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BF904AWR,115 BF904AWR,115 NXP USA Inc. BF904A%2CAR%2CAWR.pdf Description: RF MOSFET 5V CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 200MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 7 V
Voltage - Test: 5 V
Current - Test: 10 mA
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
1480+0.33 EUR
Mindestbestellmenge: 1480
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MC9328MX1CVM15 MC9328MX1CVM15 NXP USA Inc. MC9328MX1.pdf Description: IC MPU I.MX1 150MHZ 256MAPBGA
Packaging: Tray
Package / Case: 256-MAPBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
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MC68LC302AF16VCT MC68LC302AF16VCT NXP USA Inc. MC68LC302.pdf Description: IC MPU M683XX 16MHZ 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 3.3V
Supplier Device Package: 100-LQFP (14x14)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
auf Bestellung 56 Stücke:
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1+106.44 EUR
10+86.95 EUR
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BC856T,115 BC856T,115 NXP USA Inc. BC856T_857T_Rev_Feb2017.pdf Description: TRANS PNP 65V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 125 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SC-75
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 65 V
Power - Max: 150 mW
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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MC34SB0800AER2 MC34SB0800AER2 NXP USA Inc. Description: IC MOTOR DRIVER 36V 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 36V
Applications: Pump, Valve Controller
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
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MC34SB0800AER2 MC34SB0800AER2 NXP USA Inc. Description: IC MOTOR DRIVER 36V 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 36V
Applications: Pump, Valve Controller
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
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MC34SB0800AER2 MC34SB0800AER2 NXP USA Inc. Description: IC MOTOR DRIVER 36V 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 36V
Applications: Pump, Valve Controller
Supplier Device Package: 64-LQFP (10x10)
auf Bestellung 1500 Stücke:
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16+32.47 EUR
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74AHCT244PW,112 74AHCT244PW,112 NXP USA Inc. 74AHC_AHCT244.pdf Description: IC BUFF/DVR TRI-ST DUAL 20TSSOP
Packaging: Bulk
auf Bestellung 12120 Stücke:
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1722+0.29 EUR
Mindestbestellmenge: 1722
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S912B32E4CFUE8 S912B32E4CFUE8 NXP USA Inc. M68HC12B.pdf Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC912D60AMFUE8 MC912D60AMFUE8 NXP USA Inc. MC68HC912D60A.pdf Description: IC MCU 16BIT 60KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 8x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCHC912B32VFUE8 MCHC912B32VFUE8 NXP USA Inc. M68HC12B.pdf Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC68C812A4PVE5 XC68C812A4PVE5 NXP USA Inc. MC68HC812A4.pdf Description: IC MCU 16BIT 4KB EEPROM 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 5MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 1K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: EEPROM
Core Processor: CPU12
Data Converters: A/D 8x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912B32E4MFUE8R S912B32E4MFUE8R NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912DG12AE0CPVE S912DG12AE0CPVE NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Bulk
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1313FBD48,151 LPC1313FBD48,151 NXP USA Inc. LPC1311_13_42_43.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1730 Stücke:
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3+7.23 EUR
10+5.57 EUR
25+5.08 EUR
100+4.69 EUR
250+4.23 EUR
500+3.99 EUR
1000+3.86 EUR
Mindestbestellmenge: 3
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S912XD64F2CAA S912XD64F2CAA NXP USA Inc. 9S12XDP512DGV1.pdf Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74AHCT373PW,118 74AHCT373PW,118 NXP USA Inc. 74AHC373.pdf Description: IC OCT D TRANSP LTCH 3ST 20TSSOP
Packaging: Bulk
auf Bestellung 33538 Stücke:
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2959+0.17 EUR
Mindestbestellmenge: 2959
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74LVU04D,118 74LVU04D,118 NXP USA Inc. 74LVU04.pdf Description: IC HEX INVERTER 14SOIC
Packaging: Bulk
auf Bestellung 5200 Stücke:
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2420+0.19 EUR
Mindestbestellmenge: 2420
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MC908KX8MDWE MC908KX8MDWE NXP USA Inc. MC68HC908KX8.pdf Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HCT373D-Q100,118 74HCT373D-Q100,118 NXP USA Inc. PHGLS25322-1.pdf?t.download=true&u=5oefqw Description: IC D-TYPE TRANSP SGL 8:8 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-SO
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2479 Stücke:
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1374+0.36 EUR
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MFS2323BMBA1EPR2 MFS2323BMBA1EPR2 NXP USA Inc. FS23_SBC.pdf Description: MFS2323BMBA1EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MPF5200AMBA1ESR2 MPF5200AMBA1ESR2 NXP USA Inc. PF5200.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 32-HWQFN (5x5)
Produkt ist nicht verfügbar
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MFS2323BMBA1EP MFS2323BMBA1EP NXP USA Inc. FS23_SBC.pdf Description: MFS2323BMBA1EP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MPF5200AMBA1ES MPF5200AMBA1ES NXP USA Inc. PF5200.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Current - Supply: 40µA
Supplier Device Package: 32-HWQFN (5x5)
Grade: Automotive
Produkt ist nicht verfügbar
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S9S12ZVL16ACLC NXP USA Inc. Description: S12Z CPU, 16K FLASH
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12ZVL16AVLC S9S12ZVL16AVLC NXP USA Inc. Description: S12Z CPU, 16K FLASH
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
Produkt ist nicht verfügbar
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S9S12ZVL16ACLFR NXP USA Inc. Description: S12Z CPU, 16K FLASH
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S12ZVL16ACLF NXP USA Inc. Description: S12Z CPU, 16K FLASH
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8343EVRAGDB MPC8343EVRAGDB NXP USA Inc. Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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MIMXRT1180-EVK NXP USA Inc. Description: IC
Packaging: Box
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7, Cortex®-M33
Utilized IC / Part: RT1180
Produkt ist nicht verfügbar
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FS32K142URT0VLHT FS32K142URT0VLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC16374ADGG,112 74LVC16374ADGG,112 NXP USA Inc. 74LVC_LVCH16374A.pdf Description: IC FF D-TYPE DUAL 8BIT 48TSSOP
Packaging: Bulk
auf Bestellung 7476 Stücke:
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1066+0.47 EUR
Mindestbestellmenge: 1066
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74LVT16373ADGG,112 74LVT16373ADGG,112 NXP USA Inc. 74LVT16373A.pdf Description: IC 16BIT TRANSP LATCH D 48TSSOP
Packaging: Bulk
auf Bestellung 8775 Stücke:
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703+0.72 EUR
Mindestbestellmenge: 703
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74ABT16244ADGG,112 74ABT16244ADGG,112 NXP USA Inc. 74ABT16244A.pdf Description: IC BUFF NON-INVERT 5.5V 48TSSOP
Packaging: Bulk
auf Bestellung 2822 Stücke:
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556+0.91 EUR
Mindestbestellmenge: 556
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74LVC16240ADGG,112 74LVC16240ADGG,112 NXP USA Inc. 74LVC16240A.pdf Description: IC INVERTER QUAD 4-INPUT 48TSSOP
Packaging: Bulk
auf Bestellung 1850 Stücke:
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552+0.91 EUR
Mindestbestellmenge: 552
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LPC1114LVFHN24/303 LPC1114LVFHN24/303 NXP USA Inc. LPC111XLV_LPC11XXLVUK.pdf Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
auf Bestellung 1969 Stücke:
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162+2.88 EUR
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LPC1114FHN33/302:5 LPC1114FHN33/302:5 NXP USA Inc. UM10398.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 308 Stücke:
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151+3.09 EUR
Mindestbestellmenge: 151
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LPC1114LVFHI33/303 LPC1114LVFHI33/303 NXP USA Inc. LPC111XLV_LPC11XXLVUK.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 27
DigiKey Programmable: Not Verified
auf Bestellung 350 Stücke:
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LPC1114JHN33/303E LPC1114JHN33/303E NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
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KW45B41Z-LOC NXP USA Inc. KW45.pdf Description: KW45B41Z-LOC
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: KW45B41Z
