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110-93-428-41-105000 110-93-428-41-105000 Mill-Max Manufacturing Corp. 104.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
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110-93-432-41-001000 110-93-432-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
1+30.57 EUR
12+24.51 EUR
36+22.23 EUR
Im Einkaufswagen  Stück im Wert von  UAH
110-93-432-41-105000 110-93-432-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 32POS GOLD
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110-93-624-41-105000 110-93-624-41-105000 Mill-Max Manufacturing Corp. 104.pdf Description: CONN IC DIP SOCKET 24POS GOLD
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110-93-624-41-605000 110-93-624-41-605000 Mill-Max Manufacturing Corp. 094.pdf Description: CONN IC DIP SOCKET 24POS GOLD
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110-93-628-41-105000 110-93-628-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 28POS GOLD
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110-93-628-41-605000 110-93-628-41-605000 Mill-Max Manufacturing Corp. 094.PDF Description: CONN IC DIP SOCKET 28POS GOLD
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110-93-632-41-105000 110-93-632-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
1+33.16 EUR
12+28.73 EUR
36+27.24 EUR
60+26.84 EUR
Im Einkaufswagen  Stück im Wert von  UAH
110-93-632-41-605000 Mill-Max Manufacturing Corp. 094.PDF Description: CONN IC DIP SOCKET 32POS GOLD
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110-93-632-41-801000 Mill-Max Manufacturing Corp. 098.PDF Description: CONN IC DIP SOCKET 32POS GOLD
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110-93-636-41-001000 Mill-Max Manufacturing Corp. 090.PDF Description: CONN IC DIP SOCKET 36POS GOLD
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110-93-636-41-105000 110-93-636-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 36POS GOLD
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110-93-640-41-105000 110-93-640-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
1+30.78 EUR
10+26.95 EUR
30+25.79 EUR
50+24.96 EUR
Im Einkaufswagen  Stück im Wert von  UAH
110-93-640-41-605000 110-93-640-41-605000 Mill-Max Manufacturing Corp. 094.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
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110-93-642-41-001000 110-93-642-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
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110-93-642-41-105000 110-93-642-41-105000 Mill-Max Manufacturing Corp. 104.pdf Description: CONN IC DIP SOCKET 42POS GOLD
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110-93-648-41-105000 110-93-648-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 48POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-650-41-001000 110-93-650-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 50POS GOLD
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110-93-650-41-105000 110-93-650-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 50POS GOLD
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110-93-652-41-001000 Mill-Max Manufacturing Corp. 090.PDF Description: CONN IC DIP SOCKET 52POS GOLD
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110-93-652-41-105000 110-93-652-41-105000 Mill-Max Manufacturing Corp. 104.PDF Description: CONN IC DIP SOCKET 52POS GOLD
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110-93-950-41-105000 110-93-950-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 50POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-952-41-001000 110-93-952-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 52POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-952-41-105000 110-93-952-41-105000 Mill-Max Manufacturing Corp. 2017-11%3A104.pdf Description: CONN IC DIP SOCKET 52POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
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110-99-210-41-001000 110-99-210-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 10POS TINLEAD
Produkt ist nicht verfügbar
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110-99-304-41-001000 110-99-304-41-001000 Mill-Max Manufacturing Corp. 090.pdf Description: CONN IC DIP SOCKET 4POS TIN-LEAD
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110-99-306-41-001000 110-99-306-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 6POS TIN-LEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 67 Stücke:
Lieferzeit 10-14 Tag (e)
1+18 EUR
10+15.96 EUR
25+15.35 EUR
50+14.73 EUR
Im Einkaufswagen  Stück im Wert von  UAH
110-99-310-41-001000 110-99-310-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 10POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 80 Stücke:
Lieferzeit 10-14 Tag (e)
1+23.51 EUR
10+20.83 EUR
40+19.23 EUR
80+18.16 EUR
Im Einkaufswagen  Stück im Wert von  UAH
110-99-322-41-001000 110-99-322-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 22POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
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110-99-420-41-001000 110-99-420-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 20POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-99-422-41-001000 110-99-422-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 22POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 53 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.14 EUR
18+18.05 EUR
36+17.19 EUR
Im Einkaufswagen  Stück im Wert von  UAH
110-99-428-41-001000 110-99-428-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 28POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-99-432-41-001000 110-99-432-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 32POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-99-636-41-001000 110-99-636-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 36POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-99-642-41-001000 110-99-642-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 42POS TINLEAD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-99-650-41-001000 110-99-650-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 50POS TINLEAD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-99-652-41-001000 110-99-652-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 52POS TINLEAD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-99-950-41-001000 110-99-950-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 50POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-99-952-41-001000 110-99-952-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 52POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-210-41-001000 111-93-210-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A091.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.01 EUR
10+20.39 EUR
40+18.03 EUR
Im Einkaufswagen  Stück im Wert von  UAH
111-93-304-41-001000 Mill-Max Manufacturing Corp. 091.PDF Description: CONN IC DIP SOCKET 4POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-306-41-001000 111-93-306-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A091.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 66 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.95 EUR
10+19.5 EUR
25+18.28 EUR
Im Einkaufswagen  Stück im Wert von  UAH
111-93-310-41-001000 Mill-Max Manufacturing Corp. 091.PDF Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-318-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A091.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-322-41-001000 Mill-Max Manufacturing Corp. 091.PDF Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-328-41-001000 Mill-Max Manufacturing Corp. 091.PDF Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-420-41-001000 Mill-Max Manufacturing Corp. 54_Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-422-41-001000 Mill-Max Manufacturing Corp. 54_Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-424-41-001000 Mill-Max Manufacturing Corp. 54_Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-428-41-001000 Mill-Max Manufacturing Corp. 54_Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-432-41-001000 Mill-Max Manufacturing Corp. 091.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-636-41-001000 Mill-Max Manufacturing Corp. 091.PDF Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-642-41-001000 Mill-Max Manufacturing Corp. 091.pdf Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-648-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A091.pdf Description: CONN IC DIP SOCKET 48POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-650-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A091.pdf Description: CONN IC DIP SOCKET 50POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-652-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A091.pdf Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-950-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A091.pdf Description: CONN IC DIP SOCKET 50POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-952-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A091.pdf Description: CONN IC DIP SOCKET 52POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-964-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A091.pdf Description: CONN IC DIP SOCKET 64POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
114-93-210-41-117000 Mill-Max Manufacturing Corp. 2017-11%3A106.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-428-41-105000 104.pdf
110-93-428-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-432-41-001000 2017-11%3A090.pdf
110-93-432-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+30.57 EUR
12+24.51 EUR
36+22.23 EUR
Im Einkaufswagen  Stück im Wert von  UAH
110-93-432-41-105000 104.PDF
110-93-432-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-624-41-105000 104.pdf
110-93-624-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-624-41-605000 094.pdf
110-93-624-41-605000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-628-41-105000 104.PDF
110-93-628-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-628-41-605000 094.PDF
110-93-628-41-605000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-632-41-105000 2017-11%3A104.pdf
110-93-632-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+33.16 EUR
12+28.73 EUR
36+27.24 EUR
60+26.84 EUR
Im Einkaufswagen  Stück im Wert von  UAH
110-93-632-41-605000 094.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-632-41-801000 098.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-636-41-001000 090.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-636-41-105000 104.PDF
110-93-636-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-640-41-105000 2017-11%3A104.pdf
110-93-640-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+30.78 EUR
10+26.95 EUR
30+25.79 EUR
50+24.96 EUR
Im Einkaufswagen  Stück im Wert von  UAH
110-93-640-41-605000 094.pdf
110-93-640-41-605000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-642-41-001000 2017-11%3A090.pdf
110-93-642-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-642-41-105000 104.pdf
110-93-642-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-648-41-105000 2017-11%3A104.pdf
110-93-648-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-650-41-001000 2017-11%3A090.pdf
110-93-650-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-650-41-105000 104.PDF
110-93-650-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-652-41-001000 090.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-652-41-105000 104.PDF
110-93-652-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-950-41-105000 2017-11%3A104.pdf
110-93-950-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-952-41-001000 2017-11%3A090.pdf
110-93-952-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-93-952-41-105000 2017-11%3A104.pdf
110-93-952-41-105000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-99-210-41-001000 2017-11%3A090.pdf
110-99-210-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS TINLEAD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-99-304-41-001000 090.pdf
110-99-304-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 4POS TIN-LEAD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-99-306-41-001000 2017-11%3A090.pdf
110-99-306-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS TIN-LEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 67 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+18 EUR
10+15.96 EUR
25+15.35 EUR
50+14.73 EUR
Im Einkaufswagen  Stück im Wert von  UAH
110-99-310-41-001000 2017-11%3A090.pdf
110-99-310-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 80 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+23.51 EUR
10+20.83 EUR
40+19.23 EUR
80+18.16 EUR
Im Einkaufswagen  Stück im Wert von  UAH
110-99-322-41-001000 2017-11%3A090.pdf
110-99-322-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-99-420-41-001000 2017-11%3A090.pdf
110-99-420-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-99-422-41-001000 2017-11%3A090.pdf
110-99-422-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 53 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+22.14 EUR
18+18.05 EUR
36+17.19 EUR
Im Einkaufswagen  Stück im Wert von  UAH
110-99-428-41-001000 2017-11%3A090.pdf
110-99-428-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-99-432-41-001000 2017-11%3A090.pdf
110-99-432-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-99-636-41-001000 2017-11%3A090.pdf
110-99-636-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-99-642-41-001000 2017-11%3A090.pdf
110-99-642-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS TINLEAD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-99-650-41-001000 2017-11%3A090.pdf
110-99-650-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS TINLEAD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-99-652-41-001000 2017-11%3A090.pdf
110-99-652-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS TINLEAD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-99-950-41-001000 2017-11%3A090.pdf
110-99-950-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
110-99-952-41-001000 2017-11%3A090.pdf
110-99-952-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-210-41-001000 2017-11%3A091.pdf
111-93-210-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+25.01 EUR
10+20.39 EUR
40+18.03 EUR
Im Einkaufswagen  Stück im Wert von  UAH
111-93-304-41-001000 091.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 4POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-306-41-001000 2017-11%3A091.pdf
111-93-306-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 66 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+22.95 EUR
10+19.5 EUR
25+18.28 EUR
Im Einkaufswagen  Stück im Wert von  UAH
111-93-310-41-001000 091.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-318-41-001000 2017-11%3A091.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-322-41-001000 091.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-328-41-001000 091.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-420-41-001000 54_Mill%20Max%20catalog.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-422-41-001000 54_Mill%20Max%20catalog.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-424-41-001000 54_Mill%20Max%20catalog.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-428-41-001000 54_Mill%20Max%20catalog.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-432-41-001000 091.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-636-41-001000 091.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-642-41-001000 091.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-648-41-001000 2017-11%3A091.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-650-41-001000 2017-11%3A091.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-652-41-001000 2017-11%3A091.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-950-41-001000 2017-11%3A091.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-952-41-001000 2017-11%3A091.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
111-93-964-41-001000 2017-11%3A091.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 64POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
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114-93-210-41-117000 2017-11%3A106.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
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