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TDA8579T/N1S118 TDA8579T/N1S118 NXP USA Inc. PHGLS28658-1.pdf?t.download=true&u=5oefqw Description: IC DUAL DIFF COMMON MODE REJECT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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AFT05MP075NR1 AFT05MP075NR1 NXP USA Inc. AFT05MP075N.pdf Description: RF MOSFET LDMOS 12.5V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 520MHz
Configuration: Dual
Power - Output: 70W
Gain: 18.5dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 400 mA
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74HC9115D/S400118 74HC9115D/S400118 NXP USA Inc. 74HC9115.pdf Description: IC BUFF 2V/6V 20-SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 9
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: -, 5.2mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
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74HC9115N,112 74HC9115N,112 NXP USA Inc. 74HC%28T%299115_Rev_Feb2017.pdf Description: IC BUFFER NON-INVERT 6V 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Open Drain
Mounting Type: Through Hole
Number of Elements: 9
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: -, 5.2mA
Supplier Device Package: 20-DIP
Part Status: Obsolete
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74HC251D-Q100118 NXP USA Inc. 74HC_HCT251_Q100.pdf Description: MUX, 8 LINE INPUT
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Active
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74HC251D/S400118 NXP USA Inc. 74HC_HCT251.pdf Description: MUX, 8 LINE INPUT
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Active
Produkt ist nicht verfügbar
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NX1A4WPZ NXP USA Inc. NX1A4WP_DS.pdf Description: IC WIRELESS PWR RECEIVER WLCSP42
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 6.1V ~ 18V
Applications: Wireless Power Receiver
Current - Supply: 12mA
Supplier Device Package: 42-WLCSP (3.56x3.41)
Part Status: Obsolete
Produkt ist nicht verfügbar
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NX2A4WPZ NXP USA Inc. NX2A4WP_DS.pdf Description: IC WIRELESS PWR RECEIVER
Packaging: Bulk
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 6.1V ~ 18V
Applications: Wireless Power Receiver
Current - Supply: 12mA
Supplier Device Package: 42-WLCSP (3.56x3.41)
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AHC1G32GW/AU125 NXP USA Inc. 74AHC_AHCT1G32.pdf Description: OR GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC1G32GV-Q100125 NXP USA Inc. 74AHC_AHCT1G32_Q100.pdf Description: OR GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC1G32GW132 NXP USA Inc. 74AHC_AHCT1G32.pdf Description: OR GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
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74AHC1G32GW/C3125 NXP USA Inc. 74AHC_AHCT1G32.pdf Description: OR GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
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74AHC1G32GW/C4125 NXP USA Inc. 74AHC_AHCT1G32.pdf Description: OR GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MMRF5017HSR5138 NXP USA Inc. PHGL-S-A0005882854-1.pdf?t.download=true&u=5oefqw Description: RF POWER FIELD-EFFECT TRANSISTOR
Packaging: Bulk
Produkt ist nicht verfügbar
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SSL3401HN/1518 NXP USA Inc. PHGLS29832-1.pdf?t.download=true&u=5oefqw Description: DIMMABLE LED CONTROLLER
Packaging: Bulk
Part Status: Active
auf Bestellung 102000 Stücke:
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MC15XS3400DHFK MC15XS3400DHFK NXP USA Inc. Description: IC PWR SWITCH N-CHAN 1:1 24PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 15mOhm
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEF5000EL/V1K NXP USA Inc. Description: WISPA-ITS
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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TEF5100EL/V1K NXP USA Inc. Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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SAF5000EL/V100Y NXP USA Inc. Description: IC RADIO SYSTEM MULTI
Produkt ist nicht verfügbar
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TEF5000EL/V1Y NXP USA Inc. Description: WISPA-ITS
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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TEF5100EL/V1Y NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IP4786CZ32518 IP4786CZ32518 NXP USA Inc. IP4786CZ32.pdf Description: IP4786CZ32S - CONSUMER CIRCUIT
Produkt ist nicht verfügbar
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LPC1767FBD100K LPC1767FBD100K NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 2020 Stücke:
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230+18.8 EUR
450+18.34 EUR
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LPC1758FBD80K LPC1758FBD80K NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
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MRF1K50H-TF2 MRF1K50H-TF2 NXP USA Inc. MRF1K50H.pdf Description: MRF1K50H REF BRD 27MHZ 1550W
Packaging: Bulk
For Use With/Related Products: MRF1K50H
Frequency: 27MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF1K50H
Supplied Contents: Board(s)
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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74HC74BQ/S400115 74HC74BQ/S400115 NXP USA Inc. PHGLS25597-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE DUAL 1BIT 14DHVQFN
Packaging: Bulk
Package / Case: 14-VFQFN Exposed Pad
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 82 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-DHVQFN (2.5x3)
Max Propagation Delay @ V, Max CL: 37ns @ 6V, 50pF
Part Status: Active
Number of Bits per Element: 1
Produkt ist nicht verfügbar
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PCA9515D,118 PCA9515D,118 NXP USA Inc. PCA9515.pdf Description: BUFFER, REDRIVER 2 CHANNEL 400KH
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: I²C
Current - Supply: 2.3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 6 pF
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BCW61C/DG/B2215 BCW61C/DG/B2215 NXP USA Inc. PHGLS09979-1.pdf?t.download=true&u=5oefqw Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 550mV @ 1.25mA, 50mA
Current - Collector Cutoff (Max): 20nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 250 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT23-3 (TO-236)
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 32 V
Power - Max: 250 mW
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PN7150B0UK/C11002Z PN7150B0UK/C11002Z NXP USA Inc. PN7150.pdf Description: IC RFID TRANSP 13.56MHZ 42WLCSP
Packaging: Bulk
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C
Type: RFID Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Standards: ISO 14443, ISO 25693, FeliCa, Mifare, NFC
Supplier Device Package: 42-WLCSP (2.88x2.8)
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LPC54618J512ET180E LPC54618J512ET180E NXP USA Inc. LPC546XX.pdf Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
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PCA9701D118 NXP USA Inc. PHGL-S-A0000131950-1.pdf?t.download=true&u=5oefqw Description: IC XPNDR 5MHZ SPI SERIAL 24SO
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: SPI Serial
Number of I/O: 16 (Input Only)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.5V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9703PW/Q900,118 PCA9703PW/Q900,118 NXP USA Inc. PCA9703.pdf Description: IC XPNDR 5MHZ SPI SERIAL 24TSSOP
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: SPI Serial
Number of I/O: 16 (Input Only)
Voltage - Supply: 4.5V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
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100+4.89 EUR
250+4.65 EUR
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74LVC1G332GW-Q100125 74LVC1G332GW-Q100125 NXP USA Inc. 74LVC1G332_Q100.pdf Description: IC GATE OR
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-TSSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
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74LVC1G332GV-Q100125 74LVC1G332GV-Q100125 NXP USA Inc. 74LVC1G332_Q100.pdf Description: IC GATE OR
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-TSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
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BFG325/XR,215 BFG325/XR,215 NXP USA Inc. BFG325_XR.pdf Description: RF TRANS NPN 6V 14GHZ SOT-143R
Packaging: Cut Tape (CT)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Gain: 18.3dB
Power - Max: 210mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 6V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 3V
Frequency - Transition: 14GHz
Noise Figure (dB Typ @ f): 1.1dB @ 2GHz
Supplier Device Package: SOT-143R
Produkt ist nicht verfügbar
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MF0ULH1101DUDV NXP USA Inc. MF0ULX1.pdf Description: IC MIFARE ULTRALIGHT EV1 FFC BUM
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF0ULH1101DUFV NXP USA Inc. MF0ULX1.pdf Description: IC MIFARE ULTRALIGHT EV1 FFC BUM
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PSMN1R4-40YLD,115 NXP USA Inc. Description: 100A, 40V, 0.00185OHM, N CHANNEL
Packaging: Bulk
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.4mOhm @ 25A, 10V
Power Dissipation (Max): 238W (Tc)
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Produkt ist nicht verfügbar
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NXQ1TXP5/101J NXP USA Inc. Description: QI TRANSMITTER
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 6000 Stücke
