Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36598) > Seite 540 nach 610
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
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MFS2401AVBA1ES | NXP USA Inc. |
 Description: Safety Mini CAN FD SBCQualification: AEC-Q100 Grade: Automotive Supplier Device Package: 32-HVQFN (5x5) Applications: System Basis Chip Voltage - Supply: 5.5V ~ 40V Operating Temperature: -40°C ~ 115°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-VFQFN Exposed Pad Packaging: Tray |
auf Bestellung 127 Stücke: Lieferzeit 10-14 Tag (e) |
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MFS2621AMDABAD | NXP USA Inc. |
Description: SAFETY SYSTEM BASIS CHIP WITH LO Grade: Automotive Supplier Device Package: 48-LQFP-EP (7x7) Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
auf Bestellung 249 Stücke: Lieferzeit 10-14 Tag (e) |
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MFS2633AMBA0AD | NXP USA Inc. |
Description: SAFETY SYSTEM BASIS CHIP WITH LO Grade: Automotive Supplier Device Package: 48-LQFP-EP (7x7) Current - Supply: 29µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
auf Bestellung 213 Stücke: Lieferzeit 10-14 Tag (e) |
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MFS8610BMBA0ES | NXP USA Inc. |
Description: IC FS86 SYSTEM BASIS CHIP ASIL Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-QFN (7x7) Applications: Camera Voltage - Supply: 4.5V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Packaging: Tray |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
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MFS2613AMDA6AD | NXP USA Inc. |
Description: SAFETY SYSTEM BASIS CHIP WITH LO Grade: Automotive Supplier Device Package: 48-LQFP-EP (7x7) Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
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MFS2613AMDDCAD | NXP USA Inc. |
Description: SAFETY SYSTEM BASIS CHIP WITH LO Grade: Automotive Supplier Device Package: 48-LQFP-EP (7x7) Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
auf Bestellung 220 Stücke: Lieferzeit 10-14 Tag (e) |
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MFS8633BMDA0ES | NXP USA Inc. |
Description: IC FS86 SYSTEM BASIS CHIP ASIL Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-QFN (7x7) Applications: Camera Voltage - Supply: 4.5V ~ 36V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Packaging: Tray |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
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MFS8610BMDA0ES | NXP USA Inc. |
Description: IC FS86 SYSTEM BASIS CHIP ASIL Package / Case: 48-VFQFN Exposed Pad Packaging: Tray Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-QFN (7x7) Applications: Camera Voltage - Supply: 4.5V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
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MFS8613BMBA0ES | NXP USA Inc. |
Description: IC FS86 SYSTEM BASIS CHIP ASIL Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-QFN (7x7) Applications: Camera Voltage - Supply: 4.5V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Packaging: Tray |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
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| S9S12GN48J0VLH | NXP USA Inc. |
Description: S12 CORE,48K FLASH Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| MGD3162AM580EKR2 | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| MGD3162AM580EKT | NXP USA Inc. |
Description: IC Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 176 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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PVF60NN151CMK50 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 364BGA Core Size: 32-Bit Dual-Core Data Converters: A/D 12bit SAR; D/A 12bit Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C RAM Size: 1.5MB Speed: 500MHz Mounting Type: Surface Mount Package / Case: 364-LFBGA Packaging: Tray DigiKey Programmable: Not Verified Supplier Device Package: 364-LFBGA (17x17) Peripherals: DMA, LVD, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC9328MXLVP15 | NXP USA Inc. |
Description: IC MPU I.MXL 150MHZ 225MAPBGA Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART Display & Interface Controllers: LCD Graphics Acceleration: No RAM Controllers: SDRAM Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 1.x (1) Supplier Device Package: 225-MAPBGA (13x13) Voltage - I/O: 1.8V, 3.0V Core Processor: ARM920T Operating Temperature: 0°C ~ 70°C (TA) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 225-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S32K396EHT1MJBST | NXP USA Inc. |
Description: S32K396 Arm Cortex-M7 Packaging: Tray |
auf Bestellung 675 Stücke: Lieferzeit 10-14 Tag (e) |
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S32K394NHT1MJBSR | NXP USA Inc. |
