Produkte > MICRON TECHNOLOGY INC. > Alle Produkte des Herstellers MICRON TECHNOLOGY INC. (10584) > Seite 160 nach 177
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| MTFC256GASAONS-AIT | Micron Technology Inc. |
 Description: USSD 2TPackaging: Box Package / Case: 153-TFBGA Mounting Type: Surface Mount Memory Size: 2Tbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Clock Frequency: 52 MHz Memory Format: FLASH Supplier Device Package: 153-TFBGA (11.5x13) Part Status: Active Memory Interface: UFS2.1 Memory Organization: 256G x 8 DigiKey Programmable: Not Verified |
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| MTFC64GASAONS-AIT TR | Micron Technology Inc. | Description: USSD 512G |
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| MTFC32GASAONS-AIT TR | Micron Technology Inc. | Description: USSD 256G |
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| MTFC32GASAONS-AIT | Micron Technology Inc. | Description: USSD 256G |
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| MTFC32GASAONS-IT TR | Micron Technology Inc. | Description: USSD 256G |
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| MTFC128GASAONS-AAT | Micron Technology Inc. | Description: USSD 1T |
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| MTFC256GASAONS-AAT | Micron Technology Inc. |
Description: USSD 2T Packaging: Box Package / Case: 153-TFBGA Mounting Type: Surface Mount Memory Size: 2Tbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND (SLC) Clock Frequency: 52 MHz Memory Format: FLASH Supplier Device Package: 153-TFBGA (11.5x13) Part Status: Active Memory Interface: UFS2.1 Memory Organization: 256G x 8 DigiKey Programmable: Not Verified |
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| MTFC256GASAONS-AIT TR | Micron Technology Inc. | Description: USSD 2T |
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| MTFC128GASAONS-AIT TR | Micron Technology Inc. | Description: USSD 1T |
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| MTFC256GASAONS-IT TR | Micron Technology Inc. | Description: USSD 2T |
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| MTFC128GASAONS-AAT TR | Micron Technology Inc. | Description: USSD 1T |
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| MTFC128GASAONS-IT TR | Micron Technology Inc. | Description: USSD 1T |
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MTFC16GAPALBH-AAT TR | Micron Technology Inc. |
Description: IC FLASH 128GBIT MMC 153TFBGA Packaging: Tape & Reel (TR) Package / Case: 153-TFBGA Mounting Type: Surface Mount Memory Size: 128Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.7V ~ 1.9V Technology: FLASH - NAND Memory Format: FLASH Supplier Device Package: 153-TFBGA (11.5x13) Part Status: Active Memory Interface: MMC Memory Organization: 16G x 8 |
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MTFC16GAPALBH-AIT ES TR | Micron Technology Inc. |
Description: IC FLASH 128GBIT MMC 153TFBGA Packaging: Tape & Reel (TR) Package / Case: 153-TFBGA Mounting Type: Surface Mount Memory Size: 128Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.9V Technology: FLASH - NAND Memory Format: FLASH Supplier Device Package: 153-TFBGA (11.5x13) Part Status: Obsolete Memory Interface: MMC Memory Organization: 16G x 8 |
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MTFC16GAPALBH-AIT ES | Micron Technology Inc. |
Description: IC FLASH 128GBIT MMC 153TFBGA Packaging: Tray Package / Case: 153-TFBGA Mounting Type: Surface Mount Memory Size: 128Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.9V Technology: FLASH - NAND Memory Format: FLASH Supplier Device Package: 153-TFBGA (11.5x13) Part Status: Obsolete Memory Interface: MMC Memory Organization: 16G x 8 |
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MTFC16GAPALBH-AAT ES | Micron Technology Inc. |
Description: IC FLASH 128GBIT MMC 153TFBGA Packaging: Tray Package / Case: 153-TFBGA Mounting Type: Surface Mount Memory Size: 128Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.7V ~ 1.9V Technology: FLASH - NAND Memory Format: FLASH Supplier Device Package: 153-TFBGA (11.5x13) Part Status: Obsolete Memory Interface: MMC Memory Organization: 16G x 8 |
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MTFC16GAPALBH-AAT ES TR | Micron Technology Inc. |
Description: IC FLASH 128GBIT MMC 153TFBGA Packaging: Tape & Reel (TR) Package / Case: 153-TFBGA Mounting Type: Surface Mount Memory Size: 128Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.7V ~ 1.9V Technology: FLASH - NAND Memory Format: FLASH Supplier Device Package: 153-TFBGA (11.5x13) Part Status: Obsolete Memory Interface: MMC Memory Organization: 16G x 8 |
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MTFC16GAPALBH-AAT | Micron Technology Inc. |
Description: IC FLASH 128GBIT MMC 153TFBGA Packaging: Tray Package / Case: 153-TFBGA Mounting Type: Surface Mount Memory Size: 128Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.7V ~ 1.9V Technology: FLASH - NAND Memory Format: FLASH Supplier Device Package: 153-TFBGA (11.5x13) Part Status: Discontinued at Digi-Key Memory Interface: MMC Memory Organization: 16G x 8 DigiKey Programmable: Not Verified |
auf Bestellung 987 Stücke: Lieferzeit 10-14 Tag (e) |
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MTFC16GAPALBH-AIT | Micron Technology Inc. |
Description: IC FLASH 128GBIT MMC 153TFBGA Packaging: Tray Package / Case: 153-TFBGA Mounting Type: Surface Mount Memory Size: 128Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.9V Technology: FLASH - NAND Memory Format: FLASH Supplier Device Package: 153-TFBGA (11.5x13) Part Status: Discontinued at Digi-Key Memory Interface: MMC Memory Organization: 16G x 8 |
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MT53D1024M32D4NQ-046 AAT ES :D T | Micron Technology Inc. |
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA Packaging: Tape & Reel (TR) Package / Case: 200-VFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.1V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-VFBGA (10x14.5) Part Status: Active Memory Organization: 1G x 32 |
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MT53D1024M32D4NQ-046 AIT ES:D TR | Micron Technology Inc. |
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA Packaging: Tape & Reel (TR) Package / Case: 200-VFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.1V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-VFBGA (10x14.5) Part Status: Active Memory Organization: 1G x 32 |
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MT53D1024M32D4NQ-046 WT ES:D TR | Micron Technology Inc. |
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA Packaging: Tape & Reel (TR) Package / Case: 200-VFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -30°C ~ 85°C (TC) Voltage - Supply: 1.1V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-VFBGA (10x14.5) Part Status: Active Memory Organization: 1G x 32 |
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MT55L1MY18PT-6 | Micron Technology Inc. |
Description: IC SRAM 18MBIT PARALLEL 100TQFP Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Memory Size: 18Mbit Memory Type: Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 3.135V ~ 3.465V Technology: SRAM - Asynchronous, ZBT Clock Frequency: 166 MHz Memory Format: SRAM Supplier Device Package: 100-TQFP (14x20.1) Part Status: Active Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 1M x 18 |
auf Bestellung 233 Stücke: Lieferzeit 10-14 Tag (e) |
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MT47H32M16NF-25E AAT:H | Micron Technology Inc. |
Description: IC DRAM 512MBIT PARALLEL 84FBGA Packaging: Bulk Package / Case: 84-TFBGA Mounting Type: Surface Mount Memory Size: 512Mbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.7V ~ 1.9V Technology: SDRAM - DDR2 Clock Frequency: 400 MHz Memory Format: DRAM Supplier Device Package: 84-FBGA (8x12.5) Part Status: Active Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 400 ps Memory Organization: 32M x 16 DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 1267 Stücke: Lieferzeit 10-14 Tag (e) |
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MT47H32M16NF-25E AIT:H | Micron Technology Inc. |
Description: IC DRAM 512MBIT PARALLEL 84FBGA Packaging: Bulk Package / Case: 84-TFBGA Mounting Type: Surface Mount Memory Size: 512Mbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.7V ~ 1.9V Technology: SDRAM - DDR2 Clock Frequency: 400 MHz Memory Format: DRAM Supplier Device Package: 84-FBGA (8x12.5) Part Status: Last Time Buy Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 400 ps Memory Organization: 32M x 16 Grade: Automotive DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
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MT47H32M16NF-25E AIT:H TR | Micron Technology Inc. |
Description: IC DRAM 512MBIT PARALLEL 84FBGA Packaging: Tape & Reel (TR) Package / Case: 84-TFBGA Mounting Type: Surface Mount Memory Size: 512Mbit Memory Type: Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.9V Technology: SDRAM - DDR2 Clock Frequency: 400 MHz Memory Format: DRAM Supplier Device Package: 84-FBGA (8x12.5) Part Status: Last Time Buy Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 400 ps Memory Organization: 32M x 16 Grade: Automotive DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
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MT47H32M16NF-25E AUT:H | Micron Technology Inc. |
Description: IC DRAM 512MBIT PARALLEL 84FBGA Packaging: Tray Package / Case: 84-TFBGA Mounting Type: Surface Mount Memory Size: 512Mbit Memory Type: Volatile Operating Temperature: -40°C ~ 125°C (TC) Voltage - Supply: 1.7V ~ 1.9V Technology: SDRAM - DDR2 Clock Frequency: 400 MHz Memory Format: DRAM Supplier Device Package: 84-FBGA (8x12.5) Part Status: Obsolete Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 400 ps Memory Organization: 32M x 16 Grade: Automotive DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
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MT29F64G08CECCBH1-12Z:C TR | Micron Technology Inc. |
Description: IC FLASH 64GBIT PARALLEL 100VBGA Packaging: Tape & Reel (TR) Package / Case: 100-VBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Non-Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND Clock Frequency: 83 MHz Memory Format: FLASH Supplier Device Package: 100-VBGA (12x18) Part Status: Obsolete Memory Interface: Parallel Memory Organization: 8G x 8 DigiKey Programmable: Not Verified |
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MT29F64G08CECCBH1-12:C TR | Micron Technology Inc. |
Description: IC FLASH 64GBIT PARALLEL 100VBGA Packaging: Tape & Reel (TR) Package / Case: 100-VBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Non-Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND Clock Frequency: 83 MHz Memory Format: FLASH Supplier Device Package: 100-VBGA (12x18) Part Status: Obsolete Memory Interface: Parallel Memory Organization: 8G x 8 |
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MT29F64G08CECCBH1-12ITZ:C TR | Micron Technology Inc. |
Description: IC FLASH 64GBIT PARALLEL 100VBGA Packaging: Tape & Reel (TR) Package / Case: 100-VBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND Clock Frequency: 83 MHz Memory Format: FLASH Supplier Device Package: 100-VBGA (12x18) Part Status: Obsolete Memory Interface: Parallel Memory Organization: 8G x 8 DigiKey Programmable: Not Verified |
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| MTFDKCC3T2TFC-1AZ15ABYY | Micron Technology Inc. |
Description: 7400 4TB U.3 SSD Packaging: Box Memory Size: 3.2TB Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC) Type: NVMe Operating Temperature: 0°C ~ 70°C Form Factor: 2.5" Speed - Read: 6.6GB/s Speed - Write: 3.5GB/s Part Status: Active |
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| MTFDKCC3T2TFC-1AZ1ZABYY | Micron Technology Inc. |
Description: 7400 4TB U.3 SSD Packaging: Box Memory Size: 3.2TB Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC) Type: NVMe Operating Temperature: 0°C ~ 70°C Form Factor: 2.5" Speed - Read: 6.6GB/s Speed - Write: 3.5GB/s Part Status: Active |
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| MTFDKCB3T2TFC-1AZ1ZABYY | Micron Technology Inc. |
Description: 7400 4TB U.3 SSD Packaging: Box Memory Size: 3.2TB Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC) Type: NVMe Operating Temperature: 0°C ~ 70°C Form Factor: 2.5" Speed - Read: 6.6GB/s Speed - Write: 3.5GB/s Part Status: Active |
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| MTFDKCC3T2TFC-1AZ45ABYY | Micron Technology Inc. |
Description: 7400 4TB U.3 SSD Packaging: Box Memory Size: 3.2TB Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC) Type: NVMe Operating Temperature: 0°C ~ 70°C Form Factor: 2.5" Speed - Read: 6.6GB/s Speed - Write: 3.5GB/s Part Status: Active |
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| MTFDKCB3T2TFS-1BC1ZABYY | Micron Technology Inc. |
Description: SSD 3.2TB 2.5" TLC NVME Packaging: Tray Memory Size: 3.2TB Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC) Type: NVMe Operating Temperature: 0°C ~ 70°C Form Factor: 2.5" Speed - Read: 6.6GB/s Speed - Write: 3.5GB/s Part Status: Active |
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| MTFDKCC3T2TFS-1BC4ZABYY | Micron Technology Inc. |
Description: 7450 3200GB U.3 SSD Packaging: Box Memory Size: 3.2TB Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC) Type: NVMe Operating Temperature: 0°C ~ 70°C Form Factor: 2.5" Speed - Read: 6.8GB/s Speed - Write: 5.3GB/s Part Status: Active |
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| MTFDKCC3T2TFC-1AZ4ZABYY | Micron Technology Inc. |
Description: 7400 4TB U.3 SSD Packaging: Box Memory Size: 3.2TB Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC) Type: NVMe Operating Temperature: 0°C ~ 70°C Form Factor: 2.5" Speed - Read: 6.6GB/s Speed - Write: 3.5GB/s Part Status: Active |
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| MTFDKCC3T2TFS-1BC45ABYY | Micron Technology Inc. |
Description: 7450 3200GB U.3 SSD Packaging: Box Memory Size: 3.2TB Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC) Type: NVMe Operating Temperature: 0°C ~ 70°C Form Factor: 2.5" Speed - Read: 6.8GB/s Speed - Write: 5.3GB/s Part Status: Active |
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| MTFDKCC3T2TFS-1BC15ABYY | Micron Technology Inc. |
Description: 7450 4TB U.3 SSD Packaging: Box Memory Size: 3.2TB Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC) Type: NVMe Operating Temperature: 0°C ~ 70°C Form Factor: 2.5" Speed - Read: 6.8GB/s Speed - Write: 5.3GB/s Part Status: Active |
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MTFDKCC3T2TFS-1BC1ZABYY | Micron Technology Inc. |
Description: IC SSD FLASH NAND SLC Packaging: Bulk Part Status: Active |
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MTSD128ANC8MS-1WT | Micron Technology Inc. |
Description: MICRON INDUSTRIAL MICROSD CARD 1 Packaging: Tray Memory Size: 128GB Speed: Class 10, UHS Class 1 Memory Type: microSD™ Operating Temperature: -25°C ~ 85°C Part Status: Active |
auf Bestellung 229 Stücke: Lieferzeit 10-14 Tag (e) |
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| MT29F8T08EWLKEM5-ITF:K | Micron Technology Inc. |
Description: TLC 8T X8 LBGA Packaging: Box Part Status: Active DigiKey Programmable: Not Verified |
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| MT29F8T08EWLKEM5-ITF:K TR | Micron Technology Inc. |
Description: TLC 8T X8 LBGA Packaging: Tape & Reel (TR) Part Status: Active DigiKey Programmable: Not Verified |
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| MT53E512M16D1Z11MWC1 | Micron Technology Inc. |
Description: LPDDR4 8G DIE 512MX16 Packaging: Box Package / Case: Die Mounting Type: Surface Mount Memory Size: 8Gbit Memory Type: Volatile Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Memory Format: DRAM Supplier Device Package: Wafer Part Status: Active Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 512M x 16 |
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| MT53D512M16D1DS-046 IT:D | Micron Technology Inc. |
Description: LPDDR4 8G 512MX16 FBGA Packaging: Box Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 8Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Part Status: Active Memory Organization: 512M x 16 |
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| MT53D512M16D1DS-046 IT:D TR | Micron Technology Inc. |
Description: LPDDR4 8G 512MX16 FBGA Packaging: Tape & Reel (TR) Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 8Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Part Status: Active Memory Interface: Parallel Memory Organization: 512M x 16 |
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MT53E512M16D1FW-046 AAT:D | Micron Technology Inc. |
Description: LPDDR4 8G 512MX16 FBGA Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 8Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Part Status: Active Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 512M x 16 |
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MT53E512M16D1FW-046 AAT:D TR | Micron Technology Inc. |
Description: LPDDR4 8G 512MX16 FBGA Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 8Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Part Status: Active Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 512M x 16 |
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MT53E512M16D1FW-046 AIT:D | Micron Technology Inc. |
Description: LPDDR4 8G 512MX16 FBGA Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 8Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Part Status: Active Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 512M x 16 |
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MT53E512M16D1FW-046 AIT:D TR | Micron Technology Inc. |
Description: LPDDR4 8G 512MX16 FBGA Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 8Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Part Status: Active Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 512M x 16 |
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| MT41K512M16VRP-107 IT:P TR | Micron Technology Inc. |
Description: DDR3 8G 512MX16 FBGA DDP Packaging: Tape & Reel (TR) Package / Case: 96-TFBGA Mounting Type: Surface Mount Memory Size: 8Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3L Clock Frequency: 933 MHz Memory Format: DRAM Supplier Device Package: 96-FBGA (8x14) Part Status: Active Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 20 ns Memory Organization: 512M x 16 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT41K512M16VRP-107 AAT:P TR | Micron Technology Inc. |
Description: DDR3 8G 512MX16 FBGA DDP Packaging: Tape & Reel (TR) Package / Case: 96-TFBGA Mounting Type: Surface Mount Memory Size: 8Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3L Clock Frequency: 933 MHz Memory Format: DRAM Supplier Device Package: 96-FBGA (8x14) Grade: Automotive Part Status: Active Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 20 ns Memory Organization: 512M x 16 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| MT41K512M16VRP-107 AAT:P | Micron Technology Inc. |
Description: DDR3 8G 512MX16 FBGA DDP Packaging: Box Package / Case: 96-TFBGA Mounting Type: Surface Mount Memory Size: 8Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3L Clock Frequency: 933 MHz Memory Format: DRAM Supplier Device Package: 96-FBGA (8x14) Grade: Automotive Part Status: Active Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 20 ns Memory Organization: 512M x 16 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
auf Bestellung 413 Stücke: Lieferzeit 10-14 Tag (e) |
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MT55V512V36PF-10 | Micron Technology Inc. |
Description: IC SRAM 18MBIT PAR 165FBGA Packaging: Bulk Package / Case: 165-TBGA Mounting Type: Surface Mount Memory Size: 18Mbit Memory Type: Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.375V ~ 2.625V Technology: SRAM - ZBT Clock Frequency: 100 MHz Memory Format: SRAM Supplier Device Package: 165-FBGA (13x15) Part Status: Active Memory Interface: Parallel Access Time: 5 ns Memory Organization: 512K x 36 |
auf Bestellung 669 Stücke: Lieferzeit 10-14 Tag (e) |
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MT55V512V32PF-10 | Micron Technology Inc. |
Description: IC SRAM 18MBIT PAR 165FBGA Packaging: Bulk Package / Case: 165-TBGA Mounting Type: Surface Mount Memory Size: 18Mbit Memory Type: Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.375V ~ 2.625V Technology: SRAM - ZBT Clock Frequency: 100 MHz Memory Format: SRAM Supplier Device Package: 165-FBGA (13x15) Part Status: Active Memory Interface: Parallel Access Time: 5 ns Memory Organization: 512K x 32 DigiKey Programmable: Not Verified |
auf Bestellung 97 Stücke: Lieferzeit 10-14 Tag (e) |
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MT47H128M8SH-25E AAT:M | Micron Technology Inc. |
Description: IC DRAM 1GBIT PARALLEL 60FBGA Packaging: Tray Package / Case: 60-TFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.7V ~ 1.9V Technology: SDRAM - DDR2 Clock Frequency: 400 MHz Memory Format: DRAM Supplier Device Package: 60-FBGA (8x10) Part Status: Obsolete Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 400 ps Memory Organization: 128M x 8 |
Produkt ist nicht verfügbar |
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MT47H128M8SH-25E AAT:M TR | Micron Technology Inc. |
Description: IC DRAM 1GBIT PARALLEL 60FBGA Packaging: Tape & Reel (TR) Package / Case: 60-TFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.7V ~ 1.9V Technology: SDRAM - DDR2 Clock Frequency: 400 MHz Memory Format: DRAM Supplier Device Package: 60-FBGA (8x10) Part Status: Obsolete Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 400 ps Memory Organization: 128M x 8 |
Produkt ist nicht verfügbar |
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MTFC16GLWDM-4M AIT Z | Micron Technology Inc. |
Description: IC FLASH 128GBIT MMC 153TFBGA Packaging: Tray Package / Case: 153-TFBGA Mounting Type: Surface Mount Memory Size: 128Gbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND Memory Format: FLASH Supplier Device Package: 153-TFBGA (11.5x13) Part Status: Obsolete Memory Interface: MMC Memory Organization: 16G x 8 |
Produkt ist nicht verfügbar |
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| MTFC16GLXAM-WT TR | Micron Technology Inc. |
Description: IC FLASH 128GBIT MMC 153VFBGA Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Memory Size: 128Gbit Memory Type: Non-Volatile Operating Temperature: -25°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND Memory Format: FLASH Part Status: Obsolete Memory Interface: MMC Memory Organization: 16G x 8 |
Produkt ist nicht verfügbar |
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| MTFC16GLTAM-WT TR | Micron Technology Inc. |
Description: IC FLASH 128GBIT MMC 153VFBGA Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Memory Size: 128Gbit Memory Type: Non-Volatile Operating Temperature: -25°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NAND Memory Format: FLASH Part Status: Obsolete Memory Interface: MMC Memory Organization: 16G x 8 |
Produkt ist nicht verfügbar |
| MTFC256GASAONS-AIT |
|
Hersteller: Micron Technology Inc.
Description: USSD 2T
Packaging: Box
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 52 MHz
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Active
Memory Interface: UFS2.1
Memory Organization: 256G x 8
DigiKey Programmable: Not Verified
Description: USSD 2T
Packaging: Box
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 52 MHz
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Active
Memory Interface: UFS2.1
Memory Organization: 256G x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MTFC64GASAONS-AIT TR |
Hersteller: Micron Technology Inc.
Description: USSD 512G
Description: USSD 512G
Produkt ist nicht verfügbar
| MTFC32GASAONS-AIT TR |
Hersteller: Micron Technology Inc.
Description: USSD 256G
Description: USSD 256G
Produkt ist nicht verfügbar
| MTFC32GASAONS-AIT |
Hersteller: Micron Technology Inc.
Description: USSD 256G
Description: USSD 256G
Produkt ist nicht verfügbar
| MTFC32GASAONS-IT TR |
Hersteller: Micron Technology Inc.
Description: USSD 256G
Description: USSD 256G
Produkt ist nicht verfügbar
| MTFC128GASAONS-AAT |
Hersteller: Micron Technology Inc.
Description: USSD 1T
Description: USSD 1T
Produkt ist nicht verfügbar
| MTFC256GASAONS-AAT |
|
Hersteller: Micron Technology Inc.
Description: USSD 2T
Packaging: Box
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 52 MHz
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Active
Memory Interface: UFS2.1
Memory Organization: 256G x 8
DigiKey Programmable: Not Verified
Description: USSD 2T
Packaging: Box
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (SLC)
Clock Frequency: 52 MHz
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Active
Memory Interface: UFS2.1
Memory Organization: 256G x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MTFC256GASAONS-AIT TR |
Hersteller: Micron Technology Inc.
Description: USSD 2T
Description: USSD 2T
Produkt ist nicht verfügbar
| MTFC128GASAONS-AIT TR |
Hersteller: Micron Technology Inc.
Description: USSD 1T
Description: USSD 1T
Produkt ist nicht verfügbar
| MTFC256GASAONS-IT TR |
Hersteller: Micron Technology Inc.
Description: USSD 2T
Description: USSD 2T
Produkt ist nicht verfügbar
| MTFC128GASAONS-AAT TR |
Hersteller: Micron Technology Inc.
Description: USSD 1T
Description: USSD 1T
Produkt ist nicht verfügbar
| MTFC128GASAONS-IT TR |
Hersteller: Micron Technology Inc.
Description: USSD 1T
Description: USSD 1T
Produkt ist nicht verfügbar
| MTFC16GAPALBH-AAT TR |
Hersteller: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Active
Memory Interface: MMC
Memory Organization: 16G x 8
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Active
Memory Interface: MMC
Memory Organization: 16G x 8
Produkt ist nicht verfügbar
| MTFC16GAPALBH-AIT ES TR |
Hersteller: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
Produkt ist nicht verfügbar
| MTFC16GAPALBH-AIT ES |
Hersteller: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
Produkt ist nicht verfügbar
| MTFC16GAPALBH-AAT ES |
Hersteller: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
Produkt ist nicht verfügbar
| MTFC16GAPALBH-AAT ES TR |
Hersteller: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
Produkt ist nicht verfügbar
| MTFC16GAPALBH-AAT |
Hersteller: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Discontinued at Digi-Key
Memory Interface: MMC
Memory Organization: 16G x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Discontinued at Digi-Key
Memory Interface: MMC
Memory Organization: 16G x 8
DigiKey Programmable: Not Verified
auf Bestellung 987 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 39.2 EUR |
| 10+ | 36.5 EUR |
| 25+ | 36.11 EUR |
| 40+ | 35.22 EUR |
| 80+ | 30.92 EUR |
| 230+ | 29.87 EUR |
| 440+ | 29.07 EUR |
| MTFC16GAPALBH-AIT |
Hersteller: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Discontinued at Digi-Key
Memory Interface: MMC
Memory Organization: 16G x 8
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Discontinued at Digi-Key
Memory Interface: MMC
Memory Organization: 16G x 8
Produkt ist nicht verfügbar
| MT53D1024M32D4NQ-046 AAT ES :D T |
Hersteller: Micron Technology Inc.
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-VFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.1V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-VFBGA (10x14.5)
Part Status: Active
Memory Organization: 1G x 32
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-VFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.1V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-VFBGA (10x14.5)
Part Status: Active
Memory Organization: 1G x 32
Produkt ist nicht verfügbar
| MT53D1024M32D4NQ-046 AIT ES:D TR |
Hersteller: Micron Technology Inc.
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-VFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.1V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-VFBGA (10x14.5)
Part Status: Active
Memory Organization: 1G x 32
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-VFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.1V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-VFBGA (10x14.5)
Part Status: Active
Memory Organization: 1G x 32
Produkt ist nicht verfügbar
| MT53D1024M32D4NQ-046 WT ES:D TR |
Hersteller: Micron Technology Inc.
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-VFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -30°C ~ 85°C (TC)
Voltage - Supply: 1.1V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-VFBGA (10x14.5)
Part Status: Active
Memory Organization: 1G x 32
Description: IC DRAM 32GBIT 2.133GHZ 200VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-VFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -30°C ~ 85°C (TC)
Voltage - Supply: 1.1V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-VFBGA (10x14.5)
Part Status: Active
Memory Organization: 1G x 32
Produkt ist nicht verfügbar
| MT55L1MY18PT-6 |
|
Hersteller: Micron Technology Inc.
Description: IC SRAM 18MBIT PARALLEL 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Technology: SRAM - Asynchronous, ZBT
Clock Frequency: 166 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1M x 18
Description: IC SRAM 18MBIT PARALLEL 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Technology: SRAM - Asynchronous, ZBT
Clock Frequency: 166 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 1M x 18
auf Bestellung 233 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 16+ | 31.26 EUR |
| MT47H32M16NF-25E AAT:H |
|
Hersteller: Micron Technology Inc.
Description: IC DRAM 512MBIT PARALLEL 84FBGA
Packaging: Bulk
Package / Case: 84-TFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 84-FBGA (8x12.5)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC DRAM 512MBIT PARALLEL 84FBGA
Packaging: Bulk
Package / Case: 84-TFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 84-FBGA (8x12.5)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1267 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 9.63 EUR |
| 10+ | 8.78 EUR |
| 25+ | 8.62 EUR |
| 50+ | 8.55 EUR |
| 100+ | 7.68 EUR |
| 250+ | 7.65 EUR |
| 500+ | 7.17 EUR |
| MT47H32M16NF-25E AIT:H |
Hersteller: Micron Technology Inc.
Description: IC DRAM 512MBIT PARALLEL 84FBGA
Packaging: Bulk
Package / Case: 84-TFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 84-FBGA (8x12.5)
Part Status: Last Time Buy
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 32M x 16
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC DRAM 512MBIT PARALLEL 84FBGA
Packaging: Bulk
Package / Case: 84-TFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 84-FBGA (8x12.5)
Part Status: Last Time Buy
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 32M x 16
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MT47H32M16NF-25E AIT:H TR |
Hersteller: Micron Technology Inc.
Description: IC DRAM 512MBIT PARALLEL 84FBGA
Packaging: Tape & Reel (TR)
Package / Case: 84-TFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 84-FBGA (8x12.5)
Part Status: Last Time Buy
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 32M x 16
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC DRAM 512MBIT PARALLEL 84FBGA
Packaging: Tape & Reel (TR)
Package / Case: 84-TFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 84-FBGA (8x12.5)
Part Status: Last Time Buy
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 32M x 16
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MT47H32M16NF-25E AUT:H |
Hersteller: Micron Technology Inc.
Description: IC DRAM 512MBIT PARALLEL 84FBGA
Packaging: Tray
Package / Case: 84-TFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 84-FBGA (8x12.5)
Part Status: Obsolete
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 32M x 16
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC DRAM 512MBIT PARALLEL 84FBGA
Packaging: Tray
Package / Case: 84-TFBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 84-FBGA (8x12.5)
Part Status: Obsolete
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 32M x 16
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MT29F64G08CECCBH1-12Z:C TR |
Hersteller: Micron Technology Inc.
Description: IC FLASH 64GBIT PARALLEL 100VBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-VBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 83 MHz
Memory Format: FLASH
Supplier Device Package: 100-VBGA (12x18)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 8G x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 64GBIT PARALLEL 100VBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-VBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 83 MHz
Memory Format: FLASH
Supplier Device Package: 100-VBGA (12x18)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 8G x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MT29F64G08CECCBH1-12:C TR |
Hersteller: Micron Technology Inc.
Description: IC FLASH 64GBIT PARALLEL 100VBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-VBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 83 MHz
Memory Format: FLASH
Supplier Device Package: 100-VBGA (12x18)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 8G x 8
Description: IC FLASH 64GBIT PARALLEL 100VBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-VBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 83 MHz
Memory Format: FLASH
Supplier Device Package: 100-VBGA (12x18)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 8G x 8
Produkt ist nicht verfügbar
| MT29F64G08CECCBH1-12ITZ:C TR |
Hersteller: Micron Technology Inc.
Description: IC FLASH 64GBIT PARALLEL 100VBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-VBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 83 MHz
Memory Format: FLASH
Supplier Device Package: 100-VBGA (12x18)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 8G x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 64GBIT PARALLEL 100VBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-VBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Clock Frequency: 83 MHz
Memory Format: FLASH
Supplier Device Package: 100-VBGA (12x18)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 8G x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MTFDKCC3T2TFC-1AZ15ABYY |
Hersteller: Micron Technology Inc.
Description: 7400 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
Description: 7400 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
Produkt ist nicht verfügbar
| MTFDKCC3T2TFC-1AZ1ZABYY |
Hersteller: Micron Technology Inc.
Description: 7400 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
Description: 7400 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
Produkt ist nicht verfügbar
| MTFDKCB3T2TFC-1AZ1ZABYY |
Hersteller: Micron Technology Inc.
Description: 7400 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
Description: 7400 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
Produkt ist nicht verfügbar
| MTFDKCC3T2TFC-1AZ45ABYY |
Hersteller: Micron Technology Inc.
Description: 7400 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
Description: 7400 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
Produkt ist nicht verfügbar
| MTFDKCB3T2TFS-1BC1ZABYY |
|
Hersteller: Micron Technology Inc.
Description: SSD 3.2TB 2.5" TLC NVME
Packaging: Tray
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
Description: SSD 3.2TB 2.5" TLC NVME
Packaging: Tray
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
Produkt ist nicht verfügbar
| MTFDKCC3T2TFS-1BC4ZABYY |
|
Hersteller: Micron Technology Inc.
Description: 7450 3200GB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.8GB/s
Speed - Write: 5.3GB/s
Part Status: Active
Description: 7450 3200GB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.8GB/s
Speed - Write: 5.3GB/s
Part Status: Active
Produkt ist nicht verfügbar
| MTFDKCC3T2TFC-1AZ4ZABYY |
Hersteller: Micron Technology Inc.
Description: 7400 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
Description: 7400 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.6GB/s
Speed - Write: 3.5GB/s
Part Status: Active
Produkt ist nicht verfügbar
| MTFDKCC3T2TFS-1BC45ABYY |
Hersteller: Micron Technology Inc.
Description: 7450 3200GB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.8GB/s
Speed - Write: 5.3GB/s
Part Status: Active
Description: 7450 3200GB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.8GB/s
Speed - Write: 5.3GB/s
Part Status: Active
Produkt ist nicht verfügbar
| MTFDKCC3T2TFS-1BC15ABYY |
|
Hersteller: Micron Technology Inc.
Description: 7450 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.8GB/s
Speed - Write: 5.3GB/s
Part Status: Active
Description: 7450 4TB U.3 SSD
Packaging: Box
Memory Size: 3.2TB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: 2.5"
Speed - Read: 6.8GB/s
Speed - Write: 5.3GB/s
Part Status: Active
Produkt ist nicht verfügbar
| MTFDKCC3T2TFS-1BC1ZABYY |
Hersteller: Micron Technology Inc.
Description: IC SSD FLASH NAND SLC
Packaging: Bulk
Part Status: Active
Description: IC SSD FLASH NAND SLC
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| MTSD128ANC8MS-1WT |
|
Hersteller: Micron Technology Inc.
Description: MICRON INDUSTRIAL MICROSD CARD 1
Packaging: Tray
Memory Size: 128GB
Speed: Class 10, UHS Class 1
Memory Type: microSD™
Operating Temperature: -25°C ~ 85°C
Part Status: Active
Description: MICRON INDUSTRIAL MICROSD CARD 1
Packaging: Tray
Memory Size: 128GB
Speed: Class 10, UHS Class 1
Memory Type: microSD™
Operating Temperature: -25°C ~ 85°C
Part Status: Active
auf Bestellung 229 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 69.57 EUR |
| 10+ | 64.52 EUR |
| 25+ | 62.22 EUR |
| 40+ | 60.67 EUR |
| 120+ | 53.16 EUR |
| MT29F8T08EWLKEM5-ITF:K |
Hersteller: Micron Technology Inc.
Description: TLC 8T X8 LBGA
Packaging: Box
Part Status: Active
DigiKey Programmable: Not Verified
Description: TLC 8T X8 LBGA
Packaging: Box
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MT29F8T08EWLKEM5-ITF:K TR |
Hersteller: Micron Technology Inc.
Description: TLC 8T X8 LBGA
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Description: TLC 8T X8 LBGA
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MT53E512M16D1Z11MWC1 |
Hersteller: Micron Technology Inc.
Description: LPDDR4 8G DIE 512MX16
Packaging: Box
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Memory Format: DRAM
Supplier Device Package: Wafer
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512M x 16
Description: LPDDR4 8G DIE 512MX16
Packaging: Box
Package / Case: Die
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Memory Format: DRAM
Supplier Device Package: Wafer
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512M x 16
Produkt ist nicht verfügbar
| MT53D512M16D1DS-046 IT:D |
|
Hersteller: Micron Technology Inc.
Description: LPDDR4 8G 512MX16 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Organization: 512M x 16
Description: LPDDR4 8G 512MX16 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Organization: 512M x 16
Produkt ist nicht verfügbar
| MT53D512M16D1DS-046 IT:D TR |
|
Hersteller: Micron Technology Inc.
Description: LPDDR4 8G 512MX16 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 512M x 16
Description: LPDDR4 8G 512MX16 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 512M x 16
Produkt ist nicht verfügbar
| MT53E512M16D1FW-046 AAT:D |
Hersteller: Micron Technology Inc.
Description: LPDDR4 8G 512MX16 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512M x 16
Description: LPDDR4 8G 512MX16 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512M x 16
Produkt ist nicht verfügbar
| MT53E512M16D1FW-046 AAT:D TR |
Hersteller: Micron Technology Inc.
Description: LPDDR4 8G 512MX16 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512M x 16
Description: LPDDR4 8G 512MX16 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512M x 16
Produkt ist nicht verfügbar
| MT53E512M16D1FW-046 AIT:D |
Hersteller: Micron Technology Inc.
Description: LPDDR4 8G 512MX16 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512M x 16
Description: LPDDR4 8G 512MX16 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512M x 16
Produkt ist nicht verfügbar
| MT53E512M16D1FW-046 AIT:D TR |
Hersteller: Micron Technology Inc.
Description: LPDDR4 8G 512MX16 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512M x 16
Description: LPDDR4 8G 512MX16 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512M x 16
Produkt ist nicht verfügbar
| MT41K512M16VRP-107 IT:P TR |
Hersteller: Micron Technology Inc.
Description: DDR3 8G 512MX16 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 96-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 96-FBGA (8x14)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 512M x 16
DigiKey Programmable: Not Verified
Description: DDR3 8G 512MX16 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 96-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 96-FBGA (8x14)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 512M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MT41K512M16VRP-107 AAT:P TR |
|
Hersteller: Micron Technology Inc.
Description: DDR3 8G 512MX16 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 96-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 96-FBGA (8x14)
Grade: Automotive
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 512M x 16
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: DDR3 8G 512MX16 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 96-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 96-FBGA (8x14)
Grade: Automotive
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 512M x 16
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MT41K512M16VRP-107 AAT:P |
|
Hersteller: Micron Technology Inc.
Description: DDR3 8G 512MX16 FBGA DDP
Packaging: Box
Package / Case: 96-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 96-FBGA (8x14)
Grade: Automotive
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 512M x 16
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: DDR3 8G 512MX16 FBGA DDP
Packaging: Box
Package / Case: 96-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 96-FBGA (8x14)
Grade: Automotive
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 512M x 16
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 413 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 32.47 EUR |
| 10+ | 30.24 EUR |
| 25+ | 29.92 EUR |
| 50+ | 29.18 EUR |
| 100+ | 25.61 EUR |
| 250+ | 24.75 EUR |
| MT55V512V36PF-10 |
|
Hersteller: Micron Technology Inc.
Description: IC SRAM 18MBIT PAR 165FBGA
Packaging: Bulk
Package / Case: 165-TBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Technology: SRAM - ZBT
Clock Frequency: 100 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Access Time: 5 ns
Memory Organization: 512K x 36
Description: IC SRAM 18MBIT PAR 165FBGA
Packaging: Bulk
Package / Case: 165-TBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Technology: SRAM - ZBT
Clock Frequency: 100 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Access Time: 5 ns
Memory Organization: 512K x 36
auf Bestellung 669 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 18+ | 28.58 EUR |
| MT55V512V32PF-10 |
|
Hersteller: Micron Technology Inc.
Description: IC SRAM 18MBIT PAR 165FBGA
Packaging: Bulk
Package / Case: 165-TBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Technology: SRAM - ZBT
Clock Frequency: 100 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Access Time: 5 ns
Memory Organization: 512K x 32
DigiKey Programmable: Not Verified
Description: IC SRAM 18MBIT PAR 165FBGA
Packaging: Bulk
Package / Case: 165-TBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Technology: SRAM - ZBT
Clock Frequency: 100 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Access Time: 5 ns
Memory Organization: 512K x 32
DigiKey Programmable: Not Verified
auf Bestellung 97 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 16+ | 30.55 EUR |
| MT47H128M8SH-25E AAT:M |
|
Hersteller: Micron Technology Inc.
Description: IC DRAM 1GBIT PARALLEL 60FBGA
Packaging: Tray
Package / Case: 60-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 60-FBGA (8x10)
Part Status: Obsolete
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 128M x 8
Description: IC DRAM 1GBIT PARALLEL 60FBGA
Packaging: Tray
Package / Case: 60-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 60-FBGA (8x10)
Part Status: Obsolete
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 128M x 8
Produkt ist nicht verfügbar
| MT47H128M8SH-25E AAT:M TR |
|
Hersteller: Micron Technology Inc.
Description: IC DRAM 1GBIT PARALLEL 60FBGA
Packaging: Tape & Reel (TR)
Package / Case: 60-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 60-FBGA (8x10)
Part Status: Obsolete
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 128M x 8
Description: IC DRAM 1GBIT PARALLEL 60FBGA
Packaging: Tape & Reel (TR)
Package / Case: 60-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SDRAM - DDR2
Clock Frequency: 400 MHz
Memory Format: DRAM
Supplier Device Package: 60-FBGA (8x10)
Part Status: Obsolete
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 400 ps
Memory Organization: 128M x 8
Produkt ist nicht verfügbar
| MTFC16GLWDM-4M AIT Z |
Hersteller: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
Description: IC FLASH 128GBIT MMC 153TFBGA
Packaging: Tray
Package / Case: 153-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 153-TFBGA (11.5x13)
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
Produkt ist nicht verfügbar
| MTFC16GLXAM-WT TR |
Hersteller: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 153VFBGA
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
Description: IC FLASH 128GBIT MMC 153VFBGA
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
Produkt ist nicht verfügbar
| MTFC16GLTAM-WT TR |
Hersteller: Micron Technology Inc.
Description: IC FLASH 128GBIT MMC 153VFBGA
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
Description: IC FLASH 128GBIT MMC 153VFBGA
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 128Gbit
Memory Type: Non-Volatile
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Part Status: Obsolete
Memory Interface: MMC
Memory Organization: 16G x 8
Produkt ist nicht verfügbar