Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36604) > Seite 528 nach 611
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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S9S12GN48ACLF | NXP USA Inc. |
 Description: IC MCU 16BIT 48KB FLASH 48LQFPPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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NCK2982RHN/00100Y | NXP USA Inc. |
Description: MANTRA CS Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 48-HVQFN (7x7) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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S912ZVL64F0MFM | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Number of I/O: 19 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC35FS4500NAER2 | NXP USA Inc. |
Description: FS4500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC35FS4500CAER2 | NXP USA Inc. |
Description: FS4500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC35FS4501NAER2 | NXP USA Inc. |
Description: FS4500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC35FS6502NAER2 | NXP USA Inc. |
Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC35FS6502CAER2 | NXP USA Inc. |
Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC35FS6511CAER2 | NXP USA Inc. |
Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| NT4H2421TSDUD/020Z | NXP USA Inc. |
Description: NT4H2421TSDUD Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader/Transponder Operating Temperature: -25°C ~ 70°C (TA) Standards: NFC Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 25977 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| 8MINTPOS | NXP USA Inc. |
Description: 8MINTPOS Packaging: Bulk |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1064DVL6BR | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA Packaging: Cut Tape (CT) Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz Program Memory Size: 4MB (4M x 8) RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 1492 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08PA4AMSC | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S08 Data Converters: A/D 4x12b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Number of I/O: 6 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| MF1P4200DA4/00J | NXP USA Inc. |
Description: MIFARE PLUS EV2 Packaging: Tape & Reel (TR) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C (TA) Standards: Mifare, NFC Supplier Device Package: PLLMC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 17500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| FXLS93322AESR2 | NXP USA Inc. |
Description: PSI5 XY DUAL-AXIS MEDIUM-G INER Packaging: Tape & Reel (TR) Package / Case: 16-LQFN Exposed Pad Output Type: I2C, SPI Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C Supplier Device Package: 16-HLQFNR (4x4) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF4000EL/101Q20AY | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2041 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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MC33FS8410G3KSR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC33FS8430G0KSR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC33FS8430G1KSR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC33FS8410G3KS | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tray Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 56-HVQFN (8x8) Current - Supply: 15mA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC33FS8410G6KS | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 56-HVQFN (8x8) Current - Supply: 15mA Applications: System Basis Chip Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| A5G23H110NT4 | NXP USA Inc. |
Description: RF MOSFET 48V 6DFN Packaging: Tape & Reel (TR) Package / Case: 6-LDFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.3GHz ~ 2.4GHz Power - Output: 13.8W Gain: 17.9dB Supplier Device Package: 6-PDFN (7x6.5) Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 60 mA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| S12VRP-DEMO | NXP USA Inc. |
Description: S12VRP SOLUTION BOARD FOR WINDOW Packaging: Bulk Function: Relay Control Type: Interface Utilized IC / Part: S12VRP Supplied Contents: Board(s) Embedded: Yes, MCU, 16-Bit |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| LFLAIBK46MT4QA | NXP USA Inc. |
Description: QORIVVA MPC5746 292 PIN 0.8MM EQ Packaging: Bulk For Use With/Related Products: MPC5746 Module/Board Type: Socket Adapter |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| AFT27S006N-1000M | NXP USA Inc. |
Description: RF MOSFET Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| RDW8887-AGQ-S0 | NXP USA Inc. |
Description: RDW8887-AGQ-S0 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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PEMI8QFN/WK,132 | NXP USA Inc. |
Description: FILTER RC(PI) 200 OHM/13.5PF SMD Number of Channels: 8 ESD Protection: Yes Resistance - Channel (Ohms): 200 Technology: RC (Pi) Applications: LAN, PCS, WAN Filter Order: 2nd Attenuation Value: 24dB @ 800MHz ~ 3GHz Height: 0.020" (0.50mm) Values: R = 200Ohms, C = 13.5pF (Total) Operating Temperature: -40°C ~ 85°C Type: Low Pass Mounting Type: Surface Mount Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm) Package / Case: 16-XFDFN Exposed Pad Packaging: Bulk |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S12XS256J0VAER | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 44 Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x12b Core Processor: HCS12X Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 12K x 8 Program Memory Size: 256KB (256K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SPC5603CF2CLL6 | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 384KB (384K x 8) RAM Size: 40K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| S9S12G48J1CLC | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Supplier Device Package: 32-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 12x10b Core Processor: S12 EEPROM Size: 1.5K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 48KB (48K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Number of I/O: 26 Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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LS2084AXE7V1B | NXP USA Inc. |
Description: IC MPU QORIQ 2.0GHZ 1292FCPBGA Supplier Device Package: 1292-FCPBGA (37.5x37.5) Core Processor: ARM® Cortex®-A72 Operating Temperature: -40°C ~ 105°C Speed: 2.0GHz Mounting Type: Surface Mount Package / Case: 1292-BFBGA, FCBGA Packaging: Tray SATA: SATA (2) Security Features: Secure Boot, TrustZone® RAM Controllers: DDR4 Number of Cores/Bus Width: 8 Core, 64-Bit USB: USB 3.0 (2) + PHY Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 21 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC9S08GW32CLKR | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 80LQFP Data Converters: A/D 16x16b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Program Memory Size: 32KB (32K x 8) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 80-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 45 Supplier Device Package: 80-LQFP (14x14) Peripherals: LCD, PWM, WDT Connectivity: I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 8-Bit |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SPC5604BF2VLL6R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP DigiKey Programmable: Not Verified Number of I/O: 79 Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 28x10b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC33FS6521CAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC33FS6521CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| MFS2401AVMA0ESR2 | NXP USA Inc. |
Description: IC Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 115°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| MFS2401AVMA0ES | NXP USA Inc. |
Description: IC Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 115°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| NCJ3320EHN/0SY | NXP USA Inc. |
Description: NCJ3320EHN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF4000EL/101Z524Y | NXP USA Inc. |
Description: SAF4000EL Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SAF4000EL/101Z524K | NXP USA Inc. |
Description: SAF4000EL Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 630 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| KIT-UCANS32K146 | NXP USA Inc. |
Description: UCANS32K146 DEVELOPMENT SYSTEM Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M4 Utilized IC / Part: S32K146 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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SPC5744BSK1AMMH6 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA Packaging: Tray Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4 Data Converters: A/D 36x10b, 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Supplier Device Package: 100-MAPBGA (11x11) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 880 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| RDW8987-AUTO-R0 | NXP USA Inc. |
Description: RDW8987-AUTO-R0 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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MC33PF8100CHES | NXP USA Inc. |
Description: IC POWER MANAGEMENT I.MX8QM Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MPC8533EVTAQGA | NXP USA Inc. |
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 90°C (TA) Core Processor: PowerPC e500v2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, HSSI, I2C, PCI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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NCX2200GSH | NXP USA Inc. |
Description: IC COMPARATOR 1 GEN PUR 6XSON Packaging: Tape & Reel (TR) Package / Case: 6-XFDFN Output Type: Rail-to-Rail Mounting Type: Surface Mount Number of Elements: 1 Type: General Purpose Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 6-XSON, SOT1202 (1x1) Propagation Delay (Max): 800ns Current - Quiescent (Max): 6µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA @ 5.5V CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 20mV |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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NCX2200GSH | NXP USA Inc. |
Description: IC COMPARATOR 1 GEN PUR 6XSON Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Output Type: Rail-to-Rail Mounting Type: Surface Mount Number of Elements: 1 Type: General Purpose Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 6-XSON, SOT1202 (1x1) Propagation Delay (Max): 800ns Current - Quiescent (Max): 6µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA @ 5.5V CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 20mV |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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S9S12GN16AMLF | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 48LQFP DigiKey Programmable: Not Verified Number of I/O: 40 Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x10b Core Processor: 12V1 EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 1K x 8 Program Memory Size: 16KB (16K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC33FS6527LAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MC33FS6527LAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO Supplier Device Package: 48-HLQFP (7x7) Qualification: AEC-Q100 Grade: Automotive Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S12ZVLS1F0MFM | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 32QFN DigiKey Programmable: Not Verified Number of I/O: 19 Supplier Device Package: 32-QFN-EP (5x5) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Core Size: 16-Bit Data Converters: A/D 6x10b Core Processor: S12Z EEPROM Size: 128 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 1K x 8 Program Memory Size: 16KB (16K x 8) Speed: 32MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| AFRX5G272T4 | NXP USA Inc. |
