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AT91RM9200-QI-002-T AT91RM9200-QI-002-T Microchip Technology 1768s.pdf Description: IC MCU 32BIT 128KB ROM 208PQFP
DigiKey Programmable: Not Verified
Number of I/O: 122
Supplier Device Package: 208-PQFP (28x28)
Peripherals: POR
Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 16/32-Bit
Core Processor: ARM920T
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 48K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tape & Reel (TR)
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JANTX1N5639A JANTX1N5639A Microchip Technology LDS-0096-REV3.pdf Description: TVS DIODE 15.3VWM 25.2VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 59.5A
Voltage - Reverse Standoff (Typ): 15.3V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.1V
Voltage - Clamping (Max) @ Ipp: 25.2V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/500
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1N5645A 1N5645A Microchip Technology LDS-0096-REV3.pdf Description: TVS DIODE 28.2VWM 45.7VC DO13
Applications: General Purpose
Operating Temperature: -65°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-202AA, DO-13, Axial
Packaging: Bulk
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 45.7V
Voltage - Breakdown (Min): 31.4V
Unidirectional Channels: 1
Supplier Device Package: DO-13 (DO-202AA)
Voltage - Reverse Standoff (Typ): 28.2V
Current - Peak Pulse (10/1000µs): 33A
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EV80L65A EV80L65A Microchip Technology dsPIC33AK512MPS512-General-Purpose-DIM-Info-Sheet-DS70005563.pdf Description: DSPIC33AK512MPS512 GP DIM
Platform: Dual-Inline Module (DIM)
Utilized IC / Part: dsPIC33AK512MPS512
Core Processor: dsPIC
Contents: Board(s)
Type: MCU 16-Bit
Mounting Type: Fixed
Packaging: Bulk
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MCP1827S-3302E/EBVAO Microchip Technology MCP1827S-3302E.pdf Description: 1.5A LDO REGULATOR
Packaging: Tube
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MCP1827ST-3302E/EBVAO Microchip Technology MCP1827S-3302E.pdf Description: 1.5A LDO REGULATOR
Packaging: Tape & Reel (TR)
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PIC16F15254-E/SP PIC16F15254-E/SP Microchip Technology PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf Description: IC MCU 8BIT 7KB FLASH 28DIP
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 28-DIP (0.300", 7.62mm)
Packaging: Tube
Number of I/O: 25
Supplier Device Package: 28-SPDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x10b SAR
Core Processor: PIC
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PIC16F15254-E/STX PIC16F15254-E/STX Microchip Technology PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf Description: IC MCU 8BIT 7KB FLASH 28VFQFN
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 25
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MCP1317T-31LE/OT MCP1317T-31LE/OT Microchip Technology MCP131X-2X-Voltage-Supervisor-DS20001985E.pdf Description: IC SUPERVISOR 1 CHANNEL SOT23-5
DigiKey Programmable: Not Verified
Supplier Device Package: SOT-23-5
Voltage - Threshold: 3.1V
Reset Timeout: 140ms Minimum
Number of Voltages Monitored: 1
Operating Temperature: -40°C ~ 125°C (TA)
Reset: Active High
Type: Simple Reset/Power-On Reset
Output: Push-Pull, Totem Pole
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Packaging: Tape & Reel (TR)
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M5KP75A M5KP75A Microchip Technology rf01010_rb.pdf Description: TVS DIODE 75VWM 121VC DO204AR
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 121V
Voltage - Breakdown (Min): 83.3V
Unidirectional Channels: 1
Supplier Device Package: DO-204AR
Voltage - Reverse Standoff (Typ): 75V
Current - Peak Pulse (10/1000µs): 41A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Packaging: Bulk
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TC1302B-PFVMF-VAO TC1302B-PFVMF-VAO Microchip Technology 21333C.pdf Description: IC REG LINEAR 1.5V/3.3V 8-DFN
Qualification: AEC-Q100
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.4V @ 150mA
PSRR: 58dB (100Hz)
Grade: Automotive
Control Features: Enable
Voltage - Output (Min/Fixed): 1.5V, 3.3V
Supplier Device Package: 8-DFN (3x3)
Number of Regulators: 2
Voltage - Input (Max): 6V
Current - Quiescent (Iq): 180 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 300mA, 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 8-VDFN Exposed Pad
Packaging: Tube
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DSC1001BL5-095.0000T DSC1001BL5-095.0000T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 95.0000MHZ CMOS SMD
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 95 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-VDFN (5x3.2)
Current - Supply (Max): 16.6mA
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
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DSC1001BL5-095.0000 DSC1001BL5-095.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 95.0000MHZ CMOS SMD
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 95 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-VDFN (5x3.2)
Current - Supply (Max): 16.6mA
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DSC1001CL5-080.0000T DSC1001CL5-080.0000T Microchip Technology Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Supplier Device Package: 4-VDFN (3.2x2.5)
Current - Supply (Max): 16.6mA
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 80 MHz
Height - Seated (Max): 0.035" (0.90mm)
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DSC1001CL5-080.0000 DSC1001CL5-080.0000 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 80 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-VDFN (3.2x2.5)
Current - Supply (Max): 16.6mA
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Strip
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DSC1121CL5-080.0000T DSC1121CL5-080.0000T Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 80 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (3.2x2.5)
Current - Supply (Max): 35mA
Voltage - Supply: 2.25V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Strip
