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BSS87,115 NXP USA Inc. BSS87.pdf Description: MOSFET N-CH 200V 400MA SOT89
Packaging: Tape & Reel (TR)
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BCM62B,215 NXP USA Inc. BCM62B.pdf Description: TRANS PNP DBL 45V 100MA SOT-143B
Packaging: Tape & Reel (TR)
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BT134-600E,127 NXP USA Inc. BT134-600E.pdf Description: TRIAC SENS GATE 600V 4A SOT82-3
Packaging: Tube
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MC908QY2AMDTE MC908QY2AMDTE NXP USA Inc. MC68HLC908QY4.pdf Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
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MC908QT1ACFQE MC908QT1ACFQE NXP USA Inc. MC68HC908QY4A.pdf Description: IC MCU 8BIT 1.5KB FLASH 8DFN
Packaging: Tray
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-DFN-EP (4x4)
Number of I/O: 5
DigiKey Programmable: Not Verified
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74HC166N,652 74HC166N,652 NXP USA Inc. 74HC%28T%29166_Rev3.pdf Description: IC SR PUSH-PULL 8BIT 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-DIP
Number of Bits per Element: 8
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74HC367D,652 74HC367D,652 NXP USA Inc. 74HC_HCT367.pdf Description: IC BUFFER NON-INVERTING 6V 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 16-SO
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74HC367D,653 74HC367D,653 NXP USA Inc. 74HC_HCT367.pdf Description: IC BUFFER NON-INVERTING 6V 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 16-SO
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74HC367DB,112 74HC367DB,112 NXP USA Inc. 74HC_HCT367.pdf Description: IC BUFFER NON-INVERT 6V 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 16-SSOP
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P1016NSE5FFB NXP USA Inc. Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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Z0109MA,412 NXP USA Inc. DS_568_Z0109MA.pdf Description: TRIAC SENS GATE 600V 1A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 10 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 8A, 8.5A
Voltage - Gate Trigger (Vgt) (Max): 1.3 V
Supplier Device Package: TO-92-3
Current - On State (It (RMS)) (Max): 1 A
Voltage - Off State: 600 V
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Z0109NA,412 NXP USA Inc. Z0109NA.pdf Description: TRIAC SENS GATE 800V 1A TO92-3
Packaging: Bulk
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PDTC114ET,235 PDTC114ET,235 NXP USA Inc. PDTC114E_SERIES_10.pdf Description: TRANS NPN 50V 100MA SOT23
Packaging: Tape & Reel (TR)
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PDTC114ET,215 PDTC114ET,215 NXP USA Inc. PDTC114E_SERIES_10.pdf Description: TRANS PREBIAS NPN 250MW TO236AB
Packaging: Tape & Reel (TR)
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1N4746A,113 1N4746A,113 NXP USA Inc. 1N4728A_SER.pdf Description: DIODE ZENER 18V 1W DO41
Packaging: Tape & Reel (TR)
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MC7447AHX1000LB MC7447AHX1000LB NXP USA Inc. MPC7447AEC.pdf Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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74HC14D,653 74HC14D,653 NXP USA Inc. 74HC_HCT14.pdf Description: IC HEX INVERTER SCHM TRIG 14SOIC
Packaging: Tape & Reel (TR)
Features: Schmitt Trigger
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
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TEA1738GT/N1,118 TEA1738GT/N1,118 NXP USA Inc. TEA1738GT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 118kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature
Voltage - Start Up: 13.2 V
Power (Watts): 75 W
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TEA1738GT/N1,118 TEA1738GT/N1,118 NXP USA Inc. TEA1738GT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 118kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature
Voltage - Start Up: 13.2 V
Power (Watts): 75 W
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MC33910G5AC MC33910G5AC NXP USA Inc. MC33910.pdf Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
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LS2084ASN7TTB LS2084ASN7TTB NXP USA Inc. Download?colCode=LS2084A&amp;location=null Description: IC MPU QORIQ 1.8GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA (2)
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MPC8536EBVTAVLA MPC8536EBVTAVLA NXP USA Inc. MPC8536E.pdf Description: IC MPU MPC85XX 1.5GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8536AVTAULA MPC8536AVTAULA NXP USA Inc. MPC8536E.pdf Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MFS2613HMDAAAD MFS2613HMDAAAD NXP USA Inc. FS26_SDS.pdf Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
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PBSS5140T,215 PBSS5140T,215 NXP USA Inc. PBSS5140T.pdf Description: TRANS PNP 40V 1A SOT23
Packaging: Tape & Reel (TR)
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BZV55-C24,135 BZV55-C24,135 NXP USA Inc. PHGLS22257-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 24V 500MW LLDS
Packaging: Tape & Reel (TR)
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74HCT00D,652 74HCT00D,652 NXP USA Inc. 74HC_HCT00.pdf Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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74HCT00N,652 74HCT00N,652 NXP USA Inc. 74HC_HCT00.pdf Description: IC GATE NAND 4CH 2-INP 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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74LVC16245ADGG,112 74LVC16245ADGG,112 NXP USA Inc. 74LVC_LVCH16245A.pdf Description: IC BUS TXRX TRI-ST 16BIT 48TSSOP
Packaging: Tube
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74LVC374AD,118 74LVC374AD,118 NXP USA Inc. 74LVC374A.pdf Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Tape & Reel (TR)
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74LVC374ABQ,115 74LVC374ABQ,115 NXP USA Inc. 74LVC374A.pdf Description: IC FF D-TYPE SNGL 8BIT 20DHVQFN
Packaging: Tape & Reel (TR)
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74LVC374AD,112 74LVC374AD,112 NXP USA Inc. 74LVC374A.pdf Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Tube
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74LVC374ADB,112 74LVC374ADB,112 NXP USA Inc. 74LVC374A.pdf Description: IC FF D-TYPE SNGL 8BIT 20SSOP
Packaging: Tube
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74LVC374ADB,118 74LVC374ADB,118 NXP USA Inc. 74LVC374A.pdf Description: IC FF D-TYPE SNGL 8BIT 20SSOP
Packaging: Tape & Reel (TR)
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74LVC374APW,118 74LVC374APW,118 NXP USA Inc. 74LVC374A.pdf Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Tape & Reel (TR)
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74HC4066DB,118 74HC4066DB,118 NXP USA Inc. 74HC_HCT4066.pdf Description: IC SWITCH QUAD 1X2 14SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 95Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-SSOP
Voltage - Supply, Single (V+): 2V ~ 10V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Switch Time (Ton, Toff) (Max): 30ns, 20ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Number of Circuits: 4
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SC16C850IBS/Q900,5 SC16C850IBS/Q900,5 NXP USA Inc. SC16C850.pdf Description: UART IC 1, UART CHANNEL RS485 12
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 1, UART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V ~ 3.3V
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
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KW47Z420B2AFTBR NXP USA Inc. KW47DS.pdf Description: KW47 AUTO HVQFN48
Packaging: Tape & Reel (TR)
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PEMI1QFN/WK,315 PEMI1QFN/WK,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 24dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 1
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PMDPB38UNE,115 PMDPB38UNE,115 NXP USA Inc. PMDPB38UNE.pdf Description: MOSFET 2N-CH 20V 4A 6HUSON
Packaging: Tape & Reel (TR)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 510mW
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 4A
Input Capacitance (Ciss) (Max) @ Vds: 268pF @ 10V
Rds On (Max) @ Id, Vgs: 46mOhm @ 3A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 4.4nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
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MPC8260AZUPIBB MPC8260AZUPIBB NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MFS2303BMBC5EP NXP USA Inc. FS23DS.pdf Description: FS2300
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.8V ~ 36V
Applications: System Basis Chip
Current - Supply: 8mA
Supplier Device Package: 48-HVQFN (7x7)
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SC33PF8100FPES NXP USA Inc. PF8100_PF8200.pdf Description: PMIC, 7 BUCK REG, 4 LDOS
Packaging: Tray
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TDA6101Q/N3,112 NXP USA Inc. Description: IC AMPLIFIER VIDEO OUT 9-SIL
Packaging: Tube
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MC9328MX21SCVKR2 MC9328MX21SCVKR2 NXP USA Inc. MC9328MX21S.pdf Description: IC MPU I.MX21 266MHZ 289LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 289-LFBGA (14x14)
USB: USB 1.x (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART
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PESD1CAN,215 PESD1CAN,215 NXP USA Inc. PESD1CAN.pdf Description: TVS DIODE 24VWM 70VC SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HC161N,652 74HC161N,652 NXP USA Inc. 74HC_HCT161_Dec_1990.pdf Description: IC BINARY COUNTER 4-BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-DIP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 48 MHz
Number of Bits per Element: 4
Produkt ist nicht verfügbar
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74HC191N,652 74HC191N,652 NXP USA Inc. 74HC_HCT191_Rev_Dec_1990.pdf Description: IC BINARY COUNTER 4-BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up, Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-DIP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 39 MHz