Description: AIRFAST RX MODULE, 2300-2690 MHZ Packaging: Tape & Reel (TR) Package / Case: 20-LFLGA Exposed Pad Frequency: 2.3GHz ~ 2.69GHz RF Type: 5G, LTE Supplier Device Package: 21-HLLGA (6.2x6.2) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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PN7220EV/C100K | NXP USA Inc. |
Description: PN7220EV/C100K Packaging: Tray Package / Case: 64-VFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, USB Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.4V ~ 5.5V Standards: FeliCa, ISO 14443A, ISO 14443B, ISO 15693, Mifare, NFC Supplier Device Package: 64-VFBGA (4.5x4.5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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S9S12G128J0VLH | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 64LQFP Number of I/O: 54 Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 12x10b Core Processor: S12 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 8 Program Memory Size: 128KB (128K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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S9S12G128J0VLHR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 64LQFP Number of I/O: 54 Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 12x10b Core Processor: S12 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 8 Program Memory Size: 128KB (128K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| MFS2621AMDA0ADR2 | NXP USA Inc. |
Description: AUTO SBC Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Current - Supply: 30µA Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| MFS2621AMDA0AD | NXP USA Inc. |
Description: AUTO SBC Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Current - Supply: 30µA Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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MFS5600AMMA8ESR2 | NXP USA Inc. |
Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 36V Current - Supply: 140µA Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| SAF4000EL/101Z224K | NXP USA Inc. |
Description: SAF4000EL Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 630 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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SC16C650BIBS,128 | NXP USA Inc. |
Description: IC UART SINGLE W/FIFO 32-HVQFN With Modem Control: Yes With False Start Bit Detection: Yes With IrDA Encoder/Decoder: Yes With Auto Flow Control: Yes Supplier Device Package: 32-HVQFN (5x5) Data Rate (Max): 3Mbps FIFO's: 32 Byte Voltage - Supply: 2.5V, 3.3V, 5V Mounting Type: Surface Mount Number of Channels: 1, UART Package / Case: 32-VFQFN Exposed Pad Packaging: Bulk |
auf Bestellung 7366 Stücke: Lieferzeit 10-14 Tag (e) |
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| S9S12GN48ACLF |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| NCK2982RHN/00100Y |
Hersteller: NXP USA Inc.
Description: MANTRA CS
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
Description: MANTRA CS
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912ZVL64F0MFM |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC35FS4500NAER2 |
|
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC35FS4500CAER2 |
|
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC35FS4501NAER2 |
|
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC35FS6502NAER2 |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC35FS6502CAER2 |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC35FS6511CAER2 |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| NT4H2421TSDUD/020Z |
Hersteller: NXP USA Inc.
Description: NT4H2421TSDUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: NFC
Supplier Device Package: Wafer
Description: NT4H2421TSDUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
Mindestbestellmenge: 25977 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| 8MINTPOS |
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 220.44 EUR |
| 10+ | 198.43 EUR |
| MIMXRT1064DVL6BR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 1492 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 31.02 EUR |
| 10+ | 24.6 EUR |
| 25+ | 23 EUR |
| 100+ | 21.24 EUR |
| 250+ | 20.96 EUR |
| MC9S08PA4AMSC |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 4x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 6
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 4x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 6
Produkt ist nicht verfügbar
Mindestbestellmenge: 2450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MF1P4200DA4/00J |
|
Hersteller: NXP USA Inc.
Description: MIFARE PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Description: MIFARE PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
Mindestbestellmenge: 17500 Stücke
Im Einkaufswagen
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| FXLS93322AESR2 |
|
Hersteller: NXP USA Inc.
Description: PSI5 XY DUAL-AXIS MEDIUM-G INER
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Description: PSI5 XY DUAL-AXIS MEDIUM-G INER
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF4000EL/101Q20AY |
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC33FS8410G3KSR2 |
|
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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| MC33FS8430G0KSR2 |
|
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MC33FS8430G1KSR2 |
|
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MC33FS8410G3KS |
|
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Description: SAFETY POWER MANAGEMENT IC, QFN5
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Produkt ist nicht verfügbar
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| MC33FS8410G6KS |
|
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Description: SAFETY POWER MANAGEMENT IC, QFN5
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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| A5G23H110NT4 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET 48V 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.4GHz
Power - Output: 13.8W
Gain: 17.9dB
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 60 mA
Description: RF MOSFET 48V 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.4GHz
Power - Output: 13.8W
Gain: 17.9dB
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 60 mA
Produkt ist nicht verfügbar
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| S12VRP-DEMO |
Hersteller: NXP USA Inc.
Description: S12VRP SOLUTION BOARD FOR WINDOW
Packaging: Bulk
Function: Relay Control
Type: Interface
Utilized IC / Part: S12VRP
Supplied Contents: Board(s)
Embedded: Yes, MCU, 16-Bit
Description: S12VRP SOLUTION BOARD FOR WINDOW
Packaging: Bulk
Function: Relay Control
Type: Interface
Utilized IC / Part: S12VRP
Supplied Contents: Board(s)
Embedded: Yes, MCU, 16-Bit
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| LFLAIBK46MT4QA |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5746 292 PIN 0.8MM EQ
Packaging: Bulk
For Use With/Related Products: MPC5746
Module/Board Type: Socket Adapter
Description: QORIVVA MPC5746 292 PIN 0.8MM EQ
Packaging: Bulk
For Use With/Related Products: MPC5746
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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| PEMI8QFN/WK,132 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/13.5PF SMD
Number of Channels: 8
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 24dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 13.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Package / Case: 16-XFDFN Exposed Pad
Packaging: Bulk
Description: FILTER RC(PI) 200 OHM/13.5PF SMD
Number of Channels: 8
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 24dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 13.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Package / Case: 16-XFDFN Exposed Pad
Packaging: Bulk
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1567+ | 0.36 EUR |
| S9S12XS256J0VAER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
Description: IC MCU 16BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
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| SPC5603CF2CLL6 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| S9S12G48J1CLC |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Number of I/O: 26
Packaging: Tray
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Number of I/O: 26
Packaging: Tray
Produkt ist nicht verfügbar
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| LS2084AXE7V1B |
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 2.0GHZ 1292FCPBGA
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C
Speed: 2.0GHz
Mounting Type: Surface Mount
Package / Case: 1292-BFBGA, FCBGA
Packaging: Tray
SATA: SATA (2)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR4
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 (2) + PHY
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
Description: IC MPU QORIQ 2.0GHZ 1292FCPBGA
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Core Processor: ARM® Cortex®-A72
Operating Temperature: -40°C ~ 105°C
Speed: 2.0GHz
Mounting Type: Surface Mount
Package / Case: 1292-BFBGA, FCBGA
Packaging: Tray
SATA: SATA (2)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR4
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 (2) + PHY
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
Produkt ist nicht verfügbar
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| MC9S08GW32CLKR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Data Converters: A/D 16x16b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 45
Supplier Device Package: 80-LQFP (14x14)
Peripherals: LCD, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Data Converters: A/D 16x16b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 45
Supplier Device Package: 80-LQFP (14x14)
Peripherals: LCD, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Produkt ist nicht verfügbar
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| SPC5604BF2VLL6R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MC33FS6521CAER2 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MC33FS6521CAE |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Produkt ist nicht verfügbar
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| MFS2401AVMA0ESR2 |
|
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: IC
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MFS2401AVMA0ES |
|
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: IC
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| NCJ3320EHN/0SY |
Produkt ist nicht verfügbar
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| SAF4000EL/101Z524Y |
Produkt ist nicht verfügbar
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| SAF4000EL/101Z524K |
Produkt ist nicht verfügbar
Mindestbestellmenge: 630 Stücke
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| KIT-UCANS32K146 |
|
Hersteller: NXP USA Inc.
