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74LVC3G14GD,125 74LVC3G14GD,125 NXP USA Inc. PHGLS27083-1.pdf?t.download=true&u=5oefqw Description: IC TRIGGER SCHMITT TRPL 8-XSON
Packaging: Bulk
auf Bestellung 99000 Stücke:
Lieferzeit 10-14 Tag (e)
2049+0.25 EUR
Mindestbestellmenge: 2049
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MCIMX31LCVMN4C MCIMX31LCVMN4C NXP USA Inc. MCIMX31C.pdf Description: IC MPU I.MX31 400MHZ 473LFBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
Produkt ist nicht verfügbar
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MC68SEC000AA20 MC68SEC000AA20 NXP USA Inc. MC68SEC000.pdf Description: IC MPU M680X0 20MHZ 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-QFP (14x14)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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KITFS86TRKFRDMEM NXP USA Inc. Description: EVAL BOARD FS86 24V
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: FS86
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Secondary Attributes: USB Interface(s)
Embedded: Yes, MCU, 32-Bit
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MPXD1010VLQ64 MPXD1010VLQ64 NXP USA Inc. PXD10.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 105
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BTS6305CJ NXP USA Inc. BTS6305C.pdf Description: RF AMPLIFIER BTS6305C
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BTS6305UJ BTS6305UJ NXP USA Inc. BTS6305U.pdf Description: 5G MASSIVE MIMO PRE-DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: 5G, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 42dB
Current - Supply: 122mA
Noise Figure: 3.5dB ~ 4dB
P1dB: 28.5dBm
Test Frequency: 3.6GHz
Supplier Device Package: 16-HVQFN (3x3)
Produkt ist nicht verfügbar
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NX3P191UK,012 NX3P191UK,012 NXP USA Inc. PHGLS29357-1.pdf?t.download=true&u=5oefqw Description: IC PWR SWITCH HI SIDE LOG 4WLCSP
Packaging: Bulk
auf Bestellung 14492 Stücke:
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LPC55S36-EVK LPC55S36-EVK NXP USA Inc. LPC5536-EVK-QSG.pdf Description: LPC55S36 EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: LPC55S36
Platform: LPCXpresso™
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LPC5502JHI48J LPC5502JHI48J NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 64KB FLASH 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
Produkt ist nicht verfügbar
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LPC5502JHI48EL LPC5502JHI48EL NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 64KB FLASH 48VFQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
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10+4.97 EUR
25+4.74 EUR
40+4.62 EUR
80+4.46 EUR
230+4.22 EUR
440+4.08 EUR
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MCZ33905CS3EK MCZ33905CS3EK NXP USA Inc. MC33903%2C4%2C5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
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10+13.61 EUR
42+12.22 EUR
126+11.47 EUR
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KMI25/2Z KMI25/2Z NXP USA Inc. KMI25_2_4.pdf Description: KMI25 - HIGH PERFORMANCE ROTATIO
Packaging: Bulk
auf Bestellung 2489 Stücke:
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179+2.70 EUR
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KMI23/4Z NXP USA Inc. Description: HIGH PERFORMANCE ROTATIONAL SPEE
Packaging: Bulk
auf Bestellung 11156 Stücke:
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177+2.73 EUR
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MC908GT16CBE MC908GT16CBE NXP USA Inc. MC68HC908GT16.pdf Description: IC MCU 8BIT 16KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 42-PDIP
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908GT8CBE MC908GT8CBE NXP USA Inc. MC68HC908GT16.pdf Description: IC MCU 8BIT 8KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 42-PDIP
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K148HET0MLQR FS32K148HET0MLQR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX8DXL-WEVK NXP USA Inc. Description: MCIMX8DXL-WEVK
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-A35, Cortex®-M4F
Utilized IC / Part: i.MX 8XLite
Produkt ist nicht verfügbar
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S9S08AW32E5MFUE S9S08AW32E5MFUE NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FXLS93433AESR2 NXP USA Inc. FXLS9xxxx.pdf Description: PSI5 XZ DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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FXLS93333AESR2 NXP USA Inc. FXLS9xxxx.pdf Description: PSI5 XY DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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FXLS90433AESR2 NXP USA Inc. FXLS9xxxx.pdf Description: XZ DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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FXLS90733AESR2 NXP USA Inc. FXLS9xxxx.pdf Description: YZ DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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FXLS90333AESR2 NXP USA Inc. FXLS9xxxx.pdf Description: XY DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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MC07XS6517DEKR2 MC07XS6517DEKR2 NXP USA Inc. Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Packaging: Tape & Reel (TR)
