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DSPA56721AF NXP USA Inc. Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1112LVFHN24/003 LPC1112LVFHN24/003 NXP USA Inc. LPC111XLV_LPC11XXLVUK.pdf Description: IC MCU 32BIT 16KB FLASH 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TFF1012HN/N1,115 TFF1012HN/N1,115 NXP USA Inc. TFF1012HN.pdf Description: IC DOWNCONVERTER 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 10.7GHz ~ 12.75GHz
RF Type: Ku-Band
Voltage - Supply: 5V
Gain: 30dB
Current - Supply: 52mA
Noise Figure: 9dB
Number of Mixers: 1
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Produkt ist nicht verfügbar
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NT4H2421TTDUD/02Z NXP USA Inc. Description: CLHW
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: NFC, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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NT4H2421TTDUF/02Z NXP USA Inc. NT4H2421Tx.pdf Description: CLHW
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: NFC, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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NT4H2421TTDUD/02V NXP USA Inc. Description: CLHW
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: NFC, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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NT4H2421TTDUF/02V NXP USA Inc. Description: CLHW
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: NFC, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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MK22FN128CAH12R MK22FN128CAH12R NXP USA Inc. Description: IC MCU 32BIT 128KB FLASH 64WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 64-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-WLCSP (3.35x3.32)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5602DF1VLL4 SPC5602DF1VLL4 NXP USA Inc. MPC5602D.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 33x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08QG8CFQE MC9S08QG8CFQE NXP USA Inc. MC9S08QG8.pdf Description: IC MCU 8BIT 8KB FLASH 8DFN
Packaging: Tray
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-DFN-EP (4x4)
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKL05Z16VFM4 MKL05Z16VFM4 NXP USA Inc. KL05P48M48SF1.pdf Description: IC MCU 32BIT 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08GT16AMFCE MC9S08GT16AMFCE NXP USA Inc. MC9S08GT16A.pdf Description: IC MCU 8BIT 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K146HFT0MLHT FS32K146HFT0MLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1N4729A,113 1N4729A,113 NXP USA Inc. 1N4728A_SER.pdf Description: DIODE ZENER 3.6V 1W DO41
Packaging: Bulk
auf Bestellung 110000 Stücke:
Lieferzeit 10-14 Tag (e)
9072+0.05 EUR
Mindestbestellmenge: 9072
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74LV04N,112 74LV04N,112 NXP USA Inc. 74LV04_Rev3.pdf Description: IC INVERTER 6CH 1-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 1
Supplier Device Package: 14-DIP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
auf Bestellung 3848 Stücke:
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620+0.81 EUR
Mindestbestellmenge: 620
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PMF780SN,115 PMF780SN,115 NXP USA Inc. PMF780SN.pdf Description: MOSFET N-CH 60V 570MA SOT323-3
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 570mA (Ta)
Rds On (Max) @ Id, Vgs: 920mOhm @ 300mA, 10V
Power Dissipation (Max): 560mW (Tc)
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 1.05 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 23 pF @ 30 V
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5323+0.10 EUR
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MC9S08AC96MFGE MC9S08AC96MFGE NXP USA Inc. MC9S08AC128.pdf Description: IC MCU 8BIT 96KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5602BF2MLQ4R SPC5602BF2MLQ4R NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74AUP1G386GM,115 74AUP1G386GM,115 NXP USA Inc. 74AUP1G386.pdf Description: IC GATE XOR 1CH 3-INP 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.1ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
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1476+0.32 EUR
Mindestbestellmenge: 1476
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MC9S12D64MFUE MC9S12D64MFUE NXP USA Inc. MC9S12DJ64%20Guide.pdf Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS1023ASN7KQB NXP USA Inc. LS1023AXE8MQB.pdf?t.download=true&u=axiww2 Description: QORIQ, 2XCPU 64-BIT ARM ARCH, 1.
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1Gbps (5), 1/2.5Gbps (1), 1/2.5/10Gbps (1)
USB: USB 3.0 + PHY (3)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
auf Bestellung 278 Stücke:
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6+94.82 EUR
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BC857QASX BC857QASX NXP USA Inc. Description: TRANS PNP 45V 0.1A 6DFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74AHC2G126GD,125 74AHC2G126GD,125 NXP USA Inc. 74AHC_AHCT2G126.pdf Description: IC BUFFER/LINEDVR DUAL XSON8U
Packaging: Bulk
auf Bestellung 90914 Stücke:
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2049+0.24 EUR
Mindestbestellmenge: 2049
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FS32K144HAT0VLFT FS32K144HAT0VLFT NXP USA Inc. S32K1xx.pdf Description: S32K144, 512K FLASH, 64K RAM
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 89
auf Bestellung 1250 Stücke:
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2+13.22 EUR
10+12.30 EUR
25+11.93 EUR
40+11.73 EUR
80+11.45 EUR
230+11.02 EUR
440+10.76 EUR
1250+10.36 EUR
Mindestbestellmenge: 2
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SPC5742PK1AMLQ9 SPC5742PK1AMLQ9 NXP USA Inc. MPC574xPFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5742PK1AMLQ9R SPC5742PK1AMLQ9R NXP USA Inc. MPC574xPFS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5743PFK1AMLQ9 SPC5743PFK1AMLQ9 NXP USA Inc. MPC574xPFS.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5745BBK1AMMH2 SPC5745BBK1AMMH2 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM-17510EVB NXP USA Inc. KTFRDM17510EVBUG.pdf Description: EVAL BOARD FOR MPC17510
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC17510
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
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FRDM-17531AEPEVB NXP USA Inc. Description: FRDM-17531AEPE
Packaging: Bulk
Function: Motor Controller/Driver, Stepper
Type: Power Management
Utilized IC / Part: MPC17531A
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
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MKW20Z160VHT4 MKW20Z160VHT4 NXP USA Inc. MKW40Z160.pdf Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Tray
Package / Case: 64-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 160kB Flash, 20kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.45V ~ 3.6V
Power - Output: 5dBm
Protocol: ZigbeePRO®
Current - Receiving: 6.5mA ~ 15.4mA
Data Rate (Max): 250kbps
Current - Transmitting: 8.4mA ~ 18.5mA
Supplier Device Package: 64-VFLGA (7x7)
GPIO: 28
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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88W8997-A1-CBQE/AZ 88W8997-A1-CBQE/AZ NXP USA Inc. 88W8997-FACT-SHEET.pdf Description: IC RF TXRX BLE 161WLCSP
Packaging: Cut Tape (CT)
Package / Case: 161-BGA, WLCSP
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 161-WLCSP
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
auf Bestellung 1460 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.17 EUR
10+23.66 EUR
25+22.44 EUR
100+20.77 EUR
250+19.77 EUR
500+19.06 EUR
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88W8777-A0-CBK/BZ NXP USA Inc. Description: IC RF TXRX BLE
Packaging: Tape & Reel (TR)
Frequency: 2.4GHz
Type: TxRx Only
Protocol: 802.11b/g/n, Bluetooth v4.0
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8977-A1-EADE/AZ NXP USA Inc. 88W8977_SDS.pdf?pspll=1 Description: IC RF TXRX+MCU 802.15.4 74EWLP
Packaging: Tape & Reel (TR)
Package / Case: 74-WFBGA, WLBGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g, Bluetooth v5.2, Class 2, GPS, GSM, LTE, WCDMA, Zigbee®
Data Rate (Max): 150Mbps
Supplier Device Package: 74-eWLP (3.46x4.68)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8787-A1-BKBE/CZ NXP USA Inc. Description: 11N 1X1 DUAL-BAND + BT + FM + SD
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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88W8787-A16CBJ/AZ NXP USA Inc. Description: 11N 1X1 + BT + FM + SDIO + GSPI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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88W8787-A16CBJ/BZ NXP USA Inc. Description: 11N 1X1 DUAL-BAND + BT + FM + SD
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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88W8787-A1-BKBE/AZ NXP USA Inc. Description: 11N 1X1 + BT + FM + SDIO + GSPI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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88W8977-A1-NMVE/AZ NXP USA Inc. 88W8977_SDS.pdf?pspll=1 Description: IC RF TXRX+MCU 802.15.4 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g, Bluetooth v5.2, Class 2, GPS, GSM, LTE, WCDMA, Zigbee®
Data Rate (Max): 150Mbps
Supplier Device Package: 68-HVQFN (8x8)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8987-A2-EAHE/AZ NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE
Packaging: Tape & Reel (TR)
Package / Case: 83-WFBGA, WLCSP
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 83-WLCSP (4.6x4.2)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8987-A2-NYEE/AZ NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: IC RF TXRX BLE 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8787-A1-BRDA/AZ NXP USA Inc. Description: 11N 1X1 SINGLE-BAND + BT + FM +
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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88W8987-A2-NYEE/AK NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8987-A2-NYEA/BZ NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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88W8987-A2-NYEI/AK NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8987-A1-NYEI/AZ NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8987-A2-NYEI/AZ NXP USA Inc. 88W8987_SDS.pdf?pspll=1 Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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MCF51JE128CLK MCF51JE128CLK NXP USA Inc. MCF51JE256.pdf Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Box
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVT245DB,112 74LVT245DB,112 NXP USA Inc. 74LVT245.pdf Description: IC TRANSCVR TRI-ST 8BIT 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SSOP
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MC9S12E32VFUE16R MC9S12E32VFUE16R NXP USA Inc. MC9S12E128V1.pdf Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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HVP-KE18F HVP-KE18F NXP USA Inc. KE1XF512PB.pdf Description: EVAL BOARD FOR KE1XF
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: KE1xF
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
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MC9S08GT60ACFBER MC9S08GT60ACFBER NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 60KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08GT60ACFBER MC9S08GT60ACFBER NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 60KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PMXB65ENE,147 PMXB65ENE,147 NXP USA Inc. PMXB65ENE.pdf Description: NOW NEXPERIA PMXB65ENE - SMALL S
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
Rds On (Max) @ Id, Vgs: 67mOhm @ 3.2A, 10V
Power Dissipation (Max): 400mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 295 pF @ 15 V
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PSMN2R9-30MLC,115 PSMN2R9-30MLC,115 NXP USA Inc. PSMN2R9-30MLC.pdf Description: 30 V, 2.95 MILLI OHM LOGIC LEVEL
Packaging: Bulk
Package / Case: SOT-1210, 8-LFPAK33 (5-Lead)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 70A (Tc)
Rds On (Max) @ Id, Vgs: 2.9mOhm @ 25A, 10V
Power Dissipation (Max): 91W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: LFPAK33
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 36.1 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2419 pF @ 15 V
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74LVC2G125GD,125 74LVC2G125GD,125 NXP USA Inc. PHGLS27070-1.pdf?t.download=true&u=5oefqw Description: IC BUS BUFF DVR TRI-ST DL 8XSON
Packaging: Bulk
auf Bestellung 516100 Stücke:
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BCX71H,235 BCX71H,235 NXP USA Inc. PHGLS19403-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BCX71H - SMALL SIGN
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 550mV @ 1.25mA, 50mA
Current - Collector Cutoff (Max): 20nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-23
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 250 mW
Qualification: AEC-Q101
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MC68302AG16VC MC68302AG16VC NXP USA Inc. M68302FADS.pdf Description: IC MPU M683XX 16MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 3.3V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Produkt ist nicht verfügbar
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PCA9451AHNY NXP USA Inc. PCA9451.pdf Description: PMIC SUPPORTING I.MX 93
Packaging: Tape & Reel (TR)
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PCA9451AHNY NXP USA Inc. PCA9451.pdf Description: PMIC SUPPORTING I.MX 93
Packaging: Cut Tape (CT)
auf Bestellung 1690 Stücke:
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25+6.68 EUR
50+6.64 EUR
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250+5.93 EUR
500+5.71 EUR
1000+5.43 EUR
Mindestbestellmenge: 3
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DSPA56721AF
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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LPC1112LVFHN24/003 LPC111XLV_LPC11XXLVUK.pdf
LPC1112LVFHN24/003
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TFF1012HN/N1,115 TFF1012HN.pdf
TFF1012HN/N1,115
Hersteller: NXP USA Inc.
Description: IC DOWNCONVERTER 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 10.7GHz ~ 12.75GHz
RF Type: Ku-Band
Voltage - Supply: 5V
Gain: 30dB
Current - Supply: 52mA
Noise Figure: 9dB
Number of Mixers: 1
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Produkt ist nicht verfügbar
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NT4H2421TTDUD/02Z
Hersteller: NXP USA Inc.
Description: CLHW
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: NFC, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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NT4H2421TTDUF/02Z NT4H2421Tx.pdf
Hersteller: NXP USA Inc.
Description: CLHW
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: NFC, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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NT4H2421TTDUD/02V
Hersteller: NXP USA Inc.
Description: CLHW
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: NFC, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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NT4H2421TTDUF/02V
Hersteller: NXP USA Inc.
Description: CLHW
Packaging: Tray
Package / Case: Die
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: NFC, ISO 14443, ISO 7816-4
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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MK22FN128CAH12R
MK22FN128CAH12R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 64-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-WLCSP (3.35x3.32)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5602DF1VLL4 MPC5602D.pdf
SPC5602DF1VLL4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 33x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08QG8CFQE MC9S08QG8.pdf
MC9S08QG8CFQE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 8DFN
Packaging: Tray
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-DFN-EP (4x4)
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKL05Z16VFM4 KL05P48M48SF1.pdf
MKL05Z16VFM4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08GT16AMFCE MC9S08GT16A.pdf
MC9S08GT16AMFCE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K146HFT0MLHT S32K1xx.pdf
FS32K146HFT0MLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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1N4729A,113 1N4728A_SER.pdf
1N4729A,113
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.6V 1W DO41
Packaging: Bulk
auf Bestellung 110000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9072+0.05 EUR
Mindestbestellmenge: 9072
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74LV04N,112 74LV04_Rev3.pdf
74LV04N,112
Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 1
Supplier Device Package: 14-DIP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
auf Bestellung 3848 Stücke:
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Anzahl Preis
620+0.81 EUR
Mindestbestellmenge: 620
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PMF780SN,115 PMF780SN.pdf
PMF780SN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 570MA SOT323-3
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 570mA (Ta)
Rds On (Max) @ Id, Vgs: 920mOhm @ 300mA, 10V
Power Dissipation (Max): 560mW (Tc)
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 1.05 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 23 pF @ 30 V
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Anzahl Preis
5323+0.10 EUR
Mindestbestellmenge: 5323
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MC9S08AC96MFGE MC9S08AC128.pdf
MC9S08AC96MFGE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5602BF2MLQ4R
SPC5602BF2MLQ4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74AUP1G386GM,115 74AUP1G386.pdf
74AUP1G386GM,115
Hersteller: NXP USA Inc.
Description: IC GATE XOR 1CH 3-INP 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.1ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
auf Bestellung 4900 Stücke:
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Anzahl Preis
1476+0.32 EUR
Mindestbestellmenge: 1476
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MC9S12D64MFUE MC9S12DJ64%20Guide.pdf
MC9S12D64MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS1023ASN7KQB LS1023AXE8MQB.pdf?t.download=true&u=axiww2
Hersteller: NXP USA Inc.
Description: QORIQ, 2XCPU 64-BIT ARM ARCH, 1.
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1Gbps (5), 1/2.5Gbps (1), 1/2.5/10Gbps (1)
USB: USB 3.0 + PHY (3)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
auf Bestellung 278 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+94.82 EUR
Mindestbestellmenge: 6
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BC857QASX
BC857QASX
Hersteller: NXP USA Inc.
Description: TRANS PNP 45V 0.1A 6DFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74AHC2G126GD,125 74AHC_AHCT2G126.pdf
74AHC2G126GD,125
Hersteller: NXP USA Inc.
Description: IC BUFFER/LINEDVR DUAL XSON8U
Packaging: Bulk
auf Bestellung 90914 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2049+0.24 EUR
Mindestbestellmenge: 2049
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FS32K144HAT0VLFT S32K1xx.pdf
FS32K144HAT0VLFT
Hersteller: NXP USA Inc.
Description: S32K144, 512K FLASH, 64K RAM
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 89
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.22 EUR
10+12.30 EUR
25+11.93 EUR
40+11.73 EUR
80+11.45 EUR
230+11.02 EUR
440+10.76 EUR
1250+10.36 EUR
Mindestbestellmenge: 2
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SPC5742PK1AMLQ9 MPC574xPFS.pdf
SPC5742PK1AMLQ9
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5742PK1AMLQ9R MPC574xPFS.pdf
SPC5742PK1AMLQ9R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5743PFK1AMLQ9 MPC574xPFS.pdf
SPC5743PFK1AMLQ9
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5745BBK1AMMH2 MPC5746C.pdf
SPC5745BBK1AMMH2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FRDM-17510EVB KTFRDM17510EVBUG.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MPC17510
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC17510
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
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FRDM-17531AEPEVB
Hersteller: NXP USA Inc.
Description: FRDM-17531AEPE
Packaging: Bulk
Function: Motor Controller/Driver, Stepper
Type: Power Management
Utilized IC / Part: MPC17531A
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
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MKW20Z160VHT4 MKW40Z160.pdf
MKW20Z160VHT4
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Tray
Package / Case: 64-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 160kB Flash, 20kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.45V ~ 3.6V
Power - Output: 5dBm
Protocol: ZigbeePRO®
Current - Receiving: 6.5mA ~ 15.4mA
Data Rate (Max): 250kbps
Current - Transmitting: 8.4mA ~ 18.5mA
Supplier Device Package: 64-VFLGA (7x7)
GPIO: 28
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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88W8997-A1-CBQE/AZ 88W8997-FACT-SHEET.pdf
88W8997-A1-CBQE/AZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 161WLCSP
Packaging: Cut Tape (CT)
Package / Case: 161-BGA, WLCSP
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Protocol: 802.11ac, Bluetooth v5.1
Data Rate (Max): 2Mbps
Supplier Device Package: 161-WLCSP
RF Family/Standard: Bluetooth
Serial Interfaces: PCM, SDIO, UART, USB
auf Bestellung 1460 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+27.17 EUR
10+23.66 EUR
25+22.44 EUR
100+20.77 EUR
250+19.77 EUR
500+19.06 EUR
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88W8777-A0-CBK/BZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE
Packaging: Tape & Reel (TR)
Frequency: 2.4GHz
Type: TxRx Only
Protocol: 802.11b/g/n, Bluetooth v4.0
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8977-A1-EADE/AZ 88W8977_SDS.pdf?pspll=1
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 74EWLP
Packaging: Tape & Reel (TR)
Package / Case: 74-WFBGA, WLBGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g, Bluetooth v5.2, Class 2, GPS, GSM, LTE, WCDMA, Zigbee®
Data Rate (Max): 150Mbps
Supplier Device Package: 74-eWLP (3.46x4.68)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8787-A1-BKBE/CZ
Hersteller: NXP USA Inc.
Description: 11N 1X1 DUAL-BAND + BT + FM + SD
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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88W8787-A16CBJ/AZ
Hersteller: NXP USA Inc.
Description: 11N 1X1 + BT + FM + SDIO + GSPI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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88W8787-A16CBJ/BZ
Hersteller: NXP USA Inc.
Description: 11N 1X1 DUAL-BAND + BT + FM + SD
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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88W8787-A1-BKBE/AZ
Hersteller: NXP USA Inc.
Description: 11N 1X1 + BT + FM + SDIO + GSPI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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88W8977-A1-NMVE/AZ 88W8977_SDS.pdf?pspll=1
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 13dBm
Protocol: 802.11a/b/g, Bluetooth v5.2, Class 2, GPS, GSM, LTE, WCDMA, Zigbee®
Data Rate (Max): 150Mbps
Supplier Device Package: 68-HVQFN (8x8)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8987-A2-EAHE/AZ 88W8987_SDS.pdf?pspll=1
Hersteller: NXP USA Inc.
Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE
Packaging: Tape & Reel (TR)
Package / Case: 83-WFBGA, WLCSP
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 83-WLCSP (4.6x4.2)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8987-A2-NYEE/AZ 88W8987_SDS.pdf?pspll=1
Hersteller: NXP USA Inc.
Description: IC RF TXRX BLE 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8787-A1-BRDA/AZ
Hersteller: NXP USA Inc.
Description: 11N 1X1 SINGLE-BAND + BT + FM +
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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88W8987-A2-NYEE/AK 88W8987_SDS.pdf?pspll=1
Hersteller: NXP USA Inc.
Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8987-A2-NYEA/BZ 88W8987_SDS.pdf?pspll=1
Hersteller: NXP USA Inc.
Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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88W8987-A2-NYEI/AK 88W8987_SDS.pdf?pspll=1
Hersteller: NXP USA Inc.
Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8987-A1-NYEI/AZ 88W8987_SDS.pdf?pspll=1
Hersteller: NXP USA Inc.
Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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88W8987-A2-NYEI/AZ 88W8987_SDS.pdf?pspll=1
Hersteller: NXP USA Inc.
Description: 1X1 11AC WAVE-2 CHIP WITH BT/LE;
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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MCF51JE128CLK MCF51JE256.pdf
MCF51JE128CLK
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Box
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVT245DB,112 74LVT245.pdf
74LVT245DB,112
Hersteller: NXP USA Inc.
Description: IC TRANSCVR TRI-ST 8BIT 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SSOP
auf Bestellung 6255 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
885+0.57 EUR
Mindestbestellmenge: 885
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MC9S12E32VFUE16R MC9S12E128V1.pdf
MC9S12E32VFUE16R
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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HVP-KE18F KE1XF512PB.pdf
HVP-KE18F
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR KE1XF
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: KE1xF
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+176.90 EUR
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MC9S08GT60ACFBER MC9S08GB60A.pdf
MC9S08GT60ACFBER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08GT60ACFBER MC9S08GB60A.pdf
MC9S08GT60ACFBER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PMXB65ENE,147 PMXB65ENE.pdf
PMXB65ENE,147
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PMXB65ENE - SMALL S
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
Rds On (Max) @ Id, Vgs: 67mOhm @ 3.2A, 10V
Power Dissipation (Max): 400mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 295 pF @ 15 V
auf Bestellung 2082 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1402+0.35 EUR
Mindestbestellmenge: 1402
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PSMN2R9-30MLC,115 PSMN2R9-30MLC.pdf
PSMN2R9-30MLC,115
Hersteller: NXP USA Inc.
Description: 30 V, 2.95 MILLI OHM LOGIC LEVEL
Packaging: Bulk
Package / Case: SOT-1210, 8-LFPAK33 (5-Lead)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 70A (Tc)
Rds On (Max) @ Id, Vgs: 2.9mOhm @ 25A, 10V
Power Dissipation (Max): 91W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: LFPAK33
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 36.1 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2419 pF @ 15 V
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
960+0.50 EUR
Mindestbestellmenge: 960
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74LVC2G125GD,125 PHGLS27070-1.pdf?t.download=true&u=5oefqw
74LVC2G125GD,125
Hersteller: NXP USA Inc.
Description: IC BUS BUFF DVR TRI-ST DL 8XSON
Packaging: Bulk
auf Bestellung 516100 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2049+0.25 EUR
Mindestbestellmenge: 2049
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BCX71H,235 PHGLS19403-1.pdf?t.download=true&u=5oefqw
BCX71H,235
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BCX71H - SMALL SIGN
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 550mV @ 1.25mA, 50mA
Current - Collector Cutoff (Max): 20nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-23
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 250 mW
Qualification: AEC-Q101
auf Bestellung 60000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13172+0.03 EUR
Mindestbestellmenge: 13172
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MC68302AG16VC M68302FADS.pdf
MC68302AG16VC
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 16MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 3.3V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Produkt ist nicht verfügbar
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PCA9451AHNY PCA9451.pdf
Hersteller: NXP USA Inc.
Description: PMIC SUPPORTING I.MX 93
Packaging: Tape & Reel (TR)
auf Bestellung 1690 Stücke:
Lieferzeit 10-14 Tag (e)
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PCA9451AHNY PCA9451.pdf
Hersteller: NXP USA Inc.
Description: PMIC SUPPORTING I.MX 93
Packaging: Cut Tape (CT)
auf Bestellung 1690 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.52 EUR
10+6.82 EUR
25+6.68 EUR
50+6.64 EUR
100+5.95 EUR
250+5.93 EUR
500+5.71 EUR
1000+5.43 EUR
Mindestbestellmenge: 3
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