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BUK7Y43-60E115 BUK7Y43-60E115 NXP USA Inc. BUK7Y43-60E.pdf Description: N-CHANNEL POWER MOSFET
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BUK7Y153-100E115 BUK7Y153-100E115 NXP USA Inc. BUK7Y153-100E.pdf Description: N-CHANNEL POWER MOSFET
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PSMN2R6-60PS127 PSMN2R6-60PS127 NXP USA Inc. PSMN2R6-60PS.pdf Description: N-CHANNEL POWER MOSFET
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S912XEG128BMAAR S912XEG128BMAAR NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEG128BMAA S912XEG128BMAA NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC125AD-Q100118 74LVC125AD-Q100118 NXP USA Inc. 74LVC125A_Q100.pdf Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 14-SO
Grade: Automotive
Part Status: Obsolete
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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74LVC125APW-Q100118 74LVC125APW-Q100118 NXP USA Inc. 74LVC125A_Q100.pdf Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PEMI2QFN/WK,115 PEMI2QFN/WK,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHMS ESD SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 24dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 2
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MKE16F256VLH16 MKE16F256VLH16 NXP USA Inc. KE1xFP100M168SF0.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
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TDA8543T/N1,518 TDA8543T/N1,518 NXP USA Inc. TDA8543.pdf Description: IC AMP CLASS AB MONO 2.2W 16SO
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 18V
Max Output Power x Channels @ Load: 2.2W x 1 @ 8Ohm
Supplier Device Package: 16-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8566TH1/N2S118 TDA8566TH1/N2S118 NXP USA Inc. _TDA8566.pdf?t.download=true&u=ovmfp3 Description: 2 X 40 W/2 OHM STEREO BTL CAR RA
Packaging: Bulk
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class B
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 55W x 2 @ 2Ohm
Supplier Device Package: 24-HSOP
Part Status: Active
Produkt ist nicht verfügbar
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TDA9984AHW/15/C130551 TDA9984AHW/15/C130551 NXP USA Inc. Description: HDMI TRANSMITTER WITH 1080P UPSC
Packaging: Bulk
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MC56F8035VLD MC56F8035VLD NXP USA Inc. MC56F8036.pdf Description: IC MCU 16BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC10XS6325BEK MC10XS6325BEK NXP USA Inc. MC12XS6D2.pdf Description: IC PWR SWITCH HIGH SIDE 32SOIC
Features: Status Flag
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A, 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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S912XD64F2CAAR S912XD64F2CAAR NXP USA Inc. 9S12XDP512DGV1.pdf Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Cut Tape (CT)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
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PDTC114EE,115-NXP PDTC114EE,115-NXP NXP USA Inc. PHGLS24122-1.pdf?t.download=true&u=5oefqw Description: 0.1A, 50V, NPN, SC-75
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AUP1G74GM 74AUP1G74GM NXP USA Inc. PHGLS25988-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 1BIT 8XQFN
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 315 MHz
Input Capacitance: 0.6 pF
Supplier Device Package: 8-XQFN (1.6x1.6)
Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
Produkt ist nicht verfügbar
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TFA9887UK/N2062 TFA9887UK/N2062 NXP USA Inc. PHGLS25067-1.pdf?t.download=true&u=5oefqw Description: AUDIO SYSTEM WITH ADAPTIVE SOUND
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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127+4.96 EUR
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NCX2202GMZ NCX2202GMZ NXP USA Inc. NCX2202.pdf Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 1
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns (Typ)
Current - Quiescent (Max): 6µA (Typ)
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
Current - Output (Typ): 68mA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 5000 Stücke
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BYC10X-600P127 NXP USA Inc. Description: HYPERFAST RECTIFIER DIODE TO 22
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BZV90-C3V0115 BZV90-C3V0115 NXP USA Inc. Description: DIODE ZENER 36V 1.5W 5% UNI
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-223
Part Status: Active
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
Produkt ist nicht verfügbar
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TDA8579T/N1S118 PHGLS28658-1.pdf?t.download=true&u=5oefqw
TDA8579T/N1S118
Hersteller: NXP USA Inc.