Produkt ist nicht verfügbar
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MC32PF1550A4EPR2 MC32PF1550A4EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC9S08LC60LH MC9S08LC60LH NXP USA Inc. MC9S08LC60.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SL2S2602FTBX SL2S2602FTBX NXP USA Inc. SL2S2602.pdf Description: ICODE
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: ISO 15693
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 1.3V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 3-XSON (1x1.45)
auf Bestellung 14470 Stücke:
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38+0.48 EUR
43+0.41 EUR
46+0.39 EUR
100+0.35 EUR
250+0.33 EUR
500+0.32 EUR
1000+0.31 EUR
Mindestbestellmenge: 38
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NX5DV330DS,118 NX5DV330DS,118 NXP USA Inc. NX5DV330.pdf Description: IC VIDEO MUX/DEMUX 1X2 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-SSOP
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
auf Bestellung 318919 Stücke:
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MPC7410VS500LE MPC7410VS500LE NXP USA Inc. DS_568_MPC7410.pdf Description: IC MPU MPC74XX 500MHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MCF5481CVR166 MCF5481CVR166 NXP USA Inc. MCF5485EC.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX8MM6DVTLZAAR MIMX8MM6DVTLZAAR NXP USA Inc. IMX8MMCEC.pdf Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Cut Tape (CT)
Package / Case: 486-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Additional Interfaces: I2C, I2S, eMMC/SDIO, PCIe, SPI, UART
auf Bestellung 725 Stücke:
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100+39.95 EUR
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S9KEAZN32AVLH S9KEAZN32AVLH NXP USA Inc. Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MR-CANHUBK344MIN NXP USA Inc. Description: MR-CANHUBK344MIN
Packaging: Box
Produkt ist nicht verfügbar
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MR-CANHUBK3 NXP USA Inc. Description: MOBILE ROBOTICS S32K3 T1 6XCAN H
Packaging: Bulk
Produkt ist nicht verfügbar
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74HCT138PW,112 74HCT138PW,112 NXP USA Inc. 74HC_HCT138.pdf Description: IC DECOD/DEMUX 3-8 LINE 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
auf Bestellung 15435 Stücke:
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1647+0.29 EUR
Mindestbestellmenge: 1647
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IMXEBOOKDC5 NXP USA Inc. IMXEBOOKDC5-UM.pdf Description: EPD DISPLAY PARALLEL INTERFACE
Packaging: Box
auf Bestellung 8 Stücke:
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MC7410VU500LE MC7410VU500LE NXP USA Inc. DS_568_MPC7410.pdf Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC7447AHX600NB MC7447AHX600NB NXP USA Inc. MPC7447AEC.pdf Description: IC MPU MPC74XX 600MHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC7447AHX867NB MC7447AHX867NB NXP USA Inc. MPC7447AEC.pdf Description: IC MPU MPC74XX 867MHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 867MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC7447ATHX1000NB MC7447ATHX1000NB NXP USA Inc. MPC7447AEC.pdf Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MIMX8ML8DVNLZCB MIMX8ML8DVNLZCB NXP USA Inc. MIMX8ML.pdf Description: MIMX8ML8DVNLZCB
Packaging: Tray
Package / Case: 548-LFBGA
Speed: 1.8GHz, 800MHz
RAM Size: 868KB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP
Connectivity: CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 548-LFBGA (15x15)
Architecture: DSP, MCU, MPU
auf Bestellung 630 Stücke:
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1+73.39 EUR
10+60.39 EUR
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MIMX8ML8DVNLZDB MIMX8ML8DVNLZDB NXP USA Inc. MIMX8ML.pdf Description: MIMX8ML8DVNLZDB
Packaging: Tray
Package / Case: 548-LFBGA
Speed: 1.8GHz, 800MHz
RAM Size: 868KB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP
Connectivity: CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 548-LFBGA (15x15)
Architecture: DSP, MCU, MPU
auf Bestellung 628 Stücke:
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10+60.39 EUR
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LFBGAMU3A NXP USA Inc. Description: 324 PIN 1.0MM PGA SOCKET SPACER
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
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LFK77CINTPWC NXP USA Inc. Description: NXP MPC5777C 300MHZ416-PIN 1.0
Packaging: Bulk
Produkt ist nicht verfügbar
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BF904AWR,115 BF904A%2CAR%2CAWR.pdf
BF904AWR,115
Hersteller: NXP USA Inc.
Description: RF MOSFET 5V CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 200MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 7 V
Voltage - Test: 5 V
Current - Test: 10 mA
auf Bestellung 12000 Stücke:
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Anzahl Preis
1480+0.33 EUR
Mindestbestellmenge: 1480
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MC9328MX1CVM15 MC9328MX1.pdf
MC9328MX1CVM15
Hersteller: NXP USA Inc.
Description: IC MPU I.MX1 150MHZ 256MAPBGA
Packaging: Tray
Package / Case: 256-MAPBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
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MC68LC302AF16VCT MC68LC302.pdf
MC68LC302AF16VCT
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 16MHZ 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 3.3V
Supplier Device Package: 100-LQFP (14x14)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
auf Bestellung 56 Stücke:
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Anzahl Preis
1+106.44 EUR
10+86.95 EUR
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BC856T,115 BC856T_857T_Rev_Feb2017.pdf
BC856T,115
Hersteller: NXP USA Inc.
Description: TRANS PNP 65V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 125 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SC-75
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 65 V
Power - Max: 150 mW
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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MC34SB0800AER2
MC34SB0800AER2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 36V 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 36V
Applications: Pump, Valve Controller
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
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MC34SB0800AER2
MC34SB0800AER2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 36V 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 36V
Applications: Pump, Valve Controller
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
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MC34SB0800AER2
MC34SB0800AER2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 36V 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 36V
Applications: Pump, Valve Controller
Supplier Device Package: 64-LQFP (10x10)
auf Bestellung 1500 Stücke:
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Anzahl Preis
16+32.47 EUR
Mindestbestellmenge: 16
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74AHCT244PW,112 74AHC_AHCT244.pdf
74AHCT244PW,112
Hersteller: NXP USA Inc.
Description: IC BUFF/DVR TRI-ST DUAL 20TSSOP
Packaging: Bulk
auf Bestellung 12120 Stücke:
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Anzahl Preis
1722+0.29 EUR
Mindestbestellmenge: 1722
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S912B32E4CFUE8 M68HC12B.pdf
S912B32E4CFUE8
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC912D60AMFUE8 MC68HC912D60A.pdf
MC912D60AMFUE8
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 60KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 8x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCHC912B32VFUE8 M68HC12B.pdf
MCHC912B32VFUE8
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC68C812A4PVE5 MC68HC812A4.pdf
XC68C812A4PVE5
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 4KB EEPROM 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 5MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 1K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: EEPROM
Core Processor: CPU12
Data Converters: A/D 8x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912B32E4MFUE8R
S912B32E4MFUE8R
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912DG12AE0CPVE
S912DG12AE0CPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Bulk
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1313FBD48,151 LPC1311_13_42_43.pdf
LPC1313FBD48,151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1730 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.23 EUR
10+5.57 EUR
25+5.08 EUR
100+4.69 EUR
250+4.23 EUR
500+3.99 EUR
1000+3.86 EUR
Mindestbestellmenge: 3
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S912XD64F2CAA 9S12XDP512DGV1.pdf
S912XD64F2CAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74AHCT373PW,118 74AHC373.pdf
74AHCT373PW,118
Hersteller: NXP USA Inc.
Description: IC OCT D TRANSP LTCH 3ST 20TSSOP
Packaging: Bulk
auf Bestellung 33538 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2959+0.17 EUR
Mindestbestellmenge: 2959
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74LVU04D,118 74LVU04.pdf
74LVU04D,118
Hersteller: NXP USA Inc.
Description: IC HEX INVERTER 14SOIC
Packaging: Bulk
auf Bestellung 5200 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2420+0.19 EUR
Mindestbestellmenge: 2420
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MC908KX8MDWE MC68HC908KX8.pdf
MC908KX8MDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HCT373D-Q100,118 PHGLS25322-1.pdf?t.download=true&u=5oefqw
74HCT373D-Q100,118
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-SO
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2479 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1374+0.36 EUR
Mindestbestellmenge: 1374
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MFS2323BMBA1EPR2 FS23_SBC.pdf
MFS2323BMBA1EPR2
Hersteller: NXP USA Inc.
