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MMRF1304LR5 MMRF1304LR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360
Mounting Type: Chassis Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.9dB
Technology: LDMOS
Supplier Device Package: NI-360
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
Produkt ist nicht verfügbar
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MMRF1304NR1 MMRF1304NR1 NXP USA Inc. Description: RF MOSFET LDMOS 50V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.4dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
Produkt ist nicht verfügbar
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MMRF1305HR5 MMRF1305HR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 512MHz
Configuration: Dual
Power - Output: 100W
Gain: 26dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
50+136.37 EUR
Mindestbestellmenge: 50
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MMRF1305HSR5 MMRF1305HSR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 512MHz
Configuration: Dual
Power - Output: 100W
Gain: 26dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MMRF1306HSR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MMRF2004NBR1 MMRF2004NBR1 NXP USA Inc. Description: RF MOSFET LDMOS 28V TO272-16
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.7GHz
Power - Output: 4W
Gain: 28.5dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 77 mA
Produkt ist nicht verfügbar
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MRF8P20140WGHSR3 MRF8P20140WGHSR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 1.88GHz ~ 1.91GHz
Configuration: Dual
Power - Output: 24W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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MRFE6VP5300GNR1 MRFE6VP5300GNR1 NXP USA Inc. MRFE6VP5300N.pdf Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270BB
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 600MHz
Configuration: Dual
Power - Output: 300W
Gain: 27dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4 Gull
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MRFE6VP5300NR1 MRFE6VP5300NR1 NXP USA Inc. MRFE6VP5300N.pdf Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 600MHz
Configuration: Dual
Power - Output: 300W
Gain: 27dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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S9S08RNA32W1MLCR S9S08RNA32W1MLCR NXP USA Inc. S9S08RN60DS.pdf Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+4.17 EUR
Mindestbestellmenge: 2000
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S9S12G96F0MLHR S9S12G96F0MLHR NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 96KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5674FF3MVY3R SPC5674FF3MVY3R NXP USA Inc. MPC5674F.pdf Description: IC MCU 32BIT 4MB FLASH 516PBGA
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CP-MCTB-MKV10Z-N NXP USA Inc. Description: MATLAB SIMULINK MKV10Z PHY. LIC.
Produkt ist nicht verfügbar
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DL-MCTB-MKV10Z-N NXP USA Inc. Description: MATLAB SIMULINK MKV10Z DNLD LIC.
Produkt ist nicht verfügbar
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D-MCTB-MC56F82-N NXP USA Inc. Description: DOWNLOAD TOOLBOX MBD MC56F82XX
Packaging: Box
Type: Integrated Development Environment (IDE)
Applications: Motor Control
Utilized IC / Part: MC56F82xx
Produkt ist nicht verfügbar
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MMPF0200NPAZES MMPF0200NPAZES NXP USA Inc. MMPF0200.pdf Description: IC REG CONV I.MX6 11OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S12ZVMC12EVBCAN S12ZVMC12EVBCAN NXP USA Inc. S12ZVM12EVB.pdf Description: BOARD EVAL S12ZVM
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S12ZVMC128
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC, PMSM)
Embedded: Yes, MCU, 16-Bit
Part Status: Active
Contents: Board(s)
Secondary Attributes: CAN Interface(s)
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+766.69 EUR
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S12ZVML12EVBLIN S12ZVML12EVBLIN NXP USA Inc. Description: EVAL BOARD FOR S12ZVML128
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S12ZVML128
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC, PMSM)
Embedded: Yes, MCU, 16-Bit
Contents: Board(s)
Secondary Attributes: LIN Interface(s)
Produkt ist nicht verfügbar
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T2080QDS-PA NXP USA Inc. Description: T2080 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e6500
Board Type: Evaluation Platform
Utilized IC / Part: T2080
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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T2080RDB-PA T2080RDB-PA NXP USA Inc. T2080RDBFS.pdf Description: T2080 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e6500
Board Type: Evaluation Platform
Utilized IC / Part: T2080
Part Status: Obsolete
Produkt ist nicht verfügbar
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T4240RDB-PB T4240RDB-PB NXP USA Inc. T4240T4160FS.pdf Description: T4240 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e6500
Board Type: Evaluation Platform
Utilized IC / Part: T4240
Part Status: Active
Produkt ist nicht verfügbar
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TRK-S12ZVH128 NXP USA Inc. TRK-S12ZVH128_QSG.PDF Description: STARTERTRAK S12ZVH EVAL BRD
Produkt ist nicht verfügbar
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MCIMX6U8DVM10AC MCIMX6U8DVM10AC NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)
1+65.84 EUR
10+54.03 EUR
60+52.55 EUR
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MMPF0100NPAZES MMPF0100NPAZES NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 430 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.88 EUR
10+12.38 EUR
25+11.5 EUR
100+10.54 EUR
260+10.07 EUR
Mindestbestellmenge: 2
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MMPF0200F3ANES MMPF0200F3ANES NXP USA Inc. MMPF0200.pdf Description: IC REG CONV I.MX6 11OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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S912XEA128J2MAA S912XEA128J2MAA NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 588 Stücke:
Lieferzeit 10-14 Tag (e)
1+32.7 EUR
10+26.13 EUR
84+22.07 EUR
504+21.93 EUR
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S912XEP100BCAG S912XEP100BCAG NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
auf Bestellung 400 Stücke:
Lieferzeit 10-14 Tag (e)
1+48.73 EUR
10+39.35 EUR
25+37.01 EUR
80+34.78 EUR
300+32.99 EUR
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S912ZVFP64F1CLL S912ZVFP64F1CLL NXP USA Inc. S12ZVHFS.pdf Description: IC MCU 16BIT 64KB FLASH 100LQFP
Produkt ist nicht verfügbar
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S912ZVFP64F1CLQ S912ZVFP64F1CLQ NXP USA Inc. S12ZVHFS.pdf Description: IC MCU 16BIT 64KB FLASH 144LQFP
auf Bestellung 266 Stücke:
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S912ZVFP64F1VLL S912ZVFP64F1VLL NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 4x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVH128F2CLQ S912ZVH128F2CLQ NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVH128F2VLQ S912ZVH128F2VLQ NXP USA Inc. S12ZVHFS.pdf Description: IC MCU 16BIT 128KB FLASH 144LQFP
Produkt ist nicht verfügbar
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S912ZVH64F2CLQ S912ZVH64F2CLQ NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVH64F2VLQ S912ZVH64F2VLQ NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVHY32F1VLL S912ZVHY32F1VLL NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 4x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 73
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVHY64F1CLL S912ZVHY64F1CLL NXP USA Inc. MC9S12ZVHYRMV1.pdf Description: IC MCU 16BIT 64KB FLASH 100LQFP
Produkt ist nicht verfügbar
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S912ZVHY64F1CLQ S912ZVHY64F1CLQ NXP USA Inc. www.nxp.com Description: IC MCU 16BIT 64KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVHY64F1VLL S912ZVHY64F1VLL NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 4x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 73
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVMC12F1MKH S912ZVMC12F1MKH NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVMC12F1WKH S912ZVMC12F1WKH NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVML12F1MKH S912ZVML12F1MKH NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVML12F1WKH S912ZVML12F1WKH NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
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S9S12GA48F0MLF S9S12GA48F0MLF NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12HY32J0CLH S9S12HY32J0CLH NXP USA Inc. MC9S12HY64RMV1.pdf Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5517EAVLU66 SPC5517EAVLU66 NXP USA Inc. MPC5510.pdf Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 137
DigiKey Programmable: Not Verified
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SPC5644CF0VLU8 SPC5644CF0VLU8 NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
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MC33882PEK MC33882PEK NXP USA Inc. MC33882.pdf Description: IC PWR DRIVER N-CHAN 1:1 32SOIC
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MC50XS4200BEK MC50XS4200BEK NXP USA Inc. MC50XS4200.pdf Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Packaging: Tube
Features: Slew Rate Controlled
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 50mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3.3V ~ 5V
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
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MC50XSD200BEK MC50XSD200BEK NXP USA Inc. MC50XSD200BEK.pdf Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
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OM13065UL OM13065UL NXP USA Inc. LPC11U6X.pdf Description: LPC11U68 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC11U68
Produkt ist nicht verfügbar
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NVT4555UKZ NVT4555UKZ NXP USA Inc. NVT4555.pdf Description: IC INTERFACE SPECIALIZED 12WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA
Mounting Type: Surface Mount
Voltage - Supply: 1.1V ~ 3.6V
Applications: SIM Card
Supplier Device Package: 12-WLCSP (1.20x1.60)
Produkt ist nicht verfügbar
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PCA9539BSHP PCA9539BSHP NXP USA Inc. PCA9539_PCA9539R.pdf Description: IC XPNDR 400KHZ I2C 24HVQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 50mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NVT4555UKZ NVT4555UKZ NXP USA Inc. NVT4555.pdf Description: IC INTERFACE SPECIALIZED 12WLCSP
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA
Mounting Type: Surface Mount
Voltage - Supply: 1.1V ~ 3.6V
Applications: SIM Card
Supplier Device Package: 12-WLCSP (1.20x1.60)
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PCA9531PW,118 PCA9531PW,118 NXP USA Inc. PCA9531.pdf Description: IC LED DRVR LIN I2C 25MA 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Outputs: 8
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 16-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Active
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PCA9558PW,118 PCA9558PW,118 NXP USA Inc. PCA9558.pdf Description: IC INTERFACE SPECIALIZED 28TSSOP
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PCA9559PW,118 PCA9559PW,118 NXP USA Inc. PCA9559.pdf Description: IC INTERFACE SPECIALIZED 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 3V ~ 3.6V
Applications: PC's, PDA's
Supplier Device Package: 20-TSSOP
Part Status: Active
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PCAL9538ABSHP PCAL9538ABSHP NXP USA Inc. PCAL9538A.pdf Description: IC EXPANDER GPIO 8BIT 16HVQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
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LPC1768UKJ LPC1768UKJ NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BFU520AR BFU520AR NXP USA Inc. BFU520A.pdf Description: RF TRANS NPN 12V 10GHZ SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 18dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Frequency - Transition: 10GHz
Noise Figure (dB Typ @ f): 0.7dB @ 900MHz
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q101
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3000+0.35 EUR
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BFU520R BFU520R NXP USA Inc. BFU520.pdf Description: RF TRANS NPN 12V 10.5GHZ SOT143B
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 20dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Frequency - Transition: 10.5GHz
Noise Figure (dB Typ @ f): 0.65dB @ 900MHz
Supplier Device Package: SOT-143B
Part Status: Active
Grade: Automotive
Qualification: AEC-Q101
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3000+0.25 EUR
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MMRF1304LR5
MMRF1304LR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360
Mounting Type: Chassis Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.9dB
Technology: LDMOS
Supplier Device Package: NI-360
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
Produkt ist nicht verfügbar
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MMRF1304NR1
MMRF1304NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.4dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
Produkt ist nicht verfügbar
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MMRF1305HR5
MMRF1305HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 512MHz
Configuration: Dual
Power - Output: 100W
Gain: 26dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
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Anzahl Preis
50+136.37 EUR
Mindestbestellmenge: 50
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MMRF1305HSR5
MMRF1305HSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 512MHz
Configuration: Dual
Power - Output: 100W
Gain: 26dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MMRF1306HSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MMRF2004NBR1
MMRF2004NBR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO272-16
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.7GHz
Power - Output: 4W
Gain: 28.5dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 77 mA
Produkt ist nicht verfügbar
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MRF8P20140WGHSR3
MRF8P20140WGHSR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 1.88GHz ~ 1.91GHz
Configuration: Dual
Power - Output: 24W
Gain: 16dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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MRFE6VP5300GNR1 MRFE6VP5300N.pdf
MRFE6VP5300GNR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270BB
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 600MHz
Configuration: Dual
Power - Output: 300W
Gain: 27dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4 Gull
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MRFE6VP5300NR1 MRFE6VP5300N.pdf
MRFE6VP5300NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 600MHz
Configuration: Dual
Power - Output: 300W
Gain: 27dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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S9S08RNA32W1MLCR S9S08RN60DS.pdf
S9S08RNA32W1MLCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2000+4.17 EUR
Mindestbestellmenge: 2000
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S9S12G96F0MLHR MC9S12GRMV1.pdf
S9S12G96F0MLHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5674FF3MVY3R MPC5674F.pdf
SPC5674FF3MVY3R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 516PBGA
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CP-MCTB-MKV10Z-N
Hersteller: NXP USA Inc.
Description: MATLAB SIMULINK MKV10Z PHY. LIC.
Produkt ist nicht verfügbar
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DL-MCTB-MKV10Z-N
Hersteller: NXP USA Inc.
Description: MATLAB SIMULINK MKV10Z DNLD LIC.
Produkt ist nicht verfügbar
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D-MCTB-MC56F82-N
Hersteller: NXP USA Inc.
Description: DOWNLOAD TOOLBOX MBD MC56F82XX
Packaging: Box
Type: Integrated Development Environment (IDE)
Applications: Motor Control
Utilized IC / Part: MC56F82xx
Produkt ist nicht verfügbar
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MMPF0200NPAZES MMPF0200.pdf
MMPF0200NPAZES
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 11OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S12ZVMC12EVBCAN S12ZVM12EVB.pdf
S12ZVMC12EVBCAN
Hersteller: NXP USA Inc.
Description: BOARD EVAL S12ZVM
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S12ZVMC128
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC, PMSM)
Embedded: Yes, MCU, 16-Bit
Part Status: Active
Contents: Board(s)
Secondary Attributes: CAN Interface(s)
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+766.69 EUR
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S12ZVML12EVBLIN
S12ZVML12EVBLIN
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR S12ZVML128
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S12ZVML128
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC, PMSM)
Embedded: Yes, MCU, 16-Bit
Contents: Board(s)
Secondary Attributes: LIN Interface(s)
Produkt ist nicht verfügbar
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T2080QDS-PA
Hersteller: NXP USA Inc.
Description: T2080 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e6500
Board Type: Evaluation Platform
Utilized IC / Part: T2080
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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T2080RDB-PA T2080RDBFS.pdf
T2080RDB-PA
Hersteller: NXP USA Inc.
Description: T2080 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e6500
Board Type: Evaluation Platform
Utilized IC / Part: T2080
Part Status: Obsolete
Produkt ist nicht verfügbar
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T4240RDB-PB T4240T4160FS.pdf
T4240RDB-PB
Hersteller: NXP USA Inc.
Description: T4240 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e6500
Board Type: Evaluation Platform
Utilized IC / Part: T4240
Part Status: Active
Produkt ist nicht verfügbar
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TRK-S12ZVH128 TRK-S12ZVH128_QSG.PDF
Hersteller: NXP USA Inc.
Description: STARTERTRAK S12ZVH EVAL BRD
Produkt ist nicht verfügbar
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MCIMX6U8DVM10AC IMX6SDLCEC.pdf
MCIMX6U8DVM10AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+65.84 EUR
10+54.03 EUR
60+52.55 EUR
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MMPF0100NPAZES MMPF0100.pdf
MMPF0100NPAZES
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 430 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.88 EUR
10+12.38 EUR
25+11.5 EUR
100+10.54 EUR
260+10.07 EUR
Mindestbestellmenge: 2
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MMPF0200F3ANES MMPF0200.pdf
MMPF0200F3ANES
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 11OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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S912XEA128J2MAA
S912XEA128J2MAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 588 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+32.7 EUR
10+26.13 EUR
84+22.07 EUR
504+21.93 EUR
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S912XEP100BCAG MC9S12XEP100RMV1.pdf
S912XEP100BCAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
auf Bestellung 400 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+48.73 EUR
10+39.35 EUR
25+37.01 EUR
80+34.78 EUR
300+32.99 EUR
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S912ZVFP64F1CLL S12ZVHFS.pdf
S912ZVFP64F1CLL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 100LQFP
Produkt ist nicht verfügbar
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S912ZVFP64F1CLQ S12ZVHFS.pdf
S912ZVFP64F1CLQ
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 144LQFP
auf Bestellung 266 Stücke:
Lieferzeit 10-14 Tag (e)
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S912ZVFP64F1VLL
S912ZVFP64F1VLL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 4x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVH128F2CLQ
S912ZVH128F2CLQ
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVH128F2VLQ S12ZVHFS.pdf
S912ZVH128F2VLQ
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 144LQFP
Produkt ist nicht verfügbar
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S912ZVH64F2CLQ
S912ZVH64F2CLQ
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVH64F2VLQ
S912ZVH64F2VLQ
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVHY32F1VLL
S912ZVHY32F1VLL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 4x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 73
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVHY64F1CLL MC9S12ZVHYRMV1.pdf
S912ZVHY64F1CLL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 100LQFP
Produkt ist nicht verfügbar
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S912ZVHY64F1CLQ www.nxp.com
S912ZVHY64F1CLQ
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVHY64F1VLL
S912ZVHY64F1VLL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 4x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 73
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVMC12F1MKH S12ZVMFS.pdf
S912ZVMC12F1MKH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVMC12F1WKH S12ZVMFS.pdf
S912ZVMC12F1WKH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVML12F1MKH S12ZVMFS.pdf
S912ZVML12F1MKH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVML12F1WKH S12ZVMFS.pdf
S912ZVML12F1WKH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
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S9S12GA48F0MLF MC9S12GRMV1.pdf
S9S12GA48F0MLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12HY32J0CLH MC9S12HY64RMV1.pdf
S9S12HY32J0CLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5517EAVLU66 MPC5510.pdf
SPC5517EAVLU66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 137
DigiKey Programmable: Not Verified
auf Bestellung 400 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+62.22 EUR
10+57.08 EUR
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SPC5644CF0VLU8 MPC5646C.pdf
SPC5644CF0VLU8
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
auf Bestellung 200 Stücke:
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MC33882PEK MC33882.pdf
MC33882PEK
Hersteller: NXP USA Inc.
Description: IC PWR DRIVER N-CHAN 1:1 32SOIC
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1+21.65 EUR
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MC50XS4200BEK MC50XS4200.pdf
MC50XS4200BEK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Packaging: Tube
Features: Slew Rate Controlled
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 50mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3.3V ~ 5V
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
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MC50XSD200BEK MC50XSD200BEK.pdf
MC50XSD200BEK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Produkt ist nicht verfügbar
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OM13065UL LPC11U6X.pdf
OM13065UL
Hersteller: NXP USA Inc.
Description: LPC11U68 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC11U68
Produkt ist nicht verfügbar
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NVT4555UKZ NVT4555.pdf
NVT4555UKZ
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 12WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA
Mounting Type: Surface Mount
Voltage - Supply: 1.1V ~ 3.6V
Applications: SIM Card
Supplier Device Package: 12-WLCSP (1.20x1.60)
Produkt ist nicht verfügbar
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PCA9539BSHP PCA9539_PCA9539R.pdf
PCA9539BSHP
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24HVQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 50mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NVT4555UKZ NVT4555.pdf
NVT4555UKZ
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 12WLCSP
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA
Mounting Type: Surface Mount
Voltage - Supply: 1.1V ~ 3.6V
Applications: SIM Card
Supplier Device Package: 12-WLCSP (1.20x1.60)
auf Bestellung 1744 Stücke:
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11+1.6 EUR
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100+1.29 EUR
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PCA9531PW,118 PCA9531.pdf
PCA9531PW,118
Hersteller: NXP USA Inc.
Description: IC LED DRVR LIN I2C 25MA 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Outputs: 8
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 16-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Active
auf Bestellung 17129 Stücke:
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PCA9558PW,118 PCA9558.pdf
PCA9558PW,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28TSSOP
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PCA9559PW,118 PCA9559.pdf
PCA9559PW,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 3V ~ 3.6V
Applications: PC's, PDA's
Supplier Device Package: 20-TSSOP
Part Status: Active
auf Bestellung 262 Stücke:
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6+3.17 EUR
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100+2.29 EUR
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PCAL9538ABSHP PCAL9538A.pdf
PCAL9538ABSHP
Hersteller: NXP USA Inc.
Description: IC EXPANDER GPIO 8BIT 16HVQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
auf Bestellung 3901 Stücke:
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6+2.99 EUR
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25+2.01 EUR
100+1.79 EUR
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500+1.63 EUR
1000+1.58 EUR
2500+1.52 EUR
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LPC1768UKJ LPC1769_68_67_66_65_64_63.pdf
LPC1768UKJ
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Discontinued at Digi-Key
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BFU520AR BFU520A.pdf
BFU520AR
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 10GHZ SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 18dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Frequency - Transition: 10GHz
Noise Figure (dB Typ @ f): 0.7dB @ 900MHz
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 12000 Stücke:
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3000+0.35 EUR
6000+0.34 EUR
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BFU520R BFU520.pdf
BFU520R
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 10.5GHZ SOT143B
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 20dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Frequency - Transition: 10.5GHz
Noise Figure (dB Typ @ f): 0.65dB @ 900MHz
Supplier Device Package: SOT-143B
Part Status: Active
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+0.25 EUR
Mindestbestellmenge: 3000
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