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TJF1051T/3/1J TJF1051T/3/1J NXP USA Inc. TJA1051.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Duplex: Half
Part Status: Active
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10+2.27 EUR
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100+1.83 EUR
250+1.73 EUR
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TJF1051T/3/1U TJF1051T/3/1U NXP USA Inc. TJF1051.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEA1551T/N1518 NXP USA Inc. Description: TEA1551T/N1518
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IP4281CZ10115 IP4281CZ10115 NXP USA Inc. IP4281CZ10.pdf Description: TVS DIODE 8VC 10XSONU
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TJA1028T/3V3/20/1 NXP USA Inc. TJA1028.pdf Description: LIN TRANSCEIVER WITH INTEGRATED
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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SAF7741HV/N129D/S31557 NXP USA Inc. _SAF7741HV.pdf?t.download=true&u=ovmfp3 Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
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SAF7741HV/N118Z518 NXP USA Inc. _SAF7741HV.pdf?t.download=true&u=ovmfp3 Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
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SAF7741HV/N139/S1518 NXP USA Inc. _SAF7741HV.pdf?t.download=true&u=ovmfp3 Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
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NTS0302JKZ NTS0302JKZ NXP USA Inc. NTS0302.pdf Description: IC VOLT TRANSLATOR X2SON8
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Number of Bits: 2
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 8-X2SON (1.4x1)
Part Status: Active
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BF1205,115 BF1205,115 NXP USA Inc. BF1205_Rev_Oct2010.pdf Description: RF MOSFET 5V 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Gain: 26dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1.2dB
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 12 mA
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MC68332ACAG25 MC68332ACAG25 NXP USA Inc. MC68332UM_ZIP.zip Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
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MMA6527KCWR2 MMA6527KCWR2 NXP USA Inc. MMA65xx_Rev.9.0_Jan2017_DS.pdf Description: ACCELEROMETER 120G SPI 16QFN
Sensitivity (LSB/g): 16 (±120g)
Supplier Device Package: 16-QFN (6x6)
Voltage - Supply: 3.135V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±120g
Axis: X, Y
Type: Digital
Mounting Type: Surface Mount
Output Type: SPI
Package / Case: 16-QFN Exposed Pad
Features: Selectable Low Pass Filter
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC33742PEP MC33742PEP NXP USA Inc. MC33742.pdf Description: IC INTERFACE SPECIALIZED 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 48-QFN-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
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MC34704BEP MC34704BEP NXP USA Inc. MC34704.pdf Description: IC POWER MANAGEMENT 56-QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 86mA
Supplier Device Package: 56-QFN-EP (7x7)
Produkt ist nicht verfügbar
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OM12001/100557 NXP USA Inc. Description: AUTOMOTIVE TELEMATICS ON-BOARD U
Part Status: Active
RF Type: Cellular
Mounting Type: Surface Mount
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9670PW,118 PCA9670PW,118 NXP USA Inc. PCA9670.pdf Description: IC XPNDR 1MHZ I2C 16TSSOP
Part Status: Active
Current - Output Source/Sink: 100µA, 25mA
Supplier Device Package: 16-TSSOP
Interrupt Output: No
Clock Frequency: 1 MHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I2C
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Features: POR
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9670PW,118 PCA9670PW,118 NXP USA Inc. PCA9670.pdf Description: IC XPNDR 1MHZ I2C 16TSSOP
Part Status: Active
Current - Output Source/Sink: 100µA, 25mA
Supplier Device Package: 16-TSSOP
Interrupt Output: No
Clock Frequency: 1 MHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I2C
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Features: POR
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
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74HCT373BQ-Q100115 74HCT373BQ-Q100115 NXP USA Inc. 74HC_HCT373_Q100.pdf Description: BUS DRIVER, HCT SERIES, 8-BIT
Part Status: Active
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Delay Time - Propagation: 14ns
Current - Output High, Low: 6mA, 6mA
Independent Circuits: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: D-Type Transparent Latch
Circuit: 1:8
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 20-VFQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVT125PW/AU118 74LVT125PW/AU118 NXP USA Inc. PHGLS14123-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, LVT SERIES
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Supplier Device Package: 14-TSSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 1
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
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74ABT125DB,118-NXP NXP USA Inc. Description: IC BUFFER NON-INVERT 5.5V 14SSOP
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
Part Status: Active
Supplier Device Package: 14-SSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Produkt ist nicht verfügbar
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TDA20142/2 NXP USA Inc. Description: HIGH QUALITY INTEGRATED CIRCUIT
Part Status: Obsolete
Supplier Device Package: 28-HVQFN (5x5)
Voltage - Supply: 3.3V
Function: Tuner
Mounting Type: Surface Mount
Package / Case: 28-VFQFN Exposed Pad
Packaging: Bulk
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PCA9541ABS/03,118 PCA9541ABS/03,118 NXP USA Inc. PCA9541A.pdf Description: IC INTFACE SPECIALIZED 16HVQFN
Package / Case: 16-VQFN Exposed Pad
Packaging: Cut Tape (CT)
Supplier Device Package: 16-HVQFN (4x4)
Applications: 2-Channel I2C Multiplexer
Voltage - Supply: 2.3V ~ 5.5V
Interface: I2C, SMBus
Mounting Type: Surface Mount
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10+4.32 EUR
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100+3.56 EUR
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TEA1610P/N6,112 TEA1610P/N6,112 NXP USA Inc. TEA1610T_P.pdf Description: IC RESONANT CONVERTR CTRLR 16DIP
Package / Case: 16-DIP (0.300", 7.62mm)
Packaging: Tube
DigiKey Programmable: Not Verified
Current - Supply: 2.4 mA
Part Status: Obsolete
Supplier Device Package: 16-DIP
Applications: Resonant Converter Controller
Voltage - Supply: 0V ~ 15V
Operating Temperature: -25°C ~ 70°C
Mounting Type: Through Hole
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TDA10025HN/C1 NXP USA Inc. PHGLS23142-1.pdf?hkey=86B6989B4B77B8125D7B68A214AD8E2D Description: TELECOM CIRCUIT, 1-FUNC, PQCC48
Control Interface: I²C
Supplier Device Package: 48-HVQFN (7x7)
Applications: Consumer Video
Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V
Function: Processor
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Bulk
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HTMS8301FTB/AF,115 HTMS8301FTB/AF,115 NXP USA Inc. H184430_HITAGu_ISO_18000_2.pdf Description: RFID TAG R/W 100-150KHZ ENCAP
Part Status: Obsolete
Writable Memory: 1.76kb (User)
Standards: ISO 11784, ISO 11785
Technology: Passive
Memory Type: Read/Write
Frequency: 100kHz ~ 150kHz
Style: Encapsulated
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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HTMS8301FTK/AF,115 HTMS8301FTK/AF,115 NXP USA Inc. H184430_HITAGu_ISO_18000_2.pdf Description: RFID TAG R/W 100-150KHZ ENCAP
Part Status: Obsolete
Writable Memory: 1.76kb (User)
Standards: ISO 11784, ISO 11785
Technology: Passive
Memory Type: Read/Write
Frequency: 100kHz ~ 150kHz
Style: Encapsulated
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MRF300AN-40MHZ MRF300AN-40MHZ NXP USA Inc. MRF300AN.pdf Description: REF BOARD MRF300AN 40MHZ
Packaging: Bulk
For Use With/Related Products: MRF300AN
Frequency: 40.68MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF300AN
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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LPC4357JBD208K LPC4357JBD208K NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 142
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
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180+22.05 EUR
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LPC2420FBD208,551 LPC2420FBD208,551 NXP USA Inc. LPC2420_60.pdf Description: IC MCU 16/32BIT ROMLESS 208LQFP
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 82K x 8
Speed: 72MHz
DigiKey Programmable: Not Verified
Number of I/O: 160
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74HC280D/S400118 74HC280D/S400118 NXP USA Inc. PHGLS06115-1.pdf?t.download=true&u=5oefqw Description: PARITY GENERATOR/CHECKER, 9-BIT
Current - Output High, Low: 5.2mA, 5.2mA
Operating Temperature: -40°C ~ 125°C
Logic Type: Parity Generator/Checker
Mounting Type: Surface Mount
Number of Circuits: 9
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Voltage - Supply: 2 V ~ 6 V
Supplier Device Package: 14-SO
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74AVCH20T245DGV118 74AVCH20T245DGV118 NXP USA Inc. sn74avch20t245.pdf?t.download=true&u=5oefqw Description: BUS TRANSCEIVER, AVC SERIES
Packaging: Bulk
Part Status: Active
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74AVCH20T245DGV:11 74AVCH20T245DGV:11 NXP USA Inc. 74AVCH20T245_Rev_Feb2017.pdf Description: IC TRANSLATOR BIDIR 56TSSOP
Supplier Device Package: 56-TSSOP
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 10
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Translation Transceiver
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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74AVCH20T245BX,518 74AVCH20T245BX,518 NXP USA Inc. Description: IC TRNSLTR BIDIRECTIONAL 60HXQFN
Produkt ist nicht verfügbar
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PTN36043ABXY PTN36043ABXY NXP USA Inc. PTN36043A.pdf Description: IC SWITCH SPDT X 2 18X2QFN
Packaging: Tape & Reel (TR)
Package / Case: 18-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 18-X2QFN (2.4x2)
Voltage - Supply, Single (V+): 1.7V ~ 1.9V
Crosstalk: -50dB @ 2.5GHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Current - Leakage (IS(off)) (Max): 6µA
Part Status: Active
Number of Circuits: 2
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74HCT85DB,112-NXP NXP USA Inc. PHGLS05972-1.pdf?t.download=true&u=5oefqw Description: MAGNITUDE COMPARATOR, HCT SERIES
Number of Bits: 4
Part Status: Active
Output Function: AB
Max Propagation Delay @ V, Max CL: 44ns @ 4.5V, 50pF
Supplier Device Package: 16-SSOP
Current - Output High, Low: 4mA, 4mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Type: Magnitude Comparator
Output: Active High
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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ACTT8B-800CTN118 ACTT8B-800CTN118 NXP USA Inc. PHGL-S-A0000770165-1.pdf?t.download=true&u=5oefqw Description: AC THYRISTOR TRIAC - D2PAK
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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ACTT8B-800C0118 ACTT8B-800C0118 NXP USA Inc. PHGLS29464-1.pdf?t.download=true&u=5oefqw Description: AC THYRISTOR TRIAC - D2PAK
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74LV373PW,112 74LV373PW,112 NXP USA Inc. 74LV373.pdf Description: IC D-TYPE TRANSP SGL 8:8 20TSSOP
Supplier Device Package: 20-TSSOP
Delay Time - Propagation: 20ns
Current - Output High, Low: 16mA, 16mA
Independent Circuits: 1
Voltage - Supply: 1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: D-Type Transparent Latch
Circuit: 8:8
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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S9S08RNA32W1MLF S9S08RNA32W1MLF NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC32ABQ-Q100115 NXP USA Inc. 74LVC32A_Q100.pdf Description: IC GATE OR 4CH 2-INP 14DHVQFN
Current - Quiescent (Max): 40 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 3.8ns @ 3.3V, 50pF
Input Logic Level - Low: 0.7V ~ 0.8V
Input Logic Level - High: 1.7V ~ 2V
Supplier Device Package: 14-DHVQFN (2.5x3)
Number of Inputs: 2
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: OR Gate
Mounting Type: Surface Mount
Package / Case: 14-VFQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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FRDM-K66F FRDM-K66F NXP USA Inc. FRDM-K66F_UG.pdf Description: FREEDOM K26/K66 EVAL BRD
Part Status: Active
Platform: Freedom
Utilized IC / Part: K26, K66
Core Processor: ARM® Cortex®-M4
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
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PMEG6010AESB315 PMEG6010AESB315 NXP USA Inc. PMEG6010AESB.pdf Description: DIODE SCHOTTKY 60V 1A DSN10062
Part Status: Active
Current - Reverse Leakage @ Vr: 650 µA @ 60 V
Voltage - Forward (Vf) (Max) @ If: 625 mV @ 1 A
Voltage - DC Reverse (Vr) (Max): 60 V
Operating Temperature - Junction: 150°C
Supplier Device Package: DSN1006-2
Current - Average Rectified (Io): 1A
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Technology: Schottky
Reverse Recovery Time (trr): 2.4 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: 2-XDFN
Packaging: Bulk
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PMEG6010ESB315 NXP USA Inc. PMEG6010ESB.pdf Description: RECTIFIER DIODE, SCHOTTKY
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MRFX1K80HR5 MRFX1K80HR5 NXP USA Inc. MRFX1K80H.pdf Description: RF MOSFET LDMOS 65V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 470MHz
Configuration: Dual
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 182 V
Voltage - Test: 65 V
Current - Test: 200 mA
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SPC5646CF0MMJ1R SPC5646CF0MMJ1R NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
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SPC5646CF0MMJ1 SPC5646CF0MMJ1 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 199
Supplier Device Package: 256-MAPBGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 33x10b, 10x12b
Core Processor: e200z4d, e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/120MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
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PCA9509DP,118 PCA9509DP,118 NXP USA Inc. PCA9509.pdf Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Active
Capacitance - Input: 2 pF
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IP4253CZ12-6-TTL1 NXP USA Inc. IP4251_52_53_54-TTL.pdf Description: DATA LINE FILTER
Packaging: Bulk
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IP4251CZ12-6-TTL NXP USA Inc. Description: DATA LINE FILTER
Packaging: Bulk
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MC56F83789VLL MC56F83789VLL NXP USA Inc. MC56F83XXXFS.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 82
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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74AHC139PW-Q100118 74AHC139PW-Q100118 NXP USA Inc. 74AHC_AHCT139_Q100.pdf Description: DECODER/DRIVER
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BSH205G2235 NXP USA Inc. BSH205G2.pdf Description: P-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
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BSH205G2215 NXP USA Inc. BSH205G2.pdf Description: P-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
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PMT200EN,115 PMT200EN,115 NXP USA Inc. Description: MOSFET N-CH 100V 1.8A SOT223
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
Rds On (Max) @ Id, Vgs: 235mOhm @ 1.5A, 10V
Power Dissipation (Max): 800mW (Ta), 8.3W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 475 pF @ 80 V
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PMT200EPEA115 PMT200EPEA115 NXP USA Inc. PMT200EPE.pdf Description: P-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
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OM13574UL NXP USA Inc. Description: EVAL BOARD FOR PCA9412A
Packaging: Bulk
Board Type: Fully Populated
Utilized IC / Part: PCA9412A
Supplied Contents: Board(s)
Contents: Board(s)
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MKE15Z128VLH7 MKE15Z128VLH7 NXP USA Inc. KE1xZP100M72SF0.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Number of I/O: 58
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 27x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 32K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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74ALVC245D,112 NXP USA Inc. PHGLS15272-1.pdf?t.download=true&u=5oefqw Description: IC TXRX NON-INVERT 3.6V 20SO
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Part Status: Active
Supplier Device Package: 20-SO
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
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NX20P0407UKZ NX20P0407UKZ NXP USA Inc. NX20P0407.pdf Description: USB TYPE-C CC1/2 SBU1/2 PROT IC
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Technology: Internal Switch
Voltage - Clamping: 28V
Supplier Device Package: 12-WLCSP (1.67x1.27)
Part Status: Active
Number of Circuits: 4
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PCA9633D16,112 PCA9633D16,112 NXP USA Inc. PCA9633.pdf Description: IC LED DRIVER PS PWM 25MA 16SO
Part Status: Obsolete
Number of Outputs: 4
Mounting Type: Surface Mount
Voltage - Output: 5.5V
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.3V
Dimming: PWM
Supplier Device Package: 16-SO
Internal Switch(s): Yes
Current - Output / Channel: 25mA
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Type: Power Switch
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TJF1051T/3/1J TJA1051.pdf
TJF1051T/3/1J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Duplex: Half
Part Status: Active
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TJF1051T/3/1U TJF1051.pdf
TJF1051T/3/1U
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEA1551T/N1518
Hersteller: NXP USA Inc.
Description: TEA1551T/N1518
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IP4281CZ10115 IP4281CZ10.pdf
IP4281CZ10115
Hersteller: NXP USA Inc.
Description: TVS DIODE 8VC 10XSONU
Produkt ist nicht verfügbar
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TJA1028T/3V3/20/1 TJA1028.pdf
Hersteller: NXP USA Inc.
Description: LIN TRANSCEIVER WITH INTEGRATED
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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SAF7741HV/N129D/S31557 _SAF7741HV.pdf?t.download=true&u=ovmfp3
Hersteller: NXP USA Inc.
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
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SAF7741HV/N118Z518 _SAF7741HV.pdf?t.download=true&u=ovmfp3
Hersteller: NXP USA Inc.
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
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SAF7741HV/N139/S1518 _SAF7741HV.pdf?t.download=true&u=ovmfp3
Hersteller: NXP USA Inc.
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
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NTS0302JKZ NTS0302.pdf
NTS0302JKZ
Hersteller: NXP USA Inc.
Description: IC VOLT TRANSLATOR X2SON8
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Number of Bits: 2
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 8-X2SON (1.4x1)
Part Status: Active
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BF1205,115 BF1205_Rev_Oct2010.pdf
BF1205,115
Hersteller: NXP USA Inc.
Description: RF MOSFET 5V 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Gain: 26dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1.2dB
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 12 mA
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MC68332ACAG25 MC68332UM_ZIP.zip
MC68332ACAG25
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
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MMA6527KCWR2 MMA65xx_Rev.9.0_Jan2017_DS.pdf
MMA6527KCWR2
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 120G SPI 16QFN
Sensitivity (LSB/g): 16 (±120g)
Supplier Device Package: 16-QFN (6x6)
Voltage - Supply: 3.135V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±120g
Axis: X, Y
Type: Digital
Mounting Type: Surface Mount
Output Type: SPI
Package / Case: 16-QFN Exposed Pad
Features: Selectable Low Pass Filter
Packaging: Tape & Reel (TR)
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MC33742PEP MC33742.pdf
MC33742PEP
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 48-QFN-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
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MC34704BEP MC34704.pdf
MC34704BEP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT 56-QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 86mA
Supplier Device Package: 56-QFN-EP (7x7)
Produkt ist nicht verfügbar
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OM12001/100557
Hersteller: NXP USA Inc.
Description: AUTOMOTIVE TELEMATICS ON-BOARD U
Part Status: Active
RF Type: Cellular
Mounting Type: Surface Mount
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9670PW,118 PCA9670.pdf
PCA9670PW,118
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 16TSSOP
Part Status: Active
Current - Output Source/Sink: 100µA, 25mA
Supplier Device Package: 16-TSSOP
Interrupt Output: No
Clock Frequency: 1 MHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I2C
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Features: POR
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9670PW,118 PCA9670.pdf
PCA9670PW,118
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 16TSSOP
Part Status: Active
Current - Output Source/Sink: 100µA, 25mA
Supplier Device Package: 16-TSSOP
Interrupt Output: No
Clock Frequency: 1 MHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I2C
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Features: POR
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
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74HCT373BQ-Q100115 74HC_HCT373_Q100.pdf
74HCT373BQ-Q100115
Hersteller: NXP USA Inc.
Description: BUS DRIVER, HCT SERIES, 8-BIT
Part Status: Active
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Delay Time - Propagation: 14ns
Current - Output High, Low: 6mA, 6mA
Independent Circuits: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: D-Type Transparent Latch
Circuit: 1:8
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 20-VFQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVT125PW/AU118 PHGLS14123-1.pdf?t.download=true&u=5oefqw
74LVT125PW/AU118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVT SERIES
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Supplier Device Package: 14-TSSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 1
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
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74ABT125DB,118-NXP
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 14SSOP
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
Part Status: Active
Supplier Device Package: 14-SSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Produkt ist nicht verfügbar
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TDA20142/2
Hersteller: NXP USA Inc.
Description: HIGH QUALITY INTEGRATED CIRCUIT
Part Status: Obsolete
Supplier Device Package: 28-HVQFN (5x5)
Voltage - Supply: 3.3V
Function: Tuner
Mounting Type: Surface Mount
Package / Case: 28-VFQFN Exposed Pad
Packaging: Bulk
auf Bestellung 14700 Stücke:
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AnzahlPrivatkunde
575+1.82 EUR
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PCA9541ABS/03,118 PCA9541A.pdf
PCA9541ABS/03,118
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 16HVQFN
Package / Case: 16-VQFN Exposed Pad
Packaging: Cut Tape (CT)
Supplier Device Package: 16-HVQFN (4x4)
Applications: 2-Channel I2C Multiplexer
Voltage - Supply: 2.3V ~ 5.5V
Interface: I2C, SMBus
Mounting Type: Surface Mount
auf Bestellung 427 Stücke:
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4+5.76 EUR
10+4.32 EUR
25+3.95 EUR
100+3.56 EUR
250+3.37 EUR
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TEA1610P/N6,112 TEA1610T_P.pdf
TEA1610P/N6,112
Hersteller: NXP USA Inc.
Description: IC RESONANT CONVERTR CTRLR 16DIP
Package / Case: 16-DIP (0.300", 7.62mm)
Packaging: Tube
DigiKey Programmable: Not Verified
Current - Supply: 2.4 mA
Part Status: Obsolete
Supplier Device Package: 16-DIP
Applications: Resonant Converter Controller
Voltage - Supply: 0V ~ 15V
Operating Temperature: -25°C ~ 70°C
Mounting Type: Through Hole
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268+2.14 EUR
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TDA10025HN/C1 PHGLS23142-1.pdf?hkey=86B6989B4B77B8125D7B68A214AD8E2D
Hersteller: NXP USA Inc.
Description: TELECOM CIRCUIT, 1-FUNC, PQCC48
Control Interface: I²C
Supplier Device Package: 48-HVQFN (7x7)
Applications: Consumer Video
Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V
Function: Processor
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Bulk
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291+3.61 EUR
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HTMS8301FTB/AF,115 H184430_HITAGu_ISO_18000_2.pdf
HTMS8301FTB/AF,115
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Part Status: Obsolete
Writable Memory: 1.76kb (User)
Standards: ISO 11784, ISO 11785
Technology: Passive
Memory Type: Read/Write
Frequency: 100kHz ~ 150kHz
Style: Encapsulated
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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HTMS8301FTK/AF,115 H184430_HITAGu_ISO_18000_2.pdf
HTMS8301FTK/AF,115
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Part Status: Obsolete
Writable Memory: 1.76kb (User)
Standards: ISO 11784, ISO 11785
Technology: Passive
Memory Type: Read/Write
Frequency: 100kHz ~ 150kHz
Style: Encapsulated
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MRF300AN-40MHZ MRF300AN.pdf
MRF300AN-40MHZ
Hersteller: NXP USA Inc.
Description: REF BOARD MRF300AN 40MHZ
Packaging: Bulk
For Use With/Related Products: MRF300AN
Frequency: 40.68MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF300AN
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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LPC4357JBD208K LPC435X_3X_2X_1X.pdf
LPC4357JBD208K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 142
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
auf Bestellung 785 Stücke:
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1+29.02 EUR
10+22.37 EUR
25+22.35 EUR
180+22.05 EUR
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LPC2420FBD208,551 LPC2420_60.pdf
LPC2420FBD208,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 82K x 8
Speed: 72MHz
DigiKey Programmable: Not Verified
Number of I/O: 160
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24+24.54 EUR
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74HC280D/S400118 PHGLS06115-1.pdf?t.download=true&u=5oefqw
74HC280D/S400118
Hersteller: NXP USA Inc.
Description: PARITY GENERATOR/CHECKER, 9-BIT
Current - Output High, Low: 5.2mA, 5.2mA
Operating Temperature: -40°C ~ 125°C
Logic Type: Parity Generator/Checker
Mounting Type: Surface Mount
Number of Circuits: 9
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Voltage - Supply: 2 V ~ 6 V
Supplier Device Package: 14-SO
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1480+0.39 EUR
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74AVCH20T245DGV118 sn74avch20t245.pdf?t.download=true&u=5oefqw
74AVCH20T245DGV118
Hersteller: NXP USA Inc.
Description: BUS TRANSCEIVER, AVC SERIES
Packaging: Bulk
Part Status: Active
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260+2.26 EUR
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74AVCH20T245DGV:11 74AVCH20T245_Rev_Feb2017.pdf
74AVCH20T245DGV:11
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 56TSSOP
Supplier Device Package: 56-TSSOP
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 10
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Translation Transceiver
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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74AVCH20T245BX,518
74AVCH20T245BX,518
Hersteller: NXP USA Inc.
Description: IC TRNSLTR BIDIRECTIONAL 60HXQFN
Produkt ist nicht verfügbar
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PTN36043ABXY PTN36043A.pdf
PTN36043ABXY
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 2 18X2QFN
Packaging: Tape & Reel (TR)
Package / Case: 18-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 18-X2QFN (2.4x2)
Voltage - Supply, Single (V+): 1.7V ~ 1.9V
Crosstalk: -50dB @ 2.5GHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Current - Leakage (IS(off)) (Max): 6µA
Part Status: Active
Number of Circuits: 2
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74HCT85DB,112-NXP PHGLS05972-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: MAGNITUDE COMPARATOR, HCT SERIES
Number of Bits: 4
Part Status: Active
Output Function: AB
Max Propagation Delay @ V, Max CL: 44ns @ 4.5V, 50pF
Supplier Device Package: 16-SSOP
Current - Output High, Low: 4mA, 4mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Type: Magnitude Comparator
Output: Active High
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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ACTT8B-800CTN118 PHGL-S-A0000770165-1.pdf?t.download=true&u=5oefqw
ACTT8B-800CTN118
Hersteller: NXP USA Inc.
Description: AC THYRISTOR TRIAC - D2PAK
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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ACTT8B-800C0118 PHGLS29464-1.pdf?t.download=true&u=5oefqw
ACTT8B-800C0118
Hersteller: NXP USA Inc.
Description: AC THYRISTOR TRIAC - D2PAK
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74LV373PW,112 74LV373.pdf
74LV373PW,112
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20TSSOP
Supplier Device Package: 20-TSSOP
Delay Time - Propagation: 20ns
Current - Output High, Low: 16mA, 16mA
Independent Circuits: 1
Voltage - Supply: 1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: D-Type Transparent Latch
Circuit: 8:8
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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1665+0.36 EUR
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S9S08RNA32W1MLF MC9S08AC60.pdf
S9S08RNA32W1MLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC32ABQ-Q100115 74LVC32A_Q100.pdf
Hersteller: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14DHVQFN
Current - Quiescent (Max): 40 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 3.8ns @ 3.3V, 50pF
Input Logic Level - Low: 0.7V ~ 0.8V
Input Logic Level - High: 1.7V ~ 2V
Supplier Device Package: 14-DHVQFN (2.5x3)
Number of Inputs: 2
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: OR Gate
Mounting Type: Surface Mount
Package / Case: 14-VFQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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FRDM-K66F FRDM-K66F_UG.pdf
FRDM-K66F
Hersteller: NXP USA Inc.
Description: FREEDOM K26/K66 EVAL BRD
Part Status: Active
Platform: Freedom
Utilized IC / Part: K26, K66
Core Processor: ARM® Cortex®-M4
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
auf Bestellung 141 Stücke:
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1+151.45 EUR
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PMEG6010AESB315 PMEG6010AESB.pdf
PMEG6010AESB315
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 60V 1A DSN10062
Part Status: Active
Current - Reverse Leakage @ Vr: 650 µA @ 60 V
Voltage - Forward (Vf) (Max) @ If: 625 mV @ 1 A
Voltage - DC Reverse (Vr) (Max): 60 V
Operating Temperature - Junction: 150°C
Supplier Device Package: DSN1006-2
Current - Average Rectified (Io): 1A
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Technology: Schottky
Reverse Recovery Time (trr): 2.4 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: 2-XDFN
Packaging: Bulk
Produkt ist nicht verfügbar
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PMEG6010ESB315 PMEG6010ESB.pdf
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MRFX1K80HR5 MRFX1K80H.pdf
MRFX1K80HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 65V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 470MHz
Configuration: Dual
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 182 V
Voltage - Test: 65 V
Current - Test: 200 mA
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1+753.38 EUR
10+652.94 EUR
25+627.87 EUR
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SPC5646CF0MMJ1R
SPC5646CF0MMJ1R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
Produkt ist nicht verfügbar
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SPC5646CF0MMJ1
SPC5646CF0MMJ1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 199
Supplier Device Package: 256-MAPBGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 33x10b, 10x12b
Core Processor: e200z4d, e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/120MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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PCA9509DP,118 PCA9509.pdf
PCA9509DP,118
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Active
Capacitance - Input: 2 pF
auf Bestellung 2438 Stücke:
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6+3.67 EUR
10+2.7 EUR
25+2.46 EUR
100+2.2 EUR
250+2.07 EUR
500+2 EUR
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IP4253CZ12-6-TTL1 IP4251_52_53_54-TTL.pdf
Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
Packaging: Bulk
Produkt ist nicht verfügbar
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IP4251CZ12-6-TTL
Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
Packaging: Bulk
Produkt ist nicht verfügbar
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MC56F83789VLL MC56F83XXXFS.pdf
MC56F83789VLL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 82
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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74AHC139PW-Q100118 74AHC_AHCT139_Q100.pdf
74AHC139PW-Q100118
Hersteller: NXP USA Inc.
Description: DECODER/DRIVER
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BSH205G2235 BSH205G2.pdf
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BSH205G2215 BSH205G2.pdf
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PMT200EN,115
PMT200EN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 1.8A SOT223
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
Rds On (Max) @ Id, Vgs: 235mOhm @ 1.5A, 10V
Power Dissipation (Max): 800mW (Ta), 8.3W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 475 pF @ 80 V
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3806+0.17 EUR
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PMT200EPEA115 PMT200EPE.pdf
PMT200EPEA115
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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OM13574UL
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PCA9412A
Packaging: Bulk
Board Type: Fully Populated
Utilized IC / Part: PCA9412A
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
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MKE15Z128VLH7 KE1xZP100M72SF0.pdf
MKE15Z128VLH7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Number of I/O: 58
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 27x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 32K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 793 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+7.54 EUR
10+5.3 EUR
Mindestbestellmenge: 3 Stücke
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74ALVC245D,112 PHGLS15272-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 20SO
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Part Status: Active
Supplier Device Package: 20-SO
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Produkt ist nicht verfügbar
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NX20P0407UKZ NX20P0407.pdf
NX20P0407UKZ
Hersteller: NXP USA Inc.
Description: USB TYPE-C CC1/2 SBU1/2 PROT IC
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Technology: Internal Switch
Voltage - Clamping: 28V
Supplier Device Package: 12-WLCSP (1.67x1.27)
Part Status: Active
Number of Circuits: 4
auf Bestellung 41280 Stücke:
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5+5.02 EUR
10+3.24 EUR
100+2.21 EUR
500+1.77 EUR
1000+1.64 EUR
2000+1.63 EUR
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PCA9633D16,112 PCA9633.pdf
PCA9633D16,112
Hersteller: NXP USA Inc.
Description: IC LED DRIVER PS PWM 25MA 16SO
Part Status: Obsolete
Number of Outputs: 4
Mounting Type: Surface Mount
Voltage - Output: 5.5V
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.3V
Dimming: PWM
Supplier Device Package: 16-SO
Internal Switch(s): Yes
Current - Output / Channel: 25mA
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Type: Power Switch
auf Bestellung 1046 Stücke:
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525+1.19 EUR
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