Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36265) > Seite 600 nach 605
| Foto | Bezeichnung | Hersteller | Beschreibung |
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PMCM650VNEZ | NXP USA Inc. |
 Description: MOSFET N-CH 12V 6.4A 6WLCSPPackaging: Bulk Package / Case: 6-XFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 6.4A (Ta) Rds On (Max) @ Id, Vgs: 25mOhm @ 3A, 4.5V Power Dissipation (Max): 556mW (Ta), 12.5W (Tc) Vgs(th) (Max) @ Id: 900mV @ 250µA Supplier Device Package: 6-WLCSP (1.48x0.98) Drive Voltage (Max Rds On, Min Rds On): 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 12 V Gate Charge (Qg) (Max) @ Vgs: 15.4 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 1060 pF @ 6 V |
auf Bestellung 461124 Stücke: Lieferzeit 10-14 Tag (e) |
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| BYV44-500,127 | NXP USA Inc. |
Description: DIODE RECT 500V 30A TO220AB Packaging: Tube |
Produkt ist nicht verfügbar |
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| MIMX8QX5CVLDZAC | NXP USA Inc. |
Description: I.MX 8QUADXPLUS 21X21 Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21x21) |
Produkt ist nicht verfügbar |
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MIMX8QX5CVLFZAC | NXP USA Inc. |
Description: MIMX8QX5CVLFZAC Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21x21) |
Produkt ist nicht verfügbar |
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| BT137-800,127 | NXP USA Inc. |
Description: TRIAC 800V 8A TO220AB Packaging: Tube |
Produkt ist nicht verfügbar |
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74AHC14D,118 | NXP USA Inc. |
Description: IC HEX INV SCHMITT TRIG 14-SOIC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74HC112N,652 | NXP USA Inc. |
Description: IC FF JK TYPE DOUBLE 1BIT 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Output Type: Complementary Mounting Type: Through Hole Number of Elements: 2 Function: Set(Preset) and Reset Type: JK Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 4 µA Current - Output High, Low: 5.2mA, 5.2mA Trigger Type: Negative Edge Clock Frequency: 71 MHz Input Capacitance: 3.5 pF Supplier Device Package: 16-DIP Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF Number of Bits per Element: 1 |
Produkt ist nicht verfügbar |
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BAT54CW,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 30V 200MA SOT323 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| PBHV8550Z,115 | NXP USA Inc. |
Description: TRANS NPN 500V 0.4A SC-73 Packaging: Tape & Reel (TR) Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Transistor Type: NPN Supplier Device Package: SC-73 Current - Collector (Ic) (Max): 400 mA Voltage - Collector Emitter Breakdown (Max): 500 V Power - Max: 1.7 W |
Produkt ist nicht verfügbar |
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PDZ7.5B,115 | NXP USA Inc. |
Description: DIODE ZENER 7.5V 400MW SOD323 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PUMX1,115 | NXP USA Inc. |
Description: TRANS 2NPN 40V 0.1A 6TSSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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SFS2623HMDF5AD | NXP USA Inc. |
Description: AUTO SBC Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 36V Applications: System Basis Chip Current - Supply: 30µA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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74LVCH32374AEC,557 | NXP USA Inc. |
Description: IC FF D-TYPE QDR 8BIT 96LFBGA Packaging: Tray Package / Case: 96-LFBGA Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 4 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 3.6V Current - Quiescent (Iq): 40 µA Current - Output High, Low: 24mA, 24mA Trigger Type: Positive Edge Clock Frequency: 300 MHz Input Capacitance: 5 pF Supplier Device Package: 96-LFBGA (13.5x5.5) Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
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74LVCH32374AEC,551 | NXP USA Inc. |
Description: IC FF D-TYPE QDR 8BIT 96LFBGA Packaging: Tray Package / Case: 96-LFBGA Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 4 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 3.6V Current - Quiescent (Iq): 40 µA Current - Output High, Low: 24mA, 24mA Trigger Type: Positive Edge Clock Frequency: 300 MHz Input Capacitance: 5 pF Supplier Device Package: 96-LFBGA (13.5x5.5) Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
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P1014NSN5HFA | NXP USA Inc. |
Description: IC MPU QORIQ P1 800MHZ 425TEPBGA Packaging: Tray Package / Case: 425-FBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 425-TEPBGA I (19x19) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, SPI |
Produkt ist nicht verfügbar |
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| SPF5020CVNAQESR2 | NXP USA Inc. |
Description: PMIC 3 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| SPF5020CVNAQES | NXP USA Inc. |
Description: PMIC 3 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
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| SPF5020CMBAKESR2 | NXP USA Inc. |
Description: PMIC -4 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| SPF5020CMBAZESR2 | NXP USA Inc. |
Description: PMIC -3 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| SPF5020AMBADESR2 | NXP USA Inc. |
Description: PMIC -3 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| SPF5020CMBAKES | NXP USA Inc. |