Number of Bits per Element: 4
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74HC191PW,112 74HC191PW,112 NXP USA Inc. 74HC191.pdf Description: IC 4BIT BINARY UP/DN CNT 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up, Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 39 MHz
Number of Bits per Element: 4
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74HC191DB,112 74HC191DB,112 NXP USA Inc. 74HC191.pdf Description: IC SYNC 4BIT BINARY UP/DN 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up, Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 39 MHz
Number of Bits per Element: 4
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PHE13003C,412 NXP USA Inc. PHE13003C.pdf Description: TRANS NPN 400V 1.5A SOT54
Packaging: Bulk
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1N4749A,113 1N4749A,113 NXP USA Inc. 1N4728A_SER.pdf Description: DIODE ZENER 24V 1W DO-41
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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HEF40106BTT,118 HEF40106BTT,118 NXP USA Inc. HEF40106B.pdf Description: IC HEX INVRTR SCHMTT TRGR14TSSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCXC141VLH MCXC141VLH NXP USA Inc. MCXC24XP64M48SF2.pdf Description: 48MHZ, CORTEX-M0+ 32 KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
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Mindestbestellmenge: 5
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BZV55-C47,115 NXP USA Inc. BZV55_SER.pdf Description: DIODE ZENER 47V 500MW LLDS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PESD5V0S2BT,215 PESD5V0S2BT,215 NXP USA Inc. PESD5V0S2BT.pdf Description: TVS DIODE 5VWM 14VC SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX6QAICPU1 NXP USA Inc. IMX6SRSFS.pdf Description: SABRE I.MX 6 EVAL BRD
Packaging: Tray
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A9
Utilized IC / Part: i.MX 6
Platform: SABRE
Produkt ist nicht verfügbar
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BAS40-04W,115 BAS40-04W,115 NXP USA Inc. PHGL-S-A0000721047-1.pdf?t.download=true&u=5oefqw Description: DIODE SCHOTTKY 40V 120MA SOT323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BSP62,115 NXP USA Inc. BSP62.pdf Description: TRANS PNP 80V 500MA SOT223
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HCT244D,653 74HCT244D,653 NXP USA Inc. 74HC_HCT244.pdf Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
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BSS87,115 BSS87.pdf
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 200V 400MA SOT89
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BCM62B,215 BCM62B.pdf
Hersteller: NXP USA Inc.
Description: TRANS PNP DBL 45V 100MA SOT-143B
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BT134-600E,127 BT134-600E.pdf
Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 600V 4A SOT82-3
Packaging: Tube
Produkt ist nicht verfügbar
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MC908QY2AMDTE MC68HLC908QY4.pdf
MC908QY2AMDTE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
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MC908QT1ACFQE MC68HC908QY4A.pdf
MC908QT1ACFQE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8DFN
Packaging: Tray
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-DFN-EP (4x4)
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HC166N,652 74HC%28T%29166_Rev3.pdf
74HC166N,652
Hersteller: NXP USA Inc.
Description: IC SR PUSH-PULL 8BIT 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-DIP
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74HC367D,652 74HC_HCT367.pdf
74HC367D,652
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERTING 6V 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
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74HC367D,653 74HC_HCT367.pdf
74HC367D,653
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERTING 6V 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
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74HC367DB,112 74HC_HCT367.pdf
74HC367DB,112
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 16-SSOP
Produkt ist nicht verfügbar
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P1016NSE5FFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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Z0109MA,412 DS_568_Z0109MA.pdf
Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 600V 1A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 10 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 8A, 8.5A
Voltage - Gate Trigger (Vgt) (Max): 1.3 V
Supplier Device Package: TO-92-3
Current - On State (It (RMS)) (Max): 1 A
Voltage - Off State: 600 V
Produkt ist nicht verfügbar
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Z0109NA,412 Z0109NA.pdf
Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 800V 1A TO92-3
Packaging: Bulk
Produkt ist nicht verfügbar
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PDTC114ET,235 PDTC114E_SERIES_10.pdf
PDTC114ET,235
Hersteller: NXP USA Inc.
Description: TRANS NPN 50V 100MA SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PDTC114ET,215 PDTC114E_SERIES_10.pdf
PDTC114ET,215
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 250MW TO236AB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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1N4746A,113 1N4728A_SER.pdf
1N4746A,113
Hersteller: NXP USA Inc.
Description: DIODE ZENER 18V 1W DO41
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC7447AHX1000LB MPC7447AEC.pdf
MC7447AHX1000LB
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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74HC14D,653 74HC_HCT14.pdf
74HC14D,653
Hersteller: NXP USA Inc.
Description: IC HEX INVERTER SCHM TRIG 14SOIC
Packaging: Tape & Reel (TR)
Features: Schmitt Trigger
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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TEA1738GT/N1,118 TEA1738GT.pdf
TEA1738GT/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 118kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature
Voltage - Start Up: 13.2 V
Power (Watts): 75 W
Produkt ist nicht verfügbar
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TEA1738GT/N1,118 TEA1738GT.pdf
TEA1738GT/N1,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 118kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature
Voltage - Start Up: 13.2 V
Power (Watts): 75 W
Produkt ist nicht verfügbar
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MC33910G5AC MC33910.pdf
MC33910G5AC
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Produkt ist nicht verfügbar
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LS2084ASN7TTB Download?colCode=LS2084A&amp;location=null
LS2084ASN7TTB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA (2)
Produkt ist nicht verfügbar
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MPC8536EBVTAVLA MPC8536E.pdf
MPC8536EBVTAVLA
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.5GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8536AVTAULA MPC8536E.pdf
MPC8536AVTAULA
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MFS2613HMDAAAD FS26_SDS.pdf
MFS2613HMDAAAD
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
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PBSS5140T,215 PBSS5140T.pdf
PBSS5140T,215
Hersteller: NXP USA Inc.
Description: TRANS PNP 40V 1A SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BZV55-C24,135 PHGLS22257-1.pdf?t.download=true&u=5oefqw
BZV55-C24,135
Hersteller: NXP USA Inc.
Description: DIODE ZENER 24V 500MW LLDS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HCT00D,652 74HC_HCT00.pdf
74HCT00D,652
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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74HCT00N,652 74HC_HCT00.pdf
74HCT00N,652
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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74LVC16245ADGG,112 74LVC_LVCH16245A.pdf
74LVC16245ADGG,112
Hersteller: NXP USA Inc.
Description: IC BUS TXRX TRI-ST 16BIT 48TSSOP
Packaging: Tube
Produkt ist nicht verfügbar
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74LVC374AD,118 74LVC374A.pdf
74LVC374AD,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74LVC374ABQ,115 74LVC374A.pdf
74LVC374ABQ,115
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20DHVQFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74LVC374AD,112 74LVC374A.pdf
74LVC374AD,112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Tube
Produkt ist nicht verfügbar
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74LVC374ADB,112 74LVC374A.pdf
74LVC374ADB,112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SSOP
Packaging: Tube
Produkt ist nicht verfügbar
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74LVC374ADB,118 74LVC374A.pdf
74LVC374ADB,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74LVC374APW,118 74LVC374A.pdf
74LVC374APW,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HC4066DB,118 74HC_HCT4066.pdf
74HC4066DB,118
Hersteller: NXP USA Inc.
Description: IC SWITCH QUAD 1X2 14SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 95Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-SSOP
Voltage - Supply, Single (V+): 2V ~ 10V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Switch Time (Ton, Toff) (Max): 30ns, 20ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Number of Circuits: 4
Produkt ist nicht verfügbar
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SC16C850IBS/Q900,5 SC16C850.pdf
SC16C850IBS/Q900,5
Hersteller: NXP USA Inc.
Description: UART IC 1, UART CHANNEL RS485 12
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 1, UART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V ~ 3.3V
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Produkt ist nicht verfügbar
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KW47Z420B2AFTBR KW47DS.pdf
Hersteller: NXP USA Inc.
Description: KW47 AUTO HVQFN48
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PEMI1QFN/WK,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/WK,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 24dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 1
Produkt ist nicht verfügbar
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PMDPB38UNE,115 PMDPB38UNE.pdf
PMDPB38UNE,115
Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 20V 4A 6HUSON
Packaging: Tape & Reel (TR)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 510mW
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 4A
Input Capacitance (Ciss) (Max) @ Vds: 268pF @ 10V
Rds On (Max) @ Id, Vgs: 46mOhm @ 3A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 4.4nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
Produkt ist nicht verfügbar
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MPC8260AZUPIBB MPC8260A.pdf
MPC8260AZUPIBB
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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MFS2303BMBC5EP FS23DS.pdf
Hersteller: NXP USA Inc.
Description: FS2300
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.8V ~ 36V
Applications: System Basis Chip
Current - Supply: 8mA
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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SC33PF8100FPES PF8100_PF8200.pdf
Hersteller: NXP USA Inc.
Description: PMIC, 7 BUCK REG, 4 LDOS
Packaging: Tray
Produkt ist nicht verfügbar
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TDA6101Q/N3,112
Hersteller: NXP USA Inc.
Description: IC AMPLIFIER VIDEO OUT 9-SIL
Packaging: Tube
Produkt ist nicht verfügbar
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MC9328MX21SCVKR2 MC9328MX21S.pdf
MC9328MX21SCVKR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX21 266MHZ 289LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 289-LFBGA (14x14)
USB: USB 1.x (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
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PESD1CAN,215 PESD1CAN.pdf
PESD1CAN,215
Hersteller: NXP USA Inc.
Description: TVS DIODE 24VWM 70VC SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HC161N,652 74HC_HCT161_Dec_1990.pdf
74HC161N,652
Hersteller: NXP USA Inc.
Description: IC BINARY COUNTER 4-BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-DIP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 48 MHz
Number of Bits per Element: 4
Produkt ist nicht verfügbar
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74HC191N,652 74HC_HCT191_Rev_Dec_1990.pdf
74HC191N,652
Hersteller: NXP USA Inc.
Description: IC BINARY COUNTER 4-BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up, Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-DIP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 39 MHz
Number of Bits per Element: 4
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74HC191PW,112 74HC191.pdf
74HC191PW,112
Hersteller: NXP USA Inc.
Description: IC 4BIT BINARY UP/DN CNT 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up, Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 39 MHz
Number of Bits per Element: 4
Produkt ist nicht verfügbar
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74HC191DB,112 74HC191.pdf
74HC191DB,112
Hersteller: NXP USA Inc.
Description: IC SYNC 4BIT BINARY UP/DN 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up, Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 39 MHz
Number of Bits per Element: 4
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PHE13003C,412 PHE13003C.pdf
Hersteller: NXP USA Inc.
Description: TRANS NPN 400V 1.5A SOT54
Packaging: Bulk
Produkt ist nicht verfügbar
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1N4749A,113 1N4728A_SER.pdf
1N4749A,113
Hersteller: NXP USA Inc.
Description: DIODE ZENER 24V 1W DO-41
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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HEF40106BTT,118 HEF40106B.pdf
HEF40106BTT,118
Hersteller: NXP USA Inc.
Description: IC HEX INVRTR SCHMTT TRGR14TSSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCXC141VLH MCXC24XP64M48SF2.pdf
MCXC141VLH
Hersteller: NXP USA Inc.
Description: 48MHZ, CORTEX-M0+ 32 KB LQFP64
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.84 EUR
10+2.84 EUR
25+2.6 EUR
160+2.26 EUR
Mindestbestellmenge: 5
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BZV55-C47,115 BZV55_SER.pdf
Hersteller: NXP USA Inc.
Description: DIODE ZENER 47V 500MW LLDS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PESD5V0S2BT,215 PESD5V0S2BT.pdf
PESD5V0S2BT,215
Hersteller: NXP USA Inc.
Description: TVS DIODE 5VWM 14VC SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX6QAICPU1 IMX6SRSFS.pdf
Hersteller: NXP USA Inc.
Description: SABRE I.MX 6 EVAL BRD
Packaging: Tray
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A9
Utilized IC / Part: i.MX 6
Platform: SABRE
Produkt ist nicht verfügbar
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BAS40-04W,115 PHGL-S-A0000721047-1.pdf?t.download=true&u=5oefqw
BAS40-04W,115
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 40V 120MA SOT323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BSP62,115 BSP62.pdf
Hersteller: NXP USA Inc.
Description: TRANS PNP 80V 500MA SOT223
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HCT244D,653 74HC_HCT244.pdf
74HCT244D,653
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
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