Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36094) > Seite 359 nach 602
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NX138BK215 | NXP USA Inc. |
Description: SMALL SIGNAL N-CHANNEL MOSFETPackaging: Bulk |
Produkt ist nicht verfügbar |
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UDA1334TS/N1,118 | NXP USA Inc. |
Description: IC DAC/AUDIO 24BIT 100K 16SSOPPackaging: Bulk Package / Case: 16-LSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Type: DAC, Audio Data Interface: I²S Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.6V Sampling Rate (Per Second): 100k Resolution (Bits): 24 b Voltage Supply Source: Analog and Digital Supplier Device Package: 16-SSOP Part Status: Obsolete Number of Channels: 3 |
auf Bestellung 2369 Stücke: Lieferzeit 10-14 Tag (e) |
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PSMN070-200P,127-NXP | NXP USA Inc. |
Description: POWER FIELD-EFFECT TRANSISTOR, 3 Packaging: Bulk Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 35A (Tc) Rds On (Max) @ Id, Vgs: 70mOhm @ 17A, 10V Power Dissipation (Max): 250W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: TO-220AB Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 200 V Gate Charge (Qg) (Max) @ Vgs: 77 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 4570 pF @ 25 V |
Produkt ist nicht verfügbar |
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| MRF8S21100HSR3,128 | NXP USA Inc. |
Description: RF S BAND, N-CHANNEL, MOSFETPackaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MRF8S18120HSR3,128 | NXP USA Inc. |
Description: RF L BAND, N-CHANNEL |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MRF7S15100HSR3128 | NXP USA Inc. |
Description: RF MOSFETPackaging: Bulk Part Status: Active |
auf Bestellung 74 Stücke: Lieferzeit 10-14 Tag (e) |
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BAS16/DG/B4215 | NXP USA Inc. |
Description: RECTIFIER DIODE, 0.215A, 100V |
Produkt ist nicht verfügbar |
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BCW61C/DG/B4215 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTORPackaging: Bulk Part Status: Active |
auf Bestellung 35990 Stücke: Lieferzeit 10-14 Tag (e) |
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| BC846B/DG/B4215 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTORPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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BAT54A/DG/B4215 | NXP USA Inc. |
Description: DIODE ARR SCHOTT 30V 200MA SOT23Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 5 ns Technology: Schottky Diode Configuration: 1 Pair Common Anode Current - Average Rectified (Io) (per Diode): 200mA (DC) Supplier Device Package: SOT-23-3 Operating Temperature - Junction: 150°C (Max) Part Status: Active Voltage - DC Reverse (Vr) (Max): 30 V Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA Current - Reverse Leakage @ Vr: 2 µA @ 25 V Grade: Automotive Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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MIMX8QX6AVLFZAC | NXP USA Inc. |
Description: IC MPU 609FBGAPackaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21x21) Part Status: Active |
auf Bestellung 115 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTB123EU115 | NXP USA Inc. |
Description: TRANS PREBIASPackaging: Bulk |
auf Bestellung 145960 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTB123YU115 | NXP USA Inc. |
Description: TRANS PREBIASPackaging: Bulk |
auf Bestellung 75890 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTB123YQA147 | NXP USA Inc. |
Description: TRANS PREBIASPackaging: Bulk |
auf Bestellung 44000 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTB123EU135 | NXP USA Inc. |
Description: TRANS PREBIASPackaging: Bulk |
auf Bestellung 39549 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTB123YU135 | NXP USA Inc. |
Description: TRANS PREBIASPackaging: Bulk |
auf Bestellung 30000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BUK7506-55A127 | NXP USA Inc. |
Description: N-CHANNEL POWER MOSFET Packaging: Bulk Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Rds On (Max) @ Id, Vgs: 6.3mOhm @ 25A, 10V Power Dissipation (Max): 300W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: TO-220AB Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 55 V Input Capacitance (Ciss) (Max) @ Vds: 6000 pF @ 25 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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PMN35EN,115 | NXP USA Inc. |
Description: SMALL SIGNAL FIELD-EFFECT TRANSI |
auf Bestellung 211087 Stücke: Lieferzeit 10-14 Tag (e) |
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PMN25EN,115 | NXP USA Inc. |
Description: MOSFET N-CH 30V 6.2A 6TSOPPackaging: Bulk Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 6.2A (Ta) Rds On (Max) @ Id, Vgs: 23mOhm @ 6.2A, 10V Power Dissipation (Max): 540mW (Ta), 6.25W (Tc) Vgs(th) (Max) @ Id: 2.5V @ 250µA Supplier Device Package: SC-74 Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 492 pF @ 15 V |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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PMN27UP,115-NXP | NXP USA Inc. |
Description: MOSFET P-CH 20V 5.7A 6TSOPPackaging: Bulk Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: P-Channel Current - Continuous Drain (Id) @ 25°C: 5.7A (Ta) Rds On (Max) @ Id, Vgs: 32mOhm @ 2.4A, 4.5V Power Dissipation (Max): 540mW (Ta), 6.25W (Tc) Vgs(th) (Max) @ Id: 950mV @ 250µA Supplier Device Package: 6-TSOP Part Status: Active Vgs (Max): ±8V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 31 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 2340 pF @ 10 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PMN20EN,115 | NXP USA Inc. |
Description: MOSFET N-CH 30V 6.7A 6TSOP Packaging: Bulk Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 6.7A (Tj) Rds On (Max) @ Id, Vgs: 20mOhm @ 6.7A, 10V Power Dissipation (Max): 545mW (Ta) Vgs(th) (Max) @ Id: 2.5V @ 250µA Supplier Device Package: SC-74 Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 18.6 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 630 pF @ 15 V |
auf Bestellung 18000 Stücke: Lieferzeit 10-14 Tag (e) |
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PMV28UN,215 | NXP USA Inc. |
Description: SMALL SIGNAL FIELD-EFFECT TRANSI |
auf Bestellung 6399 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PH9030AL115 | NXP USA Inc. |
Description: POWER FIELD-EFFECT TRANSISTOR |
auf Bestellung 10500 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PHP225,118-NXP | NXP USA Inc. | Description: SMALL SIGNAL FIELD-EFFECT TRANSI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PHT6N06T,135 | NXP USA Inc. |
Description: MOSFET N-CH 55V 5.5A SOT223 Packaging: Bulk Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 5.5A (Tc) Rds On (Max) @ Id, Vgs: 150mOhm @ 5A, 10V Power Dissipation (Max): 8.3W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: SC-73 Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 55 V Gate Charge (Qg) (Max) @ Vgs: 5.6 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 175 pF @ 25 V |
auf Bestellung 8364 Stücke: Lieferzeit 10-14 Tag (e) |
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| PSMN3R9-60XS127 | NXP USA Inc. |
Description: POWER FIELD-EFFECT TRANSISTORPackaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MCF5212LCVM66-NXP | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| 74HCT573DB,112-NXP | NXP USA Inc. |
Description: IC D-TYPE TRANSP SGL 8:8 20SSOPPackaging: Tube Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 6mA, 6mA Delay Time - Propagation: 17ns Supplier Device Package: 20-SSOP Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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LPC2364FET100,518 | NXP USA Inc. |
Description: IC MCU 16/32BIT 128KB 100TFBGAPackaging: Cut Tape (CT) Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 128KB (128K x 8) RAM Size: 34K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 6x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Not For New Designs Number of I/O: 70 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PDTD113ZQA147 | NXP USA Inc. |
Description: TRANS PREBIAS NPN 50V 500MAPackaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA Current - Collector Cutoff (Max): 500nA DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V Supplier Device Package: DFN1010D-3 Grade: Automotive Part Status: Active Current - Collector (Ic) (Max): 500 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 940 mW Frequency - Transition: 210 MHz Resistor - Base (R1): 1 kOhms Resistor - Emitter Base (R2): 10 kOhms Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| PDTD113ZU115 | NXP USA Inc. |
Description: 500 MA, 50 V NPN RESISTOR-EQUIPPPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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PDTD143XT215 | NXP USA Inc. |
Description: 500 MA, 50 V NPN RESISTOR-EQUIPP Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| PDTD123YU115 | NXP USA Inc. | Description: 0.5A, 50V, NPN, SOT323 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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ASL5008FHV/0Y | NXP USA Inc. |
Description: ASL5008FHV/0 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74LVC16245AEV,518 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 3.6V 56VFBGAPackaging: Bulk Package / Case: 56-VFBGA Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.2V ~ 3.6V Number of Bits per Element: 8 Current - Output High, Low: 24mA, 24mA Supplier Device Package: 56-VFBGA (4.5x7) Part Status: Active |
auf Bestellung 3239 Stücke: Lieferzeit 10-14 Tag (e) |
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| TJA1027TK/20/1,118 | NXP USA Inc. | Description: LIN 2.2A/SAE J2602 TRANSCEIVER |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| TJA1027TK/20/1 | NXP USA Inc. | Description: LIN 2.2A/SAE J2602 TRANSCEIVER |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| OM13062UL,598 | NXP USA Inc. |
Description: LPCXPRESSO LPC11U37H EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0 Utilized IC / Part: LPC11U37H Platform: LPCXpresso™ |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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OM13022598 | NXP USA Inc. |
Description: IAR KICKSTART LPC11U24 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0 Utilized IC / Part: LPC11U24 Platform: IAR KickStart |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| MIMX8MD6DVAJZAA557 | NXP USA Inc. |
Description: 8M QUAD APPLICATIONS PROCESSOR |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MIMX8MQ6DVAJZAA | NXP USA Inc. |
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGAPackaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE USB: USB 3.0 (2) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Part Status: Active Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC |
auf Bestellung 758 Stücke: Lieferzeit 10-14 Tag (e) |
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| MIMX8MQ6DVAJZAA,557 | NXP USA Inc. |
Description: I.MX 8M: ARM CORTEX A53 QUAD CORPackaging: Tray Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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8MIC-RPI-MX8 | NXP USA Inc. |
Description: 8 MICROPHONE BOARD FOR VOICEPackaging: Bulk Function: Microphone Type: Audio Contents: Board(s) Part Status: Active |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74LVC1T45U/C025 | NXP USA Inc. |
Description: BUS TRANSCVR, LVC/LCX/Z SERIESPackaging: Bulk Part Status: Active Output Type: Tri-State Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 420Mbps Channel Type: Bidirectional Output Signal: CMOS, LVTTL Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.2 V ~ 5.5 V Voltage - VCCB: 1.2 V ~ 5.5 V Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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LPC2420FBD208K | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 208LQFPPackaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 72MHz RAM Size: 82K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 8x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Part Status: Active Number of I/O: 160 DigiKey Programmable: Not Verified |
auf Bestellung 340 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC253DB,112-NXP | NXP USA Inc. |
Description: IC DATA SEL/MULTPL 2X4:1 16SSOPPackaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Circuit: 2 x 4:1 Type: Data Selector/Multiplexer Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Independent Circuits: 2 Current - Output High, Low: 7.8mA, 7.8mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP Part Status: Active |
Produkt ist nicht verfügbar |
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| JN5179-001-M10Z | NXP USA Inc. |
Description: RF TXRX MOD 802.15.4 TH SMDPackaging: Bulk Package / Case: Module Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.6V Power - Output: 8.5dBm Protocol: Zigbee® Current - Receiving: 16.4mA Current - Transmitting: 114mA Antenna Type: Integrated, Trace RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
auf Bestellung 3965 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6Q7CVT08AE | NXP USA Inc. |
Description: IC MPU I.MX6Q 800MHZ 624FCBGAPackaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 138 Stücke: Lieferzeit 10-14 Tag (e) |
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FRDM-K32L2B3 | NXP USA Inc. |
Description: FREEDOM EVAL BOARD K32L2B3Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: K32 L2B Platform: Freedom |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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S08PB16-EVK | NXP USA Inc. |
Description: S08PLS EVAL KITPackaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08PB16 Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC5748G-GW-RDB | NXP USA Inc. |
Description: MPC5748G ETHERNET GATEWAYPackaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5748G Part Status: Active |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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BC859CW/ZL115 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTORPackaging: Bulk Part Status: Active |
auf Bestellung 280999 Stücke: Lieferzeit 10-14 Tag (e) |
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MKV46F128VLL16 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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A2I20D020GNR1 | NXP USA Inc. |
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WBPackaging: Tape & Reel (TR) Package / Case: TO-270-17 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 1.4GHz ~ 2.2GHz RF Type: W-CDMA Voltage - Supply: 28V Gain: 35dB Test Frequency: 2.2GHz Supplier Device Package: TO-270WB-17 |
Produkt ist nicht verfügbar |
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SPC5645SF1VLUR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 125MHz Program Memory Size: 2MB (2M x 8) RAM Size: 1.064M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4d Data Converters: A/D 16x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 128 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LS1043AXE7KQA | NXP USA Inc. |
Description: QORIQ 4XCPU 64-BIT ARM ARCH 1. |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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BF821/DG/B2215 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTORPackaging: Bulk Part Status: Active Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 800mV @ 5mA, 30mA Current - Collector Cutoff (Max): 10nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 25mA, 20V Frequency - Transition: 60MHz Supplier Device Package: SOT-23-3 (TO-236) Grade: Automotive Current - Collector (Ic) (Max): 50 mA Voltage - Collector Emitter Breakdown (Max): 300 V Power - Max: 250 mW Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PCA9450CHNY | NXP USA Inc. |
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQFPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.85V ~ 5.5V Applications: General Purpose Current - Supply: 20µA Supplier Device Package: 56-HVQFN (7x7) |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9450CHNY | NXP USA Inc. |
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQFPackaging: Cut Tape (CT) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.85V ~ 5.5V Applications: General Purpose Current - Supply: 20µA Supplier Device Package: 56-HVQFN (7x7) |
auf Bestellung 6363 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1820FBD144,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz RAM Size: 168K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Discontinued at Digi-Key Number of I/O: 83 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| UDA1334TS/N1,118 |
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Hersteller: NXP USA Inc.
Description: IC DAC/AUDIO 24BIT 100K 16SSOP
Packaging: Bulk
Package / Case: 16-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Type: DAC, Audio
Data Interface: I²S
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Sampling Rate (Per Second): 100k
Resolution (Bits): 24 b
Voltage Supply Source: Analog and Digital
Supplier Device Package: 16-SSOP
Part Status: Obsolete
Number of Channels: 3
Description: IC DAC/AUDIO 24BIT 100K 16SSOP
Packaging: Bulk
Package / Case: 16-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Type: DAC, Audio
Data Interface: I²S
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Sampling Rate (Per Second): 100k
Resolution (Bits): 24 b
Voltage Supply Source: Analog and Digital
Supplier Device Package: 16-SSOP
Part Status: Obsolete
Number of Channels: 3
auf Bestellung 2369 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 430+ | 1.23 EUR |
| PSMN070-200P,127-NXP |
Hersteller: NXP USA Inc.
Description: POWER FIELD-EFFECT TRANSISTOR, 3
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35A (Tc)
Rds On (Max) @ Id, Vgs: 70mOhm @ 17A, 10V
Power Dissipation (Max): 250W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 200 V
Gate Charge (Qg) (Max) @ Vgs: 77 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4570 pF @ 25 V
Description: POWER FIELD-EFFECT TRANSISTOR, 3
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35A (Tc)
Rds On (Max) @ Id, Vgs: 70mOhm @ 17A, 10V
Power Dissipation (Max): 250W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 200 V
Gate Charge (Qg) (Max) @ Vgs: 77 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4570 pF @ 25 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF8S18120HSR3,128 |
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Hersteller: NXP USA Inc.
Description: RF L BAND, N-CHANNEL
Description: RF L BAND, N-CHANNEL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF7S15100HSR3128 |
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auf Bestellung 74 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 236.24 EUR |
| BAS16/DG/B4215 |
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Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, 0.215A, 100V
Description: RECTIFIER DIODE, 0.215A, 100V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BCW61C/DG/B4215 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
auf Bestellung 35990 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 8876+ | 0.048 EUR |
| BC846B/DG/B4215 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BAT54A/DG/B4215 |
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Hersteller: NXP USA Inc.
Description: DIODE ARR SCHOTT 30V 200MA SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 1 Pair Common Anode
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: SOT-23-3
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE ARR SCHOTT 30V 200MA SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 5 ns
Technology: Schottky
Diode Configuration: 1 Pair Common Anode
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: SOT-23-3
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX8QX6AVLFZAC |
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Hersteller: NXP USA Inc.
Description: IC MPU 609FBGA
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
Part Status: Active
Description: IC MPU 609FBGA
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
Part Status: Active
auf Bestellung 115 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 167.22 EUR |
| 10+ | 140.4 EUR |
| 60+ | 128.72 EUR |
| PDTB123EU115 |
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auf Bestellung 145960 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 8036+ | 0.067 EUR |
| PDTB123YU115 |
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auf Bestellung 75890 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 8036+ | 0.067 EUR |
| PDTB123YQA147 |
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auf Bestellung 44000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 8219+ | 0.067 EUR |
| PDTB123EU135 |
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auf Bestellung 39549 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 8036+ | 0.064 EUR |
| PDTB123YU135 |
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auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 8036+ | 0.064 EUR |
| BUK7506-55A127 |
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 6.3mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 6000 pF @ 25 V
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 6.3mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 6000 pF @ 25 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMN35EN,115 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
auf Bestellung 211087 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4808+ | 0.1 EUR |
| PMN25EN,115 |
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Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 6.2A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.2A (Ta)
Rds On (Max) @ Id, Vgs: 23mOhm @ 6.2A, 10V
Power Dissipation (Max): 540mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-74
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 492 pF @ 15 V
Description: MOSFET N-CH 30V 6.2A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.2A (Ta)
Rds On (Max) @ Id, Vgs: 23mOhm @ 6.2A, 10V
Power Dissipation (Max): 540mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-74
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 492 pF @ 15 V
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3328+ | 0.14 EUR |
| PMN27UP,115-NXP |
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Hersteller: NXP USA Inc.
Description: MOSFET P-CH 20V 5.7A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 5.7A (Ta)
Rds On (Max) @ Id, Vgs: 32mOhm @ 2.4A, 4.5V
Power Dissipation (Max): 540mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: 6-TSOP
Part Status: Active
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 31 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 2340 pF @ 10 V
Description: MOSFET P-CH 20V 5.7A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 5.7A (Ta)
Rds On (Max) @ Id, Vgs: 32mOhm @ 2.4A, 4.5V
Power Dissipation (Max): 540mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: 6-TSOP
Part Status: Active
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 31 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 2340 pF @ 10 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PMN20EN,115 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 6.7A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.7A (Tj)
Rds On (Max) @ Id, Vgs: 20mOhm @ 6.7A, 10V
Power Dissipation (Max): 545mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-74
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 18.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 630 pF @ 15 V
Description: MOSFET N-CH 30V 6.7A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.7A (Tj)
Rds On (Max) @ Id, Vgs: 20mOhm @ 6.7A, 10V
Power Dissipation (Max): 545mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-74
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 18.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 630 pF @ 15 V
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2664+ | 0.19 EUR |
| PMV28UN,215 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
auf Bestellung 6399 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| PH9030AL115 |
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Hersteller: NXP USA Inc.
Description: POWER FIELD-EFFECT TRANSISTOR
Description: POWER FIELD-EFFECT TRANSISTOR
auf Bestellung 10500 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| PHP225,118-NXP |
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PHT6N06T,135 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 5.5A SOT223
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.5A (Tc)
Rds On (Max) @ Id, Vgs: 150mOhm @ 5A, 10V
Power Dissipation (Max): 8.3W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: SC-73
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 5.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 175 pF @ 25 V
Description: MOSFET N-CH 55V 5.5A SOT223
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.5A (Tc)
Rds On (Max) @ Id, Vgs: 150mOhm @ 5A, 10V
Power Dissipation (Max): 8.3W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: SC-73
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 5.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 175 pF @ 25 V
auf Bestellung 8364 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1332+ | 0.39 EUR |
| MCF5212LCVM66-NXP |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HCT573DB,112-NXP |
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Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Delay Time - Propagation: 17ns
Supplier Device Package: 20-SSOP
Part Status: Active
Description: IC D-TYPE TRANSP SGL 8:8 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Delay Time - Propagation: 17ns
Supplier Device Package: 20-SSOP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC2364FET100,518 |
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Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 128KB 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Not For New Designs
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT 128KB 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Not For New Designs
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PDTD113ZQA147 |
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Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 500MA
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V
Supplier Device Package: DFN1010D-3
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 940 mW
Frequency - Transition: 210 MHz
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
Description: TRANS PREBIAS NPN 50V 500MA
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V
Supplier Device Package: DFN1010D-3
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 940 mW
Frequency - Transition: 210 MHz
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PDTD113ZU115 |
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Hersteller: NXP USA Inc.
Description: 500 MA, 50 V NPN RESISTOR-EQUIPP
Packaging: Bulk
Part Status: Active
Description: 500 MA, 50 V NPN RESISTOR-EQUIPP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PDTD123YU115 |
Hersteller: NXP USA Inc.
Description: 0.5A, 50V, NPN, SOT323
Description: 0.5A, 50V, NPN, SOT323
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ASL5008FHV/0Y |
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Hersteller: NXP USA Inc.
Description: ASL5008FHV/0
Description: ASL5008FHV/0
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVC16245AEV,518 |
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Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 56VFBGA
Packaging: Bulk
Package / Case: 56-VFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-VFBGA (4.5x7)
Part Status: Active
Description: IC TXRX NON-INVERT 3.6V 56VFBGA
Packaging: Bulk
Package / Case: 56-VFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-VFBGA (4.5x7)
Part Status: Active
auf Bestellung 3239 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 143+ | 3.52 EUR |
| TJA1027TK/20/1,118 |
Hersteller: NXP USA Inc.
Description: LIN 2.2A/SAE J2602 TRANSCEIVER
Description: LIN 2.2A/SAE J2602 TRANSCEIVER
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TJA1027TK/20/1 |
Hersteller: NXP USA Inc.
Description: LIN 2.2A/SAE J2602 TRANSCEIVER
Description: LIN 2.2A/SAE J2602 TRANSCEIVER
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| OM13062UL,598 |
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC11U37H EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11U37H
Platform: LPCXpresso™
Description: LPCXPRESSO LPC11U37H EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11U37H
Platform: LPCXpresso™
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| OM13022598 |
Hersteller: NXP USA Inc.
Description: IAR KICKSTART LPC11U24 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11U24
Platform: IAR KickStart
Description: IAR KICKSTART LPC11U24 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11U24
Platform: IAR KickStart
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX8MD6DVAJZAA557 |
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Hersteller: NXP USA Inc.
Description: 8M QUAD APPLICATIONS PROCESSOR
Description: 8M QUAD APPLICATIONS PROCESSOR
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX8MQ6DVAJZAA |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
auf Bestellung 758 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 5+ | 90.28 EUR |
| MIMX8MQ6DVAJZAA,557 |
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Hersteller: NXP USA Inc.
Description: I.MX 8M: ARM CORTEX A53 QUAD COR
Packaging: Tray
Part Status: Active
Description: I.MX 8M: ARM CORTEX A53 QUAD COR
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 8MIC-RPI-MX8 |
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Hersteller: NXP USA Inc.
Description: 8 MICROPHONE BOARD FOR VOICE
Packaging: Bulk
Function: Microphone
Type: Audio
Contents: Board(s)
Part Status: Active
Description: 8 MICROPHONE BOARD FOR VOICE
Packaging: Bulk
Function: Microphone
Type: Audio
Contents: Board(s)
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 361.49 EUR |
| 74LVC1T45U/C025 |
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Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Output Type: Tri-State
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 420Mbps
Channel Type: Bidirectional
Output Signal: CMOS, LVTTL
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 5.5 V
Voltage - VCCB: 1.2 V ~ 5.5 V
Number of Circuits: 1
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Output Type: Tri-State
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 420Mbps
Channel Type: Bidirectional
Output Signal: CMOS, LVTTL
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 5.5 V
Voltage - VCCB: 1.2 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC2420FBD208K |
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Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 160
DigiKey Programmable: Not Verified
auf Bestellung 340 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 22.16 EUR |
| 10+ | 17.72 EUR |
| 180+ | 16.16 EUR |
| 74HC253DB,112-NXP |
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Hersteller: NXP USA Inc.
Description: IC DATA SEL/MULTPL 2X4:1 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Data Selector/Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
Description: IC DATA SEL/MULTPL 2X4:1 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Data Selector/Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| JN5179-001-M10Z |
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Hersteller: NXP USA Inc.
Description: RF TXRX MOD 802.15.4 TH SMD
Packaging: Bulk
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.6V
Power - Output: 8.5dBm
Protocol: Zigbee®
Current - Receiving: 16.4mA
Current - Transmitting: 114mA
Antenna Type: Integrated, Trace
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TXRX MOD 802.15.4 TH SMD
Packaging: Bulk
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.6V
Power - Output: 8.5dBm
Protocol: Zigbee®
Current - Receiving: 16.4mA
Current - Transmitting: 114mA
Antenna Type: Integrated, Trace
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 3965 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 25+ | 18.62 EUR |
| MCIMX6Q7CVT08AE |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6Q 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 138 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 155.67 EUR |
| 10+ | 130.16 EUR |
| 60+ | 119.06 EUR |
| 120+ | 116.06 EUR |
| FRDM-K32L2B3 |
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Hersteller: NXP USA Inc.
Description: FREEDOM EVAL BOARD K32L2B3
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: K32 L2B
Platform: Freedom
Description: FREEDOM EVAL BOARD K32L2B3
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: K32 L2B
Platform: Freedom
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 48.29 EUR |
| S08PB16-EVK |
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Hersteller: NXP USA Inc.
Description: S08PLS EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08PB16
Part Status: Active
Description: S08PLS EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08PB16
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 46.02 EUR |
| MPC5748G-GW-RDB |
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Hersteller: NXP USA Inc.
Description: MPC5748G ETHERNET GATEWAY
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5748G
Part Status: Active
Description: MPC5748G ETHERNET GATEWAY
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5748G
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 910.08 EUR |
| BC859CW/ZL115 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
auf Bestellung 280999 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 15000+ | 0.035 EUR |
| MKV46F128VLL16 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| A2I20D020GNR1 |
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Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 35dB
Test Frequency: 2.2GHz
Supplier Device Package: TO-270WB-17
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 35dB
Test Frequency: 2.2GHz
Supplier Device Package: TO-270WB-17
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5645SF1VLUR |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.064M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4d
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.064M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4d
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LS1043AXE7KQA |
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Hersteller: NXP USA Inc.
Description: QORIQ 4XCPU 64-BIT ARM ARCH 1.
Description: QORIQ 4XCPU 64-BIT ARM ARCH 1.
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BF821/DG/B2215 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 800mV @ 5mA, 30mA
Current - Collector Cutoff (Max): 10nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 25mA, 20V
Frequency - Transition: 60MHz
Supplier Device Package: SOT-23-3 (TO-236)
Grade: Automotive
Current - Collector (Ic) (Max): 50 mA
Voltage - Collector Emitter Breakdown (Max): 300 V
Power - Max: 250 mW
Qualification: AEC-Q101
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 800mV @ 5mA, 30mA
Current - Collector Cutoff (Max): 10nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 25mA, 20V
Frequency - Transition: 60MHz
Supplier Device Package: SOT-23-3 (TO-236)
Grade: Automotive
Current - Collector (Ic) (Max): 50 mA
Voltage - Collector Emitter Breakdown (Max): 300 V
Power - Max: 250 mW
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9450CHNY |
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Hersteller: NXP USA Inc.
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.85V ~ 5.5V
Applications: General Purpose
Current - Supply: 20µA
Supplier Device Package: 56-HVQFN (7x7)
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.85V ~ 5.5V
Applications: General Purpose
Current - Supply: 20µA
Supplier Device Package: 56-HVQFN (7x7)
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2000+ | 4.91 EUR |
| PCA9450CHNY |
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Hersteller: NXP USA Inc.
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.85V ~ 5.5V
Applications: General Purpose
Current - Supply: 20µA
Supplier Device Package: 56-HVQFN (7x7)
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.85V ~ 5.5V
Applications: General Purpose
Current - Supply: 20µA
Supplier Device Package: 56-HVQFN (7x7)
auf Bestellung 6363 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 8.68 EUR |
| 10+ | 6.65 EUR |
| 25+ | 6.14 EUR |
| 100+ | 5.58 EUR |
| 250+ | 5.32 EUR |
| 500+ | 5.16 EUR |
| 1000+ | 5.02 EUR |
| LPC1820FBD144,551 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Discontinued at Digi-Key
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Discontinued at Digi-Key
Number of I/O: 83
DigiKey Programmable: Not Verified
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