Produkte > MICRON TECHNOLOGY INC. > Alle Produkte des Herstellers MICRON TECHNOLOGY INC. (10584) > Seite 162 nach 177
Foto | Bezeichnung | Hersteller | Beschreibung |
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M29F400FT55M32 | Micron Technology Inc. |
Description: IC FLASH 4MBIT PARALLEL 44SO Packaging: Tray Package / Case: 44-SOIC (0.496", 12.60mm Width) Mounting Type: Surface Mount Memory Size: 4Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Technology: FLASH - NOR Memory Format: FLASH Supplier Device Package: 44-SO Part Status: Obsolete Write Cycle Time - Word, Page: 55ns Memory Interface: Parallel Access Time: 55 ns Memory Organization: 512K x 8, 256K x 16 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT41K512M8RG-093:N | Micron Technology Inc. |
Description: IC DRAM 4GBIT PAR 78FBGA Packaging: Tray Package / Case: 78-TFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3L Clock Frequency: 1.066 GHz Memory Format: DRAM Supplier Device Package: 78-FBGA (7.5x10.6) Part Status: Obsolete Memory Interface: Parallel Access Time: 20 ns Memory Organization: 512M x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT41K512M8RG-093:N TR | Micron Technology Inc. |
Description: IC DRAM 4GBIT PAR 78FBGA Packaging: Tape & Reel (TR) Package / Case: 78-TFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3L Clock Frequency: 1.066 GHz Memory Format: DRAM Supplier Device Package: 78-FBGA (7.5x10.6) Part Status: Obsolete Memory Interface: Parallel Access Time: 20 ns Memory Organization: 512M x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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N25Q128A13EV741 | Micron Technology Inc. |
Description: IC FLASH 128MBIT SPI 108MHZ Packaging: Bulk Memory Size: 128Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NOR Clock Frequency: 108 MHz Memory Format: FLASH Part Status: Obsolete Write Cycle Time - Word, Page: 8ms, 5ms Memory Interface: SPI Memory Organization: 32M x 4 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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N25Q128A13BSFH0F | Micron Technology Inc. |
Description: IC FLASH 128MBIT SPI 108MHZ 16SO Packaging: Tray Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Memory Size: 128Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NOR Clock Frequency: 108 MHz Memory Format: FLASH Supplier Device Package: 16-SO Part Status: Obsolete Write Cycle Time - Word, Page: 8ms, 5ms Memory Interface: SPI Memory Organization: 32M x 4 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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N25Q128A13EW7DFF | Micron Technology Inc. |
Description: IC FLASH 128MBIT SPI 108MHZ Packaging: Bulk Memory Size: 128Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NOR Clock Frequency: 108 MHz Memory Format: FLASH Part Status: Obsolete Write Cycle Time - Word, Page: 8ms, 5ms Memory Interface: SPI Memory Organization: 32M x 4 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E2G32D4DE-046 AUT:C | Micron Technology Inc. |
Description: LPDDR4 64G 2GX32 FBGA Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 125°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Part Status: Active Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E2G32D4DE-046 AAT:C | Micron Technology Inc. |
Description: LPDDR4 64G 2GX32 FBGA Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Part Status: Active Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E2G32D4DE-046 AUT:C TR | Micron Technology Inc. |
Description: LPDDR4 64G 2GX32 FBGA Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 125°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Part Status: Active Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E2G32D4DE-046 AIT:C TR | Micron Technology Inc. |
Description: LPDDR4 64G 2GX32 FBGA Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Part Status: Active Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E2G32D4DE-046 WT:C TR | Micron Technology Inc. |
Description: LPDDR4 64G 2GX32 FBGA Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Part Status: Active Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E2G32D4DE-046 AIT:C | Micron Technology Inc. |
Description: LPDDR4 64G 2GX32 FBGA Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Part Status: Active Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E2G32D4DE-046 WT:C | Micron Technology Inc. |
Description: LPDDR4 64G 2GX32 FBGA Packaging: Box Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Part Status: Active Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT53E2G32D4DE-046 AAT:C TR | Micron Technology Inc. |
Description: LPDDR4 64G 2GX32 FBGA Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Part Status: Active Write Cycle Time - Word, Page: 18ns Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT62F1G32D2DS-023 WT ES:B TR | Micron Technology Inc. |
Description: LPDDR5 64G 2GX32 FBGA Packaging: Tape & Reel (TR) Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C Voltage - Supply: 1.05V Technology: SDRAM - Mobile LPDDR5 Clock Frequency: 3.2 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Part Status: Active Memory Interface: Parallel Memory Organization: 1G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT62F2G32D4DS-023 FAAT:B | Micron Technology Inc. |
Description: LPDDR5 64G 2GX32 FBGA Packaging: Box Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Voltage - Supply: 1.05V Technology: SDRAM - Mobile LPDDR5 Clock Frequency: 4.266 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Part Status: Active Memory Interface: Parallel Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT62F2G32D4DS-023 IT:B | Micron Technology Inc. |
Description: LPDDR5 64G 2GX32 FBGA Packaging: Box Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Voltage - Supply: 1.05V Technology: SDRAM - Mobile LPDDR5 Clock Frequency: 4.266 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Part Status: Active Memory Interface: Parallel Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT62F1G32D2DS-023 WT ES:B | Micron Technology Inc. |
Description: LPDDR5 64G 2GX32 FBGA Packaging: Box Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Voltage - Supply: 1.05V Technology: SDRAM - Mobile LPDDR5 Clock Frequency: 4.266 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Part Status: Active Memory Interface: Parallel Memory Organization: 1G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT62F2G32D4DS-023 WT ES:B TR | Micron Technology Inc. |
Description: LPDDR5 64G 2GX32 FBGA Packaging: Tape & Reel (TR) Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C Voltage - Supply: 1.05V Technology: SDRAM - Mobile LPDDR5 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Part Status: Active Memory Interface: Parallel Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT62F2G32D4DS-023 AUT:B | Micron Technology Inc. |
Description: LPDDR5 64G 2GX32 FBGA Packaging: Box Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Voltage - Supply: 1.05V Technology: SDRAM - Mobile LPDDR5 Clock Frequency: 4.266 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Part Status: Active Memory Interface: Parallel Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT62F2G32D4DS-023 AUT:B TR | Micron Technology Inc. |
Description: LPDDR5 64G 2GX32 FBGA Packaging: Tape & Reel (TR) Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.05V Technology: SDRAM - Mobile LPDDR5 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Part Status: Active Memory Interface: Parallel Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT62F2G32D4DS-023 AAT:B TR | Micron Technology Inc. |
Description: LPDDR5 64G 2GX32 FBGA Packaging: Tape & Reel (TR) Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.05V Technology: SDRAM - Mobile LPDDR5 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Part Status: Active Memory Interface: Parallel Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT62F2G32D4DS-023 WT ES:B | Micron Technology Inc. |
Description: LPDDR5 64G 2GX32 FBGA Packaging: Box Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C Voltage - Supply: 1.05V Technology: SDRAM - Mobile LPDDR5 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Part Status: Active Memory Interface: Parallel Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT62F2G32D4DS-023 WT:B | Micron Technology Inc. |
Description: LPDDR5 64G 2GX32 FBGA Packaging: Box Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Voltage - Supply: 1.05V Technology: SDRAM - Mobile LPDDR5 Clock Frequency: 4.266 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Part Status: Active Memory Interface: Parallel Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT62F2G32D4DS-023 WT:B TR | Micron Technology Inc. |
Description: LPDDR5 64G 2GX32 FBGA Packaging: Tape & Reel (TR) Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C Voltage - Supply: 1.05V Technology: SDRAM - Mobile LPDDR5 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Part Status: Active Memory Interface: Parallel Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT62F2G32D4DS-023 IT:B TR | Micron Technology Inc. |
Description: LPDDR5 64G 2GX32 FBGA Packaging: Tape & Reel (TR) Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.05V Technology: SDRAM - Mobile LPDDR5 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Part Status: Active Memory Interface: Parallel Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT62F2G32D4DS-023 AIT:B TR | Micron Technology Inc. |
Description: LPDDR5 64G 2GX32 FBGA Packaging: Tape & Reel (TR) Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.05V Technology: SDRAM - Mobile LPDDR5 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Part Status: Active Memory Interface: Parallel Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT62F2G32D4DS-023 AIT:B | Micron Technology Inc. |
Description: LPDDR5 64G 2GX32 FBGA Packaging: Box Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Voltage - Supply: 1.05V Technology: SDRAM - Mobile LPDDR5 Clock Frequency: 4.266 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Part Status: Active Memory Interface: Parallel Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT62F2G32D4DS-023 AAT:B | Micron Technology Inc. |
Description: LPDDR5 64G 2GX32 FBGA Packaging: Box Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Voltage - Supply: 1.05V Technology: SDRAM - Mobile LPDDR5 Clock Frequency: 4.266 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Part Status: Active Memory Interface: Parallel Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT62F2G32D4DS-023 FAAT:B TR | Micron Technology Inc. |