Description: S32K394NHT1MJBSR Packaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 320MHz Program Memory Size: 4MB (4M x 8) RAM Size: 800K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 69x12b SAR, Sigma-Delta Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, QSPI, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 289-LFBGA (14x14) Grade: Automotive Number of I/O: 209 Qualification: AEC-Q100 |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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S32K396NHT1MJBSR | NXP USA Inc. |
Description: S32K396NHT1MJBSR Packaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 320MHz Program Memory Size: 6MB (6M x 8) RAM Size: 800K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 69x12b SAR, Sigma-Delta Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, QSPI, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 289-LFBGA (14x14) Grade: Automotive Number of I/O: 209 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S32K396EHT1MJBSR | NXP USA Inc. |
Description: S32K396EHT1MJBSR Packaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 320MHz Program Memory Size: 6MB (6M x 8) RAM Size: 800K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 69x12b SAR, Sigma-Delta Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 289-LFBGA (14x14) Grade: Automotive Number of I/O: 209 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MPC8245TVV266D | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 352TBGA Packaging: Tray Package / Case: 352-LBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC 603e Voltage - I/O: 3.3V Supplier Device Package: 352-TBGA (35x35) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Additional Interfaces: I2C, I²O, PCI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MPC8245TVV300D | NXP USA Inc. |
Description: IC MPU MPC82XX 300MHZ 352TBGA Additional Interfaces: I2C, I²O, PCI, UART Graphics Acceleration: No RAM Controllers: SDRAM Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 352-TBGA (35x35) Voltage - I/O: 3.3V Core Processor: PowerPC 603e Operating Temperature: -40°C ~ 105°C (TA) Speed: 300MHz Mounting Type: Surface Mount Package / Case: 352-LBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 24 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S9S12G48J0CLF | NXP USA Inc. |
Description: S12 CORE,64K FLASH,AU Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 48KB (48K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray Number of I/O: 40 Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 12x10b Core Processor: S12 EEPROM Size: 1.5K x 8 Program Memory Type: FLASH |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S9S12G64J0MLF | NXP USA Inc. |
Description: S12 CORE,64K FLASH,AU Number of I/O: 40 Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 12x10b Core Processor: S12 EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S9S12G48J0CLFR | NXP USA Inc. |
Description: S12 CORE,64K FLASH, EEPROM Size: 1.5K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 48KB (48K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tape & Reel (TR) Number of I/O: 40 Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 12x10b Core Processor: S12 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S9S12G64J0CLFR | NXP USA Inc. |
Description: S12 CORE,64K FLASH,AU Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S9S12G64J0CLF | NXP USA Inc. |
Description: S12 CORE,64K FLASH,AU Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S9S12G48J0MLFR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S9S12G48J0MLF | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MIMXRT555SFAWCR | NXP USA Inc. |
Description: IC MCU 32BIT 192KB ROM 141WLCSP DigiKey Programmable: Not Verified Number of I/O: 136 Supplier Device Package: 141-WLCSP (4.53x4.53) Peripherals: DMA, I2S, LCD, POR, PWM, WDT Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Dual-Core Data Converters: A/D 10x12b Core Processor: ARM® Cortex®-M33 Program Memory Type: ROM Oscillator Type: External, Internal Operating Temperature: -20°C ~ 70°C (TA) RAM Size: 5M x 8 Program Memory Size: 192KB (192K x 8) Speed: 200MHz Mounting Type: Surface Mount Package / Case: 141-XFBGA, WLCSP Packaging: Cut Tape (CT) |
auf Bestellung 5418 Stücke: Lieferzeit 10-14 Tag (e) |
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| MIMXRT555SFFOCR | NXP USA Inc. |
Description: IC MCU 32BIT 192KB ROM 249FOWLP Packaging: Cut Tape (CT) Package / Case: 249-WFBGA Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 192KB (192K x 8) RAM Size: 5M x 8 Operating Temperature: -20°C ~ 70°C (TA) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 249-FOWLP (7x7) Number of I/O: 136 DigiKey Programmable: Not Verified |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT595SFFOCR | NXP USA Inc. |
Description: IC MCU 32BIT 192KB ROM 249WFBGA Packaging: Cut Tape (CT) Package / Case: 249-WFBGA Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 192KB (192K x 8) RAM Size: 5M x 8 Operating Temperature: -20°C ~ 70°C (TA) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 249-FOWLP (7x7) Number of I/O: 136 DigiKey Programmable: Not Verified |
auf Bestellung 323 Stücke: Lieferzeit 10-14 Tag (e) |
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MCHC908GR8MFAE | NXP USA Inc. |
Description: IC MCU 8BIT 7.5KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 7.5KB (7.5K x 8) RAM Size: 384 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 32-LQFP (7x7) Number of I/O: 21 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SE051C2HQ1/Z01XDZ | NXP USA Inc. |
Description: SE051C2HQ1 Packaging: Tape & Reel (TR) Package / Case: 20-XFQFN Exposed Pad Mounting Type: Surface Mount Type: IoT Secure Element Supplier Device Package: 20-HX2QFN (3x3) |
auf Bestellung 42000 Stücke: Lieferzeit 10-14 Tag (e) |
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| MPF5301AMDA0ESR2 | NXP USA Inc. |
Description: IC REG BUCK ADJ 8A 24HWQFN Topology: Buck Voltage - Input (Max): 5.5V Frequency - Switching: 2MHz ~ 3MHz Output Configuration: Positive Operating Temperature: -40°C ~ 125°C (TA) Current - Output: 8A Function: Step-Down Number of Outputs: 1 Mounting Type: Surface Mount, Wettable Flank Output Type: Adjustable Package / Case: 24-PowerWFQFN Packaging: Tape & Reel (TR) Voltage - Output (Min/Fixed): 0.5V Voltage - Input (Min): 2.7V Voltage - Output (Max): 1.2V Synchronous Rectifier: No Supplier Device Package: 24-HWQFN (4.5x3.5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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PCAL9722HN-ARD | NXP USA Inc. |
Description: PCAL9722HN-ARD Utilized IC / Part: PCAL9722 Contents: Board(s) Type: Interface Function: I/O Expansion Packaging: Bulk |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MFS2321BMBB2EPR2 | NXP USA Inc. |
Description: MFS2321BMBB2EPR2 Supplier Device Package: 48-HVQFN (7x7) Applications: System Basis Chip Voltage - Supply: 5.5V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MFS2321BMBB2EP | NXP USA Inc. |
Description: MFS2321BMBB2EP Supplier Device Package: 48-HVQFN (7x7) Applications: System Basis Chip Voltage - Supply: 5.5V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| NCF295GVHN7/0501YY | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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PN5190B2HN/C131Y | NXP USA Inc. |
Description: PN5190B2HN/C131Y Supplier Device Package: 40-VFLGA (5x5) Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC Voltage - Supply: 2.4V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Type: RFID Reader/Transponder Interface: I2C, SPI, USB Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: 40-VFLGA Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PN5190B1HN/C127Y | NXP USA Inc. |
Description: PN5190B1HN/C127Y Supplier Device Package: 40-VFLGA (5x5) Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC Voltage - Supply: 2.4V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Type: RFID Reader/Transponder Interface: I2C, SPI, USB Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: 40-VFLGA Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PN5190B2EV/C131Y | NXP USA Inc. |
Description: PN5190B2EV/C131Y Supplier Device Package: 64-VFBGA (4.5x4.5) Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC Voltage - Supply: 2.4V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Type: RFID Reader/Transponder Interface: I2C, SPI, USB Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: 64-VFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PN5190B1EV/C127Y | NXP USA Inc. |
Description: PN5190B1EV/C127Y Supplier Device Package: 64-VFBGA (4.5x4.5) Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC Voltage - Supply: 2.4V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Type: RFID Reader/Transponder Interface: I2C, SPI, USB Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: 64-VFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PN5190B2HN/C131K | NXP USA Inc. |
Description: PN5190B2HN/C131K Supplier Device Package: 40-VFLGA (5x5) Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC Voltage - Supply: 2.4V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Type: RFID Reader/Transponder Interface: I2C, SPI, USB Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: 40-VFLGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| PN5190B2EV/C131K | NXP USA Inc. |
Description: PN5190B2EV/C131K Supplier Device Package: 64-VFBGA (4.5x4.5) Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC Voltage - Supply: 2.4V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Type: RFID Reader/Transponder Interface: I2C, SPI, USB Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: 64-VFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| PN5190B1EV/C127K | NXP USA Inc. |
Description: PN5190B1EV/C127K Supplier Device Package: 64-VFBGA (4.5x4.5) Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC Voltage - Supply: 2.4V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Type: RFID Reader/Transponder Interface: I2C, SPI, USB Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: 64-VFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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|
PN7642EV/C101K | NXP USA Inc. |
Description: PN7642EV/C101K Packaging: Tray Package / Case: 64-VFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART, USB Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.4V ~ 5.5V Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC Supplier Device Package: 64-VFBGA (4.5x4.5) |
auf Bestellung 1650 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S12G64F0WLF | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Data Converters: A/D 12x10b Core Processor: 12V1 EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 40 Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
LPC54605J256BD100E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP DigiKey Programmable: Not Verified Number of I/O: 64 Supplier Device Package: 100-LQFP (14x14) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: I2C, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 12x12b Core Processor: ARM® Cortex®-M4 EEPROM Size: 16K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 136K x 8 Program Memory Size: 256KB (256K x 8) Speed: 180MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 90 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| LFVBBOM67W1A | NXP USA Inc. |
Description: QORIVVA MPC5567 422 PIN 1.0MM VE Accessory Type: Base Board For Use With/Related Products: MPC5567 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| LFVBBOM67U2A | NXP USA Inc. |
Description: QORIVVA MPC5567 330 PIN 1.0MM VE Accessory Type: Base Board For Use With/Related Products: MPC5567 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| LFVBBOM65U2A | NXP USA Inc. |
Description: QORIVVA MPC5565 330 PIN 1.0MM VE Accessory Type: Base Board For Use With/Related Products: MPC5565 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| MIMXRT1024CAG4B | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 396MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 19x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 90 |
auf Bestellung 55 Stücke: Lieferzeit 10-14 Tag (e) |
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| PIMX9131CVVXJAA | NXP USA Inc. |
Description: PIMX9131CVVXJAA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 176 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
B4860NSE7QUMD | NXP USA Inc. |
Description: IC MPU QORIQ 1.8GHZ 1020FCPBGA Packaging: Box Package / Case: 1020-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Supplier Device Package: 1020-FCPBGA (33x33) Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 24 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| FS32K144UAT0VLFR | NXP USA Inc. |
Description: S32K144 ARM CORTEX-M4F, 112 MHZ, Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
MK22FN128VLH10R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 128KB (128K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 22x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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|
MK22FN128VLH10R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 128KB (128K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 22x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 40 DigiKey Programmable: Not Verified |
auf Bestellung 1188 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE14Z256VLH7R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Peripherals: DMA, LVD, PWM, WDT Connectivity: FlexIO, I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 16x12b; D/A 1x8b Core Processor: ARM® Cortex®-M0+ EEPROM Size: 34K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 72MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 58 Supplier Device Package: 64-LQFP (10x10) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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|
MKE14Z256VLH7R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 34K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
auf Bestellung 1448 Stücke: Lieferzeit 10-14 Tag (e) |
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| MFS2633AMDAHADR2 | NXP USA Inc. |
Description: MFS2633AMDAHADR2 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| MC33FS6527NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH |
| MFS2401AVBA1ES |
|
Hersteller: NXP USA Inc.
Description: Safety Mini CAN FD SBC
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 32-HVQFN (5x5)
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 115°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Description: Safety Mini CAN FD SBC
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 32-HVQFN (5x5)
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 115°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 127 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.65 EUR |
| 10+ | 7.37 EUR |
| 25+ | 6.79 EUR |
| 100+ | 6.16 EUR |
| MFS2621AMDABAD |
|
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 249 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.16 EUR |
| 10+ | 11.76 EUR |
| 25+ | 10.91 EUR |
| 100+ | 9.97 EUR |
| MFS2633AMBA0AD |
|
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 29µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 29µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 213 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.62 EUR |
| 10+ | 12.13 EUR |
| 25+ | 11.26 EUR |
| 100+ | 10.29 EUR |
| MFS8610BMBA0ES |
|
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-QFN (7x7)
Applications: Camera
Voltage - Supply: 4.5V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-QFN (7x7)
Applications: Camera
Voltage - Supply: 4.5V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 14.41 EUR |
| 10+ | 11.15 EUR |
| 25+ | 10.33 EUR |
| 100+ | 9.44 EUR |
| 260+ | 9 EUR |
| MFS2613AMDA6AD |
|
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.09 EUR |
| 10+ | 12.5 EUR |
| 25+ | 11.6 EUR |
| MFS2613AMDDCAD |
|
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 220 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.09 EUR |
| 10+ | 12.5 EUR |
| 25+ | 11.6 EUR |
| 100+ | 10.61 EUR |
| MFS8633BMDA0ES |
|
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-QFN (7x7)
Applications: Camera
Voltage - Supply: 4.5V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-QFN (7x7)
Applications: Camera
Voltage - Supply: 4.5V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.58 EUR |
| 10+ | 12.09 EUR |
| 25+ | 11.21 EUR |
| 100+ | 10.26 EUR |
| 260+ | 9.78 EUR |
| MFS8610BMDA0ES |
|
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-QFN (7x7)
Applications: Camera
Voltage - Supply: 4.5V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-QFN (7x7)
Applications: Camera
Voltage - Supply: 4.5V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.87 EUR |
| 10+ | 12.33 EUR |
| 25+ | 11.44 EUR |
| 100+ | 10.46 EUR |
| MFS8613BMBA0ES |
|
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-QFN (7x7)
Applications: Camera
Voltage - Supply: 4.5V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-QFN (7x7)
Applications: Camera
Voltage - Supply: 4.5V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.34 EUR |
| 10+ | 12.7 EUR |
| 25+ | 11.78 EUR |
| 100+ | 10.78 EUR |
| 260+ | 10.28 EUR |
| S9S12GN48J0VLH |
Hersteller: NXP USA Inc.
Description: S12 CORE,48K FLASH
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Description: S12 CORE,48K FLASH
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MGD3162AM580EKR2 |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MGD3162AM580EKT |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 176 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PVF60NN151CMK50 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 364BGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 12bit SAR; D/A 12bit
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C
RAM Size: 1.5MB
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Supplier Device Package: 364-LFBGA (17x17)
Peripherals: DMA, LVD, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Description: IC MCU 32BIT ROMLESS 364BGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 12bit SAR; D/A 12bit
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C
RAM Size: 1.5MB
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Supplier Device Package: 364-LFBGA (17x17)
Peripherals: DMA, LVD, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9328MXLVP15 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MXL 150MHZ 225MAPBGA
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Display & Interface Controllers: LCD
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Supplier Device Package: 225-MAPBGA (13x13)
Voltage - I/O: 1.8V, 3.0V
Core Processor: ARM920T
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 225-LFBGA
Packaging: Tray
Description: IC MPU I.MXL 150MHZ 225MAPBGA
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Display & Interface Controllers: LCD
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Supplier Device Package: 225-MAPBGA (13x13)
Voltage - I/O: 1.8V, 3.0V
Core Processor: ARM920T
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 225-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
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| S32K396EHT1MJBST |
|
auf Bestellung 675 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 90.04 EUR |
| 10+ | 73.77 EUR |
| 25+ | 69.71 EUR |
| 100+ | 65.25 EUR |
| 250+ | 63.12 EUR |
| S32K394NHT1MJBSR |
|
Hersteller: NXP USA Inc.
Description: S32K394NHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Description: S32K394NHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1000+ | 44.55 EUR |
| S32K396NHT1MJBSR |
|
Hersteller: NXP USA Inc.
Description: S32K396NHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Description: S32K396NHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| S32K396EHT1MJBSR |
|
Hersteller: NXP USA Inc.
Description: S32K396EHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Description: S32K396EHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| MPC8245TVV266D |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Description: IC MPU MPC82XX 266MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8245TVV300D |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 352TBGA
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
Description: IC MPU MPC82XX 300MHZ 352TBGA
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 24 Stücke
Im Einkaufswagen
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| S9S12G48J0CLF |
Hersteller: NXP USA Inc.
Description: S12 CORE,64K FLASH,AU
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Description: S12 CORE,64K FLASH,AU
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
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| S9S12G64J0MLF |
Hersteller: NXP USA Inc.
Description: S12 CORE,64K FLASH,AU
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: S12 CORE,64K FLASH,AU
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
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| S9S12G48J0CLFR |
Hersteller: NXP USA Inc.
Description: S12 CORE,64K FLASH,
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
Description: S12 CORE,64K FLASH,
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
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| S9S12G64J0CLFR |
Hersteller: NXP USA Inc.
Description: S12 CORE,64K FLASH,AU
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: S12 CORE,64K FLASH,AU
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| S9S12G64J0CLF |
Hersteller: NXP USA Inc.
Description: S12 CORE,64K FLASH,AU
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: S12 CORE,64K FLASH,AU
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
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| S9S12G48J0MLFR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| S9S12G48J0MLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
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| MIMXRT555SFAWCR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 141WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 136
Supplier Device Package: 141-WLCSP (4.53x4.53)
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: -20°C ~ 70°C (TA)
RAM Size: 5M x 8
Program Memory Size: 192KB (192K x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 141-XFBGA, WLCSP
Packaging: Cut Tape (CT)
Description: IC MCU 32BIT 192KB ROM 141WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 136
Supplier Device Package: 141-WLCSP (4.53x4.53)
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: -20°C ~ 70°C (TA)
RAM Size: 5M x 8
Program Memory Size: 192KB (192K x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 141-XFBGA, WLCSP
Packaging: Cut Tape (CT)
auf Bestellung 5418 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 38.56 EUR |
| 10+ | 30.83 EUR |
| 25+ | 28.91 EUR |
| 100+ | 26.79 EUR |
| 250+ | 25.79 EUR |
| 500+ | 25.17 EUR |
| MIMXRT555SFFOCR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 249FOWLP
Packaging: Cut Tape (CT)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 192KB ROM 249FOWLP
Packaging: Cut Tape (CT)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 53.13 EUR |
| 10+ | 42.61 EUR |
| 100+ | 36.39 EUR |
| 500+ | 35.91 EUR |
| MIMXRT595SFFOCR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 249WFBGA
Packaging: Cut Tape (CT)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 192KB ROM 249WFBGA
Packaging: Cut Tape (CT)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 323 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 53.47 EUR |
| 10+ | 43.13 EUR |
| 25+ | 40.54 EUR |
| 100+ | 38.28 EUR |
| MCHC908GR8MFAE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 7.5KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 7.5KB (7.5K x 8)
RAM Size: 384 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 7.5KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 7.5KB (7.5K x 8)
RAM Size: 384 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SE051C2HQ1/Z01XDZ |
|
Hersteller: NXP USA Inc.
Description: SE051C2HQ1
Packaging: Tape & Reel (TR)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: IoT Secure Element
Supplier Device Package: 20-HX2QFN (3x3)
Description: SE051C2HQ1
Packaging: Tape & Reel (TR)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: IoT Secure Element
Supplier Device Package: 20-HX2QFN (3x3)
auf Bestellung 42000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3000+ | 6.15 EUR |
| MPF5301AMDA0ESR2 |
|
Hersteller: NXP USA Inc.
Description: IC REG BUCK ADJ 8A 24HWQFN
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 2MHz ~ 3MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output: 8A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount, Wettable Flank
Output Type: Adjustable
Package / Case: 24-PowerWFQFN
Packaging: Tape & Reel (TR)
Voltage - Output (Min/Fixed): 0.5V
Voltage - Input (Min): 2.7V
Voltage - Output (Max): 1.2V
Synchronous Rectifier: No
Supplier Device Package: 24-HWQFN (4.5x3.5)
Description: IC REG BUCK ADJ 8A 24HWQFN
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 2MHz ~ 3MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output: 8A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount, Wettable Flank
Output Type: Adjustable
Package / Case: 24-PowerWFQFN
Packaging: Tape & Reel (TR)
Voltage - Output (Min/Fixed): 0.5V
Voltage - Input (Min): 2.7V
Voltage - Output (Max): 1.2V
Synchronous Rectifier: No
Supplier Device Package: 24-HWQFN (4.5x3.5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
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| PCAL9722HN-ARD |
|
Hersteller: NXP USA Inc.
Description: PCAL9722HN-ARD
Utilized IC / Part: PCAL9722
Contents: Board(s)
Type: Interface
Function: I/O Expansion
Packaging: Bulk
Description: PCAL9722HN-ARD
Utilized IC / Part: PCAL9722
Contents: Board(s)
Type: Interface
Function: I/O Expansion
Packaging: Bulk
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 138.78 EUR |
| MFS2321BMBB2EPR2 |
|
Hersteller: NXP USA Inc.
Description: MFS2321BMBB2EPR2
Supplier Device Package: 48-HVQFN (7x7)
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: MFS2321BMBB2EPR2
Supplier Device Package: 48-HVQFN (7x7)
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MFS2321BMBB2EP |
|
Hersteller: NXP USA Inc.
Description: MFS2321BMBB2EP
Supplier Device Package: 48-HVQFN (7x7)
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Description: MFS2321BMBB2EP
Supplier Device Package: 48-HVQFN (7x7)
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NCF295GVHN7/0501YY |
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PN5190B2HN/C131Y |
|
Hersteller: NXP USA Inc.
Description: PN5190B2HN/C131Y
Supplier Device Package: 40-VFLGA (5x5)
Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC
Voltage - Supply: 2.4V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 40-VFLGA Exposed Pad
Packaging: Tape & Reel (TR)
Description: PN5190B2HN/C131Y
Supplier Device Package: 40-VFLGA (5x5)
Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC
Voltage - Supply: 2.4V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 40-VFLGA Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
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Stück im Wert von UAH
| PN5190B1HN/C127Y |
|
Hersteller: NXP USA Inc.
Description: PN5190B1HN/C127Y
Supplier Device Package: 40-VFLGA (5x5)
Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC
Voltage - Supply: 2.4V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 40-VFLGA Exposed Pad
Packaging: Tape & Reel (TR)
Description: PN5190B1HN/C127Y
Supplier Device Package: 40-VFLGA (5x5)
Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC
Voltage - Supply: 2.4V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 40-VFLGA Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PN5190B2EV/C131Y |
|
Hersteller: NXP USA Inc.
Description: PN5190B2EV/C131Y
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC
Voltage - Supply: 2.4V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Tape & Reel (TR)
Description: PN5190B2EV/C131Y
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC
Voltage - Supply: 2.4V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PN5190B1EV/C127Y |
|
Hersteller: NXP USA Inc.
Description: PN5190B1EV/C127Y
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC
Voltage - Supply: 2.4V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Tape & Reel (TR)
Description: PN5190B1EV/C127Y
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC
Voltage - Supply: 2.4V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PN5190B2HN/C131K |
|
Hersteller: NXP USA Inc.
Description: PN5190B2HN/C131K
Supplier Device Package: 40-VFLGA (5x5)
Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC
Voltage - Supply: 2.4V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 40-VFLGA Exposed Pad
Packaging: Tray
Description: PN5190B2HN/C131K
Supplier Device Package: 40-VFLGA (5x5)
Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC
Voltage - Supply: 2.4V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 40-VFLGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PN5190B2EV/C131K |
|
Hersteller: NXP USA Inc.
Description: PN5190B2EV/C131K
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC
Voltage - Supply: 2.4V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Tray
Description: PN5190B2EV/C131K
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC
Voltage - Supply: 2.4V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 2450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PN5190B1EV/C127K |
|
Hersteller: NXP USA Inc.
Description: PN5190B1EV/C127K
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC
Voltage - Supply: 2.4V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Tray
Description: PN5190B1EV/C127K
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC
Voltage - Supply: 2.4V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 2450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PN7642EV/C101K |
|
Hersteller: NXP USA Inc.
Description: PN7642EV/C101K
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Description: PN7642EV/C101K
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
auf Bestellung 1650 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 22.99 EUR |
| 10+ | 19.98 EUR |
| 25+ | 18.93 EUR |
| 100+ | 17.49 EUR |
| 250+ | 16.64 EUR |
| 500+ | 16.03 EUR |
| S9S12G64F0WLF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LPC54605J256BD100E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LFVBBOM67W1A |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5567 422 PIN 1.0MM VE
Accessory Type: Base Board
For Use With/Related Products: MPC5567
Packaging: Bulk
Description: QORIVVA MPC5567 422 PIN 1.0MM VE
Accessory Type: Base Board
For Use With/Related Products: MPC5567
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFVBBOM67U2A |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5567 330 PIN 1.0MM VE
Accessory Type: Base Board
For Use With/Related Products: MPC5567
Packaging: Bulk
Description: QORIVVA MPC5567 330 PIN 1.0MM VE
Accessory Type: Base Board
For Use With/Related Products: MPC5567
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFVBBOM65U2A |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5565 330 PIN 1.0MM VE
Accessory Type: Base Board
For Use With/Related Products: MPC5565
Packaging: Bulk
Description: QORIVVA MPC5565 330 PIN 1.0MM VE
Accessory Type: Base Board
For Use With/Related Products: MPC5565
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT1024CAG4B |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 396MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 90
Description: IC MCU 32BIT 4MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 396MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 90
auf Bestellung 55 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 23.75 EUR |
| 10+ | 21.99 EUR |
| 25+ | 21.49 EUR |
| PIMX9131CVVXJAA |
Produkt ist nicht verfügbar
Mindestbestellmenge: 176 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| B4860NSE7QUMD |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 1020FCPBGA
Packaging: Box
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Description: IC MPU QORIQ 1.8GHZ 1020FCPBGA
Packaging: Box
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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| FS32K144UAT0VLFR |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| MK22FN128VLH10R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MK22FN128VLH10R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 1188 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.5 EUR |
| 10+ | 8.83 EUR |
| 25+ | 8.16 EUR |
| 100+ | 7.43 EUR |
| 250+ | 7.09 EUR |
| MKE14Z256VLH7R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Peripherals: DMA, LVD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 34K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Peripherals: DMA, LVD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 34K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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| MKE14Z256VLH7R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 34K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 34K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 1448 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.77 EUR |
| 10+ | 7.32 EUR |
| 25+ | 7.14 EUR |
| 100+ | 6.99 EUR |
| 250+ | 6.66 EUR |
| 500+ | 6.37 EUR |
| MFS2633AMDAHADR2 |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| MC33FS6527NAER2 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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