Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34270) > Seite 125 nach 572
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| MXC9ATLAS-PMB | NXP USA Inc. | Description: BOARD ATLAS PM |
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| USBMLPPCBDM | NXP USA Inc. |
 Description: MULTILINK P&E POWERPC USBPackaging: Bulk For Use With/Related Products: MPC5xx / 55xx Type: Debugger (In-Circuit/In-System) Contents: Board(s) Part Status: Active |
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USBMLPPCNEXUS | NXP USA Inc. |
Description: MULTILINK P&E POWERPC NEXUS USB Packaging: Bulk For Use With/Related Products: MPC5xx / 55xx Type: Debugger (In-Circuit/In-System) Contents: Board(s) |
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TJA1041T/N1,512 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SO Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 14-SO Receiver Hysteresis: 70 mV Duplex: Half Part Status: Obsolete |
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TJA1041T/N1,518 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SO Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 14-SO Receiver Hysteresis: 70 mV Duplex: Half Part Status: Obsolete |
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LH79520N0Q000B1;55 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 176LQFP |
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LH79524N0F100A1;55 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 208LFBGA Packaging: Tray Package / Case: 208-LFBGA Mounting Type: Surface Mount Speed: 76.2MHz RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 10x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 208-LFBGA (14x14) Number of I/O: 108 DigiKey Programmable: Not Verified |
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LH79525N0Q100A1;55 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 176LQFP Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 76.2MHz RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 10x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 176-LQFP (20x20) Part Status: Obsolete Number of I/O: 86 DigiKey Programmable: Not Verified |
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LH7A404N0F000B3;55 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 324LFBGA Packaging: Tray Package / Case: 324-LFBGA Mounting Type: Surface Mount Speed: 200MHz RAM Size: 80K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: ARM9® Data Converters: A/D 9x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC'97, DMA, LCD, POR, PWM, WDT Supplier Device Package: 324-LFBGA (17x17) Number of I/O: 64 DigiKey Programmable: Not Verified |
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LH75411N0Q100C0;55 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP |
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LH7A400N0G000B5;55 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256BGA Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Speed: 200MHz RAM Size: 80K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: ARM9® Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC'97, DMA, LCD, POR, PWM, WDT Supplier Device Package: 256-BGA (17x17) Number of I/O: 60 DigiKey Programmable: Not Verified |
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3806620 | NXP USA Inc. |
Description: KIT BISS TRANSISTORS 17 VALUES Packaging: Case Mounting Type: Surface Mount Quantity: 425 Pieces (17 Values - 25 Each) Kit Type: Transistors |
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3806684 | NXP USA Inc. | Description: KIT SCHOTTKY DIODE 17 VALUES |
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BLF6G20-230P | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V LDMOST Packaging: Bag Package / Case: SOT-502A Current Rating (Amps): 5µA Mounting Type: Chassis Mount Frequency: 1.8GHz Power - Output: 50W Gain: 16.5dB Technology: LDMOS Supplier Device Package: LDMOST Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 2 A |
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MCF51JM128EVLK | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Part Status: Active Number of I/O: 66 DigiKey Programmable: Not Verified |
auf Bestellung 900 Stücke: Lieferzeit 21-28 Tag (e) |
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MCF51JM128VLK | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Number of I/O: 66 DigiKey Programmable: Not Verified |
auf Bestellung 198 Stücke: Lieferzeit 21-28 Tag (e) |
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MCF51JM128VQH | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64QFP Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 64-QFP (14x14) Part Status: Active Number of I/O: 51 DigiKey Programmable: Not Verified |
auf Bestellung 1260 Stücke: Lieferzeit 21-28 Tag (e) |