Description: LPDDR5 64G 2GX32 FBGA Packaging: Tape & Reel (TR) Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 64Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.05V Technology: SDRAM - Mobile LPDDR5 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Part Status: Active Memory Interface: Parallel Memory Organization: 2G x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT62F2G32D8DR-031 WT:B | Micron Technology Inc. |
Description: LPDDR5 64G 2GX32 FBGA 8DP Packaging: Box Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT62F2G32D8DR-031 WT:B TR | Micron Technology Inc. |
Description: LPDDR5 64G 2GX32 FBGA 8DP Packaging: Tape & Reel (TR) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT61M256M32JE-12 NIT:A TR | Micron Technology Inc. |
Description: GDDR6 8G 256MX32 FBGA Packaging: Tape & Reel (TR) Package / Case: 180-TFBGA Mounting Type: Surface Mount Memory Size: 8Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.2125V ~ 1.325V Technology: SGRAM - GDDR6 Clock Frequency: 6 GHz Memory Format: DRAM Supplier Device Package: 180-FBGA (12x14) Part Status: Obsolete Memory Interface: POD125 Memory Organization: 256M x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT61M256M32JE-12 NIT:A | Micron Technology Inc. |
Description: GDDR6 8G 256MX32 FBGA Packaging: Box Package / Case: 180-TFBGA Mounting Type: Surface Mount Memory Size: 8Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.2125V ~ 1.325V Technology: SGRAM - GDDR6 Clock Frequency: 6 GHz Memory Format: DRAM Supplier Device Package: 180-FBGA (12x14) Part Status: Obsolete Memory Interface: POD125 Memory Organization: 256M x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT61K512M32KPA-14:C | Micron Technology Inc. |
Description: GDDR6 16G 512MX32 FBGA DDP Packaging: Box Package / Case: 180-TFBGA Mounting Type: Surface Mount Memory Size: 16Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.3095V ~ 1.3905V Technology: SGRAM - GDDR6 Clock Frequency: 7 GHz Memory Format: DRAM Supplier Device Package: 180-FBGA (12x14) Part Status: Active Memory Interface: POD_135 Memory Organization: 512M x 32 DigiKey Programmable: Not Verified |
auf Bestellung 1260 Stücke: Lieferzeit 10-14 Tag (e) |
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MT61K512M32KPA-16:C | Micron Technology Inc. |
Description: GDDR6 16G 512MX32 FBGA DDP Packaging: Box Package / Case: 180-TFBGA Mounting Type: Surface Mount Memory Size: 16Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.3095V ~ 1.3905V Technology: SGRAM - GDDR6 Clock Frequency: 8 GHz Memory Format: DRAM Supplier Device Package: 180-FBGA (12x14) Part Status: Active Memory Interface: POD_135 Memory Organization: 512M x 32 DigiKey Programmable: Not Verified |
auf Bestellung 1244 Stücke: Lieferzeit 10-14 Tag (e) |
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MT61K512M32KPA-14:C TR | Micron Technology Inc. |
Description: GDDR6 16G 512MX32 FBGA DDP Packaging: Tape & Reel (TR) Package / Case: 180-TFBGA Mounting Type: Surface Mount Memory Size: 16Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.3095V ~ 1.3905V Technology: SGRAM - GDDR6 Clock Frequency: 7 GHz Memory Format: DRAM Supplier Device Package: 180-FBGA (12x14) Part Status: Active Memory Interface: POD_135 Memory Organization: 512M x 32 DigiKey Programmable: Not Verified |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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MT61K512M32KPA-21:U | Micron Technology Inc. |
Description: GDDR6 16G 512MX32 FBGA DDP Packaging: Box Package / Case: 180-TFBGA Mounting Type: Surface Mount Memory Size: 16Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.3095V ~ 1.3905V Technology: SGRAM - GDDR6 Clock Frequency: 10.5 GHz Memory Format: DRAM Supplier Device Package: 180-FBGA (12x14) Part Status: Active Memory Interface: POD_135 Memory Organization: 512M x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT61K512M32KPA-24:U TR | Micron Technology Inc. |
Description: GDDR6 16G 512MX32 FBGA DDP Packaging: Tape & Reel (TR) Package / Case: 180-TFBGA Mounting Type: Surface Mount Memory Size: 16Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.3095V ~ 1.3905V Technology: SGRAM - GDDR6 Clock Frequency: 12 GHz Memory Format: DRAM Supplier Device Package: 180-FBGA (12x14) Part Status: Active Memory Interface: POD_135 Memory Organization: 512M x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT61K512M32KPA-16:C TR | Micron Technology Inc. |
Description: GDDR6 16G 512MX32 FBGA DDP Packaging: Tape & Reel (TR) Package / Case: 180-TFBGA Mounting Type: Surface Mount Memory Size: 16Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.3095V ~ 1.3905V Technology: SGRAM - GDDR6 Clock Frequency: 8 GHz Memory Format: DRAM Supplier Device Package: 180-FBGA (12x14) Part Status: Active Memory Interface: POD_135 Memory Organization: 512M x 32 DigiKey Programmable: Not Verified |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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MT61K512M32KPA-21:U TR | Micron Technology Inc. |
Description: GDDR6 16G 512MX32 FBGA DDP Packaging: Tape & Reel (TR) Package / Case: 180-TFBGA Mounting Type: Surface Mount Memory Size: 16Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.3095V ~ 1.3905V Technology: SGRAM - GDDR6 Clock Frequency: 10.5 GHz Memory Format: DRAM Supplier Device Package: 180-FBGA (12x14) Part Status: Active Memory Interface: POD_135 Memory Organization: 512M x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT61M512M32KPA-14 AAT:C TR | Micron Technology Inc. |
