Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36403) > Seite 182 nach 607
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MC33970DWR2 | NXP USA Inc. |
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC Grade: Automotive Motor Type - Stepper: Bipolar Supplier Device Package: 24-SOIC Voltage - Load: 6.5V ~ 26V Voltage - Supply: 4.5V ~ 5.5V Output Configuration: Half Bridge (8) Operating Temperature: -40°C ~ 150°C (TJ) Interface: SPI Current - Output: 40mA Function: Driver - Fully Integrated, Control and Power Stage Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
MMA2260DR2 | NXP USA Inc. |
 Description: ACCELEROMETER 1.5G ANALOG 16SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
LPC1850FET256,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256LBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 180MHz RAM Size: 200K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 256-LBGA (17x17) Number of I/O: 164 DigiKey Programmable: Not Verified |
auf Bestellung 11813 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
|
|
LPC1830FET256,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256LBGA DigiKey Programmable: Not Verified Number of I/O: 164 Supplier Device Package: 256-LBGA (17x17) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 8x10b; D/A 1x10b Core Processor: ARM® Cortex®-M3 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 200K x 8 Speed: 180MHz Mounting Type: Surface Mount Package / Case: 256-LBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
OM13313,598 | NXP USA Inc. |
Description: EVAL BOARD FOR TDA5051A Part Status: Obsolete Supplied Contents: Board(s) Utilized IC / Part: TDA5051A Type: Interface Function: Power Line Transceiver Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
SSL2103T/1,518 | NXP USA Inc. |
Description: IC LED DRIVER OFFL TRIAC 14SO Supplier Device Package: 14-SO Topology: Flyback, Step-Down (Buck) Internal Switch(s): No Operating Temperature: -40°C ~ 100°C (TA) Type: AC DC Offline Switcher Frequency: 100kHz Number of Outputs: 1 Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Cut Tape (CT) Voltage - Supply (Max): 28V Voltage - Supply (Min): 12V Dimming: Triac |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| TFA9881UK/N1,118 | NXP USA Inc. |
Description: IC AMP CLASS D MONO 3.4W 9WLCSP Packaging: Tape & Reel (TR) Part Status: Obsolete Supplier Device Package: 9-WLCSP (1.3x1.3) Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm Voltage - Supply: 2.5V ~ 5.5V Type: Class D Mounting Type: Surface Mount Output Type: 1-Channel (Mono) Package / Case: 9-UFBGA, WLCSP Features: Depop, Overvoltage, Short Circuit, Thermal Protection |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| TFA9881UK/N1,118 | NXP USA Inc. |
Description: IC AMP CLASS D MONO 3.4W 9WLCSP Part Status: Obsolete Supplier Device Package: 9-WLCSP (1.3x1.3) Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm Voltage - Supply: 2.5V ~ 5.5V Type: Class D Mounting Type: Surface Mount Output Type: 1-Channel (Mono) Package / Case: 9-UFBGA, WLCSP Features: Depop, Overvoltage, Short Circuit, Thermal Protection Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
LPC1788FET208,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 208TFBGA Packaging: Tray Package / Case: 208-TFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 208-TFBGA (15x15) Part Status: Active Number of I/O: 165 DigiKey Programmable: Not Verified |
auf Bestellung 3597 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
|
|
LPC1778FET208,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 208TFBGA DigiKey Programmable: Not Verified Number of I/O: 165 Part Status: Active Supplier Device Package: 208-TFBGA (15x15) Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x12b; D/A 1x10b Core Processor: ARM® Cortex®-M3 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 96K x 8 Program Memory Size: 512KB (512K x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 208-TFBGA Packaging: Tray |
auf Bestellung 92 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
LPC1788FBD208,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 208LQFP Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Part Status: Discontinued at Digi-Key Number of I/O: 165 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
LPC1778FBD208,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 208LQFP DigiKey Programmable: Not Verified Number of I/O: 165 Supplier Device Package: 208-LQFP (28x28) Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x12b; D/A 1x10b Core Processor: ARM® Cortex®-M3 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 96K x 8 Program Memory Size: 512KB (512K x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 208-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
TFA9882UK/N1,023 | NXP USA Inc. |
Description: IC AMP CLASS D MONO 3.4W 9WLCSP Packaging: Tape & Reel (TR) Features: Depop, I2S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage Package / Case: 9-UFBGA, WLCSP Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 5.5V Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm Supplier Device Package: 9-WLCSP (1.49x1.27) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
CBTL04DP211BS,518 | NXP USA Inc. |
Description: IC VIDEO MULTIPLEXER 32HVQFN Control Interface: I²C Part Status: Obsolete Supplier Device Package: 32-HVQFN (3x6) Applications: Video Display Voltage - Supply: 3.0V ~ 3.6V Function: Multiplexer Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
PCA9621PW,118 | NXP USA Inc. |
Description: IC BUS PORT 8BIT 65MA 16TSSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
CBTL04DP211BS,518 | NXP USA Inc. |
Description: IC VIDEO MULTIPLEXER 32HVQFN Control Interface: I²C Part Status: Obsolete Supplier Device Package: 32-HVQFN (3x6) Applications: Video Display Voltage - Supply: 3.0V ~ 3.6V Function: Multiplexer Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
TWR-K60N512-KEIL | NXP USA Inc. |
Description: TOWER SYSTEM K60 EVAL BRD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
TWR-MCF51JF | NXP USA Inc. |
Description: TOWER SYSTEM MCF51JF EVAL BRD Contents: Board(s), Cable(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box Platform: Tower System Utilized IC / Part: MCF51JF Core Processor: Coldfire V1 |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
LFSTBEB3110 | NXP USA Inc. |
Description: KIT EVAL 3-AXIS DIG ACCELER Contents: Board(s), Cable(s) Interface: I2C Part Status: Obsolete Sensing Range: ±2g, 4g, 8g, ±1000µT Embedded: No Supplied Contents: Board(s), Cable(s) Utilized IC / Part: MAG3110, MMA8451Q Sensor Type: Accelerometer, Magnetometer Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
RD4247MAG3110 | NXP USA Inc. |
Description: KIT EVAL 3-AXIS DIG ACCELER Contents: Board(s), Cable(s) Sensing Range: ±2g, 4g, 8g, ±1000µT Embedded: No Supplied Contents: Board(s), Cable(s) Utilized IC / Part: MAG3110, MMA8451Q Sensor Type: Accelerometer, Magnetometer Interface: I2C Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB Packaging: Box Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
MCIMX-LVDS1 | NXP USA Inc. |
Description: DAUGHTER CARD LVDS FOR I.MX53 Accessory Type: Display - LVDS Interface Add-On Board For Use With/Related Products: i.MX53 Packaging: Box |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
FSLBOT | NXP USA Inc. |
Description: KIT TOWER MECH BOARD Packaging: Box Configuration: Servo Actuators Contents: Board(s), Components, Hardware, Servo(s) Utilized IC / Part: MCF52259, MMA8451Q, MPR121 Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
TWR-AUDIO-SGTL | NXP USA Inc. |
Description: TOWER SYSTEM KIT AUDIO Accessory Type: Module, Audio with CODEC For Use With/Related Products: Freescale Tower System Packaging: Box Utilized IC / Part: Freescale Tower System |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
TWR-K53N512 | NXP USA Inc. |
Description: TOWER SYSTEM K53 EVAL BRD |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
TWR-MCF51QM | NXP USA Inc. |
Description: TOWER SYSTEM MCF51QM EVAL BRD Part Status: Active Platform: Tower System Utilized IC / Part: MCF51QM Board Type: Evaluation Platform Core Processor: Coldfire V1 Contents: Board(s), Cable(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
TWR-MCF51QM-KIT | NXP USA Inc. |
Description: TOWER SYSTEM MCF51QM EVAL BRD Utilized IC / Part: MCF51QM Core Processor: Coldfire V1 Contents: Board(s), Cable(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box Platform: Tower System |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
TWR-MECH | NXP USA Inc. |
Description: KIT TOWER ROBOT SENSOR MOTOR Packaging: Box Configuration: Robot Components Contents: Board(s), Cable(s), Components, Hardware, Wheel(s) Utilized IC / Part: MCF52259, MMA8451Q, MPR121 Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
EVBUSB2SER | NXP USA Inc. |
Description: USB TO SERIAL BRIDGE Accessory Type: USB to Serial TTL Adapter Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
U-MULTILINK | NXP USA Inc. |
Description: USB MULTILINK PROGRAMMER Packaging: Box For Use With/Related Products: ARM®, ARM® Cortex® and Other Devices Type: Debugger, Programmer (In-Circuit/In-System) Contents: Board(s), Cable(s) Part Status: Active Utilized IC / Part: ARM®, ARM® Cortex® and Other Devices |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
MCZ33903BD5EK | NXP USA Inc. |
Description: IC SBC CAN HS 5.0V 32SOIC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 42 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
MCZ33903BS3EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Interface: CAN, LIN Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Box Supplier Device Package: 32-SSOP-EP Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MCZ33903BS5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
MCZ33905BD3EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOIC Supplier Device Package: 54-SOIC-EP Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V Interface: CAN, LIN Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
TWR-MCF51JF-KIT | NXP USA Inc. |
Description: TOWER SYSTEM MCF51JF EVAL BRD Platform: Tower System Utilized IC / Part: MCF51JF Core Processor: Coldfire V1 Contents: Board(s), Cable(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
MCIMX233DAG4C | NXP USA Inc. |
Description: IC MPU I.MX23 454MHZ 128LQFP Packaging: Tray Package / Case: 128-LQFP Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -10°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 128-LQFP (14x14) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Security Features: Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
auf Bestellung 393 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
MCIMX233DJM4C | NXP USA Inc. |
Description: IC MPU I.MX23 454MHZ 169MAPBGA Packaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -10°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 169-MAPBGA (11x11) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Security Features: Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
auf Bestellung 188 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
MCZ33905BD5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
MC34827A1EPR2 | NXP USA Inc. |
Description: IC USB POWER MANAGER 20-QFN Part Status: Obsolete Supplier Device Package: 20-QFN-EP (3x3) Current - Supply: 9µA Applications: OR Controller, UART/USB Data, Audio Management Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-UFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
MC34827A2EPR2 | NXP USA Inc. |
Description: IC USB POWER MANAGER 20-QFN Part Status: Obsolete Supplier Device Package: 20-QFN-EP (3x4) Current - Supply: 9µA Applications: OR Controller, UART/USB Data, Audio Management Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-UFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MCIMX233CAG4C | NXP USA Inc. |
Description: IC MPU I.MX23 454MHZ 128LQFP Packaging: Tray Package / Case: 128-LQFP Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 128-LQFP (14x14) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Security Features: Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
auf Bestellung 375 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
MPC8309CVMAHFCA | NXP USA Inc. |
Description: IC MPU MPC83XX 417MHZ 489BGA Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM Graphics Acceleration: No RAM Controllers: DDR2 Co-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (3) Supplier Device Package: 489-PBGA (19x19) Voltage - I/O: 1.8V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 417MHz Mounting Type: Surface Mount Package / Case: 489-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 420 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
MSC8156ETVT1000B | NXP USA Inc. |
Description: IC DSP 6 CORE 1GHZ 783FCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MSC8156ESVT1000B | NXP USA Inc. |
Description: IC DSP 6 CORE 1GHZ 783FCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MSC8154TVT1000B | NXP USA Inc. |
Description: IC DSP QUAD 1GHZ 783FCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MSC8154ETVT1000B | NXP USA Inc. |
Description: IC DSP QUAD 1GHZ 783FCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
SSL4101/1,518 | NXP USA Inc. |
Description: IC LED DRIVER OFFL SWITCHER 16SO Voltage - Supply (Max): 38V Voltage - Supply (Min): 15V Supplier Device Package: 16-SO Topology: Flyback Internal Switch(s): No Applications: Lighting Operating Temperature: -40°C ~ 150°C (TJ) Type: AC DC Offline Switcher Frequency: 380kHz Number of Outputs: 1 Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
OM13001,598 | NXP USA Inc. |
Description: LPC1788 EVAL BRD Part Status: Active Utilized IC / Part: LPC1788 Board Type: Evaluation Platform Core Processor: ARM® Cortex®-M3 Contents: Board(s), Cable(s), Accessories Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| TWR-RS08DC-KA8 | NXP USA Inc. |
Description: TOWER SYSTEM MC9RS08KA8 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: RS08 Board Type: Evaluation Platform Utilized IC / Part: MC9RS08KA8 Platform: Tower System Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
TWR-S08DC-AC60 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08AC60 EVAL BRD Part Status: Active Platform: Tower System Utilized IC / Part: MC9S08AC60 Board Type: Evaluation Platform Core Processor: HCS08 Contents: Board(s) Type: MCU 8-Bit Mounting Type: Fixed Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
TWR-S08DC-QD4 | NXP USA Inc. | Description: TOWER SYSTEM MC9S08QD4 EVAL BRD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
TWR-S08DC-QE64 | NXP USA Inc. | Description: TOWER SYSTEM MC9S08QE64 EVAL BRD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
TWR-S08DC-QG8 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08QG8 EVAL BRD Part Status: Active Platform: Tower System Utilized IC / Part: MC9S08QG8 Board Type: Evaluation Platform Core Processor: HCS08 Contents: Board(s) Type: MCU 8-Bit Mounting Type: Fixed Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
TWR-S08DC-SH8 | NXP USA Inc. |
Description: TOWER SYSTEM MC9S08SH8 EVAL BRD Part Status: Active Platform: Tower System Utilized IC / Part: MC9S08SH8 Board Type: Evaluation Platform Core Processor: HCS08 Contents: Board(s) Type: MCU 8-Bit Mounting Type: Fixed Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| 1323XUSB | NXP USA Inc. | Description: RF EVAL FOR MC1323X |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
TWR-S08UNIV | NXP USA Inc. |
Description: TOWER SYST TWR-RS08DC/TWR-S08DC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
1323XDSK | NXP USA Inc. |
Description: RF EVAL FOR MC1323X Supplied Contents: Board(s) Type: Transceiver; 802.15.4 Frequency: 2.4GHz For Use With/Related Products: MC1323x Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
1323XDSK-BDM | NXP USA Inc. |
Description: RF EVAL FOR MC1323X Supplied Contents: Board(s) Type: Transceiver; 802.15.4 Frequency: 2.4GHz For Use With/Related Products: MC1323x Packaging: Box |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
MCIMX50EVK | NXP USA Inc. |
Description: I.MX50 EVAL BRD Mounting Type: Fixed Packaging: Box Part Status: Active Operating System: Linux Utilized IC / Part: i.MX50 Board Type: Evaluation Platform Core Processor: ARM® Cortex®-A8 Contents: Board(s) Type: MPU |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
MC13850EPR2 | NXP USA Inc. |
Description: IC AMP GPS 400MHZ-2.5GHZ 8MLPD Part Status: Obsolete Supplier Device Package: 8-MLPD (2x2) Test Frequency: 2.4GHz P1dB: 2.2dBm Noise Figure: 1.85dB Current - Supply: 9.9mA Gain: 13dB Voltage - Supply: 2.3V ~ 3V RF Type: General Purpose Frequency: 400MHz ~ 2.5GHz Mounting Type: Surface Mount Package / Case: 8-UFDFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MC13852EPR2 | NXP USA Inc. |
Description: IC RF AMP GPS 400MHZ-1GHZ 8MLPD Noise Figure: 1.2dB Package / Case: 8-UFDFN Exposed Pad Part Status: Obsolete Supplier Device Package: 8-MLPD (2x2) Test Frequency: 900MHz P1dB: 9.6dBm Current - Supply: 5.5mA Gain: 18.3dB Voltage - Supply: 2.3V ~ 3V RF Type: General Purpose Frequency: 400MHz ~ 1GHz Mounting Type: Surface Mount Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MC33970DWR2 |
Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC
Grade: Automotive
Motor Type - Stepper: Bipolar
Supplier Device Package: 24-SOIC
Voltage - Load: 6.5V ~ 26V
Voltage - Supply: 4.5V ~ 5.5V
Output Configuration: Half Bridge (8)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: SPI
Current - Output: 40mA
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Description: IC MTR DRV BIPLR 4.5-5.5V 24SOIC
Grade: Automotive
Motor Type - Stepper: Bipolar
Supplier Device Package: 24-SOIC
Voltage - Load: 6.5V ~ 26V
Voltage - Supply: 4.5V ~ 5.5V
Output Configuration: Half Bridge (8)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: SPI
Current - Output: 40mA
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MMA2260DR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 1.5G ANALOG 16SOIC
Description: ACCELEROMETER 1.5G ANALOG 16SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC1850FET256,551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
auf Bestellung 11813 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 24.62 EUR |
| 10+ | 19.5 EUR |
| 90+ | 16.89 EUR |
| 180+ | 16.35 EUR |
| 270+ | 16.08 EUR |
| 540+ | 15.68 EUR |
| LPC1830FET256,551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA
DigiKey Programmable: Not Verified
Number of I/O: 164
Supplier Device Package: 256-LBGA (17x17)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 200K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 256LBGA
DigiKey Programmable: Not Verified
Number of I/O: 164
Supplier Device Package: 256-LBGA (17x17)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 200K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| OM13313,598 |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TDA5051A
Part Status: Obsolete
Supplied Contents: Board(s)
Utilized IC / Part: TDA5051A
Type: Interface
Function: Power Line Transceiver
Packaging: Box
Description: EVAL BOARD FOR TDA5051A
Part Status: Obsolete
Supplied Contents: Board(s)
Utilized IC / Part: TDA5051A
Type: Interface
Function: Power Line Transceiver
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SSL2103T/1,518 |
|
Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL TRIAC 14SO
Supplier Device Package: 14-SO
Topology: Flyback, Step-Down (Buck)
Internal Switch(s): No
Operating Temperature: -40°C ~ 100°C (TA)
Type: AC DC Offline Switcher
Frequency: 100kHz
Number of Outputs: 1
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Voltage - Supply (Max): 28V
Voltage - Supply (Min): 12V
Dimming: Triac
Description: IC LED DRIVER OFFL TRIAC 14SO
Supplier Device Package: 14-SO
Topology: Flyback, Step-Down (Buck)
Internal Switch(s): No
Operating Temperature: -40°C ~ 100°C (TA)
Type: AC DC Offline Switcher
Frequency: 100kHz
Number of Outputs: 1
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Voltage - Supply (Max): 28V
Voltage - Supply (Min): 12V
Dimming: Triac
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TFA9881UK/N1,118 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 9-WLCSP (1.3x1.3)
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 9-UFBGA, WLCSP
Features: Depop, Overvoltage, Short Circuit, Thermal Protection
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 9-WLCSP (1.3x1.3)
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 9-UFBGA, WLCSP
Features: Depop, Overvoltage, Short Circuit, Thermal Protection
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| TFA9881UK/N1,118 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Part Status: Obsolete
Supplier Device Package: 9-WLCSP (1.3x1.3)
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 9-UFBGA, WLCSP
Features: Depop, Overvoltage, Short Circuit, Thermal Protection
Packaging: Cut Tape (CT)
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Part Status: Obsolete
Supplier Device Package: 9-WLCSP (1.3x1.3)
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Voltage - Supply: 2.5V ~ 5.5V
Type: Class D
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 9-UFBGA, WLCSP
Features: Depop, Overvoltage, Short Circuit, Thermal Protection
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC1788FET208,551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
auf Bestellung 3597 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 32.19 EUR |
| 10+ | 25.7 EUR |
| 25+ | 24.08 EUR |
| 126+ | 22.06 EUR |
| 252+ | 21.44 EUR |
| 504+ | 20.93 EUR |
| LPC1778FET208,551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 208TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 165
Part Status: Active
Supplier Device Package: 208-TFBGA (15x15)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 96K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 208-TFBGA
Packaging: Tray
Description: IC MCU 32BIT 512KB FLSH 208TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 165
Part Status: Active
Supplier Device Package: 208-TFBGA (15x15)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 96K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 208-TFBGA
Packaging: Tray
auf Bestellung 92 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 26 EUR |
| 10+ | 20.57 EUR |
| 25+ | 19.21 EUR |
| LPC1788FBD208,551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Discontinued at Digi-Key
Number of I/O: 165
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Discontinued at Digi-Key
Number of I/O: 165
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC1778FBD208,551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 165
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 96K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
Description: IC MCU 32BIT 512KB FLASH 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 165
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 96K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TFA9882UK/N1,023 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Packaging: Tape & Reel (TR)
Features: Depop, I2S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.49x1.27)
Part Status: Obsolete
Description: IC AMP CLASS D MONO 3.4W 9WLCSP
Packaging: Tape & Reel (TR)
Features: Depop, I2S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 3.4W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.49x1.27)
Part Status: Obsolete
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| CBTL04DP211BS,518 |
|
Hersteller: NXP USA Inc.
Description: IC VIDEO MULTIPLEXER 32HVQFN
Control Interface: I²C
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (3x6)
Applications: Video Display
Voltage - Supply: 3.0V ~ 3.6V
Function: Multiplexer
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC VIDEO MULTIPLEXER 32HVQFN
Control Interface: I²C
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (3x6)
Applications: Video Display
Voltage - Supply: 3.0V ~ 3.6V
Function: Multiplexer
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9621PW,118 |
|
Hersteller: NXP USA Inc.
Description: IC BUS PORT 8BIT 65MA 16TSSOP
Description: IC BUS PORT 8BIT 65MA 16TSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| CBTL04DP211BS,518 |
|
Hersteller: NXP USA Inc.
Description: IC VIDEO MULTIPLEXER 32HVQFN
Control Interface: I²C
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (3x6)
Applications: Video Display
Voltage - Supply: 3.0V ~ 3.6V
Function: Multiplexer
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC VIDEO MULTIPLEXER 32HVQFN
Control Interface: I²C
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (3x6)
Applications: Video Display
Voltage - Supply: 3.0V ~ 3.6V
Function: Multiplexer
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-K60N512-KEIL |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K60 EVAL BRD
Description: TOWER SYSTEM K60 EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-MCF51JF |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MCF51JF EVAL BRD
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Platform: Tower System
Utilized IC / Part: MCF51JF
Core Processor: Coldfire V1
Description: TOWER SYSTEM MCF51JF EVAL BRD
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Platform: Tower System
Utilized IC / Part: MCF51JF
Core Processor: Coldfire V1
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 125.79 EUR |
| LFSTBEB3110 |
|
Hersteller: NXP USA Inc.
Description: KIT EVAL 3-AXIS DIG ACCELER
Contents: Board(s), Cable(s)
Interface: I2C
Part Status: Obsolete
Sensing Range: ±2g, 4g, 8g, ±1000µT
Embedded: No
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: MAG3110, MMA8451Q
Sensor Type: Accelerometer, Magnetometer
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Packaging: Box
Description: KIT EVAL 3-AXIS DIG ACCELER
Contents: Board(s), Cable(s)
Interface: I2C
Part Status: Obsolete
Sensing Range: ±2g, 4g, 8g, ±1000µT
Embedded: No
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: MAG3110, MMA8451Q
Sensor Type: Accelerometer, Magnetometer
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| RD4247MAG3110 |
|
Hersteller: NXP USA Inc.
Description: KIT EVAL 3-AXIS DIG ACCELER
Contents: Board(s), Cable(s)
Sensing Range: ±2g, 4g, 8g, ±1000µT
Embedded: No
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: MAG3110, MMA8451Q
Sensor Type: Accelerometer, Magnetometer
Interface: I2C
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Packaging: Box
Part Status: Active
Description: KIT EVAL 3-AXIS DIG ACCELER
Contents: Board(s), Cable(s)
Sensing Range: ±2g, 4g, 8g, ±1000µT
Embedded: No
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: MAG3110, MMA8451Q
Sensor Type: Accelerometer, Magnetometer
Interface: I2C
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Packaging: Box
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX-LVDS1 |
|
Hersteller: NXP USA Inc.
Description: DAUGHTER CARD LVDS FOR I.MX53
Accessory Type: Display - LVDS Interface Add-On Board
For Use With/Related Products: i.MX53
Packaging: Box
Description: DAUGHTER CARD LVDS FOR I.MX53
Accessory Type: Display - LVDS Interface Add-On Board
For Use With/Related Products: i.MX53
Packaging: Box
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 951.26 EUR |
| FSLBOT |
|
Hersteller: NXP USA Inc.
Description: KIT TOWER MECH BOARD
Packaging: Box
Configuration: Servo Actuators
Contents: Board(s), Components, Hardware, Servo(s)
Utilized IC / Part: MCF52259, MMA8451Q, MPR121
Part Status: Active
Description: KIT TOWER MECH BOARD
Packaging: Box
Configuration: Servo Actuators
Contents: Board(s), Components, Hardware, Servo(s)
Utilized IC / Part: MCF52259, MMA8451Q, MPR121
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-AUDIO-SGTL |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM KIT AUDIO
Accessory Type: Module, Audio with CODEC
For Use With/Related Products: Freescale Tower System
Packaging: Box
Utilized IC / Part: Freescale Tower System
Description: TOWER SYSTEM KIT AUDIO
Accessory Type: Module, Audio with CODEC
For Use With/Related Products: Freescale Tower System
Packaging: Box
Utilized IC / Part: Freescale Tower System
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-K53N512 |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K53 EVAL BRD
Description: TOWER SYSTEM K53 EVAL BRD
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| TWR-MCF51QM |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MCF51QM EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MCF51QM
Board Type: Evaluation Platform
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: TOWER SYSTEM MCF51QM EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MCF51QM
Board Type: Evaluation Platform
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-MCF51QM-KIT |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MCF51QM EVAL BRD
Utilized IC / Part: MCF51QM
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Platform: Tower System
Description: TOWER SYSTEM MCF51QM EVAL BRD
Utilized IC / Part: MCF51QM
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Platform: Tower System
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-MECH |
|
Hersteller: NXP USA Inc.
Description: KIT TOWER ROBOT SENSOR MOTOR
Packaging: Box
Configuration: Robot Components
Contents: Board(s), Cable(s), Components, Hardware, Wheel(s)
Utilized IC / Part: MCF52259, MMA8451Q, MPR121
Part Status: Active
Description: KIT TOWER ROBOT SENSOR MOTOR
Packaging: Box
Configuration: Robot Components
Contents: Board(s), Cable(s), Components, Hardware, Wheel(s)
Utilized IC / Part: MCF52259, MMA8451Q, MPR121
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| EVBUSB2SER |
Hersteller: NXP USA Inc.
Description: USB TO SERIAL BRIDGE
Accessory Type: USB to Serial TTL Adapter
Packaging: Box
Description: USB TO SERIAL BRIDGE
Accessory Type: USB to Serial TTL Adapter
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| U-MULTILINK |
|
Hersteller: NXP USA Inc.
Description: USB MULTILINK PROGRAMMER
Packaging: Box
For Use With/Related Products: ARM®, ARM® Cortex® and Other Devices
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s)
Part Status: Active
Utilized IC / Part: ARM®, ARM® Cortex® and Other Devices
Description: USB MULTILINK PROGRAMMER
Packaging: Box
For Use With/Related Products: ARM®, ARM® Cortex® and Other Devices
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s)
Part Status: Active
Utilized IC / Part: ARM®, ARM® Cortex® and Other Devices
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 551.25 EUR |
| MCZ33903BD5EK |
|
Hersteller: NXP USA Inc.
Description: IC SBC CAN HS 5.0V 32SOIC
Description: IC SBC CAN HS 5.0V 32SOIC
Produkt ist nicht verfügbar
Mindestbestellmenge: 42 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33903BS3EK |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Box
Supplier Device Package: 32-SSOP-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Description: IC INTERFACE SPECIALIZED 32SOIC
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Box
Supplier Device Package: 32-SSOP-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33903BS5EK |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCZ33905BD3EK |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Supplier Device Package: 54-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Box
Description: IC INTERFACE SPECIALIZED 54SOIC
Supplier Device Package: 54-SOIC-EP
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Interface: CAN, LIN
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-MCF51JF-KIT |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MCF51JF EVAL BRD
Platform: Tower System
Utilized IC / Part: MCF51JF
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: TOWER SYSTEM MCF51JF EVAL BRD
Platform: Tower System
Utilized IC / Part: MCF51JF
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 187.42 EUR |
| MCIMX233DAG4C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
auf Bestellung 393 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 25.17 EUR |
| 10+ | 19.98 EUR |
| 25+ | 18.68 EUR |
| 100+ | 18 EUR |
| MCIMX233DJM4C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
auf Bestellung 188 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 29.46 EUR |
| 10+ | 23.5 EUR |
| 25+ | 22.01 EUR |
| 100+ | 21.37 EUR |
| MCZ33905BD5EK |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Description: IC INTERFACE SPECIALIZED 54SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34827A1EPR2 |
Hersteller: NXP USA Inc.
Description: IC USB POWER MANAGER 20-QFN
Part Status: Obsolete
Supplier Device Package: 20-QFN-EP (3x3)
Current - Supply: 9µA
Applications: OR Controller, UART/USB Data, Audio Management
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC USB POWER MANAGER 20-QFN
Part Status: Obsolete
Supplier Device Package: 20-QFN-EP (3x3)
Current - Supply: 9µA
Applications: OR Controller, UART/USB Data, Audio Management
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34827A2EPR2 |
Hersteller: NXP USA Inc.
Description: IC USB POWER MANAGER 20-QFN
Part Status: Obsolete
Supplier Device Package: 20-QFN-EP (3x4)
Current - Supply: 9µA
Applications: OR Controller, UART/USB Data, Audio Management
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC USB POWER MANAGER 20-QFN
Part Status: Obsolete
Supplier Device Package: 20-QFN-EP (3x4)
Current - Supply: 9µA
Applications: OR Controller, UART/USB Data, Audio Management
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX233CAG4C |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
auf Bestellung 375 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 28.64 EUR |
| 10+ | 22.81 EUR |
| 25+ | 21.36 EUR |
| 100+ | 20.72 EUR |
| MPC8309CVMAHFCA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 417MHZ 489BGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 417MHz
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
Description: IC MPU MPC83XX 417MHZ 489BGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 417MHz
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 420 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MSC8156ETVT1000B |
|
Hersteller: NXP USA Inc.
Description: IC DSP 6 CORE 1GHZ 783FCBGA
Description: IC DSP 6 CORE 1GHZ 783FCBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MSC8156ESVT1000B |
|
Hersteller: NXP USA Inc.
Description: IC DSP 6 CORE 1GHZ 783FCBGA
Description: IC DSP 6 CORE 1GHZ 783FCBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MSC8154TVT1000B |
|
Hersteller: NXP USA Inc.
Description: IC DSP QUAD 1GHZ 783FCBGA
Description: IC DSP QUAD 1GHZ 783FCBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MSC8154ETVT1000B |
|
Hersteller: NXP USA Inc.
Description: IC DSP QUAD 1GHZ 783FCBGA
Description: IC DSP QUAD 1GHZ 783FCBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SSL4101/1,518 |
|
Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 16SO
Voltage - Supply (Max): 38V
Voltage - Supply (Min): 15V
Supplier Device Package: 16-SO
Topology: Flyback
Internal Switch(s): No
Applications: Lighting
Operating Temperature: -40°C ~ 150°C (TJ)
Type: AC DC Offline Switcher
Frequency: 380kHz
Number of Outputs: 1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Description: IC LED DRIVER OFFL SWITCHER 16SO
Voltage - Supply (Max): 38V
Voltage - Supply (Min): 15V
Supplier Device Package: 16-SO
Topology: Flyback
Internal Switch(s): No
Applications: Lighting
Operating Temperature: -40°C ~ 150°C (TJ)
Type: AC DC Offline Switcher
Frequency: 380kHz
Number of Outputs: 1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| OM13001,598 |
Hersteller: NXP USA Inc.
Description: LPC1788 EVAL BRD
Part Status: Active
Utilized IC / Part: LPC1788
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M3
Contents: Board(s), Cable(s), Accessories
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: LPC1788 EVAL BRD
Part Status: Active
Utilized IC / Part: LPC1788
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M3
Contents: Board(s), Cable(s), Accessories
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-RS08DC-KA8 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9RS08KA8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: RS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9RS08KA8
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM MC9RS08KA8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: RS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9RS08KA8
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-S08DC-AC60 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08AC60 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08AC60
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Description: TOWER SYSTEM MC9S08AC60 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08AC60
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-S08DC-QD4 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08QD4 EVAL BRD
Description: TOWER SYSTEM MC9S08QD4 EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-S08DC-QE64 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08QE64 EVAL BRD
Description: TOWER SYSTEM MC9S08QE64 EVAL BRD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-S08DC-QG8 |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08QG8 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08QG8
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Description: TOWER SYSTEM MC9S08QG8 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08QG8
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-S08DC-SH8 |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08SH8 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08SH8
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Description: TOWER SYSTEM MC9S08SH8 EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08SH8
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1323XUSB |
Hersteller: NXP USA Inc.
Description: RF EVAL FOR MC1323X
Description: RF EVAL FOR MC1323X
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-S08UNIV |
|
Hersteller: NXP USA Inc.
Description: TOWER SYST TWR-RS08DC/TWR-S08DC
Description: TOWER SYST TWR-RS08DC/TWR-S08DC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1323XDSK |
Hersteller: NXP USA Inc.
Description: RF EVAL FOR MC1323X
Supplied Contents: Board(s)
Type: Transceiver; 802.15.4
Frequency: 2.4GHz
For Use With/Related Products: MC1323x
Packaging: Box
Description: RF EVAL FOR MC1323X
Supplied Contents: Board(s)
Type: Transceiver; 802.15.4
Frequency: 2.4GHz
For Use With/Related Products: MC1323x
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 1323XDSK-BDM |
|
Hersteller: NXP USA Inc.
Description: RF EVAL FOR MC1323X
Supplied Contents: Board(s)
Type: Transceiver; 802.15.4
Frequency: 2.4GHz
For Use With/Related Products: MC1323x
Packaging: Box
Description: RF EVAL FOR MC1323X
Supplied Contents: Board(s)
Type: Transceiver; 802.15.4
Frequency: 2.4GHz
For Use With/Related Products: MC1323x
Packaging: Box
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 413.48 EUR |
| MCIMX50EVK |
|
Hersteller: NXP USA Inc.
Description: I.MX50 EVAL BRD
Mounting Type: Fixed
Packaging: Box
Part Status: Active
Operating System: Linux
Utilized IC / Part: i.MX50
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A8
Contents: Board(s)
Type: MPU
Description: I.MX50 EVAL BRD
Mounting Type: Fixed
Packaging: Box
Part Status: Active
Operating System: Linux
Utilized IC / Part: i.MX50
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A8
Contents: Board(s)
Type: MPU
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 951.26 EUR |
| MC13850EPR2 |
|
Hersteller: NXP USA Inc.
Description: IC AMP GPS 400MHZ-2.5GHZ 8MLPD
Part Status: Obsolete
Supplier Device Package: 8-MLPD (2x2)
Test Frequency: 2.4GHz
P1dB: 2.2dBm
Noise Figure: 1.85dB
Current - Supply: 9.9mA
Gain: 13dB
Voltage - Supply: 2.3V ~ 3V
RF Type: General Purpose
Frequency: 400MHz ~ 2.5GHz
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC AMP GPS 400MHZ-2.5GHZ 8MLPD
Part Status: Obsolete
Supplier Device Package: 8-MLPD (2x2)
Test Frequency: 2.4GHz
P1dB: 2.2dBm
Noise Figure: 1.85dB
Current - Supply: 9.9mA
Gain: 13dB
Voltage - Supply: 2.3V ~ 3V
RF Type: General Purpose
Frequency: 400MHz ~ 2.5GHz
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC13852EPR2 |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 400MHZ-1GHZ 8MLPD
Noise Figure: 1.2dB
Package / Case: 8-UFDFN Exposed Pad
Part Status: Obsolete
Supplier Device Package: 8-MLPD (2x2)
Test Frequency: 900MHz
P1dB: 9.6dBm
Current - Supply: 5.5mA
Gain: 18.3dB
Voltage - Supply: 2.3V ~ 3V
RF Type: General Purpose
Frequency: 400MHz ~ 1GHz
Mounting Type: Surface Mount
Packaging: Tape & Reel (TR)
Description: IC RF AMP GPS 400MHZ-1GHZ 8MLPD
Noise Figure: 1.2dB
Package / Case: 8-UFDFN Exposed Pad
Part Status: Obsolete
Supplier Device Package: 8-MLPD (2x2)
Test Frequency: 900MHz
P1dB: 9.6dBm
Current - Supply: 5.5mA
Gain: 18.3dB
Voltage - Supply: 2.3V ~ 3V
RF Type: General Purpose
Frequency: 400MHz ~ 1GHz
Mounting Type: Surface Mount
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH