Produkte > XIA
| Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis | ||||||
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| XIAG-M3SP-4GSJXCN9 | Advantech | MEMORY MODULE, INNO M3SP-4GSJXCN9 4GB DDR3-1333 SODIMM | Produkt ist nicht verfügbar | Im Einkaufswagen Stück im Wert von UAH | ||||||
| XIAMETER RTV-4230-E KIT,5.5KG-KIT | Dow Corning | 4107167 | Produkt ist nicht verfügbar | Im Einkaufswagen Stück im Wert von UAH | ||||||
| XIAO ESP32C3 | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-C3; WIFI; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Kit contents: prototype board; u.FL antenna Components: ESP32-C3 Interface: ADC; GPIO; I2C; I2S; SPI; UART Kind of connector: solder pads; U.FL; USB C socket Communictions protocol: WIFI Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: RISC-V Operating temperature: -40...85°C Memory: 400kB SRAM; 4MB FLASH Dimensions: 21x17.5mm WiFi: 2,4GHz Anzahl je Verpackung: 1 Stücke | auf Bestellung 89 Stücke: Lieferzeit 7-14 Tag (e) |
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| XIAO ESP32C3 | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-C3; WIFI; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Kit contents: prototype board; u.FL antenna Components: ESP32-C3 Interface: ADC; GPIO; I2C; I2S; SPI; UART Kind of connector: solder pads; U.FL; USB C socket Communictions protocol: WIFI Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: RISC-V Operating temperature: -40...85°C Memory: 400kB SRAM; 4MB FLASH Dimensions: 21x17.5mm WiFi: 2,4GHz | auf Bestellung 89 Stücke: Lieferzeit 14-21 Tag (e) |
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| XIAO ESP32S3 | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Kit contents: prototype board; u.FL antenna Components: ESP32-S3R8 Interface: ADC; GPIO; I2C; I2S; SPI; UART Kind of connector: solder pads; U.FL; USB C socket Communictions protocol: WIFI Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Xtensa LX7 Operating temperature: -40...65°C Memory: 8MB FLASH; 8MB SRAM Dimensions: 21x17.5mm WiFi: 2,4GHz | Produkt ist nicht verfügbar | Im Einkaufswagen Stück im Wert von UAH | ||||||
| XIAO ESP32S3 | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Kit contents: prototype board; u.FL antenna Components: ESP32-S3R8 Interface: ADC; GPIO; I2C; I2S; SPI; UART Kind of connector: solder pads; U.FL; USB C socket Communictions protocol: WIFI Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Xtensa LX7 Operating temperature: -40...65°C Memory: 8MB FLASH; 8MB SRAM Dimensions: 21x17.5mm WiFi: 2,4GHz Anzahl je Verpackung: 1 Stücke | Produkt ist nicht verfügbar | Im Einkaufswagen Stück im Wert von UAH | ||||||
| XIAO ESP32S3SEEED STUDIO Produktcode: 208715
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Lieblingsprodukt
| Gehäuse, Halter, Montage- und Installationselemente > Antennen | Produkt ist nicht verfügbar | Im Einkaufswagen Stück im Wert von UAH | |||||||
| XIAO ESP32S3 SENSE | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Kit contents: camera; prototype board; u.FL antenna Components: ESP32-S3R8 Interface: ADC; GPIO; I2C; I2S; SPI; UART Kind of connector: SD; solder pads; U.FL; USB C socket Communictions protocol: WIFI Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Xtensa LX7 Operating temperature: -40...65°C Memory: 8MB FLASH; 8MB SRAM Dimensions: 21x17.5mm WiFi: 2,4GHz Anzahl je Verpackung: 1 Stücke | auf Bestellung 29 Stücke: Lieferzeit 7-14 Tag (e) |
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| XIAO ESP32S3 SENSE | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Kit contents: camera; prototype board; u.FL antenna Components: ESP32-S3R8 Interface: ADC; GPIO; I2C; I2S; SPI; UART Kind of connector: SD; solder pads; U.FL; USB C socket Communictions protocol: WIFI Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Xtensa LX7 Operating temperature: -40...65°C Memory: 8MB FLASH; 8MB SRAM Dimensions: 21x17.5mm WiFi: 2,4GHz | auf Bestellung 29 Stücke: Lieferzeit 14-21 Tag (e) |
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| XIAO ESP32S3 SENSE Produktcode: 206081
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Lieblingsprodukt
| Gehäuse, Halter, Montage- und Installationselemente > Antennen | Produkt ist nicht verfügbar | Im Einkaufswagen Stück im Wert von UAH | |||||||
| XIAO NRF52840 | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; prototype board; NFC; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Kit contents: prototype board Components: nRF52840 Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART Kind of connector: solder pads; USB C socket Communictions protocol: NFC Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Cortex M4 Memory: 256kB SRAM; 2MB FLASH Dimensions: 21x17.5mm Anzahl je Verpackung: 1 Stücke | auf Bestellung 14 Stücke: Lieferzeit 7-14 Tag (e) |
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| XIAO NRF52840 | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; prototype board; NFC; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Kit contents: prototype board Components: nRF52840 Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART Kind of connector: solder pads; USB C socket Communictions protocol: NFC Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Cortex M4 Memory: 256kB SRAM; 2MB FLASH Dimensions: 21x17.5mm | auf Bestellung 14 Stücke: Lieferzeit 14-21 Tag (e) |
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| XIAO NRF52840 SENSE | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; prototype board; NFC; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Kit contents: prototype board Components: nRF52840 Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART Kind of connector: solder pads; USB C socket Communictions protocol: NFC Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Cortex M4 Memory: 256kB SRAM; 2MB FLASH Dimensions: 21x17.5mm Kind of sensor: accelerometer; gyroscope Programmers and development kits features: MEMS microphone | auf Bestellung 13 Stücke: Lieferzeit 14-21 Tag (e) |
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| XIAO NRF52840 SENSE | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; prototype board; NFC; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Kit contents: prototype board Components: nRF52840 Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART Kind of connector: solder pads; USB C socket Communictions protocol: NFC Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Cortex M4 Memory: 256kB SRAM; 2MB FLASH Dimensions: 21x17.5mm Kind of sensor: accelerometer; gyroscope Programmers and development kits features: MEMS microphone Anzahl je Verpackung: 1 Stücke | auf Bestellung 13 Stücke: Lieferzeit 7-14 Tag (e) |
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| XIAO RP2040 | SEEED STUDIO | Category: Development kits - others Description: Dev.kit: evaluation; prototype board; Comp: RP2040; XIAO; PIN: 2x7 Type of development kit: evaluation Kit contents: prototype board Components: RP2040 Interface: GPIO; I2C; SPI; SWD; UART Kind of connector: solder pads; USB C socket Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Cortex M0+ Memory: 264kB SRAM; 2MB FLASH Dimensions: 21x17.5mm Anzahl je Verpackung: 1 Stücke | auf Bestellung 17 Stücke: Lieferzeit 7-14 Tag (e) |
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| XIAO RP2040 | SEEED STUDIO | Category: Development kits - others Description: Dev.kit: evaluation; prototype board; Comp: RP2040; XIAO; PIN: 2x7 Type of development kit: evaluation Kit contents: prototype board Components: RP2040 Interface: GPIO; I2C; SPI; SWD; UART Kind of connector: solder pads; USB C socket Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Cortex M0+ Memory: 264kB SRAM; 2MB FLASH Dimensions: 21x17.5mm | auf Bestellung 17 Stücke: Lieferzeit 14-21 Tag (e) |
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| XIAO STARTER KIT | SEEED STUDIO | Category: Development kits - others Description: Dev.kit: XIAO Starter Kit; XIAO Type of development kit: XIAO Starter Kit Kit contents: accelerometer module; ambient light sensor; infrared sensor module; LED strip (50xRGB); motion sensor (PIR) module; rotation sensor module; servo; set of diodes; temperature and humidity sensor module; USB cable; wire jumpers Manufacturer series: XIAO | auf Bestellung 5 Stücke: Lieferzeit 14-21 Tag (e) |
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| XIAO STARTER KIT | SEEED STUDIO | Category: Development kits - others Description: Dev.kit: XIAO Starter Kit; XIAO Type of development kit: XIAO Starter Kit Kit contents: accelerometer module; ambient light sensor; infrared sensor module; LED strip (50xRGB); motion sensor (PIR) module; rotation sensor module; servo; set of diodes; temperature and humidity sensor module; USB cable; wire jumpers Manufacturer series: XIAO Anzahl je Verpackung: 1 Stücke | auf Bestellung 5 Stücke: Lieferzeit 7-14 Tag (e) |
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