Produkte > MILL-MAX MANUFACTURING CORP. > Alle Produkte des Herstellers MILL-MAX MANUFACTURING CORP. (38410) > Seite 52 nach 641
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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9553-0-15-01-11-27-04-0 | Mill-Max Manufacturing Corp. | Description: CONN PIN RCPT .015-.020 HEX |
Produkt ist nicht verfügbar |
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9553-0-15-01-21-02-04-0 | Mill-Max Manufacturing Corp. |
Description: CONN PIN RCPT .015-.022 HEX Packaging: Bulk Contact Finish: Tin-Lead Flange Diameter: 0.055" (1.40mm) Length - Overall: 0.352" (8.94mm) Termination: Press-Fit, Hex Mounting Hole Diameter: 0.041" (1.04mm) Contact Finish Thickness: 100.0µin (2.54µm) Contact Material: Beryllium Copper Tail Type: Standard Tail Accepts Pin Diameter: 0.015" ~ 0.022" (0.38mm ~ 0.56mm) Pin Hole Diameter: 0.031" (0.79mm) Tail Diameter: 0.018" (0.46mm) Socket Depth: 0.154" (3.91mm) Part Status: Active |
Produkt ist nicht verfügbar |
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9553-0-15-15-21-27-04-0 | Mill-Max Manufacturing Corp. | Description: CONN RECEPT PIN .015-.022" .180" |
Produkt ist nicht verfügbar |
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9970-0-15-15-30-27-04-0 | Mill-Max Manufacturing Corp. | Description: CONN RECEPT PIN .015-.025" .120" |
Produkt ist nicht verfügbar |
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9976-0-00-01-00-00-03-0 | Mill-Max Manufacturing Corp. | Description: CONN PC PIN CIRC .018DIA TINLEAD |
Produkt ist nicht verfügbar |
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9976-0-00-15-00-00-03-0 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN CIRC 0.018DIA GOLD Packaging: Bulk Contact Finish: Gold Mounting Type: Through Hole Insulation: Non-Insulated Terminal Type: PC Pin Flange Diameter: 0.060" (1.52mm) Length - Overall: 0.240" (6.10mm) Termination: Press-Fit Mounting Hole Diameter: 0.038" (0.97mm) Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Brass Alloy Terminal Style: Single End Pin Size - Above Flange: 0.018" (0.46mm) Dia Pin Size - Below Flange: 0.030" (0.76mm) Dia Length - Above Flange: 0.205" (5.21mm) Part Status: Active |
auf Bestellung 1185 Stücke: Lieferzeit 21-28 Tag (e) |
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9976-0-00-21-00-00-03-0 | Mill-Max Manufacturing Corp. | Description: CONN PC PIN CIRC 0.018DIA GOLD |
Produkt ist nicht verfügbar |
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101-93-306-41-560000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 6POS GOLD |
Produkt ist nicht verfügbar |
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101-93-308-41-560000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 8POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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101-93-314-41-560000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 14POS GOLD |
Produkt ist nicht verfügbar |
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101-93-316-41-560000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 16POS GOLD |
Produkt ist nicht verfügbar |
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101-93-318-41-560000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 18POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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101-93-320-41-560000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 20POS GOLD |
Produkt ist nicht verfügbar |
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101-93-324-41-560000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 24POS GOLD |
Produkt ist nicht verfügbar |
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101-93-422-41-560000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 22POS GOLD |
auf Bestellung 486 Stücke: Lieferzeit 21-28 Tag (e) |
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101-93-624-41-560000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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101-93-628-41-560000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 28POS GOLD |
Produkt ist nicht verfügbar |
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101-93-632-41-560000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 32POS GOLD |
Produkt ist nicht verfügbar |
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101-93-640-41-560000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 40POS GOLD |
Produkt ist nicht verfügbar |
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104-13-210-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 10POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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104-13-210-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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104-13-304-41-770000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 4POS GOLD |
Produkt ist nicht verfügbar |
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104-13-304-41-780000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 4POS GOLD |
Produkt ist nicht verfügbar |
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104-13-306-41-770000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 6POS GOLD |
Produkt ist nicht verfügbar |
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104-13-306-41-780000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 6POS GOLD |
Produkt ist nicht verfügbar |
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104-13-308-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
auf Bestellung 50 Stücke: Lieferzeit 21-28 Tag (e) |
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104-13-308-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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104-13-310-41-770000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 10POS GOLD |
Produkt ist nicht verfügbar |
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104-13-310-41-780000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 10POS GOLD |
Produkt ist nicht verfügbar |
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104-13-314-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 14POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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104-13-314-41-780000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 14POS GOLD |
Produkt ist nicht verfügbar |
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104-13-316-41-770000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 16POS GOLD |
Produkt ist nicht verfügbar |
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104-13-316-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 16POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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104-13-318-41-770000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 18POS GOLD |
Produkt ist nicht verfügbar |
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104-13-318-41-780000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 18POS GOLD |
Produkt ist nicht verfügbar |
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104-13-320-41-770000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 20POS GOLD |
Produkt ist nicht verfügbar |
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104-13-320-41-780000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 20POS GOLD |
Produkt ist nicht verfügbar |
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104-13-322-41-770000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 22POS GOLD |
Produkt ist nicht verfügbar |
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104-13-322-41-780000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 22POS GOLD |
Produkt ist nicht verfügbar |
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104-13-324-41-770000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 24POS GOLD |
Produkt ist nicht verfügbar |
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104-13-324-41-780000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 24POS GOLD |
Produkt ist nicht verfügbar |
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104-13-328-41-770000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 28POS GOLD |
Produkt ist nicht verfügbar |
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104-13-328-41-780000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 28POS GOLD |
Produkt ist nicht verfügbar |
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104-13-420-41-770000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 20POS GOLD |
Produkt ist nicht verfügbar |
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104-13-420-41-780000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 20POS GOLD |
Produkt ist nicht verfügbar |
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104-13-422-41-770000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 22POS GOLD |
Produkt ist nicht verfügbar |
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104-13-422-41-780000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 22POS GOLD |
Produkt ist nicht verfügbar |
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104-13-424-41-770000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 24POS GOLD |
Produkt ist nicht verfügbar |
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104-13-424-41-780000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 24POS GOLD |
Produkt ist nicht verfügbar |
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104-13-428-41-770000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 28POS GOLD |
Produkt ist nicht verfügbar |
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104-13-428-41-780000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 28POS GOLD |
Produkt ist nicht verfügbar |
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104-13-432-41-770000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 32POS GOLD |
Produkt ist nicht verfügbar |
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104-13-432-41-780000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 32POS GOLD |
Produkt ist nicht verfügbar |
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104-13-624-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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104-13-624-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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104-13-628-41-770000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 28POS GOLD |
Produkt ist nicht verfügbar |
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104-13-628-41-780000 | Mill-Max Manufacturing Corp. | Description: CONN IC DIP SOCKET 28POS GOLD |
Produkt ist nicht verfügbar |
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104-13-632-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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104-13-632-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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104-13-636-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 36POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 36 (2 x 18) Termination: Press-Fit Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
9553-0-15-01-11-27-04-0 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN PIN RCPT .015-.020 HEX
Description: CONN PIN RCPT .015-.020 HEX
Produkt ist nicht verfügbar
9553-0-15-01-21-02-04-0 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN PIN RCPT .015-.022 HEX
Packaging: Bulk
Contact Finish: Tin-Lead
Flange Diameter: 0.055" (1.40mm)
Length - Overall: 0.352" (8.94mm)
Termination: Press-Fit, Hex
Mounting Hole Diameter: 0.041" (1.04mm)
Contact Finish Thickness: 100.0µin (2.54µm)
Contact Material: Beryllium Copper
Tail Type: Standard Tail
Accepts Pin Diameter: 0.015" ~ 0.022" (0.38mm ~ 0.56mm)
Pin Hole Diameter: 0.031" (0.79mm)
Tail Diameter: 0.018" (0.46mm)
Socket Depth: 0.154" (3.91mm)
Part Status: Active
Description: CONN PIN RCPT .015-.022 HEX
Packaging: Bulk
Contact Finish: Tin-Lead
Flange Diameter: 0.055" (1.40mm)
Length - Overall: 0.352" (8.94mm)
Termination: Press-Fit, Hex
Mounting Hole Diameter: 0.041" (1.04mm)
Contact Finish Thickness: 100.0µin (2.54µm)
Contact Material: Beryllium Copper
Tail Type: Standard Tail
Accepts Pin Diameter: 0.015" ~ 0.022" (0.38mm ~ 0.56mm)
Pin Hole Diameter: 0.031" (0.79mm)
Tail Diameter: 0.018" (0.46mm)
Socket Depth: 0.154" (3.91mm)
Part Status: Active
Produkt ist nicht verfügbar
9553-0-15-15-21-27-04-0 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RECEPT PIN .015-.022" .180"
Description: CONN RECEPT PIN .015-.022" .180"
Produkt ist nicht verfügbar
9970-0-15-15-30-27-04-0 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RECEPT PIN .015-.025" .120"
Description: CONN RECEPT PIN .015-.025" .120"
Produkt ist nicht verfügbar
9976-0-00-01-00-00-03-0 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC .018DIA TINLEAD
Description: CONN PC PIN CIRC .018DIA TINLEAD
Produkt ist nicht verfügbar
9976-0-00-15-00-00-03-0 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC 0.018DIA GOLD
Packaging: Bulk
Contact Finish: Gold
Mounting Type: Through Hole
Insulation: Non-Insulated
Terminal Type: PC Pin
Flange Diameter: 0.060" (1.52mm)
Length - Overall: 0.240" (6.10mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.038" (0.97mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Brass Alloy
Terminal Style: Single End
Pin Size - Above Flange: 0.018" (0.46mm) Dia
Pin Size - Below Flange: 0.030" (0.76mm) Dia
Length - Above Flange: 0.205" (5.21mm)
Part Status: Active
Description: CONN PC PIN CIRC 0.018DIA GOLD
Packaging: Bulk
Contact Finish: Gold
Mounting Type: Through Hole
Insulation: Non-Insulated
Terminal Type: PC Pin
Flange Diameter: 0.060" (1.52mm)
Length - Overall: 0.240" (6.10mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.038" (0.97mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Brass Alloy
Terminal Style: Single End
Pin Size - Above Flange: 0.018" (0.46mm) Dia
Pin Size - Below Flange: 0.030" (0.76mm) Dia
Length - Above Flange: 0.205" (5.21mm)
Part Status: Active
auf Bestellung 1185 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
15+ | 1.74 EUR |
18+ | 1.49 EUR |
100+ | 1.33 EUR |
1000+ | 0.97 EUR |
9976-0-00-21-00-00-03-0 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC 0.018DIA GOLD
Description: CONN PC PIN CIRC 0.018DIA GOLD
Produkt ist nicht verfügbar
101-93-306-41-560000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
101-93-308-41-560000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
101-93-314-41-560000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
101-93-316-41-560000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
101-93-318-41-560000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
101-93-320-41-560000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
101-93-324-41-560000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
101-93-422-41-560000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
auf Bestellung 486 Stücke:
Lieferzeit 21-28 Tag (e)101-93-624-41-560000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
101-93-628-41-560000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
101-93-632-41-560000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
101-93-640-41-560000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
Produkt ist nicht verfügbar
104-13-210-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
104-13-210-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
104-13-304-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 4POS GOLD
Description: CONN IC DIP SOCKET 4POS GOLD
Produkt ist nicht verfügbar
104-13-304-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 4POS GOLD
Description: CONN IC DIP SOCKET 4POS GOLD
Produkt ist nicht verfügbar
104-13-306-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
104-13-306-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Description: CONN IC DIP SOCKET 6POS GOLD
Produkt ist nicht verfügbar
104-13-308-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 50 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 39.36 EUR |
10+ | 34.9 EUR |
25+ | 33.55 EUR |
50+ | 32.21 EUR |
104-13-308-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
104-13-310-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
104-13-310-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
104-13-314-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
104-13-314-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
104-13-316-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
104-13-316-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
104-13-318-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
104-13-318-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
104-13-320-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
104-13-320-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
104-13-322-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
104-13-322-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
104-13-324-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
104-13-324-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
104-13-328-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
104-13-328-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
104-13-420-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
104-13-420-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
104-13-422-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
104-13-422-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
Produkt ist nicht verfügbar
104-13-424-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
104-13-424-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
Produkt ist nicht verfügbar
104-13-428-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
104-13-428-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
104-13-432-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
104-13-432-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
Produkt ist nicht verfügbar
104-13-624-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
104-13-624-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
104-13-628-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
104-13-628-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
Produkt ist nicht verfügbar
104-13-632-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
104-13-632-41-780000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
104-13-636-41-770000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 36POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar