Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36787) > Seite 363 nach 614
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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OM11077598 | NXP USA Inc. |
Description: SOMDIMM-LPC2478 - MODULAR LPC247 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| LPC804UKAZ | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 20WLCSPCore Size: 32-Bit Single-Core Data Converters: A/D 12x12b; D/A 1x10b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 8 Program Memory Size: 32KB (32K x 8) Speed: 15MHz Mounting Type: Surface Mount Package / Case: 20-UFBGA, WLCSP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 17 Part Status: Active Supplier Device Package: 20-WLCSP (2.5x1.84) Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V |
auf Bestellung 3930 Stücke: Lieferzeit 10-14 Tag (e) |
Mindestbestellmenge: 3930 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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74HC4002D/C118 | NXP USA Inc. |
Description: IC GATE NOR 2CH 4-INP 14SOCurrent - Quiescent (Max): 2 µA Number of Circuits: 2 Part Status: Active Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Input Logic Level - Low: 0.5V ~ 1.8V Input Logic Level - High: 1.5V ~ 4.2V Supplier Device Package: 14-SO Number of Inputs: 4 Current - Output High, Low: 5.2mA, 5.2mA Voltage - Supply: 2V ~ 6V Operating Temperature: -40°C ~ 125°C Logic Type: NOR Gate Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Bulk |
auf Bestellung 55000 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC4002PW/C118 | NXP USA Inc. |
Description: IC GATE NOR 2CH 4-INP 14TSSOPInput Logic Level - Low: 0.5V ~ 1.8V Input Logic Level - High: 1.5V ~ 4.2V Supplier Device Package: 14-TSSOP Number of Inputs: 4 Current - Output High, Low: 5.2mA, 5.2mA Voltage - Supply: 2V ~ 6V Operating Temperature: -40°C ~ 125°C Logic Type: NOR Gate Mounting Type: Surface Mount Package / Case: 14-TSSOP (0.173", 4.40mm Width) Packaging: Bulk Current - Quiescent (Max): 2 µA Number of Circuits: 2 Part Status: Active Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LPC2103FHN48H/6518 | NXP USA Inc. |
Description: IC MCU 16/32B 32KB FLASH 48HVQFNDigiKey Programmable: Not Verified Number of I/O: 32 Part Status: Active Supplier Device Package: 48-HVQFN (6x6) Peripherals: POR, PWM, WDT Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Core Size: 16/32-Bit Data Converters: A/D 8x10b Core Processor: ARM7® Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 8K x 8 Program Memory Size: 32KB (32K x 8) Speed: 70MHz Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Packaging: Bulk |
auf Bestellung 11824 Stücke: Lieferzeit 10-14 Tag (e) |
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| PDZ24B/ZLX | NXP USA Inc. |
Description: DIODE ZENER SOD323 Part Status: Active Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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UJA1076ATW/5V0WD,1 | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HTSSOPPart Status: Active Supplier Device Package: 32-HTSSOP Applications: Automotive Voltage - Supply: 4.5V ~ 28V Interface: SPI Serial Mounting Type: Surface Mount Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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UJA1076ATW/5V0WD,1 | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HTSSOPApplications: Automotive Voltage - Supply: 4.5V ~ 28V Interface: SPI Serial Mounting Type: Surface Mount Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Packaging: Cut Tape (CT) Part Status: Active Supplier Device Package: 32-HTSSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| BGY68112 | NXP USA Inc. |
Description: 75 MHZ, 30 DB GAIN REVERSE AMPLICurrent - Supply: 135 mA Number of Circuits: 1 Supplier Device Package: 7-SFM Module Applications: CATV Mounting Type: Chassis Mount Package / Case: SOT-115J Packaging: Bulk |
auf Bestellung 93067 Stücke: Lieferzeit 10-14 Tag (e) |
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PMV250EPEA215 | NXP USA Inc. |
Description: P-CHANNEL MOSFETPackaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74LVC1G34GW/AU125 | NXP USA Inc. |
Description: BUFFER, LVC/LCX/Z SERIESPackaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74LVC1G34GV-Q100125 | NXP USA Inc. |
Description: BUFFER, LVC/LCX/Z SERIESPackaging: Bulk |
auf Bestellung 180000 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74LVC1G34GX/S500125 | NXP USA Inc. |
Description: BUFFER, LVC/LCX/Z SERIES Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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74LVC1G34GX/S505125 | NXP USA Inc. |
Description: BUFFER, LVC/LCX/Z SERIESPackaging: Bulk |
auf Bestellung 9398 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC1G34GF000 | NXP USA Inc. |
Description: BUFFER, LVC/LCX/Z SERIESPackaging: Bulk |
auf Bestellung 15000 Stücke: Lieferzeit 10-14 Tag (e) |
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MMRF1312HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Current - Test: 100 mA Voltage - Test: 50 V Voltage - Rated: 112 V Part Status: Active Supplier Device Package: NI-1230-4H Technology: LDMOS Gain: 19.6dB Power - Output: 1000W Configuration: Dual Frequency: 1.03GHz Mounting Type: Chassis Mount Package / Case: SOT-979A Packaging: Cut Tape (CT) |
auf Bestellung 38 Stücke: Lieferzeit 10-14 Tag (e) |
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MMRF1312HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Current - Test: 100 mA Voltage - Test: 50 V Voltage - Rated: 112 V Part Status: Active Supplier Device Package: NI-1230-4S Technology: LDMOS Power - Output: 1000W Configuration: Dual Frequency: 1.034GHz Mounting Type: Chassis Mount Package / Case: NI-1230-4S Packaging: Tape & Reel (TR) Gain: 19.6dB |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MMRF1312HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Power - Output: 1000W Configuration: Dual Frequency: 1.034GHz Mounting Type: Chassis Mount Package / Case: NI-1230-4S Packaging: Cut Tape (CT) Current - Test: 100 mA Voltage - Test: 50 V Voltage - Rated: 112 V Part Status: Active Supplier Device Package: NI-1230-4S Technology: LDMOS Gain: 19.6dB |
auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
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| OM13503UL | NXP USA Inc. |
Description: PCA8539 LCD DEMO BOARDContents: Board(s) Part Status: Obsolete Embedded: Yes, MCU, 32-Bit Supplied Contents: Board(s) Utilized IC / Part: PCA8539 Type: Display Function: LCD Controller Packaging: Bulk |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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MRFE6VS25GN-960 | NXP USA Inc. |
Description: MRFE6VS25GN REF BRD 1215MHZ 30WSupplied Contents: Board(s) Type: Transistor Frequency: 960MHz ~ 1.215GHz For Use With/Related Products: MRFE6VS25N Packaging: Bulk |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU8051X | NXP USA Inc. |
Description: IC AMP GSM 300MHZ-1.5GHZ 8HWSONPart Status: Active Supplier Device Package: 8-HWSON (2x2) Test Frequency: 900MHz P1dB: 19dBm Noise Figure: 0.43dB Current - Supply: 48mA Gain: 18.3dB Voltage - Supply: 4.75V ~ 5.25V RF Type: GSM, LTE, W-CDMA Frequency: 300MHz ~ 1.5GHz Mounting Type: Surface Mount Package / Case: 8-WFDFN Exposed Pad Packaging: Tape & Reel (TR) |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU8051X | NXP USA Inc. |
Description: IC AMP GSM 300MHZ-1.5GHZ 8HWSONPart Status: Active Supplier Device Package: 8-HWSON (2x2) Test Frequency: 900MHz P1dB: 19dBm Noise Figure: 0.43dB Current - Supply: 48mA Gain: 18.3dB Voltage - Supply: 4.75V ~ 5.25V RF Type: GSM, LTE, W-CDMA Frequency: 300MHz ~ 1.5GHz Mounting Type: Surface Mount Package / Case: 8-WFDFN Exposed Pad Packaging: Cut Tape (CT) |
auf Bestellung 4761 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F83000-EVK | NXP USA Inc. |
Description: MC56F83XXX EVKPackaging: Bulk Mounting Type: Fixed Type: DSP Contents: Board(s) Core Processor: 56800EX Board Type: Evaluation Platform Utilized IC / Part: MC56F83789 Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| MC34PF8101A0EP | NXP USA Inc. |
Description: IC POWER MANAGEMENT |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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SPC5777CDK3MMO4 | NXP USA Inc. |
Description: IC MCU 32BIT 8MB FLASH 516MAPBGAPackaging: Tray Package / Case: 516-BGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 8MB (8M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 16b Sigma-Delta, eQADC Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Supplier Device Package: 516-MAPBGA (27x27) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 801 Stücke: Lieferzeit 10-14 Tag (e) |
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| J3D081MXS/T1DM1E6D | NXP USA Inc. | Description: IC RF MODULE PLLCC8 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 12500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D016MX1C/9B070J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D016MX1C/9B07AJ | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D016MX30/9B070J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D016MX30/9B07AJ | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D016PX1C/9B060J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D016PX1D/9B060J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D016PX36/9B139J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D024MX1C/9B071J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D024MX1C/9B07AJ | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D024MX1C/9B950J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D024MX1G/9B051J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D024MX30/9B071J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D024MX30/9B07AJ | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D024MX30/9B950J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D024MX34/9B051J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D024MX34/9B950J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D024MX55/9B081J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D024PX34/9B0204 | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D024PX34/9B9803 | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D040MX1C/9C100J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D041PX30/9E38CJ | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| P60D052MX54/9C080J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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N74F786D,602 | NXP USA Inc. |
Description: IC ASYNC BUS ARBITER 16-SOICPackaging: Tube Supplier Device Package: 16-SO Supply Voltage: 4.5V ~ 5.5V Operating Temperature: 0°C ~ 70°C Logic Type: Bus Arbiter Number of Bits: 4 Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8548ECVJAQGD | NXP USA Inc. |
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGAPart Status: Obsolete Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR, DDR2, SDRAM Co-Processors/DSP: Signal Processing; SPE, Security; SEC Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (4) Supplier Device Package: 783-FCPBGA (29x29) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500 Operating Temperature: -40°C ~ 105°C (TA) Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| PCA9670PW112 | NXP USA Inc. |
Description: IC XPNDR 1MHZ I2C 16TSSOPDigiKey Programmable: Not Verified Part Status: Active Current - Output Source/Sink: 100µA, 25mA Supplier Device Package: 16-TSSOP Interrupt Output: No Clock Frequency: 1 MHz Voltage - Supply: 2.3V ~ 5.5V Operating Temperature: -40°C ~ 85°C Number of I/O: 8 Interface: I²C Mounting Type: Surface Mount Output Type: Push-Pull Package / Case: 16-TSSOP (0.173", 4.40mm Width) Features: POR Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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74HC240DB,118-NXP | NXP USA Inc. |
Description: IC BUFFER INVERT 6V 20SSOP Part Status: Active Supplier Device Package: 20-SSOP Current - Output High, Low: 7.8mA, 7.8mA Number of Bits per Element: 4 Voltage - Supply: 2V ~ 6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Buffer, Inverting Number of Elements: 2 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 20-SSOP (0.209", 5.30mm Width) Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| LPC4330FET180/3D551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 180TFBGACore Size: 32-Bit Dual-Core Data Converters: A/D 8x10b; D/A 1x10b Core Processor: ARM® Cortex®-M4/M0 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 264K x 8 Speed: 204MHz Mounting Type: Surface Mount Package / Case: 180-TFBGA Packaging: Bulk Number of I/O: 118 Part Status: Active Supplier Device Package: 180-TFBGA (12x12) Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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J111,126 | NXP USA Inc. |
Description: JFET N-CH 40V TO92-3Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V Voltage - Cutoff (VGS off) @ Id: 10 V @ 1 µA Resistance - RDS(On): 30 Ohms Power - Max: 400 mW Drain to Source Voltage (Vdss): 40 V Part Status: Obsolete Supplier Device Package: TO-92-3 Voltage - Breakdown (V(BR)GSS): 40 V Input Capacitance (Ciss) (Max) @ Vds: 6pF @ 10V (VGS) FET Type: N-Channel Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads Packaging: Bulk |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC7541D/S400118 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 6V 20SOSupplier Device Package: 20-SO Current - Output High, Low: 7.8mA, 7.8mA Number of Bits per Element: 8 Input Type: Schmitt Trigger Voltage - Supply: 2V ~ 6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 1 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 20-SOIC (0.295", 7.50mm Width) Packaging: Bulk |
auf Bestellung 1880 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74HC7540D/C4118 | NXP USA Inc. |
Description: IC BUFFER INVERT 6V 20SOSupplier Device Package: 20-SO Current - Output High, Low: 7.8mA, 7.8mA Number of Bits per Element: 8 Voltage - Supply: 2V ~ 6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Buffer, Inverting Number of Elements: 1 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 20-SOIC (0.295", 7.50mm Width) Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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S912XDP512J1CAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP DigiKey Programmable: Not Verified Number of I/O: 91 Supplier Device Package: 112-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x10b, 16x10b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 112-LQFP Packaging: Tray |
auf Bestellung 300 Stücke: Lieferzeit 10-14 Tag (e) |
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MM912I637AV1EP-NXP | NXP USA Inc. |
Description: BATTERY SENSOR, LIN, 96KB FLASH,Number of I/O: 14 Grade: Automotive Supplier Device Package: 48-QFN-EP (7x7) Core Processor: HCS12 Program Memory Type: FLASH (48kB) Controller Series: HCS12 Voltage - Supply: 2.25V ~ 5.25V Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 6K x 8 Interface: LIN, PWM, SCI, SPI Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad DigiKey Programmable: Not Verified Packaging: Bulk |
auf Bestellung 438 Stücke: Lieferzeit 10-14 Tag (e) |
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MK22FN512VLL12R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFPNumber of I/O: 66 Part Status: Active Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, I2S, LVD, POR, PWM, WDT Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 33x16b; D/A 2x12b Core Processor: ARM® Cortex®-M4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 128K x 8 Program Memory Size: 512KB (512K x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| MK22FX512VMD12R | NXP USA Inc. |
Description: IC MCU 32B 512KB FLASH 144MAPBGA Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 64K x 8 Program Memory Size: 512KB (512K x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 144-LBGA Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 100 Part Status: Not For New Designs Supplier Device Package: 144-MAPBGA (13x13) Peripherals: DMA, I²S, LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 42x16b; D/A 2x12b Core Processor: ARM® Cortex®-M4 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH |
| LPC804UKAZ |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 15MHz
Mounting Type: Surface Mount
Package / Case: 20-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 17
Part Status: Active
Supplier Device Package: 20-WLCSP (2.5x1.84)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 15MHz
Mounting Type: Surface Mount
Package / Case: 20-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 17
Part Status: Active
Supplier Device Package: 20-WLCSP (2.5x1.84)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
auf Bestellung 3930 Stücke:
Lieferzeit 10-14 Tag (e)
| 74HC4002D/C118 |
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Hersteller: NXP USA Inc.
Description: IC GATE NOR 2CH 4-INP 14SO
Current - Quiescent (Max): 2 µA
Number of Circuits: 2
Part Status: Active
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Input Logic Level - Low: 0.5V ~ 1.8V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-SO
Number of Inputs: 4
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: NOR Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Description: IC GATE NOR 2CH 4-INP 14SO
Current - Quiescent (Max): 2 µA
Number of Circuits: 2
Part Status: Active
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Input Logic Level - Low: 0.5V ~ 1.8V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-SO
Number of Inputs: 4
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: NOR Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
auf Bestellung 55000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1480+ | 0.39 EUR |
| 74HC4002PW/C118 |
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Hersteller: NXP USA Inc.
Description: IC GATE NOR 2CH 4-INP 14TSSOP
Input Logic Level - Low: 0.5V ~ 1.8V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 4
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: NOR Gate
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Current - Quiescent (Max): 2 µA
Number of Circuits: 2
Part Status: Active
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Description: IC GATE NOR 2CH 4-INP 14TSSOP
Input Logic Level - Low: 0.5V ~ 1.8V
Input Logic Level - High: 1.5V ~ 4.2V
Supplier Device Package: 14-TSSOP
Number of Inputs: 4
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: NOR Gate
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Current - Quiescent (Max): 2 µA
Number of Circuits: 2
Part Status: Active
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC2103FHN48H/6518 |
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Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 32KB FLASH 48HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 32
Part Status: Active
Supplier Device Package: 48-HVQFN (6x6)
Peripherals: POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 70MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Bulk
Description: IC MCU 16/32B 32KB FLASH 48HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 32
Part Status: Active
Supplier Device Package: 48-HVQFN (6x6)
Peripherals: POR, PWM, WDT
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 70MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Bulk
auf Bestellung 11824 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 121.28 EUR |
| PDZ24B/ZLX |
Hersteller: NXP USA Inc.
Description: DIODE ZENER SOD323
Part Status: Active
Packaging: Tape & Reel (TR)
Description: DIODE ZENER SOD323
Part Status: Active
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| UJA1076ATW/5V0WD,1 |
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Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Part Status: Active
Supplier Device Package: 32-HTSSOP
Applications: Automotive
Voltage - Supply: 4.5V ~ 28V
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC INTFACE SPECIALIZED 32HTSSOP
Part Status: Active
Supplier Device Package: 32-HTSSOP
Applications: Automotive
Voltage - Supply: 4.5V ~ 28V
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| UJA1076ATW/5V0WD,1 |
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Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Applications: Automotive
Voltage - Supply: 4.5V ~ 28V
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Packaging: Cut Tape (CT)
Part Status: Active
Supplier Device Package: 32-HTSSOP
Description: IC INTFACE SPECIALIZED 32HTSSOP
Applications: Automotive
Voltage - Supply: 4.5V ~ 28V
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Packaging: Cut Tape (CT)
Part Status: Active
Supplier Device Package: 32-HTSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BGY68112 |
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Hersteller: NXP USA Inc.
Description: 75 MHZ, 30 DB GAIN REVERSE AMPLI
Current - Supply: 135 mA
Number of Circuits: 1
Supplier Device Package: 7-SFM Module
Applications: CATV
Mounting Type: Chassis Mount
Package / Case: SOT-115J
Packaging: Bulk
Description: 75 MHZ, 30 DB GAIN REVERSE AMPLI
Current - Supply: 135 mA
Number of Circuits: 1
Supplier Device Package: 7-SFM Module
Applications: CATV
Mounting Type: Chassis Mount
Package / Case: SOT-115J
Packaging: Bulk
auf Bestellung 93067 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 17+ | 36.59 EUR |
| 74LVC1G34GV-Q100125 |
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auf Bestellung 180000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3297+ | 0.18 EUR |
| 74LVC1G34GX/S505125 |
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auf Bestellung 9398 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3806+ | 0.15 EUR |
| 74LVC1G34GF000 |
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auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 928+ | 0.58 EUR |
| MMRF1312HR5 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 112 V
Part Status: Active
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Gain: 19.6dB
Power - Output: 1000W
Configuration: Dual
Frequency: 1.03GHz
Mounting Type: Chassis Mount
Package / Case: SOT-979A
Packaging: Cut Tape (CT)
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 112 V
Part Status: Active
Supplier Device Package: NI-1230-4H
Technology: LDMOS
Gain: 19.6dB
Power - Output: 1000W
Configuration: Dual
Frequency: 1.03GHz
Mounting Type: Chassis Mount
Package / Case: SOT-979A
Packaging: Cut Tape (CT)
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1129.74 EUR |
| 10+ | 1095.76 EUR |
| MMRF1312HSR5 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 112 V
Part Status: Active
Supplier Device Package: NI-1230-4S
Technology: LDMOS
Power - Output: 1000W
Configuration: Dual
Frequency: 1.034GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230-4S
Packaging: Tape & Reel (TR)
Gain: 19.6dB
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 112 V
Part Status: Active
Supplier Device Package: NI-1230-4S
Technology: LDMOS
Power - Output: 1000W
Configuration: Dual
Frequency: 1.034GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230-4S
Packaging: Tape & Reel (TR)
Gain: 19.6dB
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MMRF1312HSR5 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Power - Output: 1000W
Configuration: Dual
Frequency: 1.034GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230-4S
Packaging: Cut Tape (CT)
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 112 V
Part Status: Active
Supplier Device Package: NI-1230-4S
Technology: LDMOS
Gain: 19.6dB
Description: RF MOSFET LDMOS 50V NI1230
Power - Output: 1000W
Configuration: Dual
Frequency: 1.034GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230-4S
Packaging: Cut Tape (CT)
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 112 V
Part Status: Active
Supplier Device Package: NI-1230-4S
Technology: LDMOS
Gain: 19.6dB
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1131.88 EUR |
| 10+ | 1097.83 EUR |
| OM13503UL |
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Hersteller: NXP USA Inc.
Description: PCA8539 LCD DEMO BOARD
Contents: Board(s)
Part Status: Obsolete
Embedded: Yes, MCU, 32-Bit
Supplied Contents: Board(s)
Utilized IC / Part: PCA8539
Type: Display
Function: LCD Controller
Packaging: Bulk
Description: PCA8539 LCD DEMO BOARD
Contents: Board(s)
Part Status: Obsolete
Embedded: Yes, MCU, 32-Bit
Supplied Contents: Board(s)
Utilized IC / Part: PCA8539
Type: Display
Function: LCD Controller
Packaging: Bulk
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 149.64 EUR |
| MRFE6VS25GN-960 |
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Hersteller: NXP USA Inc.
Description: MRFE6VS25GN REF BRD 1215MHZ 30W
Supplied Contents: Board(s)
Type: Transistor
Frequency: 960MHz ~ 1.215GHz
For Use With/Related Products: MRFE6VS25N
Packaging: Bulk
Description: MRFE6VS25GN REF BRD 1215MHZ 30W
Supplied Contents: Board(s)
Type: Transistor
Frequency: 960MHz ~ 1.215GHz
For Use With/Related Products: MRFE6VS25N
Packaging: Bulk
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1764.89 EUR |
| BGU8051X |
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Hersteller: NXP USA Inc.
Description: IC AMP GSM 300MHZ-1.5GHZ 8HWSON
Part Status: Active
Supplier Device Package: 8-HWSON (2x2)
Test Frequency: 900MHz
P1dB: 19dBm
Noise Figure: 0.43dB
Current - Supply: 48mA
Gain: 18.3dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: GSM, LTE, W-CDMA
Frequency: 300MHz ~ 1.5GHz
Mounting Type: Surface Mount
Package / Case: 8-WFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC AMP GSM 300MHZ-1.5GHZ 8HWSON
Part Status: Active
Supplier Device Package: 8-HWSON (2x2)
Test Frequency: 900MHz
P1dB: 19dBm
Noise Figure: 0.43dB
Current - Supply: 48mA
Gain: 18.3dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: GSM, LTE, W-CDMA
Frequency: 300MHz ~ 1.5GHz
Mounting Type: Surface Mount
Package / Case: 8-WFDFN Exposed Pad
Packaging: Tape & Reel (TR)
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2000+ | 8.89 EUR |
| BGU8051X |
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Hersteller: NXP USA Inc.
Description: IC AMP GSM 300MHZ-1.5GHZ 8HWSON
Part Status: Active
Supplier Device Package: 8-HWSON (2x2)
Test Frequency: 900MHz
P1dB: 19dBm
Noise Figure: 0.43dB
Current - Supply: 48mA
Gain: 18.3dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: GSM, LTE, W-CDMA
Frequency: 300MHz ~ 1.5GHz
Mounting Type: Surface Mount
Package / Case: 8-WFDFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC AMP GSM 300MHZ-1.5GHZ 8HWSON
Part Status: Active
Supplier Device Package: 8-HWSON (2x2)
Test Frequency: 900MHz
P1dB: 19dBm
Noise Figure: 0.43dB
Current - Supply: 48mA
Gain: 18.3dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: GSM, LTE, W-CDMA
Frequency: 300MHz ~ 1.5GHz
Mounting Type: Surface Mount
Package / Case: 8-WFDFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 4761 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.83 EUR |
| 10+ | 11.98 EUR |
| 25+ | 11.34 EUR |
| 100+ | 10.46 EUR |
| 250+ | 9.94 EUR |
| 500+ | 9.57 EUR |
| 1000+ | 9.22 EUR |
| MC56F83000-EVK |
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Hersteller: NXP USA Inc.
Description: MC56F83XXX EVK
Packaging: Bulk
Mounting Type: Fixed
Type: DSP
Contents: Board(s)
Core Processor: 56800EX
Board Type: Evaluation Platform
Utilized IC / Part: MC56F83789
Part Status: Active
Description: MC56F83XXX EVK
Packaging: Bulk
Mounting Type: Fixed
Type: DSP
Contents: Board(s)
Core Processor: 56800EX
Board Type: Evaluation Platform
Utilized IC / Part: MC56F83789
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF8101A0EP |
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Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT
Description: IC POWER MANAGEMENT
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
| SPC5777CDK3MMO4 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Packaging: Tray
Package / Case: 516-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 516-MAPBGA (27x27)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8MB FLASH 516MAPBGA
Packaging: Tray
Package / Case: 516-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 516-MAPBGA (27x27)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 801 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 161.19 EUR |
| 10+ | 134.29 EUR |
| 50+ | 123.55 EUR |
| 100+ | 120.21 EUR |
| J3D081MXS/T1DM1E6D |
Hersteller: NXP USA Inc.
Description: IC RF MODULE PLLCC8
Description: IC RF MODULE PLLCC8
Produkt ist nicht verfügbar
Mindestbestellmenge: 12500 Stücke
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Stück im Wert von UAH
| P60D016MX1C/9B070J |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P60D016MX1C/9B07AJ |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P60D016MX30/9B070J |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P60D016MX30/9B07AJ |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P60D016PX1C/9B060J |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P60D016PX1D/9B060J |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P60D016PX36/9B139J |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P60D024MX1C/9B071J |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P60D024MX1C/9B07AJ |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P60D024MX1C/9B950J |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P60D024MX1G/9B051J |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P60D024MX30/9B071J |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P60D024MX30/9B07AJ |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P60D024MX30/9B950J |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P60D024MX34/9B051J |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
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| P60D024MX34/9B950J |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
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| P60D024MX55/9B081J |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
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| P60D024PX34/9B0204 |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
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| P60D024PX34/9B9803 |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
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| P60D040MX1C/9C100J |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
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| P60D041PX30/9E38CJ |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
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| P60D052MX54/9C080J |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
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| N74F786D,602 |
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Hersteller: NXP USA Inc.
Description: IC ASYNC BUS ARBITER 16-SOIC
Packaging: Tube
Supplier Device Package: 16-SO
Supply Voltage: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: Bus Arbiter
Number of Bits: 4
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Description: IC ASYNC BUS ARBITER 16-SOIC
Packaging: Tube
Supplier Device Package: 16-SO
Supply Voltage: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: Bus Arbiter
Number of Bits: 4
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 118+ | 4.9 EUR |
| MPC8548ECVJAQGD |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Part Status: Obsolete
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Part Status: Obsolete
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
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| PCA9670PW112 |
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Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 16TSSOP
DigiKey Programmable: Not Verified
Part Status: Active
Current - Output Source/Sink: 100µA, 25mA
Supplier Device Package: 16-TSSOP
Interrupt Output: No
Clock Frequency: 1 MHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I²C
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Features: POR
Packaging: Bulk
Description: IC XPNDR 1MHZ I2C 16TSSOP
DigiKey Programmable: Not Verified
Part Status: Active
Current - Output Source/Sink: 100µA, 25mA
Supplier Device Package: 16-TSSOP
Interrupt Output: No
Clock Frequency: 1 MHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I²C
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Features: POR
Packaging: Bulk
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| 74HC240DB,118-NXP |
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERT 6V 20SSOP
Part Status: Active
Supplier Device Package: 20-SSOP
Current - Output High, Low: 7.8mA, 7.8mA
Number of Bits per Element: 4
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
Description: IC BUFFER INVERT 6V 20SSOP
Part Status: Active
Supplier Device Package: 20-SSOP
Current - Output High, Low: 7.8mA, 7.8mA
Number of Bits per Element: 4
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
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| LPC4330FET180/3D551 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Bulk
Number of I/O: 118
Part Status: Active
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 180TFBGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 264K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Bulk
Number of I/O: 118
Part Status: Active
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
DigiKey Programmable: Not Verified
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| J111,126 |
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Hersteller: NXP USA Inc.
Description: JFET N-CH 40V TO92-3
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
Voltage - Cutoff (VGS off) @ Id: 10 V @ 1 µA
Resistance - RDS(On): 30 Ohms
Power - Max: 400 mW
Drain to Source Voltage (Vdss): 40 V
Part Status: Obsolete
Supplier Device Package: TO-92-3
Voltage - Breakdown (V(BR)GSS): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 6pF @ 10V (VGS)
FET Type: N-Channel
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Packaging: Bulk
Description: JFET N-CH 40V TO92-3
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
Voltage - Cutoff (VGS off) @ Id: 10 V @ 1 µA
Resistance - RDS(On): 30 Ohms
Power - Max: 400 mW
Drain to Source Voltage (Vdss): 40 V
Part Status: Obsolete
Supplier Device Package: TO-92-3
Voltage - Breakdown (V(BR)GSS): 40 V
Input Capacitance (Ciss) (Max) @ Vds: 6pF @ 10V (VGS)
FET Type: N-Channel
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Packaging: Bulk
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1066+ | 0.54 EUR |
| 74HC7541D/S400118 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 20SO
Supplier Device Package: 20-SO
Current - Output High, Low: 7.8mA, 7.8mA
Number of Bits per Element: 8
Input Type: Schmitt Trigger
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Description: IC BUFFER NON-INVERT 6V 20SO
Supplier Device Package: 20-SO
Current - Output High, Low: 7.8mA, 7.8mA
Number of Bits per Element: 8
Input Type: Schmitt Trigger
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
auf Bestellung 1880 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 476+ | 1.2 EUR |
| 74HC7540D/C4118 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER INVERT 6V 20SO
Supplier Device Package: 20-SO
Current - Output High, Low: 7.8mA, 7.8mA
Number of Bits per Element: 8
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Description: IC BUFFER INVERT 6V 20SO
Supplier Device Package: 20-SO
Current - Output High, Low: 7.8mA, 7.8mA
Number of Bits per Element: 8
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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| S912XDP512J1CAL |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b, 16x10b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b, 16x10b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 49 EUR |
| 10+ | 42.29 EUR |
| MM912I637AV1EP-NXP |
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Hersteller: NXP USA Inc.
Description: BATTERY SENSOR, LIN, 96KB FLASH,
Number of I/O: 14
Grade: Automotive
Supplier Device Package: 48-QFN-EP (7x7)
Core Processor: HCS12
Program Memory Type: FLASH (48kB)
Controller Series: HCS12
Voltage - Supply: 2.25V ~ 5.25V
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 6K x 8
Interface: LIN, PWM, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
DigiKey Programmable: Not Verified
Packaging: Bulk
Description: BATTERY SENSOR, LIN, 96KB FLASH,
Number of I/O: 14
Grade: Automotive
Supplier Device Package: 48-QFN-EP (7x7)
Core Processor: HCS12
Program Memory Type: FLASH (48kB)
Controller Series: HCS12
Voltage - Supply: 2.25V ~ 5.25V
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 6K x 8
Interface: LIN, PWM, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
DigiKey Programmable: Not Verified
Packaging: Bulk
auf Bestellung 438 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 51+ | 11.25 EUR |
| MK22FN512VLL12R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Number of I/O: 66
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 33x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Number of I/O: 66
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 33x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| MK22FX512VMD12R |
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 100
Part Status: Not For New Designs
Supplier Device Package: 144-MAPBGA (13x13)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 42x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 100
Part Status: Not For New Designs
Supplier Device Package: 144-MAPBGA (13x13)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 42x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Produkt ist nicht verfügbar
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