Description: MFS2323BMBA1EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MPF5200AMBA1ESR2 PF5200.pdf
MPF5200AMBA1ESR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 32-HWQFN (5x5)
Produkt ist nicht verfügbar
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MFS2323BMBA1EP FS23_SBC.pdf
MFS2323BMBA1EP
Hersteller: NXP USA Inc.
Description: MFS2323BMBA1EP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MPF5200AMBA1ES PF5200.pdf
MPF5200AMBA1ES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Current - Supply: 40µA
Supplier Device Package: 32-HWQFN (5x5)
Grade: Automotive
Produkt ist nicht verfügbar
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S9S12ZVL16ACLC
Hersteller: NXP USA Inc.
Description: S12Z CPU, 16K FLASH
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12ZVL16AVLC
S9S12ZVL16AVLC
Hersteller: NXP USA Inc.
Description: S12Z CPU, 16K FLASH
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
Produkt ist nicht verfügbar
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S9S12ZVL16ACLFR
Hersteller: NXP USA Inc.
Description: S12Z CPU, 16K FLASH
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S12ZVL16ACLF
Hersteller: NXP USA Inc.
Description: S12Z CPU, 16K FLASH
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MPC8343EVRAGDB
MPC8343EVRAGDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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MIMXRT1180-EVK
Hersteller: NXP USA Inc.
Description: IC
Packaging: Box
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7, Cortex®-M33
Utilized IC / Part: RT1180
Produkt ist nicht verfügbar
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FS32K142URT0VLHT S32K1xx.pdf
FS32K142URT0VLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC16374ADGG,112 74LVC_LVCH16374A.pdf
74LVC16374ADGG,112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 48TSSOP
Packaging: Bulk
auf Bestellung 7476 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1066+0.47 EUR
Mindestbestellmenge: 1066
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74LVT16373ADGG,112 74LVT16373A.pdf
74LVT16373ADGG,112
Hersteller: NXP USA Inc.
Description: IC 16BIT TRANSP LATCH D 48TSSOP
Packaging: Bulk
auf Bestellung 8775 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
703+0.72 EUR
Mindestbestellmenge: 703
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74ABT16244ADGG,112 74ABT16244A.pdf
74ABT16244ADGG,112
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 48TSSOP
Packaging: Bulk
auf Bestellung 2822 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
556+0.91 EUR
Mindestbestellmenge: 556
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74LVC16240ADGG,112 74LVC16240A.pdf
74LVC16240ADGG,112
Hersteller: NXP USA Inc.
Description: IC INVERTER QUAD 4-INPUT 48TSSOP
Packaging: Bulk
auf Bestellung 1850 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
552+0.91 EUR
Mindestbestellmenge: 552
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LPC1114LVFHN24/303 LPC111XLV_LPC11XXLVUK.pdf
LPC1114LVFHN24/303
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
auf Bestellung 1969 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
162+2.88 EUR
Mindestbestellmenge: 162
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LPC1114FHN33/302:5 UM10398.pdf
LPC1114FHN33/302:5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 308 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
151+3.09 EUR
Mindestbestellmenge: 151
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LPC1114LVFHI33/303 LPC111XLV_LPC11XXLVUK.pdf
LPC1114LVFHI33/303
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 27
DigiKey Programmable: Not Verified
auf Bestellung 350 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
143+3.25 EUR
Mindestbestellmenge: 143
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LPC1114JHN33/303E LPC111X.pdf
LPC1114JHN33/303E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 12185 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
146+3.19 EUR
Mindestbestellmenge: 146
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KW45B41Z-LOC KW45.pdf
Hersteller: NXP USA Inc.
Description: KW45B41Z-LOC
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: KW45B41Z
Produkt ist nicht verfügbar
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MC32PF1550A4EPR2 PF1550.pdf
MC32PF1550A4EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC9S08LC60LH MC9S08LC60.pdf
MC9S08LC60LH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SL2S2602FTBX SL2S2602.pdf
SL2S2602FTBX
Hersteller: NXP USA Inc.
Description: ICODE
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: ISO 15693
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 1.3V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 3-XSON (1x1.45)
auf Bestellung 14470 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
38+0.48 EUR
43+0.41 EUR
46+0.39 EUR
100+0.35 EUR
250+0.33 EUR
500+0.32 EUR
1000+0.31 EUR
Mindestbestellmenge: 38
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NX5DV330DS,118 NX5DV330.pdf
NX5DV330DS,118
Hersteller: NXP USA Inc.
Description: IC VIDEO MUX/DEMUX 1X2 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-SSOP
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
auf Bestellung 318919 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
477+1.03 EUR
Mindestbestellmenge: 477
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MPC7410VS500LE DS_568_MPC7410.pdf
MPC7410VS500LE
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 500MHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MCF5481CVR166 MCF5485EC.pdf
MCF5481CVR166
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX8MM6DVTLZAAR IMX8MMCEC.pdf
MIMX8MM6DVTLZAAR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Cut Tape (CT)
Package / Case: 486-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Additional Interfaces: I2C, I2S, eMMC/SDIO, PCIe, SPI, UART
auf Bestellung 725 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+55.79 EUR
10+45.4 EUR
25+42.8 EUR
100+39.95 EUR
250+38.59 EUR
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S9KEAZN32AVLH
S9KEAZN32AVLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MR-CANHUBK344MIN
Hersteller: NXP USA Inc.
Description: MR-CANHUBK344MIN
Packaging: Box
Produkt ist nicht verfügbar
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MR-CANHUBK3
Hersteller: NXP USA Inc.
Description: MOBILE ROBOTICS S32K3 T1 6XCAN H
Packaging: Bulk
Produkt ist nicht verfügbar
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74HCT138PW,112 74HC_HCT138.pdf
74HCT138PW,112
Hersteller: NXP USA Inc.
Description: IC DECOD/DEMUX 3-8 LINE 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
auf Bestellung 15435 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1647+0.29 EUR
Mindestbestellmenge: 1647
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IMXEBOOKDC5 IMXEBOOKDC5-UM.pdf
Hersteller: NXP USA Inc.
Description: EPD DISPLAY PARALLEL INTERFACE
Packaging: Box
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1366.94 EUR
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MC7410VU500LE DS_568_MPC7410.pdf
MC7410VU500LE
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC7447AHX600NB MPC7447AEC.pdf
MC7447AHX600NB
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 600MHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC7447AHX867NB MPC7447AEC.pdf
MC7447AHX867NB
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 867MHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 867MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC7447ATHX1000NB MPC7447AEC.pdf
MC7447ATHX1000NB
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MIMX8ML8DVNLZCB MIMX8ML.pdf
MIMX8ML8DVNLZCB
Hersteller: NXP USA Inc.
Description: MIMX8ML8DVNLZCB
Packaging: Tray
Package / Case: 548-LFBGA
Speed: 1.8GHz, 800MHz
RAM Size: 868KB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP
Connectivity: CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 548-LFBGA (15x15)
Architecture: DSP, MCU, MPU
auf Bestellung 630 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+73.39 EUR
10+60.39 EUR
25+59.04 EUR
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MIMX8ML8DVNLZDB MIMX8ML.pdf
MIMX8ML8DVNLZDB
Hersteller: NXP USA Inc.
Description: MIMX8ML8DVNLZDB
Packaging: Tray
Package / Case: 548-LFBGA
Speed: 1.8GHz, 800MHz
RAM Size: 868KB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP
Connectivity: CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 548-LFBGA (15x15)
Architecture: DSP, MCU, MPU
auf Bestellung 628 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+73.39 EUR
10+60.39 EUR
25+59.04 EUR
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LFBGAMU3A
Hersteller: NXP USA Inc.
Description: 324 PIN 1.0MM PGA SOCKET SPACER
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
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LFK77CINTPWC
Hersteller: NXP USA Inc.
Description: NXP MPC5777C 300MHZ416-PIN 1.0
Packaging: Bulk
Produkt ist nicht verfügbar
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