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MCF51JM128VLH | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 51 DigiKey Programmable: Verified |
auf Bestellung 5251 Stücke: Lieferzeit 21-28 Tag (e) |
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MCF51JM128VLD | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 33 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF51JM64VLD | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 33 DigiKey Programmable: Not Verified |
auf Bestellung 1600 Stücke: Lieferzeit 21-28 Tag (e) |
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DEMOJM | NXP USA Inc. |
Description: MCF51JM128/MC9S08JM60 EVAL BRD Packaging: Box Mounting Type: Socket Type: MCU Contents: Board(s), Cable(s), Accessories Board Type: Evaluation Platform Utilized IC / Part: MCF51JM128, MC9S08JM60 Part Status: Obsolete |
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| SL3ICS1002FUG/V7AF | NXP USA Inc. |
Description: IC UCODE G2XM FFC Packaging: Tube Package / Case: Die Mounting Type: Surface Mount Frequency: 840MHz ~ 960MHz Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 85°C Standards: ISO 15962, ISO 15963, ISO 18000-1, ISO 18000-6, ISO 19762 Supplier Device Package: Wafer Part Status: Active |
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SA58670ABS,115 | NXP USA Inc. |
Description: IC AMP CLASS D STER 2.1W 20HVQFN Packaging: Tape & Reel (TR) Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown Package / Case: 20-VFQFN Exposed Pad Output Type: 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 5.5V Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm Supplier Device Package: 20-HVQFN (4x4) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SA58671UK,027 | NXP USA Inc. |
Description: IC AMP CLASS D STER 1.3W 16WLCSP |
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SA58637BS,118 | NXP USA Inc. |
Description: IC AMP CLSS AB STER 2.2W 20HVQFN |
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SA58670ABS,115 | NXP USA Inc. |
Description: IC AMP CLASS D STER 2.1W 20HVQFN Packaging: Cut Tape (CT) Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown Package / Case: 20-VFQFN Exposed Pad Output Type: 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 5.5V Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm Supplier Device Package: 20-HVQFN (4x4) Part Status: Obsolete |
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SA58671UK,027 | NXP USA Inc. |
Description: IC AMP CLASS D STER 1.3W 16WLCSP |
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CWP-PRO-NL | NXP USA Inc. |
Description: SOFTWARE CODE WARRIOR Packaging: Box For Use With/Related Products: Code Warrior™ Software Type: Integrated Development Environment (IDE) Applications: Programming Operating System: Windows XP, 7 Edition: Professional License Length: Perpetual License - User Details: Fixed Node Media Delivery Type: Electronically Delivered Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 21-28 Tag (e) |
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BB179,115 | NXP USA Inc. |
Description: DIODE UHF VAR CAP 30V SOD523 |
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TJA1080TS,118 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 20SSOP Packaging: Cut Tape (CT) Package / Case: 20-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Interface: FlexRay Voltage - Supply: 4.75V ~ 5.25V Applications: Automotive Supplier Device Package: 20-SSOP |
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OM11005 | NXP USA Inc. |
Description: DISPLAY QVGA TFT FOR OM10100 Packaging: Box For Use With/Related Products: OM10100 Accessory Type: LCD Display |
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OM11013,598 | NXP USA Inc. |
Description: LPC2387 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM7 Utilized IC / Part: LPC2387 |
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MC34671AEPR2 | NXP USA Inc. |
Description: IC BATT CHG LI-ION 1CELL 8UDFN Packaging: Cut Tape (CT) Package / Case: 8-UFDFN Exposed Pad Number of Cells: 1 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Battery Chemistry: Lithium Ion/Polymer Supplier Device Package: 8-UDFN (3x2) Charge Current - Max: 600mA Fault Protection: Over Temperature, Over Voltage Voltage - Supply (Max): 10V Battery Pack Voltage: 4.2V Current - Charging: Constant - Programmable |
auf Bestellung 7222 Stücke: Lieferzeit 21-28 Tag (e) |
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MC34673AEPR2 | NXP USA Inc. |
Description: IC BATT CHG LI-ION 1CELL 8UDFN Packaging: Cut Tape (CT) Package / Case: 8-UFDFN Exposed Pad Number of Cells: 1 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Battery Chemistry: Lithium Ion/Polymer Supplier Device Package: 8-UDFN (3x2) Charge Current - Max: 1.2A Fault Protection: Over Voltage Voltage - Supply (Max): 6.6V Battery Pack Voltage: 4.2V Current - Charging: Constant - Programmable |
auf Bestellung 10813 Stücke: Lieferzeit 21-28 Tag (e) |
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MC34674AEPR2 | NXP USA Inc. |
Description: IC BATT CHG LI-ION 1CELL 8UDFN |
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MC9S08QE128CFT | NXP USA Inc. |
Description: IC MCU 8BIT 128KB FLASH 48QFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Part Status: Active Number of I/O: 38 DigiKey Programmable: Not Verified |
auf Bestellung 1300 Stücke: Lieferzeit 21-28 Tag (e) |
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MC9S08QE96CLH | NXP USA Inc. |
Description: IC MCU 8BIT 96KB FLASH 64LQFP |
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MC9S08QE128CLD | NXP USA Inc. |
Description: IC MCU 8BIT 128KB FLASH 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 34 DigiKey Programmable: Not Verified |
auf Bestellung 3200 Stücke: Lieferzeit 21-28 Tag (e) |
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MC9S08QE64CFT | NXP USA Inc. |
Description: IC MCU 8BIT 64KB FLASH 48QFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Part Status: Active Number of I/O: 38 DigiKey Programmable: Not Verified |
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MC9S08QE64CLD | NXP USA Inc. |
Description: IC MCU 8BIT 64KB FLASH 44LQFP |
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DEMOACKIT | NXP USA Inc. |
Description: MC9S08AC128/MCF51AC256 EVAL BRD Packaging: Box Mounting Type: Socket Type: MCU Contents: Board(s), Cable(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08AC128, MCF51AC256 Part Status: Active |
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MC9S08AC128CFGE | NXP USA Inc. |
Description: IC MCU 8BIT 128KB FLASH 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 38 DigiKey Programmable: Not Verified |
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MC9S08AC128CLKE | NXP USA Inc. |
Description: IC MCU 8BIT 128KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Part Status: Active Number of I/O: 69 DigiKey Programmable: Not Verified |
auf Bestellung 410 Stücke: Lieferzeit 21-28 Tag (e) |
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LPC2470FBD208,551 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 208LQFP |
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LPC2470FET208,551 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 208TFBGA |
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LPC2478FBD208,551 | NXP USA Inc. |
Description: IC MCU 16/32B 512KB FLSH 208LQFP |
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LPC2478FET208,551 | NXP USA Inc. |
Description: IC MCU 16/32BIT 512KB 208TFBGA Packaging: Tray Package / Case: 208-TFBGA Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 208-TFBGA (15x15) Part Status: Not For New Designs Number of I/O: 160 DigiKey Programmable: Not Verified |
auf Bestellung 343 Stücke: Lieferzeit 21-28 Tag (e) |
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LPC2104FBD48/01,15 | NXP USA Inc. |
Description: IC MCU 16/32B 128KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Not For New Designs Number of I/O: 32 DigiKey Programmable: Not Verified |
auf Bestellung 250 Stücke: Lieferzeit 21-28 Tag (e) |
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LPC2105FBD48/01,15 | NXP USA Inc. |
Description: IC MCU 16/32B 128KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 32 DigiKey Programmable: Not Verified |
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LPC2106FBD48/01,15 | NXP USA Inc. |
Description: IC MCU 16/32B 128KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 128KB (128K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Not For New Designs Number of I/O: 32 DigiKey Programmable: Not Verified |
auf Bestellung 1195 Stücke: Lieferzeit 21-28 Tag (e) |
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LPC2106FHN48/01,55 | NXP USA Inc. |
Description: IC MCU 16/32B 128KB FLSH 48HVQFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 128KB (128K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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OM11015 | NXP USA Inc. |
Description: LPC2478 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), LCD Core Processor: ARM7 Board Type: Evaluation Platform Utilized IC / Part: LPC2478 Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TJA1055T/3,518 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SO Packaging: Cut Tape (CT) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 14-SO Duplex: Half Part Status: Obsolete |
Produkt ist nicht verfügbar |
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UJA1065TW/3V0,518 | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HTSSOP Packaging: Cut Tape (CT) Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 52V Applications: Networking Supplier Device Package: 32-HTSSOP |
Produkt ist nicht verfügbar |
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UJA1065TW/3V3,518 | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HTSSOP Packaging: Cut Tape (CT) Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 52V Applications: Networking Supplier Device Package: 32-HTSSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
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DEMO9S08QE8 | NXP USA Inc. |
 Description: MC9S08QE8 EVAL BRD |
Produkt ist nicht verfügbar |
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MC34700EP | NXP USA Inc. |
Description: IC REG QUAD BUCK/LNR SYNC 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 9V ~ 18V Frequency - Switching: 800kHz Topology: Step-Down (Buck) Synchronous (3), Linear (LDO) (1) Supplier Device Package: 32-QFN-EP (5x5) Voltage/Current - Output 1: 2V ~ 5.25V, 1.5A Voltage/Current - Output 2: 0.7V ~ 3.6V, 1.25A Voltage/Current - Output 3: 0.7V ~ 3.6V, 1.25A w/LED Driver: No w/Supervisor: No w/Sequencer: No Number of Outputs: 4 |
Produkt ist nicht verfügbar |
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MC9S08AC32CFDE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 48QFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Part Status: Active Number of I/O: 38 DigiKey Programmable: Verified |
auf Bestellung 1300 Stücke: Lieferzeit 21-28 Tag (e) |
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MC9S08AC32CFGE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
auf Bestellung 160 Stücke: Lieferzeit 21-28 Tag (e) |
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MC9S08AC32CPUE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Verified |
auf Bestellung 511 Stücke: Lieferzeit 21-28 Tag (e) |
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| USBMLPPCBDM |
|
Hersteller: NXP USA Inc.
Description: MULTILINK P&E POWERPC USB
Packaging: Bulk
For Use With/Related Products: MPC5xx / 55xx
Type: Debugger (In-Circuit/In-System)
Contents: Board(s)
Part Status: Active
Description: MULTILINK P&E POWERPC USB
Packaging: Bulk
For Use With/Related Products: MPC5xx / 55xx
Type: Debugger (In-Circuit/In-System)
Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| USBMLPPCNEXUS |
Hersteller: NXP USA Inc.
Description: MULTILINK P&E POWERPC NEXUS USB
Packaging: Bulk
For Use With/Related Products: MPC5xx / 55xx
Type: Debugger (In-Circuit/In-System)
Contents: Board(s)
Description: MULTILINK P&E POWERPC NEXUS USB
Packaging: Bulk
For Use With/Related Products: MPC5xx / 55xx
Type: Debugger (In-Circuit/In-System)
Contents: Board(s)
Produkt ist nicht verfügbar
| TJA1041T/N1,512 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
| TJA1041T/N1,518 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
| LH79520N0Q000B1;55 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 176LQFP
Description: IC MCU 32BIT ROMLESS 176LQFP
Produkt ist nicht verfügbar
| LH79524N0F100A1;55 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208LFBGA
Packaging: Tray
Package / Case: 208-LFBGA
Mounting Type: Surface Mount
Speed: 76.2MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LFBGA (14x14)
Number of I/O: 108
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 208LFBGA
Packaging: Tray
Package / Case: 208-LFBGA
Mounting Type: Surface Mount
Speed: 76.2MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LFBGA (14x14)
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LH79525N0Q100A1;55 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 76.2MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 86
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 76.2MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 86
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LH7A404N0F000B3;55 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 324LFBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 9x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 324-LFBGA (17x17)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 324LFBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 9x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 324-LFBGA (17x17)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LH75411N0Q100C0;55 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Description: IC MCU 32BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
| LH7A400N0G000B5;55 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256BGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 256-BGA (17x17)
Number of I/O: 60
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256BGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 256-BGA (17x17)
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 3806620 |
Hersteller: NXP USA Inc.