Description: GDDR6 16G 512MX32 FBGA DDP Packaging: Tape & Reel (TR) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT61M512M32KPA-14 N:C TR | Micron Technology Inc. |
Description: GDDR6 16G 512MX32 FBGA DDP Packaging: Tape & Reel (TR) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT61M512M32KPA-14 AAT:C | Micron Technology Inc. |
Description: GDDR6 16G 512MX32 FBGA DDP Packaging: Box Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT61M512M32KPA-14 NIT:C | Micron Technology Inc. |
Description: GDDR6 16G 512MX32 FBGA DDP Packaging: Box Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT61M512M32KPA-14 N:C | Micron Technology Inc. |
Description: GDDR6 16G 512MX32 FBGA DDP Packaging: Box Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT61M512M32KPA-14 NIT:C TR | Micron Technology Inc. |
Description: GDDR6 16G 512MX32 FBGA DDP Packaging: Tape & Reel (TR) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT58L512L18FS-8.5 | Micron Technology Inc. |
Description: IC SRAM 8MBIT PAR 100TQFP Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Memory Size: 8Mbit Memory Type: Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 3.135V ~ 3.6V Technology: SRAM - Standard Clock Frequency: 100 MHz Memory Format: SRAM Supplier Device Package: 100-TQFP (14x20.1) Part Status: Active Memory Interface: Parallel Access Time: 8.5 ns Memory Organization: 512K x 18 DigiKey Programmable: Not Verified |
auf Bestellung 17071 Stücke: Lieferzeit 10-14 Tag (e) |
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MT58L256L32PT-6 | Micron Technology Inc. |
Description: IC SRAM 8MBIT PARALLEL 100TQFP Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Memory Size: 8Mbit Memory Type: Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 3.135V ~ 3.6V Technology: SRAM - Standard Clock Frequency: 166 MHz Memory Format: SRAM Supplier Device Package: 100-TQFP (14x20.1) Part Status: Active Memory Interface: Parallel Access Time: 3.5 ns Memory Organization: 256K x 32 DigiKey Programmable: Not Verified |
auf Bestellung 786 Stücke: Lieferzeit 10-14 Tag (e) |
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MT58L512Y36PT-5 | Micron Technology Inc. |
Description: IC SRAM 18MBIT PARALLEL 100TQFP Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Memory Size: 18Mbit Memory Type: Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 3.135V ~ 3.465V Technology: SRAM - Standard Clock Frequency: 200 MHz Memory Format: SRAM Supplier Device Package: 100-TQFP (14x20.1) Part Status: Active Memory Interface: Parallel Access Time: 3.1 ns Memory Organization: 512K x 36 DigiKey Programmable: Not Verified |
auf Bestellung 423 Stücke: Lieferzeit 10-14 Tag (e) |
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MT58L256L36PS-7.5TR | Micron Technology Inc. |
Description: IC SRAM 8MBIT PARALLEL 100TQFP Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Memory Size: 8Mbit Memory Type: Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 3.135V ~ 3.6V Technology: SRAM - Standard Clock Frequency: 133 MHz Memory Format: SRAM Supplier Device Package: 100-TQFP (14x20.1) Part Status: Active Memory Interface: Parallel Access Time: 4 ns Memory Organization: 256K x 36 DigiKey Programmable: Not Verified |
auf Bestellung 6501 Stücke: Lieferzeit 10-14 Tag (e) |
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MT29F1T08EMCAGJ4-5M:A TR | Micron Technology Inc. |
Description: IC FLASH 1TBIT PARALLEL 132VBGA Packaging: Tape & Reel (TR) Package / Case: 132-VBGA Mounting Type: Surface Mount Memory Size: 1Tbit Memory Type: Non-Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.5V ~ 3.6V Technology: FLASH - NAND Memory Format: FLASH Supplier Device Package: 132-VBGA (12x18) Part Status: Discontinued at Digi-Key Memory Interface: Parallel Memory Organization: 128G x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT29F1T08EMCAGJ4-5M:A | Micron Technology Inc. |
Description: IC FLASH 1TBIT PARALLEL 132VBGA Packaging: Box Package / Case: 132-VBGA Mounting Type: Surface Mount Memory Size: 1Tbit Memory Type: Non-Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 2.5V ~ 3.6V Technology: FLASH - NAND Memory Format: FLASH Supplier Device Package: 132-VBGA (12x18) Part Status: Obsolete Memory Interface: Parallel Memory Organization: 128G x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT29C4G48MAYBBAHK-48 AIT | Micron Technology Inc. |
Description: IC FLASH RAM 4GBIT PAR 137VFBGA Packaging: Tray Package / Case: 137-VFBGA Mounting Type: Surface Mount Memory Size: 4Gbit (NAND), 2Gbit (LPDRAM) Memory Type: Non-Volatile, Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: FLASH - NAND, Mobile LPDRAM Clock Frequency: 208 MHz Memory Format: FLASH, RAM Supplier Device Package: 137-VFBGA (13x10.5) Part Status: Active Memory Interface: Parallel Memory Organization: 512M x 8 (NAND), 64M x 32 (LPDRAM) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MT29C4G48MAYBBAHK-48 AIT TR | Micron Technology Inc. |
Description: IC FLASH RAM 4GBIT PAR 137VFBGA Packaging: Tape & Reel (TR) Package / Case: 137-VFBGA Mounting Type: Surface Mount Memory Size: 4Gbit (NAND), 2Gbit (LPDRAM) Memory Type: Non-Volatile, Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: FLASH - NAND, Mobile LPDRAM Clock Frequency: 208 MHz Memory Format: FLASH, RAM Supplier Device Package: 137-VFBGA (13x10.5) Part Status: Active Memory Interface: Parallel Memory Organization: 512M x 8 (NAND), 64M x 32 (LPDRAM) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MTFDKBG960TDZ-1AZ15ABYY | Micron Technology Inc. |
Description: 7400 1TB M.2 SSD Packaging: Box Memory Size: 960GB Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC) Type: NVMe Operating Temperature: 0°C ~ 70°C Form Factor: M.2 Module Speed - Read: 4.4GB/s Speed - Write: 1GB/s Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MTFDKBG960TFR-1BC4DABYY | Micron Technology Inc. |
Description: 7450 960GB U.3 SSD Packaging: Box Memory Size: 960GB Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC) Type: NVMe Operating Temperature: 0°C ~ 70°C Form Factor: M.2 Module Speed - Read: 5GB/s Speed - Write: 1.4GB/s Part Status: Active |
Produkt ist nicht verfügbar |
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MTFDKBG960TFR-1BC15ABYY | Micron Technology Inc. |
Description: 7450 1TB M.2 SSD Packaging: Box Memory Size: 960GB Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC) Type: NVMe Operating Temperature: 0°C ~ 70°C Form Factor: M.2 Module Speed - Read: 5GB/s Speed - Write: 1.4GB/s Part Status: Active |
Produkt ist nicht verfügbar |
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MTFDKBG960TDZ-1AZ4DABYY | Micron Technology Inc. |
Description: 7400 1TB M.2 SSD Packaging: Box Memory Size: 960GB Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC) Type: NVMe Operating Temperature: 0°C ~ 70°C Form Factor: M.2 Module Speed - Read: 4.4GB/s Speed - Write: 1GB/s Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MTFDKBG960TFR-1BC1ZABYY | Micron Technology Inc. |
Description: 7450 1TB M.2 SSD Packaging: Box Memory Size: 960GB Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC) Type: NVMe Operating Temperature: 0°C ~ 70°C Form Factor: M.2 Module Speed - Read: 5GB/s Speed - Write: 1.4GB/s Part Status: Active |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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M29F400FT55M32 |
Hersteller: Micron Technology Inc.
Description: IC FLASH 4MBIT PARALLEL 44SO
Packaging: Tray
Package / Case: 44-SOIC (0.496", 12.60mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 44-SO
Part Status: Obsolete
Write Cycle Time - Word, Page: 55ns
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 512K x 8, 256K x 16
DigiKey Programmable: Not Verified
Description: IC FLASH 4MBIT PARALLEL 44SO
Packaging: Tray
Package / Case: 44-SOIC (0.496", 12.60mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 44-SO
Part Status: Obsolete
Write Cycle Time - Word, Page: 55ns
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 512K x 8, 256K x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT41K512M8RG-093:N |
Hersteller: Micron Technology Inc.
Description: IC DRAM 4GBIT PAR 78FBGA
Packaging: Tray
Package / Case: 78-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 78-FBGA (7.5x10.6)
Part Status: Obsolete
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 512M x 8
DigiKey Programmable: Not Verified
Description: IC DRAM 4GBIT PAR 78FBGA
Packaging: Tray
Package / Case: 78-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 78-FBGA (7.5x10.6)
Part Status: Obsolete
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 512M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT41K512M8RG-093:N TR |
Hersteller: Micron Technology Inc.
Description: IC DRAM 4GBIT PAR 78FBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 78-FBGA (7.5x10.6)
Part Status: Obsolete
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 512M x 8
DigiKey Programmable: Not Verified
Description: IC DRAM 4GBIT PAR 78FBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 78-FBGA (7.5x10.6)
Part Status: Obsolete
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 512M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
N25Q128A13EV741 |
Hersteller: Micron Technology Inc.
Description: IC FLASH 128MBIT SPI 108MHZ
Packaging: Bulk
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 108 MHz
Memory Format: FLASH
Part Status: Obsolete
Write Cycle Time - Word, Page: 8ms, 5ms
Memory Interface: SPI
Memory Organization: 32M x 4
DigiKey Programmable: Not Verified
Description: IC FLASH 128MBIT SPI 108MHZ
Packaging: Bulk
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 108 MHz
Memory Format: FLASH
Part Status: Obsolete
Write Cycle Time - Word, Page: 8ms, 5ms
Memory Interface: SPI
Memory Organization: 32M x 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
N25Q128A13BSFH0F |
Hersteller: Micron Technology Inc.
Description: IC FLASH 128MBIT SPI 108MHZ 16SO
Packaging: Tray
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 108 MHz
Memory Format: FLASH
Supplier Device Package: 16-SO
Part Status: Obsolete
Write Cycle Time - Word, Page: 8ms, 5ms
Memory Interface: SPI
Memory Organization: 32M x 4
DigiKey Programmable: Not Verified
Description: IC FLASH 128MBIT SPI 108MHZ 16SO
Packaging: Tray
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 108 MHz
Memory Format: FLASH
Supplier Device Package: 16-SO
Part Status: Obsolete
Write Cycle Time - Word, Page: 8ms, 5ms
Memory Interface: SPI
Memory Organization: 32M x 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
N25Q128A13EW7DFF |
Hersteller: Micron Technology Inc.
Description: IC FLASH 128MBIT SPI 108MHZ
Packaging: Bulk
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 108 MHz
Memory Format: FLASH
Part Status: Obsolete
Write Cycle Time - Word, Page: 8ms, 5ms
Memory Interface: SPI
Memory Organization: 32M x 4
DigiKey Programmable: Not Verified
Description: IC FLASH 128MBIT SPI 108MHZ
Packaging: Bulk
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 108 MHz
Memory Format: FLASH
Part Status: Obsolete
Write Cycle Time - Word, Page: 8ms, 5ms
Memory Interface: SPI
Memory Organization: 32M x 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E2G32D4DE-046 AUT:C |
Hersteller: Micron Technology Inc.
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E2G32D4DE-046 AAT:C |
Hersteller: Micron Technology Inc.
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E2G32D4DE-046 AUT:C TR |
Hersteller: Micron Technology Inc.
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E2G32D4DE-046 AIT:C TR |
Hersteller: Micron Technology Inc.
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E2G32D4DE-046 WT:C TR |
Hersteller: Micron Technology Inc.
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E2G32D4DE-046 AIT:C |
Hersteller: Micron Technology Inc.
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E2G32D4DE-046 WT:C |
Hersteller: Micron Technology Inc.
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT53E2G32D4DE-046 AAT:C TR |
Hersteller: Micron Technology Inc.
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR4 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Part Status: Active
Write Cycle Time - Word, Page: 18ns
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT62F1G32D2DS-023 WT ES:B TR |
Hersteller: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 3.2 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 3.2 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT62F2G32D4DS-023 FAAT:B |
Hersteller: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT62F2G32D4DS-023 IT:B |
Hersteller: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT62F1G32D2DS-023 WT ES:B |
Hersteller: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 1G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT62F2G32D4DS-023 WT ES:B TR |
Hersteller: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT62F2G32D4DS-023 AUT:B |
Hersteller: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT62F2G32D4DS-023 AUT:B TR |
Hersteller: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT62F2G32D4DS-023 AAT:B TR |
Hersteller: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT62F2G32D4DS-023 WT ES:B |
Hersteller: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT62F2G32D4DS-023 WT:B |
Hersteller: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT62F2G32D4DS-023 WT:B TR |
Hersteller: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT62F2G32D4DS-023 IT:B TR |
Hersteller: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT62F2G32D4DS-023 AIT:B TR |
Hersteller: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT62F2G32D4DS-023 AIT:B |
Hersteller: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT62F2G32D4DS-023 AAT:B |
Hersteller: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Box
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 4.266 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT62F2G32D4DS-023 FAAT:B TR |
Hersteller: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Description: LPDDR5 64G 2GX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.05V
Technology: SDRAM - Mobile LPDDR5
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 2G x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT62F2G32D8DR-031 WT:B |
Hersteller: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA 8DP
Packaging: Box
Part Status: Active
DigiKey Programmable: Not Verified
Description: LPDDR5 64G 2GX32 FBGA 8DP
Packaging: Box
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT62F2G32D8DR-031 WT:B TR |
Hersteller: Micron Technology Inc.
Description: LPDDR5 64G 2GX32 FBGA 8DP
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Description: LPDDR5 64G 2GX32 FBGA 8DP
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT61M256M32JE-12 NIT:A TR |
Hersteller: Micron Technology Inc.
Description: GDDR6 8G 256MX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.2125V ~ 1.325V
Technology: SGRAM - GDDR6
Clock Frequency: 6 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Obsolete
Memory Interface: POD125
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
Description: GDDR6 8G 256MX32 FBGA
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.2125V ~ 1.325V
Technology: SGRAM - GDDR6
Clock Frequency: 6 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Obsolete
Memory Interface: POD125
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT61M256M32JE-12 NIT:A |
Hersteller: Micron Technology Inc.
Description: GDDR6 8G 256MX32 FBGA
Packaging: Box
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.2125V ~ 1.325V
Technology: SGRAM - GDDR6
Clock Frequency: 6 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Obsolete
Memory Interface: POD125
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
Description: GDDR6 8G 256MX32 FBGA
Packaging: Box
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.2125V ~ 1.325V
Technology: SGRAM - GDDR6
Clock Frequency: 6 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Obsolete
Memory Interface: POD125
Memory Organization: 256M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT61K512M32KPA-14:C |
Hersteller: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 7 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 7 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
auf Bestellung 1260 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 34.99 EUR |
10+ | 32.59 EUR |
25+ | 32.24 EUR |
50+ | 31.45 EUR |
100+ | 27.6 EUR |
250+ | 26.67 EUR |
500+ | 25.96 EUR |
MT61K512M32KPA-16:C |
Hersteller: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 8 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 8 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
auf Bestellung 1244 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 34.99 EUR |
10+ | 32.59 EUR |
25+ | 32.24 EUR |
50+ | 31.45 EUR |
100+ | 27.6 EUR |
250+ | 26.67 EUR |
500+ | 25.96 EUR |
MT61K512M32KPA-14:C TR |
Hersteller: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 7 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 7 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2000+ | 24.15 EUR |
MT61K512M32KPA-21:U |
Hersteller: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 10.5 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 10.5 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT61K512M32KPA-24:U TR |
Hersteller: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 12 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 12 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT61K512M32KPA-16:C TR |
Hersteller: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 8 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 8 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2000+ | 24.15 EUR |
MT61K512M32KPA-21:U TR |
Hersteller: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 10.5 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Memory Size: 16Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.3095V ~ 1.3905V
Technology: SGRAM - GDDR6
Clock Frequency: 10.5 GHz
Memory Format: DRAM
Supplier Device Package: 180-FBGA (12x14)
Part Status: Active
Memory Interface: POD_135
Memory Organization: 512M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT61M512M32KPA-14 AAT:C TR |
Hersteller: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT61M512M32KPA-14 N:C TR |
Hersteller: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT61M512M32KPA-14 AAT:C |
Hersteller: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Part Status: Active
DigiKey Programmable: Not Verified
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT61M512M32KPA-14 NIT:C |
Hersteller: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Part Status: Active
DigiKey Programmable: Not Verified
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT61M512M32KPA-14 N:C |
Hersteller: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Part Status: Active
DigiKey Programmable: Not Verified
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Box
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT61M512M32KPA-14 NIT:C TR |
Hersteller: Micron Technology Inc.
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Description: GDDR6 16G 512MX32 FBGA DDP
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT58L512L18FS-8.5 |
Hersteller: Micron Technology Inc.
Description: IC SRAM 8MBIT PAR 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Standard
Clock Frequency: 100 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 8.5 ns
Memory Organization: 512K x 18
DigiKey Programmable: Not Verified
Description: IC SRAM 8MBIT PAR 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Standard
Clock Frequency: 100 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 8.5 ns
Memory Organization: 512K x 18
DigiKey Programmable: Not Verified
auf Bestellung 17071 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
51+ | 10.45 EUR |
MT58L256L32PT-6 |
Hersteller: Micron Technology Inc.
Description: IC SRAM 8MBIT PARALLEL 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Standard
Clock Frequency: 166 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 256K x 32
DigiKey Programmable: Not Verified
Description: IC SRAM 8MBIT PARALLEL 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Standard
Clock Frequency: 166 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 256K x 32
DigiKey Programmable: Not Verified
auf Bestellung 786 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
31+ | 15.53 EUR |
MT58L512Y36PT-5 |
Hersteller: Micron Technology Inc.
Description: IC SRAM 18MBIT PARALLEL 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Technology: SRAM - Standard
Clock Frequency: 200 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 3.1 ns
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
Description: IC SRAM 18MBIT PARALLEL 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.465V
Technology: SRAM - Standard
Clock Frequency: 200 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 3.1 ns
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
auf Bestellung 423 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
17+ | 32.3 EUR |
MT58L256L36PS-7.5TR |
Hersteller: Micron Technology Inc.
Description: IC SRAM 8MBIT PARALLEL 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Standard
Clock Frequency: 133 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 4 ns
Memory Organization: 256K x 36
DigiKey Programmable: Not Verified
Description: IC SRAM 8MBIT PARALLEL 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Standard
Clock Frequency: 133 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20.1)
Part Status: Active
Memory Interface: Parallel
Access Time: 4 ns
Memory Organization: 256K x 36
DigiKey Programmable: Not Verified
auf Bestellung 6501 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
16+ | 33.33 EUR |
MT29F1T08EMCAGJ4-5M:A TR |
Hersteller: Micron Technology Inc.
Description: IC FLASH 1TBIT PARALLEL 132VBGA
Packaging: Tape & Reel (TR)
Package / Case: 132-VBGA
Mounting Type: Surface Mount
Memory Size: 1Tbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 132-VBGA (12x18)
Part Status: Discontinued at Digi-Key
Memory Interface: Parallel
Memory Organization: 128G x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 1TBIT PARALLEL 132VBGA
Packaging: Tape & Reel (TR)
Package / Case: 132-VBGA
Mounting Type: Surface Mount
Memory Size: 1Tbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 132-VBGA (12x18)
Part Status: Discontinued at Digi-Key
Memory Interface: Parallel
Memory Organization: 128G x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT29F1T08EMCAGJ4-5M:A |
Hersteller: Micron Technology Inc.
Description: IC FLASH 1TBIT PARALLEL 132VBGA
Packaging: Box
Package / Case: 132-VBGA
Mounting Type: Surface Mount
Memory Size: 1Tbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 132-VBGA (12x18)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 128G x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 1TBIT PARALLEL 132VBGA
Packaging: Box
Package / Case: 132-VBGA
Mounting Type: Surface Mount
Memory Size: 1Tbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: FLASH - NAND
Memory Format: FLASH
Supplier Device Package: 132-VBGA (12x18)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 128G x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT29C4G48MAYBBAHK-48 AIT |
Hersteller: Micron Technology Inc.
Description: IC FLASH RAM 4GBIT PAR 137VFBGA
Packaging: Tray
Package / Case: 137-VFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit (NAND), 2Gbit (LPDRAM)
Memory Type: Non-Volatile, Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND, Mobile LPDRAM
Clock Frequency: 208 MHz
Memory Format: FLASH, RAM
Supplier Device Package: 137-VFBGA (13x10.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 512M x 8 (NAND), 64M x 32 (LPDRAM)
DigiKey Programmable: Not Verified
Description: IC FLASH RAM 4GBIT PAR 137VFBGA
Packaging: Tray
Package / Case: 137-VFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit (NAND), 2Gbit (LPDRAM)
Memory Type: Non-Volatile, Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND, Mobile LPDRAM
Clock Frequency: 208 MHz
Memory Format: FLASH, RAM
Supplier Device Package: 137-VFBGA (13x10.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 512M x 8 (NAND), 64M x 32 (LPDRAM)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MT29C4G48MAYBBAHK-48 AIT TR |
Hersteller: Micron Technology Inc.
Description: IC FLASH RAM 4GBIT PAR 137VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 137-VFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit (NAND), 2Gbit (LPDRAM)
Memory Type: Non-Volatile, Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND, Mobile LPDRAM
Clock Frequency: 208 MHz
Memory Format: FLASH, RAM
Supplier Device Package: 137-VFBGA (13x10.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 512M x 8 (NAND), 64M x 32 (LPDRAM)
DigiKey Programmable: Not Verified
Description: IC FLASH RAM 4GBIT PAR 137VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 137-VFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit (NAND), 2Gbit (LPDRAM)
Memory Type: Non-Volatile, Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND, Mobile LPDRAM
Clock Frequency: 208 MHz
Memory Format: FLASH, RAM
Supplier Device Package: 137-VFBGA (13x10.5)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 512M x 8 (NAND), 64M x 32 (LPDRAM)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MTFDKBG960TDZ-1AZ15ABYY |
Hersteller: Micron Technology Inc.
Description: 7400 1TB M.2 SSD
Packaging: Box
Memory Size: 960GB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: M.2 Module
Speed - Read: 4.4GB/s
Speed - Write: 1GB/s
Part Status: Obsolete
Description: 7400 1TB M.2 SSD
Packaging: Box
Memory Size: 960GB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: M.2 Module
Speed - Read: 4.4GB/s
Speed - Write: 1GB/s
Part Status: Obsolete
Produkt ist nicht verfügbar
MTFDKBG960TFR-1BC4DABYY |
Hersteller: Micron Technology Inc.
Description: 7450 960GB U.3 SSD
Packaging: Box
Memory Size: 960GB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: M.2 Module
Speed - Read: 5GB/s
Speed - Write: 1.4GB/s
Part Status: Active
Description: 7450 960GB U.3 SSD
Packaging: Box
Memory Size: 960GB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: M.2 Module
Speed - Read: 5GB/s
Speed - Write: 1.4GB/s
Part Status: Active
Produkt ist nicht verfügbar
MTFDKBG960TFR-1BC15ABYY |
Hersteller: Micron Technology Inc.
Description: 7450 1TB M.2 SSD
Packaging: Box
Memory Size: 960GB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: M.2 Module
Speed - Read: 5GB/s
Speed - Write: 1.4GB/s
Part Status: Active
Description: 7450 1TB M.2 SSD
Packaging: Box
Memory Size: 960GB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: M.2 Module
Speed - Read: 5GB/s
Speed - Write: 1.4GB/s
Part Status: Active
Produkt ist nicht verfügbar
MTFDKBG960TDZ-1AZ4DABYY |
Hersteller: Micron Technology Inc.
Description: 7400 1TB M.2 SSD
Packaging: Box
Memory Size: 960GB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: M.2 Module
Speed - Read: 4.4GB/s
Speed - Write: 1GB/s
Part Status: Obsolete
Description: 7400 1TB M.2 SSD
Packaging: Box
Memory Size: 960GB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: M.2 Module
Speed - Read: 4.4GB/s
Speed - Write: 1GB/s
Part Status: Obsolete
Produkt ist nicht verfügbar
MTFDKBG960TFR-1BC1ZABYY |
Hersteller: Micron Technology Inc.
Description: 7450 1TB M.2 SSD
Packaging: Box
Memory Size: 960GB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: M.2 Module
Speed - Read: 5GB/s
Speed - Write: 1.4GB/s
Part Status: Active
Description: 7450 1TB M.2 SSD
Packaging: Box
Memory Size: 960GB
Memory Type: Solid State Drive (SSD) FLASH - NAND (TLC)
Type: NVMe
Operating Temperature: 0°C ~ 70°C
Form Factor: M.2 Module
Speed - Read: 5GB/s
Speed - Write: 1.4GB/s
Part Status: Active
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 409.11 EUR |
10+ | 356.44 EUR |
25+ | 355.48 EUR |