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DSC1121CL5-080.0000 DSC1121CL5-080.0000 Microchip Technology DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Package / Case: 6-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 80 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (3.2x2.5)
Current - Supply (Max): 35mA
Voltage - Supply: 2.25V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
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AT91M42800A-33AU AT91M42800A-33AU Microchip Technology doc1779.pdf Description: IC MCU 16/32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 144-LQFP (20x20)
Peripherals: WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 16/32-Bit
Core Processor: ARM7®
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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USB2534D/UDX USB2534D/UDX Microchip Technology USB2534D-Data-Sheet-DS00005422.pdf Description: USB 2.0 HI-SPEED FOUR PORT HUB C
Supplier Device Package: 36-SQFN (6x6)
Standards: USB 2.0
Protocol: USB
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 70°C (TA)
Interface: USB, GPIO, I2C, SMBus
Function: Hub Controller
Package / Case: 36-VFQFN Exposed Pad
Packaging: Tray
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ATF22V10C-10SC ATF22V10C-10SC Microchip Technology doc0735.pdf Description: IC PLD 10MC 10NS 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Voltage - Input: 5V
Programmable Type: EE PLD
Number of Macrocells: 10
Supplier Device Package: 24-SOIC
Speed: 10 ns
DigiKey Programmable: Verified
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ATF22V10CQZ-20SC ATF22V10CQZ-20SC Microchip Technology doc0778.pdf Description: IC PLD 10MC 20NS 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Voltage - Input: 5V
Programmable Type: EE PLD
Number of Macrocells: 10
Supplier Device Package: 24-SOIC
Speed: 20 ns
DigiKey Programmable: Not Verified
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1N5231 1N5231 Microchip Technology LDS-0232.pdf Description: DIODE ZENER 5.1V 500MW DO204AH
Current - Reverse Leakage @ Vr: 5 µA @ 1.9 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 17 Ohms
Voltage - Zener (Nom) (Vz): 5.1 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
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DSC1123CI2-333.3300T DSC1123CI2-333.3300T Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 333.3300MHZ LVDS SMD
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 333.33 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (3.2x2.5)
Current - Supply (Max): 32mA
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DSC1123CI2-333.3333T DSC1123CI2-333.3333T Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 333.3333MHZ LVDS SMD
Supplier Device Package: 6-VDFN (3.2x2.5)
Current - Supply (Max): 32mA
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Base Resonator: MEMS
Frequency: 333.3333 MHz
Height - Seated (Max): 0.035" (0.90mm)
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Strip
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DSC1123CI2-333.3300 DSC1123CI2-333.3300 Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 333.3300MHZ LVDS SMD
Base Resonator: MEMS
Frequency: 333.33 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (3.2x2.5)
Current - Supply (Max): 32mA
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Strip
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DSC1123CI2-333.3333 DSC1123CI2-333.3333 Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 333.3333MHZ LVDS SMD
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 333.3333 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (3.2x2.5)
Current - Supply (Max): 32mA
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
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M5KP30CA M5KP30CA Microchip Technology rf01010_rb.pdf Description: TVS DIODE 30VWM 48.4VC DO204AR
Packaging: Bulk
Voltage - Clamping (Max) @ Ipp: 48.4V
Voltage - Breakdown (Min): 33.3V
Bidirectional Channels: 1
Supplier Device Package: DO-204AR
Voltage - Reverse Standoff (Typ): 30V
Current - Peak Pulse (10/1000µs): 103A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
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M5KP28CAE3/TR M5KP28CAE3/TR Microchip Technology rf01010_rb.pdf Description: TVS DIODE 28VWM 45.4VC P600
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 45.4V
Voltage - Breakdown (Min): 31.1V
Bidirectional Channels: 1
Supplier Device Package: P600
Voltage - Reverse Standoff (Typ): 28V
Current - Peak Pulse (10/1000µs): 110A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: P600, Axial
Packaging: Tape & Reel (TR)
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ATMEGA644P-15AZ ATMEGA644P-15AZ Microchip Technology ATmega164%2C324%2C644P%20Summary.pdf Description: IC MCU 8BIT 64KB FLASH 44TQFP
Qualification: AEC-Q100
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (32K x 16)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 32
Grade: Automotive
Supplier Device Package: 44-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: AVR
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
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ATMEGA644PV-10PU ATMEGA644PV-10PU Microchip Technology Atmel-42744-ATmega644P_Summary.pdf description Description: IC MCU 8BIT 64KB FLASH 40DIP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 40-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: AVR
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (32K x 16)
Speed: 10MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
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DSC6011BA3B-250K000 DSC6011BA3B-250K000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC
Base Resonator: MEMS
Frequency: 250 kHz
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VDFN (5x3.2)
Current - Supply (Max): 1.3mA (Typ)
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 125°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Strip
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DSC6011BA3B-250K000T DSC6011BA3B-250K000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 250 kHz
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VDFN (5x3.2)
Current - Supply (Max): 1.3mA (Typ)
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 125°C
Type: XO (Standard)
