Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36588) > Seite 183 nach 610
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MCZ33903BS5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCZ33905BD3EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOICSupplier Device Package: 54-SOIC-EP Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V Interface: CAN, LIN Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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TWR-MCF51JF-KIT | NXP USA Inc. |
Description: TOWER SYSTEM MCF51JF EVAL BRDPlatform: Tower System Utilized IC / Part: MCF51JF Core Processor: Coldfire V1 Contents: Board(s), Cable(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCIMX233DAG4C | NXP USA Inc. |
Description: IC MPU I.MX23 454MHZ 128LQFPPackaging: Tray Package / Case: 128-LQFP Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -10°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 128-LQFP (14x14) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Security Features: Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
auf Bestellung 393 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX233DJM4C | NXP USA Inc. |
Description: IC MPU I.MX23 454MHZ 169MAPBGAPackaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -10°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 169-MAPBGA (11x11) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Security Features: Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
auf Bestellung 188 Stücke: Lieferzeit 10-14 Tag (e) |
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MCZ33905BD5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MC34827A1EPR2 | NXP USA Inc. |
Description: IC USB POWER MANAGER 20-QFN Part Status: Obsolete Supplier Device Package: 20-QFN-EP (3x3) Current - Supply: 9µA Applications: OR Controller, UART/USB Data, Audio Management Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-UFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MC34827A2EPR2 | NXP USA Inc. |
Description: IC USB POWER MANAGER 20-QFN Part Status: Obsolete Supplier Device Package: 20-QFN-EP (3x4) Current - Supply: 9µA Applications: OR Controller, UART/USB Data, Audio Management Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-UFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCIMX233CAG4C | NXP USA Inc. |
Description: IC MPU I.MX23 454MHZ 128LQFPPackaging: Tray Package / Case: 128-LQFP Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 128-LQFP (14x14) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Security Features: Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
auf Bestellung 375 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8309CVMAHFCA | NXP USA Inc. |
Description: IC MPU MPC83XX 417MHZ 489BGAAdditional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM Graphics Acceleration: No RAM Controllers: DDR2 Co-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (3) Supplier Device Package: 489-PBGA (19x19) Voltage - I/O: 1.8V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 417MHz Mounting Type: Surface Mount Package / Case: 489-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MSC8156ETVT1000B | NXP USA Inc. |
Description: IC DSP 6 CORE 1GHZ 783FCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MSC8156ESVT1000B | NXP USA Inc. |
Description: IC DSP 6 CORE 1GHZ 783FCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MSC8154TVT1000B | NXP USA Inc. |
Description: IC DSP QUAD 1GHZ 783FCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MSC8154ETVT1000B | NXP USA Inc. |
Description: IC DSP QUAD 1GHZ 783FCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SSL4101/1,518 | NXP USA Inc. |
Description: IC LED DRIVER OFFL SWITCHER 16SOVoltage - Supply (Max): 38V Voltage - Supply (Min): 15V Supplier Device Package: 16-SO Topology: Flyback Internal Switch(s): No Applications: Lighting Operating Temperature: -40°C ~ 150°C (TJ) Type: AC DC Offline Switcher Frequency: 380kHz Number of Outputs: 1 Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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OM13001,598 | NXP USA Inc. |
Description: LPC1788 EVAL BRD Part Status: Active Utilized IC / Part: LPC1788 Board Type: Evaluation Platform Core Processor: ARM® Cortex®-M3 Contents: Board(s), Cable(s), Accessories Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
| TWR-RS08DC-KA8 | NXP USA Inc. |
