): 415 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1.02 kW
Current - Collector Cutoff (Max): 24 µA
Input Capacitance (Cies) @ Vce: 60000 pF @ 25 V
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APTGX300DU170T6G APTGX300DU170T6G-IGBT-Module-Datasheet.pdf
Hersteller: Microchip Technology
Description: IGBT MODULE 1700V 385A 1.034KW
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual, Common Emitter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 300A
NTC Thermistor: Yes
Current - Collector (Ic) (Max): 385 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 1.034 kW
Current - Collector Cutoff (Max): 25 µA
Input Capacitance (Cies) @ Vce: 31300 pF @ 25 V
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1+280.16 EUR
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APTGX450DU120T6G APTGX450DU120T6G-IGBT-Module-Datasheet.pdf
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 605A 1.456KW
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual, Common Emitter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 450A
NTC Thermistor: Yes
Current - Collector (Ic) (Max): 605 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1.456 kW
Current - Collector Cutoff (Max): 36 µA
Input Capacitance (Cies) @ Vce: 90000 pF @ 25 V
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1+298.53 EUR
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APTGX600DU120T6G APTGX600DU120T6G-IGBT-Module-Datasheet.pdf
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 805A 1.923KW
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual, Common Emitter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 600A
NTC Thermistor: Yes
Current - Collector (Ic) (Max): 805 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1.923 kW
Current - Collector Cutoff (Max): 50 µA
Input Capacitance (Cies) @ Vce: 120000 pF @ 25 V
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Anzahl Preis
1+360.96 EUR
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APTGX600DU170T6G APTGX600DU170T6G-IGBT-Module-Datasheet.pdf
Hersteller: Microchip Technology
Description: IGBT MODULE 1700V 750A 1.948KW
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual, Common Emitter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 600A
NTC Thermistor: Yes
Current - Collector (Ic) (Max): 750 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 1.948 kW
Current - Collector Cutoff (Max): 50 µA
Input Capacitance (Cies) @ Vce: 62500 pF @ 25 V
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Anzahl Preis
1+447.85 EUR
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AT24C16BY6-YH-T AT24C16B.pdf
AT24C16BY6-YH-T
Hersteller: Microchip Technology
Description: IC EEPROM 16KBIT I2C 8MINI MAP
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-Mini Map (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 550 ns
Memory Organization: 2K x 8
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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1N5300UR-1 1N5283UR-1_1N5314UR-1.pdf
1N5300UR-1
Hersteller: Microchip Technology
Description: DIODE CUR REG 100V 1.43MA 500MW
Packaging: Bulk
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 500mW
Voltage - Anode - Cathode (Vak)(Max): 100V
Regulator Current (Max): 1.43mA
Voltage - Limiting (Max): 1.5V
Produkt ist nicht verfügbar
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1N5302UR-1 1N5283UR-1_1N5314UR-1.pdf
1N5302UR-1
Hersteller: Microchip Technology
Description: DIODE CUR REG 100V 1.65MA 500MW
Packaging: Bulk
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 500mW
Voltage - Anode - Cathode (Vak)(Max): 100V
Regulator Current (Max): 1.65mA
Voltage - Limiting (Max): 1.6V
Produkt ist nicht verfügbar
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1N5302UR-1/TR 1N5283UR-1_1N5314UR-1.pdf
1N5302UR-1/TR
Hersteller: Microchip Technology
Description: DIODE CUR REG 100V 1.65MA 500MW
Packaging: Tape & Reel (TR)
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 500mW
Voltage - Anode - Cathode (Vak)(Max): 100V
Regulator Current (Max): 1.65mA
Voltage - Limiting (Max): 1.6V
Produkt ist nicht verfügbar
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USB7205C/KDX USB7205C-Data-Sheet-00005227.pdf
USB7205C/KDX
Hersteller: Microchip Technology
Description: USB3.1 GEN2 HUB_NO PD_NO TYPE C
Packaging: Tray
Package / Case: 100-VFQFN Exposed Pad
Function: Hub Controller
Interface: I2C
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.3V
Protocol: USB
Supplier Device Package: 100-VQFN (12x12)
auf Bestellung 168 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.1 EUR
25+11.75 EUR
100+11.34 EUR
Mindestbestellmenge: 2
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USB7205C-I/KDX USB7205C-Data-Sheet-00005227.pdf
USB7205C-I/KDX
Hersteller: Microchip Technology
Description: USB3.1 GEN2 HUB_NO PD_NO TYPE C
Packaging: Tray
Package / Case: 100-VFQFN Exposed Pad
Function: Hub Controller
Interface: I2C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Protocol: USB
Supplier Device Package: 100-VQFN (12x12)
auf Bestellung 168 Stücke:
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Anzahl Preis
1+17.6 EUR
25+14.67 EUR
100+14.18 EUR
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USB7205CT/KDX USB7205C-Data-Sheet-00005227.pdf
USB7205CT/KDX
Hersteller: Microchip Technology
Description: USB3.1 GEN2 HUB_NO PD_NO TYPE C
Packaging: Tape & Reel (TR)
Package / Case: 100-VFQFN Exposed Pad
Function: Hub Controller
Interface: I2C
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.3V
Protocol: USB
Supplier Device Package: 100-VQFN (12x12)
Produkt ist nicht verfügbar
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USB7205CT-I/KDX USB7205C-Data-Sheet-00005227.pdf
USB7205CT-I/KDX
Hersteller: Microchip Technology
Description: USB3.1 GEN2 HUB_NO PD_NO TYPE C
Packaging: Tape & Reel (TR)
Package / Case: 100-VFQFN Exposed Pad
Function: Hub Controller
Interface: I2C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Protocol: USB
Supplier Device Package: 100-VQFN (12x12)
Produkt ist nicht verfügbar
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VT-706-EAE-2070-25M0000000
Hersteller: Microchip Technology
Description: TCXO +3.3 VDC CMOS -40C TO +85C
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LXS101-23-3 150_LSX100_LSX700_Series.pdf
LXS101-23-3
Hersteller: Microchip Technology
Description: RF DIODE SCHOTTKY 8V 1A SOT23-3
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: Schottky - 1 Pair Common Anode
Operating Temperature: -55°C ~ 125°C
Capacitance @ Vr, F: 1pF @ 0V, 1MHz
Voltage - Peak Reverse (Max): 8V
Supplier Device Package: SOT-23-3
Current - Max: 1 A
Power Dissipation (Max): 250 mW
auf Bestellung 197 Stücke:
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Anzahl Preis
3+8.54 EUR
Mindestbestellmenge: 3
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MCP6141T-E/OTVAO 20001668E.pdf
MCP6141T-E/OTVAO
Hersteller: Microchip Technology
Description: IC OPAMP GP 1 CIRCUIT SOT23-5
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C
Current - Supply: 600nA
Slew Rate: 0.003V/µs
Gain Bandwidth Product: 100 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 3 mV
Supplier Device Package: SOT-23-5
Grade: Automotive
Number of Circuits: 1
Current - Output / Channel: 20 mA
Voltage - Supply Span (Min): 1.4 V
Voltage - Supply Span (Max): 6 V
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+0.91 EUR
Mindestbestellmenge: 3000
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MCP6141T-E/OTVAO 20001668E.pdf
MCP6141T-E/OTVAO
Hersteller: Microchip Technology
Description: IC OPAMP GP 1 CIRCUIT SOT23-5
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C
Current - Supply: 600nA
Slew Rate: 0.003V/µs
Gain Bandwidth Product: 100 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 3 mV
Supplier Device Package: SOT-23-5
Grade: Automotive
Number of Circuits: 1
Current - Output / Channel: 20 mA
Voltage - Supply Span (Min): 1.4 V
Voltage - Supply Span (Max): 6 V
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15+1.2 EUR
25+1 EUR
100+0.91 EUR
Mindestbestellmenge: 15
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MCP6141T-E/SNVAO 20001668E.pdf
MCP6141T-E/SNVAO
Hersteller: Microchip Technology
Description: IC OPAMP GP 1 CIRCUIT 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Single-Ended
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 600nA
Slew Rate: 0.024V/µs
Gain Bandwidth Product: 100 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 3 mV
Supplier Device Package: 8-SOIC
Number of Circuits: 1
Current - Output / Channel: 20 mA
Voltage - Supply Span (Min): 1.4 V
Voltage - Supply Span (Max): 6 V
Produkt ist nicht verfügbar
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ATA6502T-4BWVAO ATA6500T-4CWVAO.pdf
ATA6502T-4BWVAO
Hersteller: Microchip Technology
Description: CAN FD TRX SBC WITH 5V LDO 1.8 A
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 3.1V ~ 5.5V, 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 10-VDFN (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5000+0.94 EUR
Mindestbestellmenge: 5000
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ATA6502T-4BWVAO ATA6500T-4CWVAO.pdf
ATA6502T-4BWVAO
Hersteller: Microchip Technology
Description: CAN FD TRX SBC WITH 5V LDO 1.8 A
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 3.1V ~ 5.5V, 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 10-VDFN (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15+1.25 EUR
25+1.05 EUR
100+0.94 EUR
Mindestbestellmenge: 15
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JANTX1N5310UR-1 1N5283UR-1_1N5314UR-1.pdf
JANTX1N5310UR-1
Hersteller: Microchip Technology
Description: DIODE CUR REG 100V 3.63MA 500MW
Packaging: Bulk
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Supplier Device Package: DO-213AB (MELF, LL41)
Grade: Military
Power - Max: 500mW
Voltage - Anode - Cathode (Vak)(Max): 100V
Regulator Current (Max): 3.63mA
Voltage - Limiting (Max): 2.35V
Qualification: MIL-PRF-19500/463
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AT80C51SND1C-ROTUL doc4109s.pdf
AT80C51SND1C-ROTUL
Hersteller: Microchip Technology
Description: IC MCU 8BIT ROMLESS 80TQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 80C51
Data Converters: A/D 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Connectivity: I2C, IDE/ATAPI, Memory Card, SPI, UART/USART, USB
Peripherals: Audio, I2S, MP3, PCM, POR, WDT
Supplier Device Package: 80-TQFP (14x14)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC32CM3204JH00048-I/Y8X PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM3204JH00048-I/Y8X
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Supplier Device Package: 48-TQFP (7x7)
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.43 EUR
Mindestbestellmenge: 8
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PIC32CM3204JH00048-I/U5B PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM3204JH00048-I/U5B
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-VQFN (7x7)
auf Bestellung 832 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.5 EUR
Mindestbestellmenge: 8
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PIC32CX5109BZ36048-V/ZWX PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf
Hersteller: Microchip Technology
Description: 48-PIN 64MHZ CM4F CORE WITH INTE
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -108dBm
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 512kB Flash, 64kB ROM, 96kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v6.0, Thread, Zigbee®
Current - Receiving: 14.5mA ~ 20mA
Data Rate (Max): 2Mbps
Current - Transmitting: 21.5mA ~ 50mA
Supplier Device Package: 48-VQFN (6x6)
GPIO: 27
Modulation: DSSS
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, DAC, GPIO, IrDA, I2C, PWM, SPI, UART, USART
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 485 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.82 EUR
25+3.47 EUR
100+3.16 EUR
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PIC32CX5109BZ36048T-V/ZWX PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf
Hersteller: Microchip Technology
Description: 48-PIN 64MHZ CM4F CORE WITH INTE
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -108dBm
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 512kB Flash, 64kB ROM, 96kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v6.0, Thread, Zigbee®
Current - Receiving: 14.5mA ~ 20mA
Data Rate (Max): 2Mbps
Current - Transmitting: 21.5mA ~ 50mA
Supplier Device Package: 48-VQFN (6x6)
GPIO: 27
Modulation: DSSS
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, DAC, GPIO, IrDA, I2C, PWM, SPI, UART, USART
Grade: Automotive
Qualification: AEC-Q100
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PIC32CX5109BZ36048T-V/ZWX PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf
Hersteller: Microchip Technology
Description: 48-PIN 64MHZ CM4F CORE WITH INTE
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -108dBm
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 512kB Flash, 64kB ROM, 96kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v6.0, Thread, Zigbee®
Current - Receiving: 14.5mA ~ 20mA
Data Rate (Max): 2Mbps
Current - Transmitting: 21.5mA ~ 50mA
Supplier Device Package: 48-VQFN (6x6)
GPIO: 27
Modulation: DSSS
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, DAC, GPIO, IrDA, I2C, PWM, SPI, UART, USART
Grade: Automotive
Qualification: AEC-Q100
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PIC32CM3204JH00048T-I/Y8X PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM3204JH00048T-I/Y8X
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Supplier Device Package: 48-TQFP (7x7)
Produkt ist nicht verfügbar
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PIC32CM3204JH00048T-I/U5B PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM3204JH00048T-I/U5B
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-VQFN (7x7)
Produkt ist nicht verfügbar
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PIC32CM6408JH00048T-I/Y8X PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM6408JH00048T-I/U5B PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM3204JH00048-E/Y8X
PIC32CM3204JH00048-E/Y8X
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Supplier Device Package: 48-TQFP (7x7)
Produkt ist nicht verfügbar
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PIC32CM3204JH00048T-E/Y8X PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM3204JH00048T-E/Y8X
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Supplier Device Package: 48-TQFP (7x7)
Produkt ist nicht verfügbar
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PIC32CM3204JH00048-E/U5B
PIC32CM3204JH00048-E/U5B
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-VQFN (7x7)
Produkt ist nicht verfügbar
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PIC32CM3204JH00048T-E/U5B PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM3204JH00048T-E/U5B
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-VQFN (7x7)
Produkt ist nicht verfügbar
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PIC32CM6408JH00048-E/Y8X
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tray
Produkt ist nicht verfügbar
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PIC32CM6408JH00048T-E/Y8X PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM6408JH00048-E/U5B
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tray
Produkt ist nicht verfügbar
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PIC32CM6408JH00048T-E/U5B PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SG2524N sg1524_rev1.2.pdf
SG2524N
Hersteller: Microchip Technology
Description: IC REG CTRLR MULT TOPOLOGY 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Transistor Driver
Mounting Type: Through Hole
Function: Step-Down, Step-Up/Step-Down
Operating Temperature: -25°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 100kHz ~ 300kHz
Topology: Buck, Flyback, Push-Pull
Voltage - Supply (Vcc/Vdd): 8V ~ 40V
Supplier Device Package: 16-PDIP
Synchronous Rectifier: Yes
Control Features: Enable
Output Phases: 1
Duty Cycle (Max): 49%
Clock Sync: No
Number of Outputs: 2
Produkt ist nicht verfügbar
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M1.5KE250A RF01008_rE.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 214VWM 344VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5A
Voltage - Reverse Standoff (Typ): 214V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 237V
Voltage - Clamping (Max) @ Ipp: 344V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PIC32CZ4010CA80144-I/LUX PIC32CZ-CA80-CA90-Family-Data-Sheet-DS60001749.pdf
PIC32CZ4010CA80144-I/LUX
Hersteller: Microchip Technology
Description: CM7,4MB FLASH,CONNECTIVITY,144BG
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (12x12)
Number of I/O: 108
auf Bestellung 184 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.22 EUR
25+11.99 EUR
100+10.9 EUR
Mindestbestellmenge: 2
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PIC32CZ8110CA80144-I/LUX PIC32CZ-CA80-CA90-Family-Data-Sheet-DS60001749.pdf
PIC32CZ8110CA80144-I/LUX
Hersteller: Microchip Technology
Description: CM7,8MB FLASH,CONNECTIVITY,144BG
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (12x12)
Number of I/O: 108
auf Bestellung 189 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.58 EUR
25+14.14 EUR
100+12.86 EUR
Mindestbestellmenge: 2
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DSPIC33CK256MP405-E/M7 dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
DSPIC33CK256MP405-E/M7
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48VFQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 19x12b SAR; D/A 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 89
auf Bestellung 183 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.47 EUR
25+4.06 EUR
100+3.69 EUR
Mindestbestellmenge: 4
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BZV55C68 150_8298-bzv55-c2v4-c75-pdf.pdf
BZV55C68
Hersteller: Microchip Technology
Description: DIODE ZENER 68V DO213AA
Packaging: Bulk
Tolerance: ±6%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 68 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 47.6 V
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JANTX1N5526BUR-1 1N5518BUR-1_1N5546BUR-1.pdf
JANTX1N5526BUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 6.8V 500MW DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.8 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 6.2 V
Qualification: MIL-PRF-19500/437
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