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MCP48FVB14T-E/MQ MCP48FVB14T-E/MQ Microchip Technology MCP48FXBX4-8-Family-Data-Sheet-DS20006362A.pdf Description: IC DAC 10BIT 20-VQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VQFN Exposed Pad
Output Type: Voltage - Unbuffered
Mounting Type: Surface Mount
Number of Bits: 10
Data Interface: SPI
Reference Type: External
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 2.7V ~ 5.5V
Voltage - Supply, Digital: 2.7V ~ 5.5V
Settling Time: 7.8µs (Typ)
Supplier Device Package: 20-VQFN (5x5)
Number of D/A Converters: 4
INL/DNL (LSB): ±0.4LSB, ±0.05LSB
Differential Output: No
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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JAN1N6117A JAN1N6117A Microchip Technology lds-0277.pdf Description: TVS DIODE 22.8VWM 41.6V AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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1N6117AUS/TR 1N6117AUS/TR Microchip Technology lds-0277-1.pdf Description: TVS DIODE 22.8VWM 41.6VC SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
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JAN1N6117AUS/TR JAN1N6117AUS/TR Microchip Technology 1N6103AUS%20-%201N6137AUS.pdf Description: TVS DIODE 22.8VWM 41.6VC SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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JANTX1N6117A/TR JANTX1N6117A/TR Microchip Technology 1N6103A-1N6137A.pdf Description: TVS DIODE 22.8VWM 41.6V AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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JANTX1N6117AUS/TR JANTX1N6117AUS/TR Microchip Technology 1N6103AUS%20-%201N6137AUS.pdf Description: TVS DIODE 22.8VWM 41.6VC SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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JANTXV1N6117A JANTXV1N6117A Microchip Technology lds-0277.pdf Description: TVS DIODE 22.8VWM 41.6V AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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JANTXV1N6117AUS JANTXV1N6117AUS Microchip Technology lds-0277-1.pdf Description: TVS DIODE 22.8VWM 41.6VC SQMELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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JANTXV1N6117AUS/TR JANTXV1N6117AUS/TR Microchip Technology 1N6103AUS%20-%201N6137AUS.pdf Description: TVS DIODE 22.8VWM 41.6VC SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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JANS1N6117AUS JANS1N6117AUS Microchip Technology 1N6103AUS-1N6137AUS.pdf Description: TVS DIODE 22.8VWM 41.6VC SQMELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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JANS1N6117AUS/TR JANS1N6117AUS/TR Microchip Technology 1N6103AUS-1N6137AUS.pdf Description: TVS DIODE 22.8VWM 41.6VC SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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JANS1N6117A JANS1N6117A Microchip Technology 1N6103A-1N6137A.pdf Description: TVS DIODE 22.8VWM 41.6VC B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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MCP8022T-5015H/NHXVAO MCP8022T-5015H/NHXVAO Microchip Technology MCP8021-Data-Sheet-DS20006265.pdf Description: 3-PHASE BRUSHLESS DC MOTOR GATE
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Current - Output: 500mA
Interface: Analog, PWM
Operating Temperature: -40°C ~ 150°C (TA)
Output Configuration: Pre-Driver - Half Bridge (3)
Voltage - Supply: 4V ~ 40V
Applications: General Purpose
Technology: NMOS
Voltage - Load: 6.25V ~ 29V
Supplier Device Package: 40-VQFN (5x5)
Motor Type - Stepper: Multiphase
Motor Type - AC, DC: Brushless DC (BLDC)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCP8022T-5015H/SBXVAO Microchip Technology MCP8021-Data-Sheet-DS20006265.pdf Description: 3-PHASE BRUSHLESS DC MOTOR GATE
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Controller - Speed
Current - Output: 500mA
Interface: Analog, PWM
Operating Temperature: -40°C ~ 150°C (TA)
Output Configuration: Pre-Driver - Half Bridge (3)
Voltage - Supply: 4V ~ 40V
Applications: General Purpose
Technology: NMOS
Voltage - Load: 6.25V ~ 29V
Supplier Device Package: 38-TSSOP-EP
Motor Type - Stepper: Multiphase
Motor Type - AC, DC: Brushless DC (BLDC)
Grade: Automotive
Qualification: AEC-Q100
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AT91SAM7SE32-CU AT91SAM7SE32-CU Microchip Technology 6222s.pdf Description: IC MCU 16/32BIT 32KB FLSH 144BGA
Packaging: Tray
Package / Case: 144-LFBGA
Mounting Type: Surface Mount
Speed: 55MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 144-BGA (13x13)
Number of I/O: 88
DigiKey Programmable: Not Verified
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AT91SAM7SE32-CU-999 AT91SAM7SE32-CU-999 Microchip Technology 6222s.pdf Description: IC MCU 16/32BIT 32KB FLSH 144BGA
Packaging: Tape & Reel (TR)
Package / Case: 144-LFBGA
Mounting Type: Surface Mount
Speed: 55MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 144-BGA (13x13)
Number of I/O: 88
DigiKey Programmable: Not Verified
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DSA6011AL1B-032K768VAO DSA6011AL1B-032K768VAO Microchip Technology DSA60xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006221.pdf Description: MEMS OSC, AUTO, LVCMOS, 32.768KH
Packaging: Tube
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 MHz
Base Resonator: MEMS
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100+1.48 EUR
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PIC32CM6408PL10028-I/3LW PIC32CM6408PL10028-I/3LW Microchip Technology PIC32CM6408PL10-028-032-048-064-DataSheet-DS40002667.pdf Description: CM0+, 64KB, 24MHZ, 5V, 12BIT ADC
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 22
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PIC32CM6408PL10064-I/5LX PIC32CM6408PL10064-I/5LX Microchip Technology PIC32CM6408PL10-028-032-048-064-DataSheet-DS40002667.pdf Description: CM0+, 64KB, 24MHZ, 5V, 12BIT ADC
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 29x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 55
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PIC32CM6408PL10028-I/SP PIC32CM6408PL10028-I/SP Microchip Technology PIC32CM6408PL10-028-032-048-064-DataSheet-DS40002667.pdf Description: CM0+, 64KB, 24MHZ, 5V, 12BIT ADC
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 22
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090-02984-007 090-02984-007 Microchip Technology 00002982.pdf Description: IC EMBEDDED ATOMIC CLOCKS
Packaging: Tray
Package / Case: 12-DIP Module, 9 Leads
Mounting Type: Through Hole
Type: Embedded Atomic Clocks
DigiKey Programmable: Not Verified
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CDLL5226D CDLL5226D Microchip Technology 8394-cdll5221-cdll5272b-pdf.pdf Description: DIODE ZENER 3.3V DO-213AA
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 28 Ohms
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 25 µA @ 1 V
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CDLL5226D/TR CDLL5226D/TR Microchip Technology 8394-cdll5221-cdll5272b-pdf.pdf Description: DIODE ZENER 3.3V DO-213AA
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 28 Ohms
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 25 µA @ 1 V
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JANSK2N2222AUB JANSK2N2222AUB Microchip Technology 2n2222-d.pdf Description: SMALL-SIGNAL BJT _ UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500
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JANSU2N2222AUB/TR Microchip Technology Description: SMALL-SIGNAL BJT
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500
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JANSE2N2222AUB JANSE2N2222AUB Microchip Technology 2n2222-d.pdf Description: SMALL-SIGNAL BJT _ UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500
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JAN1N1128RA JAN1N1128RA Microchip Technology LDS-0135.pdf Description: DIODE STANDARD REV 600V DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 150°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2.2 V @ 10 A
Current - Reverse Leakage @ Vr: 5 µA @ 600 V
Qualification: MIL-PRF-19500/260
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DSA1121DL1-050.0000TVAO DSA1121DL1-050.0000TVAO Microchip Technology DSA1101-21-05-25-Low-Jitter-CMOS-Oscillator-for-Automotive-DS20005890C.pdf Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1121DL1-050.0000VAO DSA1121DL1-050.0000VAO Microchip Technology DSA1101-21-05-25-Low-Jitter-CMOS-Oscillator-for-Automotive-DS20005890C.pdf Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1121DL2-014.7456TVAO DSA1121DL2-014.7456TVAO Microchip Technology DSA1101-21-05-25-Low-Jitter-CMOS-Oscillator-for-Automotive-DS20005890C.pdf Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.7456 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1121DL2-011.2896VAO DSA1121DL2-011.2896VAO Microchip Technology DSA1101-21-05-25-Low-Jitter-CMOS-Oscillator-for-Automotive-DS20005890C.pdf Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 11.2896 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1121DL2-011.2896TVAO DSA1121DL2-011.2896TVAO Microchip Technology DSA1101-21-05-25-Low-Jitter-CMOS-Oscillator-for-Automotive-DS20005890C.pdf Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 11.2896 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1121DL2-014.7456VAO DSA1121DL2-014.7456VAO Microchip Technology DSA1101-21-05-25-Low-Jitter-CMOS-Oscillator-for-Automotive-DS20005890C.pdf Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.7456 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MART100KP170CA MART100KP170CA Microchip Technology MRT100KP40A%E2%80%93MXLRT100KP400CA.pdf Description: TVS DIODE 170VWM 334VC CASE 5A
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: Case 5A (DO-204AR)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 189V
Voltage - Clamping (Max) @ Ipp: 334V
Power - Peak Pulse: 100000W (100kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MASMCGLCE90Ae3 MASMCGLCE90Ae3 Microchip Technology Description: TVS DIODE 90VWM 146VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 90pF @ 1MHz
Current - Peak Pulse (10/1000µs): 10.3A
Voltage - Reverse Standoff (Typ): 90V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 100V
Voltage - Clamping (Max) @ Ipp: 146V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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JAN1N3032D-1 JAN1N3032D-1 Microchip Technology 1N3016B-1N3045B.pdf Description: DIODE ZENER 33V 1W DO204AL
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 25.1 V
Qualification: MIL-PRF-19500/115
Produkt ist nicht verfügbar
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GC4701-01 Microchip Technology GC4700_Series.pdf Description: RF DIODE PIN 20V 2W CHIP
Packaging: Tray
Package / Case: Die
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.15pF @ 6V, 1MHz
Resistance @ If, F: 1.5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 20V
Supplier Device Package: Chip
Power Dissipation (Max): 2 W
Produkt ist nicht verfügbar
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MSMCJ5.0A MSMCJ5.0A Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 5VWM 9.2VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 163A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 9.2V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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PM42036B1-F3EI Microchip Technology 00002987.pdf Description: PCIE SWITCH GEN4 X36 PAX 753BBGA
Packaging: Tray
Package / Case: 753-BBGA
Mounting Type: Surface Mount
Interface: PCI
Applications: PCIe Switch
Supplier Device Package: 753-BBGA (29x29)
Produkt ist nicht verfügbar
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ATMEGA48A-CCU ATMEGA48A-CCU Microchip Technology ATmega48A-PA-88A-PA-168A-PA-328-P-DS-DS40002061B.pdf Description: IC MCU 8BIT 4KB FLASH 32UFBGA
Packaging: Tray
Package / Case: 32-UFBGA
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-UFBGA (4x4)
Number of I/O: 23
DigiKey Programmable: Not Verified
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25+1.31 EUR
100+1.18 EUR
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ATMEGA48A-CCU ATMEGA48A-CCU Microchip Technology ATmega48A-PA-88A-PA-168A-PA-328-P-DS-DS40002061B.pdf Description: IC MCU 8BIT 4KB FLASH 32UFBGA
Packaging: Tray
Package / Case: 32-UFBGA
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-UFBGA (4x4)
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAM9X60D6K-I/4GB-SL3 Microchip Technology SAM9X60-Data-Sheet-DS60001579.pdf Description: ARM926 MPU,BGA,IND TEMP,64MB SDR
Packaging: Tray
Package / Case: 196-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 196-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
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SAM9X60D6KT-I/4GB-SL3 Microchip Technology SAM9X60-Data-Sheet-DS60001579.pdf Description: ARM926 MPU,BGA,IND TEMP,64MB SDR
Packaging: Tape & Reel (TR)
Package / Case: 196-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 196-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
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SAM9X60D5M-I/4FB-SL3 Microchip Technology SAM9X60-Data-Sheet-DS60001579.pdf Description: ARM926 MPU,BGA,IND TEMP,512MBIT
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
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SAM9X60D5MT-I/4FB-SL3 Microchip Technology SAM9X60-Data-Sheet-DS60001579.pdf Description: ARM926 MPU,BGA,IND TEMP,512MBIT
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
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SAM9X60D1G-I/4FB-SL3 Microchip Technology SAM9X60-Data-Sheet-DS60001579.pdf Description: ARM926 MPU,BGA,IND TEMP,1GBIT DD
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
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SAM9X60D1GT-I/4FB-SL3 Microchip Technology SAM9X60-Data-Sheet-DS60001579.pdf Description: ARM926 MPU,BGA,IND TEMP,1GBIT DD
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
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SAM9X60T-V/DWB-SL3 Microchip Technology ATSAM9X60_D.pdf Description: ARM926 MPU, BGA, EXT. TEMP, T&R
Packaging: Tape & Reel (TR)
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
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SAM9X60-V/DWB-SL3 Microchip Technology ATSAM9X60_D.pdf Description: ARM926 MPU, BGA, EXT. TEMP
Packaging: Tray
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
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M1.5KE180A Microchip Technology RF01008_rE.pdf Description: TVS DIODE 154VWM 246VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.1A
Voltage - Reverse Standoff (Typ): 154V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 171V
Voltage - Clamping (Max) @ Ipp: 246V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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ATMEGA324PB-AUR ATMEGA324PB-AUR Microchip Technology 40001928A.pdf Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 39
DigiKey Programmable: Not Verified
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ATMEGA324PB-AUR ATMEGA324PB-AUR Microchip Technology 40001928A.pdf Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 39
DigiKey Programmable: Not Verified
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5+4.25 EUR
25+4.15 EUR
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MCP1824T-ADJE/OTVAO MCP1824T-ADJE/OTVAO Microchip Technology 22070a.pdf Description: IC REG LIN POS ADJ 300MA SOT23-5
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-23-5
Voltage - Output (Max): 5V
Voltage - Output (Min/Fixed): 0.8V
Control Features: Enable, Power Good
Grade: Automotive
PSRR: 55dB (100Hz)
Voltage Dropout (Max): 0.32V @ 300mA
Protection Features: Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
Qualification: AEC-Q100
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MCP1824T-ADJE/OTVAO MCP1824T-ADJE/OTVAO Microchip Technology 22070a.pdf Description: IC REG LIN POS ADJ 300MA SOT23-5
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-23-5
Voltage - Output (Max): 5V
Voltage - Output (Min/Fixed): 0.8V
Control Features: Enable, Power Good
Grade: Automotive
PSRR: 55dB (100Hz)
Voltage Dropout (Max): 0.32V @ 300mA
Protection Features: Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
Qualification: AEC-Q100
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39+0.55 EUR
47+0.45 EUR
100+0.44 EUR
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MCP41U83T-502E/ST MCP41U83T-502E/ST Microchip Technology MCP41U83-Data-Sheet-DS20007000.pdf Description: IC DIG POT 5K 14-TSSOP
Packaging: Tape & Reel (TR)
Resistance (Ohms): 5k
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Non-Volatile
Interface: SPI
Configuration: Potentiometer, Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 1024
Voltage - Supply: 2.7V ~ 5.5V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 19
Temperature Coefficient (Typ): 43ppm/°C
Number of Circuits: 1
Produkt ist nicht verfügbar
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MCP41U83T-502E/ST MCP41U83T-502E/ST Microchip Technology MCP41U83-Data-Sheet-DS20007000.pdf Description: IC DIG POT 5K 14-TSSOP
Packaging: Cut Tape (CT)
Resistance (Ohms): 5k
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Non-Volatile
Interface: SPI
Configuration: Potentiometer, Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 1024
Voltage - Supply: 2.7V ~ 5.5V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 19
Temperature Coefficient (Typ): 43ppm/°C
Number of Circuits: 1
auf Bestellung 1917 Stücke:
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24LC025T/SN 24LC025T/SN Microchip Technology 24AA024-24LC024-24AA025-24LC025-2-Kbit-I2C-Serial-EEPROM-DS20001210.pdf Description: IC EEPROM 2KBIT I2C 400KHZ 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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24LC025T/SN 24LC025T/SN Microchip Technology 24AA024-24LC024-24AA025-24LC025-2-Kbit-I2C-Serial-EEPROM-DS20001210.pdf Description: IC EEPROM 2KBIT I2C 400KHZ 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
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32+0.67 EUR
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AT89C51IC2-RLTUM AT89C51IC2-RLTUM Microchip Technology doc4301.pdf Description: IC MCU 8BIT 32KB FLASH 44VQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-VQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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VN0104N3-G-P013 VN0104N3-G-P013 Microchip Technology VN0104-N-Channel-Enhancement-Mode-Vertical-DMOS-FET-Data-Sheet-20005975A.pdf Description: MOSFET N-CH 40V 350MA TO92-3
Packaging: Cut Tape (CT)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Tj)
Rds On (Max) @ Id, Vgs: 3Ohm @ 1A, 10V
Power Dissipation (Max): 1W (Tc)
Vgs(th) (Max) @ Id: 2.4V @ 1mA
Supplier Device Package: TO-92-3
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 65 pF @ 25 V
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14+1.59 EUR
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MCP48FVB14T-E/MQ MCP48FXBX4-8-Family-Data-Sheet-DS20006362A.pdf
Hersteller: Microchip Technology
Description: IC DAC 10BIT 20-VQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VQFN Exposed Pad
Output Type: Voltage - Unbuffered
Mounting Type: Surface Mount
Number of Bits: 10
Data Interface: SPI
Reference Type: External
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 2.7V ~ 5.5V
Voltage - Supply, Digital: 2.7V ~ 5.5V
Settling Time: 7.8µs (Typ)
Supplier Device Package: 20-VQFN (5x5)
Number of D/A Converters: 4
INL/DNL (LSB): ±0.4LSB, ±0.05LSB
Differential Output: No
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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JAN1N6117A lds-0277.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 22.8VWM 41.6V AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
Produkt ist nicht verfügbar
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1N6117AUS/TR lds-0277-1.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 22.8VWM 41.6VC SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Produkt ist nicht verfügbar
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JAN1N6117AUS/TR 1N6103AUS%20-%201N6137AUS.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 22.8VWM 41.6VC SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
Produkt ist nicht verfügbar
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JANTX1N6117A/TR 1N6103A-1N6137A.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 22.8VWM 41.6V AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
Produkt ist nicht verfügbar
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JANTX1N6117AUS/TR 1N6103AUS%20-%201N6137AUS.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 22.8VWM 41.6VC SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
Produkt ist nicht verfügbar
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JANTXV1N6117A lds-0277.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 22.8VWM 41.6V AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
Produkt ist nicht verfügbar
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JANTXV1N6117AUS lds-0277-1.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 22.8VWM 41.6VC SQMELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
Produkt ist nicht verfügbar
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JANTXV1N6117AUS/TR 1N6103AUS%20-%201N6137AUS.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 22.8VWM 41.6VC SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
Produkt ist nicht verfügbar
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JANS1N6117AUS 1N6103AUS-1N6137AUS.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 22.8VWM 41.6VC SQMELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
Produkt ist nicht verfügbar
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JANS1N6117AUS/TR 1N6103AUS-1N6137AUS.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 22.8VWM 41.6VC SQMELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, SQ-MELF
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
Produkt ist nicht verfügbar
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JANS1N6117A 1N6103A-1N6137A.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 22.8VWM 41.6VC B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 12A
Voltage - Reverse Standoff (Typ): 22.8V
Supplier Device Package: B, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 28.5V
Voltage - Clamping (Max) @ Ipp: 41.6V
Power - Peak Pulse: 500W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
Produkt ist nicht verfügbar
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MCP8022T-5015H/NHXVAO MCP8021-Data-Sheet-DS20006265.pdf
Hersteller: Microchip Technology
Description: 3-PHASE BRUSHLESS DC MOTOR GATE
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Controller - Speed
Current - Output: 500mA
Interface: Analog, PWM
Operating Temperature: -40°C ~ 150°C (TA)
Output Configuration: Pre-Driver - Half Bridge (3)
Voltage - Supply: 4V ~ 40V
Applications: General Purpose
Technology: NMOS
Voltage - Load: 6.25V ~ 29V
Supplier Device Package: 40-VQFN (5x5)
Motor Type - Stepper: Multiphase
Motor Type - AC, DC: Brushless DC (BLDC)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCP8022T-5015H/SBXVAO MCP8021-Data-Sheet-DS20006265.pdf
Hersteller: Microchip Technology
Description: 3-PHASE BRUSHLESS DC MOTOR GATE
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Controller - Speed
Current - Output: 500mA
Interface: Analog, PWM
Operating Temperature: -40°C ~ 150°C (TA)
Output Configuration: Pre-Driver - Half Bridge (3)
Voltage - Supply: 4V ~ 40V
Applications: General Purpose
Technology: NMOS
Voltage - Load: 6.25V ~ 29V
Supplier Device Package: 38-TSSOP-EP
Motor Type - Stepper: Multiphase
Motor Type - AC, DC: Brushless DC (BLDC)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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AT91SAM7SE32-CU 6222s.pdf
Hersteller: Microchip Technology
Description: IC MCU 16/32BIT 32KB FLSH 144BGA
Packaging: Tray
Package / Case: 144-LFBGA
Mounting Type: Surface Mount
Speed: 55MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 144-BGA (13x13)
Number of I/O: 88
DigiKey Programmable: Not Verified
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AT91SAM7SE32-CU-999 6222s.pdf
Hersteller: Microchip Technology
Description: IC MCU 16/32BIT 32KB FLSH 144BGA
Packaging: Tape & Reel (TR)
Package / Case: 144-LFBGA
Mounting Type: Surface Mount
Speed: 55MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 144-BGA (13x13)
Number of I/O: 88
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DSA6011AL1B-032K768VAO DSA60xx-Ultra-Small-Low-Power-MEMS-Oscillator-for-Automotive-DS20006221.pdf
Hersteller: Microchip Technology
Description: MEMS OSC, AUTO, LVCMOS, 32.768KH
Packaging: Tube
Package / Case: 4-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 MHz
Base Resonator: MEMS
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AnzahlPrivatkunde
12+1.82 EUR
25+1.52 EUR
100+1.48 EUR
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PIC32CM6408PL10028-I/3LW PIC32CM6408PL10-028-032-048-064-DataSheet-DS40002667.pdf
Hersteller: Microchip Technology
Description: CM0+, 64KB, 24MHZ, 5V, 12BIT ADC
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 22
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AnzahlPrivatkunde
18+1.18 EUR
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PIC32CM6408PL10064-I/5LX PIC32CM6408PL10-028-032-048-064-DataSheet-DS40002667.pdf
Hersteller: Microchip Technology
Description: CM0+, 64KB, 24MHZ, 5V, 12BIT ADC
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 29x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 55
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AnzahlPrivatkunde
11+1.96 EUR
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PIC32CM6408PL10028-I/SP PIC32CM6408PL10-028-032-048-064-DataSheet-DS40002667.pdf
Hersteller: Microchip Technology
Description: CM0+, 64KB, 24MHZ, 5V, 12BIT ADC
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 22
auf Bestellung 278 Stücke:
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AnzahlPrivatkunde
7+3.01 EUR
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090-02984-007 00002982.pdf
Hersteller: Microchip Technology
Description: IC EMBEDDED ATOMIC CLOCKS
Packaging: Tray
Package / Case: 12-DIP Module, 9 Leads
Mounting Type: Through Hole
Type: Embedded Atomic Clocks
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CDLL5226D 8394-cdll5221-cdll5272b-pdf.pdf
Hersteller: Microchip Technology
Description: DIODE ZENER 3.3V DO-213AA
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 28 Ohms
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 25 µA @ 1 V
Produkt ist nicht verfügbar
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CDLL5226D/TR 8394-cdll5221-cdll5272b-pdf.pdf
Hersteller: Microchip Technology
Description: DIODE ZENER 3.3V DO-213AA
Packaging: Tape & Reel (TR)
Tolerance: ±1%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.3 V
Impedance (Max) (Zzt): 28 Ohms
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 25 µA @ 1 V
Produkt ist nicht verfügbar
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JANSK2N2222AUB 2n2222-d.pdf
Hersteller: Microchip Technology
Description: SMALL-SIGNAL BJT _ UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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JANSU2N2222AUB/TR
Hersteller: Microchip Technology
Description: SMALL-SIGNAL BJT
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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JANSE2N2222AUB 2n2222-d.pdf
Hersteller: Microchip Technology
Description: SMALL-SIGNAL BJT _ UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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JAN1N1128RA LDS-0135.pdf
Hersteller: Microchip Technology
Description: DIODE STANDARD REV 600V DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 150°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2.2 V @ 10 A
Current - Reverse Leakage @ Vr: 5 µA @ 600 V
Qualification: MIL-PRF-19500/260
Produkt ist nicht verfügbar
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DSA1121DL1-050.0000TVAO DSA1101-21-05-25-Low-Jitter-CMOS-Oscillator-for-Automotive-DS20005890C.pdf
Hersteller: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1121DL1-050.0000VAO DSA1101-21-05-25-Low-Jitter-CMOS-Oscillator-for-Automotive-DS20005890C.pdf
Hersteller: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1121DL2-014.7456TVAO DSA1101-21-05-25-Low-Jitter-CMOS-Oscillator-for-Automotive-DS20005890C.pdf
Hersteller: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.7456 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1121DL2-011.2896VAO DSA1101-21-05-25-Low-Jitter-CMOS-Oscillator-for-Automotive-DS20005890C.pdf
Hersteller: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 11.2896 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1121DL2-011.2896TVAO DSA1101-21-05-25-Low-Jitter-CMOS-Oscillator-for-Automotive-DS20005890C.pdf
Hersteller: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 11.2896 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSA1121DL2-014.7456VAO DSA1101-21-05-25-Low-Jitter-CMOS-Oscillator-for-Automotive-DS20005890C.pdf
Hersteller: Microchip Technology
Description: MEMS OSC., AUTOMOTIVE, -40-105C,
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 35mA
Supplier Device Package: 6-VDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 14.7456 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MART100KP170CA MRT100KP40A%E2%80%93MXLRT100KP400CA.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 170VWM 334VC CASE 5A
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Voltage - Reverse Standoff (Typ): 170V
Supplier Device Package: Case 5A (DO-204AR)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 189V
Voltage - Clamping (Max) @ Ipp: 334V
Power - Peak Pulse: 100000W (100kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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MASMCGLCE90Ae3
Hersteller: Microchip Technology
Description: TVS DIODE 90VWM 146VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Capacitance @ Frequency: 90pF @ 1MHz
Current - Peak Pulse (10/1000µs): 10.3A
Voltage - Reverse Standoff (Typ): 90V
Supplier Device Package: DO-214AB (SMCG)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 100V
Voltage - Clamping (Max) @ Ipp: 146V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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JAN1N3032D-1 1N3016B-1N3045B.pdf
Hersteller: Microchip Technology
Description: DIODE ZENER 33V 1W DO204AL
Packaging: Bulk
Tolerance: ±1%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 25.1 V
Qualification: MIL-PRF-19500/115
Produkt ist nicht verfügbar
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GC4701-01 GC4700_Series.pdf
Hersteller: Microchip Technology
Description: RF DIODE PIN 20V 2W CHIP
Packaging: Tray
Package / Case: Die
Diode Type: PIN - Single
Operating Temperature: -55°C ~ 150°C
Capacitance @ Vr, F: 0.15pF @ 6V, 1MHz
Resistance @ If, F: 1.5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 20V
Supplier Device Package: Chip
Power Dissipation (Max): 2 W
Produkt ist nicht verfügbar
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MSMCJ5.0A rf01001_rev_b_final-pd-000307351.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 5VWM 9.2VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 163A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 9.2V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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PM42036B1-F3EI 00002987.pdf
Hersteller: Microchip Technology
Description: PCIE SWITCH GEN4 X36 PAX 753BBGA
Packaging: Tray
Package / Case: 753-BBGA
Mounting Type: Surface Mount
Interface: PCI
Applications: PCIe Switch
Supplier Device Package: 753-BBGA (29x29)
Produkt ist nicht verfügbar
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ATMEGA48A-CCU ATmega48A-PA-88A-PA-168A-PA-328-P-DS-DS40002061B.pdf
Hersteller: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 32UFBGA
Packaging: Tray
Package / Case: 32-UFBGA
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-UFBGA (4x4)
Number of I/O: 23
DigiKey Programmable: Not Verified
auf Bestellung 804 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
15+1.4 EUR
25+1.31 EUR
100+1.18 EUR
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ATMEGA48A-CCU ATmega48A-PA-88A-PA-168A-PA-328-P-DS-DS40002061B.pdf
Hersteller: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 32UFBGA
Packaging: Tray
Package / Case: 32-UFBGA
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-UFBGA (4x4)
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAM9X60D6K-I/4GB-SL3 SAM9X60-Data-Sheet-DS60001579.pdf
Hersteller: Microchip Technology
Description: ARM926 MPU,BGA,IND TEMP,64MB SDR
Packaging: Tray
Package / Case: 196-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 196-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
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SAM9X60D6KT-I/4GB-SL3 SAM9X60-Data-Sheet-DS60001579.pdf
Hersteller: Microchip Technology
Description: ARM926 MPU,BGA,IND TEMP,64MB SDR
Packaging: Tape & Reel (TR)
Package / Case: 196-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 196-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
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SAM9X60D5M-I/4FB-SL3 SAM9X60-Data-Sheet-DS60001579.pdf
Hersteller: Microchip Technology
Description: ARM926 MPU,BGA,IND TEMP,512MBIT
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
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SAM9X60D5MT-I/4FB-SL3 SAM9X60-Data-Sheet-DS60001579.pdf
Hersteller: Microchip Technology
Description: ARM926 MPU,BGA,IND TEMP,512MBIT
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
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SAM9X60D1G-I/4FB-SL3 SAM9X60-Data-Sheet-DS60001579.pdf
Hersteller: Microchip Technology
Description: ARM926 MPU,BGA,IND TEMP,1GBIT DD
Packaging: Tray
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
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SAM9X60D1GT-I/4FB-SL3 SAM9X60-Data-Sheet-DS60001579.pdf
Hersteller: Microchip Technology
Description: ARM926 MPU,BGA,IND TEMP,1GBIT DD
Packaging: Tape & Reel (TR)
Package / Case: 233-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 233-TFBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, DMA, EBI/EMI, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART
Produkt ist nicht verfügbar
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SAM9X60T-V/DWB-SL3 ATSAM9X60_D.pdf
Hersteller: Microchip Technology
Description: ARM926 MPU, BGA, EXT. TEMP, T&R
Packaging: Tape & Reel (TR)
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
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SAM9X60-V/DWB-SL3 ATSAM9X60_D.pdf
Hersteller: Microchip Technology
Description: ARM926 MPU, BGA, EXT. TEMP
Packaging: Tray
Package / Case: 228-TFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 228-TFBGA (11x11)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (5)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR, LPSDR, SRAM
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
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M1.5KE180A RF01008_rE.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 154VWM 246VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 6.1A
Voltage - Reverse Standoff (Typ): 154V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 171V
Voltage - Clamping (Max) @ Ipp: 246V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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ATMEGA324PB-AUR 40001928A.pdf
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 39
DigiKey Programmable: Not Verified
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ATMEGA324PB-AUR 40001928A.pdf
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Cut Tape (CT)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 39
DigiKey Programmable: Not Verified
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MCP1824T-ADJE/OTVAO 22070a.pdf
Hersteller: Microchip Technology
Description: IC REG LIN POS ADJ 300MA SOT23-5
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-23-5
Voltage - Output (Max): 5V
Voltage - Output (Min/Fixed): 0.8V
Control Features: Enable, Power Good
Grade: Automotive
PSRR: 55dB (100Hz)
Voltage Dropout (Max): 0.32V @ 300mA
Protection Features: Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
Qualification: AEC-Q100
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MCP1824T-ADJE/OTVAO 22070a.pdf
Hersteller: Microchip Technology
Description: IC REG LIN POS ADJ 300MA SOT23-5
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-23-5
Voltage - Output (Max): 5V
Voltage - Output (Min/Fixed): 0.8V
Control Features: Enable, Power Good
Grade: Automotive
PSRR: 55dB (100Hz)
Voltage Dropout (Max): 0.32V @ 300mA
Protection Features: Over Temperature, Short Circuit, Under Voltage Lockout (UVLO)
Qualification: AEC-Q100
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MCP41U83T-502E/ST MCP41U83-Data-Sheet-DS20007000.pdf
Hersteller: Microchip Technology
Description: IC DIG POT 5K 14-TSSOP
Packaging: Tape & Reel (TR)
Resistance (Ohms): 5k
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Non-Volatile
Interface: SPI
Configuration: Potentiometer, Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 1024
Voltage - Supply: 2.7V ~ 5.5V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 19
Temperature Coefficient (Typ): 43ppm/°C
Number of Circuits: 1
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MCP41U83T-502E/ST MCP41U83-Data-Sheet-DS20007000.pdf
Hersteller: Microchip Technology
Description: IC DIG POT 5K 14-TSSOP
Packaging: Cut Tape (CT)
Resistance (Ohms): 5k
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Non-Volatile
Interface: SPI
Configuration: Potentiometer, Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 1024
Voltage - Supply: 2.7V ~ 5.5V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 19
Temperature Coefficient (Typ): 43ppm/°C
Number of Circuits: 1
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24LC025T/SN 24AA024-24LC024-24AA025-24LC025-2-Kbit-I2C-Serial-EEPROM-DS20001210.pdf
Hersteller: Microchip Technology
Description: IC EEPROM 2KBIT I2C 400KHZ 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
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24LC025T/SN 24AA024-24LC024-24AA025-24LC025-2-Kbit-I2C-Serial-EEPROM-DS20001210.pdf
Hersteller: Microchip Technology
Description: IC EEPROM 2KBIT I2C 400KHZ 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 256 x 8
DigiKey Programmable: Not Verified
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AT89C51IC2-RLTUM doc4301.pdf
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 44VQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-VQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
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VN0104N3-G-P013 VN0104-N-Channel-Enhancement-Mode-Vertical-DMOS-FET-Data-Sheet-20005975A.pdf
Hersteller: Microchip Technology
Description: MOSFET N-CH 40V 350MA TO92-3
Packaging: Cut Tape (CT)
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Tj)
Rds On (Max) @ Id, Vgs: 3Ohm @ 1A, 10V
Power Dissipation (Max): 1W (Tc)
Vgs(th) (Max) @ Id: 2.4V @ 1mA
Supplier Device Package: TO-92-3
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 65 pF @ 25 V
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