Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35546) > Seite 126 nach 593
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MCF53281CVM240 | NXP USA Inc. |
 Description: IC MCU 32BIT ROMLESS 256MAPBGAPackaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 240MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, LCD, PWM, WDT Supplier Device Package: 256-MAPBGA (17x17) Number of I/O: 94 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF53721CVM240 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 196MAPBGA |
Produkt ist nicht verfügbar |
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MCF54450VM240 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256MAPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 240MHz RAM Size: 32K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 256-MAPBGA (17x17) Part Status: Active Number of I/O: 132 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF54451CVM180 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256MAPBGA |
Produkt ist nicht verfügbar |
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MCF54451VM240 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256MAPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 240MHz RAM Size: 32K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Connectivity: I²C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 256-MAPBGA (17x17) Part Status: Active Number of I/O: 132 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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mcf54452cvr200 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360TEPBGA |
Produkt ist nicht verfügbar |
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MCF54452VR266 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360TEPBGA Packaging: Tray Package / Case: 360-BBGA Mounting Type: Surface Mount Speed: 266MHz RAM Size: 32K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Connectivity: I2C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 360-TEPBGA (23x23) Number of I/O: 132 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF54453CVR200 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360TEPBGA Packaging: Tray Package / Case: 360-BBGA Mounting Type: Surface Mount Speed: 200MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Connectivity: I²C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 360-TEPBGA (23x23) Part Status: Obsolete Number of I/O: 132 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF54453VR266 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360TEPBGA Packaging: Tray Package / Case: 360-BBGA Mounting Type: Surface Mount Speed: 266MHz RAM Size: 32K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V Connectivity: I²C, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 360-TEPBGA (23x23) Number of I/O: 132 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF54454VR266 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360TEPBGA |
Produkt ist nicht verfügbar |
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MCF54455VR266 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 360TEPBGA |
Produkt ist nicht verfügbar |
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MCHC908QY2CDWER | NXP USA Inc. |
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-SOIC Number of I/O: 13 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCIMX27ADSE | NXP USA Inc. |
Description: I.MX27 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), LCD, Power Supply, Accessories Core Processor: ARM9 Utilized IC / Part: i.MX27 |
Produkt ist nicht verfügbar |
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MCIMX27LVOP4AR2 | NXP USA Inc. |
Description: IC MPU I.MX27 400MHZ 404LFBGA Packaging: Tape & Reel (TR) Package / Case: 404-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -20°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V Supplier Device Package: 404-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SAHARAH2 RAM Controllers: DDR Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART Part Status: Not For New Designs |
Produkt ist nicht verfügbar |
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MCIMX27VOP4A | NXP USA Inc. |
 Description: IC MPU I.MX27 400MHZ 404LFBGAPackaging: Tray Package / Case: 404-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -20°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V Supplier Device Package: 404-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SAHARAH2 RAM Controllers: DDR Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART |
auf Bestellung 652 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX27VOP4AR2 | NXP USA Inc. |
Description: IC MPU I.MX27 400MHZ 404LFBGA Packaging: Tape & Reel (TR) Package / Case: 404-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -20°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V Supplier Device Package: 404-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SAHARAH2 RAM Controllers: DDR Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory |
Produkt ist nicht verfügbar |
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| MCIMX31ADSE/C | NXP USA Inc. |
Description: I.MX31 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM11 Utilized IC / Part: i.MX31 |
Produkt ist nicht verfügbar |
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MCIMX31VKN5C | NXP USA Inc. |
Description: IC MPU I.MX31 532MHZ 457MAPBGA |
Produkt ist nicht verfügbar |
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MCZ33793AEF | NXP USA Inc. |
Description: IC DSI SLAVE SENSOR 16-SOIC Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Logic Mounting Type: Surface Mount Type: Sensor Interface Operating Temperature: -40°C ~ 150°C Input Type: Logic Supplier Device Package: 16-SOIC Part Status: Active Current - Supply: 250 mA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCZ33793AEFR2 | NXP USA Inc. |
Description: IC DSI SLAVE SENSOR 16-SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Logic Mounting Type: Surface Mount Type: Sensor Interface Operating Temperature: -40°C ~ 150°C Input Type: Logic Supplier Device Package: 16-SOIC Current - Supply: 250 mA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCZ33879EK | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC |
Produkt ist nicht verfügbar |
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MCZ33879EKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC |
Produkt ist nicht verfügbar |
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MCZ33880EW | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC Packaging: Tube Package / Case: 32-BSSOP (0.295", 7.50mm Width) Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 8 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: High Side or Low Side Rds On (Typ): 550mOhm Voltage - Load: 5.5V ~ 24.5V Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Current - Output (Max): 800mA Ratio - Input:Output: 1:8 Supplier Device Package: 32-SOIC Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MCZ33880EWR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 8 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: High Side or Low Side Rds On (Typ): 550mOhm Voltage - Load: 5.5V ~ 24.5V Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Current - Output (Max): 800mA Ratio - Input:Output: 1:8 Supplier Device Package: 32-SOIC Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MCZ33897DEF | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 12V Number of Drivers/Receivers: 1/1 Data Rate: 83.33Kbps Protocol: CANbus Supplier Device Package: 8-SOIC Receiver Hysteresis: 500 mV Duplex: Half |
Produkt ist nicht verfügbar |
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MCZ33897DEFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOIC |
Produkt ist nicht verfügbar |
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MCZ33897TEFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOIC Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 12V Number of Drivers/Receivers: 1/1 Data Rate: 83.33Kbps Protocol: CANbus Supplier Device Package: 14-SOIC Receiver Hysteresis: 500 mV Duplex: Half Part Status: Active |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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MCZ33972AEK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 8V ~ 26V Applications: Switch Monitoring Supplier Device Package: 32-SOIC-EP |
Produkt ist nicht verfügbar |
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MCZ33972AEW | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 8V ~ 26V Applications: Switch Monitoring Supplier Device Package: 32-SOIC |
Produkt ist nicht verfügbar |
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MCZ33972AEWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 8V ~ 26V Applications: Switch Monitoring Supplier Device Package: 32-SOIC |
Produkt ist nicht verfügbar |
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MCZ33975EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 28V Supplier Device Package: 32-SOIC-EP Grade: Automotive |
Produkt ist nicht verfügbar |
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MCZ33975EKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 28V Supplier Device Package: 32-SOIC-EP Grade: Automotive |
Produkt ist nicht verfügbar |
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MCZ33991EG | NXP USA Inc. |
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC Packaging: Tube Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 40mA Interface: SPI Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Half Bridge (8) Voltage - Supply: 4.5V ~ 5.5V Voltage - Load: 6.5V ~ 26V Supplier Device Package: 24-SOIC Motor Type - Stepper: Bipolar Grade: Automotive |
Produkt ist nicht verfügbar |
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MCZ33991EGR2 | NXP USA Inc. |
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC Packaging: Tape & Reel (TR) Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 40mA Interface: SPI Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Half Bridge (8) Voltage - Supply: 4.5V ~ 5.5V Voltage - Load: 6.5V ~ 26V Supplier Device Package: 24-SOIC Motor Type - Stepper: Bipolar Grade: Automotive |
Produkt ist nicht verfügbar |
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MCZ33993EW | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC |
Produkt ist nicht verfügbar |
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MCZ33993EWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC |
Produkt ist nicht verfügbar |
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| MFR4300FRDC | NXP USA Inc. |
Description: FRDC FLEXRAY DAUGHTER CARD Packaging: Bulk For Use With/Related Products: HCS12XEVB Accessory Type: Daughter Board |
Produkt ist nicht verfügbar |
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| MFR4310FRDC | NXP USA Inc. |
Description: FRDC FLEXRAY DAUGHTER CARD Packaging: Bulk For Use With/Related Products: EVB9S12XDP512 Accessory Type: Daughter Board Utilized IC / Part: EVB9S12XDP512 |
Produkt ist nicht verfügbar |
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MMA7330LR1 | NXP USA Inc. |