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JANTX1N4148UR-1/TR Microchip Technology lds_0281_1-1592599.pdf Description: DIODE SWITCH 75V 200MA MELF MIL
Packaging: Tape & Reel (TR)
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JANTX1N4148UR-1/TR Microchip Technology lds_0281_1-1592599.pdf Description: DIODE SWITCH 75V 200MA MELF MIL
Packaging: Cut Tape (CT)
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MCP1416RT-E/OTVAO MCP1416RT-E/OTVAO Microchip Technology 20002092G.pdf Description: IC GATE DRVR LOW-SIDE SOT23-5
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 18V
Input Type: Non-Inverting
Supplier Device Package: SOT-23-5
Rise / Fall Time (Typ): 18ns, 21ns
Channel Type: Single
Driven Configuration: Low-Side
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel, P-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 1.5A, 1.5A
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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MCP1416RT-E/OTVAO MCP1416RT-E/OTVAO Microchip Technology 20002092G.pdf Description: IC GATE DRVR LOW-SIDE SOT23-5
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 18V
Input Type: Non-Inverting
Supplier Device Package: SOT-23-5
Rise / Fall Time (Typ): 18ns, 21ns
Channel Type: Single
Driven Configuration: Low-Side
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel, P-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 1.5A, 1.5A
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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DSPIC33CK512MP710-E/PT DSPIC33CK512MP710-E/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 512KB FLASH 100TQFP
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
auf Bestellung 119 Stücke:
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3+5.98 EUR
25+5.44 EUR
100+4.94 EUR
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dsPIC33CK512MP710-I/PT dsPIC33CK512MP710-I/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 512KB FLASH 100TQFP
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
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dsPIC33CK256MP710T-I/PT dsPIC33CK256MP710T-I/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 100TQFP
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tape & Reel (TR)
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
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dsPIC33CK256MP710T-I/PT dsPIC33CK256MP710T-I/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 100TQFP
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Package / Case: 100-TQFP
Packaging: Cut Tape (CT)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
auf Bestellung 1195 Stücke:
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25+4.83 EUR
100+4.41 EUR
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dsPIC33CK256MP710-E/PT dsPIC33CK256MP710-E/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 100TQFP
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
auf Bestellung 116 Stücke:
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dsPIC33CK256MP710-I/PT dsPIC33CK256MP710-I/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 100TQFP
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Produkt ist nicht verfügbar
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dsPIC33CK512MP410-E/PT dsPIC33CK512MP410-E/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 512KB FLASH 100TQFP
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
auf Bestellung 100 Stücke:
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4+5.86 EUR
25+5.32 EUR
100+4.83 EUR
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dsPIC33CK512MP410-I/PT dsPIC33CK512MP410-I/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 512KB FLASH 100TQFP
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
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dsPIC33CK512MP408-I/PT dsPIC33CK512MP408-I/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 512KB FLASH 80TQFP
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 80-TQFP
Packaging: Tray
Core Size: 16-Bit
Data Converters: A/D 24x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Number of I/O: 89
Supplier Device Package: 80-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
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dsPIC33CK256MP410T-I/PT dsPIC33CK256MP410T-I/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 100TQFP
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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dsPIC33CK256MP410T-I/PT dsPIC33CK256MP410T-I/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 100TQFP
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Cut Tape (CT)
auf Bestellung 1061 Stücke:
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4+5.21 EUR
25+4.74 EUR
100+4.32 EUR
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dsPIC33CK256MP410-E/PT dsPIC33CK256MP410-E/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 100TQFP
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
auf Bestellung 119 Stücke:
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4+5.72 EUR
25+5.18 EUR
100+4.71 EUR
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dsPIC33CK256MP410-I/PT dsPIC33CK256MP410-I/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 100TQFP
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Produkt ist nicht verfügbar
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dsPIC33CK256MP408T-I/PT dsPIC33CK256MP408T-I/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 80TQFP
Package / Case: 80-TQFP
Packaging: Tape & Reel (TR)
Number of I/O: 89
Supplier Device Package: 80-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 24x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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dsPIC33CK256MP408T-I/PT dsPIC33CK256MP408T-I/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 80TQFP
Number of I/O: 89
Supplier Device Package: 80-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 24x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 80-TQFP
Packaging: Cut Tape (CT)
auf Bestellung 1194 Stücke:
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4+4.8 EUR
25+4.36 EUR
100+3.97 EUR
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DSPIC33CK256MP408-E/PT DSPIC33CK256MP408-E/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 80TQFP
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 80-TQFP
Packaging: Tray
Number of I/O: 89
Supplier Device Package: 80-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 24x12b SAR; D/A 6x12b
Core Processor: dsPIC
auf Bestellung 238 Stücke:
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4+5.26 EUR
25+4.77 EUR
100+4.33 EUR
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dsPIC33CK256MP408-I/PT dsPIC33CK256MP408-I/PT Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 80TQFP
Number of I/O: 89
Supplier Device Package: 80-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 24x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 80-TQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LAN8651B1-E/LMX LAN8651B1-E/LMX Microchip Technology LAN8650-1-Data-Sheet-60001734.pdf Description: IC TRANSCEIVER HALF 1/1 32VQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Number of Drivers/Receivers: 1/1
Data Rate: 10Mbps
Protocol: Ethernet
Supplier Device Package: 32-VQFN (5x5)
Receiver Hysteresis: 230 mV
Duplex: Half
auf Bestellung 1298 Stücke:
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3+7.25 EUR
25+6.04 EUR
100+5.83 EUR
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DSC6011AA3B-400K000T DSC6011AA3B-400K000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC SO
Base Resonator: MEMS
Frequency: 400 kHz
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VDFN (7x5)
Current - Supply (Max): 1.3mA (Typ)
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 125°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Package / Case: 4-VDFN Exposed Pad
Packaging: Strip
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Produkt ist nicht verfügbar
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DSC6011AA3B-400K000 DSC6011AA3B-400K000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC SO
Supplier Device Package: 4-VDFN (7x5)
Current - Supply (Max): 1.3mA (Typ)
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 125°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN Exposed Pad
Packaging: Strip
Base Resonator: MEMS
Frequency: 400 kHz
Height - Seated (Max): 0.035" (0.89mm)
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DSC6011AE3B-048.0000 DSC6011AE3B-048.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: OSCILLATOR MEMS SMD
Base Resonator: MEMS
Frequency: 48 MHz
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VDFN (7x5)
Current - Supply (Max): 1.3mA (Typ)
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -20°C ~ 70°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 4-VDFN Exposed Pad
Packaging: Strip
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DSC6011AE3B-048.0000T DSC6011AE3B-048.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: OSCILLATOR MEMS SMD
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -20°C ~ 70°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 4-VDFN Exposed Pad
Packaging: Strip
Base Resonator: MEMS
Frequency: 48 MHz
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VDFN (7x5)
Current - Supply (Max): 1.3mA (Typ)
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DSC6011AE3B-045.0000T DSC6011AE3B-045.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: OSCILLATOR MEMS SMD
Base Resonator: MEMS
Frequency: 45 MHz
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VDFN (7x5)
Current - Supply (Max): 1.3mA (Typ)
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -20°C ~ 70°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 4-VDFN Exposed Pad
Packaging: Strip
Produkt ist nicht verfügbar
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DSC6011AE3B-045.0000 DSC6011AE3B-045.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: OSCILLATOR MEMS SMD
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -20°C ~ 70°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 4-VDFN Exposed Pad
Packaging: Strip
Base Resonator: MEMS
Frequency: 45 MHz
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VDFN (7x5)
Current - Supply (Max): 1.3mA (Typ)
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AT91RM9200-QI-002-T 1768s.pdf
AT91RM9200-QI-002-T
Hersteller: Microchip Technology
Description: IC MCU 32BIT 128KB ROM 208PQFP
DigiKey Programmable: Not Verified
Number of I/O: 122
Supplier Device Package: 208-PQFP (28x28)
Peripherals: POR
Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Core Size: 16/32-Bit
Core Processor: ARM920T
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 48K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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JANTX1N5639A LDS-0096-REV3.pdf
JANTX1N5639A
Hersteller: Microchip Technology
Description: TVS DIODE 15.3VWM 25.2VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 59.5A
Voltage - Reverse Standoff (Typ): 15.3V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.1V
Voltage - Clamping (Max) @ Ipp: 25.2V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/500
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1N5645A LDS-0096-REV3.pdf
1N5645A
Hersteller: Microchip Technology
Description: TVS DIODE 28.2VWM 45.7VC DO13
Applications: General Purpose
Operating Temperature: -65°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-202AA, DO-13, Axial
Packaging: Bulk
Power Line Protection: No
Power - Peak Pulse: 1500W (1.5kW)
Voltage - Clamping (Max) @ Ipp: 45.7V
Voltage - Breakdown (Min): 31.4V
Unidirectional Channels: 1
Supplier Device Package: DO-13 (DO-202AA)
Voltage - Reverse Standoff (Typ): 28.2V
Current - Peak Pulse (10/1000µs): 33A
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EV80L65A dsPIC33AK512MPS512-General-Purpose-DIM-Info-Sheet-DS70005563.pdf
EV80L65A
Hersteller: Microchip Technology
Description: DSPIC33AK512MPS512 GP DIM
Platform: Dual-Inline Module (DIM)
Utilized IC / Part: dsPIC33AK512MPS512
Core Processor: dsPIC
Contents: Board(s)
Type: MCU 16-Bit
Mounting Type: Fixed
Packaging: Bulk
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MCP1827S-3302E/EBVAO MCP1827S-3302E.pdf
Hersteller: Microchip Technology
Description: 1.5A LDO REGULATOR
Packaging: Tube
Produkt ist nicht verfügbar
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MCP1827ST-3302E/EBVAO MCP1827S-3302E.pdf
Hersteller: Microchip Technology
Description: 1.5A LDO REGULATOR
