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S912ZVLA64ACLC NXP USA Inc. Description: S12Z CPU, 64K FLASH
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
Produkt ist nicht verfügbar
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S912ZVLA64ACLFR NXP USA Inc. Description: S12Z CPU, 64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
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S912ZVLA64ACLF NXP USA Inc. Description: S12Z CPU, 64K FLASH
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
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S912ZVLA64AMLFR NXP USA Inc. Description: IC MCU 16BIT
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912ZVLA64AVFMR NXP USA Inc. Description: S12Z CPU, 64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 34
Produkt ist nicht verfügbar
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MC908QT1ACDWE MC908QT1ACDWE NXP USA Inc. MC68HC908QY4A.pdf Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908QY1AMDWE MC908QY1AMDWE NXP USA Inc. MC68HLC908QY4.pdf Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908QB4MDWE MC908QB4MDWE NXP USA Inc. MC68HLC908QY4.pdf Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MCIMX6L3DVN10AC MCIMX6L3DVN10AC NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Bulk
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 9086 Stücke:
Lieferzeit 10-14 Tag (e)
16+31.88 EUR
Mindestbestellmenge: 16
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MWCT2D16SHT1VPB NXP USA Inc. Description: MWCT2D16S, MAXQFP172
Packaging: Tray
Produkt ist nicht verfügbar
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MWCT2D17SHT1VPBR NXP USA Inc. Description: MWCT2D17S,MAXQFP172
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MWCT2D17SHT1VPB NXP USA Inc. Description: MWCT2D17S,MAXQFP172
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S12XD256CAA MC9S12XD256CAA NXP USA Inc. 9S12XDFAMPP.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12XD256VAA MC9S12XD256VAA NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12XD256VAG MC9S12XD256VAG NXP USA Inc. MC9S12XDP512RMV2.pdf Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC125ADB,112 74LVC125ADB,112 NXP USA Inc. 74LVC125A.pdf Description: IC BUFF DVR TRI-ST QD 14SSOP
Packaging: Tube
auf Bestellung 17546 Stücke:
Lieferzeit 10-14 Tag (e)
1869+0.27 EUR
Mindestbestellmenge: 1869
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MC12311CHNR MC12311CHNR NXP USA Inc. Description: IC RF TXRX+MCU ISM<1GHZ 60VFLGA
Packaging: Tape & Reel (TR)
Package / Case: 60-VFLGA Exposed Pad
Sensitivity: -120dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 433MHz, 470MHz, 868MHz, 915MHz, 928MHz, 955MHz
Memory Size: 32kB Flash, 2kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 17dBm
Current - Receiving: 16mA
Data Rate (Max): 300kbps
Current - Transmitting: 16mA ~ 95mA
Supplier Device Package: 60-VFLGA (8x8)
GPIO: 34
Modulation: FSK, GFSK, GMSK, MSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MMRF5017HSR5 MMRF5017HSR5 NXP USA Inc. MMRF5017HS.pdf Description: RF MOSFET HEMT 50V NI400
Packaging: Bulk
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 30MHz ~ 2.2GHz
Power - Output: 125W
Gain: 18.4dB
Technology: HEMT
Supplier Device Package: NI-400S-2S
Voltage - Rated: 150 V
Voltage - Test: 50 V
Current - Test: 200 mA
auf Bestellung 451 Stücke:
Lieferzeit 10-14 Tag (e)
2+370.37 EUR
Mindestbestellmenge: 2
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MCF51AG96CLH MCF51AG96CLH NXP USA Inc. MCF51AG128.pdf Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 19x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LH79524N0F100A1 NXP USA Inc. PHGLS28978-1.pdf?hkey=86B6989B4B77B8125D7B68A214AD8E2D Description: IC MCU 32BIT ROMLESS 208LFBGA
Packaging: Tray
Package / Case: 208-LFBGA
Mounting Type: Surface Mount
Speed: 76.205MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM720T™ RISC
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LFBGA (14x14)
Number of I/O: 108
DigiKey Programmable: Not Verified
auf Bestellung 6693 Stücke:
Lieferzeit 10-14 Tag (e)
100+8.97 EUR
Mindestbestellmenge: 100
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PDTA144TU,115 PDTA144TU,115 NXP USA Inc. Description: TRANS PNP W/RES 50V SOT323
Packaging: Bulk
auf Bestellung 143980 Stücke:
Lieferzeit 10-14 Tag (e)
13172+0.032 EUR
Mindestbestellmenge: 13172
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PDTA144EMB,315 PDTA144EMB,315 NXP USA Inc. PHGLS24726-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2
auf Bestellung 200000 Stücke:
Lieferzeit 10-14 Tag (e)
11225+0.051 EUR
Mindestbestellmenge: 11225
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MCIMX6DP7CVT8AA MCIMX6DP7CVT8AA NXP USA Inc. IMX6DQPCEC.pdf Description: IC MPU I.MX6DP 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
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MFS8632BMBA0ES MFS8632BMBA0ES NXP USA Inc. Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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74LV08N,112 74LV08N,112 NXP USA Inc. 74LV08.pdf Description: IC GATE AND 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 9ns @ 3.3V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Produkt ist nicht verfügbar
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MK12DX128VLH5 MK12DX128VLH5 NXP USA Inc. K12P64M50SF4.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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N74F194D,602 N74F194D,602 NXP USA Inc. DS_568_74F194.pdf Description: IC SHIFT REGISTER 4BIT 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Universal
Logic Type: Register, Bidirectional
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 4
auf Bestellung 975 Stücke:
Lieferzeit 10-14 Tag (e)
975+0.52 EUR
Mindestbestellmenge: 975
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PZU3.3B2,115 PZU3.3B2,115 NXP USA Inc. PHGLS19743-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 3.3V 310MW SOD323F
Packaging: Bulk
auf Bestellung 16382 Stücke:
Lieferzeit 10-14 Tag (e)
10804+0.049 EUR
Mindestbestellmenge: 10804
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HEF40373BP,652 HEF40373BP,652 NXP USA Inc. HEF40373B.pdf Description: IC D-TYPE TRANSP SGL 8:8 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Independent Circuits: 1
Delay Time - Propagation: 40ns
Supplier Device Package: 20-DIP
Produkt ist nicht verfügbar
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MKL81Z128VLK7 MKL81Z128VLK7 NXP USA Inc. KNTSKL8XFS.pdf Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K146HAT0VLHR FS32K146HAT0VLHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K146HAT0VLHT FS32K146HAT0VLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K148HET0VLQT FS32K148HET0VLQT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEF8102EN/N1Y NXP USA Inc. Description: RADAR
Packaging: Tape & Reel (TR)
Package / Case: 155-WFBGA
Mounting Type: Surface Mount
Frequency: 76GHz ~ 81GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 135°C (TJ)
Voltage - Supply: 1.045V ~ 1.21V, 1.71V ~ 1.98V, 2.97V ~ 3.63V
Power - Output: 12dBm
Data Rate (Max): 40Mbps
Supplier Device Package: 155-WFBGA (7.5x7.5)
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEF8102EN/N1E NXP USA Inc. Description: RADAR
Packaging: Tray
Package / Case: 155-WFBGA
Mounting Type: Surface Mount
Frequency: 76GHz ~ 81GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 135°C (TJ)
Voltage - Supply: 1.045V ~ 1.21V, 1.71V ~ 1.98V, 2.97V ~ 3.63V
Power - Output: 12dBm
Data Rate (Max): 40Mbps
Supplier Device Package: 155-WFBGA (7.5x7.5)
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AFT20S015NR1 AFT20S015NR1 NXP USA Inc. AFT20S015N.pdf Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.5W
Gain: 17.6dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 132 mA
Produkt ist nicht verfügbar
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AFT20S015NR1 AFT20S015NR1 NXP USA Inc. AFT20S015N.pdf Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.5W
Gain: 17.6dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 132 mA
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MHT1008NT1 MHT1008NT1 NXP USA Inc. MHT1008N.pdf Description: RF MOSFET LDMOS PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 12.5W
Gain: 18.6dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 28 V
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MHT1008NT1 MHT1008NT1 NXP USA Inc. MHT1008N.pdf Description: RF MOSFET LDMOS PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 12.5W
Gain: 18.6dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 28 V
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MHT1008NT1 MHT1008NT1 NXP USA Inc. MHT1008N.pdf Description: RF MOSFET LDMOS PLD-1.5W
Packaging: Bulk
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 12.5W
Gain: 18.6dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 28 V
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MWCT1001AVLH MWCT1001AVLH NXP USA Inc. MWCT1001AVLH_Web.pdf Description: IC DSP MULTI COIL 5W 5V 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
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A5M35TG140-TCT1 A5M35TG140-TCT1 NXP USA Inc. A5M35TG140-TC.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.4dB
P1dB: 49.9dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
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A5M35TG140-TCT1 A5M35TG140-TCT1 NXP USA Inc. A5M35TG140-TC.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Cut Tape (CT)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.4dB
P1dB: 49.9dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
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A5M36TG140-TCT1 A5M36TG140-TCT1 NXP USA Inc. A5M36TG140-TC.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.9dB
P1dB: 49.3dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
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A5M36TG140-TCT1 A5M36TG140-TCT1 NXP USA Inc. A5M36TG140-TC.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Cut Tape (CT)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.9dB
P1dB: 49.3dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
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MPC8309VMAGDCA NXP USA Inc. FSCL-S-A0000128317-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC POWER ARCH SOC, 400MH
Packaging: Bulk
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NX3V1G66GM,132 NX3V1G66GM,132 NXP USA Inc. NX3V1G66.pdf Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
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N74F280BD,623 N74F280BD,623 NXP USA Inc. N74F280B.pdf Description: IC PARITY GEN/CHKER 9-BIT 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Number of Circuits: 9-Bit
Mounting Type: Surface Mount
Logic Type: Parity Generator/Checker
Operating Temperature: -40°C ~ 85°C
Current - Output High, Low: 1mA, 20mA
Supplier Device Package: 14-SO
Voltage - Supply: 4.5 V ~ 5.5 V
Produkt ist nicht verfügbar
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NAFE11388-EVB NXP USA Inc. Description: LOW PWR PLC I/O GEN1 REF DESIGN
Packaging: Box
Function: Analog Front End (AFE)
Type: Power Management
Utilized IC / Part: NAFE11388
Supplied Contents: Board(s)
Embedded: No
Produkt ist nicht verfügbar
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NAFE13388-EVB NXP USA Inc. Description: IC
Packaging: Box
Function: Analog Front End (AFE)
Type: Interface
Utilized IC / Part: NAFE13388
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 8-Channel (Octal)
Embedded: No
Produkt ist nicht verfügbar
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KITNAFE13388-EVB NXP USA Inc. Description: IC
Packaging: Box
Function: Analog Front End (AFE)
Type: Interface
Utilized IC / Part: NAFE13388
Supplied Contents: Board(s)
Primary Attributes: 8-Channel (Octal)
Embedded: No
Produkt ist nicht verfügbar
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KITNAFE11388-EVB NXP USA Inc. UM11565.pdf Description: EVAL BOARD FOR NAFE11388
Packaging: Box
Function: Analog Front End (AFE)
Type: Interface
Utilized IC / Part: NAFE11388
Supplied Contents: Board(s)
Primary Attributes: 8-Channel (Octal)
Embedded: No
Contents: Board(s)
Produkt ist nicht verfügbar
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MKM14Z128ACHH5R MKM14Z128ACHH5R NXP USA Inc. MKMxxZxxACxx5.pdf Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Tape & Reel (TR)
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 20
DigiKey Programmable: Not Verified
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MKM14Z128ACHH5R MKM14Z128ACHH5R NXP USA Inc. MKMxxZxxACxx5.pdf Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Cut Tape (CT)
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 20
DigiKey Programmable: Not Verified
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MKM33Z64ACLH5R MKM33Z64ACLH5R NXP USA Inc. MKMxxZxxACxx5.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x16b, 24b SAR, Sigma; D/A 4x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MKM33Z64ACLL5R MKM33Z64ACLL5R NXP USA Inc. MKMxxZxxACxx5.pdf Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
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MKM33Z64ACLL5R MKM33Z64ACLL5R NXP USA Inc. MKMxxZxxACxx5.pdf Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
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MKM33Z128ACLL5R MKM33Z128ACLL5R NXP USA Inc. MKMxxZxxACxx5.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 24b SAR, Sigma; D/A 4x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
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S912XEP768W1MAGR S912XEP768W1MAGR NXP USA Inc. Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
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S912XEP768W1MAG S912XEP768W1MAG NXP USA Inc. Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVLA64ACLC
Hersteller: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
Produkt ist nicht verfügbar
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S912ZVLA64ACLFR
Hersteller: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
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S912ZVLA64ACLF
Hersteller: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
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S912ZVLA64AMLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912ZVLA64AVFMR
Hersteller: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 34
Produkt ist nicht verfügbar
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MC908QT1ACDWE MC68HC908QY4A.pdf
MC908QT1ACDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908QY1AMDWE MC68HLC908QY4.pdf
MC908QY1AMDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908QB4MDWE MC68HLC908QY4.pdf
MC908QB4MDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MCIMX6L3DVN10AC IMX6SLCEC.pdf
MCIMX6L3DVN10AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Bulk
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 9086 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
16+31.88 EUR
Mindestbestellmenge: 16
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MWCT2D16SHT1VPB
Hersteller: NXP USA Inc.
Description: MWCT2D16S, MAXQFP172
Packaging: Tray
Produkt ist nicht verfügbar
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MWCT2D17SHT1VPBR
Hersteller: NXP USA Inc.
Description: MWCT2D17S,MAXQFP172
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MWCT2D17SHT1VPB
Hersteller: NXP USA Inc.
Description: MWCT2D17S,MAXQFP172
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S12XD256CAA 9S12XDFAMPP.pdf
MC9S12XD256CAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12XD256VAA
MC9S12XD256VAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12XD256VAG MC9S12XDP512RMV2.pdf
MC9S12XD256VAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC125ADB,112 74LVC125A.pdf
74LVC125ADB,112
Hersteller: NXP USA Inc.
Description: IC BUFF DVR TRI-ST QD 14SSOP
Packaging: Tube
auf Bestellung 17546 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1869+0.27 EUR
Mindestbestellmenge: 1869
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MC12311CHNR
MC12311CHNR
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU ISM<1GHZ 60VFLGA
Packaging: Tape & Reel (TR)
Package / Case: 60-VFLGA Exposed Pad
Sensitivity: -120dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 433MHz, 470MHz, 868MHz, 915MHz, 928MHz, 955MHz
Memory Size: 32kB Flash, 2kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 17dBm
Current - Receiving: 16mA
Data Rate (Max): 300kbps
Current - Transmitting: 16mA ~ 95mA
Supplier Device Package: 60-VFLGA (8x8)
GPIO: 34
Modulation: FSK, GFSK, GMSK, MSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MMRF5017HSR5 MMRF5017HS.pdf
MMRF5017HSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET HEMT 50V NI400
Packaging: Bulk
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 30MHz ~ 2.2GHz
Power - Output: 125W
Gain: 18.4dB
Technology: HEMT
Supplier Device Package: NI-400S-2S
Voltage - Rated: 150 V
Voltage - Test: 50 V
Current - Test: 200 mA
auf Bestellung 451 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+370.37 EUR
Mindestbestellmenge: 2
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MCF51AG96CLH MCF51AG128.pdf
MCF51AG96CLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 19x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LH79524N0F100A1 PHGLS28978-1.pdf?hkey=86B6989B4B77B8125D7B68A214AD8E2D
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208LFBGA
Packaging: Tray
Package / Case: 208-LFBGA
Mounting Type: Surface Mount
Speed: 76.205MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM720T™ RISC
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LFBGA (14x14)
Number of I/O: 108
DigiKey Programmable: Not Verified
auf Bestellung 6693 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
100+8.97 EUR
Mindestbestellmenge: 100
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PDTA144TU,115
PDTA144TU,115
Hersteller: NXP USA Inc.
Description: TRANS PNP W/RES 50V SOT323
Packaging: Bulk
auf Bestellung 143980 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13172+0.032 EUR
Mindestbestellmenge: 13172
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PDTA144EMB,315 PHGLS24726-1.pdf?t.download=true&u=5oefqw
PDTA144EMB,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2
auf Bestellung 200000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11225+0.051 EUR
Mindestbestellmenge: 11225
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MCIMX6DP7CVT8AA IMX6DQPCEC.pdf
MCIMX6DP7CVT8AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
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MFS8632BMBA0ES
MFS8632BMBA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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74LV08N,112 74LV08.pdf
74LV08N,112
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 9ns @ 3.3V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Produkt ist nicht verfügbar
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MK12DX128VLH5 K12P64M50SF4.pdf
MK12DX128VLH5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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N74F194D,602 DS_568_74F194.pdf
N74F194D,602
Hersteller: NXP USA Inc.
Description: IC SHIFT REGISTER 4BIT 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Universal
Logic Type: Register, Bidirectional
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 4
auf Bestellung 975 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
975+0.52 EUR
Mindestbestellmenge: 975
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PZU3.3B2,115 PHGLS19743-1.pdf?t.download=true&u=5oefqw
PZU3.3B2,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.3V 310MW SOD323F
Packaging: Bulk
auf Bestellung 16382 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10804+0.049 EUR
Mindestbestellmenge: 10804
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HEF40373BP,652 HEF40373B.pdf
HEF40373BP,652
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Independent Circuits: 1
Delay Time - Propagation: 40ns
Supplier Device Package: 20-DIP
Produkt ist nicht verfügbar
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MKL81Z128VLK7 KNTSKL8XFS.pdf
MKL81Z128VLK7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K146HAT0VLHR S32K1xx.pdf
FS32K146HAT0VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K146HAT0VLHT S32K1xx.pdf
FS32K146HAT0VLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K148HET0VLQT S32K1xx.pdf
FS32K148HET0VLQT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEF8102EN/N1Y
Hersteller: NXP USA Inc.
Description: RADAR
Packaging: Tape & Reel (TR)
Package / Case: 155-WFBGA
Mounting Type: Surface Mount
Frequency: 76GHz ~ 81GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 135°C (TJ)
Voltage - Supply: 1.045V ~ 1.21V, 1.71V ~ 1.98V, 2.97V ~ 3.63V
Power - Output: 12dBm
Data Rate (Max): 40Mbps
Supplier Device Package: 155-WFBGA (7.5x7.5)
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEF8102EN/N1E
Hersteller: NXP USA Inc.
Description: RADAR
Packaging: Tray
Package / Case: 155-WFBGA
Mounting Type: Surface Mount
Frequency: 76GHz ~ 81GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 135°C (TJ)
Voltage - Supply: 1.045V ~ 1.21V, 1.71V ~ 1.98V, 2.97V ~ 3.63V
Power - Output: 12dBm
Data Rate (Max): 40Mbps
Supplier Device Package: 155-WFBGA (7.5x7.5)
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AFT20S015NR1 AFT20S015N.pdf
AFT20S015NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.5W
Gain: 17.6dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 132 mA
Produkt ist nicht verfügbar
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AFT20S015NR1 AFT20S015N.pdf
AFT20S015NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.5W
Gain: 17.6dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 132 mA
auf Bestellung 397 Stücke:
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1+46.32 EUR
10+37.44 EUR
25+35.22 EUR
100+34.7 EUR
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MHT1008NT1 MHT1008N.pdf
MHT1008NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 12.5W
Gain: 18.6dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 28 V
Produkt ist nicht verfügbar
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MHT1008NT1 MHT1008N.pdf
MHT1008NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 12.5W
Gain: 18.6dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 28 V
Produkt ist nicht verfügbar
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MHT1008NT1 MHT1008N.pdf
MHT1008NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS PLD-1.5W
Packaging: Bulk
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 12.5W
Gain: 18.6dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 28 V
auf Bestellung 2994 Stücke:
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25+18.56 EUR
Mindestbestellmenge: 25
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MWCT1001AVLH MWCT1001AVLH_Web.pdf
MWCT1001AVLH
Hersteller: NXP USA Inc.
Description: IC DSP MULTI COIL 5W 5V 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
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Anzahl Preis
38+13.65 EUR
Mindestbestellmenge: 38
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A5M35TG140-TCT1 A5M35TG140-TC.pdf
A5M35TG140-TCT1
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.4dB
P1dB: 49.9dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
auf Bestellung 1000 Stücke:
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Anzahl Preis
1000+79.06 EUR
Mindestbestellmenge: 1000
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A5M35TG140-TCT1 A5M35TG140-TC.pdf
A5M35TG140-TCT1
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Cut Tape (CT)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.4dB
P1dB: 49.9dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
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1+120.63 EUR
10+105.99 EUR
25+101.6 EUR
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A5M36TG140-TCT1 A5M36TG140-TC.pdf
A5M36TG140-TCT1
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.9dB
P1dB: 49.3dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
Produkt ist nicht verfügbar
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A5M36TG140-TCT1 A5M36TG140-TC.pdf
A5M36TG140-TCT1
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Cut Tape (CT)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.9dB
P1dB: 49.3dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
auf Bestellung 956 Stücke:
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Anzahl Preis
1+128.3 EUR
10+112.78 EUR
25+108.71 EUR
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MPC8309VMAGDCA FSCL-S-A0000128317-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: POWERQUICC POWER ARCH SOC, 400MH
Packaging: Bulk
auf Bestellung 3371 Stücke:
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Anzahl Preis
9+57.5 EUR
Mindestbestellmenge: 9
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NX3V1G66GM,132 NX3V1G66.pdf
NX3V1G66GM,132
Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
auf Bestellung 5000 Stücke:
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Anzahl Preis
3328+0.15 EUR
Mindestbestellmenge: 3328
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N74F280BD,623 N74F280B.pdf
N74F280BD,623
Hersteller: NXP USA Inc.
Description: IC PARITY GEN/CHKER 9-BIT 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Number of Circuits: 9-Bit
Mounting Type: Surface Mount
Logic Type: Parity Generator/Checker
Operating Temperature: -40°C ~ 85°C
Current - Output High, Low: 1mA, 20mA
Supplier Device Package: 14-SO
Voltage - Supply: 4.5 V ~ 5.5 V
Produkt ist nicht verfügbar
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NAFE11388-EVB
Hersteller: NXP USA Inc.
Description: LOW PWR PLC I/O GEN1 REF DESIGN
Packaging: Box
Function: Analog Front End (AFE)
Type: Power Management
Utilized IC / Part: NAFE11388
Supplied Contents: Board(s)
Embedded: No
Produkt ist nicht verfügbar
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NAFE13388-EVB
Hersteller: NXP USA Inc.
Description: IC
Packaging: Box
Function: Analog Front End (AFE)
Type: Interface
Utilized IC / Part: NAFE13388
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 8-Channel (Octal)
Embedded: No
Produkt ist nicht verfügbar
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KITNAFE13388-EVB
Hersteller: NXP USA Inc.
Description: IC
Packaging: Box
Function: Analog Front End (AFE)
Type: Interface
Utilized IC / Part: NAFE13388
Supplied Contents: Board(s)
Primary Attributes: 8-Channel (Octal)
Embedded: No
Produkt ist nicht verfügbar
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KITNAFE11388-EVB UM11565.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR NAFE11388
Packaging: Box
Function: Analog Front End (AFE)
Type: Interface
Utilized IC / Part: NAFE11388
Supplied Contents: Board(s)
Primary Attributes: 8-Channel (Octal)
Embedded: No
Contents: Board(s)
Produkt ist nicht verfügbar
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MKM14Z128ACHH5R MKMxxZxxACxx5.pdf
MKM14Z128ACHH5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Tape & Reel (TR)
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 20
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKM14Z128ACHH5R MKMxxZxxACxx5.pdf
MKM14Z128ACHH5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Cut Tape (CT)
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 20
DigiKey Programmable: Not Verified
auf Bestellung 4937 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.33 EUR
10+7.93 EUR
25+7.33 EUR
100+6.67 EUR
250+6.35 EUR
500+6.16 EUR
1000+6.01 EUR
2500+5.84 EUR
Mindestbestellmenge: 2
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MKM33Z64ACLH5R MKMxxZxxACxx5.pdf
MKM33Z64ACLH5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x16b, 24b SAR, Sigma; D/A 4x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.14 EUR
10+6.89 EUR
25+6.73 EUR
100+6.56 EUR
250+6.27 EUR
500+6.03 EUR
Mindestbestellmenge: 2
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MKM33Z64ACLL5R MKMxxZxxACxx5.pdf
MKM33Z64ACLL5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+6.47 EUR
Mindestbestellmenge: 1000
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MKM33Z64ACLL5R MKMxxZxxACxx5.pdf
MKM33Z64ACLL5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.04 EUR
10+8.5 EUR
25+7.86 EUR
100+7.16 EUR
250+6.83 EUR
500+6.63 EUR
Mindestbestellmenge: 2
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MKM33Z128ACLL5R MKMxxZxxACxx5.pdf
MKM33Z128ACLL5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 24b SAR, Sigma; D/A 4x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.69 EUR
10+9.8 EUR
25+9.08 EUR
100+8.29 EUR
250+7.91 EUR
500+7.69 EUR
Mindestbestellmenge: 2
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S912XEP768W1MAGR
S912XEP768W1MAGR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEP768W1MAG
S912XEP768W1MAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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