Features: Internal PWM
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
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MC07XS6517DEK MC07XS6517DEK NXP USA Inc. Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Packaging: Tube
Features: Internal PWM
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
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AFT26HW050SR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4S4
Mounting Type: Chassis Mount
Frequency: 2.69GHz
Configuration: Dual
Power - Output: 9W
Gain: 14.2dB
Technology: LDMOS
Supplier Device Package: NI-780-4S4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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74HC2G02GD,125 74HC2G02GD,125 NXP USA Inc. 74HC_HCT2G02.pdf Description: IC GATE NOR 2CH 2-INP 8-XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 20 µA
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MCIMX6S4AVM08ADR MCIMX6S4AVM08ADR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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OL2385AHN/001A2Y OL2385AHN/001A2Y NXP USA Inc. OL2385.pdf Description: IC RF TXRX+MCU 802.15.4 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -123dBm
Mounting Type: Surface Mount
Frequency: 158MHz ~ 960MHz
Memory Size: 7kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Protocol: Sigfox, Wireless M-Bus, Zigbee®
Current - Receiving: 600nA ~ 11mA
Data Rate (Max): 400kbps
Current - Transmitting: 500µA ~ 33mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: 2-FSK, 4-FSK, ASK, FSK, GFSK, OOK
RF Family/Standard: 802.15.4
Serial Interfaces: GPIO, SPI, UART, USART
Produkt ist nicht verfügbar
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PCA9634PW,112 PCA9634PW,112 NXP USA Inc. PCA9634.pdf Description: IC LED DRVR PS I2C 25MA 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 8
Frequency: 25MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 20-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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SSL5251T/1118 NXP USA Inc. PHGL-S-A0001022918-1.pdf?t.download=true&u=5oefqw Description: MAINS DIMMABLE BUCK
Packaging: Bulk
auf Bestellung 6754 Stücke:
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683+0.71 EUR
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SSL5237TE/1518 SSL5237TE/1518 NXP USA Inc. Description: 10 OHM/700 VOLT MAINS DIMMABLE B
Packaging: Bulk
auf Bestellung 2429 Stücke:
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579+0.83 EUR
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MC33PT2001HAER2 NXP USA Inc. MC33PT2001_SDS.pdf Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33PT2001HMAER2 MC33PT2001HMAER2 NXP USA Inc. MC33PT2001_SDS.pdf Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33PT2001AER2 MC33PT2001AER2 NXP USA Inc. MC33PT2001_SDS.pdf Description: SOLENOID CONTROLLER 6 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33PT2001HAE NXP USA Inc. MC33PT2001_SDS.pdf Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33PT2001HMAE MC33PT2001HMAE NXP USA Inc. MC33PT2001_SDS.pdf Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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IP4365CX11/P135 IP4365CX11/P135 NXP USA Inc. IP4365CX11.pdf Description: DATA LINE FILTER
Packaging: Bulk
auf Bestellung 122437 Stücke:
Lieferzeit 10-14 Tag (e)
2219+0.22 EUR
Mindestbestellmenge: 2219
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MF4SAM3HN/9BA6AUZ NXP USA Inc. Description: MF4SAM3HN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 850kHz ~ 11.5MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
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MF4SAM3HN/9BA6AUZ NXP USA Inc. Description: MF4SAM3HN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 850kHz ~ 11.5MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
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TEA19363T/1J TEA19363T/1J NXP USA Inc. TEA19363T.pdf Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Produkt ist nicht verfügbar
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TEA19363T/1J TEA19363T/1J NXP USA Inc. TEA19363T.pdf Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
auf Bestellung 2499 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.27 EUR
11+1.65 EUR
25+1.49 EUR
100+1.32 EUR
250+1.24 EUR
500+1.19 EUR
1000+1.15 EUR
Mindestbestellmenge: 8
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TDA8034HN/C2J NXP USA Inc. TDA8034HN.pdf Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
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TDA8034HN/C2EL NXP USA Inc. TDA8034HN.pdf Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