Description: IC DUAL DIFF COMMON MODE REJECT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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AFT05MP075NR1 AFT05MP075N.pdf
AFT05MP075NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 520MHz
Configuration: Dual
Power - Output: 70W
Gain: 18.5dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 400 mA
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1+102.19 EUR
10+84.19 EUR
25+79.69 EUR
100+74.76 EUR
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74HC9115D/S400118 74HC9115.pdf
74HC9115D/S400118
Hersteller: NXP USA Inc.
Description: IC BUFF 2V/6V 20-SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 9
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: -, 5.2mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
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74HC9115N,112 74HC%28T%299115_Rev_Feb2017.pdf
74HC9115N,112
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Open Drain
Mounting Type: Through Hole
Number of Elements: 9
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: -, 5.2mA
Supplier Device Package: 20-DIP
Part Status: Obsolete
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74HC251D-Q100118 74HC_HCT251_Q100.pdf
Hersteller: NXP USA Inc.
Description: MUX, 8 LINE INPUT
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Active
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74HC251D/S400118 74HC_HCT251.pdf
Hersteller: NXP USA Inc.
Description: MUX, 8 LINE INPUT
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Active
Produkt ist nicht verfügbar
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NX1A4WPZ NX1A4WP_DS.pdf
Hersteller: NXP USA Inc.
Description: IC WIRELESS PWR RECEIVER WLCSP42
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 6.1V ~ 18V
Applications: Wireless Power Receiver
Current - Supply: 12mA
Supplier Device Package: 42-WLCSP (3.56x3.41)
Part Status: Obsolete
Produkt ist nicht verfügbar
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NX2A4WPZ NX2A4WP_DS.pdf
Hersteller: NXP USA Inc.
Description: IC WIRELESS PWR RECEIVER
Packaging: Bulk
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 6.1V ~ 18V
Applications: Wireless Power Receiver
Current - Supply: 12mA
Supplier Device Package: 42-WLCSP (3.56x3.41)
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AHC1G32GW/AU125 74AHC_AHCT1G32.pdf
Hersteller: NXP USA Inc.
Description: OR GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC1G32GV-Q100125 74AHC_AHCT1G32_Q100.pdf
Hersteller: NXP USA Inc.
Description: OR GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC1G32GW132 74AHC_AHCT1G32.pdf
Hersteller: NXP USA Inc.
Description: OR GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC1G32GW/C3125 74AHC_AHCT1G32.pdf
Hersteller: NXP USA Inc.
Description: OR GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
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74AHC1G32GW/C4125 74AHC_AHCT1G32.pdf
Hersteller: NXP USA Inc.
Description: OR GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MMRF5017HSR5138 PHGL-S-A0005882854-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: RF POWER FIELD-EFFECT TRANSISTOR
Packaging: Bulk
Produkt ist nicht verfügbar
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SSL3401HN/1518 PHGLS29832-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: DIMMABLE LED CONTROLLER
Packaging: Bulk
Part Status: Active
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MC15XS3400DHFK
MC15XS3400DHFK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 24PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 15mOhm
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEF5000EL/V1K
Hersteller: NXP USA Inc.
Description: WISPA-ITS
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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TEF5100EL/V1K
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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SAF5000EL/V100Y
Hersteller: NXP USA Inc.
Description: IC RADIO SYSTEM MULTI
Produkt ist nicht verfügbar
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TEF5000EL/V1Y
Hersteller: NXP USA Inc.
Description: WISPA-ITS
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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TEF5100EL/V1Y
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IP4786CZ32518 IP4786CZ32.pdf
IP4786CZ32518
Hersteller: NXP USA Inc.
Description: IP4786CZ32S - CONSUMER CIRCUIT
Produkt ist nicht verfügbar
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LPC1767FBD100K LPC1769_68_67_66_65_64_63.pdf
LPC1767FBD100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 2020 Stücke:
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1+28.69 EUR
10+22.68 EUR
24+21.24 EUR
80+19.75 EUR
230+18.8 EUR
450+18.34 EUR
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LPC1758FBD80K LPC1759_58_56_54_52_51.pdf
LPC1758FBD80K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
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1+20.99 EUR
10+15.42 EUR
25+14.04 EUR
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MRF1K50H-TF2 MRF1K50H.pdf
MRF1K50H-TF2
Hersteller: NXP USA Inc.
Description: MRF1K50H REF BRD 27MHZ 1550W
Packaging: Bulk
For Use With/Related Products: MRF1K50H
Frequency: 27MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF1K50H
Supplied Contents: Board(s)
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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74HC74BQ/S400115 PHGLS25597-1.pdf?t.download=true&u=5oefqw
74HC74BQ/S400115
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14DHVQFN
Packaging: Bulk
Package / Case: 14-VFQFN Exposed Pad
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 82 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-DHVQFN (2.5x3)
Max Propagation Delay @ V, Max CL: 37ns @ 6V, 50pF
Part Status: Active
Number of Bits per Element: 1
Produkt ist nicht verfügbar
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PCA9515D,118 PCA9515.pdf
PCA9515D,118
Hersteller: NXP USA Inc.
Description: BUFFER, REDRIVER 2 CHANNEL 400KH
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: I²C
Current - Supply: 2.3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 6 pF
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500+2.09 EUR
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BCW61C/DG/B2215 PHGLS09979-1.pdf?t.download=true&u=5oefqw
BCW61C/DG/B2215
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 550mV @ 1.25mA, 50mA
Current - Collector Cutoff (Max): 20nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 250 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT23-3 (TO-236)
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 32 V
Power - Max: 250 mW
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15000+0.038 EUR
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PN7150B0UK/C11002Z PN7150.pdf
PN7150B0UK/C11002Z
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 42WLCSP
Packaging: Bulk
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C
Type: RFID Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Standards: ISO 14443, ISO 25693, FeliCa, Mifare, NFC
Supplier Device Package: 42-WLCSP (2.88x2.8)
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46+13.72 EUR
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LPC54618J512ET180E LPC546XX.pdf
LPC54618J512ET180E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9701D118 PHGL-S-A0000131950-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC XPNDR 5MHZ SPI SERIAL 24SO
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: SPI Serial
Number of I/O: 16 (Input Only)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.5V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 24-SO
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9703PW/Q900,118 PCA9703.pdf
PCA9703PW/Q900,118
Hersteller: NXP USA Inc.
Description: IC XPNDR 5MHZ SPI SERIAL 24TSSOP
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: SPI Serial
Number of I/O: 16 (Input Only)
Voltage - Supply: 4.5V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
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3+7.79 EUR
10+5.89 EUR
25+5.41 EUR
100+4.89 EUR
250+4.65 EUR
500+4.63 EUR
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74LVC1G332GW-Q100125 74LVC1G332_Q100.pdf
74LVC1G332GW-Q100125
Hersteller: NXP USA Inc.
Description: IC GATE OR
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-TSSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
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3571+0.15 EUR
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74LVC1G332GV-Q100125 74LVC1G332_Q100.pdf
74LVC1G332GV-Q100125
Hersteller: NXP USA Inc.
Description: IC GATE OR
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-TSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
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3126+0.2 EUR
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BFG325/XR,215 BFG325_XR.pdf
BFG325/XR,215
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 6V 14GHZ SOT-143R
Packaging: Cut Tape (CT)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Gain: 18.3dB
Power - Max: 210mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 6V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 3V
Frequency - Transition: 14GHz
Noise Figure (dB Typ @ f): 1.1dB @ 2GHz
Supplier Device Package: SOT-143R
Produkt ist nicht verfügbar
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MF0ULH1101DUDV MF0ULX1.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE ULTRALIGHT EV1 FFC BUM
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF0ULH1101DUFV MF0ULX1.pdf
Hersteller: NXP USA Inc.
Description: IC MIFARE ULTRALIGHT EV1 FFC BUM
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PSMN1R4-40YLD,115
Hersteller: NXP USA Inc.
Description: 100A, 40V, 0.00185OHM, N CHANNEL
Packaging: Bulk
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.4mOhm @ 25A, 10V
Power Dissipation (Max): 238W (Tc)
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Produkt ist nicht verfügbar
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NXQ1TXP5/101J
Hersteller: NXP USA Inc.
Description: QI TRANSMITTER
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BUK7Y43-60E115 BUK7Y43-60E.pdf
BUK7Y43-60E115
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
auf Bestellung 7500 Stücke:
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BUK7Y153-100E115 BUK7Y153-100E.pdf
BUK7Y153-100E115
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
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PSMN2R6-60PS127 PSMN2R6-60PS.pdf
PSMN2R6-60PS127
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Produkt ist nicht verfügbar
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S912XEG128BMAAR MC9S12XEP100RMV1.pdf
S912XEG128BMAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEG128BMAA MC9S12XEP100RMV1.pdf
S912XEG128BMAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC125AD-Q100118 74LVC125A_Q100.pdf
74LVC125AD-Q100118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 14-SO
Grade: Automotive
Part Status: Obsolete
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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74LVC125APW-Q100118 74LVC125A_Q100.pdf
74LVC125APW-Q100118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PEMI2QFN/WK,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/WK,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHMS ESD SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 24dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 2
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3806+0.17 EUR
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MKE16F256VLH16 KE1xFP100M168SF0.pdf
MKE16F256VLH16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 738 Stücke:
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3+10.25 EUR
10+7.91 EUR
25+7.83 EUR
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TDA8543T/N1,518 TDA8543.pdf
TDA8543T/N1,518
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB MONO 2.2W 16SO
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 18V
Max Output Power x Channels @ Load: 2.2W x 1 @ 8Ohm
Supplier Device Package: 16-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8566TH1/N2S118 _TDA8566.pdf?t.download=true&u=ovmfp3
TDA8566TH1/N2S118
Hersteller: NXP USA Inc.
Description: 2 X 40 W/2 OHM STEREO BTL CAR RA
Packaging: Bulk
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class B
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 55W x 2 @ 2Ohm
Supplier Device Package: 24-HSOP
Part Status: Active
Produkt ist nicht verfügbar
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TDA9984AHW/15/C130551
TDA9984AHW/15/C130551
Hersteller: NXP USA Inc.
Description: HDMI TRANSMITTER WITH 1080P UPSC
Packaging: Bulk
auf Bestellung 13090 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
59+9.88 EUR
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MC56F8035VLD MC56F8036.pdf
MC56F8035VLD
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC10XS6325BEK MC12XS6D2.pdf
MC10XS6325BEK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32SOIC
Features: Status Flag
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A, 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
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S912XD64F2CAAR 9S12XDP512DGV1.pdf
S912XD64F2CAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Cut Tape (CT)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 235 Stücke:
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1+33.32 EUR
10+26.53 EUR
25+24.82 EUR
100+22.94 EUR
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PDTC114EE,115-NXP PHGLS24122-1.pdf?t.download=true&u=5oefqw
PDTC114EE,115-NXP
Hersteller: NXP USA Inc.
Description: 0.1A, 50V, NPN, SC-75
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AUP1G74GM PHGLS25988-1.pdf?t.download=true&u=5oefqw
74AUP1G74GM
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 8XQFN
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 315 MHz
Input Capacitance: 0.6 pF
Supplier Device Package: 8-XQFN (1.6x1.6)
Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
Produkt ist nicht verfügbar
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TFA9887UK/N2062 PHGLS25067-1.pdf?t.download=true&u=5oefqw
TFA9887UK/N2062
Hersteller: NXP USA Inc.
Description: AUDIO SYSTEM WITH ADAPTIVE SOUND
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 400000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
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NCX2202GMZ NCX2202.pdf
NCX2202GMZ
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 1
Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns (Typ)
Current - Quiescent (Max): 6µA (Typ)
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
Current - Output (Typ): 68mA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Active
Produkt ist nicht verfügbar
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BYC10X-600P127
Hersteller: NXP USA Inc.
Description: HYPERFAST RECTIFIER DIODE TO 22
Packaging: Bulk
Part Status: Active
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BZV90-C3V0115
BZV90-C3V0115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 36V 1.5W 5% UNI
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3 V
Impedance (Max) (Zzt): 95 Ohms
Supplier Device Package: SOT-223
Part Status: Active
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
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