Description: TOWER SYSTEM MC9RS08KA8 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: RS08 Board Type: Evaluation Platform Utilized IC / Part: MC9RS08KA8 Platform: Tower System Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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TWR-S08DC-AC60 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08AC60 EVAL BRD Part Status: Active Platform: Tower System Utilized IC / Part: MC9S08AC60 Board Type: Evaluation Platform Core Processor: HCS08 Contents: Board(s) Type: MCU 8-Bit Mounting Type: Fixed Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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TWR-S08DC-QD4 | NXP USA Inc. | Description: TOWER SYSTEM MC9S08QD4 EVAL BRD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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TWR-S08DC-QE64 | NXP USA Inc. | Description: TOWER SYSTEM MC9S08QE64 EVAL BRD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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TWR-S08DC-QG8 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08QG8 EVAL BRDPart Status: Active Platform: Tower System Utilized IC / Part: MC9S08QG8 Board Type: Evaluation Platform Core Processor: HCS08 Contents: Board(s) Type: MCU 8-Bit Mounting Type: Fixed Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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TWR-S08DC-SH8 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08SH8 EVAL BRD Part Status: Active Platform: Tower System Utilized IC / Part: MC9S08SH8 Board Type: Evaluation Platform Core Processor: HCS08 Contents: Board(s) Type: MCU 8-Bit Mounting Type: Fixed Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
| 1323XUSB | NXP USA Inc. | Description: RF EVAL FOR MC1323X |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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TWR-S08UNIV | NXP USA Inc. |
Description: TOWER SYST TWR-RS08DC/TWR-S08DC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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1323XDSK | NXP USA Inc. |
Description: RF EVAL FOR MC1323X Supplied Contents: Board(s) Type: Transceiver; 802.15.4 Frequency: 2.4GHz For Use With/Related Products: MC1323x Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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1323XDSK-BDM | NXP USA Inc. |
Description: RF EVAL FOR MC1323XSupplied Contents: Board(s) Type: Transceiver; 802.15.4 Frequency: 2.4GHz For Use With/Related Products: MC1323x Packaging: Box |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX50EVK | NXP USA Inc. |
Description: I.MX50 EVAL BRDMounting Type: Fixed Packaging: Box Part Status: Active Operating System: Linux Utilized IC / Part: i.MX50 Board Type: Evaluation Platform Core Processor: ARM® Cortex®-A8 Contents: Board(s) Type: MPU |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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MC13850EPR2 | NXP USA Inc. |
Description: IC AMP GPS 400MHZ-2.5GHZ 8MLPDPart Status: Obsolete Supplier Device Package: 8-MLPD (2x2) Test Frequency: 2.4GHz P1dB: 2.2dBm Noise Figure: 1.85dB Current - Supply: 9.9mA Gain: 13dB Voltage - Supply: 2.3V ~ 3V RF Type: General Purpose Frequency: 400MHz ~ 2.5GHz Mounting Type: Surface Mount Package / Case: 8-UFDFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MC13852EPR2 | NXP USA Inc. |
Description: IC RF AMP GPS 400MHZ-1GHZ 8MLPDNoise Figure: 1.2dB Package / Case: 8-UFDFN Exposed Pad Part Status: Obsolete Supplier Device Package: 8-MLPD (2x2) Test Frequency: 900MHz P1dB: 9.6dBm Current - Supply: 5.5mA Gain: 18.3dB Voltage - Supply: 2.3V ~ 3V RF Type: General Purpose Frequency: 400MHz ~ 1GHz Mounting Type: Surface Mount Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MRF8P20165WHSR5 | NXP USA Inc. |
Description: FET RF 2CH 65V 2.01GHZ NI780S4 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MC9S08GW32CLK | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 80LQFPPackaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x16b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LCD, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Part Status: Active Number of I/O: 45 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
| MMA6805AKW | NXP USA Inc. | Description: ACCELEROMETER 16QFN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 75 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
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MMA6555KW | NXP USA Inc. |
Description: ACCELEROMETER 105G SPI 16QFN Features: Selectable Low Pass Filter Packaging: Tray Package / Case: 16-QFN Exposed Pad Output Type: SPI Mounting Type: Surface Mount Type: Digital Axis: X Acceleration Range: ±105g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.135V ~ 5.25V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 18.2 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 75 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MMA6823AKW | NXP USA Inc. | Description: ACCELEROMETER 50G SPI 16QFN |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 75 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCIMX534AVV8CR2 | NXP USA Inc. |
Description: IC MPU I.MX53 800MHZ 529FBGA Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART SATA: SATA 1.5Gbps (1) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, DDR2, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (2), USB 2.0 + PHY (2) Ethernet: 10/100Mbps (1) Supplier Device Package: 529-FBGA (19x19) Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Core Processor: ARM® Cortex®-A8 Operating Temperature: -40°C ~ 125°C (TJ) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 529-FBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 750 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCIMX536AVV8CR2 | NXP USA Inc. |
Description: IC MPU 529FBGA Part Status: Obsolete Supplier Device Package: 529-FBGA (19x19) Mounting Type: Surface Mount Package / Case: 529-FBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 750 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MCIMX537CVV8CR2 | NXP USA Inc. |
Description: IC MPU I.MX53 800MHZ 529FBGAAdditional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART SATA: SATA 1.5Gbps (1) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, DDR2, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (2), USB 2.0 + PHY (2) Ethernet: 10/100Mbps (1) Supplier Device Package: 529-FBGA (19x19) Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Core Processor: ARM® Cortex®-A8 Operating Temperature: -40°C ~ 85°C (TA) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 529-FBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 750 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MRF8P20140WHR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Current - Test: 500 mA Voltage - Test: 28 V Voltage - Rated: 65 V Supplier Device Package: NI-780-4 Technology: LDMOS Gain: 16dB Power - Output: 24W Configuration: Dual Frequency: 1.88GHz ~ 1.91GHz Mounting Type: Chassis Mount Package / Case: NI-780-4 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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MRF8P20165WHSR3 | NXP USA Inc. |
Description: FET RF 2CH 65V 2.01GHZ NI780S4 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
| P3041DS-PA | NXP USA Inc. |
Description: P3041 EVAL BRD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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DEMO9S12XHY256 | NXP USA Inc. |
Description: MC9S12XHY256 EVAL BRD Part Status: Active Type: MCU 16-Bit Utilized IC / Part: MC9S12XHY256 Core Processor: HCS12X Contents: Board(s), LCD Mounting Type: Fixed Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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TRK-MPC5604P | NXP USA Inc. |
Description: STARTERTRAK MPC5604P EVAL BRDPart Status: Active Platform: StarterTRAK Utilized IC / Part: MPC5604P Core Processor: e200 Contents: Board(s), Cable(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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TRK-MPC5634M | NXP USA Inc. |
Description: STARTERTRAK MPC5634M EVAL BRDPlatform: StarterTRAK Utilized IC / Part: MPC5634M Core Processor: e200 Contents: Board(s), Cable(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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| DSPAUDIOEVMMB1E | NXP USA Inc. |
Description: DSP563XX EVAL BRD Utilized IC / Part: DSP563xx Contents: Board(s) Type: DSP Mounting Type: Fixed Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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MX50EBOOKDC1 | NXP USA Inc. |
Description: HARDWARE MX50EBOOKDC1Packaging: Box For Use With/Related Products: i.MX50 Accessory Type: Electronic Paper Display (EPD) Part Status: Active Utilized IC / Part: i.MX50 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
| LFDA8451 | NXP USA Inc. |
Description: MMA8451 DEVICE ADPTR BRDAccessory Type: Adapter Board For Use With/Related Products: Freescale Tower System, MMA8451Q Packaging: Box Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| MC13850-470EVK | NXP USA Inc. |
Description: IC MC13850_470_EVKPackaging: Box Frequency: 470MHz Type: Amplifier Contents: Board(s) Utilized IC / Part: MC13850 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| MC13850-900HEVK | NXP USA Inc. |
Description: IC MC13850_900_HIIP3_EVK |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| MC13851-2400EVK | NXP USA Inc. |
Description: IC MC13851 EVB 2400MHZ |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| MC13852-434EVK | NXP USA Inc. |
Description: IC MC13852 EVB 434MHZPart Status: Obsolete Supplied Contents: Board(s) Type: Amplifier Frequency: 434MHz For Use With/Related Products: MC13852 Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| MC13917-1900EVK | NXP USA Inc. |
Description: IC MC13917_1900_EVKSupplied Contents: Board(s) Type: Amplifier Frequency: 1.9GHz For Use With/Related Products: MC13917 Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| MC13917-350EVK | NXP USA Inc. |
Description: IC MC13917_350_EVKSupplied Contents: Board(s) Type: Amplifier Frequency: 350MHz For Use With/Related Products: MC13917 Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| MC13917-434EVK | NXP USA Inc. |
Description: IC MC13917 EVB 434MHZPart Status: Obsolete Supplied Contents: Board(s) Type: Amplifier Frequency: 434MHz For Use With/Related Products: MC13917 Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| MC13917-900EVK | NXP USA Inc. |
Description: IC MC13917_900_EVKSupplied Contents: Board(s) Type: Amplifier Frequency: 900MHz For Use With/Related Products: MC13917 Packaging: Box Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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MCIMX535DVV1CR2 | NXP USA Inc. |
Description: IC MPU I.MX53 1.0GHZ 529FBGAPart Status: Obsolete SATA: SATA 1.5Gbps (1) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART RAM Controllers: LPDDR2, DDR2, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (2), USB 2.0 + PHY (2) Ethernet: 10/100Mbps (1) Supplier Device Package: 529-FBGA (19x19) Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Core Processor: ARM® Cortex®-A8 Operating Temperature: -20°C ~ 85°C (TC) Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 529-FBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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PSMN3R7-25YLC,115 | NXP USA Inc. |
Description: MOSFET N-CH 25V 97A LFPAK56Rds On (Max) @ Id, Vgs: 3.9mOhm @ 20A, 10V Current - Continuous Drain (Id) @ 25°C: 97A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Package / Case: SC-100, SOT-669 Packaging: Tape & Reel (TR) Input Capacitance (Ciss) (Max) @ Vds: 1585 pF @ 12 V Gate Charge (Qg) (Max) @ Vgs: 21.6 nC @ 10 V Drain to Source Voltage (Vdss): 25 V Vgs (Max): ±20V Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Supplier Device Package: LFPAK56, Power-SO8 Vgs(th) (Max) @ Id: 1.95V @ 1mA Power Dissipation (Max): 64W (Tc) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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PSMN3R7-30YLC,115 | NXP USA Inc. |
Description: MOSFET N-CH 30V 100A LFPAK56 Current - Continuous Drain (Id) @ 25°C: 100A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Package / Case: SC-100, SOT-669 Packaging: Tape & Reel (TR) Input Capacitance (Ciss) (Max) @ Vds: 1848 pF @ 15 V Gate Charge (Qg) (Max) @ Vgs: 29 nC @ 10 V Drain to Source Voltage (Vdss): 30 V Vgs (Max): ±20V Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Supplier Device Package: LFPAK56, Power-SO8 Vgs(th) (Max) @ Id: 1.95V @ 1mA Power Dissipation (Max): 79W (Tc) Rds On (Max) @ Id, Vgs: 3.95mOhm @ 20A, 10V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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PESD5V0L6UAS,118 | NXP USA Inc. |
Description: TVS DIODE 5VWM 15VC 8-TSSOP Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TA) Applications: General Purpose Capacitance @ Frequency: 16pF @ 1MHz Current - Peak Pulse (10/1000µs): 2.5A (8/20µs) Voltage - Reverse Standoff (Typ): 5V (Max) Supplier Device Package: 8-TSSOP Unidirectional Channels: 6 Voltage - Breakdown (Min): 6.4V Voltage - Clamping (Max) @ Ipp: 15V Power - Peak Pulse: 35W Power Line Protection: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
|
PESD3V3L1UA,115 | NXP USA Inc. |
Description: TVS DIODE 3.3VWM 11VC SOD323Packaging: Cut Tape (CT) Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Type: Zener Operating Temperature: -55°C ~ 150°C (TA) Capacitance @ Frequency: 34pF @ 1MHz Current - Peak Pulse (10/1000µs): 4.5A (8/20µs) Voltage - Reverse Standoff (Typ): 3.3V (Max) Supplier Device Package: SOD-323 Unidirectional Channels: 1 Voltage - Breakdown (Min): 5.3V Voltage - Clamping (Max) @ Ipp: 11V Power - Peak Pulse: 45W Power Line Protection: No Grade: Automotive Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
|
PBSS2540E,115 | NXP USA Inc. |
Description: TRANS NPN 40V 0.5A SC-75Packaging: Cut Tape (CT) Package / Case: SC-75, SOT-416 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 2V Frequency - Transition: 450MHz Supplier Device Package: SC-75 Current - Collector (Ic) (Max): 500 mA Voltage - Collector Emitter Breakdown (Max): 40 V Power - Max: 250 mW |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MCZ33903BS5EK |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33905BD3EK |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Supplier Device Package: 54-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Box
Description: IC INTERFACE SPECIALIZED 54SOIC
Supplier Device Package: 54-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-MCF51JF-KIT |
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Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MCF51JF EVAL BRD
Platform: Tower System
Utilized IC / Part: MCF51JF
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: TOWER SYSTEM MCF51JF EVAL BRD
Platform: Tower System
Utilized IC / Part: MCF51JF
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX233DAG4C |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
auf Bestellung 393 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 29.95 EUR |
| 10+ | 23.78 EUR |
| 25+ | 22.23 EUR |
| 100+ | 21.42 EUR |
| MCIMX233DJM4C |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
auf Bestellung 188 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 35.06 EUR |
| 10+ | 27.96 EUR |
| 25+ | 26.19 EUR |
| 100+ | 25.43 EUR |
| MCZ33905BD5EK |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Description: IC INTERFACE SPECIALIZED 54SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34827A1EPR2 |
Hersteller: NXP USA Inc.
Description: IC USB POWER MANAGER 20-QFN
Part Status: Obsolete
Supplier Device Package: 20-QFN-EP (3x3)
Current - Supply: 9µA
Applications: OR Controller, UART/USB Data, Audio Management
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC USB POWER MANAGER 20-QFN
Part Status: Obsolete
Supplier Device Package: 20-QFN-EP (3x3)
Current - Supply: 9µA
Applications: OR Controller, UART/USB Data, Audio Management
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34827A2EPR2 |
Hersteller: NXP USA Inc.
Description: IC USB POWER MANAGER 20-QFN
Part Status: Obsolete
Supplier Device Package: 20-QFN-EP (3x4)
Current - Supply: 9µA
Applications: OR Controller, UART/USB Data, Audio Management
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC USB POWER MANAGER 20-QFN
Part Status: Obsolete
Supplier Device Package: 20-QFN-EP (3x4)
Current - Supply: 9µA
Applications: OR Controller, UART/USB Data, Audio Management
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX233CAG4C |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
auf Bestellung 375 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 34.34 EUR |
| 10+ | 27.37 EUR |
| 25+ | 25.62 EUR |
| 100+ | 24.86 EUR |
| MPC8309CVMAHFCA |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 417MHZ 489BGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 417MHz
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
Description: IC MPU MPC83XX 417MHZ 489BGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 417MHz
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MSC8156ETVT1000B |
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Hersteller: NXP USA Inc.
Description: IC DSP 6 CORE 1GHZ 783FCBGA
Description: IC DSP 6 CORE 1GHZ 783FCBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MSC8156ESVT1000B |
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Hersteller: NXP USA Inc.
Description: IC DSP 6 CORE 1GHZ 783FCBGA
Description: IC DSP 6 CORE 1GHZ 783FCBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MSC8154TVT1000B |
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Hersteller: NXP USA Inc.
Description: IC DSP QUAD 1GHZ 783FCBGA
Description: IC DSP QUAD 1GHZ 783FCBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MSC8154ETVT1000B |
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Hersteller: NXP USA Inc.
Description: IC DSP QUAD 1GHZ 783FCBGA
Description: IC DSP QUAD 1GHZ 783FCBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SSL4101/1,518 |
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Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 16SO
Voltage - Supply (Max): 38V
Voltage - Supply (Min): 15V
Supplier Device Package: 16-SO
Topology: Flyback
Internal Switch(s): No
Applications: Lighting
Operating Temperature: -40°C ~ 150°C (TJ)
Type: AC DC Offline Switcher
Frequency: 380kHz
Number of Outputs: 1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Description: IC LED DRIVER OFFL SWITCHER 16SO
Voltage - Supply (Max): 38V
Voltage - Supply (Min): 15V
Supplier Device Package: 16-SO
Topology: Flyback
Internal Switch(s): No
Applications: Lighting
Operating Temperature: -40°C ~ 150°C (TJ)
Type: AC DC Offline Switcher
Frequency: 380kHz
Number of Outputs: 1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| OM13001,598 |
Hersteller: NXP USA Inc.
Description: LPC1788 EVAL BRD
Part Status: Active
Utilized IC / Part: LPC1788
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M3
Contents: Board(s), Cable(s), Accessories
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: LPC1788 EVAL BRD
Part Status: Active
Utilized IC / Part: LPC1788
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M3
Contents: Board(s), Cable(s), Accessories
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-RS08DC-KA8 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9RS08KA8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: RS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9RS08KA8
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC9RS08KA8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: RS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9RS08KA8
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-S08DC-AC60 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08AC60 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08AC60
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Description: TOWER SYSTEM MC9S08AC60 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08AC60
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-S08DC-QD4 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08QD4 EVAL BRD
Description: TOWER SYSTEM MC9S08QD4 EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-S08DC-QE64 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08QE64 EVAL BRD
Description: TOWER SYSTEM MC9S08QE64 EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-S08DC-QG8 |
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Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08QG8 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08QG8
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Description: TOWER SYSTEM MC9S08QG8 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08QG8
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-S08DC-SH8 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08SH8 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08SH8
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Description: TOWER SYSTEM MC9S08SH8 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08SH8
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1323XUSB |
Hersteller: NXP USA Inc.
Description: RF EVAL FOR MC1323X
Description: RF EVAL FOR MC1323X
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-S08UNIV |
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Hersteller: NXP USA Inc.
Description: TOWER SYST TWR-RS08DC/TWR-S08DC
Description: TOWER SYST TWR-RS08DC/TWR-S08DC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1323XDSK |
Hersteller: NXP USA Inc.
Description: RF EVAL FOR MC1323X
Supplied Contents: Board(s)
Type: Transceiver; 802.15.4
Frequency: 2.4GHz
For Use With/Related Products: MC1323x
Packaging: Box
Description: RF EVAL FOR MC1323X
Supplied Contents: Board(s)
Type: Transceiver; 802.15.4
Frequency: 2.4GHz
For Use With/Related Products: MC1323x
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1323XDSK-BDM |
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Hersteller: NXP USA Inc.
Description: RF EVAL FOR MC1323X
Supplied Contents: Board(s)
Type: Transceiver; 802.15.4
Frequency: 2.4GHz
For Use With/Related Products: MC1323x
Packaging: Box
Description: RF EVAL FOR MC1323X
Supplied Contents: Board(s)
Type: Transceiver; 802.15.4
Frequency: 2.4GHz
For Use With/Related Products: MC1323x
Packaging: Box
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 492.04 EUR |
| MCIMX50EVK |
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Hersteller: NXP USA Inc.
Description: I.MX50 EVAL BRD
Mounting Type: Fixed
Packaging: Box
Part Status: Active
Operating System: Linux
Utilized IC / Part: i.MX50
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A8
Contents: Board(s)
Type: MPU
Description: I.MX50 EVAL BRD
Mounting Type: Fixed
Packaging: Box
Part Status: Active
Operating System: Linux
Utilized IC / Part: i.MX50
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A8
Contents: Board(s)
Type: MPU
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1132 EUR |
| MC13850EPR2 |
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Hersteller: NXP USA Inc.
Description: IC AMP GPS 400MHZ-2.5GHZ 8MLPD
Part Status: Obsolete
Supplier Device Package: 8-MLPD (2x2)
Test Frequency: 2.4GHz
P1dB: 2.2dBm
Noise Figure: 1.85dB
Current - Supply: 9.9mA
Gain: 13dB
Voltage - Supply: 2.3V ~ 3V
RF Type: General Purpose
Frequency: 400MHz ~ 2.5GHz
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC AMP GPS 400MHZ-2.5GHZ 8MLPD
Part Status: Obsolete
Supplier Device Package: 8-MLPD (2x2)
Test Frequency: 2.4GHz
P1dB: 2.2dBm
Noise Figure: 1.85dB
Current - Supply: 9.9mA
Gain: 13dB
Voltage - Supply: 2.3V ~ 3V
RF Type: General Purpose
Frequency: 400MHz ~ 2.5GHz
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC13852EPR2 |
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Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 400MHZ-1GHZ 8MLPD
Noise Figure: 1.2dB
Package / Case: 8-UFDFN Exposed Pad
Part Status: Obsolete
Supplier Device Package: 8-MLPD (2x2)
Test Frequency: 900MHz
P1dB: 9.6dBm
Current - Supply: 5.5mA
Gain: 18.3dB
Voltage - Supply: 2.3V ~ 3V
RF Type: General Purpose
Frequency: 400MHz ~ 1GHz
Mounting Type: Surface Mount
Packaging: Tape & Reel (TR)
Description: IC RF AMP GPS 400MHZ-1GHZ 8MLPD
Noise Figure: 1.2dB
Package / Case: 8-UFDFN Exposed Pad
Part Status: Obsolete
Supplier Device Package: 8-MLPD (2x2)
Test Frequency: 900MHz
P1dB: 9.6dBm
Current - Supply: 5.5mA
Gain: 18.3dB
Voltage - Supply: 2.3V ~ 3V
RF Type: General Purpose
Frequency: 400MHz ~ 1GHz
Mounting Type: Surface Mount
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRF8P20165WHSR5 |
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Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 2.01GHZ NI780S4
Description: FET RF 2CH 65V 2.01GHZ NI780S4
Produkt ist nicht verfügbar
Mindestbestellmenge: 3 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MC9S08GW32CLK |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MMA6805AKW |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 16QFN
Description: ACCELEROMETER 16QFN
Produkt ist nicht verfügbar
Mindestbestellmenge: 75 Stücke
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| MMA6555KW |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 105G SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tray
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±105g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 18.2
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 105G SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tray
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±105g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 18.2
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MMA6823AKW |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 50G SPI 16QFN
Description: ACCELEROMETER 50G SPI 16QFN
Produkt ist nicht verfügbar
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| MCIMX534AVV8CR2 |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tape & Reel (TR)
Description: IC MPU I.MX53 800MHZ 529FBGA
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MCIMX536AVV8CR2 |
Hersteller: NXP USA Inc.
Description: IC MPU 529FBGA
Part Status: Obsolete
Supplier Device Package: 529-FBGA (19x19)
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tape & Reel (TR)
Description: IC MPU 529FBGA
Part Status: Obsolete
Supplier Device Package: 529-FBGA (19x19)
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 750 Stücke
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| MCIMX537CVV8CR2 |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tape & Reel (TR)
Description: IC MPU I.MX53 800MHZ 529FBGA
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 750 Stücke
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| MRF8P20140WHR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 500 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780-4
Technology: LDMOS
Gain: 16dB
Power - Output: 24W
Configuration: Dual
Frequency: 1.88GHz ~ 1.91GHz
Mounting Type: Chassis Mount
Package / Case: NI-780-4
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 500 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780-4
Technology: LDMOS
Gain: 16dB
Power - Output: 24W
Configuration: Dual
Frequency: 1.88GHz ~ 1.91GHz
Mounting Type: Chassis Mount
Package / Case: NI-780-4
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MRF8P20165WHSR3 |
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Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 2.01GHZ NI780S4
Description: FET RF 2CH 65V 2.01GHZ NI780S4
Produkt ist nicht verfügbar
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| P3041DS-PA |
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Hersteller: NXP USA Inc.
Description: P3041 EVAL BRD
Description: P3041 EVAL BRD
Produkt ist nicht verfügbar
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| DEMO9S12XHY256 |
Hersteller: NXP USA Inc.
Description: MC9S12XHY256 EVAL BRD
Part Status: Active
Type: MCU 16-Bit
Utilized IC / Part: MC9S12XHY256
Core Processor: HCS12X
Contents: Board(s), LCD
Mounting Type: Fixed
Packaging: Box
Description: MC9S12XHY256 EVAL BRD
Part Status: Active
Type: MCU 16-Bit
Utilized IC / Part: MC9S12XHY256
Core Processor: HCS12X
Contents: Board(s), LCD
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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| TRK-MPC5604P |
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Hersteller: NXP USA Inc.
Description: STARTERTRAK MPC5604P EVAL BRD
Part Status: Active
Platform: StarterTRAK
Utilized IC / Part: MPC5604P
Core Processor: e200
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: STARTERTRAK MPC5604P EVAL BRD
Part Status: Active
Platform: StarterTRAK
Utilized IC / Part: MPC5604P
Core Processor: e200
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 304.15 EUR |
| TRK-MPC5634M |
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Hersteller: NXP USA Inc.
Description: STARTERTRAK MPC5634M EVAL BRD
Platform: StarterTRAK
Utilized IC / Part: MPC5634M
Core Processor: e200
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: STARTERTRAK MPC5634M EVAL BRD
Platform: StarterTRAK
Utilized IC / Part: MPC5634M
Core Processor: e200
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 331.57 EUR |
| DSPAUDIOEVMMB1E |
Hersteller: NXP USA Inc.
Description: DSP563XX EVAL BRD
Utilized IC / Part: DSP563xx
Contents: Board(s)
Type: DSP
Mounting Type: Fixed
Packaging: Box
Description: DSP563XX EVAL BRD
Utilized IC / Part: DSP563xx
Contents: Board(s)
Type: DSP
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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| MX50EBOOKDC1 |
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Hersteller: NXP USA Inc.
Description: HARDWARE MX50EBOOKDC1
Packaging: Box
For Use With/Related Products: i.MX50
Accessory Type: Electronic Paper Display (EPD)
Part Status: Active
Utilized IC / Part: i.MX50
Description: HARDWARE MX50EBOOKDC1
Packaging: Box
For Use With/Related Products: i.MX50
Accessory Type: Electronic Paper Display (EPD)
Part Status: Active
Utilized IC / Part: i.MX50
Produkt ist nicht verfügbar
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| LFDA8451 |
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Hersteller: NXP USA Inc.
Description: MMA8451 DEVICE ADPTR BRD
Accessory Type: Adapter Board
For Use With/Related Products: Freescale Tower System, MMA8451Q
Packaging: Box
Part Status: Obsolete
Description: MMA8451 DEVICE ADPTR BRD
Accessory Type: Adapter Board
For Use With/Related Products: Freescale Tower System, MMA8451Q
Packaging: Box
Part Status: Obsolete
Produkt ist nicht verfügbar
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| MC13850-470EVK |
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Hersteller: NXP USA Inc.
Description: IC MC13850_470_EVK
Packaging: Box
Frequency: 470MHz
Type: Amplifier
Contents: Board(s)
Utilized IC / Part: MC13850
Description: IC MC13850_470_EVK
Packaging: Box
Frequency: 470MHz
Type: Amplifier
Contents: Board(s)
Utilized IC / Part: MC13850
Produkt ist nicht verfügbar
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| MC13850-900HEVK |
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Hersteller: NXP USA Inc.
Description: IC MC13850_900_HIIP3_EVK
Description: IC MC13850_900_HIIP3_EVK
Produkt ist nicht verfügbar
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| MC13851-2400EVK |
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Hersteller: NXP USA Inc.
Description: IC MC13851 EVB 2400MHZ
Description: IC MC13851 EVB 2400MHZ
Produkt ist nicht verfügbar
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| MC13852-434EVK |
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Hersteller: NXP USA Inc.
Description: IC MC13852 EVB 434MHZ
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 434MHz
For Use With/Related Products: MC13852
Packaging: Box
Description: IC MC13852 EVB 434MHZ
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 434MHz
For Use With/Related Products: MC13852
Packaging: Box
Produkt ist nicht verfügbar
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| MC13917-1900EVK |
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Hersteller: NXP USA Inc.
Description: IC MC13917_1900_EVK
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 1.9GHz
For Use With/Related Products: MC13917
Packaging: Box
Description: IC MC13917_1900_EVK
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 1.9GHz
For Use With/Related Products: MC13917
Packaging: Box
Produkt ist nicht verfügbar
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| MC13917-350EVK |
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Hersteller: NXP USA Inc.
Description: IC MC13917_350_EVK
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 350MHz
For Use With/Related Products: MC13917
Packaging: Box
Description: IC MC13917_350_EVK
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 350MHz
For Use With/Related Products: MC13917
Packaging: Box
Produkt ist nicht verfügbar
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| MC13917-434EVK |
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Hersteller: NXP USA Inc.
Description: IC MC13917 EVB 434MHZ
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 434MHz
For Use With/Related Products: MC13917
Packaging: Box
Description: IC MC13917 EVB 434MHZ
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 434MHz
For Use With/Related Products: MC13917
Packaging: Box
Produkt ist nicht verfügbar
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| MC13917-900EVK |
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Hersteller: NXP USA Inc.
Description: IC MC13917_900_EVK
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 900MHz
For Use With/Related Products: MC13917
Packaging: Box
Part Status: Obsolete
Description: IC MC13917_900_EVK
Supplied Contents: Board(s)
Type: Amplifier
Frequency: 900MHz
For Use With/Related Products: MC13917
Packaging: Box
Part Status: Obsolete
Produkt ist nicht verfügbar
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| MCIMX535DVV1CR2 |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 1.0GHZ 529FBGA
Part Status: Obsolete
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tape & Reel (TR)
Description: IC MPU I.MX53 1.0GHZ 529FBGA
Part Status: Obsolete
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PSMN3R7-25YLC,115 |
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Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 97A LFPAK56
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 20A, 10V
Current - Continuous Drain (Id) @ 25°C: 97A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-100, SOT-669
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 1585 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 21.6 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: LFPAK56, Power-SO8
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Power Dissipation (Max): 64W (Tc)
Description: MOSFET N-CH 25V 97A LFPAK56
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 20A, 10V
Current - Continuous Drain (Id) @ 25°C: 97A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-100, SOT-669
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 1585 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 21.6 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: LFPAK56, Power-SO8
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Power Dissipation (Max): 64W (Tc)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PSMN3R7-30YLC,115 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 100A LFPAK56
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-100, SOT-669
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 1848 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 29 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: LFPAK56, Power-SO8
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Power Dissipation (Max): 79W (Tc)
Rds On (Max) @ Id, Vgs: 3.95mOhm @ 20A, 10V
Description: MOSFET N-CH 30V 100A LFPAK56
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-100, SOT-669
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 1848 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 29 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: LFPAK56, Power-SO8
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Power Dissipation (Max): 79W (Tc)
Rds On (Max) @ Id, Vgs: 3.95mOhm @ 20A, 10V
Produkt ist nicht verfügbar
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Stück im Wert von UAH
| PESD5V0L6UAS,118 |
Hersteller: NXP USA Inc.
Description: TVS DIODE 5VWM 15VC 8-TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: 8-TSSOP
Unidirectional Channels: 6
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 15V
Power - Peak Pulse: 35W
Power Line Protection: No
Description: TVS DIODE 5VWM 15VC 8-TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: 8-TSSOP
Unidirectional Channels: 6
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 15V
Power - Peak Pulse: 35W
Power Line Protection: No
Produkt ist nicht verfügbar
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| PESD3V3L1UA,115 |
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Hersteller: NXP USA Inc.
Description: TVS DIODE 3.3VWM 11VC SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Capacitance @ Frequency: 34pF @ 1MHz
Current - Peak Pulse (10/1000µs): 4.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: SOD-323
Unidirectional Channels: 1
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 45W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
Description: TVS DIODE 3.3VWM 11VC SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Capacitance @ Frequency: 34pF @ 1MHz
Current - Peak Pulse (10/1000µs): 4.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: SOD-323
Unidirectional Channels: 1
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 45W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
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| PBSS2540E,115 |
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Hersteller: NXP USA Inc.
Description: TRANS NPN 40V 0.5A SC-75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 2V
Frequency - Transition: 450MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Description: TRANS NPN 40V 0.5A SC-75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 2V
Frequency - Transition: 450MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
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