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TDA8034HN/C2QL NXP USA Inc. TDA8034HN.pdf Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
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TDA8026ET/C3K NXP USA Inc. TDA8026.pdf Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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TDA8026ET/C3Y NXP USA Inc. TDA8026.pdf Description: IC INTFACE SPECIALIZED 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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TDA8026ET/C3E NXP USA Inc. TDA8026.pdf Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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LPC3131FET180,551 LPC3131FET180,551 NXP USA Inc. LPC3130_31.pdf Description: IC MCU 16/32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 3.6V
Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
DigiKey Programmable: Not Verified
auf Bestellung 189 Stücke:
Lieferzeit 10-14 Tag (e)
189+17.77 EUR
Mindestbestellmenge: 189
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74ALVC32PW,112 74ALVC32PW,112 NXP USA Inc. 74ALVC32.pdf Description: IC GATE OR 4CH 2-INP 14-TSSOP
Packaging: Tube
auf Bestellung 4800 Stücke:
Lieferzeit 10-14 Tag (e)
2664+0.18 EUR
Mindestbestellmenge: 2664
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PCA9421BSZ PCA9421BSZ NXP USA Inc. PCA9421.pdf Description: IC PMIC HVQFN24
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Supplier Device Package: 24-HVQFN (3x3)
Produkt ist nicht verfügbar
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PCA9421BSZ PCA9421BSZ NXP USA Inc. PCA9421.pdf Description: IC PMIC HVQFN24
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Supplier Device Package: 24-HVQFN (3x3)
auf Bestellung 1390 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.91 EUR
10+3.67 EUR
25+3.36 EUR
100+3.02 EUR
250+2.86 EUR
500+2.76 EUR
Mindestbestellmenge: 4
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SAF7772EL/200Z13AY NXP USA Inc. Description: SAF7772EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7771EL/200Z13AY NXP USA Inc. Description: SAF7771EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7772EL/200Z13AK NXP USA Inc. Description: SAF7772EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7771EL/200Z13AK NXP USA Inc. Description: SAF7771EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/200Z13AY NXP USA Inc. Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/101Z13AY NXP USA Inc. Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/200Z13AK NXP USA Inc. Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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74LVC3G14GD,125 PHGLS27083-1.pdf?t.download=true&u=5oefqw
74LVC3G14GD,125
Hersteller: NXP USA Inc.
Description: IC TRIGGER SCHMITT TRPL 8-XSON
Packaging: Bulk
auf Bestellung 99000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2049+0.25 EUR
Mindestbestellmenge: 2049
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MCIMX31LCVMN4C MCIMX31C.pdf
MCIMX31LCVMN4C
Hersteller: NXP USA Inc.
Description: IC MPU I.MX31 400MHZ 473LFBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
Produkt ist nicht verfügbar
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MC68SEC000AA20 MC68SEC000.pdf
MC68SEC000AA20
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 20MHZ 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-QFP (14x14)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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KITFS86TRKFRDMEM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FS86 24V
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: FS86
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Secondary Attributes: USB Interface(s)
Embedded: Yes, MCU, 32-Bit
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+975.27 EUR
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MPXD1010VLQ64 PXD10.pdf
MPXD1010VLQ64
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 105
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BTS6305CJ BTS6305C.pdf
Hersteller: NXP USA Inc.
Description: RF AMPLIFIER BTS6305C
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BTS6305UJ BTS6305U.pdf
BTS6305UJ
Hersteller: NXP USA Inc.
Description: 5G MASSIVE MIMO PRE-DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: 5G, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 42dB
Current - Supply: 122mA
Noise Figure: 3.5dB ~ 4dB
P1dB: 28.5dBm
Test Frequency: 3.6GHz
Supplier Device Package: 16-HVQFN (3x3)
Produkt ist nicht verfügbar
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NX3P191UK,012 PHGLS29357-1.pdf?t.download=true&u=5oefqw
NX3P191UK,012
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH HI SIDE LOG 4WLCSP
Packaging: Bulk
auf Bestellung 14492 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1092+0.42 EUR
Mindestbestellmenge: 1092
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LPC55S36-EVK LPC5536-EVK-QSG.pdf
LPC55S36-EVK
Hersteller: NXP USA Inc.
Description: LPC55S36 EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: LPC55S36
Platform: LPCXpresso™
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+118.31 EUR
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LPC5502JHI48J LPC55S0x_LPC550x.pdf
LPC5502JHI48J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
Produkt ist nicht verfügbar
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LPC5502JHI48EL LPC55S0x_LPC550x.pdf
LPC5502JHI48EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48VFQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
auf Bestellung 1288 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.60 EUR
10+4.97 EUR
25+4.74 EUR
40+4.62 EUR
80+4.46 EUR
230+4.22 EUR
440+4.08 EUR
Mindestbestellmenge: 4
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MCZ33905CS3EK MC33903%2C4%2C5.pdf
MCZ33905CS3EK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
auf Bestellung 175 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+17.42 EUR
10+13.61 EUR
42+12.22 EUR
126+11.47 EUR
Mindestbestellmenge: 2
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KMI25/2Z KMI25_2_4.pdf
KMI25/2Z
Hersteller: NXP USA Inc.
Description: KMI25 - HIGH PERFORMANCE ROTATIO
Packaging: Bulk
auf Bestellung 2489 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
179+2.70 EUR
Mindestbestellmenge: 179
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KMI23/4Z
Hersteller: NXP USA Inc.
Description: HIGH PERFORMANCE ROTATIONAL SPEE
Packaging: Bulk
auf Bestellung 11156 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
177+2.73 EUR
Mindestbestellmenge: 177
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MC908GT16CBE MC68HC908GT16.pdf
MC908GT16CBE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 42-PDIP
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908GT8CBE MC68HC908GT16.pdf
MC908GT8CBE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 42-PDIP
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K148HET0MLQR S32K1xx.pdf
FS32K148HET0MLQR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX8DXL-WEVK
Hersteller: NXP USA Inc.
Description: MCIMX8DXL-WEVK
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-A35, Cortex®-M4F
Utilized IC / Part: i.MX 8XLite
Produkt ist nicht verfügbar
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S9S08AW32E5MFUE MC9S08AW60.pdf
S9S08AW32E5MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FXLS93433AESR2 FXLS9xxxx.pdf
Hersteller: NXP USA Inc.
Description: PSI5 XZ DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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FXLS93333AESR2 FXLS9xxxx.pdf
Hersteller: NXP USA Inc.
Description: PSI5 XY DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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FXLS90433AESR2 FXLS9xxxx.pdf
Hersteller: NXP USA Inc.
Description: XZ DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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FXLS90733AESR2 FXLS9xxxx.pdf
Hersteller: NXP USA Inc.
Description: YZ DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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FXLS90333AESR2 FXLS9xxxx.pdf
Hersteller: NXP USA Inc.
Description: XY DUAL-AXIS HIGH-G INERTIAL SE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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MC07XS6517DEKR2
MC07XS6517DEKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Packaging: Tape & Reel (TR)
Features: Internal PWM
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
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MC07XS6517DEK
MC07XS6517DEK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Packaging: Tube
Features: Internal PWM
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 2:3
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
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AFT26HW050SR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4S4
Mounting Type: Chassis Mount
Frequency: 2.69GHz
Configuration: Dual
Power - Output: 9W
Gain: 14.2dB
Technology: LDMOS
Supplier Device Package: NI-780-4S4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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74HC2G02GD,125 74HC_HCT2G02.pdf
74HC2G02GD,125
Hersteller: NXP USA Inc.
Description: IC GATE NOR 2CH 2-INP 8-XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 20 µA
auf Bestellung 53574 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2049+0.25 EUR
Mindestbestellmenge: 2049
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MCIMX6S4AVM08ADR IMX6SDLAEC.pdf
MCIMX6S4AVM08ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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OL2385AHN/001A2Y OL2385.pdf
OL2385AHN/001A2Y
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -123dBm
Mounting Type: Surface Mount
Frequency: 158MHz ~ 960MHz
Memory Size: 7kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Protocol: Sigfox, Wireless M-Bus, Zigbee®
Current - Receiving: 600nA ~ 11mA
Data Rate (Max): 400kbps
Current - Transmitting: 500µA ~ 33mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: 2-FSK, 4-FSK, ASK, FSK, GFSK, OOK
RF Family/Standard: 802.15.4
Serial Interfaces: GPIO, SPI, UART, USART
Produkt ist nicht verfügbar
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PCA9634PW,112 PCA9634.pdf
PCA9634PW,112
Hersteller: NXP USA Inc.
Description: IC LED DRVR PS I2C 25MA 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 8
Frequency: 25MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 20-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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SSL5251T/1118 PHGL-S-A0001022918-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: MAINS DIMMABLE BUCK
Packaging: Bulk
auf Bestellung 6754 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
683+0.71 EUR
Mindestbestellmenge: 683
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SSL5237TE/1518
SSL5237TE/1518
Hersteller: NXP USA Inc.