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC16F15254-E/SP PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf
PIC16F15254-E/SP
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 28DIP
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 7KB (7K x 8)
Speed: 32MHz
Mounting Type: Through Hole
Package / Case: 28-DIP (0.300", 7.62mm)
Packaging: Tube
Number of I/O: 25
Supplier Device Package: 28-SPDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 19x10b SAR
Core Processor: PIC
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6+3.26 EUR
25+2.96 EUR
100+2.68 EUR
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PIC16F15254-E/STX PIC16F15254-55-Microcontroller-Data-Sheet-40002324.pdf
PIC16F15254-E/STX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 7KB FLASH 28VFQFN
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 7KB (7K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 25
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16+1.14 EUR
25+1.03 EUR
100+0.94 EUR
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MCP1317T-31LE/OT MCP131X-2X-Voltage-Supervisor-DS20001985E.pdf
MCP1317T-31LE/OT
Hersteller: Microchip Technology
Description: IC SUPERVISOR 1 CHANNEL SOT23-5
DigiKey Programmable: Not Verified
Supplier Device Package: SOT-23-5
Voltage - Threshold: 3.1V
Reset Timeout: 140ms Minimum
Number of Voltages Monitored: 1
Operating Temperature: -40°C ~ 125°C (TA)
Reset: Active High
Type: Simple Reset/Power-On Reset
Output: Push-Pull, Totem Pole
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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M5KP75A rf01010_rb.pdf
M5KP75A
Hersteller: Microchip Technology
Description: TVS DIODE 75VWM 121VC DO204AR
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 121V
Voltage - Breakdown (Min): 83.3V
Unidirectional Channels: 1
Supplier Device Package: DO-204AR
Voltage - Reverse Standoff (Typ): 75V
Current - Peak Pulse (10/1000µs): 41A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Packaging: Bulk
Produkt ist nicht verfügbar
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TC1302B-PFVMF-VAO 21333C.pdf
TC1302B-PFVMF-VAO
Hersteller: Microchip Technology
Description: IC REG LINEAR 1.5V/3.3V 8-DFN
Qualification: AEC-Q100
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.4V @ 150mA
PSRR: 58dB (100Hz)
Grade: Automotive
Control Features: Enable
Voltage - Output (Min/Fixed): 1.5V, 3.3V
Supplier Device Package: 8-DFN (3x3)
Number of Regulators: 2
Voltage - Input (Max): 6V
Current - Quiescent (Iq): 180 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C
Current - Output: 300mA, 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 8-VDFN Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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DSC1001BL5-095.0000T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BL5-095.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 95.0000MHZ CMOS SMD
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 95 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-VDFN (5x3.2)
Current - Supply (Max): 16.6mA
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
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DSC1001BL5-095.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001BL5-095.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 95.0000MHZ CMOS SMD
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 95 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-VDFN (5x3.2)
Current - Supply (Max): 16.6mA
Produkt ist nicht verfügbar
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DSC1001CL5-080.0000T
DSC1001CL5-080.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Supplier Device Package: 4-VDFN (3.2x2.5)
Current - Supply (Max): 16.6mA
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 80 MHz
Height - Seated (Max): 0.035" (0.90mm)
Produkt ist nicht verfügbar
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DSC1001CL5-080.0000 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CL5-080.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 80 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 4-VDFN (3.2x2.5)
Current - Supply (Max): 16.6mA
Voltage - Supply: 1.7V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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DSC1121CL5-080.0000T DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1121CL5-080.0000T
Hersteller: Microchip Technology
Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Base Resonator: MEMS
Frequency: 80 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (3.2x2.5)
Current - Supply (Max): 35mA
Voltage - Supply: 2.25V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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DSC1121CL5-080.0000 DSC1101-21-Low-Jitter-Precision-CMOS-Oscillator-DS20005613D.pdf
DSC1121CL5-080.0000
Hersteller: Microchip Technology
Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Package / Case: 6-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 80 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (3.2x2.5)
Current - Supply (Max): 35mA
Voltage - Supply: 2.25V ~ 3.6V
Frequency Stability: ±10ppm
Operating Temperature: -40°C ~ 105°C
Type: XO (Standard)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Produkt ist nicht verfügbar
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AT91M42800A-33AU doc1779.pdf
AT91M42800A-33AU
Hersteller: Microchip Technology
Description: IC MCU 16/32BIT ROMLESS 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 144-LQFP (20x20)
Peripherals: WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 16/32-Bit
Core Processor: ARM7®
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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1+18.46 EUR
25+16.8 EUR
100+15.22 EUR
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USB2534D/UDX USB2534D-Data-Sheet-DS00005422.pdf
USB2534D/UDX
Hersteller: Microchip Technology
Description: USB 2.0 HI-SPEED FOUR PORT HUB C
Supplier Device Package: 36-SQFN (6x6)
Standards: USB 2.0
Protocol: USB
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 70°C (TA)
Interface: USB, GPIO, I2C, SMBus
Function: Hub Controller
Package / Case: 36-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 154 Stücke:
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3+8.11 EUR
25+6.76 EUR
100+6.54 EUR
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ATF22V10C-10SC doc0735.pdf
ATF22V10C-10SC
Hersteller: Microchip Technology
Description: IC PLD 10MC 10NS 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Voltage - Input: 5V
Programmable Type: EE PLD
Number of Macrocells: 10
Supplier Device Package: 24-SOIC
Speed: 10 ns
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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ATF22V10CQZ-20SC doc0778.pdf
ATF22V10CQZ-20SC
Hersteller: Microchip Technology
Description: IC PLD 10MC 20NS 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Voltage - Input: 5V
Programmable Type: EE PLD
Number of Macrocells: 10
Supplier Device Package: 24-SOIC
Speed: 20 ns
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1N5231 LDS-0232.pdf
1N5231
Hersteller: Microchip Technology
Description: DIODE ZENER 5.1V 500MW DO204AH
Current - Reverse Leakage @ Vr: 5 µA @ 1.9 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 17 Ohms
Voltage - Zener (Nom) (Vz): 5.1 V
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
auf Bestellung 313 Stücke:
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AnzahlPreis
5+3.85 EUR
100+3.59 EUR
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DSC1123CI2-333.3300T DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123CI2-333.3300T
Hersteller: Microchip Technology
Description: MEMS OSC XO 333.3300MHZ LVDS SMD
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 333.33 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (3.2x2.5)
Current - Supply (Max): 32mA
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DSC1123CI2-333.3333T DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123CI2-333.3333T
Hersteller: Microchip Technology
Description: MEMS OSC XO 333.3333MHZ LVDS SMD
Supplier Device Package: 6-VDFN (3.2x2.5)
Current - Supply (Max): 32mA
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Base Resonator: MEMS
Frequency: 333.3333 MHz
Height - Seated (Max): 0.035" (0.90mm)
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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DSC1123CI2-333.3300 DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123CI2-333.3300
Hersteller: Microchip Technology
Description: MEMS OSC XO 333.3300MHZ LVDS SMD
Base Resonator: MEMS
Frequency: 333.33 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (3.2x2.5)
Current - Supply (Max): 32mA
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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DSC1123CI2-333.3333 DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123CI2-333.3333
Hersteller: Microchip Technology
Description: MEMS OSC XO 333.3333MHZ LVDS SMD
Operating Temperature: -40°C ~ 85°C
Type: XO (Standard)
Function: Enable/Disable
Output: LVDS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 6-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 333.3333 MHz
Height - Seated (Max): 0.035" (0.90mm)
Supplier Device Package: 6-VDFN (3.2x2.5)
Current - Supply (Max): 32mA
Voltage - Supply: 2.25V ~ 3.63V
Frequency Stability: ±25ppm
Produkt ist nicht verfügbar
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M5KP30CA rf01010_rb.pdf
M5KP30CA
Hersteller: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC DO204AR
Packaging: Bulk
Voltage - Clamping (Max) @ Ipp: 48.4V
Voltage - Breakdown (Min): 33.3V
Bidirectional Channels: 1
Supplier Device Package: DO-204AR
Voltage - Reverse Standoff (Typ): 30V
Current - Peak Pulse (10/1000µs): 103A
Applications: General Purpose
Operating Temperature: -65°C ~ 150°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: DO-204AR, Axial
Qualification: MIL-PRF-19500
Grade: Military
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
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AnzahlPreis
2+10.24 EUR
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M5KP28CAE3/TR rf01010_rb.pdf
M5KP28CAE3/TR
Hersteller: Microchip Technology
Description: TVS DIODE 28VWM 45.4VC P600
Power Line Protection: No
Power - Peak Pulse: 5000W (5kW)
Voltage - Clamping (Max) @ Ipp: 45.4V
Voltage - Breakdown (Min): 31.1V
Bidirectional Channels: 1
Supplier Device Package: P600
Voltage - Reverse Standoff (Typ): 28V
Current - Peak Pulse (10/1000µs): 110A
Applications: General Purpose
Operating Temperature: -55°C ~ 175°C (TJ)
Type: Zener
Mounting Type: Through Hole
Package / Case: P600, Axial
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ATMEGA644P-15AZ ATmega164%2C324%2C644P%20Summary.pdf
ATMEGA644P-15AZ
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 44TQFP
Qualification: AEC-Q100
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (32K x 16)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 32
Grade: Automotive
Supplier Device Package: 44-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: AVR
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Produkt ist nicht verfügbar
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ATMEGA644PV-10PU description Atmel-42744-ATmega644P_Summary.pdf
ATMEGA644PV-10PU
Hersteller: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 40DIP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 40-PDIP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: AVR
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (32K x 16)
Speed: 10MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
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AnzahlPreis
2+11.39 EUR
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DSC6011BA3B-250K000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6011BA3B-250K000
Hersteller: Microchip Technology
Description: MEMS OSC
Base Resonator: MEMS
Frequency: 250 kHz
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VDFN (5x3.2)
Current - Supply (Max): 1.3mA (Typ)
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 125°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Strip
Produkt ist nicht verfügbar
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DSC6011BA3B-250K000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6011BA3B-250K000T
Hersteller: Microchip Technology
Description: MEMS OSC
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Package / Case: 4-VDFN
Packaging: Strip
Base Resonator: MEMS
Frequency: 250 kHz
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VDFN (5x3.2)
Current - Supply (Max): 1.3mA (Typ)
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 125°C
Type: XO (Standard)
Produkt ist nicht verfügbar
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JANTX1N4148UR-1/TR lds_0281_1-1592599.pdf
Hersteller: Microchip Technology
Description: DIODE SWITCH 75V 200MA MELF MIL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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JANTX1N4148UR-1/TR lds_0281_1-1592599.pdf
Hersteller: Microchip Technology
Description: DIODE SWITCH 75V 200MA MELF MIL
Packaging: Cut Tape (CT)
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AnzahlPreis
7+2.89 EUR
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MCP1416RT-E/OTVAO 20002092G.pdf
MCP1416RT-E/OTVAO
Hersteller: Microchip Technology
Description: IC GATE DRVR LOW-SIDE SOT23-5
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 18V
Input Type: Non-Inverting
Supplier Device Package: SOT-23-5
Rise / Fall Time (Typ): 18ns, 21ns
Channel Type: Single
Driven Configuration: Low-Side
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel, P-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 1.5A, 1.5A
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCP1416RT-E/OTVAO 20002092G.pdf
MCP1416RT-E/OTVAO
Hersteller: Microchip Technology
Description: IC GATE DRVR LOW-SIDE SOT23-5
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 18V
Input Type: Non-Inverting
Supplier Device Package: SOT-23-5
Rise / Fall Time (Typ): 18ns, 21ns
Channel Type: Single
Driven Configuration: Low-Side
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel, P-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 1.5A, 1.5A
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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DSPIC33CK512MP710-E/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
DSPIC33CK512MP710-E/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 512KB FLASH 100TQFP
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
auf Bestellung 119 Stücke:
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AnzahlPreis
3+5.98 EUR
25+5.44 EUR
100+4.94 EUR
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dsPIC33CK512MP710-I/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
dsPIC33CK512MP710-I/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 512KB FLASH 100TQFP
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Produkt ist nicht verfügbar
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dsPIC33CK256MP710T-I/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
dsPIC33CK256MP710T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 100TQFP
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tape & Reel (TR)
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Produkt ist nicht verfügbar
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dsPIC33CK256MP710T-I/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
dsPIC33CK256MP710T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 100TQFP
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Package / Case: 100-TQFP
Packaging: Cut Tape (CT)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
auf Bestellung 1195 Stücke:
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AnzahlPreis
4+5.33 EUR
25+4.83 EUR
100+4.41 EUR
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dsPIC33CK256MP710-E/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
dsPIC33CK256MP710-E/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 100TQFP
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
auf Bestellung 116 Stücke:
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4+5.84 EUR
25+5.29 EUR
100+4.82 EUR
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dsPIC33CK256MP710-I/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
dsPIC33CK256MP710-I/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 100TQFP
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Produkt ist nicht verfügbar
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dsPIC33CK512MP410-E/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
dsPIC33CK512MP410-E/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 512KB FLASH 100TQFP
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
auf Bestellung 100 Stücke:
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AnzahlPreis
4+5.86 EUR
25+5.32 EUR
100+4.83 EUR
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dsPIC33CK512MP410-I/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
dsPIC33CK512MP410-I/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 512KB FLASH 100TQFP
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
Produkt ist nicht verfügbar
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dsPIC33CK512MP408-I/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
dsPIC33CK512MP408-I/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 512KB FLASH 80TQFP
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 80-TQFP
Packaging: Tray
Core Size: 16-Bit
Data Converters: A/D 24x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Number of I/O: 89
Supplier Device Package: 80-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Produkt ist nicht verfügbar
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dsPIC33CK256MP410T-I/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
dsPIC33CK256MP410T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 100TQFP
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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dsPIC33CK256MP410T-I/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
dsPIC33CK256MP410T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 100TQFP
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Cut Tape (CT)
auf Bestellung 1061 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4+5.21 EUR
25+4.74 EUR
100+4.32 EUR
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dsPIC33CK256MP410-E/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
dsPIC33CK256MP410-E/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 100TQFP
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
auf Bestellung 119 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4+5.72 EUR
25+5.18 EUR
100+4.71 EUR
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dsPIC33CK256MP410-I/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
dsPIC33CK256MP410-I/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 100TQFP
Number of I/O: 89
Supplier Device Package: 100-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
Core Size: 16-Bit
Data Converters: A/D 28x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Produkt ist nicht verfügbar
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dsPIC33CK256MP408T-I/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
dsPIC33CK256MP408T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 80TQFP
Package / Case: 80-TQFP
Packaging: Tape & Reel (TR)
Number of I/O: 89
Supplier Device Package: 80-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 24x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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dsPIC33CK256MP408T-I/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
dsPIC33CK256MP408T-I/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 80TQFP
Number of I/O: 89
Supplier Device Package: 80-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 24x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 80-TQFP
Packaging: Cut Tape (CT)
auf Bestellung 1194 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4+4.8 EUR
25+4.36 EUR
100+3.97 EUR
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DSPIC33CK256MP408-E/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
DSPIC33CK256MP408-E/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 80TQFP
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 80-TQFP
Packaging: Tray
Number of I/O: 89
Supplier Device Package: 80-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 24x12b SAR; D/A 6x12b
Core Processor: dsPIC
auf Bestellung 238 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4+5.26 EUR
25+4.77 EUR
100+4.33 EUR
Mindestbestellmenge: 4 Stücke
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dsPIC33CK256MP408-I/PT dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
dsPIC33CK256MP408-I/PT
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 80TQFP
Number of I/O: 89
Supplier Device Package: 80-TQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 24x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount
Package / Case: 80-TQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LAN8651B1-E/LMX LAN8650-1-Data-Sheet-60001734.pdf
LAN8651B1-E/LMX
Hersteller: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 32VQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Number of Drivers/Receivers: 1/1
Data Rate: 10Mbps
Protocol: Ethernet
Supplier Device Package: 32-VQFN (5x5)
Receiver Hysteresis: 230 mV
Duplex: Half
auf Bestellung 1298 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+7.25 EUR
25+6.04 EUR
100+5.83 EUR
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DSC6011AA3B-400K000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6011AA3B-400K000T
Hersteller: Microchip Technology
Description: MEMS OSC SO
Base Resonator: MEMS
Frequency: 400 kHz
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VDFN (7x5)
Current - Supply (Max): 1.3mA (Typ)
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 125°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Package / Case: 4-VDFN Exposed Pad
Packaging: Strip
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Produkt ist nicht verfügbar
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DSC6011AA3B-400K000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6011AA3B-400K000
Hersteller: Microchip Technology
Description: MEMS OSC SO
Supplier Device Package: 4-VDFN (7x5)
Current - Supply (Max): 1.3mA (Typ)
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -40°C ~ 125°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Package / Case: 4-VDFN Exposed Pad
Packaging: Strip
Base Resonator: MEMS
Frequency: 400 kHz
Height - Seated (Max): 0.035" (0.89mm)
Produkt ist nicht verfügbar
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DSC6011AE3B-048.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6011AE3B-048.0000
Hersteller: Microchip Technology
Description: OSCILLATOR MEMS SMD
Base Resonator: MEMS
Frequency: 48 MHz
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VDFN (7x5)
Current - Supply (Max): 1.3mA (Typ)
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -20°C ~ 70°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 4-VDFN Exposed Pad
Packaging: Strip
Produkt ist nicht verfügbar
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DSC6011AE3B-048.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6011AE3B-048.0000T
Hersteller: Microchip Technology
Description: OSCILLATOR MEMS SMD
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -20°C ~ 70°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 4-VDFN Exposed Pad
Packaging: Strip
Base Resonator: MEMS
Frequency: 48 MHz
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VDFN (7x5)
Current - Supply (Max): 1.3mA (Typ)
Produkt ist nicht verfügbar
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DSC6011AE3B-045.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6011AE3B-045.0000T
Hersteller: Microchip Technology
Description: OSCILLATOR MEMS SMD
Base Resonator: MEMS
Frequency: 45 MHz
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VDFN (7x5)
Current - Supply (Max): 1.3mA (Typ)
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -20°C ~ 70°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 4-VDFN Exposed Pad
Packaging: Strip
Produkt ist nicht verfügbar
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DSC6011AE3B-045.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6011AE3B-045.0000
Hersteller: Microchip Technology
Description: OSCILLATOR MEMS SMD
Voltage - Supply: 1.71V ~ 3.63V
Frequency Stability: ±20ppm
Operating Temperature: -20°C ~ 70°C
Type: XO (Standard)
Function: Standby (Power Down)
Output: CMOS
Mounting Type: Surface Mount
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Package / Case: 4-VDFN Exposed Pad
Packaging: Strip
Base Resonator: MEMS
Frequency: 45 MHz
Height - Seated (Max): 0.035" (0.89mm)
Supplier Device Package: 4-VDFN (7x5)
Current - Supply (Max): 1.3mA (Typ)
Produkt ist nicht verfügbar
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