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BTS7202UJ NXP USA Inc. BTS7202U.pdf Description: RX FRONT-END MODULE, 3.3-4.2 GHZ
Supplier Device Package: 40-HVQFN (6x6)
RF Type: 5G, LTE
Frequency: 3.3GHz ~ 4.2GHz
Package / Case: 40-VFQFN Exposed Pad
Features: 5V Supply Voltage
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FRDM-MCXA153 FRDM-MCXA153 NXP USA Inc. MCXAP64M96FS3.pdf Description: FREEDOM MCXA153 EVAL BRD
Platform: Freedom
Utilized IC / Part: MCXA153
Core Processor: ARM® Cortex®-M33
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
auf Bestellung 251 Stücke:
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1+28.85 EUR
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SAF4010EL/101Q50AY NXP USA Inc. Description: AUDIO DSPS SAF4010EL/101Q5005
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4010EL/101Q50AK NXP USA Inc. Description: AUDIO DSPS SAF4010EL/101Q5005
Packaging: Tray
Produkt ist nicht verfügbar
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MCF52210CAE80 MCF52210CAE80 NXP USA Inc. MCF52211.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 43
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: Coldfire V2
Produkt ist nicht verfügbar
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AFT18S230SR5 AFT18S230SR5 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Bulk
Package / Case: NI-780S-6
Mounting Type: Surface Mount
Frequency: 1.88GHz
Power - Output: 50W
Gain: 19dB
Technology: LDMOS
Supplier Device Package: NI-780S-6
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.8 A
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3+274.35 EUR
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MCXA143VFM MCXA143VFM NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCX 48MHZ SGL CR 128KB QFN32
Packaging: Tray
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
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10+5.02 EUR
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MCXA143VFT MCXA143VFT NXP USA Inc. MCXAP064M096F30.pdf Description: IC MCX 48MHZ SGL CR 128KB QFN48
Number of I/O: 41
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: POR, PWM, WDT
Connectivity: I2C, I3C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 1x12b; D/A 1x8b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Packaging: Tray
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4+6.94 EUR
10+5.21 EUR
50+4.53 EUR
100+4.32 EUR
260+4.08 EUR
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MCXA153VFM MCXA153VFM NXP USA Inc. MCXAP064M096F30.pdf Description: IC MCX 96MHZ SGL CR 128KB QFN32
Packaging: Tray
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
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3+8.9 EUR
10+6.76 EUR
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MCXA153VFT MCXA153VFT NXP USA Inc. MCXAP064M096F30.pdf Description: IC MCX 96MHZ SGL CR 128KB QFN48
Number of I/O: 41
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: POR, PWM, WDT
Connectivity: I2C, I3C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 1x12b; D/A 1x8b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 96MHz
Mounting Type: Surface Mount
Packaging: Tray
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4+5.43 EUR
10+4.05 EUR
50+3.49 EUR
100+3.32 EUR
260+3.13 EUR
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P3T2030HUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030HUKAZ
Sensing Temperature - Local: -40°C ~ 125°C
Accuracy - Highest (Lowest): ±2%
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Supplier Device Package: 4-WLCSP (0.83x0.78)
Resolution: 12 b
Sensor Type: Digital
Voltage - Supply: 1.4V ~ 1.98V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Output Type: I2C, I3C
Package / Case: 4-UFBGA, WLCSP
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
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3500+0.69 EUR
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NCF29AEMHN4/0116YY NXP USA Inc. Description: NCF29AEMHN4
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S12G128J0MLH S9S12G128J0MLH NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
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MF3D2300DA8/00J NXP USA Inc. MF3D_H_X3_SDS.pdf Description: MF3D2300DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
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MF3D4300DA8/00J NXP USA Inc. MF3D_H_X3_SDS.pdf Description: MF3D4300DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
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MF3D4300DA4/00J NXP USA Inc. MF3D_H_X3_SDS.pdf Description: MF3D4300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
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74LVC2G07GXZ 74LVC2G07GXZ NXP USA Inc. 74LVC2G07.pdf Description: IC BUFF 1.65V 6-X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-X2SON (1.0x0.8)
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SPC5602BK0VLL6 SPC5602BK0VLL6 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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BZX79-B39,133 NXP USA Inc. Description: DIODE ZENER 39V 400MW ALF2
Packaging: Bulk
auf Bestellung 22015 Stücke:
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13172+0.039 EUR
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S912ZVMAL1F0MLFR S912ZVMAL1F0MLFR NXP USA Inc. Bootloader%20User%20Guide.pdf Description: VMA16, 16K FLASH, 1K RAM, 48LQFP
Qualification: AEC-Q100
Number of I/O: 31
Grade: Automotive
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Core Size: 16-Bit
Data Converters: A/D 7x12b SAR
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LPC55S04JBD64Y LPC55S04JBD64Y NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
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1500+5.95 EUR
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LPC55S04JBD64Y LPC55S04JBD64Y NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
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3+10.22 EUR
10+7.79 EUR
50+6.82 EUR
100+6.52 EUR
500+6.01 EUR
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MF3DH9200DA4/02J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: MF3DH9200DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: PLLMC
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MF3DHA200DA4/02J NXP USA Inc. MF3DX2_MF3DHX2_SDS.pdf Description: MF3DHA200DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
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S912ZVC96AVLFR NXP USA Inc. Description: S12Z, 48LQFP, 96K FLASH
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPC862PCZQ66B MPC862PCZQ66B NXP USA Inc. MPC862EC%2C857%28T%2CDSL%29.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 115°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX8US3CVP08SC MIMX8US3CVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: 8ULP DUAL CORTEX A35
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 630 Stücke:
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1+31.86 EUR
10+25.32 EUR
25+23.69 EUR
100+21.9 EUR
250+21.04 EUR
630+20.37 EUR
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SAF4000EL/101Z130K NXP USA Inc. Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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MFS8416AMBP3ES MFS8416AMBP3ES NXP USA Inc. FS84QFN48EP.pdf Description: SAFETY POWER MANAGEMENT IC, QFN4
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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LPC5504JHI48J LPC5504JHI48J NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
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2000+5.25 EUR
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LPC5504JHI48J LPC5504JHI48J NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
auf Bestellung 2000 Stücke:
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3+7.33 EUR
10+6.65 EUR
25+6.51 EUR
50+6.47 EUR
100+5.81 EUR
250+5.78 EUR
500+5.57 EUR
1000+5.3 EUR
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LPC5504JHI48EL LPC5504JHI48EL NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
auf Bestellung 1300 Stücke:
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3+7.31 EUR
10+6.63 EUR
25+6.49 EUR
40+6.45 EUR
80+5.78 EUR
230+5.76 EUR
440+5.56 EUR
1300+5.28 EUR
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LPC5504JBD64Y LPC5504JBD64Y NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1500 Stücke
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LPC5504JBD64Y LPC5504JBD64Y NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
auf Bestellung 693 Stücke:
Lieferzeit 10-14 Tag (e)
3+9.26 EUR
10+7.03 EUR
50+6.14 EUR
100+5.87 EUR
500+5.4 EUR
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LPC5504JBD64K LPC5504JBD64K NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
auf Bestellung 740 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.98 EUR
10+6.83 EUR
50+5.97 EUR
100+5.7 EUR
500+5.25 EUR
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LPC5506JHI48J LPC5506JHI48J NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 256KB FLASH 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC5506JHI48J LPC5506JHI48J NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 256KB FLASH 48VFQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC5506JHI48EL LPC5506JHI48EL NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 256KB FLASH 48VFQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
auf Bestellung 584 Stücke:
Lieferzeit 10-14 Tag (e)
4+6.53 EUR
10+6.14 EUR
25+5.71 EUR
100+5.28 EUR
250+5.07 EUR
500+4.9 EUR
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LPC55S04JHI48J LPC55S04JHI48J NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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LPC55S04JHI48J LPC55S04JHI48J NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
auf Bestellung 1892 Stücke:
Lieferzeit 10-14 Tag (e)
3+9.32 EUR
10+7.08 EUR
25+6.53 EUR
100+5.91 EUR
250+5.63 EUR
500+5.45 EUR
1000+5.31 EUR
Mindestbestellmenge: 3 Stücke
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LPC55S04JHI48EL LPC55S04JHI48EL NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
auf Bestellung 1270 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.72 EUR
10+7.2 EUR
25+6.99 EUR
40+6.88 EUR
80+6.71 EUR
230+6.46 EUR
440+6.32 EUR
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LPC5506JBD64Y LPC5506JBD64Y NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1500 Stücke
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LPC5506JBD64Y LPC5506JBD64Y NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
auf Bestellung 1157 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.9 EUR
10+6.77 EUR
25+6.24 EUR
100+5.65 EUR
250+5.38 EUR
500+5.21 EUR
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LPC5506JBD64K LPC5506JBD64K NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
auf Bestellung 771 Stücke:
Lieferzeit 10-14 Tag (e)
3+9.73 EUR
10+7.43 EUR
50+6.5 EUR
100+6.21 EUR
500+5.72 EUR
Mindestbestellmenge: 3 Stücke
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LPC55S04JBD64K LPC55S04JBD64K NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
3+9.92 EUR
10+7.58 EUR
50+6.63 EUR
100+6.34 EUR
500+5.84 EUR
Mindestbestellmenge: 3 Stücke
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LPC55S06JHI48J LPC55S06JHI48J NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 256KB FLASH 48VFQFN
Packaging: Tape & Reel (TR)
Number of I/O: 30
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 96MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+6.43 EUR
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LPC55S06JHI48J LPC55S06JHI48J NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 256KB FLASH 48VFQFN
Number of I/O: 30
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 96MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.98 EUR
10+8.15 EUR
25+7.97 EUR
50+7.94 EUR
100+7.12 EUR
250+7.09 EUR
500+6.83 EUR
1000+6.5 EUR
Mindestbestellmenge: 3 Stücke
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LPC55S06JHI48EL LPC55S06JHI48EL NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 256KB FLASH 48VFQFN
Number of I/O: 30
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 96MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 704 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.12 EUR
10+6.32 EUR
25+6.03 EUR
40+5.88 EUR
80+5.68 EUR
230+5.37 EUR
440+5.32 EUR
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LPC5512JBD100Y LPC5512JBD100Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
3+10.39 EUR
10+7.93 EUR
50+6.95 EUR
100+6.64 EUR
500+6.13 EUR
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LPC5514JBD64K LPC5514JBD64K NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
3+10.31 EUR
10+7.88 EUR
50+6.9 EUR
100+6.59 EUR
500+6.08 EUR
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MC56F81646LVLF MC56F81646LVLF NXP USA Inc. MC56F81XXX.pdf Description: MC56F81646LVLF
Non-Volatile Memory: FLASH (64kB)
Operating Temperature: -40°C ~ 105°C (TA)
Type: Digital Signal Controllers
Interface: DMA, I2C, LINbus, SCI, QSPI
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
Supplier Device Package: 48-LQFP (7x7)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 12kB
Produkt ist nicht verfügbar
 Mindestbestellmenge: 250 Stücke
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NCJ29D5BHN/00200Y NCJ29D5BHN/00200Y NXP USA Inc. UM12397.pdf Description: NCJ29D5BHN
Supplier Device Package: 40-HVQFN (6x6)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 4000 Stücke
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MCXA154VLL MCXA154VLL NXP USA Inc. MCXAP100M96FS6.pdf Description: IC MCU 32BIT 256KB FLASH
Packaging: Tray
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
auf Bestellung 85 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.31 EUR
10+5.52 EUR
Mindestbestellmenge: 3 Stücke
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MC56F83763VLHR MC56F83763VLHR NXP USA Inc. MC56F837XXDS.pdf Description: MC56F83763VLHR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: CANbus, SCI, SPI
Type: DSP
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 48kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1500 Stücke
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DSPB56374AFC DSPB56374AFC NXP USA Inc. DSP56374.pdf Description: IC DSP 24BIT 150MHZ 80-LQFP