Description: 10 OHM/700 VOLT MAINS DIMMABLE B
Packaging: Bulk
auf Bestellung 2429 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
579+0.83 EUR
Mindestbestellmenge: 579
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MC33PT2001HAER2 MC33PT2001_SDS.pdf
Hersteller: NXP USA Inc.
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33PT2001HMAER2 MC33PT2001_SDS.pdf
MC33PT2001HMAER2
Hersteller: NXP USA Inc.
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33PT2001AER2 MC33PT2001_SDS.pdf
MC33PT2001AER2
Hersteller: NXP USA Inc.
Description: SOLENOID CONTROLLER 6 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33PT2001HAE MC33PT2001_SDS.pdf
Hersteller: NXP USA Inc.
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33PT2001HMAE MC33PT2001_SDS.pdf
MC33PT2001HMAE
Hersteller: NXP USA Inc.
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0V ~ 72V
Applications: Solenoid Controller
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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IP4365CX11/P135 IP4365CX11.pdf
IP4365CX11/P135
Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
Packaging: Bulk
auf Bestellung 122437 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2219+0.22 EUR
Mindestbestellmenge: 2219
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MF4SAM3HN/9BA6AUZ
Hersteller: NXP USA Inc.
Description: MF4SAM3HN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 850kHz ~ 11.5MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
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MF4SAM3HN/9BA6AUZ
Hersteller: NXP USA Inc.
Description: MF4SAM3HN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 850kHz ~ 11.5MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
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TEA19363T/1J TEA19363T.pdf
TEA19363T/1J
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Produkt ist nicht verfügbar
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TEA19363T/1J TEA19363T.pdf
TEA19363T/1J
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 10SO
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 25.5kHz ~ 128kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 0V ~ 120V
Supplier Device Package: 10-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
auf Bestellung 2499 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.27 EUR
11+1.65 EUR
25+1.49 EUR
100+1.32 EUR
250+1.24 EUR
500+1.19 EUR
1000+1.15 EUR
Mindestbestellmenge: 8
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TDA8034HN/C2J TDA8034HN.pdf
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
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TDA8034HN/C2EL TDA8034HN.pdf
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
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TDA8034HN/C2QL TDA8034HN.pdf
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Supplier Device Package: 24-HVQFN (4x4)
Produkt ist nicht verfügbar
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TDA8026ET/C3K TDA8026.pdf
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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TDA8026ET/C3Y TDA8026.pdf
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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TDA8026ET/C3E TDA8026.pdf
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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LPC3131FET180,551 LPC3130_31.pdf
LPC3131FET180,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 3.6V
Connectivity: EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
DigiKey Programmable: Not Verified
auf Bestellung 189 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
189+17.77 EUR
Mindestbestellmenge: 189
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74ALVC32PW,112 74ALVC32.pdf
74ALVC32PW,112
Hersteller: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14-TSSOP
Packaging: Tube
auf Bestellung 4800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2664+0.18 EUR
Mindestbestellmenge: 2664
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PCA9421BSZ PCA9421.pdf
PCA9421BSZ
Hersteller: NXP USA Inc.
Description: IC PMIC HVQFN24
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Supplier Device Package: 24-HVQFN (3x3)
Produkt ist nicht verfügbar
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PCA9421BSZ PCA9421.pdf
PCA9421BSZ
Hersteller: NXP USA Inc.
Description: IC PMIC HVQFN24
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 5.5µA
Supplier Device Package: 24-HVQFN (3x3)
auf Bestellung 1390 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.91 EUR
10+3.67 EUR
25+3.36 EUR
100+3.02 EUR
250+2.86 EUR
500+2.76 EUR
Mindestbestellmenge: 4
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SAF7772EL/200Z13AY
Hersteller: NXP USA Inc.
Description: SAF7772EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7771EL/200Z13AY
Hersteller: NXP USA Inc.
Description: SAF7771EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7772EL/200Z13AK
Hersteller: NXP USA Inc.
Description: SAF7772EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7771EL/200Z13AK
Hersteller: NXP USA Inc.
Description: SAF7771EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/200Z13AY
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/101Z13AY
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7770EL/200Z13AK
Hersteller: NXP USA Inc.
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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