Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36263) > Seite 604 nach 605
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74HCT366DB,118 | NXP USA Inc. |
 Description: IC BUFF 4.5V/5.5V 16-SSOPPackaging: Tape & Reel (TR) Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 6 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 16-SSOP |
Produkt ist nicht verfügbar |
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74HCT366D,653 | NXP USA Inc. |
Description: IC BUFF 4.5V/5.5V 16-SO Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 6 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 16-SO |
Produkt ist nicht verfügbar |
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TL431AIDBZR,215 | NXP USA Inc. |
Description: IC VREF SHUNT PREC ADJ SOT-23-3 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74HC21D,652 | NXP USA Inc. |
Description: IC GATE AND 2CH 4-INP 14-SO Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: AND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 4 Supplier Device Package: 14-SO Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 19ns @ 6V, 50pF Number of Circuits: 2 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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74HC21DB,112 | NXP USA Inc. |
Description: IC GATE AND 2CH 4-INP 14-SSOP Packaging: Tube Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: AND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 4 Supplier Device Package: 14-SSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 19ns @ 6V, 50pF Number of Circuits: 2 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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74HC21D,653 | NXP USA Inc. |
Description: IC GATE AND 2CH 4-INP 14-SO Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: AND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 4 Supplier Device Package: 14-SO Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 19ns @ 6V, 50pF Number of Circuits: 2 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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PUMD2,115 | NXP USA Inc. |
Description: TRANS PREBIAS NPN/PNP 6TSSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PUMD24,115 | NXP USA Inc. |
Description: TRANS PREBIASED DUAL 6TSSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74HCT365DB,112 | NXP USA Inc. |
Description: IC BUFF 4.5V/5.5V 16-SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 6 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 16-SSOP |
Produkt ist nicht verfügbar |
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74HCT365D,653 | NXP USA Inc. |
Description: IC BUFF 4.5V/5.5V 16-SO Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 6 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 16-SO |
Produkt ist nicht verfügbar |
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BZX79-C15,113 | NXP USA Inc. |
Description: DIODE ZENER 15V 400MW ALF2 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74HC165D,653 | NXP USA Inc. |
Description: IC SR COMPLEMENTARY 8BIT 16-SO Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Complementary Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel or Serial to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SO Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
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74HC165DB,112 | NXP USA Inc. |
Description: IC SHIFT REGTR COMP 8BIT 16-SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: Complementary Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel or Serial to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SSOP Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
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BZV55-C18,135 | NXP USA Inc. |
Description: DIODE ZENER 18V 500MW LLDS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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N74F11N,602 | NXP USA Inc. |
Description: IC GATE AND 3CH 3-INP 14DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: AND Gate Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 1mA, 20mA Number of Inputs: 3 Supplier Device Package: 14-DIP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF Number of Circuits: 3 |
Produkt ist nicht verfügbar |
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PDZ3.3B,115 | NXP USA Inc. |
Description: DIODE ZENER 3.3V 400MW SOD323 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| IMX95LP4XCPU-15 | NXP USA Inc. |
Description: IMX95LP4XCPU-15 Packaging: Bulk |
Produkt ist nicht verfügbar |
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MC33772BTP1AE | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP Packaging: Bulk Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: TPL Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage |
auf Bestellung 47 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33FS6522CAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
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MC33FS6522CAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO Packaging: Cut Tape (CT) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
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PDTA143ZT,215 | NXP USA Inc. |
Description: TRANS PNP 50V 100MA SOT23 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PESD3V3U1UT,215 | NXP USA Inc. |
Description: TVS DIODE 3.3VWM 20VC SOT23 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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BFG310W/XR,115 | NXP USA Inc. |
Description: RF TRANS NPN 6V 14GHZ CMPAK-4 Packaging: Tape & Reel (TR) Package / Case: SC-82A, SOT-343 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Gain: 18dB Power - Max: 60mW Current - Collector (Ic) (Max): 10mA Voltage - Collector Emitter Breakdown (Max): 6V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 3V Frequency - Transition: 14GHz Noise Figure (dB Typ @ f): 1dB @ 2GHz Supplier Device Package: CMPAK-4 |
Produkt ist nicht verfügbar |
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MCHRC705KJ1CDWE | NXP USA Inc. |
Description: IC MCU 8BIT 1.2KB OTP 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 4MHz Program Memory Size: 1.2KB (1.2K x 8) RAM Size: 64 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: POR, WDT Supplier Device Package: 16-SOIC Number of I/O: 10 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCHRC705KJ1CPE | NXP USA Inc. |
Description: IC MCU 8BIT 1.2KB OTP 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 4MHz Program Memory Size: 1.2KB (1.2K x 8) RAM Size: 64 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: POR, WDT Supplier Device Package: 16-PDIP Number of I/O: 10 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCHLC705KJ1CDWE | NXP USA Inc. |
Description: IC MCU 8BIT 1.2KB OTP 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 4MHz Program Memory Size: 1.2KB (1.2K x 8) RAM Size: 64 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: POR, WDT Supplier Device Package: 16-SOIC Number of I/O: 10 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCHRC705J1ACDWE | NXP USA Inc. |
Description: IC MCU 8BIT 1.2KB OTP 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 4MHz Program Memory Size: 1.2KB (1.2K x 8) RAM Size: 64 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: POR, WDT Supplier Device Package: 16-SOIC Number of I/O: 14 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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74HCT03PW,112 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-TSSOP Packaging: Tube Features: Open Drain Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: -, 4mA Number of Inputs: 2 Supplier Device Package: 14-TSSOP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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74HCT03D,652 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-SO Packaging: Tube Features: Open Drain Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: -, 4mA Number of Inputs: 2 Supplier Device Package: 14-SO Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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74HCT03D,653 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-SO Packaging: Tape & Reel (TR) Features: Open Drain Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: -, 4mA Number of Inputs: 2 Supplier Device Package: 14-SO Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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74HCT03DB,112 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-SSOP Packaging: Tube Features: Open Drain Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: -, 4mA Number of Inputs: 2 Supplier Device Package: 14-SSOP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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| BYV29-500,127 | NXP USA Inc. |
Description: DIODE UFAST 500V 9A TO220AC Packaging: Tube |
Produkt ist nicht verfügbar |
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1N4742A,113 | NXP USA Inc. |
Description: DIODE ZENER 12V 1W DO41 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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1N4729A,113 | NXP USA Inc. |
Description: DIODE ZENER 3.6V 1W DO41 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BT151-500L,127 | NXP USA Inc. |
Description: THYRISTOR 12A 650V TO220AB Packaging: Tube |
Produkt ist nicht verfügbar |
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HEF4093BT,653 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-SO Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| MAC97A8,412 | NXP USA Inc. |
 Description: TRIAC SENS GATE 600V 0.6A TO92-3Packaging: Bulk |
Produkt ist nicht verfügbar |
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74ALVC16245DL,118 | NXP USA Inc. |
Description: IC TRANSCVR 3-ST 16BIT 48SSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74ALVC16245DL,112 | NXP USA Inc. |
Description: IC TRANSCVR 3-ST 16BIT 48SSOP Packaging: Tube |
Produkt ist nicht verfügbar |
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74ALVC16245DGG,118 | NXP USA Inc. |
Description: IC TRANSCVR 3-ST 16BIT 48TSSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74ALVC16245DGG,112 | NXP USA Inc. |
Description: IC TRANSCVR TRI-ST 16BIT 48TSSOP Packaging: Tube |
Produkt ist nicht verfügbar |
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| BT151U-650C,127 | NXP USA Inc. |
Description: THYRISTOR 650V 12A SOT533 Packaging: Bulk |
Produkt ist nicht verfügbar |
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| BT151S-650R,118 | NXP USA Inc. |
Description: THYRISTOR 650V 12A DPAK Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BT151S-800R,118 | NXP USA Inc. |
Description: THYRISTOR 800V 12A DPAK Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BT151-650R,127 | NXP USA Inc. |
Description: THYRISTOR 12A 650V TO220AB Packaging: Tube |
Produkt ist nicht verfügbar |
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| BC846A,215 | NXP USA Inc. |
Description: TRANSISTOR NPN 100MA 65V SOT23 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BF622,115 | NXP USA Inc. |
Description: TRANS NPN 250V 50MA SOT89 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| MF3EH43A1DUF/01EVZ | NXP USA Inc. |
Description: MF3EH43A1DUF/01EV Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -25°C ~ 85°C (TA) Standards: ISO 14443A, ISO 7816-4, Mifare, NFC Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
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MC7447AVS1000LB | NXP USA Inc. |
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA Packaging: Tray Package / Case: 360-CLGA, FCCLGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.8V, 2.5V Supplier Device Package: 360-FCCLGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
Produkt ist nicht verfügbar |
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MC7447AVS1000NB | NXP USA Inc. |
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA Packaging: Tray Package / Case: 360-CLGA, FCCLGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.8V, 2.5V Supplier Device Package: 360-FCCLGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
Produkt ist nicht verfügbar |
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MCXW727AMFTBT | NXP USA Inc. |
Description: MCXW72 HVQFN48 Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Memory Size: 2MB Flash, 256kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Protocol: Ultra Wideband (UWB) Supplier Device Package: 48-HVQFN (7x7) RF Family/Standard: Bluetooth |
auf Bestellung 1300 Stücke: Lieferzeit 10-14 Tag (e) |
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MCXW727CMFTBT | NXP USA Inc. |
Description: MCXW72 HVQFN48 Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Memory Size: 2MB Flash, 256kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Protocol: Ultra Wideband (UWB) Supplier Device Package: 48-HVQFN (7x7) RF Family/Standard: Bluetooth |
Produkt ist nicht verfügbar |
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| KW47Z42082AFTBT | NXP USA Inc. |
Description: KW47 AUTO QFN48 Packaging: Tray |
Produkt ist nicht verfügbar |
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| KW47Z42092AFTBT | NXP USA Inc. |
Description: KW47 AUTO QFN48 Packaging: Tray |
Produkt ist nicht verfügbar |
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| KW47Z420B3AFTBT | NXP USA Inc. |
Description: KW47 AUTO QFN48 Packaging: Tray |
Produkt ist nicht verfügbar |
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| KW47Z420B2AFTBT | NXP USA Inc. |
Description: KW47 AUTO QFN48 Packaging: Tray |
Produkt ist nicht verfügbar |
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| KW47B42ZB2AFTBT | NXP USA Inc. |
Description: KW47 AUTO QFN48 Packaging: Tray |
Produkt ist nicht verfügbar |
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| MPF5103AMMA0ES | NXP USA Inc. |
Description: SUPERSET COVERING PF5103 QM DEVI Packaging: Tray Package / Case: 28-PowerWFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.95V ~ 5.5V Applications: Processor Current - Supply: 1.5µA Supplier Device Package: 28-HWQFN (4.5x4.5) |
Produkt ist nicht verfügbar |
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| MPF5103AMBA0ES | NXP USA Inc. |
Description: SUPERSET COVERING PF5103 ASIL B Packaging: Tray Package / Case: 28-PowerWFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.95V ~ 5.5V Applications: Processor Current - Supply: 1.5µA Supplier Device Package: 28-HWQFN (4.5x4.5) |
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| MPF5113AMMA0ES | NXP USA Inc. |
Description: SUPERSET COVERING PF5113 QM DEVI Packaging: Tray Package / Case: 28-PowerWFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.95V ~ 5.5V Applications: Processor Current - Supply: 1.5µA Supplier Device Package: 28-HWQFN (4.5x4.5) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 74HCT366DB,118 |
|
Hersteller: NXP USA Inc.
Description: IC BUFF 4.5V/5.5V 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SSOP
Description: IC BUFF 4.5V/5.5V 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SSOP
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| 74HCT366D,653 |
|
Hersteller: NXP USA Inc.
Description: IC BUFF 4.5V/5.5V 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SO
Description: IC BUFF 4.5V/5.5V 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SO
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| 74HC21D,652 |
|
Hersteller: NXP USA Inc.
Description: IC GATE AND 2CH 4-INP 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 4
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 19ns @ 6V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
Description: IC GATE AND 2CH 4-INP 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 4
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 19ns @ 6V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
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| 74HC21DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC GATE AND 2CH 4-INP 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 4
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 19ns @ 6V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
Description: IC GATE AND 2CH 4-INP 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 4
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 19ns @ 6V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
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| 74HC21D,653 |
|
Hersteller: NXP USA Inc.
Description: IC GATE AND 2CH 4-INP 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 4
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 19ns @ 6V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
Description: IC GATE AND 2CH 4-INP 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 4
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 19ns @ 6V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 2 µA
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| 74HCT365DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC BUFF 4.5V/5.5V 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SSOP
Description: IC BUFF 4.5V/5.5V 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SSOP
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| 74HCT365D,653 |
|
Hersteller: NXP USA Inc.
Description: IC BUFF 4.5V/5.5V 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SO
Description: IC BUFF 4.5V/5.5V 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SO
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| 74HC165D,653 |
|
Hersteller: NXP USA Inc.
Description: IC SR COMPLEMENTARY 8BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Description: IC SR COMPLEMENTARY 8BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
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| 74HC165DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC SHIFT REGTR COMP 8BIT 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Description: IC SHIFT REGTR COMP 8BIT 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
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| N74F11N,602 |
|
Hersteller: NXP USA Inc.
Description: IC GATE AND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: AND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF
Number of Circuits: 3
Description: IC GATE AND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: AND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF
Number of Circuits: 3
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| MC33772BTP1AE |
|
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: TPL
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
auf Bestellung 47 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 34+ | 13.24 EUR |
| MC33FS6522CAER2 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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| MC33FS6522CAER2 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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| BFG310W/XR,115 |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 6V 14GHZ CMPAK-4
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Gain: 18dB
Power - Max: 60mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 6V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 3V
Frequency - Transition: 14GHz
Noise Figure (dB Typ @ f): 1dB @ 2GHz
Supplier Device Package: CMPAK-4
Description: RF TRANS NPN 6V 14GHZ CMPAK-4
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Gain: 18dB
Power - Max: 60mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 6V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 3V
Frequency - Transition: 14GHz
Noise Figure (dB Typ @ f): 1dB @ 2GHz
Supplier Device Package: CMPAK-4
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| MCHRC705KJ1CDWE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-SOIC
Number of I/O: 10
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.2KB OTP 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-SOIC
Number of I/O: 10
DigiKey Programmable: Not Verified
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| MCHRC705KJ1CPE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-PDIP
Number of I/O: 10
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.2KB OTP 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-PDIP
Number of I/O: 10
DigiKey Programmable: Not Verified
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| MCHLC705KJ1CDWE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-SOIC
Number of I/O: 10
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.2KB OTP 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-SOIC
Number of I/O: 10
DigiKey Programmable: Not Verified
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| MCHRC705J1ACDWE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.2KB OTP 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
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| 74HCT03PW,112 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-TSSOP
Packaging: Tube
Features: Open Drain
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 4mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Description: IC GATE NAND 4CH 2-INP 14-TSSOP
Packaging: Tube
Features: Open Drain
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 4mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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| 74HCT03D,652 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Tube
Features: Open Drain
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Tube
Features: Open Drain
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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| 74HCT03D,653 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Tape & Reel (TR)
Features: Open Drain
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Tape & Reel (TR)
Features: Open Drain
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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| 74HCT03DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-SSOP
Packaging: Tube
Features: Open Drain
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 4mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Description: IC GATE NAND 4CH 2-INP 14-SSOP
Packaging: Tube
Features: Open Drain
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 4mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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| MF3EH43A1DUF/01EVZ |
|
Hersteller: NXP USA Inc.
Description: MF3EH43A1DUF/01EV
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C (TA)
Standards: ISO 14443A, ISO 7816-4, Mifare, NFC
Supplier Device Package: Wafer
Description: MF3EH43A1DUF/01EV
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C (TA)
Standards: ISO 14443A, ISO 7816-4, Mifare, NFC
Supplier Device Package: Wafer
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| MC7447AVS1000LB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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| MC7447AVS1000NB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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| MCXW727AMFTBT |
|
Hersteller: NXP USA Inc.
Description: MCXW72 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 2MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Protocol: Ultra Wideband (UWB)
Supplier Device Package: 48-HVQFN (7x7)
RF Family/Standard: Bluetooth
Description: MCXW72 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 2MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Protocol: Ultra Wideband (UWB)
Supplier Device Package: 48-HVQFN (7x7)
RF Family/Standard: Bluetooth
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 11.7 EUR |
| 10+ | 9.04 EUR |
| 25+ | 8.38 EUR |
| 100+ | 7.64 EUR |
| 260+ | 7.28 EUR |
| 520+ | 7.07 EUR |
| 1040+ | 6.9 EUR |
| MCXW727CMFTBT |
|
Hersteller: NXP USA Inc.
Description: MCXW72 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 2MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Protocol: Ultra Wideband (UWB)
Supplier Device Package: 48-HVQFN (7x7)
RF Family/Standard: Bluetooth
Description: MCXW72 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 2MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Protocol: Ultra Wideband (UWB)
Supplier Device Package: 48-HVQFN (7x7)
RF Family/Standard: Bluetooth
Produkt ist nicht verfügbar
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| MPF5103AMMA0ES |
|
Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5103 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Description: SUPERSET COVERING PF5103 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
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| MPF5103AMBA0ES |
|
Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5103 ASIL B
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Description: SUPERSET COVERING PF5103 ASIL B
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
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| MPF5113AMMA0ES |
|
Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5113 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Description: SUPERSET COVERING PF5113 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
Produkt ist nicht verfügbar
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