Description: ACCELEROMETER 4-12G ANALOG 14LGA Features: Selectable Scale, Sleep Mode Packaging: Tape & Reel (TR) Package / Case: 14-TFLGA Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: X, Y, Z Acceleration Range: ±4g, 12g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.2V ~ 3.6V Bandwidth: 400Hz (X,Y), 300Hz (Z) Supplier Device Package: 14-LGA (3x5) Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g) |
Produkt ist nicht verfügbar |
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MMA7360LR1 | NXP USA Inc. |
Description: ACCEL 1.5-6G ANALOG 14LGA Features: Selectable Scale, Sleep Mode Packaging: Tape & Reel (TR) Package / Case: 14-TFLGA Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: X, Y, Z Acceleration Range: ±1.5g, 6g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.2V ~ 3.6V Bandwidth: 400Hz (X,Y), 300Hz (Z) Supplier Device Package: 14-LGA (3x5) Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g) |
Produkt ist nicht verfügbar |
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MMA7455LR1 | NXP USA Inc. |
Description: ACCELEROMETER 2-8G I2C/SPI 14LGA Features: Adjustable Bandwidth, Selectable Scale Packaging: Tape & Reel (TR) Package / Case: 14-TFLGA Output Type: I2C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Bandwidth: 62.5Hz ~ 125Hz Supplier Device Package: 14-LGA (3x5) Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g) |
Produkt ist nicht verfügbar |
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MMA7455LR2 | NXP USA Inc. |
Description: ACCELEROMETER 2-8G I2C/SPI 14LGA Features: Adjustable Bandwidth, Selectable Scale Packaging: Tape & Reel (TR) Package / Case: 14-TFLGA Output Type: I2C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Bandwidth: 62.5Hz ~ 125Hz Supplier Device Package: 14-LGA (3x5) Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g) |
Produkt ist nicht verfügbar |
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MMA7455LT | NXP USA Inc. |
Description: ACCELEROMETER 2-8G I2C/SPI 14LGA Features: Adjustable Bandwidth, Selectable Scale Packaging: Tray Package / Case: 14-TFLGA Output Type: I2C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Bandwidth: 62.5Hz ~ 125Hz Supplier Device Package: 14-LGA (3x5) Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g) |
Produkt ist nicht verfügbar |
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MMG3006NT1 | NXP USA Inc. |
Description: IC AMP CELL 400MHZ-2.4GHZ 16QFN Packaging: Tape & Reel (TR) Package / Case: 16-VQFN Exposed Pad Mounting Type: Surface Mount Frequency: 400MHz ~ 2.4GHz RF Type: Cellular, PCS, PHS, WLL Voltage - Supply: 5V Gain: 17.5dB Current - Supply: 850mA Noise Figure: 6.6dB P1dB: 33dBm Test Frequency: 900MHz Supplier Device Package: 16-QFN (4x4) Part Status: Active |
Produkt ist nicht verfügbar |
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| MOD5270BXX | NXP USA Inc. |
Description: IC MOD COLDFIRE 95MHZ 2.064MB Packaging: Bulk Connector Type: RJ-45, 2x50 Header Size / Dimension: 2.600" L x 2.000" W (66.04mm x 50.80mm) Speed: 95MHz RAM Size: 2.064MB Operating Temperature: 0°C ~ 70°C Module/Board Type: MCU, Ethernet Core Core Processor: ColdFire 5270 Flash Size: 512KB |
Produkt ist nicht verfügbar |
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| MPC5510KIT208 | NXP USA Inc. |
Description: MPC5510 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Utilized IC / Part: MPC5510 |
Produkt ist nicht verfügbar |
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| MPC5553EVB | NXP USA Inc. |
Description: MPC5553 EVAL BRD |
Produkt ist nicht verfügbar |
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| MPC5553EVBGHS | NXP USA Inc. |
Description: MPC5553 EVAL BRD |
Produkt ist nicht verfügbar |
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| MPC5553EVBISYS | NXP USA Inc. |
Description: MPC5553 EVAL BRD |
Produkt ist nicht verfügbar |
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MPC5553MZP132 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 416PBGA Packaging: Tray Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 132MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 416-PBGA (27x27) Number of I/O: 220 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MPC5553MZQ132 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 324PBGA Packaging: Tray Package / Case: 324-BBGA Mounting Type: Surface Mount Speed: 132MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 324-PBGA (23x23) Number of I/O: 220 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MPC5554EVB | NXP USA Inc. |
Description: MPC5554 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Utilized IC / Part: MPC5554 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
 |
MPC5554EVBGHS | NXP USA Inc. |
Description: MPC5554 EVAL BRD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC5554EVBISYS | NXP USA Inc. |
Description: MPC5554 EVAL BRD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC5554INT | NXP USA Inc. |
Description: MPC5554 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Utilized IC / Part: MPC5554 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
| MPC5561EVB | NXP USA Inc. |
Description: MPC5561 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Utilized IC / Part: MPC5561 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
 |
MPC5566EVB | NXP USA Inc. |
Description: MPC5566 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5566 Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
|
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| MPC5567EVB | NXP USA Inc. |
Description: MPC5567 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), Power Supply, USB Multilink Programmer Core Processor: e200 Utilized IC / Part: MPC5567 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
 |
MPC7410HX400LE | NXP USA Inc. |
