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114-93-636-41-117000 Mill-Max Manufacturing Corp. 2017-11%3A106.pdf Description: CONN IC DIP SOCKET 36POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
114-93-640-41-117000 Mill-Max Manufacturing Corp. 2017-11%3A106.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
114-93-642-41-117000 Mill-Max Manufacturing Corp. 2017-11%3A106.pdf Description: CONN IC DIP SOCKET 42POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 42 (2 x 21)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
114-93-648-41-117000 Mill-Max Manufacturing Corp. 2017-11%3A106.pdf Description: CONN IC DIP SOCKET 48POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
114-93-650-41-117000 Mill-Max Manufacturing Corp. 2017-11%3A106.pdf Description: CONN IC DIP SOCKET 50POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
114-93-652-41-117000 Mill-Max Manufacturing Corp. 2017-11%3A106.pdf Description: CONN IC DIP SOCKET 52POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 52 (2 x 26)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
114-93-950-41-117000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 50POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 50 (2 x 25)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
114-93-952-41-117000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 52POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 52 (2 x 26)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
114-93-964-41-117000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 64POS GOLD
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 64 (2 x 32)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Produkt ist nicht verfügbar
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115-13-628-41-003000 115-13-628-41-003000 Mill-Max Manufacturing Corp. 093.PDF Description: CONN IC DIP SOCKET 28POS GOLD
auf Bestellung 56 Stücke:
Lieferzeit 10-14 Tag (e)
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115-93-210-41-001000 115-93-210-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A092.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 82 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.03 EUR
10+21.27 EUR
41+19.25 EUR
82+18.34 EUR
Im Einkaufswagen  Stück im Wert von  UAH
115-93-304-41-001000 Mill-Max Manufacturing Corp. 092.PDF Description: CONN IC DIP SOCKET 4POS GOLD
Produkt ist nicht verfügbar
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115-93-306-41-001000 115-93-306-41-001000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 67 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.49 EUR
10+18.26 EUR
25+17.12 EUR
67+15.97 EUR
Im Einkaufswagen  Stück im Wert von  UAH
115-93-306-41-003000 Mill-Max Manufacturing Corp. 093.PDF Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
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115-93-310-41-001000 Mill-Max Manufacturing Corp. 092.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-322-41-001000 Mill-Max Manufacturing Corp. 092.PDF Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-322-41-003000 Mill-Max Manufacturing Corp. 093.PDF Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
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115-93-420-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A092.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-422-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A092.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
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115-93-424-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A092.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-428-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A092.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-428-41-003000 Mill-Max Manufacturing Corp. 2017-11%3A093.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-432-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A092.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-636-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A092.pdf Description: CONN IC DIP SOCKET 36POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-636-41-003000 Mill-Max Manufacturing Corp. 2017-11%3A093.pdf Description: CONN IC DIP SOCKET 36POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-642-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A092.pdf Description: CONN IC DIP SOCKET 42POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-648-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A092.pdf Description: CONN IC DIP SOCKET 48POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-650-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A092.pdf Description: CONN IC DIP SOCKET 50POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-650-41-003000 Mill-Max Manufacturing Corp. 2017-11%3A093.pdf Description: CONN IC DIP SOCKET 50POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-652-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A092.pdf Description: CONN IC DIP SOCKET 52POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-950-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A092.pdf Description: CONN IC DIP SOCKET 50POS GOLD
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 50 (2 x 25)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-952-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A092.pdf Description: CONN IC DIP SOCKET 52POS GOLD
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 52 (2 x 26)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-964-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A092.pdf Description: CONN IC DIP SOCKET 64POS GOLD
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 64 (2 x 32)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-210-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-210-41-003000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-210-41-006000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-210-41-007000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-210-41-008000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-304-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-304-41-003000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-304-41-006000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-304-41-007000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-304-41-008000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 4POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-306-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-306-41-003000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-306-41-006000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Termination: Solder
Type: DIP, 0.3" (7.62mm) Row Spacing
Packaging: Tube
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 125°C
Mounting Type: Through Hole
Features: Elevated, Open Frame
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-306-41-007000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-306-41-008000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-308-41-001000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-308-41-003000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-308-41-006000 Mill-Max Manufacturing Corp. 111.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-308-41-007000 116-93-308-41-007000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
auf Bestellung 902 Stücke:
