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PCA9541ABS/03,118 PCA9541ABS/03,118 NXP USA Inc. PCA9541A.pdf Description: IC INTFACE SPECIALIZED 16HVQFN
Package / Case: 16-VQFN Exposed Pad
Packaging: Cut Tape (CT)
Supplier Device Package: 16-HVQFN (4x4)
Applications: 2-Channel I2C Multiplexer
Voltage - Supply: 2.3V ~ 5.5V
Interface: I2C, SMBus
Mounting Type: Surface Mount
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100+3.56 EUR
250+3.37 EUR
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TEA1610P/N6,112 TEA1610P/N6,112 NXP USA Inc. TEA1610T_P.pdf Description: IC RESONANT CONVERTR CTRLR 16DIP
Package / Case: 16-DIP (0.300", 7.62mm)
Packaging: Tube
DigiKey Programmable: Not Verified
Current - Supply: 2.4 mA
Part Status: Obsolete
Supplier Device Package: 16-DIP
Applications: Resonant Converter Controller
Voltage - Supply: 0V ~ 15V
Operating Temperature: -25°C ~ 70°C
Mounting Type: Through Hole
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TDA10025HN/C1 NXP USA Inc. PHGLS23142-1.pdf?hkey=86B6989B4B77B8125D7B68A214AD8E2D Description: TELECOM CIRCUIT, 1-FUNC, PQCC48
Control Interface: I²C
Supplier Device Package: 48-HVQFN (7x7)
Applications: Consumer Video
Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V
Function: Processor
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Bulk
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HTMS8301FTB/AF,115 HTMS8301FTB/AF,115 NXP USA Inc. H184430_HITAGu_ISO_18000_2.pdf Description: RFID TAG R/W 100-150KHZ ENCAP
Part Status: Obsolete
Writable Memory: 1.76kb (User)
Standards: ISO 11784, ISO 11785
Technology: Passive
Memory Type: Read/Write
Frequency: 100kHz ~ 150kHz
Style: Encapsulated
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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HTMS8301FTK/AF,115 HTMS8301FTK/AF,115 NXP USA Inc. H184430_HITAGu_ISO_18000_2.pdf Description: RFID TAG R/W 100-150KHZ ENCAP
Part Status: Obsolete
Writable Memory: 1.76kb (User)
Standards: ISO 11784, ISO 11785
Technology: Passive
Memory Type: Read/Write
Frequency: 100kHz ~ 150kHz
Style: Encapsulated
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MRF300AN-40MHZ MRF300AN-40MHZ NXP USA Inc. MRF300AN.pdf Description: REF BOARD MRF300AN 40MHZ
Packaging: Bulk
For Use With/Related Products: MRF300AN
Frequency: 40.68MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF300AN
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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LPC4357JBD208K LPC4357JBD208K NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 142
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
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LPC2420FBD208,551 LPC2420FBD208,551 NXP USA Inc. LPC2420_60.pdf Description: IC MCU 16/32BIT ROMLESS 208LQFP
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 82K x 8
Speed: 72MHz
DigiKey Programmable: Not Verified
Number of I/O: 160
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74HC280D/S400118 74HC280D/S400118 NXP USA Inc. PHGLS06115-1.pdf?t.download=true&u=5oefqw Description: PARITY GENERATOR/CHECKER, 9-BIT
Current - Output High, Low: 5.2mA, 5.2mA
Operating Temperature: -40°C ~ 125°C
Logic Type: Parity Generator/Checker
Mounting Type: Surface Mount
Number of Circuits: 9
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Voltage - Supply: 2 V ~ 6 V
Supplier Device Package: 14-SO
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74AVCH20T245DGV118 74AVCH20T245DGV118 NXP USA Inc. sn74avch20t245.pdf?t.download=true&u=5oefqw Description: BUS TRANSCEIVER, AVC SERIES
Packaging: Bulk
Part Status: Active
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74AVCH20T245DGV:11 74AVCH20T245DGV:11 NXP USA Inc. 74AVCH20T245_Rev_Feb2017.pdf Description: IC TRANSLATOR BIDIR 56TSSOP
Supplier Device Package: 56-TSSOP
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 10
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Translation Transceiver
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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74AVCH20T245BX,518 74AVCH20T245BX,518 NXP USA Inc. Description: IC TRNSLTR BIDIRECTIONAL 60HXQFN
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PTN36043ABXY PTN36043ABXY NXP USA Inc. PTN36043A.pdf Description: IC SWITCH SPDT X 2 18X2QFN
Packaging: Tape & Reel (TR)
Package / Case: 18-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 18-X2QFN (2.4x2)
Voltage - Supply, Single (V+): 1.7V ~ 1.9V
Crosstalk: -50dB @ 2.5GHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Current - Leakage (IS(off)) (Max): 6µA
Part Status: Active
Number of Circuits: 2
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74HCT85DB,112-NXP NXP USA Inc. PHGLS05972-1.pdf?t.download=true&u=5oefqw Description: MAGNITUDE COMPARATOR, HCT SERIES
Number of Bits: 4
Part Status: Active
Output Function: AB
Max Propagation Delay @ V, Max CL: 44ns @ 4.5V, 50pF
Supplier Device Package: 16-SSOP
Current - Output High, Low: 4mA, 4mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Type: Magnitude Comparator
Output: Active High
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Tube
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ACTT8B-800CTN118 ACTT8B-800CTN118 NXP USA Inc. PHGL-S-A0000770165-1.pdf?t.download=true&u=5oefqw Description: AC THYRISTOR TRIAC - D2PAK
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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ACTT8B-800C0118 ACTT8B-800C0118 NXP USA Inc. PHGLS29464-1.pdf?t.download=true&u=5oefqw Description: AC THYRISTOR TRIAC - D2PAK
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74LV373PW,112 74LV373PW,112 NXP USA Inc. 74LV373.pdf Description: IC D-TYPE TRANSP SGL 8:8 20TSSOP
Supplier Device Package: 20-TSSOP
Delay Time - Propagation: 20ns
Current - Output High, Low: 16mA, 16mA
Independent Circuits: 1
Voltage - Supply: 1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: D-Type Transparent Latch
Circuit: 8:8
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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S9S08RNA32W1MLF S9S08RNA32W1MLF NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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74LVC32ABQ-Q100115 NXP USA Inc. 74LVC32A_Q100.pdf Description: IC GATE OR 4CH 2-INP 14DHVQFN
Current - Quiescent (Max): 40 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 3.8ns @ 3.3V, 50pF
Input Logic Level - Low: 0.7V ~ 0.8V
Input Logic Level - High: 1.7V ~ 2V
Supplier Device Package: 14-DHVQFN (2.5x3)
Number of Inputs: 2
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: OR Gate
Mounting Type: Surface Mount
Package / Case: 14-VFQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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FRDM-K66F FRDM-K66F NXP USA Inc. K66P144M180SF5V2.pdf Description: FREEDOM K26/K66 EVAL BRD
Part Status: Active
Platform: Freedom
Utilized IC / Part: K26, K66
Core Processor: ARM® Cortex®-M4
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
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PMEG6010AESB315 PMEG6010AESB315 NXP USA Inc. PMEG6010AESB.pdf Description: DIODE SCHOTTKY 60V 1A DSN10062
Part Status: Active
Current - Reverse Leakage @ Vr: 650 µA @ 60 V
Voltage - Forward (Vf) (Max) @ If: 625 mV @ 1 A
Voltage - DC Reverse (Vr) (Max): 60 V
Operating Temperature - Junction: 150°C
Supplier Device Package: DSN1006-2
Current - Average Rectified (Io): 1A
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Technology: Schottky
Reverse Recovery Time (trr): 2.4 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: 2-XDFN
Packaging: Bulk
Produkt ist nicht verfügbar
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PMEG6010ESB315 NXP USA Inc. PMEG6010ESB.pdf Description: RECTIFIER DIODE, SCHOTTKY
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MRFX1K80HR5 MRFX1K80HR5 NXP USA Inc. MRFX1K80H.pdf Description: RF MOSFET LDMOS 65V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 470MHz
Configuration: Dual
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 182 V
Voltage - Test: 65 V
Current - Test: 200 mA
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SPC5646CF0MMJ1R SPC5646CF0MMJ1R NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
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SPC5646CF0MMJ1 SPC5646CF0MMJ1 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 199
Supplier Device Package: 256-MAPBGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 33x10b, 10x12b
Core Processor: e200z4d, e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/120MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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PCA9509DP,118 PCA9509DP,118 NXP USA Inc. PCA9509.pdf Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Active
Capacitance - Input: 2 pF
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IP4253CZ12-6-TTL1 NXP USA Inc. IP4251_52_53_54-TTL.pdf Description: DATA LINE FILTER
Packaging: Bulk
Produkt ist nicht verfügbar
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IP4251CZ12-6-TTL NXP USA Inc. Description: DATA LINE FILTER
Packaging: Bulk
Produkt ist nicht verfügbar
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MC56F83789VLL MC56F83789VLL NXP USA Inc. MC56F83XXXFS.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 82
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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74AHC139PW-Q100118 74AHC139PW-Q100118 NXP USA Inc. 74AHC_AHCT139_Q100.pdf Description: DECODER/DRIVER
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BSH205G2235 NXP USA Inc. BSH205G2.pdf Description: P-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BSH205G2215 NXP USA Inc. BSH205G2.pdf Description: P-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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PMT200EN,115 PMT200EN,115 NXP USA Inc. Description: MOSFET N-CH 100V 1.8A SOT223
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
Rds On (Max) @ Id, Vgs: 235mOhm @ 1.5A, 10V
Power Dissipation (Max): 800mW (Ta), 8.3W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 475 pF @ 80 V
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PMT200EPEA115 PMT200EPEA115 NXP USA Inc. PMT200EPE.pdf Description: P-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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OM13574UL NXP USA Inc. Description: EVAL BOARD FOR PCA9412A
Packaging: Bulk
Board Type: Fully Populated
Utilized IC / Part: PCA9412A
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
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MKE15Z128VLH7 MKE15Z128VLH7 NXP USA Inc. KE1xZP100M72SF0.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Number of I/O: 58
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 27x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 32K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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74ALVC245D,112 NXP USA Inc. PHGLS15272-1.pdf?t.download=true&u=5oefqw Description: IC TXRX NON-INVERT 3.6V 20SO
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Part Status: Active
Supplier Device Package: 20-SO
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Produkt ist nicht verfügbar
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NX20P0407UKZ NX20P0407UKZ NXP USA Inc. NX20P0407.pdf Description: USB TYPE-C CC1/2 SBU1/2 PROT IC
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Technology: Internal Switch
Voltage - Clamping: 28V
Supplier Device Package: 12-WLCSP (1.67x1.27)
Part Status: Active
Number of Circuits: 4
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500+1.64 EUR
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PCA9633D16,112 PCA9633D16,112 NXP USA Inc. PCA9633.pdf Description: IC LED DRIVER PS PWM 25MA 16SO
Part Status: Obsolete
Number of Outputs: 4
Mounting Type: Surface Mount
Voltage - Output: 5.5V
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.3V
Dimming: PWM
Supplier Device Package: 16-SO
Internal Switch(s): Yes
Current - Output / Channel: 25mA
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Type: Power Switch
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PCA9633TK,118 PCA9633TK,118 NXP USA Inc. PCA9633.pdf Description: IC LED DRIVER PS PWM 25MA 8HVSON
Part Status: Active
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.3V
Dimming: I2C
Supplier Device Package: 8-HVSON (3x3)
Internal Switch(s): Yes
Current - Output / Channel: 25mA
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Type: Power Switch
Number of Outputs: 4
Mounting Type: Surface Mount
Voltage - Output: 5.5V
Package / Case: 8-VFDFN Exposed Pad
Packaging: Cut Tape (CT)
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25+1.86 EUR
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250+1.56 EUR
500+1.5 EUR
1000+1.44 EUR
2500+1.39 EUR
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PCA9633PW112 PCA9633PW112 NXP USA Inc. PHGLS15651-1.pdf?t.download=true&u=5oefqw Description: LED DRIVER 4-SEGMENT
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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PBLS1503V,115-NXP PBLS1503V,115-NXP NXP USA Inc. PHGLS19114-1.pdf?t.download=true&u=5oefqw Description: 0.1A 50V 2-ELEMENT NPN AND PNP
Part Status: Active
Supplier Device Package: SOT-666
Resistor - Emitter Base (R2): 10kOhms
Resistor - Base (R1): 10kOhms
Frequency - Transition: 280MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V / 200 @ 10mA, 2V
Current - Collector Cutoff (Max): 1µA, 100nA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 250mV @ 50mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 15V
Current - Collector (Ic) (Max): 100mA, 500mA
Power - Max: 300mW
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Mounting Type: Surface Mount
Package / Case: SOT-563, SOT-666
Packaging: Bulk
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74AUP1G86GW-Q100125 74AUP1G86GW-Q100125 NXP USA Inc. 74AUP1G86_Q100.pdf Description: IC GATE XOR 1CH 2-INP 5TSSOP
Qualification: AEC-Q100
Current - Quiescent (Max): 500 nA
Number of Circuits: 1
Grade: Automotive
Max Propagation Delay @ V, Max CL: 7.1ns @ 3.3V, 30pF
Supplier Device Package: 5-TSSOP
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: XOR (Exclusive OR)
Mounting Type: Surface Mount
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Packaging: Bulk
Produkt ist nicht verfügbar
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74AUP1G86GF,132 74AUP1G86GF,132 NXP USA Inc. PHGLS24884-1.pdf?t.download=true&u=5oefqw Description: IC GATE XOR 1CH 2-INP 6XSON
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74LVCH244APW/AUJ118 NXP USA Inc. Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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PSMN1R9-40PL127 PSMN1R9-40PL127 NXP USA Inc. PSMN1R9-40PL.pdf Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 150A (Ta)
Rds On (Max) @ Id, Vgs: 1.7mOhm @ 25A, 10V
Power Dissipation (Max): 349W (Ta)
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 230 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 13200 pF @ 25 V
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BUK7230-55A BUK7230-55A NXP USA Inc. BUK7230-55A.pdf Description: MOSFET 38AA
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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S08PT60-EVK S08PT60-EVK NXP USA Inc. S08PT60EVKQSG.pdf Description: EVALUATION BOARD S08PT60
Part Status: Active
Utilized IC / Part: MC9S08PT16
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
auf Bestellung 6 Stücke:
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MC9S08PL8CLC MC9S08PL8CLC NXP USA Inc. MC9S08PL4.pdf Description: IC MCU 8BIT 8KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 30
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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MC9S08PL32CLC MC9S08PL32CLC NXP USA Inc. MC9S08PL60.pdf Description: IC MCU 8BIT 32KB FLASH 32LQFP
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
DigiKey Programmable: Not Verified
Number of I/O: 30
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MC9S08PL60CLC MC9S08PL60CLC NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 60KB FLASH 32LQFP
Number of I/O: 30
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM
DigiKey Programmable: Not Verified
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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MC9S08PA32AVLDR MC9S08PA32AVLDR NXP USA Inc. MC9S08PL60.pdf Description: IC MCU 8BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC9S08PL16CLD MC9S08PL16CLD NXP USA Inc. MC9S08PL16.pdf Description: IC MCU 8BIT 16KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S08QG84CDTE MC9S08QG84CDTE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Verified
Number of I/O: 12
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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S9S08RNA32W1VLF NXP USA Inc. Description: 8 BIT HCS08L 32K FLASH
Produkt ist nicht verfügbar
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MMPF0100F1AEPR2,528 NXP USA Inc. Description: PMIC I.MX6, PRE-PROG ,4/6 BUCK,
Packaging: Bulk
Produkt ist nicht verfügbar
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MC34704AEPR2,528 MC34704AEPR2,528 NXP USA Inc. MC34704.pdf Description: IC PWR MGMNT DC-DC MULT 56-QFN
Packaging: Bulk
Produkt ist nicht verfügbar
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F104X8A699 NXP USA Inc. FSCL-S-A0000209099-1.pdf?t.download=true&u=5oefqw Description: QUAD PORT 10/100/1000BASE-T PHY
Packaging: Bulk
Produkt ist nicht verfügbar
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74AHCT1G126GV-Q100125 74AHCT1G126GV-Q100125 NXP USA Inc. 74AHC_AHCT1G126_Q100.pdf Description: BUS DRIVER, AHCT/VHCT/VT SERIES
Produkt ist nicht verfügbar
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LPC2478FBD208K LPC2478FBD208K NXP USA Inc. LPC2478.pdf Description: IC MCU 16/32B 512KB FLSH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 160
DigiKey Programmable: Not Verified
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PCA9541ABS/03,118 PCA9541A.pdf
PCA9541ABS/03,118
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 16HVQFN
Package / Case: 16-VQFN Exposed Pad
Packaging: Cut Tape (CT)
Supplier Device Package: 16-HVQFN (4x4)
Applications: 2-Channel I2C Multiplexer
Voltage - Supply: 2.3V ~ 5.5V
Interface: I2C, SMBus
Mounting Type: Surface Mount
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4+5.76 EUR
10+4.32 EUR
25+3.95 EUR
100+3.56 EUR
250+3.37 EUR
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TEA1610P/N6,112 TEA1610T_P.pdf
TEA1610P/N6,112
Hersteller: NXP USA Inc.
Description: IC RESONANT CONVERTR CTRLR 16DIP
Package / Case: 16-DIP (0.300", 7.62mm)
Packaging: Tube
DigiKey Programmable: Not Verified
Current - Supply: 2.4 mA
Part Status: Obsolete
Supplier Device Package: 16-DIP
Applications: Resonant Converter Controller
Voltage - Supply: 0V ~ 15V
Operating Temperature: -25°C ~ 70°C
Mounting Type: Through Hole
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268+2.14 EUR
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TDA10025HN/C1 PHGLS23142-1.pdf?hkey=86B6989B4B77B8125D7B68A214AD8E2D
Hersteller: NXP USA Inc.
Description: TELECOM CIRCUIT, 1-FUNC, PQCC48
Control Interface: I²C
Supplier Device Package: 48-HVQFN (7x7)
Applications: Consumer Video
Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V
Function: Processor
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Bulk
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291+3.61 EUR
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HTMS8301FTB/AF,115 H184430_HITAGu_ISO_18000_2.pdf
HTMS8301FTB/AF,115
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Part Status: Obsolete
Writable Memory: 1.76kb (User)
Standards: ISO 11784, ISO 11785
Technology: Passive
Memory Type: Read/Write
Frequency: 100kHz ~ 150kHz
Style: Encapsulated
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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HTMS8301FTK/AF,115 H184430_HITAGu_ISO_18000_2.pdf
HTMS8301FTK/AF,115
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Part Status: Obsolete
Writable Memory: 1.76kb (User)
Standards: ISO 11784, ISO 11785
Technology: Passive
Memory Type: Read/Write
Frequency: 100kHz ~ 150kHz
Style: Encapsulated
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MRF300AN-40MHZ MRF300AN.pdf
MRF300AN-40MHZ
Hersteller: NXP USA Inc.
Description: REF BOARD MRF300AN 40MHZ
Packaging: Bulk
For Use With/Related Products: MRF300AN
Frequency: 40.68MHz
Type: Transistor
Contents: Board(s)
Utilized IC / Part: MRF300AN
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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LPC4357JBD208K LPC435X_3X_2X_1X.pdf
LPC4357JBD208K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 142
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
auf Bestellung 785 Stücke:
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1+29.02 EUR
10+22.37 EUR
25+22.35 EUR
180+22.05 EUR
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LPC2420FBD208,551 LPC2420_60.pdf
LPC2420FBD208,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 82K x 8
Speed: 72MHz
DigiKey Programmable: Not Verified
Number of I/O: 160
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24+24.54 EUR
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74HC280D/S400118 PHGLS06115-1.pdf?t.download=true&u=5oefqw
74HC280D/S400118
Hersteller: NXP USA Inc.
Description: PARITY GENERATOR/CHECKER, 9-BIT
Current - Output High, Low: 5.2mA, 5.2mA
Operating Temperature: -40°C ~ 125°C
Logic Type: Parity Generator/Checker
Mounting Type: Surface Mount
Number of Circuits: 9
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Voltage - Supply: 2 V ~ 6 V
Supplier Device Package: 14-SO
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74AVCH20T245DGV118 sn74avch20t245.pdf?t.download=true&u=5oefqw
74AVCH20T245DGV118
Hersteller: NXP USA Inc.
Description: BUS TRANSCEIVER, AVC SERIES
Packaging: Bulk
Part Status: Active
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260+2.26 EUR
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74AVCH20T245DGV:11 74AVCH20T245_Rev_Feb2017.pdf
74AVCH20T245DGV:11
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 56TSSOP
Supplier Device Package: 56-TSSOP
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 10
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Translation Transceiver
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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74AVCH20T245BX,518
74AVCH20T245BX,518
Hersteller: NXP USA Inc.
Description: IC TRNSLTR BIDIRECTIONAL 60HXQFN
Produkt ist nicht verfügbar
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PTN36043ABXY PTN36043A.pdf
PTN36043ABXY
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 2 18X2QFN
Packaging: Tape & Reel (TR)
Package / Case: 18-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 18-X2QFN (2.4x2)
Voltage - Supply, Single (V+): 1.7V ~ 1.9V
Crosstalk: -50dB @ 2.5GHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Current - Leakage (IS(off)) (Max): 6µA
Part Status: Active
Number of Circuits: 2
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10000+3.08 EUR
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74HCT85DB,112-NXP PHGLS05972-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: MAGNITUDE COMPARATOR, HCT SERIES
Number of Bits: 4
Part Status: Active
Output Function: AB
Max Propagation Delay @ V, Max CL: 44ns @ 4.5V, 50pF
Supplier Device Package: 16-SSOP
Current - Output High, Low: 4mA, 4mA
Current - Quiescent (Iq): 8 µA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Type: Magnitude Comparator
Output: Active High
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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ACTT8B-800CTN118 PHGL-S-A0000770165-1.pdf?t.download=true&u=5oefqw
ACTT8B-800CTN118
Hersteller: NXP USA Inc.
Description: AC THYRISTOR TRIAC - D2PAK
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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ACTT8B-800C0118 PHGLS29464-1.pdf?t.download=true&u=5oefqw
ACTT8B-800C0118
Hersteller: NXP USA Inc.
Description: AC THYRISTOR TRIAC - D2PAK
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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74LV373PW,112 74LV373.pdf
74LV373PW,112
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20TSSOP
Supplier Device Package: 20-TSSOP
Delay Time - Propagation: 20ns
Current - Output High, Low: 16mA, 16mA
Independent Circuits: 1
Voltage - Supply: 1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: D-Type Transparent Latch
Circuit: 8:8
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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1665+0.36 EUR
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S9S08RNA32W1MLF MC9S08AC60.pdf
S9S08RNA32W1MLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC32ABQ-Q100115 74LVC32A_Q100.pdf
Hersteller: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14DHVQFN
Current - Quiescent (Max): 40 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 3.8ns @ 3.3V, 50pF
Input Logic Level - Low: 0.7V ~ 0.8V
Input Logic Level - High: 1.7V ~ 2V
Supplier Device Package: 14-DHVQFN (2.5x3)
Number of Inputs: 2
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: OR Gate
Mounting Type: Surface Mount
Package / Case: 14-VFQFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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FRDM-K66F K66P144M180SF5V2.pdf
FRDM-K66F
Hersteller: NXP USA Inc.
Description: FREEDOM K26/K66 EVAL BRD
Part Status: Active
Platform: Freedom
Utilized IC / Part: K26, K66
Core Processor: ARM® Cortex®-M4
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
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PMEG6010AESB315 PMEG6010AESB.pdf
PMEG6010AESB315
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 60V 1A DSN10062
Part Status: Active
Current - Reverse Leakage @ Vr: 650 µA @ 60 V
Voltage - Forward (Vf) (Max) @ If: 625 mV @ 1 A
Voltage - DC Reverse (Vr) (Max): 60 V
Operating Temperature - Junction: 150°C
Supplier Device Package: DSN1006-2
Current - Average Rectified (Io): 1A
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Technology: Schottky
Reverse Recovery Time (trr): 2.4 ns
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: 2-XDFN
Packaging: Bulk
Produkt ist nicht verfügbar
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PMEG6010ESB315 PMEG6010ESB.pdf
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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MRFX1K80HR5 MRFX1K80H.pdf
MRFX1K80HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 65V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 470MHz
Configuration: Dual
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 182 V
Voltage - Test: 65 V
Current - Test: 200 mA
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SPC5646CF0MMJ1R
SPC5646CF0MMJ1R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
Produkt ist nicht verfügbar
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SPC5646CF0MMJ1
SPC5646CF0MMJ1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 199
Supplier Device Package: 256-MAPBGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 33x10b, 10x12b
Core Processor: e200z4d, e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 80MHz/120MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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PCA9509DP,118 PCA9509.pdf
PCA9509DP,118
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Active
Capacitance - Input: 2 pF
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6+3.67 EUR
10+2.7 EUR
25+2.46 EUR
100+2.2 EUR
250+2.07 EUR
500+2 EUR
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IP4253CZ12-6-TTL1 IP4251_52_53_54-TTL.pdf
Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
Packaging: Bulk
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IP4251CZ12-6-TTL
Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
Packaging: Bulk
Produkt ist nicht verfügbar
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MC56F83789VLL MC56F83XXXFS.pdf
MC56F83789VLL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 82
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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74AHC139PW-Q100118 74AHC_AHCT139_Q100.pdf
74AHC139PW-Q100118
Hersteller: NXP USA Inc.
Description: DECODER/DRIVER
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BSH205G2235 BSH205G2.pdf
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BSH205G2215 BSH205G2.pdf
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
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PMT200EN,115
PMT200EN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 1.8A SOT223
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
Rds On (Max) @ Id, Vgs: 235mOhm @ 1.5A, 10V
Power Dissipation (Max): 800mW (Ta), 8.3W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 475 pF @ 80 V
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3806+0.17 EUR
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PMT200EPEA115 PMT200EPE.pdf
PMT200EPEA115
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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OM13574UL
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PCA9412A
Packaging: Bulk
Board Type: Fully Populated
Utilized IC / Part: PCA9412A
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
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MKE15Z128VLH7 KE1xZP100M72SF0.pdf
MKE15Z128VLH7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Number of I/O: 58
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 27x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 32K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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3+7.54 EUR
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74ALVC245D,112 PHGLS15272-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 20SO
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Part Status: Active
Supplier Device Package: 20-SO
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Produkt ist nicht verfügbar
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NX20P0407UKZ NX20P0407.pdf
NX20P0407UKZ
Hersteller: NXP USA Inc.
Description: USB TYPE-C CC1/2 SBU1/2 PROT IC
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Technology: Internal Switch
Voltage - Clamping: 28V
Supplier Device Package: 12-WLCSP (1.67x1.27)
Part Status: Active
Number of Circuits: 4
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7+3.08 EUR
10+2.25 EUR
25+2.03 EUR
100+1.81 EUR
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1000+1.63 EUR
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PCA9633D16,112 PCA9633.pdf
PCA9633D16,112
Hersteller: NXP USA Inc.
Description: IC LED DRIVER PS PWM 25MA 16SO
Part Status: Obsolete
Number of Outputs: 4
Mounting Type: Surface Mount
Voltage - Output: 5.5V
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.3V
Dimming: PWM
Supplier Device Package: 16-SO
Internal Switch(s): Yes
Current - Output / Channel: 25mA
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Type: Power Switch
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525+1.19 EUR
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PCA9633TK,118 PCA9633.pdf
PCA9633TK,118
Hersteller: NXP USA Inc.
Description: IC LED DRIVER PS PWM 25MA 8HVSON
Part Status: Active
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.3V
Dimming: I2C
Supplier Device Package: 8-HVSON (3x3)
Internal Switch(s): Yes
Current - Output / Channel: 25mA
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Type: Power Switch
Number of Outputs: 4
Mounting Type: Surface Mount
Voltage - Output: 5.5V
Package / Case: 8-VFDFN Exposed Pad
Packaging: Cut Tape (CT)
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8+2.81 EUR
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25+1.86 EUR
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500+1.5 EUR
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2500+1.39 EUR
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PCA9633PW112 PHGLS15651-1.pdf?t.download=true&u=5oefqw
PCA9633PW112
Hersteller: NXP USA Inc.
Description: LED DRIVER 4-SEGMENT
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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PBLS1503V,115-NXP PHGLS19114-1.pdf?t.download=true&u=5oefqw
PBLS1503V,115-NXP
Hersteller: NXP USA Inc.
Description: 0.1A 50V 2-ELEMENT NPN AND PNP
Part Status: Active
Supplier Device Package: SOT-666
Resistor - Emitter Base (R2): 10kOhms
Resistor - Base (R1): 10kOhms
Frequency - Transition: 280MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V / 200 @ 10mA, 2V
Current - Collector Cutoff (Max): 1µA, 100nA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 250mV @ 50mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 15V
Current - Collector (Ic) (Max): 100mA, 500mA
Power - Max: 300mW
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Mounting Type: Surface Mount
Package / Case: SOT-563, SOT-666
Packaging: Bulk
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3806+0.15 EUR
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74AUP1G86GW-Q100125 74AUP1G86_Q100.pdf
74AUP1G86GW-Q100125
Hersteller: NXP USA Inc.
Description: IC GATE XOR 1CH 2-INP 5TSSOP
Qualification: AEC-Q100
Current - Quiescent (Max): 500 nA
Number of Circuits: 1
Grade: Automotive
Max Propagation Delay @ V, Max CL: 7.1ns @ 3.3V, 30pF
Supplier Device Package: 5-TSSOP
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: XOR (Exclusive OR)
Mounting Type: Surface Mount
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Packaging: Bulk
Produkt ist nicht verfügbar
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74AUP1G86GF,132 PHGLS24884-1.pdf?t.download=true&u=5oefqw
74AUP1G86GF,132
Hersteller: NXP USA Inc.
Description: IC GATE XOR 1CH 2-INP 6XSON
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1765+0.32 EUR
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74LVCH244APW/AUJ118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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PSMN1R9-40PL127 PSMN1R9-40PL.pdf
PSMN1R9-40PL127
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 150A (Ta)
Rds On (Max) @ Id, Vgs: 1.7mOhm @ 25A, 10V
Power Dissipation (Max): 349W (Ta)
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 230 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 13200 pF @ 25 V
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BUK7230-55A BUK7230-55A.pdf
BUK7230-55A
Hersteller: NXP USA Inc.
Description: MOSFET 38AA
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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S08PT60-EVK S08PT60EVKQSG.pdf
S08PT60-EVK
Hersteller: NXP USA Inc.
Description: EVALUATION BOARD S08PT60
Part Status: Active
Utilized IC / Part: MC9S08PT16
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
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MC9S08PL8CLC MC9S08PL4.pdf
MC9S08PL8CLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 30
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S08PL32CLC MC9S08PL60.pdf
MC9S08PL32CLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
DigiKey Programmable: Not Verified
Number of I/O: 30
Produkt ist nicht verfügbar
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MC9S08PL60CLC MC9S08AC60.pdf
MC9S08PL60CLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Number of I/O: 30
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM
DigiKey Programmable: Not Verified
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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MC9S08PA32AVLDR MC9S08PL60.pdf
MC9S08PA32AVLDR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC9S08PL16CLD MC9S08PL16.pdf
MC9S08PL16CLD
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM
Connectivity: LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S08QG84CDTE MC9S08AC60.pdf
MC9S08QG84CDTE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Verified
Number of I/O: 12
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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S9S08RNA32W1VLF
Hersteller: NXP USA Inc.
Description: 8 BIT HCS08L 32K FLASH
Produkt ist nicht verfügbar
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MMPF0100F1AEPR2,528
Hersteller: NXP USA Inc.
Description: PMIC I.MX6, PRE-PROG ,4/6 BUCK,
Packaging: Bulk
Produkt ist nicht verfügbar
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MC34704AEPR2,528 MC34704.pdf
MC34704AEPR2,528
Hersteller: NXP USA Inc.
Description: IC PWR MGMNT DC-DC MULT 56-QFN
Packaging: Bulk
Produkt ist nicht verfügbar
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F104X8A699 FSCL-S-A0000209099-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: QUAD PORT 10/100/1000BASE-T PHY
Packaging: Bulk
Produkt ist nicht verfügbar
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74AHCT1G126GV-Q100125 74AHC_AHCT1G126_Q100.pdf
74AHCT1G126GV-Q100125
Hersteller: NXP USA Inc.
Description: BUS DRIVER, AHCT/VHCT/VT SERIES
Produkt ist nicht verfügbar
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LPC2478FBD208K LPC2478.pdf
LPC2478FBD208K
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 160
DigiKey Programmable: Not Verified
auf Bestellung 718 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+61.15 EUR
10+49.56 EUR
25+46.67 EUR
180+42.47 EUR
360+41.46 EUR
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