Description: UCANS32K146 DEVELOPMENT SYSTEM
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: S32K146
Description: UCANS32K146 DEVELOPMENT SYSTEM
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: S32K146
Produkt ist nicht verfügbar
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| SPC5744BSK1AMMH6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MC33PF8100CHES |
|
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT I.MX8QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Description: IC POWER MANAGEMENT I.MX8QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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| MPC8533EVTAQGA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI
Produkt ist nicht verfügbar
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| NCX2200GSH |
|
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
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Im Einkaufswagen
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| NCX2200GSH |
|
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
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Im Einkaufswagen
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| S9S12GN16AMLF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: 12V1
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 16BIT 16KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: 12V1
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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| MC33FS6527LAER2 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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| MC33FS6527LAE |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Supplier Device Package: 48-HLQFP (7x7)
Qualification: AEC-Q100
Grade: Automotive
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Supplier Device Package: 48-HLQFP (7x7)
Qualification: AEC-Q100
Grade: Automotive
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 18.2 EUR |
| 10+ | 14.18 EUR |
| 25+ | 13.19 EUR |
| 100+ | 12.09 EUR |
| 250+ | 11.57 EUR |
| S9S12ZVLS1F0MFM |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 19
Supplier Device Package: 32-QFN-EP (5x5)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 6x10b
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 32MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Description: IC MCU 16BIT 16KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 19
Supplier Device Package: 32-QFN-EP (5x5)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 6x10b
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 32MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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| AFRX5G272T4 |
|
Hersteller: NXP USA Inc.
Description: AIRFAST RX MODULE, 2300-2690 MHZ
Packaging: Tape & Reel (TR)
Package / Case: 20-LFLGA Exposed Pad
Frequency: 2.3GHz ~ 2.69GHz
RF Type: 5G, LTE
Supplier Device Package: 21-HLLGA (6.2x6.2)
Description: AIRFAST RX MODULE, 2300-2690 MHZ
Packaging: Tape & Reel (TR)
Package / Case: 20-LFLGA Exposed Pad
Frequency: 2.3GHz ~ 2.69GHz
RF Type: 5G, LTE
Supplier Device Package: 21-HLLGA (6.2x6.2)
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| PN7220EV/C100K |
|
Hersteller: NXP USA Inc.
Description: PN7220EV/C100K
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, ISO 15693, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Description: PN7220EV/C100K
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, ISO 15693, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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| S9S12G128J0VLH |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
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| S9S12G128J0VLHR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MFS2621AMDA0ADR2 |
|
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
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| MFS2621AMDA0AD |
|
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
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| MFS5600AMMA8ESR2 |
|
Hersteller: NXP USA Inc.
Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
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| SAF4000EL/101Z224K |
Produkt ist nicht verfügbar
Mindestbestellmenge: 630 Stücke
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| SC16C650BIBS,128 |
|
Hersteller: NXP USA Inc.
Description: IC UART SINGLE W/FIFO 32-HVQFN
With Modem Control: Yes
With False Start Bit Detection: Yes
With IrDA Encoder/Decoder: Yes
With Auto Flow Control: Yes
Supplier Device Package: 32-HVQFN (5x5)
Data Rate (Max): 3Mbps
FIFO's: 32 Byte
Voltage - Supply: 2.5V, 3.3V, 5V
Mounting Type: Surface Mount
Number of Channels: 1, UART
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Description: IC UART SINGLE W/FIFO 32-HVQFN
With Modem Control: Yes
With False Start Bit Detection: Yes
With IrDA Encoder/Decoder: Yes
With Auto Flow Control: Yes
Supplier Device Package: 32-HVQFN (5x5)
Data Rate (Max): 3Mbps
FIFO's: 32 Byte
Voltage - Supply: 2.5V, 3.3V, 5V
Mounting Type: Surface Mount
Number of Channels: 1, UART
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
auf Bestellung 7366 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 53+ | 10.66 EUR |