Lieferzeit 10-14 Tag (e)
1+28.72 EUR
10+25.46 EUR
25+24.48 EUR
50+23.5 EUR
100+22.2 EUR
250+20.24 EUR
500+18.93 EUR
Im Einkaufswagen  Stück im Wert von  UAH
116-93-308-41-008000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-310-41-001000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-310-41-003000 Mill-Max Manufacturing Corp. 111.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-310-41-006000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-310-41-007000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-310-41-008000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-314-41-001000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-314-41-003000 Mill-Max Manufacturing Corp. 111.PDF Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
114-93-636-41-117000 2017-11%3A106.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
114-93-640-41-117000 2017-11%3A106.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
114-93-642-41-117000 2017-11%3A106.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 42 (2 x 21)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
114-93-648-41-117000 2017-11%3A106.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
114-93-650-41-117000 2017-11%3A106.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
114-93-652-41-117000 2017-11%3A106.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 52 (2 x 26)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
114-93-950-41-117000 Mill%20Max%20catalog.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 50 (2 x 25)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
114-93-952-41-117000 Mill%20Max%20catalog.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 52 (2 x 26)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
114-93-964-41-117000 Mill%20Max%20catalog.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 64POS GOLD
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 64 (2 x 32)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-13-628-41-003000 093.PDF
115-13-628-41-003000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
auf Bestellung 56 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
115-93-210-41-001000 2017-11%3A092.pdf
115-93-210-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 82 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+25.03 EUR
10+21.27 EUR
41+19.25 EUR
82+18.34 EUR
Im Einkaufswagen  Stück im Wert von  UAH
115-93-304-41-001000 092.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 4POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-306-41-001000 Mill%20Max%20catalog.pdf
115-93-306-41-001000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 67 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.49 EUR
10+18.26 EUR
25+17.12 EUR
67+15.97 EUR
Im Einkaufswagen  Stück im Wert von  UAH
115-93-306-41-003000 093.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-310-41-001000 092.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-322-41-001000 092.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-322-41-003000 093.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-420-41-001000 2017-11%3A092.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-422-41-001000 2017-11%3A092.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-424-41-001000 2017-11%3A092.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-428-41-001000 2017-11%3A092.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-428-41-003000 2017-11%3A093.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-432-41-001000 2017-11%3A092.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-636-41-001000 2017-11%3A092.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-636-41-003000 2017-11%3A093.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-642-41-001000 2017-11%3A092.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-648-41-001000 2017-11%3A092.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-650-41-001000 2017-11%3A092.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-650-41-003000 2017-11%3A093.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-652-41-001000 2017-11%3A092.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-950-41-001000 2017-11%3A092.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 50 (2 x 25)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-952-41-001000 2017-11%3A092.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 52 (2 x 26)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
115-93-964-41-001000 2017-11%3A092.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 64POS GOLD
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 64 (2 x 32)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-210-41-001000 2017-11%3A111.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-210-41-003000 2017-11%3A111.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-210-41-006000 2017-11%3A111.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-210-41-007000 2017-11%3A111.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-210-41-008000 2017-11%3A111.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-304-41-001000 2017-11%3A111.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-304-41-003000 2017-11%3A111.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-304-41-006000 2017-11%3A111.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-304-41-007000 2017-11%3A111.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-304-41-008000 2017-11%3A111.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 4POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-306-41-001000 2017-11%3A111.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-306-41-003000 2017-11%3A111.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-306-41-006000 2017-11%3A111.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Termination: Solder
Type: DIP, 0.3" (7.62mm) Row Spacing
Packaging: Tube
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 125°C
Mounting Type: Through Hole
Features: Elevated, Open Frame
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-306-41-007000 2017-11%3A111.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-306-41-008000 2017-11%3A111.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-308-41-001000 111.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-308-41-003000 111.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-308-41-006000 111.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-308-41-007000 2017-11%3A111.pdf
116-93-308-41-007000
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
auf Bestellung 902 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+28.72 EUR
10+25.46 EUR
25+24.48 EUR
50+23.5 EUR
100+22.2 EUR
250+20.24 EUR
500+18.93 EUR
Im Einkaufswagen  Stück im Wert von  UAH
116-93-308-41-008000 111.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-310-41-001000 111.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-310-41-003000 111.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-310-41-006000 111.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-310-41-007000 111.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-310-41-008000 111.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-314-41-001000 111.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
116-93-314-41-003000 111.PDF
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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