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2N5884 2N5884 Microchip Technology 2n5883-d.pdf Description: PNP POWER TRANSISTOR SILICON AMP
Packaging: Bulk
Produkt ist nicht verfügbar
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DSPIC33CK256MC105-I/M7 DSPIC33CK256MC105-I/M7 Microchip Technology dsPIC33CK256MC506-Family-Data-Sheet-DS70005473C.pdf Description: IC MCU 16BIT 256KB FLASH 48VQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 20x12b SAR; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SmartCard, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 191 Stücke:
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7+2.52 EUR
25+2.28 EUR
100+2.08 EUR
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dsPIC33CK256MC105T-I/M7 dsPIC33CK256MC105T-I/M7 Microchip Technology dsPIC33CK256MC506-Family-Data-Sheet-DS70005473C.pdf Description: IC MCU 16BIT 256KB FLASH 48VQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 20x12b SAR; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SmartCard, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 34
DigiKey Programmable: Not Verified
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dsPIC33CK256MC505T-I/M7 dsPIC33CK256MC505T-I/M7 Microchip Technology dsPIC33CK256MC506-Family-Data-Sheet-DS70005473C.pdf Description: IC MCU 16BIT 256KB FLASH 48VQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 20x12b SAR; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, SPI, Smart Card, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 34
DigiKey Programmable: Not Verified
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dsPIC33CK256MC505-E/M7 dsPIC33CK256MC505-E/M7 Microchip Technology dsPIC33CK256MC506-Family-Data-Sheet-DS70005473C.pdf Description: IC MCU 16BIT 256KB FLASH 48VQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 20x12b SAR; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, SPI, Smart Card, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 34
DigiKey Programmable: Not Verified
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ATSAM3S1AA-MUR ATSAM3S1AA-MUR Microchip Technology SAM3S_Series.pdf Description: IC MCU 32BIT 64KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10/12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC32CM2532LE00048-E/U5B PIC32CM2532LE00048-E/U5B Microchip Technology 60001615E.pdf Description: CM23, ULP, TOUCH, 256K FLASH, 48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 14x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
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PIC32CM2532LE00048T-E/U5B PIC32CM2532LE00048T-E/U5B Microchip Technology 60001615E.pdf Description: CM23, ULP, TOUCH, 256K FLASH, 48
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 14x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 34
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PIC32CM2532LS00048-E/U5B PIC32CM2532LS00048-E/U5B Microchip Technology 60001615E.pdf Description: CM23, ULP, TOUCH, SECURITY, 256K
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 14x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 34
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PIC32CM2532LS00048T-E/U5B PIC32CM2532LS00048T-E/U5B Microchip Technology 60001615E.pdf Description: CM23, ULP, TOUCH, SECURITY, 256K
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 14x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
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1N5246 1N5246 Microchip Technology LDS-0232.pdf Description: DIODE ZENER 16V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 17 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 11.4 V
Produkt ist nicht verfügbar
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1N759A 1N759A Microchip Technology 1N746A-1-1N759A-1_1N4370A-1-1N4372A-1.pdf Description: DIODE ZENER 12V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 9 V
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APTGX600SK120T6G Microchip Technology APTGX600SK120T6G-IGBT-Module-Datasheet.pdf Description: IGBT MODULE 1200V 805A 1.923KW
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 600A
NTC Thermistor: Yes
Current - Collector (Ic) (Max): 805 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1.923 kW
Current - Collector Cutoff (Max): 50 µA
Input Capacitance (Cies) @ Vce: 120000 pF @ 25 V
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MO-9150AE-6E-HS-133M000000 Microchip Technology Description: MEMS BASED XO +2.5 VDC -40C TO +
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC18F55Q43-I/6LX PIC18F55Q43-I/6LX Microchip Technology PIC18F25-45-55Q43-Data-Sheet-40002170E.pdf Description: IC MCU 8BIT 32KB FLASH 48VQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 44
DigiKey Programmable: Not Verified
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7+2.59 EUR
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100+2.14 EUR
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PIC18F55Q43-E/6LX PIC18F55Q43-E/6LX Microchip Technology PIC18F25-45-55Q43-Data-Sheet-40002170E.pdf Description: IC MCU 8BIT 32KB FLASH 48VQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 44
DigiKey Programmable: Not Verified
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1N5261B 1N5261B Microchip Technology 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf Description: DIODE ZENER 47V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 105 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 36 V
Produkt ist nicht verfügbar
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UPT17E3/TR7 UPT17E3/TR7 Microchip Technology UPT+RF01103_Rev_B_Final-PD-000177967+%284%29.pdf Description: TVS DIODE 17VWM 29.2VC POWERMIT1
Packaging: Tape & Reel (TR)
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.14A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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MAUPT17 MAUPT17 Microchip Technology Description: TVS DIODE 17VWM 29.2VC POWERMIT1
Packaging: Bulk
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.14A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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MAUPT17e3 MAUPT17e3 Microchip Technology Description: TVS DIODE 17VWM 29.2VC POWERMIT1
Packaging: Bulk
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.14A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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JANTX1N4957C Microchip Technology 1N4954-1N4996%2C15968-1N5969%2C1N6632-1N6637.pdf Description: DIODE ZENER 9.1V 5W E-AXIAL
Tolerance: ±2%
Packaging: Bulk
Package / Case: E, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 2 Ohms
Supplier Device Package: E, Axial
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 25 µA @ 6.9 V
Qualification: MIL-PRF-19500/435
Produkt ist nicht verfügbar
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MCP1725-1802E/MCVAO Microchip Technology MCP1725-500-mA%2C-Low-Voltage%2C-Low-Quiescent-Current-LDO-Regulator-20002026C.pdf Description: 500MA, LOW VOLTAGE LDO
Packaging: Tube
Produkt ist nicht verfügbar
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MCP1405T-E/SNVAO MCP1405T-E/SNVAO Microchip Technology 22022b.pdf Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 18V
Input Type: Inverting, Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 18ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel, P-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 4.5A, 4.5A
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCP1405T-E/SNVAO MCP1405T-E/SNVAO Microchip Technology 22022b.pdf Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 18V
Input Type: Inverting, Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 18ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel, P-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 4.5A, 4.5A
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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VCC1-1519-12M28800000 Microchip Technology VCC1-April-2020.pdf Description: CUSTOM CMOS XO
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Height - Seated (Max): 0.075" (1.90mm)
Frequency: 12.288 MHz
Base Resonator: Crystal
Produkt ist nicht verfügbar
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MPFS-ICICLE-KIT MPFS-ICICLE-KIT Microchip Technology microchip_polarfire_soc_fpga_icicle_kit_user_guide_vb.pdf Description: POLARFIRE SOC FPGA ICICLE KIT
Packaging: Bulk
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: MPFS250
Platform: PolarFire SoC FPGA SiFive RISC-V Icicle
auf Bestellung 12 Stücke:
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1+612.44 EUR
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EV25F14A EV25F14A Microchip Technology RNBD451-Add-On-Board-User-Guide-DS50003476.pdf Description: RNBD451 ADD ON BOARD
Packaging: Box
Function: Bluetooth Low Energy (BLE)
Type: RF
Contents: Board(s)
Utilized IC / Part: RNBD451
Platform: mikroBUS™ Click™
auf Bestellung 27 Stücke:
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1+24.24 EUR
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dsPIC33AK256MC505-I/M7 dsPIC33AK256MC505-I/M7 Microchip Technology dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
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25+3.89 EUR
100+3.54 EUR
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dsPIC33AK512MC205-I/M7 dsPIC33AK512MC205-I/M7 Microchip Technology dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
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dsPIC33AK512MC505-I/M7 dsPIC33AK512MC505-I/M7 Microchip Technology dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
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dsPIC33AK256MPS205-I/M7 dsPIC33AK256MPS205-I/M7 Microchip Technology dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
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dsPIC33AK512MPS205-I/M7 dsPIC33AK512MPS205-I/M7 Microchip Technology dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
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DSPIC33AK256MC205-I/M7 DSPIC33AK256MC205-I/M7 Microchip Technology dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
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5+4.22 EUR
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MO9168 Microchip Technology Description: CLOCK OSCILLATOR
Packaging: Tray
Produkt ist nicht verfügbar
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DSC1001CE1-037.1250T DSC1001CE1-037.1250T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 37.1250MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 37.125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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DSC1001CE1-037.1250 DSC1001CE1-037.1250 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 37.1250MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 37.125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MSC010SDA070S MSC010SDA070S Microchip Technology 00003841A_MSC010SDA070S_SiC_SBD_Datasheet.pdf Description: DIODE SIL CARBIDE 700V 10A D3PAK
Packaging: Bulk
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Current - Average Rectified (Io): 10A
Supplier Device Package: D3Pak
Voltage - DC Reverse (Vr) (Max): 700 V
Produkt ist nicht verfügbar
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EV18H47A EV18H47A Microchip Technology Motor-Control-Low-Voltage-48V-300W-Inverter-Board-Users-Guide-DS50003297.pdf Description: EVAL BOARD FOR ATSAME70N21
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: ATSAME70N21
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU
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1+356.61 EUR
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EV42J24A EV42J24A Microchip Technology Description: CEC1736 EVALUATION BOARD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: CEC1736
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1+778.36 EUR
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VX-805-ECE-KEXN-204M800000 Microchip Technology VX-805-April-2020.pdf Description: LOW NOISE CERAMIC VCXO +3.3 VDC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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JANS1N6319CUS JANS1N6319CUS Microchip Technology Description: DIODE ZENER 6.2V 500MW SQ-MELF
Tolerance: ±2%
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: B, SQ-MELF
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 5 µA @ 3.5 V
Qualification: MIL-PRF-19500/533
Produkt ist nicht verfügbar
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MIC2951-03BN MIC2951-03BN Microchip Technology mic2950.pdf Description: IC REG LIN POS ADJ 150MA 8-PDIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Output Type: Adjustable (Fixed)
Mounting Type: Through Hole
Current - Output: 150mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 300 µA
Voltage - Input (Max): 30V
Number of Regulators: 1
Supplier Device Package: 8-PDIP
Voltage - Output (Max): 29V
Voltage - Output (Min/Fixed): 1.24V (5V)
Control Features: Enable
Voltage Dropout (Max): 0.6V @ 150mA
Protection Features: Over Current, Over Temperature, Reverse Polarity
Current - Supply (Max): 8 mA
Produkt ist nicht verfügbar
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MCP41U83T-103E/ST MCP41U83T-103E/ST Microchip Technology MCP41U83-Data-Sheet-DS20007000.pdf Description: 10BIT I2C/SPI 1-CH DIGI POT WITH
Resistance (Ohms): 10k
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Non-Volatile
Interface: SPI
Configuration: Potentiometer, Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 1024
Voltage - Supply: 2.7V ~ 5.5V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 19
Temperature Coefficient (Typ): 25ppm/°C
Number of Circuits: 1
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MCP41U83T-103E/ST MCP41U83T-103E/ST Microchip Technology MCP41U83-Data-Sheet-DS20007000.pdf Description: 10BIT I2C/SPI 1-CH DIGI POT WITH
Resistance (Ohms): 10k
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Non-Volatile
Interface: SPI
Configuration: Potentiometer, Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 1024
Voltage - Supply: 2.7V ~ 5.5V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 19
Temperature Coefficient (Typ): 25ppm/°C
Number of Circuits: 1
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MSC400SMA330B4N MSC400SMA330B4N Microchip Technology product-ds.MSC400SMA330.pdf Description: MOSFET SIC 3300V 400 MOHM TO-247
Packaging: Tube
Package / Case: TO-247-4
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 11A (Tc)
Rds On (Max) @ Id, Vgs: 520mOhm @ 5A, 20V
Power Dissipation (Max): 131W (Tc)
Vgs(th) (Max) @ Id: 2.97V @ 1mA
Supplier Device Package: TO-247-4
Drive Voltage (Max Rds On, Min Rds On): 20V
Vgs (Max): +23V, -10V
Drain to Source Voltage (Vdss): 3300 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 20 V
Input Capacitance (Ciss) (Max) @ Vds: 579 pF @ 2.4 kV
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1N5240B 1N5240B Microchip Technology 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf Description: DIODE ZENER 10V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 17 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 8 V
Produkt ist nicht verfügbar
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1N5243B 1N5243B Microchip Technology 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf Description: DIODE ZENER 13V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 13 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 9.9 V
Produkt ist nicht verfügbar
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MSC035SMA070J MSC035SMA070J Microchip Technology High-Voltage-Power-Discretes-and-Modules-Brochure-00003052.pdf Description: MOSFET SIC 700 V 35 MOHM SOT-227
Packaging: Box
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Supplier Device Package: SOT-227 (ISOTOP®)
Drain to Source Voltage (Vdss): 700 V
Produkt ist nicht verfügbar
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VCC1-B3F-65M0000000 Microchip Technology VCC1-April-2020.pdf Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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VCC1-B3F-66M0000000 VCC1-B3F-66M0000000 Microchip Technology VCC1-April-2020.pdf Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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VCC1-B3F-66M6660000 Microchip Technology VCC1-April-2020.pdf Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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VCC1-B3F-66M6667000 Microchip Technology VCC1-April-2020.pdf Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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25CS640T-I/Q4B 25CS640T-I/Q4B Microchip Technology 25CS640-64-Kbit-SPI-Serial-EEPROM-128-Bit-Serial-Number-Enhanced-Write-Protection-DS20005943.pdf Description: IC EEPROM 64KBIT SPI 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 20 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UDFN (2x3)
Write Cycle Time - Word, Page: 4ms
Memory Interface: SPI
Access Time: 20 ns
Memory Organization: 8K x 8
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25CS640T-I/Q4B 25CS640T-I/Q4B Microchip Technology 25CS640-64-Kbit-SPI-Serial-EEPROM-128-Bit-Serial-Number-Enhanced-Write-Protection-DS20005943.pdf Description: IC EEPROM 64KBIT SPI 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 20 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UDFN (2x3)
Write Cycle Time - Word, Page: 4ms
Memory Interface: SPI
Access Time: 20 ns
Memory Organization: 8K x 8
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MPF100TC-FCSG325I MPF100TC-FCSG325I Microchip Technology PolarFire-FPGA-Datasheet-DS00003831.pdf Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
Package / Case: 325-LFBGA, FC
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 109000
Supplier Device Package: 325-FCBGA (11x14.5)
Number of LABs/CLBs: 27250
Total RAM Bits: 7969178
Number of I/O: 170
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MPF100TC-FCG484I MPF100TC-FCG484I Microchip Technology PolarFire-FPGA-Datasheet-DS00003831.pdf Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 109000
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 27250
Total RAM Bits: 7969178
Number of I/O: 244
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MPF100TC-FCVG484I Microchip Technology PolarFire-FPGA-Datasheet-DS00003831.pdf Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 109000
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 27250
Total RAM Bits: 7969178
Number of I/O: 284
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MPF100TC-FCSG325E MPF100TC-FCSG325E Microchip Technology PolarFire-FPGA-Datasheet-DS00003831.pdf Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
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MPF100TC-FCG484E Microchip Technology PolarFire-FPGA-Datasheet-DS00003831.pdf Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
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MPF100TC-FCVG484E Microchip Technology PolarFire-FPGA-Datasheet-DS00003831.pdf Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
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2N5884 2n5883-d.pdf
2N5884
Hersteller: Microchip Technology
Description: PNP POWER TRANSISTOR SILICON AMP
Packaging: Bulk
Produkt ist nicht verfügbar
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DSPIC33CK256MC105-I/M7 dsPIC33CK256MC506-Family-Data-Sheet-DS70005473C.pdf
DSPIC33CK256MC105-I/M7
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48VQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 20x12b SAR; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SmartCard, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 34
DigiKey Programmable: Not Verified
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Anzahl Preis
7+2.52 EUR
25+2.28 EUR
100+2.08 EUR
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dsPIC33CK256MC105T-I/M7 dsPIC33CK256MC506-Family-Data-Sheet-DS70005473C.pdf
dsPIC33CK256MC105T-I/M7
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48VQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 20x12b SAR; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SmartCard, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 34
DigiKey Programmable: Not Verified
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dsPIC33CK256MC505T-I/M7 dsPIC33CK256MC506-Family-Data-Sheet-DS70005473C.pdf
dsPIC33CK256MC505T-I/M7
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48VQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 20x12b SAR; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, SPI, Smart Card, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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dsPIC33CK256MC505-E/M7 dsPIC33CK256MC506-Family-Data-Sheet-DS70005473C.pdf
dsPIC33CK256MC505-E/M7
Hersteller: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48VQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 20x12b SAR; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, SPI, Smart Card, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ATSAM3S1AA-MUR SAM3S_Series.pdf
ATSAM3S1AA-MUR
Hersteller: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10/12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PIC32CM2532LE00048-E/U5B 60001615E.pdf
PIC32CM2532LE00048-E/U5B
Hersteller: Microchip Technology
Description: CM23, ULP, TOUCH, 256K FLASH, 48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 14x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
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PIC32CM2532LE00048T-E/U5B 60001615E.pdf
PIC32CM2532LE00048T-E/U5B
Hersteller: Microchip Technology
Description: CM23, ULP, TOUCH, 256K FLASH, 48
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 14x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
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PIC32CM2532LS00048-E/U5B 60001615E.pdf
PIC32CM2532LS00048-E/U5B
Hersteller: Microchip Technology
Description: CM23, ULP, TOUCH, SECURITY, 256K
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 14x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
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PIC32CM2532LS00048T-E/U5B 60001615E.pdf
PIC32CM2532LS00048T-E/U5B
Hersteller: Microchip Technology
Description: CM23, ULP, TOUCH, SECURITY, 256K
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M23
Data Converters: A/D 14x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
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1N5246 LDS-0232.pdf
1N5246
Hersteller: Microchip Technology
Description: DIODE ZENER 16V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 17 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 11.4 V
Produkt ist nicht verfügbar
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1N759A 1N746A-1-1N759A-1_1N4370A-1-1N4372A-1.pdf
1N759A
Hersteller: Microchip Technology
Description: DIODE ZENER 12V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 9 V
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.08 EUR
Mindestbestellmenge: 6
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APTGX600SK120T6G APTGX600SK120T6G-IGBT-Module-Datasheet.pdf
Hersteller: Microchip Technology
Description: IGBT MODULE 1200V 805A 1.923KW
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 600A
NTC Thermistor: Yes
Current - Collector (Ic) (Max): 805 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1.923 kW
Current - Collector Cutoff (Max): 50 µA
Input Capacitance (Cies) @ Vce: 120000 pF @ 25 V
auf Bestellung 5 Stücke:
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Anzahl Preis
1+279.54 EUR
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MO-9150AE-6E-HS-133M000000
Hersteller: Microchip Technology
Description: MEMS BASED XO +2.5 VDC -40C TO +
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PIC18F55Q43-I/6LX PIC18F25-45-55Q43-Data-Sheet-40002170E.pdf
PIC18F55Q43-I/6LX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 48VQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 44
DigiKey Programmable: Not Verified
auf Bestellung 284 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.59 EUR
25+2.37 EUR
100+2.14 EUR
Mindestbestellmenge: 7
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PIC18F55Q43-E/6LX PIC18F25-45-55Q43-Data-Sheet-40002170E.pdf
PIC18F55Q43-E/6LX
Hersteller: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 48VQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 44
DigiKey Programmable: Not Verified
auf Bestellung 181 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.85 EUR
25+2.6 EUR
100+2.36 EUR
Mindestbestellmenge: 7
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1N5261B 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf
1N5261B
Hersteller: Microchip Technology
Description: DIODE ZENER 47V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 105 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 36 V
Produkt ist nicht verfügbar
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UPT17E3/TR7 UPT+RF01103_Rev_B_Final-PD-000177967+%284%29.pdf
UPT17E3/TR7
Hersteller: Microchip Technology
Description: TVS DIODE 17VWM 29.2VC POWERMIT1
Packaging: Tape & Reel (TR)
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.14A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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MAUPT17
MAUPT17
Hersteller: Microchip Technology
Description: TVS DIODE 17VWM 29.2VC POWERMIT1
Packaging: Bulk
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.14A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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MAUPT17e3
MAUPT17e3
Hersteller: Microchip Technology
Description: TVS DIODE 17VWM 29.2VC POWERMIT1
Packaging: Bulk
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.14A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
Produkt ist nicht verfügbar
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JANTX1N4957C 1N4954-1N4996%2C15968-1N5969%2C1N6632-1N6637.pdf
Hersteller: Microchip Technology
Description: DIODE ZENER 9.1V 5W E-AXIAL
Tolerance: ±2%
Packaging: Bulk
Package / Case: E, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 2 Ohms
Supplier Device Package: E, Axial
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 25 µA @ 6.9 V
Qualification: MIL-PRF-19500/435
Produkt ist nicht verfügbar
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MCP1725-1802E/MCVAO MCP1725-500-mA%2C-Low-Voltage%2C-Low-Quiescent-Current-LDO-Regulator-20002026C.pdf
Hersteller: Microchip Technology
Description: 500MA, LOW VOLTAGE LDO
Packaging: Tube
Produkt ist nicht verfügbar
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MCP1405T-E/SNVAO 22022b.pdf
MCP1405T-E/SNVAO
Hersteller: Microchip Technology
Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 18V
Input Type: Inverting, Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 18ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel, P-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 4.5A, 4.5A
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCP1405T-E/SNVAO 22022b.pdf
MCP1405T-E/SNVAO
Hersteller: Microchip Technology
Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 18V
Input Type: Inverting, Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 18ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel, P-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 4.5A, 4.5A
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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VCC1-1519-12M28800000 VCC1-April-2020.pdf
Hersteller: Microchip Technology
Description: CUSTOM CMOS XO
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Height - Seated (Max): 0.075" (1.90mm)
Frequency: 12.288 MHz
Base Resonator: Crystal
Produkt ist nicht verfügbar
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MPFS-ICICLE-KIT microchip_polarfire_soc_fpga_icicle_kit_user_guide_vb.pdf
MPFS-ICICLE-KIT
Hersteller: Microchip Technology
Description: POLARFIRE SOC FPGA ICICLE KIT
Packaging: Bulk
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: MPFS250
Platform: PolarFire SoC FPGA SiFive RISC-V Icicle
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+612.44 EUR
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EV25F14A RNBD451-Add-On-Board-User-Guide-DS50003476.pdf
EV25F14A
Hersteller: Microchip Technology
Description: RNBD451 ADD ON BOARD
Packaging: Box
Function: Bluetooth Low Energy (BLE)
Type: RF
Contents: Board(s)
Utilized IC / Part: RNBD451
Platform: mikroBUS™ Click™
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+24.24 EUR
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dsPIC33AK256MC505-I/M7 dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf
dsPIC33AK256MC505-I/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
auf Bestellung 305 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+4.29 EUR
25+3.89 EUR
100+3.54 EUR
Mindestbestellmenge: 5
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dsPIC33AK512MC205-I/M7 dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf
dsPIC33AK512MC205-I/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
auf Bestellung 555 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+4.33 EUR
25+3.94 EUR
100+3.59 EUR
Mindestbestellmenge: 5
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dsPIC33AK512MC505-I/M7 dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf
dsPIC33AK512MC505-I/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
auf Bestellung 555 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.4 EUR
25+3.98 EUR
100+3.63 EUR
Mindestbestellmenge: 4
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dsPIC33AK256MPS205-I/M7 dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf
dsPIC33AK256MPS205-I/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
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4+4.59 EUR
25+4.16 EUR
100+3.79 EUR
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dsPIC33AK512MPS205-I/M7 dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf
dsPIC33AK512MPS205-I/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
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4+4.7 EUR
25+4.27 EUR
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DSPIC33AK256MC205-I/M7 dsPIC33AK512MPS512-Family-Data-Sheet-DS70005591.pdf
DSPIC33AK256MC205-I/M7
Hersteller: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
auf Bestellung 244 Stücke:
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5+4.22 EUR
25+3.83 EUR
100+3.5 EUR
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MO9168
Hersteller: Microchip Technology
Description: CLOCK OSCILLATOR
Packaging: Tray
Produkt ist nicht verfügbar
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DSC1001CE1-037.1250T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CE1-037.1250T
Hersteller: Microchip Technology
Description: MEMS OSC XO 37.1250MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 37.125 MHz
Base Resonator: MEMS
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DSC1001CE1-037.1250 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001CE1-037.1250
Hersteller: Microchip Technology
Description: MEMS OSC XO 37.1250MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 37.125 MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
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MSC010SDA070S 00003841A_MSC010SDA070S_SiC_SBD_Datasheet.pdf
MSC010SDA070S
Hersteller: Microchip Technology
Description: DIODE SIL CARBIDE 700V 10A D3PAK
Packaging: Bulk
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Current - Average Rectified (Io): 10A
Supplier Device Package: D3Pak
Voltage - DC Reverse (Vr) (Max): 700 V
Produkt ist nicht verfügbar
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EV18H47A Motor-Control-Low-Voltage-48V-300W-Inverter-Board-Users-Guide-DS50003297.pdf
EV18H47A
Hersteller: Microchip Technology
Description: EVAL BOARD FOR ATSAME70N21
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: ATSAME70N21
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU
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Anzahl Preis
1+356.61 EUR
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EV42J24A
EV42J24A
Hersteller: Microchip Technology
Description: CEC1736 EVALUATION BOARD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: CEC1736
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1+778.36 EUR
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VX-805-ECE-KEXN-204M800000 VX-805-April-2020.pdf
Hersteller: Microchip Technology
Description: LOW NOISE CERAMIC VCXO +3.3 VDC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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JANS1N6319CUS
JANS1N6319CUS
Hersteller: Microchip Technology
Description: DIODE ZENER 6.2V 500MW SQ-MELF
Tolerance: ±2%
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: B, SQ-MELF
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 5 µA @ 3.5 V
Qualification: MIL-PRF-19500/533
Produkt ist nicht verfügbar
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MIC2951-03BN mic2950.pdf
MIC2951-03BN
Hersteller: Microchip Technology
Description: IC REG LIN POS ADJ 150MA 8-PDIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Output Type: Adjustable (Fixed)
Mounting Type: Through Hole
Current - Output: 150mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 300 µA
Voltage - Input (Max): 30V
Number of Regulators: 1
Supplier Device Package: 8-PDIP
Voltage - Output (Max): 29V
Voltage - Output (Min/Fixed): 1.24V (5V)
Control Features: Enable
Voltage Dropout (Max): 0.6V @ 150mA
Protection Features: Over Current, Over Temperature, Reverse Polarity
Current - Supply (Max): 8 mA
Produkt ist nicht verfügbar
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MCP41U83T-103E/ST MCP41U83-Data-Sheet-DS20007000.pdf
MCP41U83T-103E/ST
Hersteller: Microchip Technology
Description: 10BIT I2C/SPI 1-CH DIGI POT WITH
Resistance (Ohms): 10k
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Non-Volatile
Interface: SPI
Configuration: Potentiometer, Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 1024
Voltage - Supply: 2.7V ~ 5.5V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 19
Temperature Coefficient (Typ): 25ppm/°C
Number of Circuits: 1
Produkt ist nicht verfügbar
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MCP41U83T-103E/ST MCP41U83-Data-Sheet-DS20007000.pdf
MCP41U83T-103E/ST
Hersteller: Microchip Technology
Description: 10BIT I2C/SPI 1-CH DIGI POT WITH
Resistance (Ohms): 10k
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Non-Volatile
Interface: SPI
Configuration: Potentiometer, Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 1024
Voltage - Supply: 2.7V ~ 5.5V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 19
Temperature Coefficient (Typ): 25ppm/°C
Number of Circuits: 1
auf Bestellung 189 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.19 EUR
25+2.66 EUR
100+2.42 EUR
Mindestbestellmenge: 6
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MSC400SMA330B4N product-ds.MSC400SMA330.pdf
MSC400SMA330B4N
Hersteller: Microchip Technology
Description: MOSFET SIC 3300V 400 MOHM TO-247
Packaging: Tube
Package / Case: TO-247-4
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 11A (Tc)
Rds On (Max) @ Id, Vgs: 520mOhm @ 5A, 20V
Power Dissipation (Max): 131W (Tc)
Vgs(th) (Max) @ Id: 2.97V @ 1mA
Supplier Device Package: TO-247-4
Drive Voltage (Max Rds On, Min Rds On): 20V
Vgs (Max): +23V, -10V
Drain to Source Voltage (Vdss): 3300 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 20 V
Input Capacitance (Ciss) (Max) @ Vds: 579 pF @ 2.4 kV
Produkt ist nicht verfügbar
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1N5240B 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf
1N5240B
Hersteller: Microchip Technology
Description: DIODE ZENER 10V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 17 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 8 V
Produkt ist nicht verfügbar
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1N5243B 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf
1N5243B
Hersteller: Microchip Technology
Description: DIODE ZENER 13V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 13 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 500 nA @ 9.9 V
Produkt ist nicht verfügbar
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MSC035SMA070J High-Voltage-Power-Discretes-and-Modules-Brochure-00003052.pdf
MSC035SMA070J
Hersteller: Microchip Technology
Description: MOSFET SIC 700 V 35 MOHM SOT-227
Packaging: Box
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Supplier Device Package: SOT-227 (ISOTOP®)
Drain to Source Voltage (Vdss): 700 V
Produkt ist nicht verfügbar
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VCC1-B3F-65M0000000 VCC1-April-2020.pdf
Hersteller: Microchip Technology
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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VCC1-B3F-66M0000000 VCC1-April-2020.pdf
VCC1-B3F-66M0000000
Hersteller: Microchip Technology
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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VCC1-B3F-66M6660000 VCC1-April-2020.pdf
Hersteller: Microchip Technology
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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VCC1-B3F-66M6667000 VCC1-April-2020.pdf
Hersteller: Microchip Technology
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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25CS640T-I/Q4B 25CS640-64-Kbit-SPI-Serial-EEPROM-128-Bit-Serial-Number-Enhanced-Write-Protection-DS20005943.pdf
25CS640T-I/Q4B
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT SPI 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 20 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UDFN (2x3)
Write Cycle Time - Word, Page: 4ms
Memory Interface: SPI
Access Time: 20 ns
Memory Organization: 8K x 8
auf Bestellung 5000 Stücke:
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25CS640T-I/Q4B 25CS640-64-Kbit-SPI-Serial-EEPROM-128-Bit-Serial-Number-Enhanced-Write-Protection-DS20005943.pdf
25CS640T-I/Q4B
Hersteller: Microchip Technology
Description: IC EEPROM 64KBIT SPI 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 64Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 20 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UDFN (2x3)
Write Cycle Time - Word, Page: 4ms
Memory Interface: SPI
Access Time: 20 ns
Memory Organization: 8K x 8
auf Bestellung 5000 Stücke:
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Anzahl Preis
19+0.95 EUR
Mindestbestellmenge: 19
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MPF100TC-FCSG325I PolarFire-FPGA-Datasheet-DS00003831.pdf
MPF100TC-FCSG325I
Hersteller: Microchip Technology
Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
Package / Case: 325-LFBGA, FC
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 109000
Supplier Device Package: 325-FCBGA (11x14.5)
Number of LABs/CLBs: 27250
Total RAM Bits: 7969178
Number of I/O: 170
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Anzahl Preis
1+169.15 EUR
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MPF100TC-FCG484I PolarFire-FPGA-Datasheet-DS00003831.pdf
MPF100TC-FCG484I
Hersteller: Microchip Technology
Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 109000
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 27250
Total RAM Bits: 7969178
Number of I/O: 244
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1+185.89 EUR
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MPF100TC-FCVG484I PolarFire-FPGA-Datasheet-DS00003831.pdf
Hersteller: Microchip Technology
Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 109000
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 27250
Total RAM Bits: 7969178
Number of I/O: 284
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Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+198.81 EUR
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MPF100TC-FCSG325E PolarFire-FPGA-Datasheet-DS00003831.pdf
MPF100TC-FCSG325E
Hersteller: Microchip Technology
Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
Produkt ist nicht verfügbar
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MPF100TC-FCG484E PolarFire-FPGA-Datasheet-DS00003831.pdf
Hersteller: Microchip Technology
Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
Produkt ist nicht verfügbar
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MPF100TC-FCVG484E PolarFire-FPGA-Datasheet-DS00003831.pdf
Hersteller: Microchip Technology
Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
Produkt ist nicht verfügbar
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