Description: IC MPU MPC74XX 400MHZ 360CBGA Packaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 360-CBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
 |
MPC8260ADS-TCOM | NXP USA Inc. |
Description: BOARD DEV ADS POWERQUICC II Packaging: Bulk For Use With/Related Products: 8260ADS Accessory Type: Interface Board Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MCF53281CVM240 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 94
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 94
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF53721CVM240 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF54450VM240 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Active
Number of I/O: 132
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Active
Number of I/O: 132
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF54451CVM180 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF54451VM240 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I²C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Active
Number of I/O: 132
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I²C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Active
Number of I/O: 132
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| mcf54452cvr200 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF54452VR266 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-TEPBGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-TEPBGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF54453CVR200 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I²C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-TEPBGA (23x23)
Part Status: Obsolete
Number of I/O: 132
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I²C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-TEPBGA (23x23)
Part Status: Obsolete
Number of I/O: 132
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF54453VR266 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I²C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-TEPBGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I²C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-TEPBGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF54454VR266 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF54455VR266 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Description: IC MCU 32BIT ROMLESS 360TEPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCHC908QY2CDWER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX27ADSE |
|
Hersteller: NXP USA Inc.
Description: I.MX27 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), LCD, Power Supply, Accessories
Core Processor: ARM9
Utilized IC / Part: i.MX27
Description: I.MX27 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), LCD, Power Supply, Accessories
Core Processor: ARM9
Utilized IC / Part: i.MX27
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX27LVOP4AR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX27 400MHZ 404LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 404-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 404-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Part Status: Not For New Designs
Description: IC MPU I.MX27 400MHZ 404LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 404-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 404-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Part Status: Not For New Designs
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX27VOP4A | |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX27 400MHZ 404LFBGA
Packaging: Tray
Package / Case: 404-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 404-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
Description: IC MPU I.MX27 400MHZ 404LFBGA
Packaging: Tray
Package / Case: 404-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 404-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Additional Interfaces: 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
auf Bestellung 652 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 53.22 EUR |
| 10+ | 43.39 EUR |
| 25+ | 41.72 EUR |
| MCIMX27VOP4AR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX27 400MHZ 404LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 404-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 404-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Description: IC MPU I.MX27 400MHZ 404LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 404-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -20°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 404-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SAHARAH2
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX31ADSE/C |
Hersteller: NXP USA Inc.
Description: I.MX31 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM11
Utilized IC / Part: i.MX31
Description: I.MX31 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM11
Utilized IC / Part: i.MX31
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX31VKN5C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX31 532MHZ 457MAPBGA
Description: IC MPU I.MX31 532MHZ 457MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33793AEF |
|
Hersteller: NXP USA Inc.
Description: IC DSI SLAVE SENSOR 16-SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 150°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Part Status: Active
Current - Supply: 250 mA
DigiKey Programmable: Not Verified
Description: IC DSI SLAVE SENSOR 16-SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 150°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Part Status: Active
Current - Supply: 250 mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33793AEFR2 |
|
Hersteller: NXP USA Inc.
Description: IC DSI SLAVE SENSOR 16-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 150°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 250 mA
DigiKey Programmable: Not Verified
Description: IC DSI SLAVE SENSOR 16-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 150°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 250 mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33879EK |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33879EKR2 |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33880EW |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side or Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 5.5V ~ 24.5V
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Current - Output (Max): 800mA
Ratio - Input:Output: 1:8
Supplier Device Package: 32-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side or Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 5.5V ~ 24.5V
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Current - Output (Max): 800mA
Ratio - Input:Output: 1:8
Supplier Device Package: 32-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Part Status: Obsolete
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| MCZ33880EWR2 |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side or Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 5.5V ~ 24.5V
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Current - Output (Max): 800mA
Ratio - Input:Output: 1:8
Supplier Device Package: 32-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side or Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 5.5V ~ 24.5V
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Current - Output (Max): 800mA
Ratio - Input:Output: 1:8
Supplier Device Package: 32-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Part Status: Obsolete
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| MCZ33897DEF |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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| MCZ33897DEFR2 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Produkt ist nicht verfügbar
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| MCZ33897TEFR2 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Part Status: Active
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Part Status: Active
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2500+ | 2.83 EUR |
| MCZ33972AEK |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 8V ~ 26V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 8V ~ 26V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MCZ33972AEW |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 8V ~ 26V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 8V ~ 26V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
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Im Einkaufswagen
Stück im Wert von UAH
| MCZ33972AEWR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 8V ~ 26V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 8V ~ 26V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33975EK |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 28V
Supplier Device Package: 32-SOIC-EP
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 28V
Supplier Device Package: 32-SOIC-EP
Grade: Automotive
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33975EKR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 28V
Supplier Device Package: 32-SOIC-EP
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 28V
Supplier Device Package: 32-SOIC-EP
Grade: Automotive
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MCZ33991EG |
|
Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 40mA
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 4.5V ~ 5.5V
Voltage - Load: 6.5V ~ 26V
Supplier Device Package: 24-SOIC
Motor Type - Stepper: Bipolar
Grade: Automotive
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 40mA
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 4.5V ~ 5.5V
Voltage - Load: 6.5V ~ 26V
Supplier Device Package: 24-SOIC
Motor Type - Stepper: Bipolar
Grade: Automotive
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| MCZ33991EGR2 |
|
Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 40mA
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 4.5V ~ 5.5V
Voltage - Load: 6.5V ~ 26V
Supplier Device Package: 24-SOIC
Motor Type - Stepper: Bipolar
Grade: Automotive
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 40mA
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 4.5V ~ 5.5V
Voltage - Load: 6.5V ~ 26V
Supplier Device Package: 24-SOIC
Motor Type - Stepper: Bipolar
Grade: Automotive
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MCZ33993EW |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Produkt ist nicht verfügbar
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| MCZ33993EWR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Produkt ist nicht verfügbar
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| MFR4300FRDC |
Hersteller: NXP USA Inc.
Description: FRDC FLEXRAY DAUGHTER CARD
Packaging: Bulk
For Use With/Related Products: HCS12XEVB
Accessory Type: Daughter Board
Description: FRDC FLEXRAY DAUGHTER CARD
Packaging: Bulk
For Use With/Related Products: HCS12XEVB
Accessory Type: Daughter Board
Produkt ist nicht verfügbar
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| MFR4310FRDC |
Hersteller: NXP USA Inc.
Description: FRDC FLEXRAY DAUGHTER CARD
Packaging: Bulk
For Use With/Related Products: EVB9S12XDP512
Accessory Type: Daughter Board
Utilized IC / Part: EVB9S12XDP512
Description: FRDC FLEXRAY DAUGHTER CARD
Packaging: Bulk
For Use With/Related Products: EVB9S12XDP512
Accessory Type: Daughter Board
Utilized IC / Part: EVB9S12XDP512
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MMA7330LR1 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 4-12G ANALOG 14LGA
Features: Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 12g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
Description: ACCELEROMETER 4-12G ANALOG 14LGA
Features: Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 12g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
Produkt ist nicht verfügbar
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| MMA7360LR1 |
|
Hersteller: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 14LGA
Features: Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
Description: ACCEL 1.5-6G ANALOG 14LGA
Features: Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
Produkt ist nicht verfügbar
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| MMA7455LR1 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C/SPI 14LGA
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Bandwidth: 62.5Hz ~ 125Hz
Supplier Device Package: 14-LGA (3x5)
Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g)
Description: ACCELEROMETER 2-8G I2C/SPI 14LGA
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Bandwidth: 62.5Hz ~ 125Hz
Supplier Device Package: 14-LGA (3x5)
Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MMA7455LR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C/SPI 14LGA
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Bandwidth: 62.5Hz ~ 125Hz
Supplier Device Package: 14-LGA (3x5)
Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g)
Description: ACCELEROMETER 2-8G I2C/SPI 14LGA
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Bandwidth: 62.5Hz ~ 125Hz
Supplier Device Package: 14-LGA (3x5)
Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MMA7455LT | |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C/SPI 14LGA
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tray
Package / Case: 14-TFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Bandwidth: 62.5Hz ~ 125Hz
Supplier Device Package: 14-LGA (3x5)
Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g)
Description: ACCELEROMETER 2-8G I2C/SPI 14LGA
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tray
Package / Case: 14-TFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Bandwidth: 62.5Hz ~ 125Hz
Supplier Device Package: 14-LGA (3x5)
Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MMG3006NT1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CELL 400MHZ-2.4GHZ 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.4GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 17.5dB
Current - Supply: 850mA
Noise Figure: 6.6dB
P1dB: 33dBm
Test Frequency: 900MHz
Supplier Device Package: 16-QFN (4x4)
Part Status: Active
Description: IC AMP CELL 400MHZ-2.4GHZ 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.4GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 17.5dB
Current - Supply: 850mA
Noise Figure: 6.6dB
P1dB: 33dBm
Test Frequency: 900MHz
Supplier Device Package: 16-QFN (4x4)
Part Status: Active
Produkt ist nicht verfügbar
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| MOD5270BXX |
Hersteller: NXP USA Inc.
Description: IC MOD COLDFIRE 95MHZ 2.064MB
Packaging: Bulk
Connector Type: RJ-45, 2x50 Header
Size / Dimension: 2.600" L x 2.000" W (66.04mm x 50.80mm)
Speed: 95MHz
RAM Size: 2.064MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: MCU, Ethernet Core
Core Processor: ColdFire 5270
Flash Size: 512KB
Description: IC MOD COLDFIRE 95MHZ 2.064MB
Packaging: Bulk
Connector Type: RJ-45, 2x50 Header
Size / Dimension: 2.600" L x 2.000" W (66.04mm x 50.80mm)
Speed: 95MHz
RAM Size: 2.064MB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: MCU, Ethernet Core
Core Processor: ColdFire 5270
Flash Size: 512KB
Produkt ist nicht verfügbar
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| MPC5510KIT208 |
|
Hersteller: NXP USA Inc.
Description: MPC5510 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5510
Description: MPC5510 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5510
Produkt ist nicht verfügbar
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| MPC5553EVB |
|
Hersteller: NXP USA Inc.
Description: MPC5553 EVAL BRD
Description: MPC5553 EVAL BRD
Produkt ist nicht verfügbar
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| MPC5553EVBGHS |
|
Hersteller: NXP USA Inc.
Description: MPC5553 EVAL BRD
Description: MPC5553 EVAL BRD
Produkt ist nicht verfügbar
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| MPC5553EVBISYS |
|
Hersteller: NXP USA Inc.
Description: MPC5553 EVAL BRD
Description: MPC5553 EVAL BRD
Produkt ist nicht verfügbar
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| MPC5553MZP132 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 220
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 220
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPC5553MZQ132 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 220
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 220
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MPC5554EVB |
|
Hersteller: NXP USA Inc.
Description: MPC5554 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5554
Description: MPC5554 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5554
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC5554EVBGHS |
|
Hersteller: NXP USA Inc.
Description: MPC5554 EVAL BRD
Description: MPC5554 EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC5554EVBISYS |
|
Hersteller: NXP USA Inc.
Description: MPC5554 EVAL BRD
Description: MPC5554 EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC5554INT |
|
Hersteller: NXP USA Inc.
Description: MPC5554 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5554
Description: MPC5554 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5554
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC5561EVB |
|
Hersteller: NXP USA Inc.
Description: MPC5561 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5561
Description: MPC5561 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5561
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC5566EVB |
|
Hersteller: NXP USA Inc.
Description: MPC5566 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5566
Part Status: Active
Description: MPC5566 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5566
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 3041.47 EUR |
| MPC5567EVB |
|
Hersteller: NXP USA Inc.
Description: MPC5567 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply, USB Multilink Programmer
Core Processor: e200
Utilized IC / Part: MPC5567
Description: MPC5567 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply, USB Multilink Programmer
Core Processor: e200
Utilized IC / Part: MPC5567
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC7410HX400LE |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 400MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU MPC74XX 400MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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Stück im Wert von UAH
| MPC8260ADS-TCOM |
Hersteller: NXP USA Inc.
Description: BOARD DEV ADS POWERQUICC II
Packaging: Bulk
For Use With/Related Products: 8260ADS
Accessory Type: Interface Board
Part Status: Obsolete
Description: BOARD DEV ADS POWERQUICC II
Packaging: Bulk
For Use With/Related Products: 8260ADS
Accessory Type: Interface Board
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH