Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36178) > Seite 601 nach 603
| Foto | Bezeichnung | Hersteller | Beschreibung |
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BZX84-B3V3,215 | NXP USA Inc. |
Description: DIODE ZENER 3.3V 250MW TO236ABPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| RDK01DB1562 | NXP USA Inc. |
Description: EVAL BOARD TEA1995T TEA2016AATPackaging: Box Voltage - Output: 12V Current - Output: 20A Contents: Board(s), Cable(s) Regulator Topology: Flyback Utilized IC / Part: TEA1995T, TEA2016AAT Main Purpose: AC/DC, Primary and Secondary Side with PFC Outputs and Type: 1 Non-Isolated Output Power - Output: 240W |
Produkt ist nicht verfügbar |
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MC9S12HZ256CAL | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFPPackaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 256KB (256K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 85 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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BSH205,215 | NXP USA Inc. |
Description: MOSFET P-CH 12V 750MA TO236ABPackaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: P-Channel Current - Continuous Drain (Id) @ 25°C: 750mA (Ta) Rds On (Max) @ Id, Vgs: 400mOhm @ 430mA, 4.5V Power Dissipation (Max): 417mW (Ta) Vgs(th) (Max) @ Id: 680mV @ 1mA (Typ) Supplier Device Package: SOT-23 (TO-236AB) Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 12 V Gate Charge (Qg) (Max) @ Vgs: 3.8 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 200 pF @ 9.6 V |
Produkt ist nicht verfügbar |
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PEMI8QFN/CE,132 | NXP USA Inc. |
Description: FILTER RC(PI) 20 OHMS ESD SMDPackaging: Tape & Reel (TR) Package / Case: 16-XFDFN Exposed Pad Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 20Ohms, C = 8.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 7dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 20 ESD Protection: Yes Number of Channels: 8 |
Produkt ist nicht verfügbar |
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74HC107DB,112 | NXP USA Inc. |
Description: IC FF JK TYPE DBL 1-BIT 14-SSOPPackaging: Tube Package / Case: 14-SSOP (0.209", 5.30mm Width) Output Type: Complementary Mounting Type: Surface Mount Number of Elements: 2 Function: Reset Type: JK Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 4 µA Current - Output High, Low: 5.2mA, 5.2mA Trigger Type: Negative Edge Clock Frequency: 85 MHz Input Capacitance: 3.5 pF Supplier Device Package: 14-SSOP Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF Number of Bits per Element: 1 |
Produkt ist nicht verfügbar |
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74HC107D,652 | NXP USA Inc. |
Description: IC FF JK TYPE DOUBLE 1BIT 14-SOPackaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Output Type: Complementary Mounting Type: Surface Mount Number of Elements: 2 Function: Reset Type: JK Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 4 µA Current - Output High, Low: 5.2mA, 5.2mA Trigger Type: Negative Edge Clock Frequency: 85 MHz Input Capacitance: 3.5 pF Supplier Device Package: 14-SO Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF Number of Bits per Element: 1 |
Produkt ist nicht verfügbar |
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HEF4049BT,652 | NXP USA Inc. |
Description: IC INVERTER HEX 1INPUT 16SOICPackaging: Tube |
Produkt ist nicht verfügbar |
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PMBS3906,215 | NXP USA Inc. |
Description: TRANS PNP 40V 100MA SOT23Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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BZX84-A5V6,215 | NXP USA Inc. |
Description: DIODE ZENER 5.6V 250MW TO236ABPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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BAS40-05,215 | NXP USA Inc. |
Description: DIODE SCHOTTKY 40V 120MA TO236ABPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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1N4742A,113 | NXP USA Inc. |
Description: DIODE ZENER 12V 1W DO41Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BTA201-600E,112 | NXP USA Inc. |
Description: TRIAC 600V 1A TO-92Packaging: Bulk |
Produkt ist nicht verfügbar |
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NVT4556BUKZ | NXP USA Inc. |
Description: SIM CARD INTERFACE LEVEL TRANSLAPackaging: Bulk |
auf Bestellung 3957 Stücke: Lieferzeit 10-14 Tag (e) |
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BAS85,135 | NXP USA Inc. |
Description: DIODE SCHOTTKY 30V 200MA SOD80CPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PHE13007,127 | NXP USA Inc. |
Description: TRANS NPN 400V 8A TO-220ABPackaging: Tube |
Produkt ist nicht verfügbar |
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MWPR1516CFM | NXP USA Inc. |
Description: IC RECEIVER 16KB FLASH 32QFN Packaging: Tray Package / Case: 32-UFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.5V ~ 20V Applications: Wireless Power Receiver Current - Supply: 120mA Supplier Device Package: 32-QFN (5x5) |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| TDA20142/2,557 | NXP USA Inc. |
Description: IC VIDEO TUNER 28HVQFN Packaging: Tray Package / Case: 28-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Tuner Voltage - Supply: 3.3V Applications: Consumer Video Supplier Device Package: 28-HVQFN (5x5) |
Produkt ist nicht verfügbar |
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| S32K358NHT1VPCST | NXP USA Inc. |
Description: 8MB,1152KB RAM,ASIL-D,+125C,172HPackaging: Tray Package / Case: 172-QFP Exposed Pad Mounting Type: Surface Mount Speed: 240MHz Program Memory Size: 8MB (8M x 8) RAM Size: 1.125M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7F Data Converters: A/D 24x12b SAR Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 172-QFP-EP Grade: Automotive Number of I/O: 142 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC13213 | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 71LGAPackaging: Tray Package / Case: 71-VFLGA Exposed Pad Sensitivity: -92dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 60kB Flash, 4kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2V ~ 3.4V Power - Output: 3dBm Protocol: Zigbee® Current - Receiving: 37mA Data Rate (Max): 250kbps Current - Transmitting: 30mA Supplier Device Package: 71-LGA (9x9) GPIO: 32 Modulation: DSSS, O-QPSK RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MSC8152TAG1000B | NXP USA Inc. |
Description: IC DSP 2X 1GHZ SC3850 783FCBGAPackaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Type: SC3850 Dual Core Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (96KB) On-Chip RAM: 576kB Voltage - I/O: 2.50V Voltage - Core: 1.00V Clock Rate: 1GHz Supplier Device Package: 783-FCPBGA (29x29) |
Produkt ist nicht verfügbar |
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BAS20,215 | NXP USA Inc. |
Description: DIODE GEN-PURP 200V 200MA SOT-23Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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HEF4093BT,653 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-SOPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PBSS5580PA,115 | NXP USA Inc. |
Description: TRANS PNP 80V 4A SOT1061Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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MC705JJ7CDWE | NXP USA Inc. |
Description: IC MCU 8BIT 6KB OTP 20SOICPackaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 2.1MHz Program Memory Size: 6KB (6K x 8) RAM Size: 224 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Data Converters: A/D 4x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SIO Peripherals: POR, Temp Sensor, WDT Supplier Device Package: 20-SOIC Number of I/O: 14 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCHSC705C8ACPE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB OTP 40DIPPackaging: Tube Package / Case: 40-DIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 4MHz Program Memory Size: 8KB (8K x 8) RAM Size: 304 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 40-PDIP Number of I/O: 24 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC705K1CP | NXP USA Inc. |
Description: IC MCU 8BIT 512B OTP 16DIPPackaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 4MHz Program Memory Size: 512B (512 x 8) RAM Size: 32 x 8 Operating Temperature: -40°C ~ 85°C Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: LVD, POR, WDT Supplier Device Package: 16-PDIP Number of I/O: 10 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HRC705J1ACPE | NXP USA Inc. |
Description: IC MCU 8BIT 1.2KB OTP 20DIPPackaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 4.2MHz Program Memory Size: 1.2KB (1.2K x 8) RAM Size: 64 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: POR, WDT Supplier Device Package: 20-PDIP Number of I/O: 14 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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P89LPC904FD,529 | NXP USA Inc. |
Description: IC MCU 8BIT 1KB FLASH 8SOICPackaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 12MHz Program Memory Size: 1KB (1K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, WDT Supplier Device Package: 8-SO Number of I/O: 6 DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
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N74F244D,602 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 20-SOPackaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 15mA, 64mA Supplier Device Package: 20-SO |
Produkt ist nicht verfügbar |
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N74F244DB,112 | NXP USA Inc. |
Description: IC BUFF NON-INVERT 5.5V 20-SSOPPackaging: Tube Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 15mA, 64mA Supplier Device Package: 20-SSOP |
Produkt ist nicht verfügbar |
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N74F244D,623 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 20-SOPackaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 15mA, 64mA Supplier Device Package: 20-SO |
Produkt ist nicht verfügbar |
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N74F245D,602 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 5.5V 20-SOPackaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Transceiver, Non-Inverting Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 3mA, 24mA; 15mA, 64mA Supplier Device Package: 20-SO |
Produkt ist nicht verfügbar |
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N74F245N,602 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 5.5V 20-DIPPackaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Output Type: 3-State Mounting Type: Through Hole Number of Elements: 1 Logic Type: Transceiver, Non-Inverting Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 3mA, 24mA; 15mA, 64mA Supplier Device Package: 20-DIP |
Produkt ist nicht verfügbar |
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74ABT74DB,112 | NXP USA Inc. |
Description: IC FF D-TYPE DUAL 1BIT 14SSOPPackaging: Tube |
Produkt ist nicht verfügbar |
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74ABT74PW,112 | NXP USA Inc. |
Description: IC FF D-TYPE DUAL 1BIT 14TSSOPPackaging: Tube |
Produkt ist nicht verfügbar |
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74ABT74D,112 | NXP USA Inc. |
Description: IC FF D-TYPE DUAL 1BIT 14SOPackaging: Tube |
Produkt ist nicht verfügbar |
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74ABT74D,118 | NXP USA Inc. |
Description: IC FF D-TYPE DUAL 1BIT 14SOPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BCX52,115 | NXP USA Inc. |
Description: TRANSISTOR PNP 60V 1A SOT89Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74HCT4051PW,112 | NXP USA Inc. |
Description: IC MUX/DEMUX 8X1 16TSSOPPackaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 120Ohm -3db Bandwidth: 180MHz Supplier Device Package: 16-TSSOP Voltage - Supply, Single (V+): 4.5V ~ 5.5V Voltage - Supply, Dual (V±): ±1V ~ 5V Switch Time (Ton, Toff) (Max): 39ns, 32ns Channel Capacitance (CS(off), CD(off)): 3.5pF Current - Leakage (IS(off)) (Max): 400nA Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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74HCT4051DB,112 | NXP USA Inc. |
Description: IC MUX/DEMUX 8X1 16SSOPPackaging: Tube |
Produkt ist nicht verfügbar |
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BZX79-C3V3,113 | NXP USA Inc. |
Description: DIODE ZENER 3.3V 400MW ALF2Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BZX79-C3V3,133 | NXP USA Inc. |
Description: DIODE ZENER 3.3V 400MW ALF2Packaging: Tape & Box (TB) |
Produkt ist nicht verfügbar |
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| NAFE33352B40BSMP | NXP USA Inc. |
Description: ICPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Bits: 24 Voltage - Supply, Analog: 2.97V ~ 3.63V Voltage - Supply, Digital: 2.97V ~ 3.63V Supplier Device Package: 40-HVQFN (6x6) Number of Channels: 2 |
Produkt ist nicht verfügbar |
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MPC8260ACZUMIBB | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 480TBGAPackaging: Tray Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2 Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
Produkt ist nicht verfügbar |
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| BT136S-600D,118 | NXP USA Inc. |
Description: TRIAC 600V 4A DPAKPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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MC9S08QE32CFM | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 32QFNPackaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Number of I/O: 26 DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
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| BTA208S-600D,118 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 8A DPAKPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BTA208S-600F,118 | NXP USA Inc. |
Description: TRIAC 600V 8A DPAKPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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BTA208S-800B,118 | NXP USA Inc. |
Description: TRIAC 800V 8A DPAKPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BTA208S-600E,118 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 8A DPAKPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| BTA208X-800B,127 | NXP USA Inc. |
Description: TRIAC 800V 8A TO220FPackaging: Tube |
Produkt ist nicht verfügbar |
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| BTA208X-600F,127 | NXP USA Inc. |
Description: TRIAC 600V 8A TO220-3Packaging: Tube |
Produkt ist nicht verfügbar |
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| BTA208-600B,127 | NXP USA Inc. |
Description: TRIAC 600V 8A TO220ABPackaging: Tube |
Produkt ist nicht verfügbar |
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JN5139-XK006 | NXP USA Inc. |
Description: ROUTER 6LOWPAN ETHERNETFrequency: 2.4GHz Type: Transceiver; 802.15.4 (ZigBee®) Contents: Board(s), Cable(s) Utilized IC / Part: JN5139 |
Produkt ist nicht verfügbar |
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| BZV85-C27,113 | NXP USA Inc. |
Description: DIODE ZENER 27V 1.3W DO41Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74HC14DB,118 | NXP USA Inc. |
Description: IC HEX INV SCHMITT TRIG 14SSOPFeatures: Schmitt Trigger Packaging: Tape & Reel (TR) Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 1 Supplier Device Package: 14-SSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.3V ~ 1.2V Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF Number of Circuits: 6 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
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BAS40-06W,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 40V 120MA SOT323Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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MC68MH360AI33L | NXP USA Inc. |
Description: IC MPU M683XX 33MHZ 240FQFPPackaging: Tray Package / Case: 240-BFQFP Mounting Type: Surface Mount Speed: 33MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 240-FQFP (32x32) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: SCC, SMC, SPI |
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| BZV55-C43,115 | NXP USA Inc. |
Description: DIODE ZENER 43V 500MW LLDSPackaging: Tape & Reel (TR) |
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| RDK01DB1562 |
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Hersteller: NXP USA Inc.
Description: EVAL BOARD TEA1995T TEA2016AAT
Packaging: Box
Voltage - Output: 12V
Current - Output: 20A
Contents: Board(s), Cable(s)
Regulator Topology: Flyback
Utilized IC / Part: TEA1995T, TEA2016AAT
Main Purpose: AC/DC, Primary and Secondary Side with PFC
Outputs and Type: 1 Non-Isolated Output
Power - Output: 240W
Description: EVAL BOARD TEA1995T TEA2016AAT
Packaging: Box
Voltage - Output: 12V
Current - Output: 20A
Contents: Board(s), Cable(s)
Regulator Topology: Flyback
Utilized IC / Part: TEA1995T, TEA2016AAT
Main Purpose: AC/DC, Primary and Secondary Side with PFC
Outputs and Type: 1 Non-Isolated Output
Power - Output: 240W
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| MC9S12HZ256CAL |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 85
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 85
DigiKey Programmable: Not Verified
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| BSH205,215 |
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Hersteller: NXP USA Inc.
Description: MOSFET P-CH 12V 750MA TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 750mA (Ta)
Rds On (Max) @ Id, Vgs: 400mOhm @ 430mA, 4.5V
Power Dissipation (Max): 417mW (Ta)
Vgs(th) (Max) @ Id: 680mV @ 1mA (Typ)
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 3.8 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 200 pF @ 9.6 V
Description: MOSFET P-CH 12V 750MA TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 750mA (Ta)
Rds On (Max) @ Id, Vgs: 400mOhm @ 430mA, 4.5V
Power Dissipation (Max): 417mW (Ta)
Vgs(th) (Max) @ Id: 680mV @ 1mA (Typ)
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 3.8 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 200 pF @ 9.6 V
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| PEMI8QFN/CE,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 7dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Number of Channels: 8
Description: FILTER RC(PI) 20 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 7dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Number of Channels: 8
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| 74HC107DB,112 |
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Hersteller: NXP USA Inc.
Description: IC FF JK TYPE DBL 1-BIT 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 85 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
Description: IC FF JK TYPE DBL 1-BIT 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 85 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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| 74HC107D,652 |
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Hersteller: NXP USA Inc.
Description: IC FF JK TYPE DOUBLE 1BIT 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 85 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
Description: IC FF JK TYPE DOUBLE 1BIT 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 85 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
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| NVT4556BUKZ |
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auf Bestellung 3957 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 270+ | 1.65 EUR |
| MWPR1516CFM |
Hersteller: NXP USA Inc.
Description: IC RECEIVER 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.5V ~ 20V
Applications: Wireless Power Receiver
Current - Supply: 120mA
Supplier Device Package: 32-QFN (5x5)
Description: IC RECEIVER 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.5V ~ 20V
Applications: Wireless Power Receiver
Current - Supply: 120mA
Supplier Device Package: 32-QFN (5x5)
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 6.71 EUR |
| TDA20142/2,557 |
Hersteller: NXP USA Inc.
Description: IC VIDEO TUNER 28HVQFN
Packaging: Tray
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Consumer Video
Supplier Device Package: 28-HVQFN (5x5)
Description: IC VIDEO TUNER 28HVQFN
Packaging: Tray
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Consumer Video
Supplier Device Package: 28-HVQFN (5x5)
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| S32K358NHT1VPCST |
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Hersteller: NXP USA Inc.
Description: 8MB,1152KB RAM,ASIL-D,+125C,172H
Packaging: Tray
Package / Case: 172-QFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP-EP
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Description: 8MB,1152KB RAM,ASIL-D,+125C,172H
Packaging: Tray
Package / Case: 172-QFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP-EP
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
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| MC13213 |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 71LGA
Packaging: Tray
Package / Case: 71-VFLGA Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 60kB Flash, 4kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 3dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 71-LGA (9x9)
GPIO: 32
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 71LGA
Packaging: Tray
Package / Case: 71-VFLGA Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 60kB Flash, 4kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 3dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 71-LGA (9x9)
GPIO: 32
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI
DigiKey Programmable: Not Verified
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| MSC8152TAG1000B |
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Hersteller: NXP USA Inc.
Description: IC DSP 2X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Dual Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Description: IC DSP 2X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Dual Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
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| MC705JJ7CDWE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 6KB OTP 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 6KB (6K x 8)
RAM Size: 224 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SIO
Peripherals: POR, Temp Sensor, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 6KB OTP 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 6KB (6K x 8)
RAM Size: 224 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SIO
Peripherals: POR, Temp Sensor, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
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| MCHSC705C8ACPE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB OTP 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 40-PDIP
Number of I/O: 24
DigiKey Programmable: Not Verified
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| MC68HC705K1CP |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 512B OTP 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 512B (512 x 8)
RAM Size: 32 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: LVD, POR, WDT
Supplier Device Package: 16-PDIP
Number of I/O: 10
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 512B OTP 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 512B (512 x 8)
RAM Size: 32 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: LVD, POR, WDT
Supplier Device Package: 16-PDIP
Number of I/O: 10
DigiKey Programmable: Not Verified
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| MC68HRC705J1ACPE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4.2MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-PDIP
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.2KB OTP 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4.2MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-PDIP
Number of I/O: 14
DigiKey Programmable: Not Verified
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| P89LPC904FD,529 |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 8-SO
Number of I/O: 6
DigiKey Programmable: Verified
Description: IC MCU 8BIT 1KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 8-SO
Number of I/O: 6
DigiKey Programmable: Verified
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| N74F244D,602 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
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| N74F244DB,112 |
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Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SSOP
Description: IC BUFF NON-INVERT 5.5V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SSOP
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| N74F244D,623 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
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| N74F245D,602 |
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Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
Supplier Device Package: 20-SO
Description: IC TXRX NON-INVERT 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
Supplier Device Package: 20-SO
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| N74F245N,602 |
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Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
Supplier Device Package: 20-DIP
Description: IC TXRX NON-INVERT 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
Supplier Device Package: 20-DIP
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| 74HCT4051PW,112 |
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Hersteller: NXP USA Inc.
Description: IC MUX/DEMUX 8X1 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 120Ohm
-3db Bandwidth: 180MHz
Supplier Device Package: 16-TSSOP
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Voltage - Supply, Dual (V±): ±1V ~ 5V
Switch Time (Ton, Toff) (Max): 39ns, 32ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 400nA
Number of Circuits: 1
Description: IC MUX/DEMUX 8X1 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 120Ohm
-3db Bandwidth: 180MHz
Supplier Device Package: 16-TSSOP
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Voltage - Supply, Dual (V±): ±1V ~ 5V
Switch Time (Ton, Toff) (Max): 39ns, 32ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 400nA
Number of Circuits: 1
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| NAFE33352B40BSMP |
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Hersteller: NXP USA Inc.
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.63V
Voltage - Supply, Digital: 2.97V ~ 3.63V
Supplier Device Package: 40-HVQFN (6x6)
Number of Channels: 2
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 2.97V ~ 3.63V
Voltage - Supply, Digital: 2.97V ~ 3.63V
Supplier Device Package: 40-HVQFN (6x6)
Number of Channels: 2
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| MPC8260ACZUMIBB |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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| MC9S08QE32CFM |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 26
DigiKey Programmable: Verified
Description: IC MCU 8BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 26
DigiKey Programmable: Verified
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| JN5139-XK006 | ![]() |
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Hersteller: NXP USA Inc.
Description: ROUTER 6LOWPAN ETHERNET
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Contents: Board(s), Cable(s)
Utilized IC / Part: JN5139
Description: ROUTER 6LOWPAN ETHERNET
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Contents: Board(s), Cable(s)
Utilized IC / Part: JN5139
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| 74HC14DB,118 |
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Hersteller: NXP USA Inc.
Description: IC HEX INV SCHMITT TRIG 14SSOP
Features: Schmitt Trigger
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
Description: IC HEX INV SCHMITT TRIG 14SSOP
Features: Schmitt Trigger
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
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| MC68MH360AI33L |
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Hersteller: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
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