Produkte > MILL-MAX MANUFACTURING CORP. > Alle Produkte des Herstellers MILL-MAX MANUFACTURING CORP. (38369) > Seite 58 nach 640
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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116-93-624-41-003000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 24POS GOLD |
Produkt ist nicht verfügbar |
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116-93-624-41-006000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 24POS GOLD |
Produkt ist nicht verfügbar |
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116-93-624-41-007000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 24POS GOLD |
Produkt ist nicht verfügbar |
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116-93-624-41-008000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 24POS GOLD |
Produkt ist nicht verfügbar |
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116-93-628-41-001000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 28POS GOLD |
Produkt ist nicht verfügbar |
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116-93-628-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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116-93-628-41-006000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 28POS GOLD |
Produkt ist nicht verfügbar |
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116-93-628-41-007000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 28POS GOLD |
Produkt ist nicht verfügbar |
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116-93-628-41-008000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 28POS GOLD |
Produkt ist nicht verfügbar |
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116-93-632-41-001000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 32POS GOLD |
Produkt ist nicht verfügbar |
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116-93-632-41-003000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 32POS GOLD |
Produkt ist nicht verfügbar |
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116-93-632-41-006000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 32POS GOLD |
auf Bestellung 1 Stücke: Lieferzeit 21-28 Tag (e) |
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116-93-632-41-007000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 32POS GOLD |
Produkt ist nicht verfügbar |
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116-93-632-41-008000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 32POS GOLD |
Produkt ist nicht verfügbar |
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116-93-636-41-001000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 36POS GOLD |
Produkt ist nicht verfügbar |
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116-93-636-41-003000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 36POS GOLD |
Produkt ist nicht verfügbar |
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116-93-636-41-006000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 36POS GOLD |
Produkt ist nicht verfügbar |
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116-93-636-41-007000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 36POS GOLD |
Produkt ist nicht verfügbar |
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116-93-636-41-008000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 36POS GOLD |
Produkt ist nicht verfügbar |
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116-93-640-41-001000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 40POS GOLD |
Produkt ist nicht verfügbar |
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116-93-640-41-003000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 40POS GOLD |
Produkt ist nicht verfügbar |
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116-93-640-41-006000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 40POS GOLD |
Produkt ist nicht verfügbar |
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116-93-640-41-007000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 40POS GOLD |
Produkt ist nicht verfügbar |
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116-93-640-41-008000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 40POS GOLD |
Produkt ist nicht verfügbar |
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116-93-642-41-001000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 42POS GOLD |
Produkt ist nicht verfügbar |
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116-93-642-41-003000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 42POS GOLD |
Produkt ist nicht verfügbar |
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116-93-642-41-006000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 42POS GOLD |
Produkt ist nicht verfügbar |
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116-93-642-41-007000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 42POS GOLD |
Produkt ist nicht verfügbar |
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116-93-642-41-008000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 42POS GOLD |
Produkt ist nicht verfügbar |
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116-93-648-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 48POS GOLD Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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116-93-648-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 48POS GOLD Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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116-93-648-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 48POS GOLD Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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116-93-648-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 48POS GOLD Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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116-93-648-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 48POS GOLD Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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116-93-650-41-001000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 50POS GOLD |
Produkt ist nicht verfügbar |
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116-93-650-41-003000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 50POS GOLD |
Produkt ist nicht verfügbar |
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116-93-650-41-006000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 50POS GOLD |
Produkt ist nicht verfügbar |
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116-93-650-41-007000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 50POS GOLD |
Produkt ist nicht verfügbar |
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116-93-650-41-008000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 50POS GOLD |
Produkt ist nicht verfügbar |
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116-93-652-41-001000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
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116-93-652-41-003000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
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116-93-652-41-006000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
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116-93-652-41-007000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
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116-93-652-41-008000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
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116-93-950-41-001000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 50POS GOLD |
Produkt ist nicht verfügbar |
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116-93-950-41-003000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 50POS GOLD |
Produkt ist nicht verfügbar |
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116-93-950-41-006000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 50POS GOLD |
Produkt ist nicht verfügbar |
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116-93-950-41-007000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 50POS GOLD |
Produkt ist nicht verfügbar |
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116-93-950-41-008000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 50POS GOLD |
Produkt ist nicht verfügbar |
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116-93-952-41-001000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
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116-93-952-41-003000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
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116-93-952-41-006000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
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116-93-952-41-007000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
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116-93-952-41-008000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 52POS GOLD |
Produkt ist nicht verfügbar |
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116-93-964-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 64POS GOLD Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (2 x 32) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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116-93-964-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 64POS GOLD Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (2 x 32) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
||
116-93-964-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 64POS GOLD Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (2 x 32) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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116-93-964-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 64POS GOLD Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (2 x 32) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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116-93-964-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 64POS GOLD Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (2 x 32) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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121-13-210-41-001000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 10POS GOLD |
Produkt ist nicht verfügbar |
116-93-624-41-003000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
116-93-624-41-006000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
116-93-624-41-007000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
116-93-624-41-008000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
116-93-628-41-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
116-93-628-41-003000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
116-93-628-41-006000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
116-93-628-41-007000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
116-93-628-41-008000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
116-93-632-41-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
116-93-632-41-003000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
116-93-632-41-006000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)116-93-632-41-007000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
116-93-632-41-008000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
116-93-636-41-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
116-93-636-41-003000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
116-93-636-41-006000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
116-93-636-41-007000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
116-93-636-41-008000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
Produkt ist nicht verfügbar
116-93-640-41-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
116-93-640-41-003000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
116-93-640-41-006000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
116-93-640-41-007000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
116-93-640-41-008000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
116-93-642-41-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
116-93-642-41-003000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
116-93-642-41-006000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
116-93-642-41-007000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
116-93-642-41-008000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
Description: CONN IC DIP SOCKET 42POS GOLD
Produkt ist nicht verfügbar
116-93-648-41-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
116-93-648-41-003000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
116-93-648-41-006000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
116-93-648-41-007000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
116-93-648-41-008000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
116-93-650-41-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
116-93-650-41-003000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
116-93-650-41-006000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
116-93-650-41-007000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
116-93-650-41-008000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
116-93-652-41-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
116-93-652-41-003000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
116-93-652-41-006000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
116-93-652-41-007000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
116-93-652-41-008000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
116-93-950-41-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
116-93-950-41-003000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
116-93-950-41-006000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
116-93-950-41-007000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
116-93-950-41-008000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
Produkt ist nicht verfügbar
116-93-952-41-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
116-93-952-41-003000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
116-93-952-41-006000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
116-93-952-41-007000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
116-93-952-41-008000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
Produkt ist nicht verfügbar
116-93-964-41-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
116-93-964-41-003000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
116-93-964-41-006000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
116-93-964-41-007000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
116-93-964-41-008000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
121-13-210-41-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar