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PCA9570GMH PCA9570GMH NXP USA Inc. PCA9570.pdf Description: IC XPNDR 100KHZ I2C SMBUS 8XQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 4
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 100 kHz
Interrupt Output: No
Supplier Device Package: 8-XQFN (1.6x1.6)
Current - Output Source/Sink: 4mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 25044 Stücke:
Lieferzeit 21-28 Tag (e)
14+1.98 EUR
15+ 1.74 EUR
25+ 1.64 EUR
100+ 1.34 EUR
250+ 1.24 EUR
500+ 1.06 EUR
1000+ 0.85 EUR
Mindestbestellmenge: 14
PCA9617ATPZ PCA9617ATPZ NXP USA Inc. PCA9617A.pdf Description: IC REDRIVER I2C 1CH 1MHZ 8HWSON
Packaging: Cut Tape (CT)
Package / Case: 8-WFDFN Exposed Pad
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 5.5V, 2.2V ~ 5.5V
Applications: I2C
Current - Supply: 50µA
Data Rate (Max): 1MHz
Supplier Device Package: 8-HWSON (2x3)
Part Status: Active
Capacitance - Input: 7 pF
auf Bestellung 1250 Stücke:
Lieferzeit 21-28 Tag (e)
8+3.41 EUR
10+ 3.04 EUR
25+ 2.89 EUR
100+ 2.37 EUR
250+ 2.22 EUR
500+ 1.96 EUR
1000+ 1.55 EUR
Mindestbestellmenge: 8
PCA9952TW/Q900,118 PCA9952TW/Q900,118 NXP USA Inc. PCA9952_PCA9955.pdf Description: IC LED DRV LIN PWM 57MA 28HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 57mA
Internal Switch(s): Yes
Supplier Device Package: 28-HTSSOP
Dimming: PWM
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 13276 Stücke:
Lieferzeit 21-28 Tag (e)
3+11 EUR
10+ 9.87 EUR
25+ 9.33 EUR
100+ 8.09 EUR
250+ 7.67 EUR
500+ 6.88 EUR
1000+ 5.81 EUR
Mindestbestellmenge: 3
PCAL6416AEXX NXP USA Inc. Description: IC XPND 400KHZ I2C SMBUS 24XFBGA
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-XFBGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-XFBGA (2x2)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PCT2075DP,118 PCT2075DP,118 NXP USA Inc. PCT2075.pdf Description: SENSOR DIGITAL -55C-125C 8TSSOP
Features: Output Switch, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
auf Bestellung 20595 Stücke:
Lieferzeit 21-28 Tag (e)
13+2.13 EUR
16+ 1.62 EUR
25+ 1.4 EUR
50+ 1.35 EUR
100+ 1.15 EUR
500+ 1 EUR
1000+ 0.88 EUR
Mindestbestellmenge: 13
PTN36242LBS,518 PTN36242LBS,518 NXP USA Inc. PTN36242L.pdf Description: IC REDRIVER USB 3.0 2CH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Delay Time: 0.4ns
Number of Channels: 2
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: USB 3.0
Current - Supply: 225mA
Supplier Device Package: 32-HVQFN (3x6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
SC16IS741AIPWJ SC16IS741AIPWJ NXP USA Inc. SC16IS741A.pdf Description: IC UART SGL I2C BUS SPI 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Number of Channels: 1, UART
Mounting Type: Surface Mount
Voltage - Supply: 2.3V ~ 3.6V
FIFO's: 64 Byte
Protocol: RS232, RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 16-TSSOP
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With Modem Control: Yes
Part Status: Active
auf Bestellung 32364 Stücke:
Lieferzeit 21-28 Tag (e)
5+5.64 EUR
10+ 5.07 EUR
25+ 4.79 EUR
100+ 4.15 EUR
250+ 3.94 EUR
500+ 3.75 EUR
Mindestbestellmenge: 5
SDIO101AIHRZ SDIO101AIHRZ NXP USA Inc. SDIO101A.pdf Description: IC FLASH MEMORY CTRLR 60HXQFN
Produkt ist nicht verfügbar
LPC11E37HFBD64/4QL LPC11E37HFBD64/4QL NXP USA Inc. LPC11E3X.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
OM13062UL OM13062UL NXP USA Inc. LPC11U3x_Rev2.3.pdf Description: LPCXPRESSO LPC11U37H EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Board Type: Evaluation Platform
Utilized IC / Part: LPC11U37H
Platform: LPCXpresso™
Part Status: Active
Produkt ist nicht verfügbar
FRDM-FXS-MULTI-B FRDM-FXS-MULTI-B NXP USA Inc. Xtrinsic_Sensors_Platform_FS.pdf Description: DEV KIT FOR XTRINSIC SENSOR BT
Packaging: Box
For Use With/Related Products: Kinetis, mbed-Enabled Development
Accessory Type: Sensor Board
Produkt ist nicht verfügbar
FRDM-FXS-9AXIS FRDM-FXS-9AXIS NXP USA Inc. Xtrinsic_Sensors_Platform_FS.pdf Description: DEV KIT FOR 9AXIS XTRINSIC SNSR
Produkt ist nicht verfügbar
OM13061UL OM13061UL NXP USA Inc. LPC185x,3x,2x,1x.pdf Description: XPLORER LPC1837 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1837
Platform: Xplorer
Part Status: Obsolete
Produkt ist nicht verfügbar
TWR-KW24D512 TWR-KW24D512 NXP USA Inc. DWF13_AMF_IND_T0274_Ottawa.pdf#Page=22 Description: TOWER SYSTEM KIT
auf Bestellung 26 Stücke:
Lieferzeit 21-28 Tag (e)
PCF8545ATT/AJ PCF8545ATT/AJ NXP USA Inc. PCF8545.pdf Description: IC DRVR 320 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C
Configuration: 320 Segment
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Supplier Device Package: 56-TSSOP
Current - Supply: 30 µA
Produkt ist nicht verfügbar
PCF8545BTT/AJ PCF8545BTT/AJ NXP USA Inc. PCF8545.pdf Description: IC DRVR 320 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 320 Segment
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
Current - Supply: 30 µA
Produkt ist nicht verfügbar
PCA8546ATT/AJ PCA8546ATT/AJ NXP USA Inc. PCA8546.pdf Description: IC DRVR 176 SEGMENT 56TSSOP
Produkt ist nicht verfügbar
PCA8546BTT/AJ PCA8546BTT/AJ NXP USA Inc. PCA8546.pdf Description: IC DRVR 176 SEGMENT 56TSSOP
Produkt ist nicht verfügbar
PCA8546ATT/AJ PCA8546ATT/AJ NXP USA Inc. PCA8546.pdf Description: IC DRVR 176 SEGMENT 56TSSOP
Produkt ist nicht verfügbar
PCA8546BTT/AJ PCA8546BTT/AJ NXP USA Inc. PCA8546.pdf Description: IC DRVR 176 SEGMENT 56TSSOP
Produkt ist nicht verfügbar
LPC11U67JBD48E LPC11U67JBD48E NXP USA Inc. LPC11U6X.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 277 Stücke:
Lieferzeit 21-28 Tag (e)
2+17.37 EUR
10+ 13.64 EUR
80+ 11.29 EUR
Mindestbestellmenge: 2
LPC11U68JBD64E LPC11U68JBD64E NXP USA Inc. LPC11U6X.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
LPC11U68JBD100E LPC11U68JBD100E NXP USA Inc. LPC11U6X.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
OM13058UL OM13058UL NXP USA Inc. LPC11U6X.pdf Description: LPCXPRESSO LPC11U68 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC11U68
Platform: LPCXpresso™
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 21-28 Tag (e)
1+70.38 EUR
TWR-K64F120M TWR-K64F120M NXP USA Inc. TWR-K64F120M_QSG.pdf Description: TOWER SYSTEM K64 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K64
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
TWR-13237 TWR-13237 NXP USA Inc. DevKit_PB.pdf Description: KIT DEVELOPMENT MC13237CHT
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)
1+536.9 EUR
TWR-13237-KIT TWR-13237-KIT NXP USA Inc. DevKit_PB.pdf Description: KIT DEVELOPMENT MC13237CHT
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)
1+854.57 EUR
TWR-MC-FRDMKE02Z NXP USA Inc. Description: TOWER MOD KE BD TWR-MC-LV3PH
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: Interface Board
Part Status: Active
Produkt ist nicht verfügbar
13237ADC-BDM 13237ADC-BDM NXP USA Inc. DevKit_PB.pdf Description: KIT DEV MC13237CHT BDM
Packaging: Bulk
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)
1+1216.88 EUR
ADAM20G1KIT NXP USA Inc. Description: KIT EVAL ADAM 2.1GHZ
Packaging: Bulk
Type: Amplifier
Supplied Contents: Board(s), Cable(s)
Part Status: Active
Produkt ist nicht verfügbar
BRKOUT-FXLN8361Q BRKOUT-FXLN8361Q NXP USA Inc. FXLN83xxQ.pdf Description: BOARD BREAKOUT FXLN8361Q
Packaging: Box
Sensitivity: 229mV/g, 57.25mV/g
Interface: Analog
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLN8361Q
Supplied Contents: Board(s)
Sensing Range: ±2g, 8g
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)
1+37.44 EUR
BRKOUT-FXLN8371Q BRKOUT-FXLN8371Q NXP USA Inc. FXLN83xxQ.pdf Description: BOARD BREAKOUT FXLN8371Q
Packaging: Box
Sensitivity: 229mV/g, 57.25mV/g
Interface: Analog
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLN8371Q
Supplied Contents: Board(s)
Sensing Range: ±2g, 8g
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)
1+38.79 EUR
BRKOUT-FXLS8471Q NXP USA Inc. FXLS8471QFS.pdf Description: BOARD BREAKOUT FXLS8471Q
Produkt ist nicht verfügbar
CWP-MCTB-S12ZV-N NXP USA Inc. Description: MOTOR CTRL TOOLBOX MC9S12ZVMX
Produkt ist nicht verfügbar
DLD-MCTB-S12ZV-N NXP USA Inc. Description: DNLD MC9S12ZVMX CTRL TOOLBOX
Produkt ist nicht verfügbar
DL-RAPPID577XKSW NXP USA Inc. Description: DL PEX RAPPID SUITE V10 MPC577XK
Packaging: Electronic Delivery
For Use With/Related Products: MPC5xx
Type: Integrated Development Environment (IDE)
Applications: Programming
Operating System: Windows
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
KITFXLC95000MAG NXP USA Inc. Description: KIT XTRINSIC FXLC95000
Packaging: Bulk
Sensitivity: 0.061mg/LSB, 0.122mg/LSB, 0.244mg/LSB
Interface: I2C, Serial, SPI
Voltage - Supply: 1.71V ~ 1.89V
Sensor Type: Accelerometer, Temperature
Utilized IC / Part: FXLC95000CL
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Sensing Range: ±2g, 4g, 8g
Part Status: Active
Produkt ist nicht verfügbar
S912XDG128F2CAAR S912XDG128F2CAAR NXP USA Inc. MC9S12XDP512RMV2.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12VR48AF0MLFR S9S12VR48AF0MLFR NXP USA Inc. 15944_MC9S12VRRMV3.pdf Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
AFT21H350W03SR6 AFT21H350W03SR6 NXP USA Inc. Description: FET RF 2CH 65V 2.11GHZ NI1230S
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 2.11GHz
Power - Output: 63W
Gain: 16.4dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 750 mA
Produkt ist nicht verfügbar
AFT21H350W04GSR6 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S-4 GW
Mounting Type: Chassis Mount
Frequency: 2.11GHz
Power - Output: 63W
Gain: 16.4dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4 GULL
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 750 mA
Produkt ist nicht verfügbar
AFT23S160W02GSR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-2L
Mounting Type: Surface Mount
Frequency: 2.4GHz
Power - Output: 45W
Gain: 17.9dB
Technology: LDMOS
Supplier Device Package: NI-780GS-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.1 A
Produkt ist nicht verfügbar
AFT23S160W02SR3 AFT23S160W02SR3 NXP USA Inc. AFT23S160W02S.pdf Description: FET RF 65V 2.4GHZ NI780S-2
Produkt ist nicht verfügbar
AFT26H200W03SR6 AFT26H200W03SR6 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 2.5GHz
Power - Output: 45W
Gain: 14.1dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
AFT27S006NT1 AFT27S006NT1 NXP USA Inc. www.nxp.com Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 28.8dBm
Gain: 22dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 70 mA
auf Bestellung 1000 Stücke:
Lieferzeit 21-28 Tag (e)
1000+17.73 EUR
Mindestbestellmenge: 1000
MC06XS4200BFKR2 MC06XS4200BFKR2 NXP USA Inc. MC06XS4200.pdf Description: IC PWR SWITCH N-CHAN 1:1 23PQFN
Produkt ist nicht verfügbar
MC10XS3535JHFKR2 NXP USA Inc. Description: IC PWR SWITCH N-CHAN 1:6 24PQFN
Features: Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max), 35mOhm (Max)
Voltage - Load: 7V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Ratio - Input:Output: 1:6
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Part Status: Obsolete
Produkt ist nicht verfügbar
MC10XS4200BAFKR2 MC10XS4200BAFKR2 NXP USA Inc. MC10XS4200.pdf Description: IC PWR SWITCH N-CHAN 1:1 23PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
MC10XS4200BFKR2 MC10XS4200BFKR2 NXP USA Inc. MC10XS4200.pdf Description: IC PWR SWITCH N-CHAN 1:1 23PQFN
Produkt ist nicht verfügbar
MC20XS4200BAFKR2 MC20XS4200BAFKR2 NXP USA Inc. www.nxp.com Description: IC PWR SWITCH N-CHAN 1:1 23PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 20mOhm (Max)
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 3A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
MC20XS4200BFKR2 MC20XS4200BFKR2 NXP USA Inc. MC20XS4200.pdf Description: IC PWR SWITCH N-CHAN 1:1 23PQFN
Produkt ist nicht verfügbar
MC56F84550VLFR MC56F84550VLFR NXP USA Inc. MC56F8455X.pdf Description: IC MCU 32BIT 96KB FLASH 48LQFP
auf Bestellung 2000 Stücke:
Lieferzeit 21-28 Tag (e)
MC9S08PA16VLCR MC9S08PA16VLCR NXP USA Inc. MC9S08PA16_Rev.1.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S08PA16VTJR MC9S08PA16VTJR NXP USA Inc. MC9S08PA16_Rev.1.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Produkt ist nicht verfügbar
MC9S08PA32VLDR MC9S08PA32VLDR NXP USA Inc. www.nxp.com Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 37
Produkt ist nicht verfügbar
MC9S08PA4VTGR MC9S08PA4VTGR NXP USA Inc. MC9S08PA4.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Produkt ist nicht verfügbar
MC9S08PA4VWJR MC9S08PA4VWJR NXP USA Inc. MC9S08PA4.pdf Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 18
Produkt ist nicht verfügbar
MC9S08PA60VLDR MC9S08PA60VLDR NXP USA Inc. MC9S08PA60VLH_Web.pdf Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S08PA8VTGR MC9S08PA8VTGR NXP USA Inc. MC9S08PA16_Rev.1.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S08PA8VWJR MC9S08PA8VWJR NXP USA Inc. MC9S08PA16_Rev.1.pdf Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PCA9570GMH PCA9570.pdf
PCA9570GMH
Hersteller: NXP USA Inc.
Description: IC XPNDR 100KHZ I2C SMBUS 8XQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 4
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 100 kHz
Interrupt Output: No
Supplier Device Package: 8-XQFN (1.6x1.6)
Current - Output Source/Sink: 4mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 25044 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
14+1.98 EUR
15+ 1.74 EUR
25+ 1.64 EUR
100+ 1.34 EUR
250+ 1.24 EUR
500+ 1.06 EUR
1000+ 0.85 EUR
Mindestbestellmenge: 14
PCA9617ATPZ PCA9617A.pdf
PCA9617ATPZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 1MHZ 8HWSON
Packaging: Cut Tape (CT)
Package / Case: 8-WFDFN Exposed Pad
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 5.5V, 2.2V ~ 5.5V
Applications: I2C
Current - Supply: 50µA
Data Rate (Max): 1MHz
Supplier Device Package: 8-HWSON (2x3)
Part Status: Active
Capacitance - Input: 7 pF
auf Bestellung 1250 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
8+3.41 EUR
10+ 3.04 EUR
25+ 2.89 EUR
100+ 2.37 EUR
250+ 2.22 EUR
500+ 1.96 EUR
1000+ 1.55 EUR
Mindestbestellmenge: 8
PCA9952TW/Q900,118 PCA9952_PCA9955.pdf
PCA9952TW/Q900,118
Hersteller: NXP USA Inc.
Description: IC LED DRV LIN PWM 57MA 28HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 57mA
Internal Switch(s): Yes
Supplier Device Package: 28-HTSSOP
Dimming: PWM
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 13276 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
3+11 EUR
10+ 9.87 EUR
25+ 9.33 EUR
100+ 8.09 EUR
250+ 7.67 EUR
500+ 6.88 EUR
1000+ 5.81 EUR
Mindestbestellmenge: 3
PCAL6416AEXX
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24XFBGA
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-XFBGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-XFBGA (2x2)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PCT2075DP,118 PCT2075.pdf
PCT2075DP,118
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Features: Output Switch, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
auf Bestellung 20595 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
13+2.13 EUR
16+ 1.62 EUR
25+ 1.4 EUR
50+ 1.35 EUR
100+ 1.15 EUR
500+ 1 EUR
1000+ 0.88 EUR
Mindestbestellmenge: 13
PTN36242LBS,518 PTN36242L.pdf
PTN36242LBS,518
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 2CH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Delay Time: 0.4ns
Number of Channels: 2
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: USB 3.0
Current - Supply: 225mA
Supplier Device Package: 32-HVQFN (3x6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Produkt ist nicht verfügbar
SC16IS741AIPWJ SC16IS741A.pdf
SC16IS741AIPWJ
Hersteller: NXP USA Inc.
Description: IC UART SGL I2C BUS SPI 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Number of Channels: 1, UART
Mounting Type: Surface Mount
Voltage - Supply: 2.3V ~ 3.6V
FIFO's: 64 Byte
Protocol: RS232, RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 16-TSSOP
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With Modem Control: Yes
Part Status: Active
auf Bestellung 32364 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
5+5.64 EUR
10+ 5.07 EUR
25+ 4.79 EUR
100+ 4.15 EUR
250+ 3.94 EUR
500+ 3.75 EUR
Mindestbestellmenge: 5
SDIO101AIHRZ SDIO101A.pdf
SDIO101AIHRZ
Hersteller: NXP USA Inc.
Description: IC FLASH MEMORY CTRLR 60HXQFN
Produkt ist nicht verfügbar
LPC11E37HFBD64/4QL LPC11E3X.pdf
LPC11E37HFBD64/4QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
OM13062UL LPC11U3x_Rev2.3.pdf
OM13062UL
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC11U37H EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Board Type: Evaluation Platform
Utilized IC / Part: LPC11U37H
Platform: LPCXpresso™
Part Status: Active
Produkt ist nicht verfügbar
FRDM-FXS-MULTI-B Xtrinsic_Sensors_Platform_FS.pdf
FRDM-FXS-MULTI-B
Hersteller: NXP USA Inc.
Description: DEV KIT FOR XTRINSIC SENSOR BT
Packaging: Box
For Use With/Related Products: Kinetis, mbed-Enabled Development
Accessory Type: Sensor Board
Produkt ist nicht verfügbar
FRDM-FXS-9AXIS Xtrinsic_Sensors_Platform_FS.pdf
FRDM-FXS-9AXIS
Hersteller: NXP USA Inc.
Description: DEV KIT FOR 9AXIS XTRINSIC SNSR
Produkt ist nicht verfügbar
OM13061UL LPC185x,3x,2x,1x.pdf
OM13061UL
Hersteller: NXP USA Inc.
Description: XPLORER LPC1837 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1837
Platform: Xplorer
Part Status: Obsolete
Produkt ist nicht verfügbar
TWR-KW24D512 DWF13_AMF_IND_T0274_Ottawa.pdf#Page=22
TWR-KW24D512
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM KIT
auf Bestellung 26 Stücke:
Lieferzeit 21-28 Tag (e)
PCF8545ATT/AJ PCF8545.pdf
PCF8545ATT/AJ
Hersteller: NXP USA Inc.
Description: IC DRVR 320 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C
Configuration: 320 Segment
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Supplier Device Package: 56-TSSOP
Current - Supply: 30 µA
Produkt ist nicht verfügbar
PCF8545BTT/AJ PCF8545.pdf
PCF8545BTT/AJ
Hersteller: NXP USA Inc.
Description: IC DRVR 320 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 320 Segment
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
Current - Supply: 30 µA
Produkt ist nicht verfügbar
PCA8546ATT/AJ PCA8546.pdf
PCA8546ATT/AJ
Hersteller: NXP USA Inc.
Description: IC DRVR 176 SEGMENT 56TSSOP
Produkt ist nicht verfügbar
PCA8546BTT/AJ PCA8546.pdf
PCA8546BTT/AJ
Hersteller: NXP USA Inc.
Description: IC DRVR 176 SEGMENT 56TSSOP
Produkt ist nicht verfügbar
PCA8546ATT/AJ PCA8546.pdf
PCA8546ATT/AJ
Hersteller: NXP USA Inc.
Description: IC DRVR 176 SEGMENT 56TSSOP
Produkt ist nicht verfügbar
PCA8546BTT/AJ PCA8546.pdf
PCA8546BTT/AJ
Hersteller: NXP USA Inc.
Description: IC DRVR 176 SEGMENT 56TSSOP
Produkt ist nicht verfügbar
LPC11U67JBD48E LPC11U6X.pdf
LPC11U67JBD48E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 277 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
2+17.37 EUR
10+ 13.64 EUR
80+ 11.29 EUR
Mindestbestellmenge: 2
LPC11U68JBD64E LPC11U6X.pdf
LPC11U68JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
LPC11U68JBD100E LPC11U6X.pdf
LPC11U68JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
OM13058UL LPC11U6X.pdf
OM13058UL
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC11U68 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC11U68
Platform: LPCXpresso™
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1+70.38 EUR
TWR-K64F120M TWR-K64F120M_QSG.pdf
TWR-K64F120M
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K64 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K64
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
TWR-13237 DevKit_PB.pdf
TWR-13237
Hersteller: NXP USA Inc.
Description: KIT DEVELOPMENT MC13237CHT
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1+536.9 EUR
TWR-13237-KIT DevKit_PB.pdf
TWR-13237-KIT
Hersteller: NXP USA Inc.
Description: KIT DEVELOPMENT MC13237CHT
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1+854.57 EUR
TWR-MC-FRDMKE02Z
Hersteller: NXP USA Inc.
Description: TOWER MOD KE BD TWR-MC-LV3PH
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: Interface Board
Part Status: Active
Produkt ist nicht verfügbar
13237ADC-BDM DevKit_PB.pdf
13237ADC-BDM
Hersteller: NXP USA Inc.
Description: KIT DEV MC13237CHT BDM
Packaging: Bulk
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1+1216.88 EUR
ADAM20G1KIT
Hersteller: NXP USA Inc.
Description: KIT EVAL ADAM 2.1GHZ
Packaging: Bulk
Type: Amplifier
Supplied Contents: Board(s), Cable(s)
Part Status: Active
Produkt ist nicht verfügbar
BRKOUT-FXLN8361Q FXLN83xxQ.pdf
BRKOUT-FXLN8361Q
Hersteller: NXP USA Inc.
Description: BOARD BREAKOUT FXLN8361Q
Packaging: Box
Sensitivity: 229mV/g, 57.25mV/g
Interface: Analog
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLN8361Q
Supplied Contents: Board(s)
Sensing Range: ±2g, 8g
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1+37.44 EUR
BRKOUT-FXLN8371Q FXLN83xxQ.pdf
BRKOUT-FXLN8371Q
Hersteller: NXP USA Inc.
Description: BOARD BREAKOUT FXLN8371Q
Packaging: Box
Sensitivity: 229mV/g, 57.25mV/g
Interface: Analog
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLN8371Q
Supplied Contents: Board(s)
Sensing Range: ±2g, 8g
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1+38.79 EUR
BRKOUT-FXLS8471Q FXLS8471QFS.pdf
Hersteller: NXP USA Inc.
Description: BOARD BREAKOUT FXLS8471Q
Produkt ist nicht verfügbar
CWP-MCTB-S12ZV-N
Hersteller: NXP USA Inc.
Description: MOTOR CTRL TOOLBOX MC9S12ZVMX
Produkt ist nicht verfügbar
DLD-MCTB-S12ZV-N
Hersteller: NXP USA Inc.
Description: DNLD MC9S12ZVMX CTRL TOOLBOX
Produkt ist nicht verfügbar
DL-RAPPID577XKSW
Hersteller: NXP USA Inc.
Description: DL PEX RAPPID SUITE V10 MPC577XK
Packaging: Electronic Delivery
For Use With/Related Products: MPC5xx
Type: Integrated Development Environment (IDE)
Applications: Programming
Operating System: Windows
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
KITFXLC95000MAG
Hersteller: NXP USA Inc.
Description: KIT XTRINSIC FXLC95000
Packaging: Bulk
Sensitivity: 0.061mg/LSB, 0.122mg/LSB, 0.244mg/LSB
Interface: I2C, Serial, SPI
Voltage - Supply: 1.71V ~ 1.89V
Sensor Type: Accelerometer, Temperature
Utilized IC / Part: FXLC95000CL
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Sensing Range: ±2g, 4g, 8g
Part Status: Active
Produkt ist nicht verfügbar
S912XDG128F2CAAR MC9S12XDP512RMV2.pdf
S912XDG128F2CAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12VR48AF0MLFR 15944_MC9S12VRRMV3.pdf
S9S12VR48AF0MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
AFT21H350W03SR6
AFT21H350W03SR6
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 2.11GHZ NI1230S
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 2.11GHz
Power - Output: 63W
Gain: 16.4dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 750 mA
Produkt ist nicht verfügbar
AFT21H350W04GSR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S-4 GW
Mounting Type: Chassis Mount
Frequency: 2.11GHz
Power - Output: 63W
Gain: 16.4dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4 GULL
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 750 mA
Produkt ist nicht verfügbar
AFT23S160W02GSR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-2L
Mounting Type: Surface Mount
Frequency: 2.4GHz
Power - Output: 45W
Gain: 17.9dB
Technology: LDMOS
Supplier Device Package: NI-780GS-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.1 A
Produkt ist nicht verfügbar
AFT23S160W02SR3 AFT23S160W02S.pdf
AFT23S160W02SR3
Hersteller: NXP USA Inc.
Description: FET RF 65V 2.4GHZ NI780S-2
Produkt ist nicht verfügbar
AFT26H200W03SR6
AFT26H200W03SR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 2.5GHz
Power - Output: 45W
Gain: 14.1dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
AFT27S006NT1 www.nxp.com
AFT27S006NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 28.8dBm
Gain: 22dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 70 mA
auf Bestellung 1000 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1000+17.73 EUR
Mindestbestellmenge: 1000
MC06XS4200BFKR2 MC06XS4200.pdf
MC06XS4200BFKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 23PQFN
Produkt ist nicht verfügbar
MC10XS3535JHFKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:6 24PQFN
Features: Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max), 35mOhm (Max)
Voltage - Load: 7V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Ratio - Input:Output: 1:6
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Part Status: Obsolete
Produkt ist nicht verfügbar
MC10XS4200BAFKR2 MC10XS4200.pdf
MC10XS4200BAFKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 23PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
MC10XS4200BFKR2 MC10XS4200.pdf
MC10XS4200BFKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 23PQFN
Produkt ist nicht verfügbar
MC20XS4200BAFKR2 www.nxp.com
MC20XS4200BAFKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 23PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 20mOhm (Max)
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 3A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Produkt ist nicht verfügbar
MC20XS4200BFKR2 MC20XS4200.pdf
MC20XS4200BFKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 23PQFN
Produkt ist nicht verfügbar
MC56F84550VLFR MC56F8455X.pdf
MC56F84550VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
auf Bestellung 2000 Stücke:
Lieferzeit 21-28 Tag (e)
MC9S08PA16VLCR MC9S08PA16_Rev.1.pdf
MC9S08PA16VLCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S08PA16VTJR MC9S08PA16_Rev.1.pdf
MC9S08PA16VTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Produkt ist nicht verfügbar
MC9S08PA32VLDR www.nxp.com
MC9S08PA32VLDR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 37
Produkt ist nicht verfügbar
MC9S08PA4VTGR MC9S08PA4.pdf
MC9S08PA4VTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Produkt ist nicht verfügbar
MC9S08PA4VWJR MC9S08PA4.pdf
MC9S08PA4VWJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 18
Produkt ist nicht verfügbar
MC9S08PA60VLDR MC9S08PA60VLH_Web.pdf
MC9S08PA60VLDR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S08PA8VTGR MC9S08PA16_Rev.1.pdf
MC9S08PA8VTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S08PA8VWJR MC9S08PA16_Rev.1.pdf
MC9S08PA8VWJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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