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S32G254ASBK0VUCR S32G254ASBK0VUCR NXP USA Inc. S32G2.pdf Description: S32G254A ARM CORTEX-M7 AND -A53,
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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S9S12G64J0MLHR S9S12G64J0MLHR NXP USA Inc. Description: S12 CORE 64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
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S9S12G48J0MLHR S9S12G48J0MLHR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
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TEA19162HT/2J TEA19162HT/2J NXP USA Inc. TEA19162T.pdf Description: IC PFC CONTROLLER SO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Current - Startup: 800 µA
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TEA19162HT/2J TEA19162HT/2J NXP USA Inc. TEA19162T.pdf Description: IC PFC CONTROLLER SO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Current - Startup: 800 µA
Produkt ist nicht verfügbar
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P3T1035DUKAZ P3T1035DUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T1035DUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
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500+0.9 EUR
1000+0.87 EUR
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MC35FS6500NAE MC35FS6500NAE NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MGD3160AM338EKR2 NXP USA Inc. PB_GD3160.pdf Description: GATE DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: IGBT, SiC MOSFET
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
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74ABT16240ADL,118 74ABT16240ADL,118 NXP USA Inc. 74ABT16240A.pdf Description: IC BUFFER INVERT 5.5V 48SSOP
Packaging: Bulk
auf Bestellung 2000 Stücke:
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PCA9420BSAZ PCA9420BSAZ NXP USA Inc. PCA9420.pdf Description: PCA9420BS
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Current - Supply: 4.5µA
Supplier Device Package: 24-HVQFN (3x3)
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PCA9420BSAZ PCA9420BSAZ NXP USA Inc. PCA9420.pdf Description: PCA9420BS
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Current - Supply: 4.5µA
Supplier Device Package: 24-HVQFN (3x3)
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MC33665ATF4AER2 MC33665ATF4AER2 NXP USA Inc. MC33665A_SDS.pdf Description: HIGH SPEED TRANSCEIVER WITH CAN
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: CAN, I2C
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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100+10.64 EUR
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MKM35Z512VLQ7R MKM35Z512VLQ7R NXP USA Inc. KM35P144M75SF0.pdf Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 99
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MC68LC302CAF20CT MC68LC302CAF20CT NXP USA Inc. MC68LC302.pdf Description: IC MPU M683XX 20MHZ 100LQFP
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 100-LQFP (14x14)
Voltage - I/O: 5.0V
Core Processor: M68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
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P3S0210BQAZ P3S0210BQAZ NXP USA Inc. P3S0210BQ.pdf Description: IC BUS SW 1X2:1/1X1:2 14-DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 2:1, 1 x 1:2
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.72V ~ 3.63V
Independent Circuits: 1
Current - Output High, Low: 10µA, 10µA
Voltage Supply Source: Single Supply
Supplier Device Package: 14-DHVQFN (2.5x3)
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S9S08LG32J0CLK S9S08LG32J0CLK NXP USA Inc. MC9S08LG32.pdf Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
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PEMI4QFN/LM,132 PEMI4QFN/LM,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHMS ESD SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 4
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SPC5645BK0VLT1 SPC5645BK0VLT1 NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
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FRDM-22XSDBEVB NXP USA Inc. MC22XS4200.pdf Description: EVAL BOARD FOR MC22XS4200
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC22XS4200
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
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LFBDMPGMR NXP USA Inc. Description: BDM FLASH PROGRAMMER FOR HCS08,
Packaging: Bulk
For Use With/Related Products: HC12, HCS08, HCS12, HCS12X
Type: Programmer
Contents: Board(s), Cable(s), Power Supply, Accessories
Produkt ist nicht verfügbar
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MPL3150A2ST1 MPL3150A2ST1 NXP USA Inc. MPL3115A2.pdf Description: IC BAR SENSOR 150KPA HORIZON 8TS
Packaging: Tape & Reel (TR)
Package / Case: 8-TLGA
Mounting Type: Surface Mount
Supplier Device Package: 8-LGA (3x5)
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SPC5200CVR400B SPC5200CVR400B NXP USA Inc. MPC5200BDS.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
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SPC5200CVR400BR2 SPC5200CVR400BR2 NXP USA Inc. MPC5200BDS.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
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NXH3675UK/A1Z NXP USA Inc. NXH3675A4FS.pdf Description: NXH3675UK
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NHS3100THADADKUL NXP USA Inc. NHS3100.pdf Description: NHS3100 THERAPY ADK
Packaging: Bulk
For Use With/Related Products: NHS3100
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: NHS3100
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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MFS8601BMBA0ESR2 MFS8601BMBA0ESR2 NXP USA Inc. FS8600_SDS.pdf Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MFS8601BMBA0ES MFS8601BMBA0ES NXP USA Inc. Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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BGU8823/AY NXP USA Inc. Description: BGU8823
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: 5G, CDMA, FDD, GSM, LTE, TDD, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 19dB
Current - Supply: 57mA
Noise Figure: 2.9dB
P1dB: 37.2dBm
Test Frequency: 2.3GHz
Supplier Device Package: 44-HVLGA (5x5)
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BGU8822/AY NXP USA Inc. Description: BGU8822
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.2GHz
RF Type: 5G, CDMA, FDD, GSM, LTE, TDD, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 22.2dB
Current - Supply: 57mA
Noise Figure: 2.3dB
P1dB: 36.3dBm
Test Frequency: 1.7GHz
Supplier Device Package: 44-HVLGA (5x5)
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BGU8821/AY NXP USA Inc. Description: BGU8821
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 700MHz ~ 1GHz
RF Type: 5G, CDMA, FDD, GSM, LTE, TDD, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 24.4dB
Current - Supply: 57mA
Noise Figure: 1.7dB
P1dB: 35.2dB
Test Frequency: 700MHz ~ 850MHz
Supplier Device Package: 44-HVLGA (5x5)
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LPC11E11FHN33/101, LPC11E11FHN33/101, NXP USA Inc. LPC11E3X.pdf Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
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74LVC169PW,112 74LVC169PW,112 NXP USA Inc. 74LVC169.pdf Description: IC BINARY COUNTER 4-BIT 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Operating Temperature: -40°C ~ 125°C
Direction: Up, Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2.7 V ~ 3.6 V
Count Rate: 150 MHz
Number of Bits per Element: 4
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1600+0.4 EUR
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MCF51JE256VML NXP USA Inc. MCF51JE256.pdf Description: IC MCU 32B 256KB FLASH 104MAPBGA
Packaging: Box
Package / Case: 104-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 104-MAPBGA (10x10)
Number of I/O: 69
DigiKey Programmable: Not Verified
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PCA9440HE-Q100Z NXP USA Inc. Description: IC GATE DRVR HALF-BRIDGE 18HUQFN
Packaging: Tape & Reel (TR)
Package / Case: 18-PowerUFQFN
Mounting Type: Surface Mount
Supplier Device Package: 18-HUQFN (2.6x2.6)
Driven Configuration: Half-Bridge
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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74AHCT3G14GD,125 74AHCT3G14GD,125 NXP USA Inc. 74AHC_AHCT3G14.pdf Description: IC INV SCHMITT TRIGGER 8-XSON
Packaging: Bulk
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74HCT3G14GD,125 74HCT3G14GD,125 NXP USA Inc. PHGLS29087-1.pdf?t.download=true&u=5oefqw Description: IC INVERT SCHMITT 3CH 3INP 8XSON
Current - Quiescent (Max): 1 µA
Number of Circuits: 3
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Input Logic Level - Low: 0.5V ~ 0.6V
Input Logic Level - High: 1.9V ~ 2.1V
Supplier Device Package: 8-XSON (2x3)
Number of Inputs: 3
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Features: Schmitt Trigger
Packaging: Bulk
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74AUP3G14GSX 74AUP3G14GSX NXP USA Inc. 74AUP3G14.pdf Description: IC INVERT SCHMITT 3CH 3INP 8XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 8-XSON (1.35x1)
Input Logic Level - High: 0.6V ~ 2.29V
Input Logic Level - Low: 0.1V ~ 0.88V
Max Propagation Delay @ V, Max CL: 6.1ns @ 3.3V, 30pF
Number of Circuits: 3
Current - Quiescent (Max): 500 nA
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LFTAA1C NXP USA Inc. Description: 8 PIN 0.8MM DFN TARGET ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - DFN
Produkt ist nicht verfügbar
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LFJ76DBGWSA NXP USA Inc. Description: QORIVVA MPC5676 416 PIN 1.0MM CA
Module/Board Type: Socket Adapter
For Use With/Related Products: MPC5676
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1027T/20/2Z TJA1027T/20/2Z NXP USA Inc. TJA1027.pdf Description: IC TRANSCEIVER 1/1 8SO
Qualification: AEC-Q100
Grade: Automotive
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SO
Protocol: LIN
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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250+1 EUR
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SAF4000EL/102Z225Y NXP USA Inc. Description: SAF4000EL
Packaging: Tape & Reel (TR)
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SAF4000EL/102Z225K NXP USA Inc. Description: SAF4000EL
Packaging: Tray
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MC56F81768LMLH NXP USA Inc. MC56F81XXXL.pdf Description: IC
Supplier Device Package: 64-LQFP (10x10)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 20kB
Non-Volatile Memory: FLASH (128kB)
Operating Temperature: -40°C ~ 125°C (TA)
Type: Digital Signal Controllers
Interface: DMA, I2C, LINbus, SCI, QSPI
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
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TEA1792TS/1Z TEA1792TS/1Z NXP USA Inc. TEA1792TS.pdf Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 8.5V ~ 38V
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: SC-74
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NCF3320EHN/0SY NXP USA Inc. Description: NCF3320EHN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, RS 232
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18092, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPC5554MVR80 MPC5554MVR80 NXP USA Inc. MPC5554.pdf Description: MPC5554MVR80
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Bulk
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MPC5554MZP112 MPC5554MZP112 NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 416PBGA
DigiKey Programmable: Not Verified
Number of I/O: 256
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tray
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LFVBBOM54W1A NXP USA Inc. Description: QORIVVA MPC5554 422 PIN 1.0MM VE
Utilized IC / Part: MPC5554
Accessory Type: Base Board
For Use With/Related Products: MPC5554
Packaging: Bulk
Produkt ist nicht verfügbar
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MC33FS8530A1KS MC33FS8530A1KS NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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PCA9600DPZ PCA9600DPZ NXP USA Inc. PCA9600.pdf Description: IC REDRIVER I2C 1CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 100ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 15V
Applications: I2C
Current - Supply: 5.5mA
Data Rate (Max): 1MHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 10 pF
auf Bestellung 6742 Stücke:
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10+5.08 EUR
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S9S12G128AMLHR S9S12G128AMLHR NXP USA Inc. S12GFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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S9S12G128AMLHR S9S12G128AMLHR NXP USA Inc. S12GFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.24 EUR
10+10.24 EUR
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100+8.67 EUR
250+8.28 EUR
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LPC5534JHI48/00MP LPC5534JHI48/00MP NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
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Lieferzeit 10-14 Tag (e)
2+10.84 EUR
10+9.89 EUR
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MFS8603BMBA0ESR2 MFS8603BMBA0ESR2 NXP USA Inc. FS8600_SDS.pdf Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HVQFN (7x7)
Applications: Camera
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC33FS4507CAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Produkt ist nicht verfügbar
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MC35FS4506CAER2 NXP USA Inc. 35FS4500-35FS6500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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MC33FS8510C4ESR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: PMIC, SAFETY, 2 BUCKS
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 4000 Stücke
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SPC5602BK0VLL4R SPC5602BK0VLL4R NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
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SPC5603BK0CLQ4R SPC5603BK0CLQ4R NXP USA Inc. Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FH32K146HFT0MLQR NXP USA Inc. Description: S32K146, M4F, FLASH 1M, RAM 128K
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S32G254ASBK0VUCR S32G2.pdf
S32G254ASBK0VUCR
Hersteller: NXP USA Inc.
Description: S32G254A ARM CORTEX-M7 AND -A53,
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S9S12G64J0MLHR
S9S12G64J0MLHR
Hersteller: NXP USA Inc.
Description: S12 CORE 64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Produkt ist nicht verfügbar
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S9S12G48J0MLHR
S9S12G48J0MLHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Produkt ist nicht verfügbar
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TEA19162HT/2J TEA19162T.pdf
TEA19162HT/2J
Hersteller: NXP USA Inc.
Description: IC PFC CONTROLLER SO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Current - Startup: 800 µA
Produkt ist nicht verfügbar
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TEA19162HT/2J TEA19162T.pdf
TEA19162HT/2J
Hersteller: NXP USA Inc.
Description: IC PFC CONTROLLER SO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Current - Startup: 800 µA
Produkt ist nicht verfügbar
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P3T1035DUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T1035DUKAZ
Hersteller: NXP USA Inc.
Description: P3T1035DUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
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AnzahlPreis
13+1.41 EUR
15+1.23 EUR
16+1.17 EUR
25+1.09 EUR
50+1.04 EUR
100+0.99 EUR
500+0.9 EUR
1000+0.87 EUR
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MC35FS6500NAE 35FS4500-35FS6500SDS.pdf
MC35FS6500NAE
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MGD3160AM338EKR2 PB_GD3160.pdf
Hersteller: NXP USA Inc.
Description: GATE DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: IGBT, SiC MOSFET
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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74ABT16240ADL,118 74ABT16240A.pdf
74ABT16240ADL,118
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 48SSOP
Packaging: Bulk
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
522+0.96 EUR
Mindestbestellmenge: 522 Stücke
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PCA9420BSAZ PCA9420.pdf
PCA9420BSAZ
Hersteller: NXP USA Inc.
Description: PCA9420BS
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Current - Supply: 4.5µA
Supplier Device Package: 24-HVQFN (3x3)
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AnzahlPreis
1400+2.52 EUR
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PCA9420BSAZ PCA9420.pdf
PCA9420BSAZ
Hersteller: NXP USA Inc.
Description: PCA9420BS
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Current - Supply: 4.5µA
Supplier Device Package: 24-HVQFN (3x3)
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4+4.66 EUR
10+3.49 EUR
25+3.2 EUR
100+2.88 EUR
250+2.72 EUR
500+2.63 EUR
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MC33665ATF4AER2 MC33665A_SDS.pdf
MC33665ATF4AER2
Hersteller: NXP USA Inc.
Description: HIGH SPEED TRANSCEIVER WITH CAN
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: CAN, I2C
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+15.98 EUR
10+12.48 EUR
25+11.6 EUR
100+10.64 EUR
250+10.5 EUR
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MKM35Z512VLQ7R KM35P144M75SF0.pdf
MKM35Z512VLQ7R
Hersteller: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 99
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AnzahlPreis
1+20.28 EUR
10+15.95 EUR
25+14.87 EUR
100+13.69 EUR
250+13.5 EUR
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MC68LC302CAF20CT MC68LC302.pdf
MC68LC302CAF20CT
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 20MHZ 100LQFP
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 100-LQFP (14x14)
Voltage - I/O: 5.0V
Core Processor: M68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Produkt ist nicht verfügbar
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P3S0210BQAZ P3S0210BQ.pdf
P3S0210BQAZ
Hersteller: NXP USA Inc.
Description: IC BUS SW 1X2:1/1X1:2 14-DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 2:1, 1 x 1:2
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.72V ~ 3.63V
Independent Circuits: 1
Current - Output High, Low: 10µA, 10µA
Voltage Supply Source: Single Supply
Supplier Device Package: 14-DHVQFN (2.5x3)
auf Bestellung 525 Stücke:
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AnzahlPreis
12+1.51 EUR
17+1.08 EUR
25+0.97 EUR
100+0.86 EUR
250+0.8 EUR
500+0.77 EUR
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S9S08LG32J0CLK MC9S08LG32.pdf
S9S08LG32J0CLK
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PEMI4QFN/LM,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI4QFN/LM,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHMS ESD SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 4
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2959+0.16 EUR
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SPC5645BK0VLT1
SPC5645BK0VLT1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM-22XSDBEVB MC22XS4200.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC22XS4200
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC22XS4200
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
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LFBDMPGMR
Hersteller: NXP USA Inc.
Description: BDM FLASH PROGRAMMER FOR HCS08,
Packaging: Bulk
For Use With/Related Products: HC12, HCS08, HCS12, HCS12X
Type: Programmer
Contents: Board(s), Cable(s), Power Supply, Accessories
Produkt ist nicht verfügbar
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MPL3150A2ST1 MPL3115A2.pdf
MPL3150A2ST1
Hersteller: NXP USA Inc.
Description: IC BAR SENSOR 150KPA HORIZON 8TS
Packaging: Tape & Reel (TR)
Package / Case: 8-TLGA
Mounting Type: Surface Mount
Supplier Device Package: 8-LGA (3x5)
Produkt ist nicht verfügbar
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SPC5200CVR400B MPC5200BDS.pdf
SPC5200CVR400B
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Produkt ist nicht verfügbar
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SPC5200CVR400BR2 MPC5200BDS.pdf
SPC5200CVR400BR2
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Produkt ist nicht verfügbar
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NXH3675UK/A1Z NXH3675A4FS.pdf
Hersteller: NXP USA Inc.
Description: NXH3675UK
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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NHS3100THADADKUL NHS3100.pdf
Hersteller: NXP USA Inc.
Description: NHS3100 THERAPY ADK
Packaging: Bulk
For Use With/Related Products: NHS3100
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: NHS3100
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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MFS8601BMBA0ESR2 FS8600_SDS.pdf
MFS8601BMBA0ESR2
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS8601BMBA0ES
MFS8601BMBA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BGU8823/AY
Hersteller: NXP USA Inc.
Description: BGU8823
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: 5G, CDMA, FDD, GSM, LTE, TDD, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 19dB
Current - Supply: 57mA
Noise Figure: 2.9dB
P1dB: 37.2dBm
Test Frequency: 2.3GHz
Supplier Device Package: 44-HVLGA (5x5)
Produkt ist nicht verfügbar
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BGU8822/AY
Hersteller: NXP USA Inc.
Description: BGU8822
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.2GHz
RF Type: 5G, CDMA, FDD, GSM, LTE, TDD, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 22.2dB
Current - Supply: 57mA
Noise Figure: 2.3dB
P1dB: 36.3dBm
Test Frequency: 1.7GHz
Supplier Device Package: 44-HVLGA (5x5)
Produkt ist nicht verfügbar
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BGU8821/AY
Hersteller: NXP USA Inc.
Description: BGU8821
Packaging: Tape & Reel (TR)
Package / Case: 44-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 700MHz ~ 1GHz
RF Type: 5G, CDMA, FDD, GSM, LTE, TDD, W-CDMA
Voltage - Supply: 4.75V ~ 5.25V
Gain: 24.4dB
Current - Supply: 57mA
Noise Figure: 1.7dB
P1dB: 35.2dB
Test Frequency: 700MHz ~ 850MHz
Supplier Device Package: 44-HVLGA (5x5)
Produkt ist nicht verfügbar
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LPC11E11FHN33/101, LPC11E3X.pdf
LPC11E11FHN33/101,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC169PW,112 74LVC169.pdf
74LVC169PW,112
Hersteller: NXP USA Inc.
Description: IC BINARY COUNTER 4-BIT 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Operating Temperature: -40°C ~ 125°C
Direction: Up, Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2.7 V ~ 3.6 V
Count Rate: 150 MHz
Number of Bits per Element: 4
auf Bestellung 1600 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1600+0.4 EUR
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MCF51JE256VML MCF51JE256.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 104MAPBGA
Packaging: Box
Package / Case: 104-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 104-MAPBGA (10x10)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9440HE-Q100Z
Hersteller: NXP USA Inc.
Description: IC GATE DRVR HALF-BRIDGE 18HUQFN
Packaging: Tape & Reel (TR)
Package / Case: 18-PowerUFQFN
Mounting Type: Surface Mount
Supplier Device Package: 18-HUQFN (2.6x2.6)
Driven Configuration: Half-Bridge
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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74AHCT3G14GD,125 74AHC_AHCT3G14.pdf
74AHCT3G14GD,125
Hersteller: NXP USA Inc.
Description: IC INV SCHMITT TRIGGER 8-XSON
Packaging: Bulk
auf Bestellung 36000 Stücke:
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AnzahlPreis
2049+0.25 EUR
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74HCT3G14GD,125 PHGLS29087-1.pdf?t.download=true&u=5oefqw
74HCT3G14GD,125
Hersteller: NXP USA Inc.
Description: IC INVERT SCHMITT 3CH 3INP 8XSON
Current - Quiescent (Max): 1 µA
Number of Circuits: 3
Max Propagation Delay @ V, Max CL: 32ns @ 4.5V, 50pF
Input Logic Level - Low: 0.5V ~ 0.6V
Input Logic Level - High: 1.9V ~ 2.1V
Supplier Device Package: 8-XSON (2x3)
Number of Inputs: 3
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: Inverter
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Features: Schmitt Trigger
Packaging: Bulk
auf Bestellung 51398 Stücke:
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AnzahlPreis
1665+0.3 EUR
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74AUP3G14GSX 74AUP3G14.pdf
74AUP3G14GSX
Hersteller: NXP USA Inc.
Description: IC INVERT SCHMITT 3CH 3INP 8XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 8-XSON (1.35x1)
Input Logic Level - High: 0.6V ~ 2.29V
Input Logic Level - Low: 0.1V ~ 0.88V
Max Propagation Delay @ V, Max CL: 6.1ns @ 3.3V, 30pF
Number of Circuits: 3
Current - Quiescent (Max): 500 nA
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AnzahlPreis
2268+0.21 EUR
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LFTAA1C
Hersteller: NXP USA Inc.
Description: 8 PIN 0.8MM DFN TARGET ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - DFN
Produkt ist nicht verfügbar
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LFJ76DBGWSA
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5676 416 PIN 1.0MM CA
Module/Board Type: Socket Adapter
For Use With/Related Products: MPC5676
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1027T/20/2Z TJA1027.pdf
TJA1027T/20/2Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Qualification: AEC-Q100
Grade: Automotive
Receiver Hysteresis: 175 mV
Supplier Device Package: 8-SO
Protocol: LIN
Number of Drivers/Receivers: 1/1
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 4668 Stücke:
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AnzahlPreis
10+1.85 EUR
14+1.34 EUR
25+1.21 EUR
100+1.06 EUR
250+1 EUR
500+0.96 EUR
1000+0.92 EUR
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SAF4000EL/102Z225Y
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/102Z225K
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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MC56F81768LMLH MC56F81XXXL.pdf
Hersteller: NXP USA Inc.
Description: IC
Supplier Device Package: 64-LQFP (10x10)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 20kB
Non-Volatile Memory: FLASH (128kB)
Operating Temperature: -40°C ~ 125°C (TA)
Type: Digital Signal Controllers
Interface: DMA, I2C, LINbus, SCI, QSPI
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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TEA1792TS/1Z TEA1792TS.pdf
TEA1792TS/1Z
Hersteller: NXP USA Inc.
Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 8.5V ~ 38V
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: SC-74
Produkt ist nicht verfügbar
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NCF3320EHN/0SY
Hersteller: NXP USA Inc.
Description: NCF3320EHN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, RS 232
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18092, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPC5554MVR80 MPC5554.pdf
MPC5554MVR80
Hersteller: NXP USA Inc.
Description: MPC5554MVR80
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Bulk
Produkt ist nicht verfügbar
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MPC5554MZP112
MPC5554MZP112
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
DigiKey Programmable: Not Verified
Number of I/O: 256
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LFVBBOM54W1A
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5554 422 PIN 1.0MM VE
Utilized IC / Part: MPC5554
Accessory Type: Base Board
For Use With/Related Products: MPC5554
Packaging: Bulk
Produkt ist nicht verfügbar
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MC33FS8530A1KS FS84_FS85C_DS.pdf
MC33FS8530A1KS
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PCA9600DPZ PCA9600.pdf
PCA9600DPZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 100ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 15V
Applications: I2C
Current - Supply: 5.5mA
Data Rate (Max): 1MHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 10 pF
auf Bestellung 6742 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+6.69 EUR
10+5.08 EUR
25+4.67 EUR
100+4.23 EUR
250+4.02 EUR
500+3.89 EUR
1000+3.78 EUR
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S9S12G128AMLHR S12GFS.pdf
S9S12G128AMLHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1500+7.75 EUR
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S9S12G128AMLHR S12GFS.pdf
S9S12G128AMLHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+13.24 EUR
10+10.24 EUR
25+9.5 EUR
100+8.67 EUR
250+8.28 EUR
500+8.05 EUR
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LPC5534JHI48/00MP LPC553x.pdf
LPC5534JHI48/00MP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+10.84 EUR
10+9.89 EUR
25+9.7 EUR
50+9.63 EUR
100+8.64 EUR
250+8.61 EUR
500+8.07 EUR
1000+7.73 EUR
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MFS8603BMBA0ESR2 FS8600_SDS.pdf
MFS8603BMBA0ESR2
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HVQFN (7x7)
Applications: Camera
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC33FS4507CAER2 FS6500-FS4500SDS-ASILB.pdf
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Produkt ist nicht verfügbar
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MC35FS4506CAER2 35FS4500-35FS6500SDS-ASILB.pdf
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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MC33FS8510C4ESR2 FS84_FS85C_DS.pdf
Hersteller: NXP USA Inc.
Description: PMIC, SAFETY, 2 BUCKS
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5602BK0VLL4R
SPC5602BK0VLL4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5603BK0CLQ4R
SPC5603BK0CLQ4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FH32K146HFT0MLQR
Hersteller: NXP USA Inc.
Description: S32K146, M4F, FLASH 1M, RAM 128K
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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