Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36403) > Seite 604 nach 607
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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74ALVC16245DGG,112 | NXP USA Inc. |
Description: IC TRANSCVR TRI-ST 16BIT 48TSSOPPackaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| BT151U-650C,127 | NXP USA Inc. |
Description: THYRISTOR 650V 12A SOT533Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3750 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| BT151S-650R,118 | NXP USA Inc. |
Description: THYRISTOR 650V 12A DPAKPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| BT151S-800R,118 | NXP USA Inc. |
Description: THYRISTOR 800V 12A DPAK Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| BC846A,215 | NXP USA Inc. |
Description: TRANSISTOR NPN 100MA 65V SOT23Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| BF622,115 | NXP USA Inc. |
Description: TRANS NPN 250V 50MA SOT89Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MF3EH43A1DUF/01EVZ | NXP USA Inc. |
Description: MF3EH43A1DUF/01EVPackaging: Bulk Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -25°C ~ 85°C (TA) Standards: ISO 14443A, ISO 7816-4, Mifare, NFC Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 34187 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MC7447AVS1000LB | NXP USA Inc. |
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGAPackaging: Tray Package / Case: 360-CLGA, FCCLGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.8V, 2.5V Supplier Device Package: 360-FCCLGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 44 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MC7447AVS1000NB | NXP USA Inc. |
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGAPackaging: Tray Package / Case: 360-CLGA, FCCLGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.8V, 2.5V Supplier Device Package: 360-FCCLGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 44 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MCXW727AMFTBT | NXP USA Inc. |
Description: MCXW72 HVQFN48Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Memory Size: 2MB Flash, 256kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Protocol: Ultra Wideband (UWB) Supplier Device Package: 48-HVQFN (7x7) RF Family/Standard: Bluetooth |
auf Bestellung 1300 Stücke: Lieferzeit 10-14 Tag (e) |
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MCXW727CMFTBT | NXP USA Inc. |
Description: MCXW72 HVQFN48Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Memory Size: 2MB Flash, 256kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Protocol: Ultra Wideband (UWB) Supplier Device Package: 48-HVQFN (7x7) RF Family/Standard: Bluetooth |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| KW47Z42082AFTBT | NXP USA Inc. |
Description: KW47 AUTO QFN48Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| KW47Z42092AFTBT | NXP USA Inc. |
Description: KW47 AUTO QFN48Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| KW47Z420B3AFTBT | NXP USA Inc. |
Description: KW47 AUTO QFN48Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| KW47Z420B2AFTBT | NXP USA Inc. |
Description: KW47 AUTO QFN48Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| KW47B42ZB2AFTBT | NXP USA Inc. |
Description: KW47 AUTO QFN48Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MPF5103AMMA0ES | NXP USA Inc. |
Description: SUPERSET COVERING PF5103 QM DEVIPackaging: Tray Package / Case: 28-PowerWFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.95V ~ 5.5V Applications: Processor Current - Supply: 1.5µA Supplier Device Package: 28-HWQFN (4.5x4.5) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MPF5103AMBA0ES | NXP USA Inc. |
Description: SUPERSET COVERING PF5103 ASIL BPackaging: Tray Package / Case: 28-PowerWFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.95V ~ 5.5V Applications: Processor Current - Supply: 1.5µA Supplier Device Package: 28-HWQFN (4.5x4.5) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MPF5113AMMA0ES | NXP USA Inc. |
Description: SUPERSET COVERING PF5113 QM DEVIPackaging: Tray Package / Case: 28-PowerWFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.95V ~ 5.5V Applications: Processor Current - Supply: 1.5µA Supplier Device Package: 28-HWQFN (4.5x4.5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MPF5113AMMA0ESR2 | NXP USA Inc. |
Description: SUPERSET COVERING PF5113 QM DEVIPackaging: Tape & Reel (TR) Package / Case: 28-PowerWFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.95V ~ 5.5V Applications: Processor Current - Supply: 1.5µA Supplier Device Package: 28-HWQFN (4.5x4.5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MPF5113AMBA0ESR2 | NXP USA Inc. |
Description: SUPERSET COVERING PF5113 ASIL BPackaging: Tape & Reel (TR) Package / Case: 28-PowerWFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.95V ~ 5.5V Applications: Processor Current - Supply: 1.5µA Supplier Device Package: 28-HWQFN (4.5x4.5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MPF5113AMBA0ES | NXP USA Inc. |
Description: SUPERSET COVERING PF5113 ASIL BPackaging: Tray Package / Case: 28-PowerWFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.95V ~ 5.5V Applications: Processor Current - Supply: 1.5µA Supplier Device Package: 28-HWQFN (4.5x4.5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MPF5123AMMA0ESR2 | NXP USA Inc. |
Description: SUPERSET COVERING PF5123 QM DEVIPackaging: Tray Package / Case: 28-PowerWFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.95V ~ 5.5V Applications: Processor Current - Supply: 1.5µA Supplier Device Package: 28-HWQFN (4.5x4.5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MPF5123AMMA0ES | NXP USA Inc. |
Description: SUPERSET COVERING PF5123 QM DEVIPackaging: Tray Package / Case: 28-PowerWFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.95V ~ 5.5V Applications: Processor Current - Supply: 1.5µA Supplier Device Package: 28-HWQFN (4.5x4.5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MPF5123AMBA0ESR2 | NXP USA Inc. |
Description: SUPERSET COVERING PF5123 ASIL BPackaging: Tape & Reel (TR) Package / Case: 28-PowerWFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.95V ~ 5.5V Applications: Processor Current - Supply: 1.5µA Supplier Device Package: 28-HWQFN (4.5x4.5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MPF5123AMBA0ES | NXP USA Inc. |
Description: SUPERSET COVERING PF5123 ASIL BPackaging: Tray Package / Case: 28-PowerWFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.95V ~ 5.5V Applications: Processor Current - Supply: 1.5µA Supplier Device Package: 28-HWQFN (4.5x4.5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MPF5103AMMA0ESR2 | NXP USA Inc. |
Description: SUPERSET COVERING PF5103 QM DEVIPackaging: Bulk Package / Case: 28-PowerWFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.95V ~ 5.5V Applications: Processor Current - Supply: 1.5µA Supplier Device Package: 28-HWQFN (4.5x4.5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MPF5103AMBA0ESR2 | NXP USA Inc. |
Description: SUPERSET COVERING PF5103 ASIL BPackaging: Tray Package / Case: 28-PowerWFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.95V ~ 5.5V Applications: Processor Current - Supply: 1.5µA Supplier Device Package: 28-HWQFN (4.5x4.5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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74HC86N,652 | NXP USA Inc. |
Description: IC GATE XOR 4CH 2-INP 14DIPPackaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: XOR (Exclusive OR) Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 2 Supplier Device Package: 14-DIP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 20ns @ 6V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74HC08N,652 | NXP USA Inc. |
Description: IC GATE AND 4CH 2-INP 14DIPPackaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: AND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 2 Supplier Device Package: 14-DIP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| BF620,115 | NXP USA Inc. |
Description: TRANS NPN 300V 50MA SOT89Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| BF621,115 | NXP USA Inc. |
Description: TRANS PNP 300V 50MA SOT89Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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74HC151N,652 | NXP USA Inc. |
Description: IC MULTIPLEXER 1 X 8:1 16-DIPPackaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Circuit: 1 x 8:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-DIP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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BAS70-04W,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 70V 70MA SOT323Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74HC4024N,652 | NXP USA Inc. |
Description: IC BINARY COUNTER 7-BIT 14DIPPackaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Number of Elements: 1 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Negative Edge Supplier Device Package: 14-DIP Voltage - Supply: 2 V ~ 6 V Count Rate: 90 MHz Number of Bits per Element: 7 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| BC849B,235 | NXP USA Inc. |
Description: TRANSISTOR NPN 30V 100MA SOT23Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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74AHC157D,118 | NXP USA Inc. |
Description: IC QUAD 2-INPUT MUX 16SOICPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74HC112N,652 | NXP USA Inc. |
Description: IC FF JK TYPE DOUBLE 1BIT 16DIPPackaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Output Type: Complementary Mounting Type: Through Hole Number of Elements: 2 Function: Set(Preset) and Reset Type: JK Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 4 µA Current - Output High, Low: 5.2mA, 5.2mA Trigger Type: Negative Edge Clock Frequency: 71 MHz Input Capacitance: 3.5 pF Supplier Device Package: 16-DIP Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF Number of Bits per Element: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74HC597PW,112 | NXP USA Inc. |
Description: IC SR PUSH-PULL 8BIT 16-TSSOPPackaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-TSSOP Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74HC597PW,118 | NXP USA Inc. |
Description: IC SR PUSH-PULL 8BIT 16-TSSOPPackaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-TSSOP Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74HCT597D,653 | NXP USA Inc. |
Description: IC SHFT REG PUSH-PULL 8BIT 16-SOPackaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel or Serial to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 16-SO Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74HCT597DB,112 | NXP USA Inc. |
Description: IC SR PUSH-PULL 8BIT 16-SSOPPackaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel or Serial to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 16-SSOP Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74HCT597DB,118 | NXP USA Inc. |
Description: IC SR PUSH-PULL 8BIT 16-SSOPPackaging: Tape & Reel (TR) Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel or Serial to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 16-SSOP Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74HCT597D,652 | NXP USA Inc. |
Description: IC SHFT REG PUSH-PULL 8BIT 16-SOPackaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel or Serial to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 16-SO Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74HCT161D,653 | NXP USA Inc. |
Description: IC BINARY COUNTER 4-BIT 16SOPackaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Positive Edge Timing: Synchronous Supplier Device Package: 16-SO Voltage - Supply: 4.5 V ~ 5.5 V Count Rate: 41 MHz Number of Bits per Element: 4 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74LVC1G58GM,115 | NXP USA Inc. |
Description: IC CONFIG MULTI-FUNC GATE 6-XSONPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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74LVC1G58GF,132 | NXP USA Inc. |
Description: IC GATE OR SINGLE 2INPUT 6XSONPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| MCXN546VPBT | NXP USA Inc. |
Description: ICPackaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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S32G378ASAK1VUCR | NXP USA Inc. |
Description: MICROPROCESSORS - MPU 4X CORTEX-Packaging: Cut Tape (CT) Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S32G378AAAK1VUCT | NXP USA Inc. |
Description: 3XM7-400MHZ, 4XA53-1GHZ, 15M SRAPackaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S32G378AAAK1VUCR | NXP USA Inc. |
Description: 3XM7-400MHZ, 4XA53-1GHZ, 15M SRAPackaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S32G378AABK1VUCT | NXP USA Inc. |
Description: 4XA53 - 1.1GHZ, 3XM7 - 400MHZ, 1Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1.1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, eMMC/SD, FlexRay, I2C, LINbus, PCIe, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S32G378AABK1VUCR | NXP USA Inc. |
Description: 4XA53 - 1.1GHZ, 3XM7 - 400MHZ, 1Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1.1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, eMMC/SD, FlexRay, I2C, LINbus, PCIe, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S32G378AADK1VUCT | NXP USA Inc. |
Description: CORES: 4XA53 & 3XM7, 1.4GHZ FORPackaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz, 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S32G378AADK1VUCR | NXP USA Inc. |
Description: CORES: 4XA53 & 3XM7, 1.4GHZ FORPackaging: Tape & Reel (TR) Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz, 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| S32G378ASDK1VUCT | NXP USA Inc. |
Description: CORES: 4XA53 & 3XM7, 1.4GHZ FOR Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz, 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
|
S32G378ASDK1VUCR | NXP USA Inc. |
Description: CORES: 4XA53 & 3XM7, 1.4GHZ FORPackaging: Bulk Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz, 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
74HC4050DB,118 | NXP USA Inc. |
Description: IC BUFF 2V/6V 16-SSOPPackaging: Tape & Reel (TR) Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 6 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 1 Current - Output High, Low: 5.2mA, 5.2mA Supplier Device Package: 16-SSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
|
BZX79-C6V2,113 | NXP USA Inc. |
Description: DIODE ZENER 6.2V 400MW ALF2Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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BZX79-C6V2,133 | NXP USA Inc. |
Description: DIODE ZENER 6.2V 400MW ALF2Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| BT151U-650C,127 |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 3750 Stücke
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| BT151S-650R,118 |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BT151S-800R,118 |
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MF3EH43A1DUF/01EVZ |
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Hersteller: NXP USA Inc.
Description: MF3EH43A1DUF/01EV
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C (TA)
Standards: ISO 14443A, ISO 7816-4, Mifare, NFC
Supplier Device Package: Wafer
Description: MF3EH43A1DUF/01EV
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C (TA)
Standards: ISO 14443A, ISO 7816-4, Mifare, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
Mindestbestellmenge: 34187 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC7447AVS1000LB |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
Mindestbestellmenge: 44 Stücke
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| MC7447AVS1000NB |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
Mindestbestellmenge: 44 Stücke
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Stück im Wert von UAH
| MCXW727AMFTBT |
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Hersteller: NXP USA Inc.
Description: MCXW72 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 2MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Protocol: Ultra Wideband (UWB)
Supplier Device Package: 48-HVQFN (7x7)
RF Family/Standard: Bluetooth
Description: MCXW72 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 2MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Protocol: Ultra Wideband (UWB)
Supplier Device Package: 48-HVQFN (7x7)
RF Family/Standard: Bluetooth
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 11.7 EUR |
| 10+ | 9.04 EUR |
| 25+ | 8.38 EUR |
| 100+ | 7.64 EUR |
| 260+ | 7.28 EUR |
| 520+ | 7.07 EUR |
| 1040+ | 6.9 EUR |
| MCXW727CMFTBT |
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Hersteller: NXP USA Inc.
Description: MCXW72 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 2MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Protocol: Ultra Wideband (UWB)
Supplier Device Package: 48-HVQFN (7x7)
RF Family/Standard: Bluetooth
Description: MCXW72 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 2MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Protocol: Ultra Wideband (UWB)
Supplier Device Package: 48-HVQFN (7x7)
RF Family/Standard: Bluetooth
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| KW47Z42082AFTBT |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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| KW47Z42092AFTBT |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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Stück im Wert von UAH
| KW47Z420B3AFTBT |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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Stück im Wert von UAH
| KW47Z420B2AFTBT |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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Stück im Wert von UAH
| KW47B42ZB2AFTBT |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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Stück im Wert von UAH
| MPF5103AMMA0ES |
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Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5103 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Description: SUPERSET COVERING PF5103 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPF5103AMBA0ES |
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Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5103 ASIL B
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Description: SUPERSET COVERING PF5103 ASIL B
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPF5113AMMA0ES |
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Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5113 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Description: SUPERSET COVERING PF5113 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 490 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPF5113AMMA0ESR2 |
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Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5113 QM DEVI
Packaging: Tape & Reel (TR)
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Description: SUPERSET COVERING PF5113 QM DEVI
Packaging: Tape & Reel (TR)
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPF5113AMBA0ESR2 |
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Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5113 ASIL B
Packaging: Tape & Reel (TR)
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Description: SUPERSET COVERING PF5113 ASIL B
Packaging: Tape & Reel (TR)
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPF5113AMBA0ES |
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Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5113 ASIL B
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Description: SUPERSET COVERING PF5113 ASIL B
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 490 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPF5123AMMA0ESR2 |
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Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5123 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Description: SUPERSET COVERING PF5123 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPF5123AMMA0ES |
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Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5123 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Description: SUPERSET COVERING PF5123 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 490 Stücke
Im Einkaufswagen
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| MPF5123AMBA0ESR2 |
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Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5123 ASIL B
Packaging: Tape & Reel (TR)
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Description: SUPERSET COVERING PF5123 ASIL B
Packaging: Tape & Reel (TR)
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPF5123AMBA0ES |
![]() |
Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5123 ASIL B
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Description: SUPERSET COVERING PF5123 ASIL B
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 490 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPF5103AMMA0ESR2 |
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Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5103 QM DEVI
Packaging: Bulk
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Description: SUPERSET COVERING PF5103 QM DEVI
Packaging: Bulk
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPF5103AMBA0ESR2 |
![]() |
Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5103 ASIL B
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Description: SUPERSET COVERING PF5103 ASIL B
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
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| 74HC86N,652 |
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Hersteller: NXP USA Inc.
Description: IC GATE XOR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 20ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Description: IC GATE XOR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 20ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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| 74HC08N,652 |
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Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Description: IC GATE AND 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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| 74HC151N,652 |
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Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 1 X 8:1 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-DIP
Description: IC MULTIPLEXER 1 X 8:1 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-DIP
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| 74HC4024N,652 |
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Hersteller: NXP USA Inc.
Description: IC BINARY COUNTER 7-BIT 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-DIP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 90 MHz
Number of Bits per Element: 7
Description: IC BINARY COUNTER 7-BIT 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-DIP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 90 MHz
Number of Bits per Element: 7
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| 74HC112N,652 |
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Hersteller: NXP USA Inc.
Description: IC FF JK TYPE DOUBLE 1BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 71 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 1
Description: IC FF JK TYPE DOUBLE 1BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 71 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 1
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| 74HC597PW,112 |
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Hersteller: NXP USA Inc.
Description: IC SR PUSH-PULL 8BIT 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-TSSOP
Number of Bits per Element: 8
Description: IC SR PUSH-PULL 8BIT 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-TSSOP
Number of Bits per Element: 8
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| 74HC597PW,118 |
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Hersteller: NXP USA Inc.
Description: IC SR PUSH-PULL 8BIT 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-TSSOP
Number of Bits per Element: 8
Description: IC SR PUSH-PULL 8BIT 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-TSSOP
Number of Bits per Element: 8
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| 74HCT597D,653 |
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Hersteller: NXP USA Inc.
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
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| 74HCT597DB,112 |
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Hersteller: NXP USA Inc.
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
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| 74HCT597DB,118 |
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Hersteller: NXP USA Inc.
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
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| 74HCT597D,652 |
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Hersteller: NXP USA Inc.
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
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| 74HCT161D,653 |
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Hersteller: NXP USA Inc.
Description: IC BINARY COUNTER 4-BIT 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 41 MHz
Number of Bits per Element: 4
Description: IC BINARY COUNTER 4-BIT 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 41 MHz
Number of Bits per Element: 4
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| MCXN546VPBT |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
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| S32G378ASAK1VUCR |
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Hersteller: NXP USA Inc.
Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Cut Tape (CT)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Cut Tape (CT)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
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| S32G378AAAK1VUCT |
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Hersteller: NXP USA Inc.
Description: 3XM7-400MHZ, 4XA53-1GHZ, 15M SRA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: 3XM7-400MHZ, 4XA53-1GHZ, 15M SRA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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| S32G378AAAK1VUCR |
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Hersteller: NXP USA Inc.
Description: 3XM7-400MHZ, 4XA53-1GHZ, 15M SRA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: 3XM7-400MHZ, 4XA53-1GHZ, 15M SRA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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| S32G378AABK1VUCT |
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Hersteller: NXP USA Inc.
Description: 4XA53 - 1.1GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, eMMC/SD, FlexRay, I2C, LINbus, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: 4XA53 - 1.1GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, eMMC/SD, FlexRay, I2C, LINbus, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| S32G378AABK1VUCR |
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Hersteller: NXP USA Inc.
Description: 4XA53 - 1.1GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, eMMC/SD, FlexRay, I2C, LINbus, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: 4XA53 - 1.1GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, eMMC/SD, FlexRay, I2C, LINbus, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| S32G378AADK1VUCT |
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Hersteller: NXP USA Inc.
Description: CORES: 4XA53 & 3XM7, 1.4GHZ FOR
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz, 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: CORES: 4XA53 & 3XM7, 1.4GHZ FOR
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz, 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
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| S32G378AADK1VUCR |
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Hersteller: NXP USA Inc.
Description: CORES: 4XA53 & 3XM7, 1.4GHZ FOR
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz, 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: CORES: 4XA53 & 3XM7, 1.4GHZ FOR
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz, 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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Stück im Wert von UAH
| S32G378ASDK1VUCT |
Hersteller: NXP USA Inc.
Description: CORES: 4XA53 & 3XM7, 1.4GHZ FOR
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz, 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: CORES: 4XA53 & 3XM7, 1.4GHZ FOR
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz, 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S32G378ASDK1VUCR |
![]() |
Hersteller: NXP USA Inc.
Description: CORES: 4XA53 & 3XM7, 1.4GHZ FOR
Packaging: Bulk
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz, 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: CORES: 4XA53 & 3XM7, 1.4GHZ FOR
Packaging: Bulk
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz, 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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| 74HC4050DB,118 |
![]() |
Hersteller: NXP USA Inc.
Description: IC BUFF 2V/6V 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 6
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SSOP
Description: IC BUFF 2V/6V 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 6
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH















