Produkte > XIA
| Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis ohne MwSt | ||||
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| XIAG-M3SP-4GSJXCN9 | Advantech | MEMORY MODULE, INNO M3SP-4GSJXCN9 4GB DDR3-1333 SODIMM | Produkt ist nicht verfügbar | |||||
| XIAMETER RTV-4230-E KIT,5.5KG-KIT | Dow Corning | 4107167 | Produkt ist nicht verfügbar | |||||
| XIAO ESP32C3 | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; ADC,GPIO,I2C,I2S,SPI,UART; ESP32-C3; XIAO Type of development kit: evaluation Interface: ADC; GPIO; I2C; I2S; SPI; UART Memory: 192kB SRAM; 400kB SRAM; 4MB FLASH Components: ESP32-C3 Kind of connector: solder pads; U.FL; USB C socket Kit contents: prototype board; u.FL antenna Communictions protocol: Bluetooth 5.0; WIFI Dimensions: 21x17.5mm Manufacturer series: XIAO Operating temperature: -40...85°C Kind of architecture: RISC-V Number of pins: 2x 7 Anzahl je Verpackung: 1 Stücke | Produkt ist nicht verfügbar | |||||
| XIAO ESP32C3 | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; ADC,GPIO,I2C,I2S,SPI,UART; ESP32-C3; XIAO Type of development kit: evaluation Interface: ADC; GPIO; I2C; I2S; SPI; UART Memory: 192kB SRAM; 400kB SRAM; 4MB FLASH Components: ESP32-C3 Kind of connector: solder pads; U.FL; USB C socket Kit contents: prototype board; u.FL antenna Communictions protocol: Bluetooth 5.0; WIFI Dimensions: 21x17.5mm Manufacturer series: XIAO Operating temperature: -40...85°C Kind of architecture: RISC-V Number of pins: 2x 7 | Produkt ist nicht verfügbar | |||||
| XIAO ESP32S3 | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; ADC,GPIO,I2C,I2S,SPI,UART; ESP32-S3R8; XIAO Type of development kit: evaluation Interface: ADC; GPIO; I2C; I2S; SPI; UART Memory: 192kB SRAM; 8MB FLASH; 8MB PSRAM Components: ESP32-S3R8 Kind of connector: solder pads; U.FL; USB C socket Kit contents: prototype board; u.FL antenna Communictions protocol: Bluetooth 5.0; WIFI Dimensions: 21x17.5mm Manufacturer series: XIAO Operating temperature: -40...65°C Kind of architecture: Xtensa LX7 Number of pins: 2x 7 Anzahl je Verpackung: 1 Stücke | Produkt ist nicht verfügbar | |||||
| XIAO ESP32S3 | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; ADC,GPIO,I2C,I2S,SPI,UART; ESP32-S3R8; XIAO Type of development kit: evaluation Interface: ADC; GPIO; I2C; I2S; SPI; UART Memory: 192kB SRAM; 8MB FLASH; 8MB PSRAM Components: ESP32-S3R8 Kind of connector: solder pads; U.FL; USB C socket Kit contents: prototype board; u.FL antenna Communictions protocol: Bluetooth 5.0; WIFI Dimensions: 21x17.5mm Manufacturer series: XIAO Operating temperature: -40...65°C Kind of architecture: Xtensa LX7 Number of pins: 2x 7 | Produkt ist nicht verfügbar | |||||
| XIAO ESP32S3 SENSE | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; ADC,GPIO,I2C,I2S,SPI,UART; ESP32-S3R8; XIAO Type of development kit: evaluation Interface: ADC; GPIO; I2C; I2S; SPI; UART Memory: 32kB SRAM; 8MB FLASH; 8MB PSRAM Components: ESP32-S3R8 Kind of connector: SD; solder pads; U.FL; USB C socket Kit contents: camera; prototype board; u.FL antenna Communictions protocol: Bluetooth 5.0; WIFI Dimensions: 21x17.5mm Manufacturer series: XIAO Operating temperature: -40...65°C Kind of architecture: Xtensa LX7 Number of pins: 2x 7 | auf Bestellung 2 Stücke: Lieferzeit 14-21 Tag (e) |
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| XIAO ESP32S3 SENSE | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; ADC,GPIO,I2C,I2S,SPI,UART; ESP32-S3R8; XIAO Type of development kit: evaluation Interface: ADC; GPIO; I2C; I2S; SPI; UART Memory: 32kB SRAM; 8MB FLASH; 8MB PSRAM Components: ESP32-S3R8 Kind of connector: SD; solder pads; U.FL; USB C socket Kit contents: camera; prototype board; u.FL antenna Communictions protocol: Bluetooth 5.0; WIFI Dimensions: 21x17.5mm Manufacturer series: XIAO Operating temperature: -40...65°C Kind of architecture: Xtensa LX7 Number of pins: 2x 7 Anzahl je Verpackung: 1 Stücke | auf Bestellung 2 Stücke: Lieferzeit 7-14 Tag (e) |
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| XIAO NRF52840 | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; ADC,GPIO,I2C,NFC,SPI,SWD,UART; nRF52840 Type of development kit: evaluation Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART Memory: 256kB SRAM; 2MB FLASH Components: nRF52840 Kind of connector: solder pads; USB C socket Kit contents: prototype board Communictions protocol: Bluetooth 5.0; NFC Dimensions: 21x17.5mm Manufacturer series: XIAO Kind of architecture: Cortex M4 Number of pins: 2x 7 Anzahl je Verpackung: 1 Stücke | Produkt ist nicht verfügbar | |||||
| XIAO NRF52840 | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; ADC,GPIO,I2C,NFC,SPI,SWD,UART; nRF52840 Type of development kit: evaluation Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART Memory: 256kB SRAM; 2MB FLASH Components: nRF52840 Kind of connector: solder pads; USB C socket Kit contents: prototype board Communictions protocol: Bluetooth 5.0; NFC Dimensions: 21x17.5mm Manufacturer series: XIAO Kind of architecture: Cortex M4 Number of pins: 2x 7 | Produkt ist nicht verfügbar | |||||
| XIAO NRF52840 SENSE | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; ADC,GPIO,I2C,NFC,SPI,SWD,UART; nRF52840 Type of development kit: evaluation Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART Memory: 256kB SRAM; 2MB FLASH Components: nRF52840 Kind of connector: solder pads; USB C socket Kit contents: prototype board Communictions protocol: Bluetooth 5.0; NFC Programmers and development kits features: MEMS microphone Dimensions: 21x17.5mm Manufacturer series: XIAO Kind of architecture: Cortex M4 Number of pins: 2x 7 Kind of sensor: accelerometer; gyroscope | Produkt ist nicht verfügbar | |||||
| XIAO NRF52840 SENSE | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; ADC,GPIO,I2C,NFC,SPI,SWD,UART; nRF52840 Type of development kit: evaluation Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART Memory: 256kB SRAM; 2MB FLASH Components: nRF52840 Kind of connector: solder pads; USB C socket Kit contents: prototype board Communictions protocol: Bluetooth 5.0; NFC Programmers and development kits features: MEMS microphone Dimensions: 21x17.5mm Manufacturer series: XIAO Kind of architecture: Cortex M4 Number of pins: 2x 7 Kind of sensor: accelerometer; gyroscope Anzahl je Verpackung: 1 Stücke | Produkt ist nicht verfügbar | |||||
| XIAO RP2040 | SEEED STUDIO | Category: Development kits - others Description: Dev.kit: evaluation; solder pads,USB C socket; PIN: 2x7; XIAO Type of development kit: evaluation Kind of connector: solder pads; USB C socket Interface: GPIO; I2C; SPI; SWD; UART Memory: 192kB SRAM; 264kB SRAM; 2MB FLASH Number of pins: 2x 7 Dimensions: 21x17.5mm Kit contents: prototype board Components: RP2040 Manufacturer series: XIAO Kind of architecture: Cortex M0+ Anzahl je Verpackung: 1 Stücke | Produkt ist nicht verfügbar | |||||
| XIAO RP2040 | SEEED STUDIO | Category: Development kits - others Description: Dev.kit: evaluation; solder pads,USB C socket; PIN: 2x7; XIAO Type of development kit: evaluation Kind of connector: solder pads; USB C socket Interface: GPIO; I2C; SPI; SWD; UART Memory: 192kB SRAM; 264kB SRAM; 2MB FLASH Number of pins: 2x 7 Dimensions: 21x17.5mm Kit contents: prototype board Components: RP2040 Manufacturer series: XIAO Kind of architecture: Cortex M0+ | Produkt ist nicht verfügbar | |||||
| XIAO STARTER KIT | SEEED STUDIO | Category: Development kits - others Description: Dev.kit: XIAO Starter Kit; XIAO Kit contents: accelerometer module; ambient light sensor; infrared sensor module; LED strip (50xRGB); motion sensor (PIR) module; rotation sensor module; servo; set of diodes; temperature and humidity sensor module; USB cable; wire jumpers Manufacturer series: XIAO Type of development kit: XIAO Starter Kit Anzahl je Verpackung: 1 Stücke | auf Bestellung 5 Stücke: Lieferzeit 7-14 Tag (e) |
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| XIAO STARTER KIT | SEEED STUDIO | Category: Development kits - others Description: Dev.kit: XIAO Starter Kit; XIAO Kit contents: accelerometer module; ambient light sensor; infrared sensor module; LED strip (50xRGB); motion sensor (PIR) module; rotation sensor module; servo; set of diodes; temperature and humidity sensor module; USB cable; wire jumpers Manufacturer series: XIAO Type of development kit: XIAO Starter Kit | auf Bestellung 5 Stücke: Lieferzeit 14-21 Tag (e) |
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