Supplier Device Package: 80-LQFP (14x14)
Clock Rate: 150MHz
Voltage - Core: 1.25V
Voltage - I/O: 3.30V
On-Chip RAM: 54kB
Non-Volatile Memory: ROM (84kB)
Operating Temperature: -40°C ~ 85°C (TA)
Type: Audio Processor
Interface: Host Interface, I2C, SAI, SPI
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 450 Stücke
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BLF888AS,112 NXP USA Inc. Description: TRANS SOT539B
Packaging: Tube
auf Bestellung 113 Stücke:
Lieferzeit 10-14 Tag (e)
2+434.34 EUR
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LPC55S36JBD100MP LPC55S36JBD100MP NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 3x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 66
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LPC55S36JBD100MP LPC55S36JBD100MP NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 3x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 66
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2+20 EUR
10+15.62 EUR
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100+13.33 EUR
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LPC55S36JBD100K NXP USA Inc. LPC55S3xDS.pdf Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 3x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 66
auf Bestellung 434 Stücke:
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2+18.58 EUR
10+17.09 EUR
25+16.73 EUR
40+16.67 EUR
80+14.96 EUR
230+14.51 EUR
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LPC55S36JBD100E NXP USA Inc. LPC55S3xDS.pdf Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 3x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 66
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10+17.09 EUR
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BTS7202UJ BTS7202U.pdf
Hersteller: NXP USA Inc.
Description: RX FRONT-END MODULE, 3.3-4.2 GHZ
Supplier Device Package: 40-HVQFN (6x6)
RF Type: 5G, LTE
Frequency: 3.3GHz ~ 4.2GHz
Package / Case: 40-VFQFN Exposed Pad
Features: 5V Supply Voltage
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FRDM-MCXA153 MCXAP64M96FS3.pdf
FRDM-MCXA153
Hersteller: NXP USA Inc.
Description: FREEDOM MCXA153 EVAL BRD
Platform: Freedom
Utilized IC / Part: MCXA153
Core Processor: ARM® Cortex®-M33
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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1+28.85 EUR
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SAF4010EL/101Q50AY
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF4010EL/101Q5005
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4010EL/101Q50AK
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF4010EL/101Q5005
Packaging: Tray
Produkt ist nicht verfügbar
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MCF52210CAE80 MCF52211.pdf
MCF52210CAE80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 43
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: Coldfire V2
Produkt ist nicht verfügbar
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AFT18S230SR5
AFT18S230SR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Bulk
Package / Case: NI-780S-6
Mounting Type: Surface Mount
Frequency: 1.88GHz
Power - Output: 50W
Gain: 19dB
Technology: LDMOS
Supplier Device Package: NI-780S-6
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.8 A
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3+274.35 EUR
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MCXA143VFM MCXAP64M96FS3.pdf
MCXA143VFM
Hersteller: NXP USA Inc.
Description: IC MCX 48MHZ SGL CR 128KB QFN32
Packaging: Tray
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
auf Bestellung 408 Stücke:
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4+6.66 EUR
10+5.02 EUR
25+4.62 EUR
100+4.15 EUR
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MCXA143VFT MCXAP064M096F30.pdf
MCXA143VFT
Hersteller: NXP USA Inc.
Description: IC MCX 48MHZ SGL CR 128KB QFN48
Number of I/O: 41
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: POR, PWM, WDT
Connectivity: I2C, I3C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 1x12b; D/A 1x8b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Packaging: Tray
auf Bestellung 260 Stücke:
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4+6.94 EUR
10+5.21 EUR
50+4.53 EUR
100+4.32 EUR
260+4.08 EUR
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MCXA153VFM MCXAP064M096F30.pdf
MCXA153VFM
Hersteller: NXP USA Inc.
Description: IC MCX 96MHZ SGL CR 128KB QFN32
Packaging: Tray
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
auf Bestellung 64 Stücke:
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3+8.9 EUR
10+6.76 EUR
50+5.9 EUR
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MCXA153VFT MCXAP064M096F30.pdf
MCXA153VFT
Hersteller: NXP USA Inc.
Description: IC MCX 96MHZ SGL CR 128KB QFN48
Number of I/O: 41
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: POR, PWM, WDT
Connectivity: I2C, I3C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 1x12b; D/A 1x8b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 96MHz
Mounting Type: Surface Mount
Packaging: Tray
auf Bestellung 280 Stücke:
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4+5.43 EUR
10+4.05 EUR
50+3.49 EUR
100+3.32 EUR
260+3.13 EUR
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P3T2030HUKAZ P3T1035XUK_P3T2030XUK.pdf
Hersteller: NXP USA Inc.
Description: P3T2030HUKAZ
Sensing Temperature - Local: -40°C ~ 125°C
Accuracy - Highest (Lowest): ±2%
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Supplier Device Package: 4-WLCSP (0.83x0.78)
Resolution: 12 b
Sensor Type: Digital
Voltage - Supply: 1.4V ~ 1.98V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Output Type: I2C, I3C
Package / Case: 4-UFBGA, WLCSP
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
auf Bestellung 3500 Stücke:
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3500+0.69 EUR
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NCF29AEMHN4/0116YY
Hersteller: NXP USA Inc.
Description: NCF29AEMHN4
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S12G128J0MLH MC9S12GRMV1.pdf
S9S12G128J0MLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Produkt ist nicht verfügbar
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MF3D2300DA8/00J MF3D_H_X3_SDS.pdf
Hersteller: NXP USA Inc.
Description: MF3D2300DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
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MF3D4300DA8/00J MF3D_H_X3_SDS.pdf
Hersteller: NXP USA Inc.
Description: MF3D4300DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
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MF3D4300DA4/00J MF3D_H_X3_SDS.pdf
Hersteller: NXP USA Inc.
Description: MF3D4300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
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74LVC2G07GXZ 74LVC2G07.pdf
74LVC2G07GXZ
Hersteller: NXP USA Inc.
Description: IC BUFF 1.65V 6-X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-X2SON (1.0x0.8)
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1561+0.35 EUR
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SPC5602BK0VLL6
SPC5602BK0VLL6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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BZX79-B39,133
Hersteller: NXP USA Inc.
Description: DIODE ZENER 39V 400MW ALF2
Packaging: Bulk
auf Bestellung 22015 Stücke:
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13172+0.039 EUR
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S912ZVMAL1F0MLFR Bootloader%20User%20Guide.pdf
S912ZVMAL1F0MLFR
Hersteller: NXP USA Inc.
Description: VMA16, 16K FLASH, 1K RAM, 48LQFP
Qualification: AEC-Q100
Number of I/O: 31
Grade: Automotive
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Core Size: 16-Bit
Data Converters: A/D 7x12b SAR
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LPC55S04JBD64Y LPC55S0x_LPC550x.pdf
LPC55S04JBD64Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
auf Bestellung 1500 Stücke:
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1500+5.95 EUR
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LPC55S04JBD64Y LPC55S0x_LPC550x.pdf
LPC55S04JBD64Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
auf Bestellung 2200 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+10.22 EUR
10+7.79 EUR
50+6.82 EUR
100+6.52 EUR
500+6.01 EUR
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MF3DH9200DA4/02J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: MF3DH9200DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
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MF3DHA200DA4/02J MF3DX2_MF3DHX2_SDS.pdf
Hersteller: NXP USA Inc.
Description: MF3DHA200DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, ISO 14443, ISO 7816-4
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
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S912ZVC96AVLFR
Hersteller: NXP USA Inc.
Description: S12Z, 48LQFP, 96K FLASH
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPC862PCZQ66B MPC862EC%2C857%28T%2CDSL%29.pdf
MPC862PCZQ66B
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 115°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX8US3CVP08SC IMX8ULPIEC.pdf
MIMX8US3CVP08SC
Hersteller: NXP USA Inc.
Description: 8ULP DUAL CORTEX A35
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 630 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+31.86 EUR
10+25.32 EUR
25+23.69 EUR
100+21.9 EUR
250+21.04 EUR
630+20.37 EUR
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SAF4000EL/101Z130K
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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MFS8416AMBP3ES FS84QFN48EP.pdf
MFS8416AMBP3ES
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN4
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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LPC5504JHI48J LPC55S0x_LPC550x.pdf
LPC5504JHI48J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2000+5.25 EUR
Mindestbestellmenge: 2000 Stücke
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LPC5504JHI48J LPC55S0x_LPC550x.pdf
LPC5504JHI48J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+7.33 EUR
10+6.65 EUR
25+6.51 EUR
50+6.47 EUR
100+5.81 EUR
250+5.78 EUR
500+5.57 EUR
1000+5.3 EUR
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LPC5504JHI48EL LPC55S0x_LPC550x.pdf
LPC5504JHI48EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+7.31 EUR
10+6.63 EUR
25+6.49 EUR
40+6.45 EUR
80+5.78 EUR
230+5.76 EUR
440+5.56 EUR
1300+5.28 EUR
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LPC5504JBD64Y LPC55S0x_LPC550x.pdf
LPC5504JBD64Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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LPC5504JBD64Y LPC55S0x_LPC550x.pdf
LPC5504JBD64Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
auf Bestellung 693 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.26 EUR
10+7.03 EUR
50+6.14 EUR
100+5.87 EUR
500+5.4 EUR
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LPC5504JBD64K LPC55S0x_LPC550x.pdf
LPC5504JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
auf Bestellung 740 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+8.98 EUR
10+6.83 EUR
50+5.97 EUR
100+5.7 EUR
500+5.25 EUR
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LPC5506JHI48J LPC55S0x_LPC550x.pdf
LPC5506JHI48J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC5506JHI48J LPC55S0x_LPC550x.pdf
LPC5506JHI48J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48VFQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC5506JHI48EL LPC55S0x_LPC550x.pdf
LPC5506JHI48EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48VFQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
auf Bestellung 584 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4+6.53 EUR
10+6.14 EUR
25+5.71 EUR
100+5.28 EUR
250+5.07 EUR
500+4.9 EUR
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LPC55S04JHI48J LPC55S0x_LPC550x.pdf
LPC55S04JHI48J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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LPC55S04JHI48J LPC55S0x_LPC550x.pdf
LPC55S04JHI48J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
auf Bestellung 1892 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.32 EUR
10+7.08 EUR
25+6.53 EUR
100+5.91 EUR
250+5.63 EUR
500+5.45 EUR
1000+5.31 EUR
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LPC55S04JHI48EL LPC55S0x_LPC550x.pdf
LPC55S04JHI48EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
auf Bestellung 1270 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+7.72 EUR
10+7.2 EUR
25+6.99 EUR
40+6.88 EUR
80+6.71 EUR
230+6.46 EUR
440+6.32 EUR
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LPC5506JBD64Y LPC55S0x_LPC550x.pdf
LPC5506JBD64Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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LPC5506JBD64Y LPC55S0x_LPC550x.pdf
LPC5506JBD64Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
auf Bestellung 1157 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+8.9 EUR
10+6.77 EUR
25+6.24 EUR
100+5.65 EUR
250+5.38 EUR
500+5.21 EUR
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LPC5506JBD64K LPC55S0x_LPC550x.pdf
LPC5506JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
auf Bestellung 771 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.73 EUR
10+7.43 EUR
50+6.5 EUR
100+6.21 EUR
500+5.72 EUR
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LPC55S04JBD64K LPC55S0x_LPC550x.pdf
LPC55S04JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.92 EUR
10+7.58 EUR
50+6.63 EUR
100+6.34 EUR
500+5.84 EUR
Mindestbestellmenge: 3 Stücke
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LPC55S06JHI48J LPC55S0x_LPC550x.pdf
LPC55S06JHI48J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48VFQFN
Packaging: Tape & Reel (TR)
Number of I/O: 30
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 96MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2000+6.43 EUR