Description: KIT BISS TRANSISTORS 17 VALUES
Packaging: Case
Mounting Type: Surface Mount
Quantity: 425 Pieces (17 Values - 25 Each)
Kit Type: Transistors
Description: KIT BISS TRANSISTORS 17 VALUES
Packaging: Case
Mounting Type: Surface Mount
Quantity: 425 Pieces (17 Values - 25 Each)
Kit Type: Transistors
Produkt ist nicht verfügbar
| 3806684 |
Hersteller: NXP USA Inc.
Description: KIT SCHOTTKY DIODE 17 VALUES
Description: KIT SCHOTTKY DIODE 17 VALUES
Produkt ist nicht verfügbar
| BLF6G20-230P |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V LDMOST
Packaging: Bag
Package / Case: SOT-502A
Current Rating (Amps): 5µA
Mounting Type: Chassis Mount
Frequency: 1.8GHz
Power - Output: 50W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 2 A
Description: RF MOSFET LDMOS 28V LDMOST
Packaging: Bag
Package / Case: SOT-502A
Current Rating (Amps): 5µA
Mounting Type: Chassis Mount
Frequency: 1.8GHz
Power - Output: 50W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 2 A
Produkt ist nicht verfügbar
| MCF51JM128EVLK |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 900 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 45.86 EUR |
| 10+ | 36.65 EUR |
| 80+ | 30.95 EUR |
| 450+ | 30.76 EUR |
| MCF51JM128VLK |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 198 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 36.97 EUR |
| 10+ | 29.55 EUR |
| 80+ | 24.95 EUR |
| MCF51JM128VQH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
auf Bestellung 1260 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 35.65 EUR |
| 10+ | 28.49 EUR |
| 80+ | 24.06 EUR |
| 840+ | 23.92 EUR |
| MCF51JM128VLH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Verified
auf Bestellung 5251 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 35.98 EUR |
| 10+ | 28.76 EUR |
| 80+ | 24.29 EUR |
| 800+ | 24.14 EUR |
| MCF51JM128VLD |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MCF51JM64VLD |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
auf Bestellung 1600 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 31.82 EUR |
| 10+ | 25.43 EUR |
| 80+ | 21.48 EUR |
| 800+ | 21.35 EUR |
| DEMOJM |
|
Hersteller: NXP USA Inc.
Description: MCF51JM128/MC9S08JM60 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU
Contents: Board(s), Cable(s), Accessories
Board Type: Evaluation Platform
Utilized IC / Part: MCF51JM128, MC9S08JM60
Part Status: Obsolete
Description: MCF51JM128/MC9S08JM60 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU
Contents: Board(s), Cable(s), Accessories
Board Type: Evaluation Platform
Utilized IC / Part: MCF51JM128, MC9S08JM60
Part Status: Obsolete
Produkt ist nicht verfügbar
| SL3ICS1002FUG/V7AF |
Hersteller: NXP USA Inc.
Description: IC UCODE G2XM FFC
Packaging: Tube
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15962, ISO 15963, ISO 18000-1, ISO 18000-6, ISO 19762
Supplier Device Package: Wafer
Part Status: Active
Description: IC UCODE G2XM FFC
Packaging: Tube
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15962, ISO 15963, ISO 18000-1, ISO 18000-6, ISO 19762
Supplier Device Package: Wafer
Part Status: Active
Produkt ist nicht verfügbar
| SA58670ABS,115 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D STER 2.1W 20HVQFN
Packaging: Tape & Reel (TR)
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
Description: IC AMP CLASS D STER 2.1W 20HVQFN
Packaging: Tape & Reel (TR)
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SA58671UK,027 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D STER 1.3W 16WLCSP
Description: IC AMP CLASS D STER 1.3W 16WLCSP
Produkt ist nicht verfügbar
| SA58637BS,118 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLSS AB STER 2.2W 20HVQFN
Description: IC AMP CLSS AB STER 2.2W 20HVQFN
Produkt ist nicht verfügbar
| SA58670ABS,115 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D STER 2.1W 20HVQFN
Packaging: Cut Tape (CT)
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
Description: IC AMP CLASS D STER 2.1W 20HVQFN
Packaging: Cut Tape (CT)
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SA58671UK,027 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D STER 1.3W 16WLCSP
Description: IC AMP CLASS D STER 1.3W 16WLCSP
Produkt ist nicht verfügbar
| CWP-PRO-NL |
|
Hersteller: NXP USA Inc.
Description: SOFTWARE CODE WARRIOR
Packaging: Box
For Use With/Related Products: Code Warrior™ Software
Type: Integrated Development Environment (IDE)
Applications: Programming
Operating System: Windows XP, 7
Edition: Professional
License Length: Perpetual
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: SOFTWARE CODE WARRIOR
Packaging: Box
For Use With/Related Products: Code Warrior™ Software
Type: Integrated Development Environment (IDE)
Applications: Programming
Operating System: Windows XP, 7
Edition: Professional
License Length: Perpetual
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 14066.86 EUR |
| BB179,115 |
|
Hersteller: NXP USA Inc.
Description: DIODE UHF VAR CAP 30V SOD523
Description: DIODE UHF VAR CAP 30V SOD523
Produkt ist nicht verfügbar
| TJA1080TS,118 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Applications: Automotive
Supplier Device Package: 20-SSOP
Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Applications: Automotive
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
| OM11005 |
Hersteller: NXP USA Inc.
Description: DISPLAY QVGA TFT FOR OM10100
Packaging: Box
For Use With/Related Products: OM10100
Accessory Type: LCD Display
Description: DISPLAY QVGA TFT FOR OM10100
Packaging: Box
For Use With/Related Products: OM10100
Accessory Type: LCD Display
Produkt ist nicht verfügbar
| OM11013,598 |
Hersteller: NXP USA Inc.
Description: LPC2387 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM7
Utilized IC / Part: LPC2387
Description: LPC2387 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM7
Utilized IC / Part: LPC2387
Produkt ist nicht verfügbar
| MC34671AEPR2 |
|
Hersteller: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 600mA
Fault Protection: Over Temperature, Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 600mA
Fault Protection: Over Temperature, Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
auf Bestellung 7222 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 5.64 EUR |
| 10+ | 5.06 EUR |
| 25+ | 4.78 EUR |
| 100+ | 4.07 EUR |
| 250+ | 3.82 EUR |
| 500+ | 3.34 EUR |
| 1000+ | 2.77 EUR |
| MC34673AEPR2 |
|
Hersteller: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 1.2A
Fault Protection: Over Voltage
Voltage - Supply (Max): 6.6V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 1.2A
Fault Protection: Over Voltage
Voltage - Supply (Max): 6.6V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
auf Bestellung 10813 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 7+ | 3.95 EUR |
| 10+ | 3.56 EUR |
| 25+ | 3.36 EUR |
| 100+ | 2.86 EUR |
| 250+ | 2.69 EUR |
| 500+ | 2.37 EUR |
| MC34674AEPR2 |
|
Hersteller: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Produkt ist nicht verfügbar
| MC9S08QE128CFT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 128KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 30 EUR |
| 10+ | 23.57 EUR |
| 80+ | 19.51 EUR |
| 1300+ | 17.02 EUR |
| MC9S08QE96CLH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 64LQFP
Description: IC MCU 8BIT 96KB FLASH 64LQFP
Produkt ist nicht verfügbar
| MC9S08QE128CLD |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 3200 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 27.53 EUR |
| 10+ | 21.62 EUR |
| 80+ | 17.9 EUR |
| MC9S08QE64CFT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC9S08QE64CLD |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 44LQFP
Description: IC MCU 8BIT 64KB FLASH 44LQFP
Produkt ist nicht verfügbar
| DEMOACKIT |
|
Hersteller: NXP USA Inc.
Description: MC9S08AC128/MCF51AC256 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08AC128, MCF51AC256
Part Status: Active
Description: MC9S08AC128/MCF51AC256 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08AC128, MCF51AC256
Part Status: Active
Produkt ist nicht verfügbar
| MC9S08AC128CFGE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC9S08AC128CLKE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 69
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 69
DigiKey Programmable: Not Verified
auf Bestellung 410 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 31.88 EUR |
| 10+ | 25.05 EUR |
| 80+ | 20.74 EUR |
| LPC2470FBD208,551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Produkt ist nicht verfügbar
| LPC2470FET208,551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Produkt ist nicht verfügbar
| LPC2478FBD208,551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 208LQFP
Description: IC MCU 16/32B 512KB FLSH 208LQFP
Produkt ist nicht verfügbar
| LPC2478FET208,551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 512KB 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT 512KB 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 160
DigiKey Programmable: Not Verified
auf Bestellung 343 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 77.53 EUR |
| 10+ | 62.18 EUR |
| 126+ | 53.1 EUR |
| LPC2104FBD48/01,15 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 250 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 46.2 EUR |
| 10+ | 36.92 EUR |
| 80+ | 31.18 EUR |
| LPC2105FBD48/01,15 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC2106FBD48/01,15 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 1195 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 64.17 EUR |
| 10+ | 51.47 EUR |
| 80+ | 43.95 EUR |
| 500+ | 43.38 EUR |
| LPC2106FHN48/01,55 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLSH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 128KB FLSH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| OM11015 |
|
Hersteller: NXP USA Inc.
Description: LPC2478 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM7
Board Type: Evaluation Platform
Utilized IC / Part: LPC2478
Part Status: Obsolete
Description: LPC2478 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM7
Board Type: Evaluation Platform
Utilized IC / Part: LPC2478
Part Status: Obsolete
Produkt ist nicht verfügbar
| TJA1055T/3,518 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
Part Status: Obsolete
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
| UJA1065TW/3V0,518 |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 52V
Applications: Networking
Supplier Device Package: 32-HTSSOP
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 52V
Applications: Networking
Supplier Device Package: 32-HTSSOP
Produkt ist nicht verfügbar
| UJA1065TW/3V3,518 |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 52V
Applications: Networking
Supplier Device Package: 32-HTSSOP
Part Status: Obsolete
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 52V
Applications: Networking
Supplier Device Package: 32-HTSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC34700EP |
|
Hersteller: NXP USA Inc.
Description: IC REG QUAD BUCK/LNR SYNC 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 18V
Frequency - Switching: 800kHz
Topology: Step-Down (Buck) Synchronous (3), Linear (LDO) (1)
Supplier Device Package: 32-QFN-EP (5x5)
Voltage/Current - Output 1: 2V ~ 5.25V, 1.5A
Voltage/Current - Output 2: 0.7V ~ 3.6V, 1.25A
Voltage/Current - Output 3: 0.7V ~ 3.6V, 1.25A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 4
Description: IC REG QUAD BUCK/LNR SYNC 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 18V
Frequency - Switching: 800kHz
Topology: Step-Down (Buck) Synchronous (3), Linear (LDO) (1)
Supplier Device Package: 32-QFN-EP (5x5)
Voltage/Current - Output 1: 2V ~ 5.25V, 1.5A
Voltage/Current - Output 2: 0.7V ~ 3.6V, 1.25A
Voltage/Current - Output 3: 0.7V ~ 3.6V, 1.25A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 4
Produkt ist nicht verfügbar
| MC9S08AC32CFDE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Verified
Description: IC MCU 8BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Verified
auf Bestellung 1300 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 20.8 EUR |
| 10+ | 16.33 EUR |
| 80+ | 13.52 EUR |
| 1300+ | 11.79 EUR |
| MC9S08AC32CFGE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 21.35 EUR |
| 10+ | 16.76 EUR |
| 80+ | 13.87 EUR |
| MC9S08AC32CPUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
auf Bestellung 511 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 22.88 EUR |
| 10+ | 17.98 EUR |
| 80+ | 14.88 EUR |