Description: PMIC - 4 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SPF5020AMBADES | NXP USA Inc. |
Description: PMIC - 3 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SPF5020CMBAZES | NXP USA Inc. |
Description: PMIC - 3 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SPF5020AMBACES | NXP USA Inc. |
Description: PMIC - 3 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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SPF5024AMMAMESR2 | NXP USA Inc. |
Description: PMIC -4 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Applications: Automotive Systems Supplier Device Package: 40-HVQFN (6x6) |
Produkt ist nicht verfügbar |
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| SPF5024AMMAWESR2 | NXP USA Inc. |
Description: PMIC -4 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SPF5024AMMAWES | NXP USA Inc. |
Description: PMIC - 4 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SPF5024AMMAMES | NXP USA Inc. |
Description: PMIC - 4 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SPF5024CMBAYESR2 | NXP USA Inc. |
Description: PMIC -4 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SPF5024CMBAYES | NXP USA Inc. |
Description: PMIC - 4 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
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BZV55-C4V7,115 | NXP USA Inc. |
Description: DIODE ZENER 4.7V 500MW LLDS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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PCA9849PWJ | NXP USA Inc. |
Description: IC MULTIPLEXER 2 X 4:1 16-TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Circuit: 2 x 4:1 Type: Multiplexer Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V Independent Circuits: 1 Voltage Supply Source: Dual Supply Supplier Device Package: 16-TSSOP |
Produkt ist nicht verfügbar |
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PCA9554PW/DG,118 | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP Features: POR Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 16-TSSOP Current - Output Source/Sink: 10mA, 25mA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCA9554PW/DG,118 | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP Features: POR Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 16-TSSOP Current - Output Source/Sink: 10mA, 25mA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCXE245VLH | NXP USA Inc. |
Description: 112MHZ, CORTEX-M4 Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 112MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 64-LQFP (10x10) |
auf Bestellung 160 Stücke: Lieferzeit 10-14 Tag (e) |
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| BLF861A,112 | NXP USA Inc. |
Description: TRANSISTOR RF LDMOS SOT540A Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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BZV85-C15,113 | NXP USA Inc. |
Description: DIODE ZENER 15V 1.3W DO41 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| BZV85-C15,133 | NXP USA Inc. |
Description: DIODE VREG 15V 1.3W DO-41 Packaging: Tape & Box (TB) |
Produkt ist nicht verfügbar |
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| BZX585-C15,115 | NXP USA Inc. |
Description: DIODE ZENER 15V 300MW SOD523 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BC849C,215 | NXP USA Inc. |
Description: TRANSISTOR NPN 30V 100MA SOT23 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74LVCH244APW,112 | NXP USA Inc. |
Description: IC BUFF/DVR TRI-ST DUAL 20TSSOP Packaging: Tube |
Produkt ist nicht verfügbar |
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74LVCH244AD,112 | NXP USA Inc. |
Description: IC BUFF/DVR TRI-ST DUAL 20SOIC Packaging: Tube |
Produkt ist nicht verfügbar |
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MSC8254TAG1000B | NXP USA Inc. |
Description: IC DSP 4X 1GHZ SC3850 783FCBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Type: SC3850 Quad Core Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (96KB) On-Chip RAM: 576kB Voltage - I/O: 2.50V Voltage - Core: 1.00V Clock Rate: 1GHz Supplier Device Package: 783-FCPBGA (29x29) |
Produkt ist nicht verfügbar |
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| MCXA343VFM | NXP USA Inc. |
Description: MCXA20-256, 32QFN Packaging: Tray |
auf Bestellung 2450 Stücke: Lieferzeit 10-14 Tag (e) |
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MCXA343VLF | NXP USA Inc. |
Description: MCX A MICROCONTROLLER Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33F Data Converters: A/D 21x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, I2C, SPI, UART/USART Peripherals: DMA, LVD/HVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 41 |
auf Bestellung 1250 Stücke: Lieferzeit 10-14 Tag (e) |
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MCXA343VLH | NXP USA Inc. |
Description: MCX A MICROCONTROLLER Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33F Data Converters: A/D 31x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, I2C, SPI, UART/USART Peripherals: DMA, LVD/HVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 55 |
auf Bestellung 800 Stücke: Lieferzeit 10-14 Tag (e) |
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MCXA343VLL | NXP USA Inc. |
Description: MCX A MICROCONTROLLER Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33F Data Converters: A/D 39x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, I2C, SPI, UART/USART Peripherals: DMA, LVD/HVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 86 |
auf Bestellung 450 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC540N,652 | NXP USA Inc. |
Description: IC BUFFER INVERTING 6V 20-DIP Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Output Type: 3-State Mounting Type: Through Hole Number of Elements: 1 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 8 Current - Output High, Low: 7.8mA, 7.8mA Supplier Device Package: 20-DIP |
Produkt ist nicht verfügbar |
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LPC54S018JET180Y | NXP USA Inc. |
Description: IC MCU 32BIT 180TFBGA Packaging: Tape & Reel (TR) Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz RAM Size: 360K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Number of I/O: 145 |
Produkt ist nicht verfügbar |
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UJA1075ATW/5/2Z | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HTSSOP Packaging: Tape & Reel (TR) Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 28V Applications: System Basis Chip Current - Supply: 83µA Supplier Device Package: 32-HTSSOP Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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UJA1075ATW/5W/2Z | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HTSSOP Packaging: Tape & Reel (TR) Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 28V Applications: System Basis Chip Current - Supply: 83µA Supplier Device Package: 32-HTSSOP Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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UJA1075ATW/3/2Z | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HTSSOP Packaging: Tape & Reel (TR) Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 28V Applications: System Basis Chip Current - Supply: 83µA Supplier Device Package: 32-HTSSOP Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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UJA1075ATW/3W/2Z | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HTSSOP Packaging: Tape & Reel (TR) Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 28V Applications: System Basis Chip Current - Supply: 83µA Supplier Device Package: 32-HTSSOP Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| BT148W-600R,115 | NXP USA Inc. |
Description: THYRISTOR 1A 600V SOT-223 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| BT148-600R,127 | NXP USA Inc. |
Description: THYRISTOR 600V 4A SOT82 Packaging: Tube |
Produkt ist nicht verfügbar |
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MPC17550eVEL | NXP USA Inc. |
Description: IC MTR DRV BIPLR 2.5-5.5V 36VMFP Packaging: Tape & Reel (TR) Package / Case: 36-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 700mA Interface: Parallel Operating Temperature: -10°C ~ 150°C (TJ) Output Configuration: Half Bridge (8) Voltage - Supply: 2.5V ~ 5.5V Applications: Battery Powered Technology: Power MOSFET Voltage - Load: 1.6V ~ 5.5V Supplier Device Package: 36-VMFP Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC |
Produkt ist nicht verfügbar |
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MCIMX6S8DVM10AC | NXP USA Inc. |
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA Packaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 300 Stücke: Lieferzeit 10-14 Tag (e) |
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| FB32K118LAT0MLHR | NXP USA Inc. |
Description: S32K118, 64 LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MIMX9556AVZXNAC | NXP USA Inc. |
Description: I.MX95 HMI SEGMENT IC Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
 |
74LVT08PW,118 | NXP USA Inc. |
Description: IC QUAD 2-IN AND GATE 14TSSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| PMCM650VNEZ |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 12V 6.4A 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.4A (Ta)
Rds On (Max) @ Id, Vgs: 25mOhm @ 3A, 4.5V
Power Dissipation (Max): 556mW (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 900mV @ 250µA
Supplier Device Package: 6-WLCSP (1.48x0.98)
Drive Voltage (Max Rds On, Min Rds On): 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 15.4 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1060 pF @ 6 V
Description: MOSFET N-CH 12V 6.4A 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.4A (Ta)
Rds On (Max) @ Id, Vgs: 25mOhm @ 3A, 4.5V
Power Dissipation (Max): 556mW (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 900mV @ 250µA
Supplier Device Package: 6-WLCSP (1.48x0.98)
Drive Voltage (Max Rds On, Min Rds On): 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 15.4 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1060 pF @ 6 V
auf Bestellung 461124 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 124+ | 3.67 EUR |
| MIMX8QX5CVLDZAC |
Hersteller: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX8QX5CVLFZAC |
|
Hersteller: NXP USA Inc.
Description: MIMX8QX5CVLFZAC
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
Description: MIMX8QX5CVLFZAC
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC112N,652 |
|
Hersteller: NXP USA Inc.
Description: IC FF JK TYPE DOUBLE 1BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 71 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 1
Description: IC FF JK TYPE DOUBLE 1BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 71 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PBHV8550Z,115 |
Hersteller: NXP USA Inc.