Mindestbestellmenge: 2000 Stücke
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LPC55S06JHI48J LPC55S0x_LPC550x.pdf
LPC55S06JHI48J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48VFQFN
Number of I/O: 30
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 96MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+8.98 EUR
10+8.15 EUR
25+7.97 EUR
50+7.94 EUR
100+7.12 EUR
250+7.09 EUR
500+6.83 EUR
1000+6.5 EUR
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LPC55S06JHI48EL LPC55S0x_LPC550x.pdf
LPC55S06JHI48EL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48VFQFN
Number of I/O: 30
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 96MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 704 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+7.12 EUR
10+6.32 EUR
25+6.03 EUR
40+5.88 EUR
80+5.68 EUR
230+5.37 EUR
440+5.32 EUR
Mindestbestellmenge: 3 Stücke
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LPC5512JBD100Y LPC55S1x_LPC551x_DS.pdf
LPC5512JBD100Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+10.39 EUR
10+7.93 EUR
50+6.95 EUR
100+6.64 EUR
500+6.13 EUR
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LPC5514JBD64K LPC55S1x_LPC551x_DS.pdf
LPC5514JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+10.31 EUR
10+7.88 EUR
50+6.9 EUR
100+6.59 EUR
500+6.08 EUR
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MC56F81646LVLF MC56F81XXX.pdf
MC56F81646LVLF
Hersteller: NXP USA Inc.
Description: MC56F81646LVLF
Non-Volatile Memory: FLASH (64kB)
Operating Temperature: -40°C ~ 105°C (TA)
Type: Digital Signal Controllers
Interface: DMA, I2C, LINbus, SCI, QSPI
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
Supplier Device Package: 48-LQFP (7x7)
Clock Rate: 100MHz
Voltage - Core: 3.30V
Voltage - I/O: 3.30V
On-Chip RAM: 12kB
Produkt ist nicht verfügbar
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NCJ29D5BHN/00200Y UM12397.pdf
NCJ29D5BHN/00200Y
Hersteller: NXP USA Inc.
Description: NCJ29D5BHN
Supplier Device Package: 40-HVQFN (6x6)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCXA154VLL MCXAP100M96FS6.pdf
MCXA154VLL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH
Packaging: Tray
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
auf Bestellung 85 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+7.31 EUR
10+5.52 EUR
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MC56F83763VLHR MC56F837XXDS.pdf
MC56F83763VLHR
Hersteller: NXP USA Inc.
Description: MC56F83763VLHR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: CANbus, SCI, SPI
Type: DSP
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 48kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
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DSPB56374AFC DSP56374.pdf
DSPB56374AFC
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 150MHZ 80-LQFP
Supplier Device Package: 80-LQFP (14x14)
Clock Rate: 150MHz
Voltage - Core: 1.25V
Voltage - I/O: 3.30V
On-Chip RAM: 54kB
Non-Volatile Memory: ROM (84kB)
Operating Temperature: -40°C ~ 85°C (TA)
Type: Audio Processor
Interface: Host Interface, I2C, SAI, SPI
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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BLF888AS,112
Hersteller: NXP USA Inc.
Description: TRANS SOT539B
Packaging: Tube
auf Bestellung 113 Stücke:
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AnzahlPrivatkunde
2+434.34 EUR
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LPC55S36JBD100MP LPC553x.pdf
LPC55S36JBD100MP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 3x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 66
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1000+11.78 EUR
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LPC55S36JBD100MP LPC553x.pdf
LPC55S36JBD100MP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 3x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 66
auf Bestellung 2432 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+20 EUR
10+15.62 EUR
50+13.86 EUR
100+13.33 EUR
500+12.54 EUR
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LPC55S36JBD100K LPC55S3xDS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 3x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 66
auf Bestellung 434 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+18.58 EUR
10+17.09 EUR
25+16.73 EUR
40+16.67 EUR
80+14.96 EUR
230+14.51 EUR
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LPC55S36JBD100E LPC55S3xDS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 3x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 66
auf Bestellung 88 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+18.58 EUR
10+17.09 EUR
25+16.73 EUR
40+16.67 EUR
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