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MCP48CMB18T-20E/ST MCP48CMB18T-20E/ST Microchip Technology MCP48CxBx4_8_2021.pdf Description: IC DAC 10BIT V-OUT 20TSSOP
Differential Output: No
INL/DNL (LSB): ±0.25, ±0.25
Number of D/A Converters: 8
Architecture: R-2R
Supplier Device Package: 20-TSSOP
Settling Time: 16µs (Typ)
Voltage - Supply, Digital: 1.8V ~ 5.5V
Voltage - Supply, Analog: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Reference Type: External, Internal, Supply
Data Interface: SPI
Number of Bits: 10
Mounting Type: Surface Mount
Output Type: Voltage - Buffered
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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MCP48CMB18T-20E/ST MCP48CMB18T-20E/ST Microchip Technology MCP48CxBx4_8_2021.pdf Description: IC DAC 10BIT V-OUT 20TSSOP
Differential Output: No
INL/DNL (LSB): ±0.25, ±0.25
Number of D/A Converters: 8
Architecture: R-2R
Supplier Device Package: 20-TSSOP
Settling Time: 16µs (Typ)
Voltage - Supply, Digital: 1.8V ~ 5.5V
Voltage - Supply, Analog: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Reference Type: External, Internal, Supply
Data Interface: SPI
Number of Bits: 10
Mounting Type: Surface Mount
Output Type: Voltage - Buffered
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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M5KP30A M5KP30A Microchip Technology rf01010_rb.pdf Description: TVS DIODE 30VWM 48.4VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 103A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M15KP30A M15KP30A Microchip Technology rf01011_m15kp_rev_e.pdf Description: TVS DIODE 30VWM 50.7VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 296A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 50.7V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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APTGX75DU170T3AG Microchip Technology APTGX75DU170T3AG-IGBT-Module-Datasheet.pdf Description: IGBT MODULE 1700V 145A 524W
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 7600 pF @ 25 V
Current - Collector Cutoff (Max): 10 µA
Power - Max: 524 W
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector (Ic) (Max): 145 A
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 75A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Dual, Common Emitter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
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APTGX300DU120T6G Microchip Technology APTGX300DU120T6G-IGBT-Module-Datasheet.pdf Description: IGBT MODULE 1200V 415A 1.02KW
Input Capacitance (Cies) @ Vce: 60000 pF @ 25 V
Current - Collector Cutoff (Max): 24 µA
Power - Max: 1.02 kW
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 415 A
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 300A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Dual, Common Emitter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
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APTGX300DU170T6G Microchip Technology APTGX300DU170T6G-IGBT-Module-Datasheet.pdf Description: IGBT MODULE 1700V 385A 1.034KW
Package / Case: Module
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 31300 pF @ 25 V
Current - Collector Cutoff (Max): 25 µA
Power - Max: 1.034 kW
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector (Ic) (Max): 385 A
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 300A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Dual, Common Emitter
Input: Standard
Mounting Type: Chassis Mount
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APTGX450DU120T6G Microchip Technology APTGX450DU120T6G-IGBT-Module-Datasheet.pdf Description: IGBT MODULE 1200V 605A 1.456KW
Input Capacitance (Cies) @ Vce: 90000 pF @ 25 V
Current - Collector Cutoff (Max): 36 µA
Power - Max: 1.456 kW
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 605 A
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 450A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Dual, Common Emitter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
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APTGX600DU120T6G Microchip Technology APTGX600DU120T6G-IGBT-Module-Datasheet.pdf Description: IGBT MODULE 1200V 805A 1.923KW
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 120000 pF @ 25 V
Current - Collector Cutoff (Max): 50 µA
Power - Max: 1.923 kW
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 805 A
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 600A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Dual, Common Emitter
Input: Standard
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APTGX600DU170T6G Microchip Technology APTGX600DU170T6G-IGBT-Module-Datasheet.pdf Description: IGBT MODULE 1700V 750A 1.948KW
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 62500 pF @ 25 V
Current - Collector Cutoff (Max): 50 µA
Power - Max: 1.948 kW
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector (Ic) (Max): 750 A
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 600A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Dual, Common Emitter
Input: Standard
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AT24C16BY6-YH-T AT24C16BY6-YH-T Microchip Technology AT24C16B.pdf Description: IC EEPROM 16KBIT I2C 8MINI MAP
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-Mini Map (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 550 ns
Memory Organization: 2K x 8
DigiKey Programmable: Verified
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1N5300UR-1 1N5300UR-1 Microchip Technology 1N5283UR-1_1N5314UR-1.pdf Description: DIODE CUR REG 100V 1.43MA 500MW
Voltage - Limiting (Max): 1.5V
Regulator Current (Max): 1.43mA
Voltage - Anode - Cathode (Vak)(Max): 100V
Power - Max: 500mW
Supplier Device Package: DO-213AB (MELF, LL41)
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Packaging: Bulk
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1N5302UR-1 1N5302UR-1 Microchip Technology 1N5283UR-1_1N5314UR-1.pdf Description: DIODE CUR REG 100V 1.65MA 500MW
Voltage - Limiting (Max): 1.6V
Regulator Current (Max): 1.65mA
Voltage - Anode - Cathode (Vak)(Max): 100V
Power - Max: 500mW
Supplier Device Package: DO-213AB (MELF, LL41)
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Packaging: Bulk
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1N5302UR-1/TR 1N5302UR-1/TR Microchip Technology 1N5283UR-1_1N5314UR-1.pdf Description: DIODE CUR REG 100V 1.65MA 500MW
Voltage - Limiting (Max): 1.6V
Regulator Current (Max): 1.65mA
Voltage - Anode - Cathode (Vak)(Max): 100V
Power - Max: 500mW
Supplier Device Package: DO-213AB (MELF, LL41)
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Packaging: Tape & Reel (TR)
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USB7205C/KDX USB7205C/KDX Microchip Technology USB7205C-Data-Sheet-00005227.pdf Description: USB3.1 GEN2 HUB_NO PD_NO TYPE C
Supplier Device Package: 100-VQFN (12x12)
Protocol: USB
Voltage - Supply: 3.3V
Operating Temperature: 0°C ~ 70°C
Interface: I2C
Function: Hub Controller
Package / Case: 100-VFQFN Exposed Pad
Packaging: Tray
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USB7205C-I/KDX USB7205C-I/KDX Microchip Technology USB7205C-Data-Sheet-00005227.pdf Description: USB3.1 GEN2 HUB_NO PD_NO TYPE C
Supplier Device Package: 100-VQFN (12x12)
Protocol: USB
Voltage - Supply: 3.3V
Operating Temperature: -40°C ~ 85°C
Interface: I2C
Function: Hub Controller
Package / Case: 100-VFQFN Exposed Pad
Packaging: Tray
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USB7205CT/KDX USB7205CT/KDX Microchip Technology USB7205C-Data-Sheet-00005227.pdf Description: USB3.1 GEN2 HUB_NO PD_NO TYPE C
Protocol: USB
Voltage - Supply: 3.3V
Operating Temperature: 0°C ~ 70°C
Interface: I2C
Function: Hub Controller
Package / Case: 100-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 100-VQFN (12x12)
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USB7205CT-I/KDX USB7205CT-I/KDX Microchip Technology USB7205C-Data-Sheet-00005227.pdf Description: USB3.1 GEN2 HUB_NO PD_NO TYPE C
Operating Temperature: -40°C ~ 85°C
Interface: I2C
Function: Hub Controller
Package / Case: 100-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 100-VQFN (12x12)
Protocol: USB
Voltage - Supply: 3.3V
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VT-706-EAE-2070-25M0000000 Microchip Technology Description: TCXO +3.3 VDC CMOS -40C TO +85C
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LXS101-23-3 LXS101-23-3 Microchip Technology 150_LSX100_LSX700_Series.pdf Description: RF DIODE SCHOTTKY 8V 1A SOT23-3
Power Dissipation (Max): 250 mW
Current - Max: 1 A
Supplier Device Package: SOT-23-3
Voltage - Peak Reverse (Max): 8V
Capacitance @ Vr, F: 1pF @ 0V, 1MHz
Operating Temperature: -55°C ~ 125°C
Diode Type: Schottky - 1 Pair Common Anode
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
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MCP6141T-E/OTVAO MCP6141T-E/OTVAO Microchip Technology 20001668E.pdf Description: IC OPAMP GP 1 CIRCUIT SOT23-5
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C
Current - Supply: 600nA
Slew Rate: 0.003V/µs
Gain Bandwidth Product: 100 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 3 mV
Supplier Device Package: SOT-23-5
Grade: Automotive
Number of Circuits: 1
Current - Output / Channel: 20 mA
Voltage - Supply Span (Min): 1.4 V
Voltage - Supply Span (Max): 6 V
Qualification: AEC-Q100
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MCP6141T-E/OTVAO MCP6141T-E/OTVAO Microchip Technology 20001668E.pdf Description: IC OPAMP GP 1 CIRCUIT SOT23-5
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C
Current - Supply: 600nA
Slew Rate: 0.003V/µs
Gain Bandwidth Product: 100 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 3 mV
Supplier Device Package: SOT-23-5
Grade: Automotive
Number of Circuits: 1
Current - Output / Channel: 20 mA
Voltage - Supply Span (Min): 1.4 V
Voltage - Supply Span (Max): 6 V
Qualification: AEC-Q100
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MCP6141T-E/SNVAO MCP6141T-E/SNVAO Microchip Technology 20001668E.pdf Description: IC OPAMP GP 1 CIRCUIT 8SOIC
Voltage - Supply Span (Max): 6 V
Voltage - Supply Span (Min): 1.4 V
Current - Output / Channel: 20 mA
Number of Circuits: 1
Supplier Device Package: 8-SOIC
Voltage - Input Offset: 3 mV
Current - Input Bias: 1 pA
Gain Bandwidth Product: 100 kHz
Slew Rate: 0.024V/µs
Current - Supply: 600nA
Operating Temperature: -40°C ~ 125°C (TA)
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Single-Ended
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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ATA6502T-4BWVAO ATA6502T-4BWVAO Microchip Technology ATA6500T-4CWVAO.pdf Description: CAN FD TRX SBC WITH 5V LDO 1.8 A
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 3.1V ~ 5.5V, 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 10-VDFN (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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ATA6502T-4BWVAO ATA6502T-4BWVAO Microchip Technology ATA6500T-4CWVAO.pdf Description: CAN FD TRX SBC WITH 5V LDO 1.8 A
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 3.1V ~ 5.5V, 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 10-VDFN (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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JANTX1N5310UR-1 JANTX1N5310UR-1 Microchip Technology 1N5283UR-1_1N5314UR-1.pdf Description: DIODE CUR REG 100V 3.63MA 500MW
Qualification: MIL-PRF-19500/463
Voltage - Limiting (Max): 2.35V
Regulator Current (Max): 3.63mA
Voltage - Anode - Cathode (Vak)(Max): 100V
Power - Max: 500mW
Grade: Military
Supplier Device Package: DO-213AB (MELF, LL41)
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Packaging: Bulk
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AT80C51SND1C-ROTUL AT80C51SND1C-ROTUL Microchip Technology doc4109s.pdf Description: IC MCU 8BIT ROMLESS 80TQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 80C51
Data Converters: A/D 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Connectivity: I2C, IDE/ATAPI, Memory Card, SPI, UART/USART, USB
Peripherals: Audio, I2S, MP3, PCM, POR, WDT
Supplier Device Package: 80-TQFP (14x14)
Number of I/O: 44
DigiKey Programmable: Not Verified
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PIC32CM3204JH00048-I/Y8X PIC32CM3204JH00048-I/Y8X Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-TQFP (7x7)
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tray
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PIC32CM3204JH00048-I/U5B PIC32CM3204JH00048-I/U5B Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-VQFN (7x7)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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PIC32CX5109BZ36048-V/ZWX Microchip Technology PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf Description: 48-PIN 64MHZ CM4F CORE WITH INTE
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: ADC, DAC, GPIO, IrDA, I2C, PWM, SPI, UART, USART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: DSSS
GPIO: 27
Supplier Device Package: 48-VQFN (6x6)
Current - Transmitting: 21.5mA ~ 50mA
Data Rate (Max): 2Mbps
Current - Receiving: 14.5mA ~ 20mA
Protocol: Bluetooth v6.0, Thread, Zigbee®
Power - Output: 11dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB ROM, 96kB SRAM
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -108dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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PIC32CX5109BZ36048T-V/ZWX Microchip Technology PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf Description: 48-PIN 64MHZ CM4F CORE WITH INTE
Current - Receiving: 14.5mA ~ 20mA
Protocol: Bluetooth v6.0, Thread, Zigbee®
Power - Output: 11dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB ROM, 96kB SRAM
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -108dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: ADC, DAC, GPIO, IrDA, I2C, PWM, SPI, UART, USART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: DSSS
GPIO: 27
Supplier Device Package: 48-VQFN (6x6)
Current - Transmitting: 21.5mA ~ 50mA
Data Rate (Max): 2Mbps
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PIC32CX5109BZ36048T-V/ZWX Microchip Technology PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf Description: 48-PIN 64MHZ CM4F CORE WITH INTE
Protocol: Bluetooth v6.0, Thread, Zigbee®
Power - Output: 11dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB ROM, 96kB SRAM
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -108dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: ADC, DAC, GPIO, IrDA, I2C, PWM, SPI, UART, USART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: DSSS
GPIO: 27
Supplier Device Package: 48-VQFN (6x6)
Current - Transmitting: 21.5mA ~ 50mA
Data Rate (Max): 2Mbps
Current - Receiving: 14.5mA ~ 20mA
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PIC32CM3204JH00048T-I/Y8X PIC32CM3204JH00048T-I/Y8X Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-TQFP (7x7)
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tape & Reel (TR)
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PIC32CM3204JH00048T-I/U5B PIC32CM3204JH00048T-I/U5B Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-VQFN (7x7)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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PIC32CM6408JH00048T-I/Y8X Microchip Technology PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
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PIC32CM6408JH00048T-I/U5B Microchip Technology PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
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PIC32CM3204JH00048-E/Y8X PIC32CM3204JH00048-E/Y8X Microchip Technology Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-TQFP (7x7)
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tray
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PIC32CM3204JH00048T-E/Y8X PIC32CM3204JH00048T-E/Y8X Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-TQFP (7x7)
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM3204JH00048-E/U5B PIC32CM3204JH00048-E/U5B Microchip Technology Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-VQFN (7x7)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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PIC32CM3204JH00048T-E/U5B PIC32CM3204JH00048T-E/U5B Microchip Technology PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-VQFN (7x7)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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PIC32CM6408JH00048-E/Y8X Microchip Technology Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tray
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PIC32CM6408JH00048T-E/Y8X Microchip Technology PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
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PIC32CM6408JH00048-E/U5B Microchip Technology Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tray
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PIC32CM6408JH00048T-E/U5B Microchip Technology PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
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M1.5KE250A Microchip Technology RF01008_rE.pdf Description: TVS DIODE 214VWM 344VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5A
Voltage - Reverse Standoff (Typ): 214V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 237V
Voltage - Clamping (Max) @ Ipp: 344V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PIC32CZ4010CA80144-I/LUX PIC32CZ4010CA80144-I/LUX Microchip Technology PIC32CZ-CA80-CA90-Family-Data-Sheet-DS60001749.pdf Description: CM7,4MB FLASH,CONNECTIVITY,144BG
Number of I/O: 108
Supplier Device Package: 144-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1M x 8
Program Memory Size: 4MB (4M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 144-TFBGA
Packaging: Tray
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PIC32CZ8110CA80144-I/LUX PIC32CZ8110CA80144-I/LUX Microchip Technology PIC32CZ-CA80-CA90-Family-Data-Sheet-DS60001749.pdf Description: CM7,8MB FLASH,CONNECTIVITY,144BG
Number of I/O: 108
Supplier Device Package: 144-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1M x 8
Program Memory Size: 8MB (8M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 144-TFBGA
Packaging: Tray
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DSPIC33CK256MP405-E/M7 DSPIC33CK256MP405-E/M7 Microchip Technology dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf Description: IC MCU 16BIT 256KB FLASH 48VFQFN
Number of I/O: 89
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 19x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
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BZV55C68 BZV55C68 Microchip Technology 150_8298-bzv55-c2v4-c75-pdf.pdf Description: DIODE ZENER 68V DO213AA
Current - Reverse Leakage @ Vr: 50 nA @ 47.6 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Supplier Device Package: DO-213AA
Voltage - Zener (Nom) (Vz): 68 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±6%
Packaging: Bulk
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JANTX1N5526BUR-1 JANTX1N5526BUR-1 Microchip Technology 1N5518BUR-1_1N5546BUR-1.pdf Description: DIODE ZENER 6.8V 500MW DO213AA
Qualification: MIL-PRF-19500/437
Current - Reverse Leakage @ Vr: 1 µA @ 6.2 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 30 Ohms
Voltage - Zener (Nom) (Vz): 6.8 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Bulk
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2N1715S 2N1715S Microchip Technology Description: TRANS NPN 100V 0.75A TO39
Voltage - Collector Emitter Breakdown (Max): 100 V
Current - Collector (Ic) (Max): 750 mA
Supplier Device Package: TO-39 (TO-205AD)
Operating Temperature: -65°C ~ 175°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-205AD, TO-39-3 Metal Can
Packaging: Bulk
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2N1715 2N1715 Microchip Technology Description: TRANS NPN 100V 1A TO-5AA
Voltage - Collector Emitter Breakdown (Max): 100 V
Current - Collector (Ic) (Max): 1 A
Supplier Device Package: TO-5AA
Operating Temperature: -65°C ~ 175°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-205AA, TO-5-3 Metal Can
Packaging: Bulk
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MSC030SMB120B4N Microchip Technology MSC030SMB120B4N-SiC-MOSFET-Datasheet.pdf Description: MOSFET SIC 1200 V 30 MOHM TO-247
Packaging: Tube
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DSC1001DI1-025.0008T DSC1001DI1-025.0008T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 25.0008MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25.0008 MHz
Base Resonator: MEMS
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PIC18F97J60T-I/PF PIC18F97J60T-I/PF Microchip Technology 39762f.pdf Description: IC MCU 8BIT 128KB FLASH 100TQFP
DigiKey Programmable: Not Verified
Number of I/O: 70
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 3808 x 8
Program Memory Size: 128KB (64K x 16)
Speed: 41.667MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tape & Reel (TR)
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PIC18F97J60T-I/PF PIC18F97J60T-I/PF Microchip Technology 39762f.pdf Description: IC MCU 8BIT 128KB FLASH 100TQFP
RAM Size: 3808 x 8
Program Memory Size: 128KB (64K x 16)
Speed: 41.667MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 70
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
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DSPIC33EP256MU810T-I/PF DSPIC33EP256MU810T-I/PF Microchip Technology 70616g.pdf Description: IC MCU 16BIT 256KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 60 MIPs
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 12K x 16
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 32x10b/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 83
DigiKey Programmable: Not Verified
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DSPIC33EP256MU810T-I/PF DSPIC33EP256MU810T-I/PF Microchip Technology 70616g.pdf Description: IC MCU 16BIT 256KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 60 MIPs
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 12K x 16
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 32x10b/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 83
DigiKey Programmable: Not Verified
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APT34M60S/TR APT34M60S/TR Microchip Technology APT34M60B_S_C.pdf Description: MOSFET N-CH 600V 36A D3PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 36A (Tc)
Rds On (Max) @ Id, Vgs: 190mOhm @ 17A, 10V
Power Dissipation (Max): 624W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6640 pF @ 25 V
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APT34F60S/TR APT34F60S/TR Microchip Technology 6954-apt34f60b-apt34f60s-datasheet Description: MOSFET N-CH 600V 36A D3PAK
Supplier Device Package: D3Pak
Vgs(th) (Max) @ Id: 5V @ 1mA
Power Dissipation (Max): 624W (Tc)
Rds On (Max) @ Id, Vgs: 190mOhm @ 17A, 10V
Current - Continuous Drain (Id) @ 25°C: 36A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 6640 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
Drain to Source Voltage (Vdss): 600 V
Vgs (Max): ±30V
Drive Voltage (Max Rds On, Min Rds On): 10V
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MCP48CMB18T-20E/ST MCP48CxBx4_8_2021.pdf
MCP48CMB18T-20E/ST
Hersteller: Microchip Technology
Description: IC DAC 10BIT V-OUT 20TSSOP
Differential Output: No
INL/DNL (LSB): ±0.25, ±0.25
Number of D/A Converters: 8
Architecture: R-2R
Supplier Device Package: 20-TSSOP
Settling Time: 16µs (Typ)
Voltage - Supply, Digital: 1.8V ~ 5.5V
Voltage - Supply, Analog: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Reference Type: External, Internal, Supply
Data Interface: SPI
Number of Bits: 10
Mounting Type: Surface Mount
Output Type: Voltage - Buffered
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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MCP48CMB18T-20E/ST MCP48CxBx4_8_2021.pdf
MCP48CMB18T-20E/ST
Hersteller: Microchip Technology
Description: IC DAC 10BIT V-OUT 20TSSOP
Differential Output: No
INL/DNL (LSB): ±0.25, ±0.25
Number of D/A Converters: 8
Architecture: R-2R
Supplier Device Package: 20-TSSOP
Settling Time: 16µs (Typ)
Voltage - Supply, Digital: 1.8V ~ 5.5V
Voltage - Supply, Analog: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Reference Type: External, Internal, Supply
Data Interface: SPI
Number of Bits: 10
Mounting Type: Surface Mount
Output Type: Voltage - Buffered
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 2500 Stücke:
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M5KP30A rf01010_rb.pdf
M5KP30A
Hersteller: Microchip Technology
Description: TVS DIODE 30VWM 48.4VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 103A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 48.4V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M15KP30A rf01011_m15kp_rev_e.pdf
M15KP30A
Hersteller: Microchip Technology
Description: TVS DIODE 30VWM 50.7VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 296A
Voltage - Reverse Standoff (Typ): 30V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 33.3V
Voltage - Clamping (Max) @ Ipp: 50.7V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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APTGX75DU170T3AG APTGX75DU170T3AG-IGBT-Module-Datasheet.pdf
Hersteller: Microchip Technology
Description: IGBT MODULE 1700V 145A 524W
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 7600 pF @ 25 V
Current - Collector Cutoff (Max): 10 µA
Power - Max: 524 W
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector (Ic) (Max): 145 A
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 75A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Dual, Common Emitter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
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APTGX300DU120T6G APTGX300DU120T6G-IGBT-Module-Datasheet.pdf
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 415A 1.02KW
Input Capacitance (Cies) @ Vce: 60000 pF @ 25 V
Current - Collector Cutoff (Max): 24 µA
Power - Max: 1.02 kW
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 415 A
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 300A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Dual, Common Emitter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
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APTGX300DU170T6G APTGX300DU170T6G-IGBT-Module-Datasheet.pdf
Hersteller: Microchip Technology
Description: IGBT MODULE 1700V 385A 1.034KW
Package / Case: Module
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 31300 pF @ 25 V
Current - Collector Cutoff (Max): 25 µA
Power - Max: 1.034 kW
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector (Ic) (Max): 385 A
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 300A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Dual, Common Emitter
Input: Standard
Mounting Type: Chassis Mount
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APTGX450DU120T6G APTGX450DU120T6G-IGBT-Module-Datasheet.pdf
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 605A 1.456KW
Input Capacitance (Cies) @ Vce: 90000 pF @ 25 V
Current - Collector Cutoff (Max): 36 µA
Power - Max: 1.456 kW
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 605 A
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 450A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Dual, Common Emitter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
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APTGX600DU120T6G APTGX600DU120T6G-IGBT-Module-Datasheet.pdf
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 805A 1.923KW
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 120000 pF @ 25 V
Current - Collector Cutoff (Max): 50 µA
Power - Max: 1.923 kW
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 805 A
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 600A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Dual, Common Emitter
Input: Standard
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APTGX600DU170T6G APTGX600DU170T6G-IGBT-Module-Datasheet.pdf
Hersteller: Microchip Technology
Description: IGBT MODULE 1700V 750A 1.948KW
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 62500 pF @ 25 V
Current - Collector Cutoff (Max): 50 µA
Power - Max: 1.948 kW
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector (Ic) (Max): 750 A
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 600A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Dual, Common Emitter
Input: Standard
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AT24C16BY6-YH-T AT24C16B.pdf
AT24C16BY6-YH-T
Hersteller: Microchip Technology
Description: IC EEPROM 16KBIT I2C 8MINI MAP
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-Mini Map (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 550 ns
Memory Organization: 2K x 8
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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1N5300UR-1 1N5283UR-1_1N5314UR-1.pdf
1N5300UR-1
Hersteller: Microchip Technology
Description: DIODE CUR REG 100V 1.43MA 500MW
Voltage - Limiting (Max): 1.5V
Regulator Current (Max): 1.43mA
Voltage - Anode - Cathode (Vak)(Max): 100V
Power - Max: 500mW
Supplier Device Package: DO-213AB (MELF, LL41)
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Packaging: Bulk
Produkt ist nicht verfügbar
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1N5302UR-1 1N5283UR-1_1N5314UR-1.pdf
1N5302UR-1
Hersteller: Microchip Technology
Description: DIODE CUR REG 100V 1.65MA 500MW
Voltage - Limiting (Max): 1.6V
Regulator Current (Max): 1.65mA
Voltage - Anode - Cathode (Vak)(Max): 100V
Power - Max: 500mW
Supplier Device Package: DO-213AB (MELF, LL41)
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Packaging: Bulk
Produkt ist nicht verfügbar
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1N5302UR-1/TR 1N5283UR-1_1N5314UR-1.pdf
1N5302UR-1/TR
Hersteller: Microchip Technology
Description: DIODE CUR REG 100V 1.65MA 500MW
Voltage - Limiting (Max): 1.6V
Regulator Current (Max): 1.65mA
Voltage - Anode - Cathode (Vak)(Max): 100V
Power - Max: 500mW
Supplier Device Package: DO-213AB (MELF, LL41)
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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USB7205C/KDX USB7205C-Data-Sheet-00005227.pdf
USB7205C/KDX
Hersteller: Microchip Technology
Description: USB3.1 GEN2 HUB_NO PD_NO TYPE C
Supplier Device Package: 100-VQFN (12x12)
Protocol: USB
Voltage - Supply: 3.3V
Operating Temperature: 0°C ~ 70°C
Interface: I2C
Function: Hub Controller
Package / Case: 100-VFQFN Exposed Pad
Packaging: Tray
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2+14.1 EUR
25+11.75 EUR
100+11.34 EUR
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USB7205C-I/KDX USB7205C-Data-Sheet-00005227.pdf
USB7205C-I/KDX
Hersteller: Microchip Technology
Description: USB3.1 GEN2 HUB_NO PD_NO TYPE C
Supplier Device Package: 100-VQFN (12x12)
Protocol: USB
Voltage - Supply: 3.3V
Operating Temperature: -40°C ~ 85°C
Interface: I2C
Function: Hub Controller
Package / Case: 100-VFQFN Exposed Pad
Packaging: Tray
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1+17.6 EUR
25+14.67 EUR
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USB7205CT/KDX USB7205C-Data-Sheet-00005227.pdf
USB7205CT/KDX
Hersteller: Microchip Technology
Description: USB3.1 GEN2 HUB_NO PD_NO TYPE C
Protocol: USB
Voltage - Supply: 3.3V
Operating Temperature: 0°C ~ 70°C
Interface: I2C
Function: Hub Controller
Package / Case: 100-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 100-VQFN (12x12)
Produkt ist nicht verfügbar
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USB7205CT-I/KDX USB7205C-Data-Sheet-00005227.pdf
USB7205CT-I/KDX
Hersteller: Microchip Technology
Description: USB3.1 GEN2 HUB_NO PD_NO TYPE C
Operating Temperature: -40°C ~ 85°C
Interface: I2C
Function: Hub Controller
Package / Case: 100-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 100-VQFN (12x12)
Protocol: USB
Voltage - Supply: 3.3V
Produkt ist nicht verfügbar
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VT-706-EAE-2070-25M0000000
Hersteller: Microchip Technology
Description: TCXO +3.3 VDC CMOS -40C TO +85C
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LXS101-23-3 150_LSX100_LSX700_Series.pdf
LXS101-23-3
Hersteller: Microchip Technology
Description: RF DIODE SCHOTTKY 8V 1A SOT23-3
Power Dissipation (Max): 250 mW
Current - Max: 1 A
Supplier Device Package: SOT-23-3
Voltage - Peak Reverse (Max): 8V
Capacitance @ Vr, F: 1pF @ 0V, 1MHz
Operating Temperature: -55°C ~ 125°C
Diode Type: Schottky - 1 Pair Common Anode
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
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MCP6141T-E/OTVAO 20001668E.pdf
MCP6141T-E/OTVAO
Hersteller: Microchip Technology
Description: IC OPAMP GP 1 CIRCUIT SOT23-5
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C
Current - Supply: 600nA
Slew Rate: 0.003V/µs
Gain Bandwidth Product: 100 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 3 mV
Supplier Device Package: SOT-23-5
Grade: Automotive
Number of Circuits: 1
Current - Output / Channel: 20 mA
Voltage - Supply Span (Min): 1.4 V
Voltage - Supply Span (Max): 6 V
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCP6141T-E/OTVAO 20001668E.pdf
MCP6141T-E/OTVAO
Hersteller: Microchip Technology
Description: IC OPAMP GP 1 CIRCUIT SOT23-5
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C
Current - Supply: 600nA
Slew Rate: 0.003V/µs
Gain Bandwidth Product: 100 kHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 3 mV
Supplier Device Package: SOT-23-5
Grade: Automotive
Number of Circuits: 1
Current - Output / Channel: 20 mA
Voltage - Supply Span (Min): 1.4 V
Voltage - Supply Span (Max): 6 V
Qualification: AEC-Q100
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15+1.18 EUR
25+0.99 EUR
100+0.98 EUR
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MCP6141T-E/SNVAO 20001668E.pdf
MCP6141T-E/SNVAO
Hersteller: Microchip Technology
Description: IC OPAMP GP 1 CIRCUIT 8SOIC
Voltage - Supply Span (Max): 6 V
Voltage - Supply Span (Min): 1.4 V
Current - Output / Channel: 20 mA
Number of Circuits: 1
Supplier Device Package: 8-SOIC
Voltage - Input Offset: 3 mV
Current - Input Bias: 1 pA
Gain Bandwidth Product: 100 kHz
Slew Rate: 0.024V/µs
Current - Supply: 600nA
Operating Temperature: -40°C ~ 125°C (TA)
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Single-Ended
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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ATA6502T-4BWVAO ATA6500T-4CWVAO.pdf
ATA6502T-4BWVAO
Hersteller: Microchip Technology
Description: CAN FD TRX SBC WITH 5V LDO 1.8 A
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 3.1V ~ 5.5V, 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 10-VDFN (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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5000+0.94 EUR
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ATA6502T-4BWVAO ATA6500T-4CWVAO.pdf
ATA6502T-4BWVAO
Hersteller: Microchip Technology
Description: CAN FD TRX SBC WITH 5V LDO 1.8 A
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 3.1V ~ 5.5V, 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 10-VDFN (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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15+1.25 EUR
25+1.05 EUR
100+1.04 EUR
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JANTX1N5310UR-1 1N5283UR-1_1N5314UR-1.pdf
JANTX1N5310UR-1
Hersteller: Microchip Technology
Description: DIODE CUR REG 100V 3.63MA 500MW
Qualification: MIL-PRF-19500/463
Voltage - Limiting (Max): 2.35V
Regulator Current (Max): 3.63mA
Voltage - Anode - Cathode (Vak)(Max): 100V
Power - Max: 500mW
Grade: Military
Supplier Device Package: DO-213AB (MELF, LL41)
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Packaging: Bulk
Produkt ist nicht verfügbar
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AT80C51SND1C-ROTUL doc4109s.pdf
AT80C51SND1C-ROTUL
Hersteller: Microchip Technology
Description: IC MCU 8BIT ROMLESS 80TQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 80C51
Data Converters: A/D 2x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Connectivity: I2C, IDE/ATAPI, Memory Card, SPI, UART/USART, USB
Peripherals: Audio, I2S, MP3, PCM, POR, WDT
Supplier Device Package: 80-TQFP (14x14)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC32CM3204JH00048-I/Y8X PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM3204JH00048-I/Y8X
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-TQFP (7x7)
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tray
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AnzahlPreis
8+2.43 EUR
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PIC32CM3204JH00048-I/U5B PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM3204JH00048-I/U5B
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-VQFN (7x7)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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8+2.5 EUR
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PIC32CX5109BZ36048-V/ZWX PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf
Hersteller: Microchip Technology
Description: 48-PIN 64MHZ CM4F CORE WITH INTE
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: ADC, DAC, GPIO, IrDA, I2C, PWM, SPI, UART, USART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: DSSS
GPIO: 27
Supplier Device Package: 48-VQFN (6x6)
Current - Transmitting: 21.5mA ~ 50mA
Data Rate (Max): 2Mbps
Current - Receiving: 14.5mA ~ 20mA
Protocol: Bluetooth v6.0, Thread, Zigbee®
Power - Output: 11dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB ROM, 96kB SRAM
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -108dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 485 Stücke:
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5+3.82 EUR
25+3.47 EUR
100+3.16 EUR
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PIC32CX5109BZ36048T-V/ZWX PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf
Hersteller: Microchip Technology
Description: 48-PIN 64MHZ CM4F CORE WITH INTE
Current - Receiving: 14.5mA ~ 20mA
Protocol: Bluetooth v6.0, Thread, Zigbee®
Power - Output: 11dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB ROM, 96kB SRAM
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -108dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: ADC, DAC, GPIO, IrDA, I2C, PWM, SPI, UART, USART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: DSSS
GPIO: 27
Supplier Device Package: 48-VQFN (6x6)
Current - Transmitting: 21.5mA ~ 50mA
Data Rate (Max): 2Mbps
Produkt ist nicht verfügbar
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PIC32CX5109BZ36048T-V/ZWX PIC32CX-BZ3-and-WBZ35x-Family-Data-Sheet-DS70005541.pdf
Hersteller: Microchip Technology
Description: 48-PIN 64MHZ CM4F CORE WITH INTE
Protocol: Bluetooth v6.0, Thread, Zigbee®
Power - Output: 11dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 512kB Flash, 64kB ROM, 96kB SRAM
Mounting Type: Surface Mount, Wettable Flank
Sensitivity: -108dBm
Package / Case: 48-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Qualification: AEC-Q100
Grade: Automotive
Serial Interfaces: ADC, DAC, GPIO, IrDA, I2C, PWM, SPI, UART, USART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: DSSS
GPIO: 27
Supplier Device Package: 48-VQFN (6x6)
Current - Transmitting: 21.5mA ~ 50mA
Data Rate (Max): 2Mbps
Current - Receiving: 14.5mA ~ 20mA
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PIC32CM3204JH00048T-I/Y8X PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM3204JH00048T-I/Y8X
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-TQFP (7x7)
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM3204JH00048T-I/U5B PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM3204JH00048T-I/U5B
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-VQFN (7x7)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM6408JH00048T-I/Y8X PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM6408JH00048T-I/U5B PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM3204JH00048-E/Y8X
PIC32CM3204JH00048-E/Y8X
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-TQFP (7x7)
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tray
Produkt ist nicht verfügbar
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PIC32CM3204JH00048T-E/Y8X PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM3204JH00048T-E/Y8X
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-TQFP (7x7)
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM3204JH00048-E/U5B
PIC32CM3204JH00048-E/U5B
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-VQFN (7x7)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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PIC32CM3204JH00048T-E/U5B PIC32CM-16-32-GV00-Family-Data-Sheet-DS60001881.pdf
PIC32CM3204JH00048T-E/U5B
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 32KB FLASH, 48PIN
Supplier Device Package: 48-VQFN (7x7)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM6408JH00048-E/Y8X
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tray
Produkt ist nicht verfügbar
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PIC32CM6408JH00048T-E/Y8X PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC32CM6408JH00048-E/U5B
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tray
Produkt ist nicht verfügbar
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PIC32CM6408JH00048T-E/U5B PIC32CM-MC00-Family-Data-Sheet-DS60001638.pdf
Hersteller: Microchip Technology
Description: 5V CORTEX M0+ 64KB FLASH, 48PIN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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M1.5KE250A RF01008_rE.pdf
Hersteller: Microchip Technology
Description: TVS DIODE 214VWM 344VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5A
Voltage - Reverse Standoff (Typ): 214V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 237V
Voltage - Clamping (Max) @ Ipp: 344V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Produkt ist nicht verfügbar
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PIC32CZ4010CA80144-I/LUX PIC32CZ-CA80-CA90-Family-Data-Sheet-DS60001749.pdf
PIC32CZ4010CA80144-I/LUX
Hersteller: Microchip Technology
Description: CM7,4MB FLASH,CONNECTIVITY,144BG
Number of I/O: 108
Supplier Device Package: 144-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1M x 8
Program Memory Size: 4MB (4M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 144-TFBGA
Packaging: Tray
auf Bestellung 184 Stücke:
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AnzahlPreis
2+13.22 EUR
25+11.99 EUR
100+10.9 EUR
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PIC32CZ8110CA80144-I/LUX PIC32CZ-CA80-CA90-Family-Data-Sheet-DS60001749.pdf
PIC32CZ8110CA80144-I/LUX
Hersteller: Microchip Technology
Description: CM7,8MB FLASH,CONNECTIVITY,144BG
Number of I/O: 108
Supplier Device Package: 144-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1M x 8
Program Memory Size: 8MB (8M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 144-TFBGA
Packaging: Tray
auf Bestellung 189 Stücke:
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AnzahlPreis
2+15.58 EUR
25+14.14 EUR
100+12.86 EUR
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DSPIC33CK256MP405-E/M7 dsPIC33CK1024MP710-Family-Data-Sheet-DS70005496.pdf
DSPIC33CK256MP405-E/M7
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48VFQFN
Number of I/O: 89
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 19x12b SAR; D/A 6x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
auf Bestellung 183 Stücke:
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AnzahlPreis
4+4.47 EUR
25+4.06 EUR
100+3.69 EUR
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BZV55C68 150_8298-bzv55-c2v4-c75-pdf.pdf
BZV55C68
Hersteller: Microchip Technology
Description: DIODE ZENER 68V DO213AA
Current - Reverse Leakage @ Vr: 50 nA @ 47.6 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Supplier Device Package: DO-213AA
Voltage - Zener (Nom) (Vz): 68 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±6%
Packaging: Bulk
Produkt ist nicht verfügbar
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JANTX1N5526BUR-1 1N5518BUR-1_1N5546BUR-1.pdf
JANTX1N5526BUR-1
Hersteller: Microchip Technology
Description: DIODE ZENER 6.8V 500MW DO213AA
Qualification: MIL-PRF-19500/437
Current - Reverse Leakage @ Vr: 1 µA @ 6.2 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Grade: Military
Supplier Device Package: DO-213AA
Impedance (Max) (Zzt): 30 Ohms
Voltage - Zener (Nom) (Vz): 6.8 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AA
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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2N1715S
2N1715S
Hersteller: Microchip Technology
Description: TRANS NPN 100V 0.75A TO39
Voltage - Collector Emitter Breakdown (Max): 100 V
Current - Collector (Ic) (Max): 750 mA
Supplier Device Package: TO-39 (TO-205AD)
Operating Temperature: -65°C ~ 175°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-205AD, TO-39-3 Metal Can
Packaging: Bulk
Produkt ist nicht verfügbar
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2N1715
2N1715
Hersteller: Microchip Technology
Description: TRANS NPN 100V 1A TO-5AA
Voltage - Collector Emitter Breakdown (Max): 100 V
Current - Collector (Ic) (Max): 1 A
Supplier Device Package: TO-5AA
Operating Temperature: -65°C ~ 175°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-205AA, TO-5-3 Metal Can
Packaging: Bulk
Produkt ist nicht verfügbar
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MSC030SMB120B4N MSC030SMB120B4N-SiC-MOSFET-Datasheet.pdf
Hersteller: Microchip Technology
Description: MOSFET SIC 1200 V 30 MOHM TO-247
Packaging: Tube
auf Bestellung 120 Stücke:
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AnzahlPreis
1+17.74 EUR
25+16.36 EUR
100+14.24 EUR
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DSC1001DI1-025.0008T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DI1-025.0008T
Hersteller: Microchip Technology
Description: MEMS OSC XO 25.0008MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 8mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25.0008 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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PIC18F97J60T-I/PF 39762f.pdf
PIC18F97J60T-I/PF
Hersteller: Microchip Technology
Description: IC MCU 8BIT 128KB FLASH 100TQFP
DigiKey Programmable: Not Verified
Number of I/O: 70
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 3808 x 8
Program Memory Size: 128KB (64K x 16)
Speed: 41.667MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC18F97J60T-I/PF 39762f.pdf
PIC18F97J60T-I/PF
Hersteller: Microchip Technology
Description: IC MCU 8BIT 128KB FLASH 100TQFP
RAM Size: 3808 x 8
Program Memory Size: 128KB (64K x 16)
Speed: 41.667MHz
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 70
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: PIC
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
auf Bestellung 930 Stücke:
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AnzahlPreis
2+12.3 EUR
25+11.28 EUR
100+10.22 EUR
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DSPIC33EP256MU810T-I/PF 70616g.pdf
DSPIC33EP256MU810T-I/PF
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 60 MIPs
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 12K x 16
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 32x10b/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DSPIC33EP256MU810T-I/PF 70616g.pdf
DSPIC33EP256MU810T-I/PF
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 60 MIPs
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 12K x 16
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 32x10b/12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 474 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+16.53 EUR
25+15.13 EUR
100+13.69 EUR
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APT34M60S/TR APT34M60B_S_C.pdf
APT34M60S/TR
Hersteller: Microchip Technology
Description: MOSFET N-CH 600V 36A D3PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 36A (Tc)
Rds On (Max) @ Id, Vgs: 190mOhm @ 17A, 10V
Power Dissipation (Max): 624W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6640 pF @ 25 V
Produkt ist nicht verfügbar
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APT34F60S/TR 6954-apt34f60b-apt34f60s-datasheet
APT34F60S/TR
Hersteller: Microchip Technology
Description: MOSFET N-CH 600V 36A D3PAK
Supplier Device Package: D3Pak
Vgs(th) (Max) @ Id: 5V @ 1mA
Power Dissipation (Max): 624W (Tc)
Rds On (Max) @ Id, Vgs: 190mOhm @ 17A, 10V
Current - Continuous Drain (Id) @ 25°C: 36A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 6640 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
Drain to Source Voltage (Vdss): 600 V
Vgs (Max): ±30V
Drive Voltage (Max Rds On, Min Rds On): 10V
Produkt ist nicht verfügbar
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