Description: TRANS NPN 500V 0.4A SC-73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN
Supplier Device Package: SC-73
Current - Collector (Ic) (Max): 400 mA
Voltage - Collector Emitter Breakdown (Max): 500 V
Power - Max: 1.7 W
Description: TRANS NPN 500V 0.4A SC-73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN
Supplier Device Package: SC-73
Current - Collector (Ic) (Max): 400 mA
Voltage - Collector Emitter Breakdown (Max): 500 V
Power - Max: 1.7 W
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SFS2623HMDF5AD |
|
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVCH32374AEC,557 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE QDR 8BIT 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 4
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 96-LFBGA (13.5x5.5)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Number of Bits per Element: 8
Description: IC FF D-TYPE QDR 8BIT 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 4
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 96-LFBGA (13.5x5.5)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Number of Bits per Element: 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVCH32374AEC,551 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE QDR 8BIT 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 4
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 96-LFBGA (13.5x5.5)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Number of Bits per Element: 8
Description: IC FF D-TYPE QDR 8BIT 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 4
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 96-LFBGA (13.5x5.5)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Number of Bits per Element: 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P1014NSN5HFA |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPF5024AMMAMESR2 |
|
Hersteller: NXP USA Inc.
Description: PMIC -4 HIGH PERFORMANCE BUCKS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: Automotive Systems
Supplier Device Package: 40-HVQFN (6x6)
Description: PMIC -4 HIGH PERFORMANCE BUCKS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: Automotive Systems
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9849PWJ |
|
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Dual Supply
Supplier Device Package: 16-TSSOP
Description: IC MULTIPLEXER 2 X 4:1 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Dual Supply
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9554PW/DG,118 |
|
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9554PW/DG,118 |
|
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCXE245VLH |
|
Hersteller: NXP USA Inc.
Description: 112MHZ, CORTEX-M4
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Description: 112MHZ, CORTEX-M4
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 11.56 EUR |
| 10+ | 8.93 EUR |
| 25+ | 8.27 EUR |
| 160+ | 7.36 EUR |
| MSC8254TAG1000B |
|
Hersteller: NXP USA Inc.
Description: IC DSP 4X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Quad Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Description: IC DSP 4X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Quad Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCXA343VFM |
|
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 4.98 EUR |
| 10+ | 3.73 EUR |
| 25+ | 3.42 EUR |
| 100+ | 3.08 EUR |
| 490+ | 2.82 EUR |
| 980+ | 2.74 EUR |
| 1470+ | 2.69 EUR |
| MCXA343VLF |
|
Hersteller: NXP USA Inc.
Description: MCX A MICROCONTROLLER
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 21x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 41
Description: MCX A MICROCONTROLLER
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 21x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 41
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 5.49 EUR |
| 10+ | 4.12 EUR |
| 25+ | 3.78 EUR |
| 100+ | 3.41 EUR |
| 250+ | 3.23 EUR |
| 500+ | 3.12 EUR |
| 1250+ | 3.01 EUR |
| MCXA343VLH |
|
Hersteller: NXP USA Inc.
Description: MCX A MICROCONTROLLER
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 31x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 55
Description: MCX A MICROCONTROLLER
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 31x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 55
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 5.79 EUR |
| 10+ | 4.35 EUR |
| 25+ | 4 EUR |
| 100+ | 3.61 EUR |
| 250+ | 3.42 EUR |
| 800+ | 3.24 EUR |
| MCXA343VLL |
|
Hersteller: NXP USA Inc.
Description: MCX A MICROCONTROLLER
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 39x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 86
Description: MCX A MICROCONTROLLER
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 39x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 86
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 6.37 EUR |
| 10+ | 4.82 EUR |
| 25+ | 4.43 EUR |
| 100+ | 4 EUR |
| 450+ | 3.69 EUR |
| 74HC540N,652 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERTING 6V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-DIP
Description: IC BUFFER INVERTING 6V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-DIP
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| LPC54S018JET180Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 180TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
Description: IC MCU 32BIT 180TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
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| UJA1075ATW/5/2Z |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 83µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 83µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
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| UJA1075ATW/5W/2Z |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 83µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 83µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
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| UJA1075ATW/3/2Z |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 83µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 83µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
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| UJA1075ATW/3W/2Z |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 83µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 83µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
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| MPC17550eVEL |
|
Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.5-5.5V 36VMFP
Packaging: Tape & Reel (TR)
Package / Case: 36-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -10°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Battery Powered
Technology: Power MOSFET
Voltage - Load: 1.6V ~ 5.5V
Supplier Device Package: 36-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Description: IC MTR DRV BIPLR 2.5-5.5V 36VMFP
Packaging: Tape & Reel (TR)
Package / Case: 36-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -10°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Battery Powered
Technology: Power MOSFET
Voltage - Load: 1.6V ~ 5.5V
Supplier Device Package: 36-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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| MCIMX6S8DVM10AC |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 75.24 EUR |
| 10+ | 61.67 EUR |
| 60+ | 55.76 EUR |
| 120+ | 54.16 EUR |